X-ray tube anode target disk, welded structure and target disk preparation method

Abstract

The application relates to an X-ray tube anode target disc, a welding structure and a target disc preparation method, which comprises graphite, metal and a welding layer for welding the two; the graphite and the metal are annular and are opposite to each other on two surfaces of the graphite and the metal, one of the two surfaces is configured with a protrusion, and the other surface is configured with a groove matched with the protrusion; the welding layer comprises a first welding area, a second welding area and a third welding area in a radial direction of the target disc along an axis of the target disc; the first welding area, the second welding area and the third welding area are arranged in a stepped manner, and the second welding area is located between the protrusion and the groove; wherein the solder thickness of the first welding area is not equal to the solder thickness of the third welding area. The porosity of the welding layer of the X-ray tube anode target disc is low, the welding quality is good, the connection strength between the graphite and the metal is high, the connection stability is also good, and the working condition requirements of the X-ray tube anode target disc under high temperature and high rotation frequency can be effectively met.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of parts preparation for medical devices, in particular to an X-ray tube anode target disc and a preparation method thereof. BACKGROUND

[0002] An X-ray tube is used to generate X-rays, and plays an important role in various fields such as medical diagnosis, security inspection and non-destructive testing. The X-ray tube includes a vacuum tube and a cathode filament and an anode target disc arranged in the vacuum tube. The cathode filament is used to generate an electron beam directed to the anode target disc, and the surface of the anode target disc converts the kinetic energy of the electron beam to the anode target disc into high-frequency electromagnetic waves, i.e. X-rays. The anode target disc generally includes metal made of molybdenum alloy and graphite. The metal generates X-rays when it is bombarded by electrons from the cathode filament, and the graphite is used for heat storage. Generally, the metal and the graphite are connected by brazing. However, due to the high porosity of the welding layer during brazing of the metal and the graphite, the connection strength between the two is low, resulting in poor connection stability of the metal and the graphite, which is difficult to meet the requirements of the X-ray anode target disc under high temperature and high rotation frequency working conditions. SUMMARY

[0003] Therefore, it is necessary to provide an X-ray tube anode target disc to solve the problem of high porosity of the welding layer between the metal and the graphite in the existing X-ray tube anode target disc, which further reduces the connection strength between the two and the connection stability, and is difficult to meet the requirements of the working conditions under high temperature and high rotation frequency.

[0004] An X-ray tube anode target disc, comprising graphite, metal, and a welding layer for welding between the graphite and the metal;

[0005] The graphite and the metal are annular and have two surfaces opposite to each other, one of which is configured with a protrusion, and the other of which is configured with a groove matched with the protrusion;

[0006] The welding layer includes a first welding area, a second welding area and a third welding area in the radial direction of the X-ray tube anode target disc along the axis of the X-ray tube anode target disc; the first welding area, the second welding area and the third welding area are arranged in a stepped manner, and the second welding area is located between the protrusion and the groove;

[0007] Wherein, the solder thickness of the first welding area is not equal to the solder thickness of the third welding area.

[0008] In one embodiment, if the solder thickness h1 of the first welding area is less than the solder thickness h3 of the third welding area, the solder thickness h2 of the second welding area satisfies the condition:

[0009] h1 < h2 < h3 or h1 < h2 < h3;

[0010] If the solder thickness h1 of the first soldering area is greater than the solder thickness h3 of the third soldering area, the solder thickness h2 of the second soldering area satisfies the condition:

[0011] h3 < h2 < h1 or h3 < h2 < h1.

[0012] In one embodiment, if the solder thickness h1 of the first soldering area is less than the solder thickness h3 of the third soldering area, the height of the upper end surface of the first soldering area is higher than the height of the upper end surface of the third soldering area, and the height of the lower end surface of the first soldering area is higher than the height of the lower end surface of the third soldering area; or

[0013] If the solder thickness h1 of the first soldering area is greater than the solder thickness h3 of the third soldering area, the height of the upper end surface of the first soldering area is lower than the height of the upper end surface of the third soldering area, and the height of the lower end surface of the first soldering area is lower than the height of the lower end surface of the third soldering area.

[0014] In one embodiment, a side wall first channel is formed between the side wall of the recess and the protrusion, and the side wall first channel is used to guide the first soldering area and the second soldering area;

[0015] A side wall second channel is further formed between the side wall of the recess and the protrusion, and the side wall second channel is used to guide the second soldering area and the third soldering area;

[0016] The solder thickness L1 in the side wall first channel is less than or equal to the solder thickness L2 in the side wall second channel.

[0017] The present application also provides a soldering structure of an X-ray tube anode target disc, which can solve at least one of the above technical problems.

[0018] In one embodiment, the soldering structure of the X-ray tube anode target disc comprises graphite, metal, and a solder block placed between the graphite and the metal, and the graphite and the metal are annular;

[0019] Two surfaces of the graphite and the metal are opposite to each other, one of which is configured with a protrusion, and the other of which is configured with a recess matched with the protrusion;

[0020] The solder block is placed in the recess, and the protrusion is matched with the recess; when the protrusion and the recess are matched, a first matching area, a second matching area, and a third matching area are formed outward from the center of the graphite along the radial direction of the graphite, and the first matching area, the second matching area, and the third matching area are arranged in a stepped manner;

[0021] The height of the first matching area and the third matching area along the axial direction of the graphite is not equal.

[0022] In one embodiment, the upper end surface and / or the lower end surface of the second matching area further has a groove structure.

[0023] In one embodiment, if the height d1 of the first matching area is less than the height d2 of the third matching area, the thickness h of the solder block satisfies the condition:

[0024] d1 < h ≤ d2 or d1 ≤ h < d2;

[0025] If the height d1 of the first matching area is greater than the height d2 of the third matching area, the thickness h of the solder block satisfies the condition:

[0026] d2 < h ≤ d1 or d2 ≤ h < d1.

[0027] In one embodiment, if the height d1 of the first matching area is less than the height d2 of the third matching area, the height of the upper end surface of the first matching area is higher than the height of the upper end surface of the third matching area, and the height of the lower end surface of the first matching area is higher than the height of the lower end surface of the third matching area; or

[0028] If the height d1 of the first matching area is greater than the height d2 of the third matching area, the height of the upper end surface of the first matching area is lower than the height of the upper end surface of the third matching area, and the height of the lower end surface of the first matching area is lower than the height of the lower end surface of the third matching area.

[0029] In one embodiment, a side wall first channel is formed between the side wall of the groove and the protrusion, and the side wall first channel is used to guide the first matching area and the second matching area;

[0030] A side wall second channel is further formed between the side wall of the groove and the protrusion, and the side wall second channel is used to guide the second matching area and the third matching area;

[0031] The width d3 of the side wall first channel is less than or equal to the width d4 of the side wall second channel.

[0032] The present application also provides a preparation method of an X-ray tube anode target disc, which can solve at least one of the above technical problems.

