Package substrate, package member, and method for forming package substrate

Abstract

The embodiment of the invention discloses a packaging substrate, a packaging component and a forming method of the packaging substrate, and the packaging substrate comprises at least one group of longitudinal electric conduction structures which penetrate through a core plate so as to be electrically connected with wiring layers at the two sides of the core plate. Each group of longitudinal electric conduction structures comprises a first conduction structure and a second conduction structure which are oppositely arranged at an interval and are electrically insulated from each other, and the first conduction structure and the second conduction structure are plate-shaped structures respectively; the first conduction structure and the second conduction structure can be formed by drilling the substrate to form the first hole and depositing the conductive metal in the first hole, so that the first conduction structure and the second conduction structure of the plate-shaped structure have relatively regular shapes; impedance control over the longitudinal electric conduction structure can be achieved by controlling the width of the first conduction structure and the second conduction structure and the distance between the first conduction structure and the second conduction structure, return loss can be reduced, and signal transmission integrity can be guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and more specifically, to a packaging substrate, a packaging component and a method for forming the packaging substrate. Background Art

[0002] With the booming development of the electronics industry, consumers' demand for miniaturized, multifunctional integrated devices has increased rapidly. This demand has driven the increase in the density of integrated circuits and the requirements for chip input and output bandwidth are getting higher and higher. Currently, one way to increase the interconnection bandwidth of chips is to increase the number of interconnection signals. Usually, the number of interconnection signals is increased by increasing the number of vias, but increasing the number of interconnection signals will increase the size of the package structure. Although increasing the density of vias can maintain or reduce the occupied area of ​​the device package, increasing the density of vias may cause signal loss or crosstalk between nearby vias, which has a greater impact on the signal integrity of high-speed signals. Summary of the invention

[0003] In view of this, an embodiment of the present invention provides a packaging substrate, a packaging component and a method for forming a packaging substrate, which are conducive to ensuring signal transmission integrity.

[0004] In the first aspect, an embodiment of the present invention provides a packaging substrate, comprising a core board, a wiring layer and at least one group of longitudinal electrical conduction structures; the wiring layer is arranged on the opposite side surfaces of the core board; the longitudinal electrical conduction structure passes through the core board to electrically connect the wiring layers on both sides of the core board, and each group of the longitudinal electrical conduction structures comprises a first conduction structure and a second conduction structure, the first conduction structure and the second conduction structure are arranged relative to each other at intervals and are electrically insulated from each other, and the first conduction structure and the second conduction structure are plate-like structures respectively.

[0005] Further, the first conductive structure is mirror-symmetrical with respect to the second conductive structure.

[0006] Further, the size of the first conductive structure in a direction parallel to the first plane is larger than the size in a direction perpendicular to the first plane, and the size of the second conductive structure in a direction parallel to the first plane is larger than the size in a direction perpendicular to the first plane, wherein the first plane is an intermediate plane between the first conductive structure and the second conductive structure.

[0007] Furthermore, the packaging substrate has a first hole passing through the core board, and the first conductive structure and the second conductive structure are respectively arranged on two opposite side walls of the first hole; there is a hollow gap between the first conductive structure and the second conductive structure, or there is an insulating plug between the first conductive structure and the second conductive structure.

[0008] Further, the first hole is a long hole having two opposite long sides and two opposite short sides, and the first conductive structure and the second conductive structure are respectively arranged along a corresponding one of the long sides.

[0009] In a second aspect, an embodiment of the present invention provides a method for forming a packaging substrate, the method comprising the following steps: providing a substrate, the substrate comprising a core board and a copper cladding layer covering two opposite side surfaces of the core board; drilling the substrate to form a first hole penetrating the substrate; forming a first conductive structure and a second conductive structure spaced apart and arranged opposite to each other on an inner wall of the first hole, the first conductive structure and the second conductive structure in the same first hole forming a group of longitudinal electrical conductive structures, the first conductive structure and the second conductive structure being plate-like structures respectively and electrically connected to the conductive layers on both sides of the substrate respectively; and patterning the copper cladding layer to form a wiring layer, the wiring layers on both sides of the core board being electrically connected through the longitudinal electrical conductive structure.

