A method for cleaning semiconductor micron-sized particles

Abstract

The present invention relates to the technical field of semiconductor cleaning, and in particular to a method for cleaning semiconductor micron-sized particles, comprising a conveying device, a plurality of conveying seats being evenly arranged on the conveying device, a spray rack being arranged adjacent to the conveying device, a water pump being arranged on the spray rack, a first driving motor being arranged on the conveying seat, a lifting device being arranged on the first driving motor, a chip being arranged on the lifting device, a spray barrel being arranged on the spray rack directly above a circular semiconductor tray, a plurality of spray heads being evenly arranged around the center of the spray barrel at the top end, a rotating tube being arranged at the center of the spray barrel, one end of the rotating tube being connected to the output end of a second driving motor, a water collecting ring being arranged at the other end, a transmission rod being rotatably connected in the rotating tube, one end of the transmission rod being connected to the output end of a third driving motor, and an atomizing ring being arranged at the other end, a plurality of connecting rods being arranged on the atomizing ring, and the atomizing ring being connected to the transmission rod through the connecting rod.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor cleaning, and in particular to a method for cleaning semiconductor micron-sized particles. Background Art

[0002] Semiconductor chip manufacturing is a highly sophisticated and complex process that includes multiple steps such as chip preparation, photolithography, etching, doping, thin film deposition, etc. In these processes, cleaning is an extremely critical link because it directly affects the quality and performance of the final product.

[0003] The cleaning process mainly includes cleaning and rinsing steps. Rinsing mainly uses chemical solutions (such as SC-1, SC-2) to remove specific types of pollutants. The cleaning before this mainly uses pure water or ion exchange water. This cleaning process is often performed by spray cleaning or immersion cleaning. During spray cleaning, the nozzles are often arranged in an array rather than specifically set for the size of the chip. In this way, the distribution of the cleaning solution on the chip surface may be uneven, and it is easy to cause excessive local pressure, resulting in poor cleaning effects in some areas, while other areas may be over-cleaned, which can easily damage the chip. In addition, even if the spray device is used for cleaning in the form of spray, it cannot meet the cleaning needs due to insufficient pressure in the spray form. Summary of the invention

[0004] In order to solve the problems raised in the background technology, the purpose of the present invention is to provide a method for cleaning semiconductor micron-sized particles, which solves the problem that chips are easily damaged due to the existence of excessive local pressure, and improves the uniform cleaning effect and production quality of the product.

[0005] The present invention comprises a conveying device, on which a plurality of conveying seats are evenly arranged, a spray rack is arranged adjacent to the conveying device, a water pump is arranged on the spray rack, and a liquid infusion pipe is connected to the water pump;

[0006] To achieve the above purpose, the following steps are included:

[0007] S1, the conveying device performs intermittent conveying on the conveying seat, wherein:

[0008] The conveying seat is provided with a first driving motor, the first driving motor is provided with a lifting device, a circular semiconductor tray is placed on the lifting device, and a plurality of semiconductor chips to be cleaned are evenly fixed on the circular semiconductor tray in a circular distribution around the center of the circular semiconductor tray;

[0009] S2, the spray device on the spray rack starts to cooperate with the conveying device for intermittent spraying, wherein the spray device comprises: a spray barrel arranged on the spray rack directly above the circular semiconductor tray, a plurality of spray heads are evenly arranged around the center of the top of the spray barrel, one end of the infusion tube is connected to the water pump, and the other end extends to the top of the spray barrel and is connected to the spray head;

[0010] S3, the lifting device lifts the round semiconductor tray into the water collecting ring, wherein:

[0011] A rotating tube is arranged at the center of the spray barrel, and a buffer assembly is arranged at one end of the rotating tube located in the spray barrel. The cleaning liquid sprayed from the spray head falls onto the circular semiconductor tray in a mist form after passing through the buffer assembly. One end of the rotating tube extends to the outside of the top of the spray barrel and is connected to the output end of the second driving motor arranged on the spray barrel. The buffer assembly includes a water gathering ring and an atomizing ring. The water gathering ring is arranged at the other end of the rotating tube located in the spray barrel to gather the cleaning liquid falling on the circular semiconductor tray.

