Printed circuit board design data conversion device

By designing a printed circuit board design data conversion device, the original printed circuit board design data is analyzed, sorted, marked and layer position adjustment, which solves the problem that the existing technology cannot automatically process laser or back drilling data, and realizes automatic processing and improve data accuracy.

CN119443024APending Publication Date: 2025-02-14ELITEGROUP COMPUTER SYSTEMS +1
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Patent Information

Application Number
CN202310982362.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-08-07
Publication Date
2025-02-14

AI Technical Summary

Technical Problem

When performing Yin-Yang type-split splicing, existing printed circuit board design software cannot automatically process and arrange data of laser drilling or back drilling, resulting in data errors and the need for artificial arrangement.

Method used

Design a printed circuit board design data conversion device, including a data acquisition unit, a data analysis unit, an information addition unit, a sorting and marking unit and a layer adjustment unit, through which the original printed circuit board design data are analyzed, sorted, marked and Adjust the layer position to ensure that the data is suitable for yin and yang typesetting.

Benefits of technology

It realizes automatic processing of laser or back drilling, avoids data errors, simplifies the operation process, and improves the yield of the printed circuit board.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a printed circuit board design data conversion device which is used for converting original printed circuit board design data, so that the converted printed circuit board design data is suitable for yin-yang typesetting and splicing of a printed circuit board. The device comprises a data acquisition unit for acquiring original printed circuit board design data; the data analysis unit is in signal connection with the data acquisition unit and is used for analyzing the original printed circuit board design data so as to calculate a sorting mode of a plurality of layers; the information adding unit is in signal connection with the data analysis unit, records the original information of the original printed circuit board design data, and adds the calculated and adjusted information into the recorded information; the sorting and marking unit is in signal connection with the information adding unit, and sorts and marks the multiple layers of the recorded information according to the recorded information; and the layer adjusting unit is in signal connection with the sequencing and marking unit and is used for turning over the plurality of layers of the recorded information up and down according to the sequencing and marking result.
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Description

Technical Field

[0001] The present invention relates to a printed circuit board design data conversion device, and in particular to a printed circuit board design data conversion device which can convert original printed circuit board design data to be suitable for positive and negative typesetting and splicing of printed circuit boards. Background Art

[0002] Please refer to Figure 1 , Figure 1 It is a schematic diagram of the printed circuit board design data of the printed circuit board without the Yin-Yang layout splicing presented by the existing printed circuit board design software. Figure 1 In the figure, the two spliced ​​printed circuit boards PCS1 and PCS2 are not inverted, that is, they are spliced ​​in a normal manner. The printed circuit board design data of the printed circuit boards PCS1 and PCS2 include information S1, M1, L1, L2, L3, L4, M2, S2 of layer names in descending order and information DRL1-4 and LS3-4 of hole structures. Information S1, M1, L1, L2, L3, L4, M2, S2 represent the upper marking layer, the upper soldering layer, the first circuit layer, the second circuit layer, the third circuit layer, the fourth circuit layer, the lower soldering layer and the lower marking layer, respectively, and information DRL1-4 and LS3-4 represent through holes formed by a drilling machine in the first to fourth circuit layers and through holes formed by a laser in the third and fourth circuit layers, respectively.

[0003] However, the existing PCB design software can only invert the front and back layer data when designing a PCB with positive and negative layout splicing. However, if laser drilling or back drilling is encountered, the design software cannot automatically process and arrange the data. Therefore, it is necessary to provide a technical solution that can convert the original PCB design data so that it can be applied to the positive and negative layout splicing of the PCB. Summary of the invention

[0004] Based on at least one purpose of the present invention, the present invention provides a printed circuit board design data conversion device, which is used to convert the original printed circuit board design data, so that the converted printed circuit board design data can be suitable for the positive and negative layout splicing of the printed circuit board, and the device includes a data acquisition unit, a data parsing unit, an information adding unit, a sorting and marking unit and a layer adjustment unit. The data acquisition unit is used to acquire the original printed circuit board design data, wherein the original printed circuit board design data includes information of multiple layer names and multiple hole structures. The data parsing unit signal is connected to the data acquisition unit, and is used to parse the original printed circuit board design data to calculate the sorting method of multiple layers in the original printed circuit board design data. The information adding unit signal is connected to the data parsing unit, and is used to record the original information of the original printed circuit board design data, and add the calculated and adjusted information to the recorded information, wherein the recorded information includes the sorting method. The sorting and marking unit signal is connected to the information adding unit, and sorts and marks the multiple layers of the recorded information according to the recorded information. The layer adjustment unit signal is connected to the sorting and marking unit, and according to the sorting and marking results, the multiple layers of the recorded information are flipped up and down to adjust the positions of the multiple layers.