[0010] Furthermore, forming the first conductive structure and the second conductive structure that are spaced apart and arranged opposite to each other on the inner wall of the first hole includes: covering the inner wall of the first hole with conductive metal to form a tubular metal layer; and removing the conductive metal on the gap area of ​​the tubular metal layer so that the remaining conductive metal in the first hole forms the first conductive structure and the second conductive structure, the tubular metal layer having two gap areas that are spaced apart and arranged opposite to each other, and the gap areas extend along the length direction of the tubular metal layer.

[0011] Furthermore, the conductive metal in the gap area is removed by drilling or etching.

[0012] Furthermore, after the inner wall of the first hole is covered with conductive metal to form a tubular metal layer, the method further comprises the following step: forming an insulating plug in the tubular metal layer to electrically insulate the first conductive structure and the second conductive structure of the packaging substrate from each other.

[0013] In a third aspect, an embodiment of the present invention further provides a packaging component, comprising a chip and a packaging substrate as described in the first aspect, wherein the chip is connected to the packaging substrate.

[0014] An embodiment of the present invention provides a packaging substrate, a packaging component and a method for forming a packaging substrate. The packaging substrate includes at least one group of longitudinal electrical conductive structures that penetrate a core board to electrically connect wiring layers on both sides of the core board. Each group of longitudinal electrical conductive structures includes a first conductive structure and a second conductive structure that are arranged opposite to each other and electrically insulated from each other. The first conductive structure and the second conductive structure are plate-like structures respectively. The first conductive structure and the second conductive structure can be formed by drilling a first hole in the substrate and depositing a conductive metal in the first hole. The first conductive structure and the second conductive structure of the plate-like structure have relatively regular shapes. The impedance control of the longitudinal electrical conductive structure can be achieved by controlling the width of the first conductive structure and the second conductive structure and the distance between the first conductive structure and the second conductive structure, which is beneficial to reducing the return loss to ensure the integrity of signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0016] Figure 1 is a schematic top view of a packaging substrate according to an embodiment of the present invention;

[0017] Figure 2 is a perspective schematic diagram of a packaging substrate according to an embodiment of the present invention;

[0018] Figure 3 is a schematic structural diagram of a packaging substrate according to an embodiment of the present invention;

[0019] Figure 4 is a schematic diagram of the three-dimensional structure of a longitudinal electrical conduction structure according to an embodiment of the present invention;

[0020] Figure 5 is a schematic cross-sectional view of a substrate according to an embodiment of the present invention;

[0021] Figure 6 is a cross-sectional schematic diagram of a step of drilling a substrate to form a first hole according to an embodiment of the present invention;

[0022] Figure 7 is a perspective schematic diagram of a step of drilling a substrate to form a first hole according to an embodiment of the present invention;

[0023] Figure 8 is a schematic top view of a step of drilling a substrate to form a first hole according to an embodiment of the present invention;

[0024] Fig. 9 is a schematic cross-sectional view of a step of forming a tubular metal layer in a first hole according to an embodiment of the present invention;

[0025] Fig.10is a perspective schematic diagram of a step of forming a tubular metal layer in a first hole according to an embodiment of the present invention;

[0026] Fig.11 is a schematic top view of a step of forming a tubular metal layer in a first hole according to an embodiment of the present invention;

[0027] Fig.12 is a schematic flow chart of a method for forming a packaging substrate according to an embodiment of the present invention;

[0028] Fig.13 It is a schematic flow chart of a method for forming a first conductive structure and a second conductive structure disposed opposite to each other on an inner wall of a first hole according to an embodiment of the present invention;

[0029] Fig.14 It is an S-curve simulation diagram of the packaging substrate of the embodiment of the present invention and the comparative example.

[0030] Description of reference numerals:

[0031] A1-first plane; 1-substrate; 10-core board; 20-wiring layer; 21-conductive line; 30-longitudinal electrical conduction structure; 31-first conduction structure; 32-second conduction structure; 40-first hole; 41-long side; 42-short side; 50-insulating plug; 60-copper cladding layer; 70-tubular metal layer; 80-gap area; 81-second hole. DETAILED DESCRIPTION

[0032] The present application is described below based on embodiments, but the present application is not limited to these embodiments. In the detailed description of the present application below, some specific details are described in detail. It is possible for those skilled in the art to fully understand the present application without the description of these details. In order to avoid confusing the essence of the present application, known methods, processes, flows, components and circuits are not described in detail.

