A bonding copper wire and a preparation method thereof

Abstract

The invention relates to the technical field of bonding copper wires, and discloses a bonding copper wire and a preparation method thereof, comprising a post-processing device arranged on a workbench, the post-processing device comprising a coating bin and a cleaning bin connected to the coating bin. The bonding copper wire preparation method first changes the traditional step-by-step processing method into a continuous one, so that the coating material after spraying in the coating bin is sent to the cleaning bin for cleaning operation, with basically no interval in between, and it is difficult to cause pollution to the processing area. In addition, the gas cylinder is connected to a second sponge block arranged in the cleaning bin through a conveying groove, and the gas cylinder is circulated and squeezed so that gas can be intermittently conveyed to the second sponge block, thereby blowing and cleaning the bonding copper wire passing through the second sponge block, thereby blowing off grease residue from the bonding copper wire to improve the cleaning effect.

Description

Technical Field

[0001] The invention relates to the technical field of bonding copper wires, in particular to a bonding copper wire and a preparation method thereof. Background Art

[0002] Compared with gold wire and aluminum wire, bonding copper wire has excellent mechanical properties, electrical properties, thermal properties and low intermetallic compound growth, which greatly improves the chip frequency and reliability and adapts to the development of low-cost, fine-pitch, high-lead component packaging. The transition from aluminum metallization to copper metallization of wafers makes it possible for new packaging designs of high-speed devices to choose short copper wire bonding and copper soldering areas with a spacing of less than 50μm to become a strong competitor to the flip-chip welding process in the packaging market. And through the use of new process improvements, copper wire bonding is more solid and stable than gold wire bonding, especially in large-scale IC packaging processes with high leads, fine pitches, and small soldering areas, becoming the best bonding material to replace gold wire.

[0003] After the bonding copper wire is formed, it needs to be post-processed to improve the glossiness of the bonding copper wire. In the post-processing, a kind of grease is needed to be applied to the surface of the bonding copper wire to make it more glossy. However, a general spraying mechanism uses a nozzle to operate on the bonding copper wire so that the grease droplets can contact the bonding copper wire as much as possible. However, this spraying method consumes a large amount of grease. Even if they are collected back through a collection device, there is still a problem of contamination of the processing area. In addition, this spraying method will cause the grease to form irregular residues on the bonding copper wire. If no secondary treatment is performed, it is easy to cause the grease to not completely volatilize, causing corrosion to the bonding copper wire.

[0004] Therefore, the existing demand is not met, and we propose a bonding copper wire and a preparation method thereof. Summary of the invention

[0005] The present invention provides a bonding copper wire and a preparation method thereof, which has the beneficial effect of combining and strengthening the annealing liquid spraying and cleaning process, and solves the problem of using a nozzle to operate the bonding copper wire mentioned in the above background technology so that the grease droplets can contact the bonding copper wire as much as possible. However, this spraying method consumes a large amount of grease. Even if they are collected back by a collection device, there is still a problem of contaminating the processing area. In addition, this spraying method will also cause the grease to form irregular residues on the bonding copper wire. If no secondary treatment is performed, it is easy to cause the grease to not completely volatilize, causing corrosion to the bonding copper wire.

[0006] The present invention provides the following technical solution: a method for preparing a bonding copper wire, comprising the following steps:

[0007] S1. Place the blank on a stretching machine, and set the stretching feed speed of the stretching machine to 90-210 m / min;

[0008] S2. The stretched semi-finished product is conveyed to a heat treatment machine through a conveyor belt, and hydrogen and inert gas are used to protect and brighten the bonding copper wire during the heat treatment process, wherein the flow rate of hydrogen is 0.75 to 1.36 L / min, and the flow rate of inert gas is 0.8 to 1.37 L / min;

[0009] S3. The finished product after heat treatment is then transported to a post-processing device through a conveyor belt for secondary processing. The post-processing device includes a coating tank and a cleaning tank connected to the coating tank. The finished product is transported to the coating tank for coating with annealing oil, and is cleaned in the cleaning tank to obtain a final bonding copper wire product.

