Anti-shake assembly of image sensor and camera module

Abstract

The invention provides an anti-shake assembly of an image sensor, a camera module and an electronic device, an interconnection line used for supplying power to the image sensor is laid in a first circuit board of the anti-shake assembly, and the image sensor can be installed on a movable platform of the first circuit board. Connecting arms are connected between the movable platform and the fixed outer frame of the first circuit board, and the connecting arms can be arranged in a central symmetry mode. The interaction force between the first magnet and the coil in the anti-shake assembly can drive the movable platform to displace or rotate so as to drive the image sensor installed on the movable platform to translate or rotate. According to the anti-shake assembly, the camera module and the electronic equipment, the anti-shake performance, especially the rotation anti-shake performance, is high, the anti-shake assembly and the camera module are small in size, and the internal space utilization rate is high.

Description

Technical Field

[0001] The present application relates to the field of terminal device hardware, and in particular, to an anti-shake component of an image sensor and a camera module. Background Art

[0002] The optical image stabilization of image sensors is an important factor affecting the quality of photographing and videography of electronic devices. In order to improve the performance of photographing and videography of electronic devices, more lenses, sensors and other devices are installed inside electronic devices, and the space inside electronic devices for accommodating the anti-shake function components is getting smaller and smaller.

[0003] How to realize the multi-axis anti-shake function of the image sensor in a limited space is a question worth considering. Summary of the invention

[0004] The present application provides an anti-shake component for an image sensor, wherein the image sensor can be mounted on a movable platform of a first circuit board, and interconnection lines are laid inside the first circuit board in the anti-shake component to realize power supply to the image sensor. The connecting arms arranged centrally and symmetrically on the first circuit board can control the displacement or rotation of the movable platform, thereby driving the image sensor to translate or rotate in a limited space, and realizing the multi-axis anti-shake function of the image sensor.

[0005] In a first aspect, an anti-shake component of an image sensor is provided, comprising: a shell, a first magnet, a coil and a first circuit board, wherein the first magnet, the coil and the first circuit board are accommodated in the shell, the first circuit board comprises: an outer frame, a connecting arm, a movable platform and an interconnection line, the outer frame comprises a first interface, and the first interface is used to connect an external power supply of the anti-shake component; a gap is provided between the movable platform and the outer frame, and the movable platform is used to load the image sensor; the connecting arm is located in the gap, the connecting arm connects the outer frame and the movable platform, the number of the connecting arms is multiple, and the multiple connecting arms are centrally symmetrical about the rotation center of the first circuit board; the interconnection line is located inside the first circuit board, and the interconnection line connects the first interface and the image sensor; the first magnet or the coil is fixedly connected to the movable platform, and when current is passed through the coil, the first magnet or the coil drives the movable platform to translate or rotate.

[0006] In a possible implementation manner, a first opening is formed in the middle area of ​​the movable platform, and the first opening is used to mount an image sensor.

[0007] In a possible implementation, the first magnet is fixedly connected to the movable platform, and the coil is fixedly connected to the shell. Alternatively, the coil is fixedly connected to the movable platform, and the first magnet is fixedly connected to the shell.

[0008] It should be understood that the fixed connection here may include direct connection and indirect connection. Exemplarily, the first magnet is fixedly connected to the movable platform, which may refer to the first magnet being fixed on the movable platform, or the first magnet being fixed on the second circuit board, and the second circuit board being fixedly connected to the movable platform.

[0009] In a possible implementation, the anti-shake component further includes a controller, and the controller is used to control the direction and magnitude of the current in the coil.

[0010] In a possible implementation, the connecting arm or the first circuit board may be composed of a material having an elastic modulus greater than a preset threshold value, the connecting arm may also be referred to as an elastic connecting arm, and the first circuit board may also be referred to as an elastic circuit board.