[0033] In addition, persons of ordinary skill in the art will appreciate that the drawings provided herein are for illustration purposes and are not necessarily drawn to scale.

[0034] Unless the context clearly requires otherwise, the words "include", "including" and similar words throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, the meaning is "including but not limited to".

[0035] In the description of this application, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of this application, unless otherwise specified, the meaning of "plurality" is two or more.

[0036] One aspect of an embodiment of the present invention provides a packaging substrate 1, Figure 1-Figure 3 is a schematic diagram of the structure of the packaging substrate 1, wherein Figure 3 The cross-section shown is Figure 1 The position of the first plane A1 in Figure 1-Figure 3 The package substrate 1 includes a core board 10 and wiring layers 20 arranged on the opposite sides of the core board 10. The core board 10 is used to provide mechanical support for the package substrate 1. The core board 10 can be made of epoxy resin, glass fiber reinforced epoxy resin (FR-4), polyimide (PI), polyethylene terephthalate (PET) or other materials suitable for making the core board 10. The wiring layer 20 has a conductive line 21 formed by a conductive metal. The package substrate 1 also includes at least one group of longitudinal electrical conduction structures 30, which penetrate the core board 10 to achieve electrical connection between the wiring layers 20 on both sides of the core board 10.

[0037] In this embodiment, refer to Figure 1 Each group of longitudinal electrical conductive structures 30 includes a first conductive structure 31 and a second conductive structure 32. The first conductive structure 31 and the second conductive structure 32 are conductive metals, such as copper. The first conductive structure 31 and the second conductive structure 32 are arranged opposite to each other and are electrically insulated from each other, so that the first conductive structure 31 and the second conductive structure 32 can be electrically connected to circuit structures of different polarities in the conductive line 21, respectively. Figure 4 The three-dimensional structure of the vertical electrical conductive structure 30 is shown. Figure 4 The structure of the core plate 10 is not shown in order to better illustrate the shape of the longitudinal electrical conductive structure 30. Figure 4 In this embodiment, the first conductive structure 31 and the second conductive structure 32 are plate-like structures, or sheet-like structures. A plate-like structure refers to a shape whose size in a direction perpendicular to the thickness is greater than the thickness, and the thickness of the plate-like structure is relatively uniform at all locations. The plate-like structure can be a flat plate, an arc-shaped plate, or other elongated shapes stretched along a preset height direction.

[0038] In this embodiment, refer to Figure 1 , the first plane A1 is defined as the middle plane between the first conductive structure 31 and the second conductive structure 32, the size of the first conductive structure 31 in the direction parallel to the first plane A1 is larger than the size in the direction perpendicular to the first plane A1, and the size of the second conductive structure 32 in the direction parallel to the first plane A1 is larger than the size in the direction perpendicular to the first plane A1. Figure 1-Figure 4It can be known that the direction perpendicular to the first plane A1 can be understood as the thickness direction of the first conductive structure 31 and the second conductive structure 32. That is, the first conductive structure 31 and the second conductive structure 32 of the plate-like structure face each other with the largest surface area.

[0039] In some embodiments, reference Figure 1 The first conductive structure 31 is mirror-symmetrical with respect to the second conductive structure 32 , and the first conductive structure 31 and the second conductive structure 32 have substantially the same shape, so that the first conductive structure 31 and the second conductive structure 32 have substantially the same electrical properties and have good interchangeability.

[0040] In some embodiments, reference Figure 1 The package substrate 1 has a first hole 40 that penetrates the core board 10 along the thickness direction of the core board 10. The first conductive structure 31 and the second conductive structure 32 are respectively arranged on the two opposite side walls of the first hole 40, and extend along the inner wall of the first hole 40 respectively. The first conductive structure 31 and the second conductive structure 32 can be formed by depositing a conductive metal on the inner wall of the first hole 40. For example, after pre-treating the inner wall of the first hole 40, a thin metal layer can be deposited on the inner wall of the first hole 40 by physical vapor deposition or chemical vapor deposition to produce the first conductive structure 31 and the second conductive structure 32. The first hole 40 can play a role in positioning and assisting in shaping the manufacture of the first conductive structure 31 and the second conductive structure 32. Optionally, the first hole 40 is a long hole, and the long hole has two opposite long sides 41 and two opposite short sides 42, and the first conductive structure 31 and the second conductive structure 32 are respectively arranged along a corresponding long side 41. Thus, the first hole 40 can be formed by drilling the substrate 1, and then a conductive metal is deposited on the inner wall of the first hole 40 to form the first conductive structure 31 and the second conductive structure 32. By controlling the size of the first hole 40 formed by drilling and the thickness of the conductive metal deposited on the inner wall of the first hole 40, the spacing between the first conductive structure 31 and the second conductive structure 32 can be controlled more conveniently and accurately.