[0010] As an optional solution of the bonding copper wire preparation method of the present invention, it includes a post-processing device mentioned in the above description, the post-processing device includes a coating tank and a cleaning tank connected thereto, characterized in that: an oil tank is provided on the coating tank, the oil tank is communicated with the coating tank, a first sponge block is provided in the coating tank, and the oil tank and the first sponge block are communicated with each other;

[0011] A second sponge block is also arranged in the cleaning chamber, and an air cylinder is arranged on the cleaning chamber, and the air cylinder and the second sponge block are communicated with each other;

[0012] A conveying groove is provided in the cleaning chamber, and the air cylinder is connected to the second sponge block through the conveying groove;

[0013] A sealing sleeve is also provided in the conveying groove, and the gas cylinder is communicated with the conveying groove through the sealing sleeve.

[0014] As an optional solution of the bonding copper wire preparation method of the present invention, wherein: a protective mechanism is arranged in the sealing sleeve, and the protective mechanism is used to prevent liquid from flowing back;

[0015] The protection mechanism comprises a fixed block fixed in the sealing sleeve, the fixed block is provided with a hollow cylinder, and the fixed block is connected with the sealing sleeve through the hollow cylinder;

[0016] The hollow cylinder is provided with a flow groove, and a sealing ring block is slidably arranged on the hollow cylinder.

[0017] As an optional solution of the method for preparing the bonding copper wire of the present invention, a sealing plate is further provided on the hollow cylinder, and the sealing plate is used to seal the gap between the hollow cylinder and the sealing ring block.

[0018] As an optional solution of the bonding copper wire preparation method of the present invention, wherein: a stabilizing mechanism is also provided in the sealing sleeve, and the sealing ring block slides on the hollow cylinder through the stabilizing mechanism;

[0019] The stabilizing mechanism comprises a sliding groove provided in the sealing sleeve, a sliding block adapted to the sliding groove is provided on the sealing ring block, and the sliding groove is slidably provided in the sliding block;

[0020] The sliding block is also provided with a return spring, and the sliding block is elastically connected to the sealing sleeve via the return spring.

[0021] As an optional solution of the bonding copper wire preparation method of the present invention, wherein: a pressurizing mechanism is also arranged in the sealing sleeve, and the pressurizing mechanism is used to increase the air pressure entering the sealing sleeve;

[0022] The pressurizing mechanism comprises a positioning plate arranged in the sealing sleeve, and a plurality of through holes are opened on the positioning plate, and the through holes are used for gas flow.

[0023] As an optional solution of the bonding copper wire preparation method of the present invention, wherein: an adjustment mechanism is also provided in the sealing sleeve, and the adjustment mechanism cooperates with the boosting mechanism;

[0024] The adjusting mechanism comprises a sliding ring block slidably arranged in the sealing sleeve, the sliding ring block is provided with a sealing protrusion, and the sealing protrusion and the through hole are adapted to each other;

[0025] There are multiple sealing protrusions, and the lengths of the multiple sealing protrusions are different;

[0026] The size of the sealing protrusion increases gradually from the bottom to the top.

[0027] As an optional solution of the bonding copper wire preparation method described in the present invention, a guide rod is also arranged in the sliding groove, the sliding block is slidably arranged on the guide rod, and the reset spring is sleeved on the outer side of the guide rod.

[0028] As an optional solution of the bonding copper wire preparation method of the present invention, wherein: the cleaning chamber is also provided with a mounting plate, the top of the gas cylinder is provided with a connecting plate, and the connecting plate is slidably connected to the mounting plate;

[0029] The driving mechanism comprises a fixing seat arranged on the mounting plate, a slider is slidably arranged on the mounting plate, an electric push rod is arranged on the fixing seat, and the slider is arranged on the electric push rod;

[0030] The connecting plate is fixedly connected to the sliding block;

[0031] A limiting mechanism is also provided on the installation plate, and the limiting mechanism is used to make the sliding block slide more stably;

[0032] The limiting mechanism comprises a limiting rod arranged on a base arranged on the mounting plate, a guide block is arranged on the slider, and the slider is slidably connected to the limiting rod through the guide block.

[0033] As an optional solution of the method for preparing the bonding copper wire of the present invention, an auxiliary telescopic rod is further provided on the abutment plate, and the abutment plate is connected to the fixing plate via the auxiliary telescopic rod.

[0034] The present invention also includes a bonding copper wire, which is prepared by the bonding copper wire preparation method.