[0012] S4, the circular semiconductor tray is driven by the first driving motor to rotate at high speed, and the water collecting ring and the atomizing ring are driven by the second driving motor and the third driving motor to rotate at high speed respectively, wherein:

[0013] A transmission rod is rotatably connected inside the rotating tube, one end of the transmission rod extends to the outside of the top of the spray barrel and is connected to the output end of a third drive motor arranged on the spray barrel, the atomizing ring is arranged at the other end of the transmission rod located in the spray barrel, a plurality of connecting rods are arranged on the atomizing ring, the atomizing ring is connected to the transmission rod through the connecting rod, and the connecting rod is used to disperse the cleaning liquid sprayed from the spray head.

[0014] As a further improvement of the technical solution, one end of the rotating tube located in the spray barrel is fixedly connected to a second mounting plate, and the second mounting plate is fixedly connected to the connecting rod.

[0015] As a further improvement of the technical solution, one end of the transmission rod located in the spray barrel is fixedly connected to a first mounting plate, a plurality of support rods are fixedly connected to the water collecting ring, and the first mounting plate is fixedly connected to the support rods.

[0016] As a further improvement of the technical solution, the first mounting plate is disposed below the second mounting plate, and a gap is left between the first mounting plate and the second mounting plate.

[0017] As a further improvement of the present technical solution, a guide groove is provided on the support rod, the water collecting ring is a truncated cone structure with a wider top, a plurality of drainage grooves are evenly provided on the inner wall of the water collecting ring around its center, the support rod is fixedly connected to the drainage groove, and the support rod is flush with the top of the drainage groove, and a notch is provided at the connection between the support rod and the drainage groove.

[0018] As a further improvement of the technical solution, a plurality of baffles are evenly fixed on the inner wall of the atomizing ring, the length of the baffles is adapted to the depth of the drainage groove, and the atomizing ring is arranged above the water collecting ring.

[0019] As a further improvement of the technical solution, the rotation direction of the atomizing ring is opposite to the rotation direction of the water collecting ring.

[0020] As a further improvement of the present technical solution, the rotation direction of the first driving motor is opposite to the rotation direction of the water collecting ring.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. In the cleaning method of semiconductor micron-sized particles, the spray heads on the spray barrel are evenly arranged in a circular shape, which can further improve the uniformity of the spray, and is conducive to ensuring that the chip is evenly and comprehensively sprayed during the cleaning process, avoiding damage to the chip due to excessive local pressure, thereby greatly improving the uniform cleaning of the chip surface and improving the cleaning quality.

[0023] 2. In the cleaning method of semiconductor micron-sized particles, a buffer component (atomizing ring and a water collecting ring) is introduced, wherein the atomizing ring is connected to the transmission rod through a connecting rod, which can break up the cleaning liquid sprayed from the shower head and make it evenly sprayed on the chip in an atomized state. Then, the chip rotates at high speed driven by the rotation of the circular semiconductor tray, and relies on centrifugal force to drive the cleaning liquid to flow radially at high speed on the chip surface to achieve the cleaning purpose. The water collecting ring is used to gather the cleaning liquid falling on the chip, and guide the cleaning liquid to flow to the top and then return to the chip through the drainage groove on its inner wall, which is conducive to reducing the local pressure generated by the cleaning liquid directly sprayed onto the chip, reducing the risk of chip damage, and improving the cleaning efficiency by repeating the cleaning process; secondly, the guide groove on the support rod can help break up the cleaning liquid sprayed from the shower head and guide it to flow to the drainage groove of the water collecting ring. The drainage groove on the inner wall of the water collecting ring can guide the cleaning liquid to flow to the top and then return to the chip, which is conducive to ensuring the uniform distribution of the cleaning liquid on the chip, avoiding local accumulation leading to incomplete cleaning, and at the same time, through the design of the drainage groove, the kinetic energy of the cleaning liquid can be fully utilized to improve the cleaning effect.