[0041] In some embodiments, a hollow gap is provided between the first conductive structure 31 and the second conductive structure 32, so that the first conductive structure 31 is isolated from the second conductive structure 32. Figure 1 An insulating plug 50 is disposed in the first hole 40 . The insulating plug 50 is located between the first conductive structure 31 and the second conductive structure 32 . The first conductive structure 31 and the second conductive structure 32 are electrically isolated by the insulating plug 50 .

[0042] In another aspect of the embodiments of the present invention, a packaging component is also provided, which includes a chip and a packaging substrate 1 as described in at least some of the embodiments above, wherein the packaging substrate 1 is connected to the chip, for example, the electrical connection between the chip and the packaging substrate 1 can be achieved through wire bonding, flip chip or other feasible connection methods. By adopting the packaging substrate 1 in at least some of the embodiments above, it is beneficial to improve the impedance control of the packaging component, ensure the integrity of signal transmission, and thus ensure the performance of the packaging component.

[0043] In another aspect of the embodiments of the present invention, a method for forming a package substrate 1 is also provided. The method can be used to manufacture the package substrate 1 described in at least some of the embodiments above. Fig.12 The method includes the following steps S100 to S700:

[0044] Step S100: providing a substrate.

[0045] Reference Figure 5 The substrate 1 includes a core board 10 and a copper clad layer 60, and the opposite two side surfaces of the core board 10 are respectively covered with the copper clad layer 60. The thickness of the core board 10 and the copper clad layer 60 can be selected according to actual needs. The core board 10 can be made of epoxy resin, glass fiber reinforced epoxy resin (FR-4), polyimide (PI), polyethylene terephthalate (PET) or other materials suitable for making the core board 10. The copper clad layer 60 is used to form a patterned conductive circuit 21 structure on both sides of the core board 10 in subsequent steps.

[0046] Step S300: drilling the substrate to form a first hole penetrating the substrate.

[0047] Reference Figure 6-Figure 8 , the substrate 1 is drilled along the thickness direction of the substrate 1 to form a first hole 40, and the first hole 40 passes through the substrate 1 to connect the opposite sides of the substrate 1. The drilling can be achieved by mechanical drilling or laser drilling. Optionally, in an embodiment of the present invention, the process of drilling the first hole 40 can be achieved by laser drilling. Laser drilling has high precision and can better control the size of the first hole 40 to facilitate subsequent steps. The position of the first hole 40 is selected according to the circuit layout design of the packaging substrate 1, so that the longitudinal electrical conduction structure 30 subsequently formed on the inner wall of the first hole 40 can be set at a predetermined position to electrically conduct the wiring layer 20 on both sides of the core board 10.

[0048] Step S500: forming a first conductive structure and a second conductive structure that are spaced apart and arranged opposite to each other on the inner wall of the first hole.

[0049] The first conductive structure 31 and the second conductive structure 32 are respectively formed of conductive metal materials. The first conductive structure 31 and the second conductive structure 32 in the same first hole 40 form a group of longitudinal electrical conductive structures 30, which are used to electrically conduct the copper clad layers 60 on both sides of the core board 10, and the first conductive structure 31 and the second conductive structure 32 are electrically insulated, so that the first conductive structure 31 and the second conductive structure 32 can be electrically connected to circuit structures of different polarities. In this embodiment, the first conductive structure 31 and the second conductive structure 32 are respectively plate-shaped structures.

[0050] In an optional embodiment, if Fig.13 As shown, further, step S500 may include the following steps S510 to S530:

[0051] Step S510: Cover the inner wall of the first hole with a conductive metal to form a tubular metal layer.

