A layout device and method for a semiconductor secondary piping installation project

Abstract

The present invention discloses a layout device and method for a semiconductor secondary piping installation project, including: a file upload module that receives a layout file of a semiconductor production line; a data parsing module that parses the layout file, obtains the attribute information and location information of equipment, and transmits them to a secondary piping database; a data analysis and layout module that gives a secondary piping installation pipeline diagram, and then combines a component matching algorithm to obtain the corresponding piping and instrumentation components in the secondary piping database to form a piping and instrumentation flow diagram; a three-dimensional space management module that combines a three-dimensional model generation algorithm to generate a layout model of the semiconductor secondary piping installation project. Through the linkage between the semiconductor layout information and the secondary piping database, combined with the component matching algorithm, the information of the secondary piping components is obtained, and according to the three-dimensional model generation algorithm, the automatic output of the semiconductor secondary piping layout is realized and visualized in a three-dimensional scene.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor production layout, and in particular relates to a layout device and method for a semiconductor secondary piping installation project. Background Art

[0002] During the construction of semiconductor plants and the semiconductor production process, the production equipment will be moved in or relocated due to the gradual improvement of production lines, increased production capacity or product variations. Frequent changes in the movement of production equipment will have a linkage effect on the connections between the power source and the pipelines, instruments, etc. between the production equipment. The process of connecting the main pipeline interface to the semiconductor production equipment is a key link in the semiconductor manufacturing process, carrying the heavy responsibility of accurately and efficiently connecting the power sources of various infrastructure systems to complex process machines.

[0003] At present, the research on secondary piping is limited to the secondary piping component structure. For example, patent CN109585347A provides an integrated device for secondary piping of semiconductor production equipment, including: a pump frame body, an integrated pipeline, an integrated circuit and a vacuum pump. The pump frame body is a rectangular frame welded by carbon steel and stainless steel profiles, divided into upper and lower layers. The integrated pipeline includes a vacuum pipeline, a process cooling water pipeline and a nitrogen pipeline. The integrated circuit includes a strong current system and a weak current system. The vacuum pump includes a pump body A and a pump body B. Pump body A is arranged on the upper layer of the pump frame body, and pump body B is arranged on the lower layer of the pump frame body. The four bottom parts of pump body A and pump body B are all provided with supporting fixed feet. This scheme integrates the device, shortens the installation cycle of the entire semiconductor production equipment, reduces the occupied area of the plant, has good mobility, meets the needs of temporary adjustment of the machine position, adopts modular standardized manufacturing, solves the problems of long on-site construction period and uncontrollable progress, and the construction quality is effectively guaranteed to meet the requirements of uninterrupted operation of semiconductor factories.

[0004] The layout design of semiconductor secondary piping is often done manually by secondary piping designers, which consumes a lot of time and energy. Moreover, the drawn semiconductor secondary piping layout design drawing can only present a two-dimensional pipeline instrument flow chart, and cannot be simulated, presented, or simulated in a three-dimensional scene.

[0005] Therefore, how to obtain the information of secondary piping components by parsing the semiconductor production line layout file to realize the automatic output of the semiconductor secondary piping installation project layout, and to be able to visualize it in a three-dimensional scene and apply it to the transmission simulation of the power source is an urgent problem to be solved by technical personnel in this field. Summary of the invention

[0006] In view of the defects existing in the above-mentioned prior art, the present invention provides a layout device and method for a semiconductor secondary piping installation project, including: a file upload module for receiving a layout file of a semiconductor production line; a data parsing module for parsing the layout file, obtaining the attribute information and location information of the equipment, and transmitting them to a secondary piping database; a data analysis and layout module for giving a secondary piping installation pipeline diagram, and then combining a component matching algorithm to obtain the corresponding pipeline instrument components in the secondary piping database to form a pipeline instrument flow diagram; a three-dimensional space management module for generating a layout model of the semiconductor secondary piping installation project in combination with a three-dimensional model generation algorithm. Through the linkage between the semiconductor layout information and the secondary piping database, combined with the component matching algorithm, the information of the secondary piping components is obtained, and according to the three-dimensional model generation algorithm, the automatic output of the semiconductor secondary piping layout is realized and visualized in a three-dimensional scene.

[0007] In a first aspect, the present invention provides a layout device for a semiconductor secondary piping installation project, specifically including: a file upload module, a data parsing module, a data analysis and layout module, a three-dimensional space management module and a secondary piping database that are signal-connected;

[0008] A file upload module, a data parsing module, a data analysis and layout module, a three-dimensional space management module and a secondary piping database that are signal-connected;

[0009] The file upload module is used to receive the layout file of the semiconductor production line;

[0010] The data parsing module is used to parse the layout file of the semiconductor production line, obtain the attribute information and location information of the equipment, and transmit the attribute information and location information of the equipment to the secondary piping database, where the equipment includes semiconductor production equipment and factory utility system equipment;

[0011] The data analysis and layout module is used to, based on the attribute information and location information of the equipment, combine a component matching algorithm to obtain the corresponding pipeline instrument components in the secondary piping database, connect the equipment and the corresponding pipeline instrument components, form a pipeline instrument flow diagram, and give a secondary piping installation pipeline diagram;

[0012] The three-dimensional space management module is used to, based on the secondary piping installation pipeline diagram, combine a three-dimensional model generation algorithm to generate a layout model of the semiconductor secondary piping installation project.

[0013] Further, the layout file includes an equipment configuration file, a layout design file, and a feature information file;

[0014] The attribute information of the equipment includes equipment type, equipment manufacturer information, and interface information, and the attribute information of the factory utility system equipment further includes flow information, pressure information, and remarks information;

[0015] The location information of the equipment is the coordinate information of the equipment on the semiconductor production layout plane.

[0016] Furthermore, a secondary piping database is used to receive and store the attribute information and location information of the equipment, the attribute information of the piping and instrumentation components, and the attribute information of the three-dimensional components.