[0033] In one embodiment, the preparation method of the X-ray tube anode target disc comprises:

[0034] On two surfaces of the graphite and the metal opposite to each other, a bump structure is configured on one surface, and a groove structure matched with the bump is configured on the other surface; when the bump and the groove are matched, a first matching area, a second matching area and a third matching area are formed along a radial direction of the graphite from a center to an outside, and the first matching area, the second matching area and the third matching area are arranged in a stepped manner;

[0035] A pre-configured solder block is placed in the second matching area, and the solder block is used to weld the metal and the graphite to form an X-ray tube anode target disc.

[0036] The first matching area and the third matching area are not equal in height along an axial direction of the graphite.

[0037] In one embodiment, the method further comprises:

[0038] According to the volume of the first matching area, the second matching area and the third matching area formed by the metal and the graphite, the volume V of the solder block is calculated.

[0039] In one embodiment, the method further comprises:

[0040] According to the volume V of the solder block, the thickness h of the solder block is calculated.

[0041] According to the thickness h of the solder block, the height d1 of the first matching area and the height d2 of the third matching area are calculated.

[0042] In one embodiment, the step of calculating the height d1 of the first matching area and the height d2 of the third matching area according to the thickness h of the solder block specifically comprises:

[0043] If the height d1 of the first matching area is less than the height d2 of the third matching area, the thickness h of the solder block satisfies the condition:

[0044] d1 < h ≤ d2 or d1 ≤ h < d2;

[0045] If the height d1 of the first matching area is greater than the height d2 of the third matching area, the thickness h of the solder block satisfies the condition:

[0046] d2 < h ≤ d1 or d2 ≤ h < d1.

[0047] The X-ray tube anode target disc, the welding structure of the X-ray tube anode target disc and the preparation method of the X-ray tube anode target disc have the following advantages. One of the two surfaces of the graphite and the metal relative to each other is configured with a protrusion, and the other surface is configured with a groove matched with the protrusion. The welding layer includes a first welding area, a second welding area and a third welding area in the radial direction of the X-ray tube anode target disc along the axis of the X-ray tube anode target disc, and the first welding area, the second welding area and the third welding area are arranged in a stepped manner. The second welding area is located between the protrusion and the groove, and the solder thickness of the first welding area and the third welding area is not equal. Through such arrangement, when the solder block melts in the groove and the protrusion during the welding of the graphite and the metal, it can flow from the area where the second welding area is located to the areas of the first welding area and the third welding area, respectively. And during this flow, because the thickness of the welding layer on both sides is not consistent, the time required for the welding on both sides to be completed is also not consistent, so that the gas generated during the welding process can be discharged through the side with a larger welding layer thickness which has not been completed. Therefore, the X-ray tube anode target disc is arranged by setting the thickness of the first welding area and the third welding area to be different, so that the gas generated during the welding process can be discharged through the side with a larger welding layer thickness which has not been completed. The flow direction of the gas in the molten solder is effectively controlled, so that the porosity of the entire welding layer is low, the possibility of false welding is reduced, the welding quality is good, the connection strength between the graphite and the metal is high, the connection stability is also good, and the working condition requirements of the X-ray tube anode target disc under high temperature and high rotation frequency can be effectively met. BRIEF DESCRIPTION OF DRAWINGS

[0048] Figure 1 The cross-sectional view of the X-ray tube anode target disc provided by an embodiment of the present application before welding.

[0049] Figure 2 The partial cross-sectional view of the X-ray tube anode target disc shown in Figure 1

[0050] Figure 3 The partial cross-sectional view of the X-ray tube anode target disc shown in Figure 1

[0051] ​​Reference numerals: 100 - graphite; 110 - bump; 111 - first welding surface; 112 - second welding surface; 113 - third welding surface; 120 - first grooving structure; 200 - metal; 210 - groove; 211 - fourth welding surface; 212 - fifth welding surface; 213 - sixth welding surface; 220 - first passage; 230 - second passage; 300 - welding layer; 310 - first welding area; 320 - second welding area; 330 - third welding area; 400 - solder block; 510 - first matching area; 520 - second matching area; 530 - third matching area. DETAILED DESCRIPTION

[0052] In order to make the above objectives, features and advantages of the present application more clear and easily understood, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of different ways from those described herein without departing from the scope of the present application, and it is understood that similar improvements can be made by those skilled in the art without departing from the spirit of the present application, and therefore the present application is not limited to the specific embodiments disclosed below.

[0053] In the description of the present application, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0054] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0055] In the present application, unless specifically defined otherwise, if there is an appearance of the terms "installation", "connection", "connection", "fixation" and the like, these terms should be understood in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically defined. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0056] In the present application, unless specifically defined otherwise, if there is a description of the first feature "on" or "below" the second feature and the like, it can mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be the first feature directly above or obliquely above the second feature, or only indicates that the first feature is higher than the second feature in horizontal height. The first feature "below", "below" and "below" the second feature can be the first feature directly below or obliquely below the second feature, or only indicates that the first feature is lower than the second feature in horizontal height.

[0057] It should be noted that if an element is referred to as "fixed to" or "disposed to" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are only for illustrative purposes and do not represent the only implementation.

[0058] Please refer to Figure 1 and Figure 3 , Figure 1 shows a cross-sectional view of the X-ray tube anode target disc provided by an embodiment of the present application before welding. Figure 3 shows Figure 1 the partial cross-sectional view of the X-ray tube anode target disc shown after welding.

[0059] The embodiment of the present application provides an X-ray tube anode target disc, which comprises graphite 100, metal 200 and a welding layer 300 for welding the graphite 100 and the metal 200; the graphite 100 and the metal 200 are annular and are on two surfaces opposite to each other, wherein one surface is configured with a protrusion 110, and the other surface is configured with a groove 210 matched with the protrusion 110; the welding layer 300 comprises a first welding area 310, a second welding area 320 and a third welding area 330 along a radial direction of the X-ray tube anode target disc and with a center axis of the X-ray tube anode target disc as the center, specifically, the axis of the X-ray tube anode target disc is a straight line in which p is located, and the center axis is a point on the axis p; the radial direction of the X-ray tube anode target disc is the xx' direction in Figure 1 ; the first welding area 310, the second welding area 320 and the third welding area 330 are arranged in a stepped manner, and the second welding area 320 is located between the protrusion 110 and the groove 210; wherein the solder thickness of the first welding area 310 is not equal to the solder thickness of the third welding area 330. Figure 1

[0060] The X-ray tube anode target disc has the following advantages: the graphite 100 and the metal 200 are on two surfaces opposite to each other, wherein one surface is configured with the protrusion 110, and the other surface is configured with the groove 210 matched with the protrusion 110; the welding layer 300 comprises the first welding area 310, the second welding area 320 and the third welding area 330 along the radial direction of the X-ray tube anode target disc and with the center axis of the X-ray tube anode target disc as the center; the first welding area 310, the second welding area 320 and the third welding area 330 are arranged in a stepped manner, and the second welding area 320 is located between the protrusion 110 and the groove 210; the solder thickness of the first welding area 310 is not equal to the solder thickness of the third welding area 330. Through the arrangement, when the solder block 400 is melted in the groove 210 and the protrusion 110 in the welding process of the graphite 100 and the metal 200, the solder block 400 can flow into the areas of the first welding area 310 and the third welding area 330 from the area of the second welding area 320 respectively. And during the flowing, because the thicknesses of the welding layers 300 on two sides are different, the time required for welding on two sides is also different, so that the gas generated in the welding process can be discharged through the side with the larger thickness of the welding layer 300 which is not completed after the side with the smaller thickness of the welding layer 300 is completed.