[0052] Reference Figure 9-11 , the inner wall of the first hole 40 can be uniformly covered with conductive metal by deposition, and a hollow tubular metal layer 70 is formed in the first hole 40. The two ends of the tubular metal layer 70 are respectively connected to the copper cladding layers 60 on both sides of the core board 10. By controlling the size of the first hole 40 formed during drilling in step S300, and controlling the thickness of the conductive metal deposited on the inner wall of the first hole 40 in step S510, the spacing between the first conductive structure 31 and the second conductive structure 32 can be controlled more conveniently and accurately.

[0053] Step S530 : removing the conductive metal on the gap region of the tubular metal layer, so that the conductive metal remaining in the first hole 40 forms a first conductive structure and a second conductive structure.

[0054] Reference Fig.11 , it is defined that the tubular metal layer 70 has two gap regions 80 that are spaced apart and arranged opposite to each other, and the gap regions 80 extend along the length direction of the tubular metal layer 70. Figure 1-Figure 3, when the conductive metal in the gap region 80 is removed, the tubular metal layer 70 is disconnected to form a gap. After the conductive metal on the two gap regions 80 is removed, the remaining part of the tubular metal layer 70 forms two plate-like structures that are spaced apart and arranged opposite to each other, that is, a first conductive structure 31 and a second conductive structure 32 are formed. The specific position of the gap region 80 is selected according to the shape of the first conductive structure 31 and the second conductive structure 32 to be formed. In the present embodiment, when the first hole 40 is a long hole, the long hole has two opposite long sides 41 and two opposite short sides 42. The position of the short side 42 of the gap region 80 can be selected so that the formed first conductive structure 31 and the second conductive structure 32 are respectively arranged along a long side 41 corresponding to the long hole, so as to facilitate the control of the shape of the first conductive structure 31 and the second conductive structure 32. Optionally, the conductive metal in the gap region 80 can be removed by drilling or etching. In the present embodiment, refer to Figure 1-Figure 3 The second hole 81 can be formed by drilling a hole in the gap area 80 to remove the conductive metal in the gap area 80. This method is relatively simple and convenient to operate.

[0055] Optionally, in some embodiments, after step S510, the method may further include the step of forming an insulating plug 50 in the tubular metal layer 70. By filling the tubular metal layer 70 with insulating material to form the insulating plug 50, the first conductive structure 31 and the second conductive structure 32 formed subsequently may be isolated from each other by the insulating plug 50 to achieve electrical insulation.

[0056] Step S700: patterning the copper clad layer to form a wiring layer.

[0057] After pre-treatment such as cleaning the surface of the copper clad layer 60, the copper clad layer 60 is photolithographically formed into a mask, and then a circuit pattern is formed by dry etching or wet etching, and a conductive circuit is obtained after post-treatment such as removing the photoresist and cleaning. According to actual needs, multiple build-up layers can be stacked on both sides of the core board 10 to form a multi-layer packaging substrate, that is, each wiring layer 20 can include a multi-layer conductive circuit structure. After the wiring layer 20 is formed, Figure 4 As shown, the wiring layers 20 on both sides of the core board 10 are electrically connected through a vertical electrical conductive structure 30 .

[0058] The technical solution of the embodiment of the present invention is to make the packaging substrate 1 include at least one group of longitudinal electrical conductive structures 30 that penetrate the core board 10 to electrically connect the wiring layers 20 on both sides of the core board 10, and each group of longitudinal electrical conductive structures 30 includes a first conductive structure 31 and a second conductive structure 32 that are arranged opposite to each other and electrically insulated from each other, and the first conductive structure 31 and the second conductive structure 32 are plate-like structures respectively. Therefore, the first conductive structure 31 and the second conductive structure 32 of the plate-like structure have relatively regular shapes, and the impedance control of the longitudinal electrical conductive structure 30 can be achieved by controlling the width of the first conductive structure 31 and the second conductive structure 32 and the distance between the first conductive structure 31 and the second conductive structure 32, which is beneficial to reducing the return loss to ensure the integrity of signal transmission. Since the first conductive structure 31 and the second conductive structure 32 can be formed by drilling the substrate 1 to form the first hole 40 and depositing a conductive metal in the first hole 40, the width of the first conductive structure 31 and the second conductive structure 32 and the distance between the first conductive structure 31 and the second conductive structure 32 can be more accurately controlled by controlling the size of the drilling hole and the thickness of the metal deposition, and the impedance of the longitudinal electrical conductive structure 30 can be accurately controlled.