[0017] Furthermore, parse the layout file of the semiconductor production line to obtain the attribute information and location information of the equipment, specifically including:

[0018] Based on the parsing of the equipment configuration file, obtain the attribute information of each equipment;

[0019] Match the equipment in the characteristic information file with the layout design file, analyze the layout of each equipment, and give the location information of each equipment.

[0020] Furthermore, it also includes: a simulation module, a fluid system capacity management module, and a construction management module;

[0021] The simulation module is signal-connected to the three-dimensional space management module and is used to simulate and analyze the power supply process based on the layout model of the semiconductor secondary piping installation project and in combination with the power supply parameters;

[0022] The plant utility system capacity management module is signal-connected to the data analysis and layout module and is used to set and monitor the power supply points based on the piping and instrumentation flow diagram, and guide the generation of the secondary piping installation pipeline diagram based on the status of the power supply points;

[0023] The construction management module is signal-connected to the plant utility system capacity management module and is used to update the status of the power supply points based on the construction progress and transmit it to the plant utility system capacity management module.

[0024] Furthermore, based on the attribute information and location information of the equipment, combined with the component matching algorithm, obtain the piping and instrumentation components corresponding to the secondary piping database, specifically including:

[0025] According to the attribute information of the equipment, perform component matching in the secondary piping database to determine the piping and instrumentation components corresponding to each equipment, and extract the attribute information of the piping and instrumentation components. Among them, the attribute information of the piping and instrumentation components includes the type, size rating, and power supply amount of the piping and instrumentation components;

[0026] Classify and delimit each piping and instrumentation component, and combine the location information of the corresponding equipment to give the location information of each piping and instrumentation component.

[0027] Furthermore, according to the attribute information of the equipment, perform component matching in the secondary piping database to determine the piping and instrumentation components corresponding to each equipment, specifically including:

[0028] Query and confirm the devices for matching in the secondary piping database;

[0029] Group the semiconductor manufacturing equipment according to the equipment type and the semiconductor manufacturing area where it is located, and label the group number;

[0030] Analyze the power source demand of each group of semiconductor manufacturing equipment, determine the power source supply of the facility system equipment based on the power source demand, and give the power source supply path between the facility system equipment and the semiconductor manufacturing equipment;

[0031] In the secondary piping database, match each group of semiconductor manufacturing equipment through the attribute information of the piping and instrumentation components to determine the corresponding piping and instrumentation components.

[0032] Furthermore, classify and delimit each piping and instrumentation component, and give the location information of each piping and instrumentation component in combination with the location information of the equipment it supplies, specifically including:

[0033] Classify each determined piping and instrumentation component along the power source supply path between the facility system equipment and the semiconductor manufacturing equipment;

[0034] Determine the ordinate information of each type of piping and instrumentation component in the layout plane according to the group number of the corresponding supplied semiconductor manufacturing equipment, where the ordinate information represents the semiconductor manufacturing area where the piping and instrumentation component is located;

[0035] Determine the abscissa location of all piping and instrumentation components corresponding to the semiconductor manufacturing equipment in the layout plane according to the location information of the corresponding supplied semiconductor manufacturing equipment;

[0036] Divide the abscissa location according to the preset attribute information of each piping and instrumentation component to determine the abscissa information of each piping and instrumentation component in the layout plane, where the abscissa information represents the relative interval between the piping and instrumentation component and the corresponding supplied semiconductor manufacturing equipment.

[0037] Furthermore, based on the secondary piping installation pipeline diagram, combine the 3D model generation algorithm to generate the layout model of the semiconductor secondary piping, specifically including:

[0038] Perform component analysis on the secondary piping installation pipeline diagram to obtain each piping and instrumentation component;

[0039] Match each piping and instrumentation component with the 3D components in the secondary piping database to determine the 3D components of the corresponding piping and instrumentation;

[0040] Combine the location information of each pipeline instrument component, and update the shape of the 3D component based on the analysis of the attribute information of the 3D component, to generate a layout model for the semiconductor secondary piping installation project, where the attribute information of the 3D component includes the shape information and size information of the 3D component.

[0041] Further, combine the location information of each pipeline instrument component, and update the shape of the 3D component based on the analysis of the attribute information of the 3D component, specifically expressed as:

[0042] Compare the abscissa and ordinate information of each pipeline instrument component in the layout plane pairwise to determine the pipeline instrument components with layout intersections, and form the first set of pipeline instrument components;

[0043] Map and match the 3D components of the pipeline instruments for each pipeline instrument component in the first set of pipeline instrument components to form the first set of 3D components;

[0044] In the first set of 3D components, compare the vertical dimension information of each 3D component pairwise, and combine the preset layout model space of the semiconductor secondary piping installation project to give the 3D components with intersections, and collect the pipeline instrument components corresponding to the intersecting 3D components to form the second set of pipeline instrument components;

[0045] Adjust the abscissa, and / or, ordinate information of each pipeline instrument component in the layout plane in the second set of pipeline instrument components, and / or, adjust the vertical dimension information of each pipeline instrument component in the second set of pipeline instrument components;

[0046] Repeat the comparison of the abscissa and ordinate information of the above pipeline instrument components in the layout plane and the comparison of the vertical dimension information of each 3D component until both the first set of pipeline instrument components and the second set of pipeline instrument components are empty sets, and complete the update of the shape of the 3D component.

[0047] Further, the first set of pipeline instrument components is specifically expressed as:

[0048]

[0049] Among them, C is the set of all pipeline instrument components, c1, c2, c i 、c j 、c n are the 1st, 2nd, i-th, j-th, and n-th pipeline instrument components respectively, C1 is the first set of pipeline instrument components, x i 、y i are the abscissa and ordinate of the i-th pipeline instrument component in the layout plane, x j 、y j are the abscissa and ordinate of the j-th pipeline instrument component in the layout plane, is an empty set.