[0061] ​Therefore, the X-ray tube anode target disc is just by setting the thickness of the first welding area 310 and the third welding area 330 to be different, and then forcing the gas generated in the welding process to be discharged through the side with a larger thickness of the welding layer 300 which is not completed, effectively controlling the flow direction of the gas in the molten solder, and then making the porosity of the entire welding layer 300 lower, reducing the possibility of false welding, the welding quality is better, the connection strength between the graphite 100 and the metal 200 is higher, and the connection stability is also better, which can effectively meet the working condition requirements of the X-ray tube anode target disc under high temperature and high rotation frequency.

[0062] It should be noted that the recess 210 and the protrusion 110 on the metal 200 and the graphite 100 can be a complete annular recess 210 and annular protrusion 110, or a partial annular recess 210 and annular protrusion 110, which is not specially limited.

[0063] In one specific embodiment, the metal 200 is a TZM alloy (molybdenum-titanium-zirconium alloy). The solder of the welding layer 300 is Zr solder, or Ti solder, Ni solder, etc.

[0064] In one specific embodiment, the density of the graphite 100 is 1.85 g / cm3.

[0065] The porosity of the welding layer 300 between the metal 200 and the graphite 100 of the X-ray anode target disc is less than 5%, there is no large false welding phenomenon, and the shear strength of the connection between the metal 200 and the graphite 100 can reach 15-22 MPa, the welding strength is high, and the performance is stable and does not crack at a temperature above 1400℃.

[0066] The structure of the X-ray tube anode target disc is described in detail below. Please refer to Figure 3 In one embodiment, if the thickness h1 of the solder of the first welding area 310 is less than the thickness h3 of the solder of the third welding area 330, the thickness h2 of the solder of the second welding area 320 satisfies the condition: h1 < h2 ≤ h3 or h1 ≤ h2 < h3. In another embodiment, if the thickness h1 of the solder of the first welding area 310 is greater than the thickness h3 of the solder of the third welding area 330, the thickness h2 of the solder of the second welding area 320 satisfies the condition: h3 < h2 ≤ h1 or h3 ≤ h2 < h1.

[0067] By setting the solder thickness of the first welding area 310, the second welding area 320 and the third welding area 330 in the form of gradually increasing or gradually decreasing, when the graphite 100 and the metal 200 are in the process of welding, the solder block 400 is melted in the groove 210 and the protrusion 110, it can flow from the area where the second welding area 320 is located to the area of the first welding area 310 and the third welding area 330 respectively. And in this flow process, the gas generated in the welding process can pass through the second welding area 320 after the welding of the side of the welding layer 300 with smaller thickness is completed, and finally be discharged through the side of the welding layer 300 with larger thickness which is not completed, effectively controlling the flow direction of the gas in the melted solder, thereby making the porosity of the entire welding layer 300 lower, reducing the possibility of false welding, the welding quality is better, the connection strength between the graphite 100 and the metal 200 is higher, and the connection stability is also better, which can effectively meet the working condition requirements of the X-ray tube anode target disc under higher temperature and higher rotation frequency.

[0068] Please refer to Figure 3 In one embodiment, if the solder thickness h1 of the first welding area 310 is less than the solder thickness h3 of the third welding area 330, the solder thickness h1 of the first welding area 310 satisfies the condition: 0.1mm≤h1≤0.15mm. The solder thickness h3 of the third welding area 330 satisfies the condition: 0.2mm≤h3≤0.3mm. By setting the solder thickness h1 of the first welding area 310 and the solder thickness h3 of the third welding area 330 in the above range, the thickness of the entire welding layer 300 is kept in a relatively reasonable range under the condition that the solder thickness h1 of the first welding area 310 is not equal to the solder thickness h3 of the third welding area 330, thereby making the connection strength between the graphite 100 and the metal 200 higher.

[0069] Specifically, in one embodiment, the solder thickness h1 of the first welding area 310 is 0.1mm. In another embodiment, the solder thickness h1 of the first welding area 310 is 0.15mm. In still another embodiment, the solder thickness h1 of the first welding area 310 is 0.13mm.

[0070] In one embodiment, the solder thickness h3 of the third welding area 330 is 0.2mm. In another embodiment, the solder thickness h3 of the third welding area 330 is 0.3mm. In still another embodiment, the solder thickness h3 of the third welding area 330 is 0.25mm.

[0071] In another embodiment, the solder thickness hi of the first soldering area 310 satisfies the condition: 0.09mm≤hi≤0.14mm. The solder thickness h3 of the third soldering area 330 satisfies the condition: 0.19mm≤h3≤0.29mm.

[0072] In another embodiment, the solder thickness hi of the first soldering area 310 satisfies the condition: 0.11mm≤hi≤0.16mm. The solder thickness h3 of the third soldering area 330 satisfies the condition: 0.21mm≤h3≤0.31mm.

[0073] In another embodiment, the solder thickness hi of the first soldering area 310 satisfies the condition: 0.09mm≤hi≤0.17mm. The solder thickness h3 of the third soldering area 330 satisfies the condition: 0.19mm≤h3≤0.31mm.

[0074] In another embodiment, the solder thickness hi of the first soldering area 310 satisfies the condition: 0.09mm≤hi≤0.17mm. The solder thickness h3 of the third soldering area 330 satisfies the condition: 0.19mm≤h3≤0.31mm. Figure 3 In another embodiment, if the solder thickness hi of the first soldering area 310 is greater than the solder thickness h3 of the third soldering area 330, the solder thickness hi of the first soldering area 310 satisfies the condition: 0.2mm≤hi≤0.3mm; and the solder thickness h3 of the third soldering area 330 satisfies the condition: 0.1mm≤h3≤0.15mm. By setting the solder thickness hi of the first soldering area 310 and the solder thickness h3 of the third soldering area 330 within the above ranges, the thickness of the solder layer 300 is kept within a reasonable range while the solder thickness hi of the first soldering area 310 is not equal to the solder thickness h3 of the third soldering area 330, thereby increasing the connection strength between the graphite 100 and the metal 200.