[0035] The present invention has the following beneficial effects:

[0036] 1. The method for preparing the bonding copper wire first changes the traditional step-by-step processing method into a continuous one, so that after being sprayed in the paint chamber, the wire is sent to the cleaning chamber for cleaning, with basically no interval in between, making it difficult to pollute the processing area. In addition, the gas cylinder is connected to the second sponge block arranged in the cleaning chamber through a conveying groove, and the gas cylinder is circulated and squeezed to intermittently convey gas to the second sponge block, thereby blowing and cleaning the bonding copper wire passing through the second sponge block, thereby blowing off grease residue from the bonding copper wire to improve the cleaning effect.

[0037] 2. In the method for preparing the bonding copper wire, when the gas cylinder delivers gas to the second sponge block, the air pressure will act on the sealing ring block, causing it to slide toward the fixed block, thereby opening the flow groove on the hollow cylinder and allowing the gas delivered by the gas cylinder to flow into the hollow cylinder through the flow groove and finally be delivered to the second sponge block. When the gas cylinder is evacuating air, the gas cylinder no longer provides air pressure that can suppress the sealing ring block, so the sealing ring block will reset and slide, re-cutting the connection between the flow groove and the outside world. At this time, the grease in the second sponge block is difficult to flow out, thereby reducing the possibility of grease flowing back into the gas cylinder, thereby providing protection for it.

[0038] 3. The method for preparing the bonding copper wire achieves the purpose of opening the through hole in stages by setting sealing protrusions of different lengths, thereby expanding the enhanceable range of the boosting mechanism, and the size of a single sealing protrusion gradually increases from bottom to top, thereby expanding the adjustment range formed by a single sealing protrusion, thereby increasing the size of the adjustable range formed by the cooperation of the adjustment mechanism and the boosting mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0040] Figure 2 It is a schematic diagram of the internal structure of the overall structure of the present invention.

[0041] Figure 3 It is a schematic diagram of the external structure of the sealing sleeve in the present invention.

[0042] Figure 4 It is a schematic diagram of the internal structure of the sealing sleeve in the present invention.

[0043] Figure 5 It is a schematic diagram of the local structure of the sealing sleeve in the present invention.

[0044] Figure 6 It is a schematic front view of the installation plate and the connecting plate in the present invention.

[0045] Figure 7 It is a rear view schematic diagram of the mounting plate and the connecting plate of the present invention.

[0046] Figure 8 For the present invention Figure 5 A partial enlarged view of point A in the middle.

[0047] Fig. 9 For the present invention Figure 4 A partial enlarged view of point B in the middle.

[0048] In the figure: 1. paint bin; 2. cleaning bin; 31. first sponge block; 32. second sponge block; 4. conveying trough; 51. air cylinder; 6. sealing sleeve; 71. fixing block; 72. hollow cylinder; 73. circulation slot; 74. sealing ring block; 8. sealing plate; 91. sliding slot; 92. sliding block; 10. guide rod; 11. reset spring; 12. mounting plate; 13. connecting plate; 141. fixing seat; 142. sliding block; 143. electric push rod; 151. base; 152. guide block; 153. limiting rod; 181. positioning plate; 182. through hole; 191. sliding ring block; 192. sealing protrusion. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] Example 1

[0051] A method for preparing a bonding copper wire comprises the following steps:

[0052] S1. Place the blank on a stretching machine, and set the stretching feed speed of the stretching machine to 90-210 m / min;

[0053] S2. The stretched semi-finished product is conveyed to a heat treatment machine through a conveyor belt, and hydrogen and inert gas are used to protect and brighten the bonding copper wire during the heat treatment process, wherein the flow rate of hydrogen is 0.75 to 1.36 L / min, and the flow rate of inert gas is 0.8 to 1.37 L / min;

[0054] S3. The finished product after the heat treatment is transported to a post-processing device through a conveyor belt for secondary processing. The post-processing device includes a coating tank 1 and a cleaning tank 2 connected to the coating tank 1. The finished product is transported to the coating tank 1 to be coated with annealing oil, and is cleaned in the cleaning tank 2 to obtain a final bonding copper wire product.