[0050] Further, the set of second pipeline instrument components is specifically represented as:

[0051]

[0052] where C1' is the set of first three-dimensional components, c k , c s are the k-th and s-th pipeline instrument components respectively, c i ’, c j ’, c k ’, c s ’ are the three-dimensional components matching the pipeline instrument components c i , c j , c k , c s respectively, M() is a mapping matching function, C2 is the set of second pipeline instrument components, z k ' is the vertical dimension data of the three-dimensional component c k ', z s ' is the vertical dimension data of the three-dimensional component c s . is an empty set.

[0053] Further, the data analysis and layout module is also used for: after forming the pipeline instrument flow chart,

[0054] by receiving touch interaction information, optimizing the attribute information and / or position information of each pipeline instrument component to form an initial diagram of the secondary piping installation pipeline;

[0055] performing adaptive detection on the initial pipeline instrument flow diagram, and forming a secondary piping installation pipeline diagram based on the analysis of the adaptive detection results.

[0056] In a second aspect, the present invention also provides a layout method for a semiconductor secondary piping installation project, which uses the layout device for the semiconductor secondary piping installation project as described above, and specifically includes the following steps:

[0057] Receiving the layout file of the semiconductor production line;

[0058] Parsing the layout file of the semiconductor production line, obtaining the attribute information and position information of the equipment, and transmitting the attribute information and position information of the equipment to the secondary piping database, where the equipment includes semiconductor production equipment and factory facility system equipment;

[0059] Based on the attribute information and position information of the equipment, combining with the component matching algorithm, obtaining the corresponding pipeline instrument components in the secondary piping database, and connecting the equipment and the corresponding pipeline instrument components to form a pipeline instrument flow chart, and giving a secondary piping installation pipeline diagram;

[0060] Based on the secondary piping installation pipeline diagram and combined with the 3D model generation algorithm, a layout model for the semiconductor secondary piping installation project is generated.

[0061] The layout device and method for the semiconductor secondary piping installation project provided by the present invention at least include the following beneficial effects:

[0062] (1) Through the linkage between the semiconductor layout information and the secondary piping database, combined with the component matching algorithm, the present invention obtains the information of the secondary piping components, and according to the 3D model generation algorithm, realizes the automatic output of the semiconductor secondary piping layout and visualizes it in the 3D scene.

[0063] (2) Based on the attribute information and location information of the semiconductor production equipment and factory facility system equipment, first give the power source supply path, then perform the matching of pipeline and instrument components, and determine the location information such as the semiconductor production area and the interval from the semiconductor production equipment in the layout plane. This makes the secondary piping process of the pipeline and instrument components meet the rule requirements of semiconductor production, and is also convenient for later adjustment to meet user-defined requirements, taking into account both efficiency and flexibility, and ensuring the accuracy of the pipeline and instrument flow diagram generation.

[0064] (3) Based on the secondary piping installation pipeline diagram and according to the 3D model generation algorithm, the obtained 3D layout model of the semiconductor secondary piping installation project solves the possible problems of duplication and intersection in the conversion from the 2D pipeline and instrument flow diagram to the 3D layout model of the semiconductor secondary piping installation project, and provides a more intuitive and accurate 3D visualization solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] Figure 1 It is a schematic structural diagram of a layout device for a semiconductor secondary piping installation project according to the first embodiment provided by the present invention;

[0066] Figure 2 It is a schematic structural diagram of a layout device for a semiconductor secondary piping installation project according to the second embodiment provided by the present invention;

[0067] Figure 3 It is a schematic process diagram of component matching in the secondary piping database according to the attribute information of the equipment in a certain embodiment provided by the present invention to determine the pipeline and instrument components corresponding to each supplied equipment;

[0068] Figure 4 It is a schematic process diagram of classifying and demarcating each pipeline and instrument component and giving the location information of each pipeline and instrument component in combination with the location information of the corresponding supplied equipment in a certain embodiment provided by the present invention;

[0069] Figure 5 It is an example diagram of the secondary piping installation pipeline diagram provided by the present invention;

[0070] Figure 6 Schematic diagram of the process of generating a layout model for a semiconductor secondary piping installation project based on the secondary piping installation pipeline diagram provided by the present invention and combining a three-dimensional model generation algorithm;

[0071] Figure 7 Schematic diagram of the process of combining the position information of each pipeline instrument component and updating the shape of the three-dimensional component based on the analysis of the attribute information of the three-dimensional component provided by the present invention;

[0072] Figure 8 Example diagram of the layout model for a semiconductor secondary piping installation project provided by the present invention;

[0073] Figure 9 Schematic flow diagram of a layout method for a semiconductor secondary piping installation project provided by the present invention. Detailed implementation mode

[0074] To better understand the above technical solution, the following will describe the above technical solution in detail in conjunction with the accompanying drawings of the specification and specific implementation modes. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0075] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "the" and "said" used in the embodiments of the present invention and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. "Plural" generally includes at least two.

[0076] It should also be noted that the term "comprising", "including" or any other variation thereof is intended to cover a non-exclusive inclusion, so that a commodity or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or also includes elements inherent to this commodity or device. Without further limitation, the element defined by the statement "including one..." does not exclude the existence of another identical element in the commodity or device including the said element.

[0077] Semiconductor secondary piping refers to the second piping carried out according to each semiconductor production equipment of the semiconductor production line after the main pipeline of the semiconductor production line is laid. The layout process of semiconductor secondary piping not only requires a high degree of technical integration and coordination, but also needs to strictly comply with industry standards and specifications to ensure that each operation reaches the best safety and performance standards.

[0078] At this stage, factory utility systems such as electricity, cooling water, pure water, and bulk and special gases, which serve as power sources, need to be precisely introduced into each process step to provide a stable and reliable environment for the production of semiconductor chips.