[0011] In this technical solution, interconnection lines are laid inside the first circuit board to power the image sensor, which is conducive to improving the space utilization of the anti-shake component and reducing the adverse effects of the power supply line on the rotation anti-shake function of the anti-shake component. At the same time, by setting a centrally symmetrical connecting arm to control the image sensor to translate or rotate, it is conducive to making the displacement or rotation angle of the image sensor more stable, simplifying the structure of the anti-shake component, and improving the reliability and stability of the rotation anti-shake function of the anti-shake component. Compared with the solution of using a flexible circuit board to realize the rotation anti-shake function, the first circuit board in this technical solution has a smaller rigidity and better rotation anti-shake performance.

[0012] In combination with the first aspect, in certain implementations of the first aspect, the first end of the connecting arm is connected to the outer frame, the second end of the connecting arm is connected to the movable platform, and the angle formed between the line connecting the first end and the rotation center and the line connecting the second end and the rotation center is greater than or equal to 90°.

[0013] It should be understood that the angle formed by the two connecting lines refers to the angle between the direction from the rotation center to the first end and the direction from the rotation center to the second end.

[0014] In some scenarios, the technical solution can also be understood as dividing the plane where the first circuit board is located into four quadrants using two mutually perpendicular straight lines passing through the rotation center of the first circuit board, and the connecting arm passes through at least two of the four quadrants.

[0015] When subjected to the same force, the connecting arm that meets the length or shape of the technical solution has a larger total deformation, and is more likely to drive the movable platform connected to it to rotate or translate. In other words, the connecting arm is more efficient in driving the image sensor, which is beneficial to improving the energy utilization of the anti-shake component.

[0016] In combination with the first aspect, in certain implementations of the first aspect, there are multiple connecting arms, and the multiple connecting arms include a first connecting arm and a second connecting arm, and the first connecting arm and the second connecting arm are both used to connect the first connecting portion of the outer frame and the second connecting portion of the movable platform.

[0017] In a possible implementation manner, the plurality of connecting arms are located in a plane where the first circuit board is located, and a gap is provided between two adjacent connecting arms.

[0018] By using multiple connecting arms to jointly control the movable platform, on the one hand, the force direction at the connecting part of the movable platform is not easy to deviate, and the stability of the movable platform controlled by the connecting arms is better. On the other hand, when any of the multiple connecting arms is damaged, the remaining connecting arms can still continue to control the movable platform, and the reliability of the anti-shake performance of the anti-shake component is better.

[0019] In combination with the first aspect, in some implementations of the first aspect, a connecting rod is connected between the first connecting arm and the second connecting arm.

[0020] In a possible implementation, the first connecting arm and the connecting rod are connected to the position on the first connecting arm where the force direction suddenly changes. The second connecting arm and the connecting rod are also connected to the position on the second connecting arm where the force direction suddenly changes.

[0021] By arranging a connecting rod between the two connecting arms, the difference in the deformation amount of the two connecting arms when deformed by force is smaller, the control effect of the two connecting arms on the movable platform is more synchronized, and the anti-shake performance of the anti-shake assembly is more stable.

[0022] In combination with the first aspect, in some implementations of the first aspect, the connecting rod includes a conductive portion, and the conductive portion is used to conduct a first interconnection line located inside the first connecting arm and a second interconnection line located inside the second connecting arm.

[0023] In a possible implementation, the connecting rod is a conductor, such as metal. In this case, the connecting rod can also be called a metal flexure.

[0024] By using a connecting rod connecting the first connecting arm and the second connecting arm to connect the interconnection lines inside the two connecting arms, more optional routing methods of the interconnection lines inside the first circuit board are available, which is conducive to reducing the complexity of the routing of the interconnection lines inside the first circuit board.

[0025] In combination with the first aspect, in some implementations of the first aspect, there are multiple interconnection lines, and the multiple interconnection lines are located at different positions in the thickness direction of the first circuit board.

[0026] In a possible implementation manner, the plurality of interconnection lines are stacked and distributed in a thickness direction of the first circuit board, and the plurality of interconnection lines are insulated from each other.