[0055] Example 2

[0056] After the bonding copper wire is formed, it needs to be post-processed to improve the glossiness of the bonding copper wire. In the post-processing, a kind of grease needs to be used to apply to the surface of the bonding copper wire to make it more glossy. However, the general spraying mechanism uses a nozzle to operate on the bonding copper wire so that the grease droplets can contact the bonding copper wire as much as possible. However, this spraying method consumes a lot of grease. Even if they are collected back by the collection equipment, there is still the problem of contamination of the processing area. In addition, this spraying method will cause the grease to form irregular residues on the bonding copper wire. If no secondary treatment is performed, it is easy to cause the grease to not completely volatilize, causing corrosion to the bonding copper wire. Therefore, please refer to Figure 1-9 , discloses a method for preparing a bonding copper wire, including a post-processing device mentioned in the above description, the post-processing device includes a coating tank 1 and a cleaning tank 2 connected thereto, an oil tank is arranged on the coating tank 1, the oil tank is communicated with the coating tank 1, a first sponge block 31 is arranged in the coating tank 1, and the oil tank and the first sponge block 31 are communicated with each other;

[0057] In order to further post-process the bonding copper wire, a second sponge block 32 is provided in the cleaning chamber 2. The second sponge block 32 is similar in shape to the first sponge block 31, so that the bonding copper wire can be wiped by the second sponge block 32 when passing through the cleaning chamber 2, thereby preventing irregular grease from remaining on the bonding copper wire after it is wound and corroding the bonding copper wire.

[0058] In order to cooperate with the second sponge block 32 to post-process the bonding copper wire, a conveying groove 4 is opened in the cleaning chamber 2, and a gas cylinder 51 is arranged on the cleaning chamber 2. The gas cylinder 51 is connected with the second sponge block 32 arranged in the cleaning chamber 2 through the conveying groove 4. By cyclically squeezing the gas cylinder 51, it can intermittently convey gas to the second sponge block 32, and then blow air to clean the bonding copper wire passing through the second sponge block 32, so as to blow off the grease residue from the bonding copper wire to improve the cleaning effect;

[0059] In order to improve the airtightness between the gas cylinder 51 and the conveying groove 4, a sealing sleeve 6 is arranged in the conveying groove 4, and the output end of the gas cylinder 51 is connected to the sealing sleeve 6, so as to enhance the opening and closing performance at the connection point between the gas cylinder 51 and the conveying groove 4, and prevent large-area air leakage from causing insufficient gas pressure delivered by the gas cylinder 51 to the second sponge block 32.

[0060] In the present embodiment: firstly, the traditional step-by-step processing method is changed to a continuous method, so that the paint after spraying in the paint tank 1 will be sent to the cleaning tank 2 for cleaning operation, and there is basically no interval in the middle, which makes it difficult to cause pollution to the processing area. In addition, the air cylinder 51 is connected with the second sponge block 32 arranged in the cleaning tank 2 through the conveying groove 4. By circulating and squeezing the air cylinder 51, it can intermittently convey gas to the second sponge block 32, and then blow air to clean the bonding copper wire passing through the second sponge block 32, so as to blow off the grease residue from the bonding copper wire to improve the cleaning effect.

[0061] Example 3

[0062] See also Figure 1-9 Since the air cylinder 51 performs a reciprocating cycle to intermittently blow air to the second sponge block 32, and during the resetting process of the air cylinder 51, an air suction operation is formed in the second sponge block 32. In order to prevent the air cylinder 51 from sucking the grease wiped off by the second sponge block 32 into it during this link, thereby causing corrosion and stickiness to itself, a protective mechanism is provided in the sealing sleeve 6, and the sealing sleeve 6 is sealed by the protective mechanism, thereby preventing the air cylinder 51 from extracting the gas in the second sponge block 32 to take away the grease;

[0063] The protection mechanism includes a fixed block 71 fixed in the sealing sleeve 6, a hollow cylinder 72 is provided on the fixed block 71, and the fixed block 71 is connected with the sealing sleeve 6 through the hollow cylinder 72;

[0064] A flow groove 73 is formed on the hollow cylinder 72 , and a sealing ring block 74 is slidably disposed on the hollow cylinder 72 .

[0065] A sealing plate 8 is also provided on the hollow cylinder 72 , and the sealing plate 8 is used to seal the gap between the hollow cylinder 72 and the sealing ring block 74 .