[0079] This means that the layout of secondary piping needs to be precisely measured and advanced connection technologies and materials need to be adopted to ensure the smooth and safe transportation of gases, liquids, and electricity. At the same time, the diversity and complexity of semiconductor production also pose significant challenges to semiconductor secondary piping. Different semiconductor production process machines have different requirements for power sources, and new process equipment emerges continuously. The layout of secondary piping needs to be not only readable but also easily adjustable.

[0080] Therefore, it is necessary to accelerate the efficiency of semiconductor secondary piping layout and improve the response speed through digital means.

[0081] Currently, there are significant challenges in terms of efficiency and flexibility during the configuration process of secondary piping components such as pipes. Especially during reconfiguration, it heavily relies on the manual drawing of secondary piping technicians, which is time-consuming and laborious; new technicians need to undergo long-term training. In addition, the manual secondary piping layout can only provide two-dimensional piping and instrumentation diagrams, restricting real-time visualization in a three-dimensional scenario.

[0082] In addition, the three-dimensional model constructed based on manual drawing cannot be directly reused in subsequent simulation verification. It is necessary to frequently re-model according to the highly variable semiconductor pipe configuration scheme, which greatly increases the complexity and cost of the simulation work.

[0083] To solve the above problems, by developing an advanced platform, setting corresponding modules and platform architectures, it is possible to quickly generate a piping and instrumentation diagram that conforms to business and user-defined rules by inputting the layout file of the semiconductor production line and parsing the equipment information. Moreover, the scheme of the piping and instrumentation process does not require empirical review, directly ensuring the rationality of the scheme basis. At the same time, corresponding layout modules are also set up to support the automatic conversion from a two-dimensional flow chart to a three-dimensional model, providing an intuitive three-dimensional visualization scheme for the semiconductor secondary piping installation project.

[0084] As Figure 1 shown, the present invention provides a layout device for a semiconductor secondary piping installation project, specifically including:

[0085] A file upload module, a data parsing module, a data analysis and layout module, a three-dimensional space management module, and a secondary piping database that are signal-connected;

[0086] The file upload module is used to receive the layout file of the semiconductor production line;

[0087] A data parsing module, which is used to parse the layout file of a semiconductor production line, obtain the attribute information and location information of equipment, and transmit the attribute information and location information of the equipment to a secondary piping database, where the equipment includes semiconductor production equipment and facility system equipment;

[0088] A data analysis and layout module, which is used to obtain the corresponding piping and instrumentation components in the secondary piping database based on the attribute information and location information of the equipment, combine with a component matching algorithm, connect the equipment and the corresponding various piping and instrumentation components to form a piping and instrumentation flow diagram, and give a secondary piping installation pipeline diagram;

[0089] A three-dimensional space management module, which is used to generate a layout model of a semiconductor secondary piping installation project based on the secondary piping installation pipeline diagram and combine with a three-dimensional model generation algorithm.

[0090] Through the linkage between the semiconductor layout information and the secondary piping database, this invention combines with a component matching algorithm to obtain the information of secondary piping components, and realizes the automatic output of the semiconductor secondary piping layout and visual display in a three-dimensional scene according to the three-dimensional model generation algorithm.

[0091] The layout file includes an equipment configuration file, a layout design file, and a feature information file. A part of the above layout file is uploaded in the form of a diagram for diagram parsing processing, and another part is uploaded in the form of a table for data extraction and analysis.

[0092] For the data parsing module to perform data parsing on the uploaded layout file to obtain the attribute information and location information of the semiconductor production equipment and facility system equipment in the layout file.

[0093] Among them, the attribute information of the equipment (i.e., semiconductor production equipment and facility system equipment) includes equipment type, equipment manufacturer information, and interface information. The attribute information of the facility system equipment also includes flow information, pressure information, and remarks information;

[0094] The location information of the equipment is the coordinate information of the equipment in the semiconductor production layout plane.

[0095] The piping and instrumentation components include pipes, valves, test / measurement instruments, etc.

[0096] At the same time, after obtaining the attribute information and location information of the equipment, the data parsing module will interact with the secondary piping database and transmit the above-mentioned attribute information and location information of the equipment to the secondary piping database.

[0097] Among them, the secondary piping database receives and stores the attribute information and location information of the equipment. In addition, the secondary piping database has also pre-received and stored the attribute information of the relevant piping and instrumentation components for semiconductor secondary piping and the attribute information of the corresponding three-dimensional components.

[0098] In addition, the layout device for the semiconductor secondary piping installation project may further include a display module and a 3D model conversion module. Among them, the display module is used to display the piping and instrumentation diagram and the layout model of the semiconductor secondary piping.

[0099] The 3D model conversion module is used to convert the layout model of the semiconductor secondary piping into a target model format. For the 3D model conversion module, the 3D model can be processed through code and converted into a model data format acceptable to other software APIs, and the converted data is sent to the API for model establishment of other simulation calculation software.

[0100] Furthermore, as Figure 2 shown, the layout device for the semiconductor secondary piping installation project further includes: a simulation module, a fluid system capacity management module, and a construction management module;

[0101] The simulation module is used to simulate and analyze the power supply process based on the layout model of the semiconductor secondary piping installation project in combination with the power supply parameters.

[0102] The simulation module is signal-connected to the 3D space management module and is used to simulate and analyze the power supply process based on the layout model of the semiconductor secondary piping installation project in combination with the power supply parameters.

[0103] The facility system capacity management module is signal-connected to the data analysis and layout module and is used to set and monitor the power supply points based on the piping and instrumentation diagram, and guide the generation of the secondary piping installation pipeline diagram based on the status of the power supply points.

[0104] The construction management module is signal-connected to the facility system capacity management module and is used to update the status of the power supply points based on the construction progress and transmit it to the facility system capacity management module.