[0027] In one possible implementation, the plurality of interconnection lines are also used to power other electronic components in the anti-shake assembly, such as a Hall element, a controller, etc.

[0028] By arranging multiple interconnection lines in the thickness direction of the first circuit board, the multiple interconnection lines can be used to power more electronic components. This technical solution further utilizes the space inside the first circuit board, which is conducive to further improving the space utilization rate of the anti-shake component.

[0029] In combination with the first aspect, in certain implementations of the first aspect, the connecting arm includes a plurality of sub-connecting arms, and an angle formed between two adjacent sub-connecting arms among the plurality of sub-connecting arms is equal to 90°.

[0030] In a possible implementation, the connecting arm includes two sub-connecting arms that are perpendicular to each other.

[0031] The connecting arm is composed of sub-connecting arms in two directions perpendicular to each other. When the connecting arm is subjected to a force, the force can be effectively decomposed in the direction along the sub-connecting arm, and the deformation and / or displacement of the connecting arm can be greater. The anti-shake component has a higher conversion efficiency in converting electrical energy into mechanical energy, and the energy utilization efficiency of the anti-shake component is higher.

[0032] In combination with the first aspect, in certain implementations of the first aspect, the anti-shake assembly also includes a base plate and a support plate, the base plate is located on a side of the first circuit board away from the cover plate of the shell, the support plate is located between the first circuit board and the base plate, and the support plate is in contact with the base plate.

[0033] In a possible implementation manner, the support plate is in rolling friction contact or sliding friction contact with the bottom plate.

[0034] In a possible implementation, a lubricating material is filled between the support plate and the bottom plate, or a lubricating material is coated on a surface of the support plate that contacts the bottom plate.

[0035] A support plate is arranged between the first circuit board and the bottom plate, and friction between the support plate and the bottom plate is performed, which is beneficial to avoid direct contact between the image sensor mounted on the first circuit board and the bottom plate, and is beneficial to reducing wear of the image sensor.

[0036] In combination with the first aspect, in some implementations of the first aspect, the movable platform includes a first opening, the support plate includes a second opening, the first opening is connected to the second opening, and the first opening and the second opening are used to accommodate the image sensor.

[0037] In a possible implementation, the image sensor may be clamped in the first opening and the second opening. When the movable platform drives the image sensor to translate or rotate, the image sensor may drive the support plate to translate or rotate relative to the bottom plate.

[0038] The side of the image sensor accommodated in the first opening and the second opening facing the base plate can be in a suspended state, that is, not in contact with the base plate, the support plate, etc., which is beneficial to improving the driving effect of the anti-shake component on the image sensor, reducing the wear of the image sensor, and extending the service life of the anti-shake component.

[0039] In combination with the first aspect, in some implementations of the first aspect, a pad is provided on a side of the support plate facing the bottom plate, and the pad is in contact with the bottom plate.

[0040] In a possible implementation, the pad foot is in rolling friction contact or sliding friction contact with the base plate.

[0041] Providing a foot on the side of the support plate facing the base plate is beneficial to controlling the contact area between the support plate and the base plate during translation or rotation, which is beneficial to reducing the wear of the support plate, and is beneficial to better driving the image sensor to translate or rotate. To a certain extent, it is also beneficial to improving the contact stability between the support plate and the base plate.

[0042] In combination with the first aspect, in some implementations of the first aspect, the anti-shake assembly further includes a second magnet, the bottom plate is composed of a magnetic material, the second magnet is located above the movable platform, and the second magnet and the bottom plate attract each other.

[0043] The mutual attraction between the second magnet and the base plate can effectively press the support plate onto the base plate, which is beneficial to reducing the probability of the support plate shaking in the direction of the optical axis and is beneficial to improving the reliability and stability of the anti-shake performance of the anti-shake component.

[0044] In combination with the first aspect, in certain implementations of the first aspect, the anti-shake component also includes a support frame, the support frame is located between the base plate and the first circuit board, the support frame is located on the outside of the support plate, and the thickness of the support frame is the same as the height of the support plate.