[0066] In this embodiment: when the air cylinder 51 delivers gas to the second sponge block 32, the air pressure will act on the sealing ring block 74, causing it to slide in the direction close to the fixed block 71, thereby opening the flow groove 73 provided on the hollow cylinder 72, and allowing the gas delivered by the air cylinder 51 to the sealing sleeve 6 to flow into the hollow cylinder 72 through the flow groove 73 and finally be delivered to the second sponge block 32. When the air cylinder 51 is evacuating air, the air cylinder 51 no longer provides air pressure that can suppress the sealing ring block 74, so the sealing ring block 74 will reset and slide, re-cutting the connection between the flow groove 73 and the outside world. At this time, the grease in the second sponge block 32 is difficult to flow out, thereby reducing the possibility of grease flowing back into the air cylinder 51, thereby providing protection for it.

[0067] Example 4

[0068] See also Figure 1-9 In order to support the sealing ring block 74 to be able to reset and slide, a stabilizing mechanism is provided in the sealing sleeve 6, and the sealing ring block 74 slides on the hollow cylinder 72 through the stabilizing mechanism;

[0069] The stabilizing mechanism includes a sliding groove 91 provided in the sealing sleeve 6, a sliding block 92 adapted to the sliding groove 91 is provided on the sealing ring block 74, and the sliding groove 91 is slidably provided in the sliding block 92;

[0070] A return spring 11 is also provided on the sliding block 92 , and the sliding block 92 is elastically connected to the sealing sleeve 6 via the return spring 11 .

[0071] In this embodiment, the sealing ring block 74 can slide on the hollow cylinder 72 through the cooperation between the sliding groove 91 and the sliding block 92 .

[0072] At the same time, in order to enable the sealing ring block 74 to reset after losing air pressure, a reset spring 11 is also provided on the sliding block 92. When the sealing ring block 74 is acted upon by air pressure and approaches the fixed block 71, the sliding block 92 will squeeze the reset spring 11, causing it to undergo elastic deformation and accumulate elastic potential energy. When the sealing ring block 74 loses air pressure resistance, the reset spring 11 is able to release its accumulated elastic potential energy, thereby pushing the sealing ring block 74 to reset, thereby closing the connection between the circulation groove 73 and the sealing sleeve 6.

[0073] Example 5

[0074] In order to increase the air pressure delivered to the sealing ring block 74 so that the sealing ring block 74 can slide more stably, please refer to Figure 1-9 , a pressurizing mechanism is also provided in the sealing sleeve 6, and the pressurizing mechanism is used to increase the air pressure entering the sealing sleeve 6;

[0075] The boosting mechanism includes a positioning plate 181 arranged in the sealing sleeve 6, and a plurality of through holes 182 are opened on the positioning plate 181. The through holes 182 are used for gas flow. When the gas transported into the sealing sleeve 6 by the gas cylinder 51 passes through the positioning plate 181, it will be diverted by the through holes 182 on the positioning plate 181. At this time, the output volume remains unchanged and the flow path becomes smaller, thereby increasing the pressure, and then increasing the air pressure on the sealing ring block 74.

[0076] An adjusting mechanism is also provided in the sealing sleeve 6, and the adjusting mechanism cooperates with the pressurizing mechanism;

[0077] The adjustment mechanism includes a sliding ring block 191 slidably disposed in the sealing sleeve 6. A sealing protrusion 192 is disposed on the sliding ring block 191, and the sealing protrusion 192 and the through hole 182 are adapted to each other.

[0078] When the sliding ring block 191 slides in the sealing sleeve 6, the sealing protrusion 192 arranged on the sliding ring block 191 will slide out from the through hole 182, so that more through holes 182 are in an open state, thereby changing the enhancement amplitude of the boosting mechanism.

[0079] A plurality of sealing protrusions 192 are provided, and the plurality of sealing protrusions 192 have different lengths.

[0080] The size of the sealing protrusion 192 gradually increases from the bottom to the top.