[0024] 3. In the cleaning method of semiconductor micron-sized particles, through the rotation coordination of the first driving motor, the water collecting ring and the atomizing ring, after the chip is lifted to the specified position in the water collecting ring by the lifting device, the first driving motor drives the chip to rotate at high speed, and the water collecting ring and the atomizing ring are also driven to rotate at high speed by the second driving motor and the third driving motor respectively, and the rotation directions are opposite, which is conducive to the cleaning liquid on the chip to be thrown to the water collecting ring with higher kinetic energy, further increasing the atomization degree of the cleaning liquid, and at the same time, the reverse rotation can ensure that the cleaning liquid is quickly broken up by the baffle and returns to the chip, improving the cleaning efficiency; secondly, the atomizing ring and the water collecting ring have opposite rotation directions, which can avoid the kinetic energy loss caused by the speed difference formed by the synchronous rotation, and the reverse rotation can ensure that the cleaning liquid is quickly broken up by the baffle and returns to the chip after being thrown out of the chip, which is conducive to reducing the loss of cleaning liquid and improving the cleaning efficiency. In summary, the design achieves efficient and uniform cleaning of the chip surface by optimizing the spraying, distribution and recovery process of the cleaning liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0026] Figure 2 It is a structural schematic diagram of the transmission base of the present invention;

[0027] Figure 3 It is a structural schematic diagram of the spray rack of the present invention;

[0028] Figure 4 It is a structural cross-sectional view of the spray barrel of the present invention;

[0029] Figure 5 It is a structural schematic diagram of the buffer assembly of the present invention;

[0030] Figure 6 for Figure 5 A magnified view of the structure at center A;

[0031] Figure 7 for Figure 5 A magnified view of the structure at B in the middle;

[0032] Figure 8 It is a structural schematic diagram of the atomizing ring of the present invention;

[0033] Fig. 9 It is a schematic diagram of the structure of the water-collecting ring of the present invention;

[0034] Fig.10 A top view of the structure of the water collecting ring of the present invention;

[0035] Fig.11 It is a front view of the cross-sectional structure of the water collecting ring of the present invention;

[0036] Fig.12 for Fig.11 Enlarged view of the structure at C in the middle.

[0037] The meaning of each number in the figure is:

[0038] 1. Conveying device; 2. Spray rack; 3. Water pump; 4. Spray barrel; 5. Conveying seat; 6. First drive motor; 7. Lifting device; 8. Chip; 9. Infusion tube; 10. Spray head; 11. Rotating tube; 12. Second drive motor; 13. Atomizing ring; 14. Transmission rod; 15. Third drive motor; 16. Water collecting ring; 17. Support rod; 18. Drainage groove; 19. Guide groove; 20. First mounting plate; 21. Second mounting plate; 22. Connecting rod; 23. Baffle. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] When the existing semiconductor cleaning device uses a spraying method for cleaning, the chip is easily damaged due to the phenomenon of excessive local pressure.

[0041] To this end, the present invention provides a method for cleaning semiconductor micron-sized particles. Figure 1 and Figure 3 As shown, it comprises a conveying device 1, on which a plurality of conveying seats 5 are evenly arranged, a spray rack 2 is arranged adjacent to the conveying device 1, on which a water pump 3 is arranged, and the water pump 3 is connected to a liquid infusion tube 9. Example

[0042] The specific steps are as follows: Figure 2 and Figure 4 As shown,

[0043] S1. A first driving motor 6 is arranged on the conveying seat 5, a lifting device 7 is arranged on the first driving motor 6, a circular semiconductor tray 8 is arranged on the lifting device 7, a plurality of semiconductor chips to be cleaned are evenly fixed on the circular semiconductor tray 8 in a circular distribution around the center of the circle (hereinafter, only the circular semiconductor tray 8 will be used to replace the description of the plurality of chips distributed thereon, because the cleaning liquid falls on the circular semiconductor tray 8, that is, falls on the plurality of chips), the conveying seat 5 is intermittently conveyed by the conveying device 1, the conveying device 1 is intermittently conveyed, and the time interval of the conveying is adapted to the duration of the cleaning;

[0044] S2. A spray barrel 4 is arranged on the spray rack 2 just above the circular semiconductor tray 8. A plurality of spray heads 10 are evenly arranged around the center of the top of the spray barrel 4. One end of the infusion tube 9 is connected to the water pump 3, and the other end extends to the top of the spray barrel 4 and is connected to the spray head 10. The spray heads 10 evenly arranged in a circle can further improve the uniformity of the spray.

[0045] S3. A rotating tube 11 is provided at the center of the spray barrel 4. A buffer assembly is provided at one end of the rotating tube 11. The cleaning liquid sprayed from the spray head 10 falls onto the circular semiconductor tray 8 in a mist form after passing through the buffer assembly, thereby preventing the cleaning liquid sprayed from the spray head from directly acting on the circular semiconductor tray 8 and reducing the problem of excessive local pressure. Figure 4 and Figure 6 As shown, one end of the rotating tube 11 extends to the outside of the top of the spray barrel 4 and is connected to the output end of the second driving motor 12 disposed on the spray barrel 4. The other end located in the spray barrel 4 is provided with a water collecting ring 16 for collecting the cleaning liquid falling on the circular semiconductor tray 8.