[0059] Fig.14 1 is an S-curve simulation diagram of the package substrate of the embodiment of the present invention and the comparative example, wherein the dashed curve represents the package substrate 1 of the embodiment of the present invention, and the solid curve represents the comparative example. The comparative example is a conventional package substrate 1 that uses copper-plated vias as a longitudinal transmission structure between the wiring layers 20 on both sides of the core board 10. Fig.14 The horizontal axis in the figure is frequency. Observing the S curve of the comparative example, it exceeds -20dB at around 12GHz and exceeds -10dB at around 44GHz, and the amplitude decreases with the frequency is also large. The S parameter of the package substrate 1 of the embodiment of the present invention is kept below -20dB before 36Ghz and below -10dB before 82Ghz, and the amplitude decreases with the frequency is also relatively gentle, indicating that the crosstalk between the lines is small and the signal integrity is improved relative to the comparative example.

[0060] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A packaging substrate, characterized in that: include: Core board; A wiring layer is provided on two opposite sides of the core board; as well as At least one group of longitudinal electrical conduction structures penetrates the core board to electrically connect the wiring layers on both sides of the core board, each group of the longitudinal electrical conduction structures includes a first conduction structure and a second conduction structure, the first conduction structure and the second conduction structure are arranged relative to each other and are electrically insulated from each other, and the first conduction structure and the second conduction structure are plate-like structures respectively.

2. The packaging substrate according to claim 1, characterized in that: The first conductive structure is mirror-symmetrical to the second conductive structure.

3. The packaging substrate according to claim 1, characterized in that: The size of the first conductive structure in a direction parallel to the first plane is larger than the size in a direction perpendicular to the first plane, and the size of the second conductive structure in a direction parallel to the first plane is larger than the size in a direction perpendicular to the first plane, wherein the first plane is an intermediate plane between the first conductive structure and the second conductive structure.

4. The packaging substrate according to claim 1, characterized in that: The package substrate has a first hole penetrating the core board, and the first conductive structure and the second conductive structure are respectively arranged on two opposite side walls of the first hole; There is a hollow gap between the first conductive structure and the second conductive structure, or there is an insulating plug between the first conductive structure and the second conductive structure.

5. The packaging substrate according to claim 4, characterized in that: The first hole is a long hole having two opposite long sides and two opposite short sides, and the first conductive structure and the second conductive structure are respectively arranged along a corresponding one of the long sides.

6. A method for forming a packaging substrate, characterized in that: include: Providing a substrate, the substrate comprising a core board and a copper cladding layer covering two opposite side surfaces of the core board; Drilling the substrate to form a first hole penetrating the substrate; A first conductive structure and a second conductive structure are formed on the inner wall of the first hole and are arranged opposite to each other at intervals. The first conductive structure and the second conductive structure in the same first hole form a group of longitudinal electrical conductive structures. The first conductive structure and the second conductive structure are plate-shaped structures and are electrically connected to the conductive layers on both sides of the substrate respectively. as well as The copper clad layer is patterned to form a wiring layer, and the wiring layers on both sides of the core board are electrically connected through the longitudinal electrical conduction structure.

7. The method according to claim 6, characterized in that The first conductive structure and the second conductive structure formed on the inner wall of the first hole and arranged opposite to each other at an interval include: Covering the inner wall of the first hole with a conductive metal to form a tubular metal layer; and The conductive metal on the gap area of ​​the tubular metal layer is removed so that the remaining conductive metal in the first hole forms a first conductive structure and a second conductive structure. The tubular metal layer has two gap areas that are spaced apart and arranged opposite to each other, and the gap areas extend along the length direction of the tubular metal layer.

8. The method according to claim 7, characterized in that The conductive metal in the gap area is removed by drilling or etching.

9. The method according to claim 7, characterized in that: After the inner wall of the first hole is covered with a conductive metal to form a tubular metal layer, the method further comprises: An insulating plug is formed in the tubular metal layer to electrically insulate the first conductive structure and the second conductive structure of the package substrate from each other.

10. A packaging component, characterized in that: include: The packaging substrate according to any one of claims 1 to 5; as well as The chip is connected to the packaging substrate.

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