[0075] In particular, in one embodiment, the solder thickness hi of the first soldering area 310 is 0.2mm. In another embodiment, the solder thickness hi of the first soldering area 310 is 0.3mm. In another embodiment, the solder thickness hi of the first soldering area 310 is 0.25mm.

[0076] In one embodiment, the solder thickness h3 of the third soldering area 330 is 0.1mm. In another embodiment, the solder thickness h3 of the third soldering area 330 is 0.15mm. In another embodiment, the solder thickness h3 of the third soldering area 330 is 0.13mm.

[0077] In another embodiment, the solder thickness hi of the first soldering area 310 satisfies the condition: 0.19mm≤hi≤0.29mm. The solder thickness h3 of the third soldering area 330 satisfies the condition: 0.09mm≤h3≤0.14mm.

[0078] In another embodiment, the solder thickness h1 of the first welding zone 310 satisfies the condition: 0.21mm ≤ h1 ≤ 0.31mm. The solder thickness h3 of the third welding zone 330 satisfies the condition: 0.11mm ≤ h3 ≤ 0.26mm.

[0079] In another embodiment, the solder thickness h1 of the first welding zone 310 satisfies the condition: 0.19mm ≤ h1 ≤ 0.31mm. The solder thickness h3 of the third welding zone 330 satisfies the condition: 0.09mm ≤ h3 ≤ 0.16mm.

[0080] Please see Figure 3 In one embodiment, if the solder thickness h1 of the first welding area 310 is less than the solder thickness h3 of the third welding area 330, then the height of the upper end face of the first welding area 310 is higher than the height of the upper end face of the third welding area 330, and the height of the lower end face of the first welding area 310 is higher than the height of the lower end face of the third welding area 330. With this arrangement, during the welding process of graphite 100 and metal 200, when the solder block 400 melts in the groove 210 and protrusion 110, it can flow from the area where the second welding area 320 is located to the areas of the first welding area 310 and the third welding area 330, respectively. Furthermore, during this flow, since the solder thickness of the first welding area 310 is less than the solder thickness of the third welding area 330, and simultaneously along... Figure 3 In the yy' direction, the entire first welding zone 310 is located above the third welding zone 330, which makes the welding time of the first welding zone 310 shorter than that of the third welding zone 330. At the same time, during the welding process, the gas generated in the first welding zone 310 can pass through the second welding zone 320 and finally be discharged from the lowest third welding zone 330. That is to say, the gas generated during the welding process is discharged from top to bottom in a stepped manner, which reduces the porosity of the entire welding layer 300, reduces the possibility of incomplete welding, and results in better welding quality and higher connection strength between graphite 100 and metal 200.

[0081] Please see Figure 3In one embodiment, if the solder thickness h1 of the first welding area 310 is greater than the solder thickness h3 of the third welding area 330, then the height of the upper end face of the first welding area 310 is lower than the height of the upper end face of the third welding area 330, and the height of the lower end face of the first welding area 310 is lower than the height of the lower end face of the third welding area 330. With this arrangement, during the welding process of graphite 100 and metal 200, when the solder block 400 melts in the groove 210 and protrusion 110, it can flow from the area where the second welding area 320 is located to the areas of the first welding area 310 and the third welding area 330, respectively. Furthermore, during this flow, since the solder thickness of the first welding area 310 is greater than the solder thickness of the third welding area 330, and simultaneously along... Figure 3 In the yy' direction, the entire first welding zone 310 is located below the third welding zone 330, which makes the welding time of the first welding zone 310 longer than that of the third welding zone 330. At the same time, during the welding process, the gas generated in the third welding zone 330 can pass through the second welding zone 320 and finally be discharged from the lowest point of the first welding zone 310. That is to say, the gas generated during the welding process is discharged from top to bottom in a stepped manner, which reduces the porosity of the entire welding layer 300, reduces the possibility of incomplete welding, and results in better welding quality and higher connection strength between graphite 100 and metal 200.

[0082] Please see Figure 3 In one embodiment, a first sidewall channel 220 is formed on the sidewall of the groove 210 and the protrusion 110, which is used to connect the first welding area 310 and the second welding area 320. A second sidewall channel 230 is also formed on the sidewall of the groove 210 and the protrusion 110, which is used to connect the second welding area 320 and the third welding area 330. The solder thickness L1 in the first sidewall channel 220 is less than or equal to the solder thickness L2 in the second sidewall channel 230. With this arrangement, when the graphite 100 and the metal 200 are positioned before welding, they can be positioned more accurately through the narrower first sidewall channel 220 on the axial side near the X-ray tube anode target disk.

[0083] In one embodiment, the solder thickness L1 in the first sidewall channel 220 satisfies the condition: 0.1mm ≤ L1 ≤ 0.2mm; the solder thickness L2 in the second sidewall channel 230 satisfies the condition: 0.3mm ≤ L2 ≤ 0.4mm. By setting the solder thickness L1 in the first sidewall channel 220 and the solder thickness L2 in the second sidewall channel 230 to the above-mentioned ranges, the graphite 100 and the metal 200 can be positioned more accurately through the narrower first sidewall channel 220 on the axial side near the X-ray tube anode target disk when they are positioned before welding.

[0084] In one embodiment, the solder thickness LI in the sidewall first channel 220 is 0.1 mm. In another embodiment, the solder thickness LI in the sidewall first channel 220 is 0.2 mm. In yet another embodiment, the solder thickness LI in the sidewall first channel 220 is 0.15 mm.

[0085] In one embodiment, the solder thickness L2 in the sidewall second channel 230 is 0.3 mm. In another embodiment, the solder thickness L2 in the sidewall second channel 230 is 0.4 mm. In yet another embodiment, the solder thickness L2 in the sidewall second channel 230 is 0.35 mm.

[0086] In another embodiment, the solder thickness LI in the sidewall first channel 220 satisfies the condition: 0.09 mm < LI < 0.19 mm; and the solder thickness L2 in the sidewall second channel 230 satisfies the condition: 0.29 mm < L2 < 0.39 mm.

[0087] In yet another embodiment, the solder thickness LI in the sidewall first channel 220 satisfies the condition: 0.11 mm < LI < 0.21 mm; and the solder thickness L2 in the sidewall second channel 230 satisfies the condition: 0.31 mm < L2 < 0.41 mm.

[0088] In yet another embodiment, the solder thickness LI in the sidewall first channel 220 satisfies the condition: 0.09 mm < LI < 0.21 mm; and the solder thickness L2 in the sidewall second channel 230 satisfies the condition: 0.29 mm < L2 < 0.41 mm.

[0089] It is noted that the solder thickness LI in the sidewall first channel 220 and the solder thickness L2 in the sidewall second channel 230 are calculated by the dimensional tolerance of the metal 200 and the graphite 100.