[0046] S4, a transmission rod 14 is rotatably connected in the rotating tube 11, one end of the transmission rod 14 extends to the outside of the top of the spray barrel 4, and is connected to the output end of the third drive motor 15 arranged on the spray barrel 4, and an atomizing ring 13 is arranged at one end of the transmission rod 14 located in the spray barrel 4, and a plurality of connecting rods 22 are arranged on the atomizing ring 13, and the atomizing ring 13 is connected to the transmission rod 14 through the connecting rod 22, and the connecting rod 22 is used to break up the cleaning liquid sprayed from the spray head 10, and the atomizing ring 13 is arranged above the water collecting ring 16, and the circular semiconductor tray 8 transmitted intermittently is lifted and lowered into the water collecting ring 16 by the lifting device 7, and then the core The sheet rotates at high speed driven by the first driving motor 6, and the water collecting ring 16 and the atomizing ring 13 rotate at high speed driven by the second driving motor 12 and the third driving motor 15 respectively. After the connecting rod 22 breaks up the cleaning liquid sprayed by the spray head 10 and makes it evenly sprayed on the circular semiconductor tray 8 in an atomized state, a certain amount of cleaning liquid condenses on the circular semiconductor tray 8 and flows to the periphery to the water collecting ring 16 under a high-speed rotating state. The centrifugal force of the water collecting ring 16 makes it flow radially to the top of the water collecting ring 16, and then it is broken up by the atomizing ring 13 and returns to the circular semiconductor tray 8 in an atomized state for repeated cleaning, thereby improving the cleaning efficiency.

[0047] Among them, Figure 6As shown, one end of the rotating tube 11 located in the spray barrel 4 is fixedly connected to the second mounting disk 21, and the second mounting disk 21 is fixedly connected to the connecting rod 22, that is, the atomizing ring 13 is connected to the second mounting disk 21 through the connecting rod 22, and the rotating tube 11 drives the atomizing ring 13 to rotate by driving the second mounting disk 21; and one end of the transmission rod 14 located in the spray barrel 4 is fixedly connected to the first mounting disk 20, and a plurality of support rods 17 are fixedly connected to the water collecting ring 16, the first mounting disk 20 is fixedly connected to the support rods 17, that is, the water collecting ring 16 is fixedly connected to the first mounting disk 20 through the support rods 17, and the transmission rod 14 drives the water collecting ring 1 to rotate 6 by driving the first mounting disk 20. It should be noted here that the first mounting disk 20 is arranged below the second mounting disk 21, and a gap is left between the first mounting disk 20 and the second mounting disk 21, so that the first mounting disk 20 and the second mounting disk 21 will not affect each other when they rotate.

[0048] For further information, see Figure 7 , Figure 9-11 As shown, a guide groove 19 is provided on the support rod 17, the water collecting ring 16 is a truncated cone structure, and the top is wider, and a plurality of drainage grooves 18 are evenly provided on the inner wall of the water collecting ring 16 around the center of the circle, the support rod 17 is fixedly connected to the drainage groove 18, and the top of the support rod 17 is flush with the drainage groove 18, and a notch is provided at the connection between the support rod 17 and the drainage groove 18. Here is a force decomposition, such as Fig.12 As shown, when the circular semiconductor tray 8 rotates at a high speed and throws the condensed cleaning liquid on it onto the water collecting ring 16, a part of it directly flies back to the circular semiconductor tray 8 as fine particles, and a part of it passes through the inclined drainage groove 18 and slides to the top of the drainage groove 18 along the drainage groove 18. Because the water collecting ring 16 rotates at a high speed, the cleaning liquid in the drainage groove 18 has a centrifugal force F1 along the axial direction of the water collecting ring 16, which decomposes it into F2 and F3 along the drainage groove 18 and perpendicular to the drainage groove 18 respectively. In this way, it can be clearly concluded that F3 makes the cleaning liquid close to the inner wall of the drainage groove 18, and F2 makes the cleaning liquid flow along the drainage groove 18 to the top of the drainage groove 18; and the support rod 17 is provided with a guide groove 19, so that the cleaning liquid sprayed by the spray head 10, after being dispersed with the assistance of the support rod 17, a part of it accumulates in the guide groove 19, and can directly flow to the drainage groove 18 under the centrifugal force and merge with the cleaning liquid in the drainage groove 18 through the notch.