[0045] In the case where the support plate is not provided with feet, the thickness of the support frame is the same as the thickness of the support plate. In the case where the support plate is provided with feet, the thickness of the support frame is the same as the sum of the height of the feet and the thickness of the support plate.

[0046] The peripheral area between the bottom plate and the first circuit board can be filled by the support frame, so that the bottom plate and the first circuit board can fit more closely, and dust outside the anti-shake component is not easy to enter between the bottom plate and the first circuit board. The friction state between the bottom plate and the support plate is not easily disturbed by dust and other substances. This technical solution is conducive to improving the reliability of the anti-shake component function.

[0047] In combination with the first aspect, in certain implementations of the first aspect, the support frame avoids the connecting arm.

[0048] When the support frame avoids the connecting arm, the deformation or displacement of the connecting arm will not be adversely affected by the friction between the support frame and the connecting arm. In this technical solution, the interaction force between the coil and the first magnet drives the movable platform more efficiently, and the energy conversion efficiency of the anti-shake component is higher.

[0049] In combination with the first aspect, in certain implementations of the first aspect, the coil includes a first sub-coil and a second sub-coil, the first sub-coil is used to drive the movable platform to translate along a first direction, and the second sub-coil is used to drive the movable platform to translate along a second direction, and the first direction is perpendicular to the second direction.

[0050] In combination with the first aspect, in some implementations of the first aspect, the coil includes a third sub-coil, and the third sub-coil is used to drive the movable platform to rotate around the rotation center of the first circuit board.

[0051] In a possible implementation manner, the third sub-coil and the first sub-coil are the same coil, or the third sub-coil and the second sub-coil are the same coil.

[0052] Different coils can be used to provide forces to drive the movable platform to translate or rotate in different directions. The control logic of the anti-shake function of the anti-shake component is simpler, which is conducive to reducing the mutual interference between different coils in the anti-shake component and improving the stability of the anti-shake performance of the anti-shake component.

[0053] In combination with the first aspect, in some implementations of the first aspect, the first magnet is a Halbach magnet.

[0054] Compared with a single magnet, the Halbach magnet enhances the magnetic field strength within a certain range. The use of the Halbach magnet can enhance the interaction force between the first magnet and the coil to a certain extent, or in other words, the use of the Halbach magnet can enhance the driving force for the image sensor to a certain extent. In other words, compared with a single magnet, when using the Halbach magnet, a smaller current or a smaller volume of coil can obtain a considerable driving force. The implementation of this technical solution is conducive to improving the energy conversion efficiency of the anti-shake component and improving the space utilization efficiency within the anti-shake component.

[0055] In combination with the first aspect, in some implementations of the first aspect, the anti-shake assembly further includes a fixed plate, the fixed plate is fixedly connected to the movable platform, and the first magnet or coil is fixed on the fixed plate.

[0056] In a possible implementation, the fixing plate can also be used to fix other electronic components such as Hall elements and controllers.

[0057] In a possible implementation, the fixing plate is electrically connected to the first circuit board. For example, the fixing plate is electrically connected to the first circuit board by soldering.

[0058] By providing a fixing plate to carry the first magnet or coil, it is beneficial to uniformly install and set up multiple electronic components in the anti-shake assembly, and powering the fixing plate can realize powering the electronic components on the fixing plate. The implementation of this technical solution is beneficial to improving the installation and production efficiency of the anti-shake assembly.

[0059] For the relevant explanations and detailed description of the beneficial effects in the following technical solutions, please refer to the relevant contents in the first aspect, and for the sake of brevity, they will not be repeated below.

[0060] In a second aspect, a circuit board is provided, comprising: an outer frame, a connecting arm, a movable platform and interconnecting lines, wherein the outer frame is provided with a first interface, and the first interface is used to connect an external power supply of an anti-shake component; a gap is provided between the movable platform and the outer frame, and the movable platform is used to load an image sensor; the connecting arm is located in the gap, and the connecting arm connects the outer frame and the movable platform, and there are multiple connecting arms, and the multiple connecting arms are centrally symmetrical about the rotation center of the circuit board; the interconnecting lines are located inside the circuit board, and the interconnecting lines connect the first interface and the image sensor.