[0105] The power supply point can also be called a fluid supply point. The monitoring of the fluid supply point by the facility system capacity management module mainly focuses on the monitoring, management, and pushing of the status. For the fluid supply points without secondary piping layout, after the fluid supply point information is synchronized to the facility system capacity management module, according to the principle of the closest distance between the equipment and the point, the fluid supply point information is pushed to the data analysis and layout module; then, it is judged whether the point information meets the requirements of other equipment, and the best point is recommended according to the equipment requirements to guide the generation of the secondary piping installation pipeline diagram in the data analysis and layout module; the construction supervision module is used to update the status of the power supply point based on the construction progress and transmit it to the facility system capacity management module to ensure that the point information is updated in real time and consistent with the actual situation on site, ensuring a virtuous cycle of point allocation. After adding the simulation module, the facility system capacity management module, and the construction management module, the layout device includes the entire process of engineering design, construction, operation, and maintenance of secondary piping installation, which is of great significance for improving the design consistency, quality, and progress of secondary piping, and can reduce the investment and operation costs of secondary piping.

[0106] Parse the layout file of the semiconductor production line to obtain the attribute information and location information of the equipment, specifically including:

[0107] Based on the parsing of the equipment configuration file, obtain the attribute information of each equipment;

[0108] Match the equipment in the characteristic information file with the layout design file, analyze the layout of each equipment, and give the location information of each equipment.

[0109] After the data analysis and layout module obtains the attribute information and location information of the equipment from the data parsing module, it can realize the production of the piping and instrumentation diagram, the secondary piping installation pipeline diagram, and the layout model of the semiconductor secondary piping installation project.

[0110] The data analysis and layout module uses the component matching algorithm and the 3D model generation algorithm in the data acquisition and layout module. Among them, based on the attribute information and location information of the equipment, combined with the component matching algorithm, obtain the piping and instrumentation components corresponding to the secondary piping database, specifically including:

[0111] According to the attribute information of the equipment, perform component matching in the secondary piping database to determine the piping and instrumentation components corresponding to each equipment, and extract the attribute information of the piping and instrumentation components. Among them, the attribute information of the piping and instrumentation components includes the type, size, and rated power supply of the piping and instrumentation components;

[0112] Classify and delimit each piping and instrumentation component, and combine the location information of the corresponding equipment to which it is supplied to give the location information of each piping and instrumentation component.

[0113] For the component matching algorithm, it mainly matches and extracts the piping and instrumentation components in the secondary piping database based on the attribute information of the equipment. Specifically, as Figure 3 shown, according to the attribute information of the equipment, component matching is performed in the secondary piping database to determine the piping and instrumentation components corresponding to each equipment supply, specifically including:

[0114] Query and confirm the equipment for matching in the secondary piping database;

[0115] Group the semiconductor manufacturing equipment in combination with the equipment type and the semiconductor manufacturing area where it is located, and label the group number;

[0116] Analyze the power source demand of each group of semiconductor manufacturing equipment, and determine the power source supply of the facility system equipment based on the power source demand, and give the power source supply path between the facility system equipment and the semiconductor manufacturing equipment;

[0117] In the secondary piping database, match each group of semiconductor manufacturing equipment through the attribute information of the piping and instrumentation components to determine the corresponding piping and instrumentation components.

[0118] For example, in a specific application scenario, the data acquisition layout module sends an instruction to the secondary piping database to confirm in the secondary piping database with the attribute information of the equipment obtained by the data parsing module. Of course, the confirmed equipment includes both semiconductor manufacturing equipment and facility system equipment. After that, it is mainly grouped according to various types of semiconductor manufacturing equipment in each semiconductor manufacturing area, and each group of semiconductor manufacturing equipment is labeled. At this time, the semiconductor manufacturing area can be distinguished by the floors of the semiconductor manufacturing plant.

[0119] For each labeled group of semiconductor manufacturing equipment, calculate the power source demand and then allocate the power source supply. For the principle of power source supply, it can be mainly based on the maximum value that the total supply flow meets the power source demand. At the same time, considering the rated power supply of each piping and instrumentation component, determine the power source supply for each group of semiconductor manufacturing equipment. For example, when the total supply flow meets the maximum value of the power source demand, but the pressure significantly exceeds the rated power supply of the piping and instrumentation component, the power source supply needs to be adjusted. After adjustment, give the power source supply path between the facility system equipment and the semiconductor manufacturing equipment.

[0120] The piping and instrumentation components for secondary piping are laid out according to the power source supply path. Based on the corresponding relationship between the piping and instrumentation components and the semiconductor manufacturing equipment, determine each corresponding piping and instrumentation component required by each semiconductor manufacturing equipment. Of course, each piping and instrumentation component will also be matched with the facility system equipment based on the attribute information.

[0121] After determining the semiconductor production equipment, plant system equipment, power supply path and corresponding pipeline instrument components, such as Figure 4 As shown, each pipeline instrument component is classified and demarcated, and the location information of each pipeline instrument component is given in combination with the location information of the corresponding supplied equipment, including:

[0122] Classify each identified pipeline instrument component along the power source supply path between the plant system equipment and the semiconductor production equipment;

[0123] Determine the ordinate information of various types of pipeline instrument components in the layout plane according to the group number of the corresponding supplied semiconductor production equipment, wherein the ordinate information represents the semiconductor production area where the pipeline instrument components are located;

[0124] According to the location information of the corresponding supplied semiconductor production equipment, determine the horizontal coordinate position of all pipeline instrument components corresponding to the semiconductor production equipment in the layout plane;

[0125] According to the preset attribute information of each pipeline instrument component, the horizontal axis position is divided to determine the horizontal axis information of each pipeline instrument component in the layout plane, wherein the horizontal axis information represents the relative interval between the pipeline instrument component and the corresponding semiconductor production equipment.