[0081] In the present embodiment: by setting sealing protrusions 192 of different lengths, the purpose of opening the through hole 182 in stages is achieved, thereby expanding the intensified range of the boosting mechanism, and the size of a single sealing protrusion 192 gradually increases from bottom to top, so that the adjustment range formed by the single sealing protrusion 192 is expanded, thereby increasing the size of the adjustable range formed by the cooperation of the adjustment mechanism and the boosting mechanism.

[0082] Through the cooperation of the above mechanisms, the adjustable range size of the boost mechanism can be changed by artificial adjustment, thereby improving its applicability.

[0083] There are many ways of manual adjustment, including but not limited to threaded screw cooperation, electric telescopic rods, etc., which can be selected independently according to actual production conditions. Since there are many existing technologies for this adjustment method, it will not be described here.

[0084] Example 6

[0085] See also Figure 1-9 A guide rod 10 is also arranged in the sliding groove 91 , the sliding block 92 is slidably arranged on the guide rod 10 , and the return spring 11 is sleeved on the outer side of the guide rod 10 .

[0086] In this embodiment: in order to make the sliding block 92 slide more stably in the sliding groove 91, a guide rod 10 is also arranged in the sliding groove 91, and the sliding block 92 is slidably arranged on the guide rod 10. At the same time, in order to prevent the return spring 11 from bending during the elastic deformation process and thus hindering the sliding of the sliding block 92, the return spring 11 is sleeved on the outside of the guide rod 10 and is limited by the guide rod 10.

[0087] Example 7

[0088] In order to drive the cylinder 51 to do reciprocating motion, please refer to Figure 1-9 , a mounting plate 12 is also provided on the cleaning chamber 2, and a connecting plate 13 is provided on the top of the air cylinder 51, and the connecting plate 13 is slidably connected to the mounting plate 12;

[0089] The driving mechanism includes a fixing seat 141 disposed on the mounting plate 12, a slider 142 is also slidably disposed on the mounting plate 12, an electric push rod 143 is also disposed on the fixing seat 141, and the slider 142 is also disposed on the electric push rod 143;

[0090] The connecting plate 13 and the slider 142 are fixedly connected;

[0091] A limiting mechanism is also provided on the mounting plate 12, and the limiting mechanism is used to make the sliding block 142 slide more stably;

[0092] The limiting mechanism includes a limiting rod 153 disposed on a base 151 disposed on the mounting plate 12 , a guide block 152 disposed on the slider 142 , and the slider 142 is slidably connected to the limiting rod 153 via the guide block 152 .

[0093] In this embodiment: the electric push rod 143 drives the slider 142 to slide back and forth on the mounting plate 12, so that the connecting plate 13 connected to the slider 142 performs a reciprocating motion on the mounting plate 12, thereby driving the gas cylinder 51 to output gas or inhale gas.

[0094] In order to make the slider 142 run more stably during the sliding process, a limiting mechanism is also provided on the mounting plate 12, and the slider 142 is also slidably connected to the mounting plate 12 through the limiting mechanism so that the slider 142 can slide more stably.

[0095] Example 8

[0096] A bonding copper wire is prepared by the bonding copper wire preparation method.

[0097] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0098] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A method for preparing a bonding copper wire, characterized in that: The following steps are involved: S1. Place the blank on a stretching machine, and set the stretching feed speed of the stretching machine to 90-210 m / min; S2. The stretched semi-finished product is conveyed to a heat treatment machine through a conveyor belt, and hydrogen and inert gas are used to protect and brighten the bonding copper wire during the heat treatment process, wherein the flow rate of hydrogen is 0.75 to 1.36 L / min, and the flow rate of inert gas is 0.8 to 1.37 L / min; S3, the finished product after the heat treatment is then transported to a post-processing device via a conveyor belt for secondary processing, the post-processing device comprising a coating bin (1) and a cleaning bin (2) connected to the coating bin (1), the finished product is transported to the coating bin (1) for coating with annealing oil, and is cleaned in the cleaning bin (2), thereby obtaining a final bonding copper wire product; The post-processing device comprises a paint bin (1) and a cleaning bin (2) connected thereto, an oil bin is arranged on the paint bin (1), the oil bin is communicated with the paint bin (1), a first sponge block (31) is arranged in the paint bin (1), the oil bin and the first sponge block (31) are communicated with each other; A second sponge block (32) is also provided in the cleaning chamber (2), and an air cylinder (51) is provided on the cleaning chamber (2), wherein the air cylinder (51) and the second sponge block (32) are in communication with each other; A conveying groove (4) is provided in the cleaning chamber (2), and the air cylinder (51) is connected to the second sponge block (32) through the conveying groove (4); A sealing sleeve (6) is also provided in the conveying groove (4), and the gas cylinder (51) is connected to the conveying groove (4) through the sealing sleeve (6).