[0090] The application also provides a welding structure of an X-ray tube anode target disc, which comprises graphite 100, metal 200 and a solder block 400 placed between the graphite 100 and the metal 200, the graphite 100 and the metal 200 are annular; one surface of the graphite 100 and the metal 200 opposite to each other is configured with a protrusion 110, and the other surface is configured with a groove 210 matched with the protrusion 110; the solder block 400 is placed in the groove 210, and the protrusion 110 is matched with the groove 210; when the protrusion 110 and the groove 210 are matched, a first matching area 510, a second matching area 520 and a third matching area 530 are formed along the radial direction of the graphite 100 from the axis outward, the first matching area 510, the second matching area 520 and the third matching area 530 are arranged in a stepped manner, specifically, the axis of the graphite 100 is the same as the axis of the X-ray tube anode target disc, both are the straight line where p is located, and the axis center is a point on the axis p; the radial direction of the graphite 100 is the xx' direction in Figure 1 ; wherein the height of the first matching area 510 and the third matching area 530 along the axial direction of the graphite 100 is not equal, specifically, the height of the axial direction of the graphite 100 is the yy' direction in Figure 1 ; and the height of the second matching area 520 along the axial direction of the graphite 100 is equal to the height of the first matching area 510 and the third matching area 530 along the axial direction of the graphite 100. Figure 1 Figure 3

[0091] When the X-ray tube anode target disc is prepared by the welding structure of the X-ray tube anode target disc, the graphite 100 and the metal 200 can be welded, and the solder block 400 can flow from the area where the second matching area 520 is located to the areas where the first matching area 510 and the third matching area 530 are located when the solder block 400 is melted in the groove 210 and the protrusion 110. And during the flowing process, because the heights of the two matching areas are not equal, the time required for welding on the two sides is also not equal, so that the gas generated in the welding process can be discharged through the side with a larger height of the matching area which has not been welded after the side with a smaller height of the matching area is welded. As can be seen, the welding structure of the X-ray tube anode target disc is to set the heights of the first matching area 510 and the third matching area 530 to be different, so that the gas generated in the welding process can be discharged through the side with a larger height of the matching area which has not been welded, the flowing direction of the solder after melting is effectively controlled, the porosity of the whole welding layer 300 is low, the possibility of false welding is reduced, the welding quality is good, the connection strength between the graphite 100 and the metal 200 is high, and the connection stability is also good, which can effectively meet the working condition requirements of the X-ray tube anode target disc under high temperature and high rotation frequency.

[0092] Please refer to Figure 1 and Figure 2 ​​In one of the embodiments, the graphite 100 has a first welding surface 111, a second welding surface 112 and a third welding surface 113 arranged in a stepped manner from the center of the radial direction to the outside of the radial direction of the surface of the graphite 100 facing the metal 200. The metal 200 has a fourth welding surface 211, a fifth welding surface 212 and a sixth welding surface 213 arranged in a stepped manner from the center of the radial direction to the outside of the radial direction of the surface of the metal 200 facing the graphite 100. The first welding surface 111 is opposite to the fourth welding surface 211, the second welding surface 112 is opposite to the fifth welding surface 212, and the third welding surface 113 is opposite to the sixth welding surface 213. The first welding surface 111 and the fourth welding surface 211 form a first matching area 510, the second welding surface 112 and the fifth welding surface 212 form a second matching area 520, and the third welding surface 113 and the sixth welding surface 213 form a third matching area 530.

[0093] Referring to Figure 1 and Figure 2 In one of the embodiments, the graphite 100 has a protrusion 110 on the surface facing the metal 200, and the metal 200 has a groove 210 on the surface facing the graphite 100. In another embodiment, the graphite 100 has a groove 210 on the surface facing the metal 200, and the metal 200 has a protrusion 110 on the surface facing the graphite 100.

[0094] It should be noted that the groove 210 and the protrusion 110 on the metal 200 and the graphite 100 can be a complete annular groove 210 and a complete annular protrusion 110, or can be a partial annular groove 210 and a partial annular protrusion 110, which is not limited in particular.

[0095] In one of the embodiments, the second matching area 520 has a groove structure on the upper end surface, i.e., the fifth welding surface 212. By providing the groove structure on the surface of the metal 200 in the second matching area 520, the bonding area of the solder of the second welding area 320 and the metal 200 is increased, and thus the connection strength between the solder layer 300 and the metal 200 is higher.

[0096] Referring to Figure 1 and Figure 2 In another embodiment, the second matching area 520 has a groove structure on the lower end surface, i.e., the second welding surface 112. By providing the groove structure on the surface of the graphite 100 in the second matching area 520, the bonding area of the solder of the second welding area 320 and the graphite 100 is increased, and thus the connection strength between the solder layer 300 and the graphite 100 is higher.

[0097] In one of the embodiments, the upper end surface and the lower end surface of the second matching area 520, i.e. the fifth welding surface 212 and the second welding surface 112, are provided with groove structures. By providing the groove structures on the surfaces of the graphite 100 and the metal 200 in the second matching area 520, the bonding area between the solder of the second welding area 320 and the graphite 100 and the metal 200 is increased, and thus the connection strength between the solder layer 300 and the graphite 100 and the metal 200 is higher.

[0098] It should be noted that the groove structures can be triangular, rectangular or trapezoidal, and no special limitation is made to the shape of the groove structures.

[0099] In one of the embodiments, if the height d1 of the first matching area 510 is less than the height d2 of the third matching area 530, the thickness h of the solder block 400 satisfies the condition: d1 < h ≤ d2 or d1 ≤ h < d2. If the height d1 of the first matching area 510 is greater than the height d2 of the third matching area 530, the thickness h of the solder block 400 satisfies the condition: d2 < h ≤ d1 or d2 ≤ h < d1. By such a setting, after the solder is melted during the welding process, the metal 200 and the graphite 100 of the matching area with a lower height can be contacted first, and the metal 200 and the graphite 100 of the matching area with a higher height can be contacted later, so as to facilitate the discharge of gas during the flow process of the melted solder block 400.

[0100] It should be noted that the height d1 of the first matching area 510 is the distance between the first welding surface 111 and the fourth welding surface 211. The height d2 of the third matching area 530 is the distance between the third welding surface 113 and the sixth welding surface 213.

[0101] In one of the embodiments, if the height d1 of the first matching area 510 is less than the height d2 of the third matching area 530, the height d1 of the first matching area 510 satisfies the condition: 0.1 mm ≤ d1 ≤ 0.15 mm, and the height d2 of the third matching area 530 satisfies the condition: 0.2 mm ≤ d2 ≤ 0.3 mm. By setting the height d1 of the first matching area 510 and the height d2 of the third matching area 530 within the above ranges, under the condition that the height d1 of the first matching area 510 and the height d2 of the third matching area 530 are not equal, the thickness of the solder layer 300 at the first matching area 510 and the third matching area 530 is maintained within a relatively reasonable range after the welding is completed, and thus the connection strength between the graphite 100 and the metal 200 is higher.