[0126] The classification of each pipeline instrument component along the power source supply path is mainly based on the semiconductor production area. Taking the above application scenario as an example, each pipeline instrument component can be divided into different categories corresponding to the floors of different semiconductor production plants. Since the semiconductor production equipment at this time is also marked with group numbers according to the semiconductor production area, at this time, the semiconductor production area of a specific group number and the pipeline instrument component of a specific classification can determine the corresponding relationship, thus, the vertical coordinate information in the layout plane is used to represent the semiconductor production area, that is, the floor of the semiconductor production plant in this application scenario.

[0127] The horizontal coordinate information of the pipeline instrument component represents the relative distance between the corresponding semiconductor production equipment. The horizontal coordinate position of all the pipeline instrument components corresponding to a certain semiconductor production equipment is first determined, and then the large horizontal coordinate position is divided according to the type, size and other attribute information of each pipeline instrument component to obtain the horizontal coordinate information of each pipeline instrument component in the layout plane.

[0128] Based on the attribute information and location information of semiconductor production equipment and factory system equipment, the power source supply path is first given, and then the pipeline instrument components are matched, and the location information representing the semiconductor production area and the interval with the semiconductor production equipment is determined in the layout plane, such as Figure 5As shown in the figure, the secondary piping process of the pipeline instrument assembly meets the regulatory requirements of semiconductor production, is convenient for later adjustment to meet user-defined needs, balances efficiency and flexibility, and ensures the accuracy of the generation of the pipeline and instrument flow diagram.

[0129] In addition, the data analysis and layout module is also used for: after forming the pipeline and instrument flow diagram,

[0130] by receiving touch interaction information, optimizing the attribute information and / or position information of each pipeline instrument component to form an initial diagram of the secondary piping installation pipeline;

[0131] performing adaptive detection on the initial pipeline and instrument flow diagram, and forming a secondary piping installation pipeline diagram based on the analysis of the adaptive detection results.

[0132] Considering the later user-defined needs, touch interaction is set in the data analysis and layout module to adjust the attribute information and / or position information of the pipeline instrument components. After adjustment, adaptive detection will also be performed based on the basic rules of secondary piping, and finally a secondary piping installation pipeline diagram will be obtained.

[0133] Based on the adjustment of touch interaction, it can be viewed and displayed through the display module, and the adjusted pipeline and instrument flow diagram can be presented in the display module.

[0134] As Figure 6 shown, based on the secondary piping installation pipeline diagram and combined with the 3D model generation algorithm, a layout model of semiconductor secondary piping is generated, specifically including:

[0135] performing component analysis on the secondary piping installation pipeline diagram to obtain each pipeline instrument component;

[0136] matching each pipeline instrument component with the 3D components in the secondary piping database to determine the 3D components corresponding to the pipeline instruments;

[0137] Combining the position information of each pipeline instrument component and based on the analysis of the attribute information of the 3D components, updating the shape of the 3D components to generate a layout model of semiconductor secondary piping, where the attribute information of the 3D components includes the shape information and size information of the 3D components.

[0138] For the secondary piping installation pipeline diagram, a layout model of the semiconductor secondary piping installation project can be obtained according to the 3D model generation algorithm. The core of the 3D model generation algorithm lies in the analysis of overlap and intersection, and the re-adjustment of the attributes of each 3D component.

[0139] As Figure 7As shown, by combining the position information of each pipeline instrument component and based on the analysis of the attribute information of the three-dimensional components, the shape of the three-dimensional components is updated, specifically expressed as:

[0140] Compare the abscissa and ordinate information of each pipeline instrument component in the layout plane pairwise to determine the pipeline instrument components with layout intersections, and form the first set of pipeline instrument components;

[0141] Map and match the three-dimensional components of the pipeline instruments for each pipeline instrument component in the first set of pipeline instrument components to form the first set of three-dimensional components;

[0142] In the first set of three-dimensional components, compare the vertical dimension information of each three-dimensional component pairwise, and combine the preset layout model space of the semiconductor secondary piping installation project to give the three-dimensional components with intersections, and collect the pipeline instrument components corresponding to the intersecting three-dimensional components to form the second set of pipeline instrument components;

[0143] Adjust the abscissa, and / or ordinate information, and / or adjust the vertical dimension information of each pipeline instrument component in the layout plane of each pipeline instrument component in the second set of pipeline instrument components;

[0144] Repeat the comparison of the abscissa and ordinate information of the pipeline instrument components in the layout plane and the comparison of the vertical dimension information of each three-dimensional component until both the first set of pipeline instrument components and the second set of pipeline instrument components are empty sets, and complete the shape update of the three-dimensional components.

[0145] The first set of pipeline instrument components is specifically expressed as:

[0146]

[0147] Among them, C is the set of all pipeline instrument components, c1, c2, c i , c j , c n are the 1st, 2nd, i-th, j-th, and n-th pipeline instrument components respectively, C1 is the first set of pipeline instrument components, x i , y i are the abscissa and ordinate of the i-th pipeline instrument component in the layout plane, x j , y j are the abscissa and ordinate of the j-th pipeline instrument component in the layout plane, is an empty set.

[0148] The second set of pipeline instrument components is specifically expressed as:

[0149]

[0150] Among them, C1' is the first set of three-dimensional components, and c k , c s are the k-th and s-th piping and instrumentation components respectively, and c i ’, c j ’, c k ’, c s ’ are the three-dimensional components that match the piping and instrumentation components c i , c j , c k , c s respectively. M() is the mapping and matching function, C2 is the second set of piping and instrumentation components, z k ' is the vertical dimension data of the three-dimensional component c k ', and z s ' is the vertical dimension data of the three-dimensional component c s . is an empty set.