[0049] Furthermore, Figure 8As shown, a plurality of baffles 23 are evenly fixed on the inner wall of the atomizing ring 13, and the length of the baffles 23 is adapted to the depth of the drainage groove 18, and the atomizing ring 13 is arranged adjacent to the water collecting ring 16. After the cleaning liquid flows to the top of the drainage groove 18, it is rotated and dispersed by the baffle 23 adjacent to the top port of the drainage groove 18 and diffused in the spray barrel 4, and then falls back onto the circular semiconductor tray 8, and part of it will directly fall back onto the circular semiconductor tray 8. The atomizing ring 13 is arranged adjacent to the cleaning liquid at the top of the drainage groove 18 to form a liquid The cleaning liquid after forming the liquid spherical shape is convenient for the baffle 23 to act on it to break it up, including the cleaning liquid on the guide groove 19 mentioned above merging with the drainage groove 18 through the notch, all for the convenience of the baffle 23 to break it up. It is worth mentioning that the atomizing ring 13 is arranged near the water gathering ring 16. Firstly, it can be convenient to break up the cleaning liquid when it forms a liquid spherical shape, and secondly, it can prevent the setting distance from being too high, and the cleaning liquid is directly ejected from the drainage groove 18 in a columnar shape, which is not convenient for breaking up. Example

[0050] It should be added that the rotation direction of the atomizing ring 13 is opposite to that of the water collecting ring 16, and the rotation direction of the first driving motor 6 is opposite to that of the water collecting ring 16. Therefore, when the water collecting ring 16 and the circular semiconductor tray 8 rotate, since the rotation directions are opposite, there will be no speed difference caused by the synchronous rotation, which will cause the kinetic energy loss of the cleaning liquid condensed on the circular semiconductor tray 8 when it is thrown out of the circular semiconductor tray 8 and falls to the water collecting ring 16. Therefore, the reverse rotation causes the cleaning liquid condensed on the circular semiconductor tray 8 to hit the water collecting ring 16 with higher kinetic energy, thereby further increasing the atomization degree of the cleaning liquid, making it diffuse in the spray barrel 4, and then due to the characteristics of the atomization, it falls to the circular semiconductor tray 8 in a more uniform manner and with less local pressure. It is worth mentioning here that although the cleaning liquid is atomized, it falls to the circular semiconductor tray 8. The cleaning liquid on the body tray 8 can be condensed and the centrifugal force of the rotation of the circular semiconductor tray 8 makes it flow away from the center of the circle on the circular semiconductor tray 8 to achieve a cleaning effect. Secondly, the cleaning liquid sprayed by the spray head 10 will be dispersed, and the larger cleaning liquid particles will rush to the circular semiconductor tray 8 in liquid form to clean it, but the kinetic energy is greatly reduced at this time, and it does not have the initial kinetic energy, which can easily cause excessive local pressure; and the atomizing ring 13 and the water collecting ring 16 rotate in opposite directions. In order to pass through the drainage groove 18, the cleaning liquid can be quickly dispersed by the baffle 23 and return to the circular semiconductor tray 8, and the reverse rotation will not cause kinetic energy loss due to the speed difference, and can also play a role in adding kinetic energy, so that the loss of cleaning liquid can be greatly reduced. At the same time, combined with the continuous operation of the spray head 10, the two can cooperate with each other to improve the cleaning efficiency.

[0051] This effectively solves the problem that the chip is easily damaged due to excessive local pressure when the existing semiconductor cleaning device uses a spraying method for cleaning.