[0102] Specifically, in one embodiment, the height d1 of the first matching region 510 is 0.1 mm. In another embodiment, the height d1 of the first matching region 510 is 0.15 mm. In still another embodiment, the height d1 of the first matching region 510 is 0.13 mm.

[0103] In one embodiment, the height d2 of the third matching region 530 is 0.2 mm. In another embodiment, the height d2 of the third matching region 530 is 0.3 mm. In still another embodiment, the height d2 of the third matching region 530 is 0.25 mm.

[0104] In another embodiment, the height d1 of the first matching region 510 satisfies the condition: 0.09 mm≤h1≤0.14 mm. The height d2 of the third matching region 530 satisfies the condition: 0.19 mm≤h3≤0.29 mm.

[0105] In still another embodiment, the height d1 of the first matching region 510 satisfies the condition: 0.11 mm≤h1≤0.16 mm. The height d2 of the third matching region 530 satisfies the condition: 0.21 mm≤h3≤0.31 mm.

[0106] In still another embodiment, the height d1 of the first matching region 510 satisfies the condition: 0.09 mm≤h1≤0.17 mm. The height d2 of the third matching region 530 satisfies the condition: 0.19 mm≤h3≤0.31 mm.

[0107] In another embodiment, if the height d1 of the first matching region 510 is greater than the height d2 of the third matching region 530, the height d1 of the first matching region 510 satisfies the condition: 0.2 mm≤d1≤0.3 mm; and the height d2 of the third matching region 530 satisfies the condition: 0.1 mm≤d2≤0.15 mm. By setting the height d1 of the first matching region 510 and the height d2 of the third matching region 530 within the above ranges, the thickness of the welding layer 300 at the first matching region 510 and the third matching region 530 is kept within a reasonable range after the welding is completed, and the connection strength between the graphite 100 and the metal 200 is high, under the condition that the height d1 of the first matching region 510 is not equal to the height d2 of the third matching region 530.

[0108] Specifically, in one embodiment, the height d1 of the first matching region 510 is 0.2 mm. In another embodiment, the height d1 of the first matching region 510 is 0.3 mm. In still another embodiment, the height d1 of the first matching region 510 is 0.25 mm.

[0109] In one embodiment, the height d2 of the third mating region 530 is 0.1 mm. In another embodiment, the height d2 of the third mating region 530 is 0.15 mm. In yet another embodiment, the height d2 of the third mating region 530 is 0.13 mm.

[0110] In another embodiment, the height d1 of the first mating region 510 satisfies the condition: 0.19mm ≤ h1 ≤ 0.29mm. The height d2 of the third mating region 530 satisfies the condition: 0.09mm ≤ h3 ≤ 0.14mm.

[0111] In another embodiment, the height d1 of the first mating region 510 satisfies the condition: 0.21mm ≤ h1 ≤ 0.31mm. The height d2 of the third mating region 530 satisfies the condition: 0.11mm ≤ h3 ≤ 0.26mm.

[0112] In another embodiment, the height d1 of the first mating region 510 satisfies the condition: 0.19mm ≤ h1 ≤ 0.31mm. The height d2 of the third mating region 530 satisfies the condition: 0.09mm ≤ h3 ≤ 0.16mm.

[0113] In one embodiment, if the height d1 of the first mating region 510 is less than the height d2 of the third mating region 530, then the height of the upper end face of the first mating region 510 is higher than the height of the upper end face of the third mating region 530, and the height of the lower end face of the first mating region 510 is higher than the height of the lower end face of the third mating region 530. This arrangement allows the solder block 400 to flow from the area of ​​the second mating region 520 to the areas of the first mating region 510 and the third mating region 530 respectively when the solder block 400 melts in the groove 210 and the bump 110 during the welding process of the graphite 100 and the metal 200. Furthermore, during this flow, since the height of the first mating region 510 is less than the height of the third mating region 530, and simultaneously along... Figure 3 In the yy' direction, the entire first mating zone 510 is located above the third mating zone 530, thus making the soldering time in the first mating zone 510 shorter than that in the third mating zone 530. Simultaneously, during the welding process, the gas generated in the first mating zone 510 can pass through the second welding zone 320 and finally exit from the lowest point of the third mating zone 530. In other words, the gas generated during welding exits in a stepped, top-to-bottom manner, thereby reducing the porosity of the entire welding layer 300, reducing the possibility of incomplete welds, resulting in better welding quality and higher connection strength between the graphite 100 and the metal 200.

[0114] In another embodiment, if the height d1 of the first mating region 510 is greater than the height d2 of the third mating region 530, then the height of the upper end face of the first mating region 510 is lower than the height of the upper end face of the third mating region 530, and the height of the lower end face of the first mating region 510 is lower than the height of the lower end face of the third mating region 530. With this arrangement, during the welding process of graphite 100 and metal 200, when the solder block 400 melts in the groove 210 and the bump 110, it can flow from the area where the second mating region 520 is located to the areas of the first mating region 510 and the third mating region 530, respectively. Furthermore, during this flow, since the solder thickness of the first mating region 510 is greater than the solder thickness of the third mating region 530, and simultaneously along... Figure 3 In the yy' direction, the height of the entire first mating zone 510 is less than the height of the third mating zone 530, which results in the solder in the first mating zone 510 taking longer to complete the soldering process than the solder in the third mating zone 530. Simultaneously, during the welding process, the gas generated in the third mating zone 530 can pass through the second mating zone 520 and finally exit from the lowest point of the first mating zone 510. In other words, the gas generated during the welding process exits in a stepped manner from top to bottom, thus reducing the porosity of the entire weld layer 300, reducing the possibility of incomplete soldering, resulting in better weld quality and higher connection strength between the graphite 100 and the metal 200.

[0115] Please see Figure 1 and Figure 2 A first sidewall channel 220 is formed between the sidewall of the groove 210 and the protrusion 110, and the first sidewall channel 220 is used to connect the first mating area 510 and the second mating area 520. A second sidewall channel 230 is also formed between the sidewall of the groove 210 and the protrusion 110, and the second sidewall channel 230 is used to connect the second mating area 520 and the third mating area 530. The width d3 of the first sidewall channel 220 is less than or equal to the width d4 of the second sidewall channel 230. By setting the widths d3 and d4 of the first sidewall channel 220 and the second sidewall channel 230 within the above-mentioned range, the positioning of the welded structure before welding can be achieved through the narrower first sidewall channel 220 on the axial side near the X-ray tube anode target disk, and the positioning is relatively accurate.

[0116] Specifically, in one embodiment, the width d3 of the first channel 220 in the sidewall is 0.1 mm. In another embodiment, the width d3 of the first channel 220 in the sidewall is 0.2 mm. In yet another embodiment, the width d3 of the first channel 220 in the sidewall is 0.15 mm.