[0151] In a specific application scenario, as Figure 8 shows, a pipe in the layout plane may be two or even multiple overlapping pipes in the three-dimensional layout model space. It's just that one covers the other in a position above it (i.e., the vertical dimension information is different). Therefore, when converting from a two-dimensional secondary piping installation pipeline diagram to a three-dimensional semiconductor secondary piping layout model, it is necessary to judge these overlapping pipes. The judgment method is based on their coordinate information in the layout plane and the vertical dimension information as three-dimensional components. If the x and y coordinates of the piping and instrumentation components on the layout plane are the same, then calculate the z value of their vertical dimension information of the three-dimensional components to avoid coincidence and intersection in the three-dimensional layout model space. Because the pipes in the semiconductor production workshop are very complex and the space is very small, and the re-adjustment process includes the re-calculation of the z value, and also includes, for example, up and down adjustment (i.e., adjustment of the ordinate information in the layout plane) or left and right adjustment (i.e., adjustment of the abscissa information in the layout plane). Repeating the above process, the shape update of the three-dimensional components and the coordinate determination of the three-dimensional components in the layout model space are completed.

[0152] Based on the secondary piping installation pipeline diagram, according to the three-dimensional model generation algorithm, the obtained three-dimensional semiconductor secondary piping layout model solves the possible problems of repetition and intersection in the conversion from a two-dimensional piping and instrumentation flow chart to a three-dimensional semiconductor secondary piping layout model, and provides a more intuitive and accurate three-dimensional visualization solution.

[0153] As Figure 9 shows, the present invention also provides a layout method for a semiconductor secondary piping installation project. Using the layout device for the semiconductor secondary piping installation project as described above, it specifically includes the following steps:

[0154] Receive the layout file of the semiconductor production line;

[0155] Parse the layout file of the semiconductor production line, obtain the attribute information and location information of the equipment, and transmit the attribute information and location information of the equipment to the secondary piping database, where the equipment includes semiconductor production equipment and facility system equipment;

[0156] Based on the attribute information and location information of the equipment, combined with the component matching algorithm, obtain the corresponding piping and instrumentation components in the secondary piping database, and connect the equipment and the corresponding piping and instrumentation components to form a piping and instrumentation flow diagram, and give the secondary piping installation pipeline diagram;

[0157] Based on the secondary piping installation pipeline diagram, combined with the 3D model generation algorithm, generate the layout model of the semiconductor secondary piping installation project.

[0158] A layout device and method for a semiconductor secondary piping installation project provided by the present invention at least include the following beneficial effects:

[0159] (1) Through the linkage between the semiconductor layout information and the secondary piping database, combined with the component matching algorithm, the present invention obtains the information of the secondary piping components, and according to the 3D model generation algorithm, realizes the automatic output of the semiconductor secondary piping layout and visualizes it in a 3D scene.

[0160] (2) Based on the attribute information and location information of the semiconductor production equipment and facility system equipment, first give the power source supply path, then perform the matching of the piping and instrumentation components, and determine the position information such as the semiconductor production area and the distance from the semiconductor production equipment in the layout plane. This makes the secondary piping process of the piping and instrumentation components meet the rule requirements of semiconductor production and is also convenient for later adjustment to meet user-defined requirements, taking into account both efficiency and flexibility, and ensuring the accuracy of the generation of the piping and instrumentation flow diagram.

[0161] (3) Based on the secondary piping installation pipeline diagram, according to the 3D model generation algorithm, the obtained 3D layout model of the semiconductor secondary piping installation project solves the possible problems of duplication and intersection in the conversion from a 2D piping and instrumentation flow diagram to a 3D layout model of the semiconductor secondary piping installation project, and provides a more intuitive and accurate 3D visualization solution.

[0162] Although the preferred embodiments of the present invention have been described, additional changes and modifications can be made to these embodiments by those skilled in the art once they learn of the basic inventive concept. Therefore, the appended claims are intended to be construed to include the preferred embodiments as well as all changes and modifications that fall within the scope of the present invention. Obviously, those skilled in the art can make various changes and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these modifications and variations.

Claims

1. A layout device for a semiconductor secondary piping installation project, characterized in that, Specifically, it includes: a file upload module for signal connection, a data parsing module, a data analysis layout module, a three-dimensional space management module, and a secondary piping database; The file upload module is used to receive the layout file of the semiconductor production line; The data parsing module is used to parse the layout file of the semiconductor production line, obtain the attribute information and location information of the equipment, and transmit the attribute information and location information of the equipment to the secondary piping database, where the equipment includes semiconductor production equipment and factory facility system equipment; The data analysis layout module is used to obtain the corresponding piping and instrumentation components in the secondary piping database based on the attribute information and location information of the equipment, combine with the component matching algorithm, connect the equipment and the corresponding piping and instrumentation components, form a piping and instrumentation flow diagram, and give the secondary piping installation pipeline diagram; The three-dimensional space management module is used to generate the layout model of the semiconductor secondary piping installation project based on the secondary piping installation pipeline diagram and combine with the three-dimensional model generation algorithm; The layout device further includes: a simulation module, a factory facility system capacity management module, and a construction management module; The simulation module is signal-connected to the three-dimensional space management module and is used to simulate and analyze the power supply process based on the layout model of the semiconductor secondary piping installation project and combine with the power supply parameters; The factory facility system capacity management module is signal-connected to the data analysis layout module and is used to set and monitor the power supply points based on the piping and instrumentation flow diagram, and guide the generation of the secondary piping installation pipeline diagram based on the status of the power supply points; The construction management module is signal-connected to the factory facility system capacity management module and is used to update the status of the power supply points based on the construction progress and transmit it to the factory facility system capacity management module.

2. The layout device of the semiconductor secondary piping installation project according to claim 1, characterized in that The layout file includes an equipment configuration file, a layout design file, and a feature information file; The attribute information of the equipment includes equipment type, equipment manufacturer information, and interface information. The attribute information of the factory facility system equipment further includes flow information, pressure information, and remarks information; The location information of the equipment is the coordinate information of the equipment in the semiconductor production layout plane; Among them, parsing the layout file of the semiconductor production line to obtain the attribute information and location information of the equipment specifically includes: Based on the parsing of the equipment configuration file, obtaining the attribute information of each equipment; Matching the equipment in the feature information file with the layout design file, analyzing the layout of each equipment, and giving the location information of each equipment.