[0052] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A method for cleaning semiconductor micron-sized particles, comprising a conveying device (1), wherein a plurality of conveying seats (5) are evenly arranged on the conveying device (1), a spray rack (2) is arranged adjacent to the conveying device (1), a water pump (3) is arranged on the spray rack (2), and a liquid infusion tube (9) is connected to the water pump (3), characterized in that: S1. The conveying device (1) performs intermittent conveying on the conveying seat (5), wherein: The conveying seat (5) is provided with a first driving motor (6), the first driving motor (6) is provided with a lifting device (7), a circular semiconductor tray (8) is placed on the lifting device (7), and a plurality of semiconductor chips to be cleaned are evenly fixed on the circular semiconductor tray (8) in a circular distribution around the center of the circle; S2, the spray device on the spray rack (2) starts to cooperate with the conveying device (1) to spray intermittently, wherein the spray device comprises: a spray barrel (4) arranged on the spray rack (2) directly above the circular semiconductor tray (8), a plurality of spray heads (10) are evenly arranged around the center of the top of the spray barrel (4), one end of the infusion tube (9) is connected to the water pump (3), and the other end extends to the top of the spray barrel (4) and is connected to the spray head (10); S3, the lifting device (7) lifts the circular semiconductor tray (8) into the water collecting ring (16), wherein: A rotating tube (11) is arranged at the center of the spray barrel (4), and a buffer assembly is arranged at one end of the rotating tube (11) located in the spray barrel (4). The cleaning liquid sprayed by the spray head (10) falls onto the circular semiconductor tray (8) in the form of mist after passing through the buffer assembly. One end of the rotating tube (11) extends to the outside of the top of the spray barrel (4) and is connected to the output end of a second drive motor (12) arranged on the spray barrel (4). The buffer assembly comprises a water collecting ring (16) and an atomizing ring (13). The water collecting ring (16) is arranged at the other end of the rotating tube (11) located in the spray barrel (4) and is used to collect the cleaning liquid falling on the circular semiconductor tray (8); S4, the circular semiconductor tray (8) is driven by the first drive motor (6) to rotate at high speed, and the water collecting ring (16) and the atomizing ring (13) are driven by the second drive motor (12) and the third drive motor (15) to rotate at high speed respectively, wherein: A transmission rod (14) is rotatably connected inside the rotating tube (11); one end of the transmission rod (14) extends outside the top end of the spray barrel (4) and is connected to the output end of a third drive motor (15) disposed on the spray barrel (4); the atomizing ring (13) is disposed at the other end of the transmission rod (14) located inside the spray barrel (4); a plurality of connecting rods (22) are disposed on the atomizing ring (13); the atomizing ring (13) is connected to the transmission rod (14) via the connecting rods (22); and the connecting rods (22) are used to disperse the cleaning liquid sprayed from the spray head (10).

2. The method for cleaning semiconductor micron-sized particles according to claim 1, characterized in that: One end of the rotating tube (11) located inside the spray barrel (4) is fixedly connected to a second mounting plate (21), and the second mounting plate (21) is fixedly connected to a connecting rod (22).

3. The method for cleaning semiconductor micron-sized particles according to claim 1, characterized in that: One end of the transmission rod (14) located in the spray barrel (4) is fixedly connected to a first mounting plate (20), a plurality of support rods (17) are fixedly connected to the water collecting ring (16), and the first mounting plate (20) is fixedly connected to the support rods (17).

4. The method for cleaning semiconductor micron-sized particles according to claim 3, characterized in that: The first mounting plate (20) is disposed below the second mounting plate (21), and a gap is left between the first mounting plate (20) and the second mounting plate (21).

5. The method for cleaning semiconductor micron-sized particles according to claim 4, characterized in that: The support rod (17) is provided with a guide groove (19); the water collecting ring (16) is a truncated cone structure with a wider top end; a plurality of drainage grooves (18) are evenly provided on the inner wall of the water collecting ring (16) around the center of the circle; the support rod (17) is fixedly connected to the drainage groove (18); the top ends of the support rod (17) and the drainage groove (18) are flush; and a notch is provided at the connection between the support rod (17) and the drainage groove (18).

6. The method for cleaning semiconductor micron-sized particles according to claim 5, characterized in that: A plurality of baffles (23) are evenly fixedly disposed on the inner wall of the atomizing ring (13); the length of the baffles (23) is adapted to the depth of the drainage groove (18); and the atomizing ring (13) is disposed above the water collecting ring (16).

7. The method for cleaning semiconductor micron-sized particles according to claim 6, characterized in that: The rotation direction of the atomizing ring (13) is opposite to the rotation direction of the water collecting ring (16).

8. The method for cleaning semiconductor micron-sized particles according to claim 1, characterized in that: The rotation direction of the first drive motor (6) is opposite to the rotation direction of the water collecting ring (16).

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