[0117] In one embodiment, the width d4 of the second sidewall channel 230 is 0.3 mm. In another embodiment, the width d4 of the second sidewall channel 230 is 0.4 mm. In yet another embodiment, the width d4 of the second sidewall channel 230 is 0.35 mm.

[0118] In another embodiment, the width d3 of the first sidewall channel 220 satisfies the condition: 0.09mm≤L1≤0.19mm; the width d4 of the second sidewall channel 230 satisfies the condition: 0.29mm≤L2≤0.39mm.

[0119] In another embodiment, the width d3 of the first channel 220 of the sidewall satisfies the condition: 0.11mm≤L1≤0.21mm; the width d4 of the second channel 230 of the sidewall satisfies the condition: 0.31mm≤L2≤0.41mm.

[0120] In another embodiment, the width d3 of the first sidewall channel 220 satisfies the condition: 0.09mm≤L1≤0.21mm; the width d4 of the second sidewall channel 230 satisfies the condition: 0.29mm≤L2≤0.41mm.

[0121] This application also provides a method for preparing an X-ray tube anode target disk, comprising: constructing a protrusion 110 structure on one of the two opposing surfaces of graphite 100 and metal 200, and constructing a groove 210 structure that mates with the protrusion 110 on the other surface; when the protrusion 110 and the groove 210 mate, a first mating region 510, a second mating region 520, and a third mating region 530 are formed radially outward from the axis of the graphite 100, the first mating region 510, the second mating region 520, and the third mating region 530 being arranged in a stepped manner; specifically, the axis of the graphite 100 is the same as the axis of the X-ray tube anode target disk. Figure 1 The line containing p in the graph has its axis centered at a point on the axis p; the radial direction of graphite 100 is... Figure 1 In the xx' direction. A pre-configured solder block 400 is placed in the second mating region 520. The solder block 400 is used to weld the metal 200 and graphite 100 to form an X-ray tube anode target disk; wherein, the first mating region 510 and the third mating region 530 have unequal axial heights along the graphite 100, specifically, the axial height of the graphite 100 is... Figure 1 and Figure 3 The yy' direction in the middle.

[0122] When the X-ray tube anode target disc is prepared by the preparation method, the graphite 100 and the metal 200 can be connected to each other through the solder block 400 in the groove 210 and the protrusion 110. The solder block 400 can flow from the area where the second matching area 520 is located to the areas where the first matching area 510 and the third matching area 530 are located when the solder block 400 is melted in the welding process. During the flowing process, the time required for welding on both sides is inconsistent due to the inconsistent height of the matching areas, so that the gas generated in the welding process can be discharged through the side with a larger height of the matching area after the side with a smaller height of the matching area is welded. Therefore, the preparation method sets the height of the first matching area 510 and the third matching area 530 to be different, so that the gas generated in the welding process can be discharged through the side with a larger height of the matching area that has not been welded, effectively controlling the flowing direction of the melted solder, thereby reducing the possibility of false welding, improving the welding quality, and improving the connection strength and stability between the graphite 100 and the metal 200, which can effectively meet the working condition requirements of the X-ray tube anode target disc under high temperature and high rotation frequency.

[0123] In one embodiment, the preparation method of the X-ray tube anode target disc further includes: calculating the volume V of the solder block 400 according to the volumes of the first matching area 510, the second matching area 520 and the third matching area 530 formed by the metal 200 and the graphite 100. The volume of the solder block 400 is calculated according to the volumes of the first matching area 510, the second matching area 520 and the third matching area 530, and the volume of the solder required to fill the matching areas after the solder block 400 is melted is inversely deduced, which is simple and convenient.

[0124] Specifically, V1 is the volume of the first groove structure 120 formed on the graphite 100; V2 is the volume of the first matching area 510; V3 is the volume of the second matching area 520; V4 is the volume of the third matching area 530; and V is the volume of the solder block 400. The volume V of the solder block 400 satisfies the condition: 1.05(V1+V2+V3+V4)≤V≤1.3(V1+V2+V3+V4).

[0125] Through the calculation method, the volume of the solder block 400 can be enlarged, so that the solder block 400 can be fully filled into the first matching area 510, the second matching area 520 and the third matching area 530 during the welding and melting process, and the possibility of false welding can be reduced.

[0126] In one embodiment, the volume V of the solder block 400 is equal to 1.05(V1+V2+V3+V4). In another embodiment, the volume V of the solder block is equal to 1.3(V1+V2+V3+V4). In still another embodiment, the volume V of the solder block is equal to 1.1(V1+V2+V3+V4).

[0127] In one embodiment, the method for manufacturing the X-ray tube anode target disk further comprises: calculating the thickness h of the solder block 400 according to the volume V of the solder block 400; calculating the height d1 of the first matching area 510 and the height d2 of the third matching area 530 according to the thickness h of the solder block 400.

[0128] By calculating the thickness h of the solder block 400 according to the volume V of the solder block 400, and calculating the height d1 of the first matching area 510 and the height d2 of the third matching area 530 according to the thickness h of the solder block 400, the height of the first matching area 510, the height of the third matching area 530 and the thickness of the solder block 400 are within a reasonable range, thereby ensuring the welding quality of the final metal 200 and graphite 100.

[0129] In one embodiment, the step of calculating the distance d1 between the first welding surface 111 and the fourth welding surface 211 and the distance d2 between the third welding surface 113 and the sixth welding surface 213 according to the thickness h of the solder block 400 in the method for manufacturing the X-ray tube anode target disk specifically comprises: if the distance d1 between the first welding surface 111 and the fourth welding surface 211 is less than the distance d2 between the third welding surface 113 and the sixth welding surface 213, the thickness h of the solder block 400 satisfies the condition: d1

[0130] By such arrangement, in the radial direction of the graphite 100, the thickness of the solder block 400 is greater than the height of one side matching area but less than the height of the other side matching area, thereby effectively ensuring that, when the solder block 400 melts during welding, the graphite 100 and metal 200 in the matching area with lower height are welded first, and then the graphite 100 and metal 200 in the matching area with higher height are welded, thereby effectively controlling the flow direction of the gas in the molten solder, and thus the porosity of the entire welding layer 300 is low, the possibility of false welding is reduced, the welding quality is good, the connection strength between the graphite 100 and the metal 200 is high, and the connection stability is also good, which can effectively meet the working condition requirements of the X-ray tube anode target disk under high temperature and high rotation frequency.

[0131] In one specific embodiment, the method for preparing the X-ray tube anode target disc further comprises: before the graphite 100 and the metal 200 are welded, the two are ultrasonically cleaned, after the ultrasonic cleaning, the two are placed into a high-temperature vacuum furnace for vacuumizing treatment, and then the brazing operation is performed.

[0132] The technical features of the above embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not exist in contradiction, they shall be considered as the scope of the present disclosure.