3. The layout device of the semiconductor secondary piping installation project according to claim 1, characterized in that, Based on the attribute information and location information of the equipment, combining with the component matching algorithm to obtain the corresponding piping and instrumentation components in the secondary piping database specifically includes: According to the attribute information of the equipment, performing component matching in the secondary piping database, determining the piping and instrumentation components corresponding to each equipment, and extracting the attribute information of the piping and instrumentation components. Among them, the attribute information of the piping and instrumentation components includes the type, size rating, and power supply amount of the piping and instrumentation components; Classifying and demarcating each piping and instrumentation component, and combining with the location information of the corresponding equipment, giving the location information of each piping and instrumentation component.

4. The layout device of the semiconductor secondary piping installation project according to claim 3, characterized in that, According to the attribute information of the equipment, performing component matching in the secondary piping database to determine the piping and instrumentation components corresponding to each equipment specifically includes: Query and confirm the devices for matching in the secondary piping database; Group the semiconductor manufacturing equipment according to the equipment type and the semiconductor manufacturing area where it is located, and label the group number; Analyze the power source demand of each group of semiconductor manufacturing equipment, determine the power source supply of the facility system equipment based on the power source demand, and give the power source supply path between the facility system equipment and the semiconductor manufacturing equipment; In the secondary piping database, match each group of semiconductor manufacturing equipment through the attribute information of the piping and instrumentation components to determine the corresponding piping and instrumentation components.

5. The layout device of the semiconductor secondary piping installation project according to claim 4, characterized in that, Classify and delimit each piping and instrumentation component, and give the location information of each piping and instrumentation component in combination with the location information of the equipment to which it corresponds. Specifically, it includes: Classify each determined piping and instrumentation component along the power source supply path between the facility system equipment and the semiconductor manufacturing equipment; Determine the ordinate information of each type of piping and instrumentation component in the layout plane according to the group number of the corresponding semiconductor manufacturing equipment. Among them, the ordinate information represents the semiconductor manufacturing area where the piping and instrumentation component is located; Determine the abscissa location of all piping and instrumentation components corresponding to the semiconductor manufacturing equipment in the layout plane according to the location information of the corresponding semiconductor manufacturing equipment; Divide the abscissa location according to the preset attribute information of each piping and instrumentation component to determine the abscissa information of each piping and instrumentation component in the layout plane. Among them, the abscissa information represents the relative interval between the piping and instrumentation component and the corresponding semiconductor manufacturing equipment to which it is supplied; 6. The layout device of the semiconductor secondary piping installation project according to claim 1, characterized in that, Based on the secondary piping installation pipeline diagram, combine the 3D model generation algorithm to generate the layout model of semiconductor secondary piping, specifically including: Perform component analysis on the secondary piping installation pipeline diagram to obtain each piping and instrumentation component; Match each piping and instrumentation component with the 3D components in the secondary piping database to determine the 3D components of the corresponding piping and instrumentation; Combine the location information of each piping and instrumentation component, and based on the analysis of the attribute information of the 3D components, update the shape of the 3D components to generate the layout model of the semiconductor secondary piping installation project. Among them, the attribute information of the 3D components includes the shape information and size information of the 3D components.

7. The layout device of the semiconductor secondary piping installation project according to claim 6, characterized in that, Combine the location information of each piping and instrumentation component, and based on the analysis of the attribute information of the 3D components, update the shape of the 3D components, specifically expressed as: Compare the abscissa and ordinate information of each piping and instrumentation component in the layout plane pairwise to determine the piping and instrumentation components with layout intersections, and form the first set of piping and instrumentation components; Map and match the 3D components of the piping and instrumentation with each piping and instrumentation component in the first set of piping and instrumentation components to form the first set of 3D components; In the first set of 3D components, compare the vertical dimension information of each 3D component pairwise, and in combination with the preset layout model space of the semiconductor secondary piping installation project, give the 3D components with intersections, and gather the piping and instrumentation components of the corresponding intersecting 3D components to form the second set of piping and instrumentation components; Adjust the abscissa, and / or the ordinate information, and / or adjust the vertical dimension information of each pipeline instrument component in the second pipeline instrument component set in the layout plane; Repeat the comparison of the abscissa and ordinate information of the above pipeline instrument components in the layout plane and the comparison of the vertical dimension information of each 3D component until both the first pipeline instrument component set and the second pipeline instrument component set are empty sets, and complete the shape update of the 3D component.

8. The layout device of the semiconductor secondary piping installation project according to claim 3, characterized in that The data analysis layout module is also used for: after forming the pipeline instrument flow chart, Optimize the attribute information, and / or the position information of each pipeline instrument component by receiving touch interaction information to form an initial diagram of the secondary piping installation pipeline; Conduct an adaptive detection on the initial pipeline instrument flow chart, and form a secondary piping installation pipeline diagram based on the analysis of the adaptive detection result.

9. A layout method for a semiconductor secondary piping installation project, characterized in that, Adopt the layout device for the semiconductor secondary piping installation project as described in any one of claims 1-8, specifically including the following steps: Receive the layout file of the semiconductor production line; Parse the layout file of the semiconductor production line, obtain the attribute information and position information of the equipment, and transmit the attribute information and position information of the equipment to the secondary piping database, where the equipment includes semiconductor production equipment and factory facility system equipment; Based on the attribute information and position information of the equipment, combine with the component matching algorithm to obtain the corresponding pipeline instrument components in the secondary piping database, and connect the equipment and each corresponding pipeline instrument component to form a pipeline instrument flow chart, and give the secondary piping installation pipeline diagram; Based on the secondary piping installation pipeline diagram, combine with the 3D model generation algorithm to generate the layout model of the semiconductor secondary piping installation project.

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