[0005] According to the above-mentioned printed circuit board design data conversion device, the printed circuit board design data conversion device further comprises a layer homing unit. The layer homing unit signal is connected to the layer adjustment unit, and according to the recorded information, the multiple layers that are flipped upside down are restored to order and marked.

[0006] According to the above-mentioned printed circuit board design data conversion device, the data parsing unit parses the layer structure according to the multiple layer names and the multiple hole structures, and calculates the ordering of the multiple layers in the original printed circuit board design data according to the structure.

[0007] According to the above-mentioned printed circuit board design data conversion device, the data parsing unit parses the original printed circuit board design data in Perl language.

[0008] According to the above-mentioned printed circuit board design data conversion device, the sorting and marking unit converts the properties of the marked layer.

[0009] In summary, the technical solution of the present invention can convert the original printed circuit board design data so as to be applicable to the positive and negative layout splicing of the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a schematic diagram of a printed circuit board design data of a printed circuit board without yin-yang typesetting and splicing presented by existing printed circuit board design software.

[0011] Figure 2It is a schematic diagram of printed circuit board design data after the printed circuit board design data conversion device according to an embodiment of the present invention converts original printed circuit board design data.

[0012] Figure 3 Schematic diagram of a printed circuit board design data conversion device according to an embodiment of the present invention.

[0013] Figure 4 It is a flow chart of a printed circuit board design data conversion method according to an embodiment of the present invention.

[0014] Description of Reference Numerals

[0015] S1, M1, L1, L2, L3, L4, M2, S2, DRL1-4, LS1-2, LS3-4: Information

[0016] 31: Data acquisition unit

[0017] 32: Data analysis unit

[0018] 33: Information adding unit

[0019] 34: Sorting and labeling units

[0020] 35: Layer adjustment unit

[0021] 36: Layer homing unit DETAILED DESCRIPTION

[0022] In order to fully understand the purpose, features and effects of the present invention, the present invention is described in detail through the following specific embodiments and the accompanying drawings. The description is as follows.

[0023] In the present invention, "a" or "an" is used to describe the units, components and assemblies described herein. This is only for convenience of description and to provide a general meaning to the scope of the present invention. Therefore, unless it is obvious that it is otherwise intended, such description should be understood to include one, at least one, and the singular also includes the plural.

[0024] In the present invention, the terms "comprise", "include", "have", "contain" or any other similar terms are intended to cover non-exclusive inclusions. For example, a component, structure, article or device containing multiple elements is not limited to those listed herein, but may include other elements that are not explicitly listed but are generally inherent to the component, structure, article or device. In addition, unless expressly stated to the contrary, the term "or" refers to an inclusive "or" rather than an exclusive "or".

[0025] Please refer to Figure 2 , Figure 2It is a schematic diagram of printed circuit board design data after the printed circuit board design data conversion device according to an embodiment of the present invention converts original printed circuit board design data. Figure 1 If the PCB design data is to be used for the yin-yang layout splicing of PCB, the data needs to be further converted. Figure 2 It can be seen that after the positive and negative layout splicing, in the second printed circuit board PCS2, the through holes (formed by the drilling machine) of the first circuit layer to the fourth circuit layer are located on the right, and the through holes (formed by the laser) of the first circuit layer and the second circuit layer are located on the left. Therefore, compared with Figure 1 PCB design data, Figure 2 The printed circuit board design data further includes hole structure information LS1-2, which indicates that the first circuit layer and the through holes of the first circuit layer are formed by laser.

[0026] The purpose of the present invention is to Figure 1 The printed circuit board design data is converted into Figure 2 The printed circuit board design data is converted into printed circuit board design data before the printed circuit board design data conversion device sends the data to the processing equipment. Figure 2 The printed circuit board design data is sorted and marked, and after processing, the sorted and marked printed circuit board design data is returned to its original position.