2. The method for preparing a bonding copper wire according to claim 1, characterized in that: A protective mechanism is arranged inside the sealing sleeve (6), and the protective mechanism is used to prevent liquid from flowing back; The protection mechanism comprises a fixed block (71) fixed inside the sealing sleeve (6), a hollow cylinder (72) being provided on the fixed block (71), and the fixed block (71) is connected to the sealing sleeve (6) via the hollow cylinder (72); The hollow cylinder (72) is provided with a circulation groove (73), and a sealing ring block (74) is also slidably provided on the hollow cylinder (72).

3. The method for preparing a bonding copper wire according to claim 2, characterized in that: A sealing plate (8) is also provided on the hollow cylinder (72), and the sealing plate (8) is used to seal the gap between the hollow cylinder (72) and the sealing ring block (74).

4. The method for preparing a bonding copper wire according to claim 2, characterized in that: A stabilizing mechanism is also provided in the sealing sleeve (6), and the sealing ring block (74) slides on the hollow cylinder (72) via the stabilizing mechanism; The stabilizing mechanism comprises a sliding groove (91) provided in the sealing sleeve (6); a sliding block (92) adapted to the sliding groove (91) is provided on the sealing ring block (74); and the sliding groove (91) is slidably provided in the sliding block (92); A return spring (11) is also provided on the sliding block (92), and the sliding block (92) is elastically connected to the sealing sleeve (6) via the return spring (11).

5. The method for preparing a bonding copper wire according to claim 4, characterized in that: A pressurizing mechanism is also provided in the sealing sleeve (6), and the pressurizing mechanism is used to increase the air pressure entering the sealing sleeve (6); The pressurizing mechanism comprises a positioning plate (181) arranged in a sealing sleeve (6), wherein a plurality of through holes (182) are provided on the positioning plate (181), and wherein the through holes (182) are used for gas flow.

6. The method for preparing a bonding copper wire according to claim 5, characterized in that: An adjusting mechanism is also provided in the sealing sleeve (6), and the adjusting mechanism cooperates with the pressurizing mechanism; The adjustment mechanism comprises a sliding ring block (191) slidably arranged in the sealing sleeve (6), a sealing protrusion (192) being arranged on the sliding ring block (191), and the sealing protrusion (192) and the through hole (182) being adapted to each other; A plurality of sealing protrusions (192) are provided, and the plurality of sealing protrusions (192) have different lengths; The size of the sealing protrusion (192) gradually increases from the bottom to the top.

7. The method for preparing a bonding copper wire according to claim 4, characterized in that: A guide rod (10) is also provided in the sliding groove (91), the sliding block (92) is slidably provided on the guide rod (10), and the return spring (11) is sleeved on the outside of the guide rod (10).

8. The method for preparing a bonding copper wire according to claim 1, characterized in that: The cleaning chamber (2) is further provided with a mounting plate (12), and the top of the gas cylinder (51) is provided with a connecting plate (13), wherein the connecting plate (13) is slidably connected to the mounting plate (12); The driving mechanism comprises a fixing seat (141) arranged on a mounting plate (12), a sliding block (142) being slidably arranged on the mounting plate (12), an electric push rod (143) being arranged on the fixing seat (141), and the sliding block (142) being arranged on the electric push rod (143); The connecting plate (13) and the sliding block (142) are fixedly connected; A limiting mechanism is also provided on the mounting plate (12), and the limiting mechanism is used to make the sliding block (142) slide more stably; The limiting mechanism comprises a limiting rod (153) arranged on a base (151) arranged on the mounting plate (12), a guide block (152) being arranged on the slider (142), and the slider (142) being slidably connected to the limiting rod (153) via the guide block (152).

9. A bonding copper wire, characterized in that: The bonding copper wire is prepared by the bonding copper wire preparation method described in any one of claims 1 to 8.

Images