[0133] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it shall not be understood as a limitation on the patent scope of the present application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application shall be subject to the appended claims.

Claims

1. An X-ray tube anode target disc, characterized in that The X-ray tube anode target disc comprises graphite (100), metal (200), and a welding layer (300) for welding the graphite (100) and the metal (200); The graphite (100) and the metal (200) are annular and have two surfaces opposite to each other, one of which is configured with a protrusion (110) and the other of which is configured with a groove (210) matched with the protrusion (110); The welding layer (300) comprises a first welding area (310), a second welding area (320) and a third welding area (330) in the radial direction of the X-ray tube anode target disc; the first welding area (310), the second welding area (320) and the third welding area (330) are arranged in a stepped manner, and the second welding area (320) is located between the protrusion (110) and the groove (210); The solder thickness of the first welding area (310) is not equal to the solder thickness of the third welding area (330); if the solder thickness h1 of the first welding area (310) is less than the solder thickness h3 of the third welding area (330), the solder thickness h2 of the second welding area (320) satisfies the condition: h1 < h2 ≤ h3 or h1 ≤ h2 < h3; If the solder thickness h1 of the first welding area (310) is greater than the solder thickness h3 of the third welding area (330), the solder thickness h2 of the second welding area (320) satisfies the condition: h3 < h2 ≤ h1 or h3 ≤ h2 < h1.

2. The X-ray tube anode target disk of claim 1, wherein, If the solder thickness h1 of the first welding area (310) is less than the solder thickness h3 of the third welding area (330), the height of the upper end surface of the first welding area (310) is higher than the height of the upper end surface of the third welding area (330), and the height of the lower end surface of the first welding area (310) is higher than the height of the lower end surface of the third welding area (330); or If the solder thickness h1 of the first welding area (310) is greater than the solder thickness h3 of the third welding area (330), the height of the upper end surface of the first welding area (310) is lower than the height of the upper end surface of the third welding area (330), and the height of the lower end surface of the first welding area (310) is lower than the height of the lower end surface of the third welding area (330).

3. The X-ray tube anode target disk of claim 1, wherein, A side wall first channel (220) is formed between the side wall of the groove (210) and the protrusion (110), and the side wall first channel (220) is used for conducting the first welding area (310) and the second welding area (320); A side wall second channel (230) is also formed between the side wall of the groove (210) and the protrusion (110), and the side wall second channel (230) is used for conducting the second welding area (320) and the third welding area (330); The solder thickness L1 in the side wall first channel (220) is less than or equal to the solder thickness L2 in the side wall second channel (230).

4. A welded structure of an X-ray tube anode target disk, characterized by, The graphite (100), the metal (200) and the solder block (400) are arranged in a ring shape; One of the two surfaces of the graphite (100) and the metal (200) is configured with a protrusion (110), and the other surface is configured with a groove (210) matched with the protrusion (110); The solder block (400) is arranged in the groove (210), and the protrusion (110) is matched with the groove (210); when the protrusion (110) is matched with the groove (210), a first matching area (510), a second matching area (520) and a third matching area (530) are formed along the radial direction of the graphite (100) from the center to the outside, and the first matching area (510), the second matching area (520) and the third matching area (530) are arranged in a stepped manner; The height of the first matching area (510) and the third matching area (530) in the axial direction of the graphite (100) is not equal; if the height d1 of the first matching area (510) is less than the height d2 of the third matching area (530), the thickness h of the solder block (400) satisfies the condition: d1 < h ≤ d2 or d1 ≤ h < d2; If the height d1 of the first matching area (510) is greater than the height d2 of the third matching area (530), the thickness h of the solder block (400) satisfies the condition: d2 < h ≤ d1 or d2 ≤ h < d1.

5. The welded structure of an X-ray tube anode target disk according to claim 4, characterized in that The upper end surface and / or the lower end surface of the second matching area (520) also has a groove structure.

6. The welded structure of an X-ray tube anode target disk according to claim 4, characterized in that If the height d1 of the first matching area (510) is less than the height d2 of the third matching area (530), the height of the upper end surface of the first matching area (510) is higher than the height of the upper end surface of the third matching area (530), and the height of the lower end surface of the first matching area (510) is higher than the height of the lower end surface of the third matching area (530); or If the height d1 of the first matching area (510) is greater than the height d2 of the third matching area (530), the height of the upper end surface of the first matching area (510) is lower than the height of the upper end surface of the third matching area (530), and the height of the lower end surface of the first matching area (510) is lower than the height of the lower end surface of the third matching area (530).

7. The welded structure of an X-ray tube anode target disk according to any one of claims 4 to 6, characterized in that The side wall of the groove (210) and the protrusion (110) form a side wall first channel (220), which is used for conducting the first matching area (510) and the second matching area (520); The side wall of the groove (210) and the protrusion (110) also form a side wall second channel (230), which is used for conducting the second matching area (520) and the third matching area (530); The width d3 of the side wall first channel (220) is less than or equal to the width d4 of the side wall second channel (230).

8. A method of manufacturing an X-ray tube anode target disc, characterized in that It comprises: On two surfaces of graphite (100) and metal (200) opposite to each other, a bump (110) structure is configured on one surface, and a groove (210) structure matched with the bump (110) is configured on the other surface; when the bump (110) and the groove (210) are matched, a first matching area (510), a second matching area (520) and a third matching area (530) are formed along the radial direction of the graphite (100) from the center to the outside, and the first matching area (510), the second matching area (520) and the third matching area (530) are arranged in a stepped manner; A pre-configured solder block (400) is placed in the second matching area (520), and the solder block (400) is used to weld the metal (200) and the graphite (100) to form an X-ray tube anode target disc; Wherein, the first matching area (510) and the third matching area (530) are not equal in axial height along the graphite (100); if the height d1 of the first matching area (510) is less than the height d2 of the third matching area (530), the thickness h of the solder block (400) satisfies the condition: d1 < h ≤ d2 or d1 ≤ h < d2; If the height d1 of the first matching area (510) is greater than the height d2 of the third matching area (530), the thickness h of the solder block (400) satisfies the condition: d2 < h ≤ d1 or d2 ≤ h < d1.

9. The method of claim 8, wherein the target disk is formed by a method comprising: The method further comprises: According to the volume of the first matching area (510), the second matching area (520) and the third matching area (530) formed by the metal (200) and the graphite (100), the volume V of the solder block (400) is calculated.

10. The method of claim 9, wherein the target disk is made of a material selected from the group consisting of molybdenum, tungsten, rhenium, rhodium, iridium, ruthenium, osmium, and alloys thereof. The method further comprises: According to the volume V of the solder block (400), the thickness h of the solder block (400) is calculated; According to the thickness h of the solder block (400), the height d1 of the first matching area (510) and the height d2 of the third matching area (530) are calculated.

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