[0027] Please refer to Figure 3 , Figure 3 FIG. 1 is a block diagram of a printed circuit board design data conversion device according to an embodiment of the present invention. Figure 3 In the embodiment, the printed circuit board design data conversion device includes a data acquisition unit 31, a data analysis unit 32, an information adding unit 33, a sorting and marking unit 34, a layer adjustment unit 35 and a layer homing unit 36. The data analysis unit 32 is connected to the data acquisition unit 31 by signal, the information adding unit 33 is connected to the data analysis unit 32 by signal, the sorting and marking unit 34 is connected to the information adding unit 33 by signal, the layer adjustment unit 35 is connected to the sorting and marking unit 34 by signal, and the layer homing unit 36 ​​is connected to the layer adjustment unit 35 by signal.

[0028] Please refer to Figure 3 and Figure 4 , Figure 41 is a flow chart of the printed circuit board design data conversion method according to an embodiment of the present invention. In step S41, the data acquisition unit 31 is used to acquire the original printed circuit board design data, wherein the original printed circuit board design data includes information of multiple layer names and multiple hole structures. In step S42, the data parsing unit 32 is used to parse the original printed circuit board design data to calculate the sorting method of multiple layers in the original printed circuit board design data. The data parsing unit 32 parses the layer structure according to the multiple layer names and the multiple hole structures, and calculates the sorting method of multiple layers in the original printed circuit board design data according to the structure, and uses the perl language software for parsing.

[0029] In step S43, the information adding unit 33 is used to record the original information of the original printed circuit board design data, and add the calculated and adjusted information to the recorded information, wherein the recorded information includes the sorting method. In step S44, the sorting and marking unit 34 sorts and marks the multiple layers of the recorded information according to the recorded information, wherein the attributes of the marked layers are converted by the sorting and marking unit 34. In step S45, the layer adjustment unit 35 flips the multiple layers of the recorded information upside down according to the sorting and marking results to adjust the positions of the multiple layers. In step S46, the layer repositioning unit 36 ​​restores the sorting and marking of the multiple layers that have been flipped upside down according to the recorded information.

[0030] In summary, the technical solution of the present invention can convert the original printed circuit board design data and make it applicable to the positive and negative layout splicing of printed circuit boards. The technical solution of the present invention solves the problem of data errors caused by laser or back drilling, which causes the system of the prior art to not process. At the same time, the technical solution of the present invention solves the problem that the layers need to be arranged manually before proceeding, thereby improving efficiency, simplifying the operation process and improving the yield.

[0031] The present invention has been disclosed above with preferred embodiments. It should be understood by those skilled in the art that the embodiments are only used to describe the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that any changes and substitutions equivalent to the embodiments should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the claims.

Claims

1. A printed circuit board design data conversion device, characterized in that: The device is used to convert the original printed circuit board design data so that the converted printed circuit board design data is suitable for positive and negative layout splicing of the printed circuit board. The printed circuit board design data conversion device includes: A data acquisition unit, used to acquire the original printed circuit board design data, wherein the original printed circuit board design data includes information of multiple layer names and multiple hole structures; A data parsing unit, signal-connected to the data acquisition unit, for parsing the original printed circuit board design data to calculate the ordering of multiple layers in the original printed circuit board design data; an information adding unit, signal-connected to the data parsing unit, for recording original information of the original printed circuit board design data and adding the calculated and adjusted information to the recorded information, wherein the recorded information includes the sorting method; and a sorting and marking unit, signal-connected to the information adding unit, for sorting and marking the multiple layers of the recorded information according to the recorded information; The layer adjustment unit is connected to the sorting and marking unit by signal, and according to the sorting and marking results, the multiple layers of the recorded information are turned upside down to adjust the positions of the multiple layers.

2. The printed circuit board design data conversion device according to claim 1, characterized in that: Further including: The layer homing unit is connected to the layer adjustment unit by a signal, and according to the recorded information, restores the order and marks of the multiple layers that have been flipped upside down.

3. The printed circuit board design data conversion device according to claim 1, characterized in that: The data parsing unit parses the layer structure according to the multiple layer names and the multiple hole structures, and calculates the ordering of the multiple layers in the original printed circuit board design data according to the structure.

4. The printed circuit board design data conversion device according to claim 1, characterized in that: The data parsing unit parses the original printed circuit board design data using Perl language.

5. The printed circuit board design data conversion device according to claim 1, characterized in that: The sorting and marking unit converts the properties of the layers to be marked.