[0061] In combination with the second aspect, in certain implementations of the second aspect, the first end of the connecting arm is connected to the outer frame, the second end of the connecting arm is connected to the movable platform, and the angle formed between the line connecting the first end and the rotation center and the line connecting the second end and the rotation center is greater than or equal to 90°.

[0062] In combination with the second aspect, in certain implementations of the second aspect, there are multiple connecting arms, and the multiple connecting arms include a first connecting arm and a second connecting arm, and the first connecting arm and the second connecting arm are both used to connect the first connecting portion of the outer frame and the second connecting portion of the movable platform.

[0063] In combination with the second aspect, in certain implementations of the second aspect, the first connecting arm and the second connecting arm are connected by a connecting rod.

[0064] In combination with the second aspect, in some implementations of the second aspect, the connecting rod includes a conductive portion, and the conductive portion is used to conduct a first interconnection line located inside the first connecting arm and a second interconnection line located inside the second connecting arm.

[0065] In combination with the second aspect, in some implementations of the second aspect, there are multiple interconnection lines, and the multiple interconnection lines are located at different positions in the thickness direction of the circuit board.

[0066] In combination with the second aspect, in certain implementations of the second aspect, the connecting arm includes a plurality of sub-connecting arms, and an angle formed between two adjacent sub-connecting arms among the plurality of sub-connecting arms is equal to 90°.

[0067] In a possible implementation, the connecting arm includes two sub-connecting arms.

[0068] In a third aspect, a camera module is provided, comprising a lens, an image sensor, and an anti-shake component of the image sensor in the first aspect and any possible implementation thereof, wherein the image sensor is installed in a middle area of ​​the anti-shake component, the lens and the anti-shake component are relatively fixed, and imaging light is incident on the image sensor through the lens.

[0069] In a fourth aspect, an electronic device is provided, comprising a mainboard and the camera module of the third aspect and possible implementations thereof, wherein the camera module is electrically connected to the mainboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0070] Figure 1 It is a schematic diagram of an electronic device provided in an embodiment of the present application.

[0071] Figure 2 It is a schematic diagram of a camera module of an electronic device provided in an embodiment of the present application.

[0072] Figure 3 This is a stereoscopic view of an anti-shake module of an image sensor provided in an embodiment of the present application.

[0073] Figure 4 The embodiment of this application provides Figure 3 An exploded view of the image sensor's anti-shake module is shown.

[0074] Figure 5 It is a schematic diagram of the arrangement of the first magnet provided in an embodiment of the present application.

[0075] Figure 6 It is a schematic diagram of the structure of a first magnet provided in an embodiment of the present application.

[0076] Figure 7 It is a schematic diagram of the structure of another first magnet provided in an embodiment of the present application.

[0077] Figure 8 It is a schematic diagram of the arrangement of the coils provided in the embodiment of the present application.

[0078] Fig. 9 yes Figure 8 Schematic diagram of force analysis of the coil shown.

[0079] Fig.10 This is a three-dimensional view of the first circuit board provided in an embodiment of the present application.

[0080] Fig.11 It is a schematic diagram of a fixed outer frame of a first circuit board provided in an embodiment of the present application.

[0081] Fig.12It is a schematic diagram of the arrangement of the connecting arm of the first circuit board provided in an embodiment of the present application.

[0082] Fig.13 It is a schematic diagram of the connecting arm of the first circuit board provided in an embodiment of the present application.

[0083] Fig.14 It is a schematic diagram of the shape of the connecting arm of the first circuit board provided in an embodiment of the present application.

[0084] Fig.15 It is a schematic diagram of the movable platform of the first circuit board provided in an embodiment of the present application.

[0085] Fig.16 It is a schematic diagram of the AA cross section of the first circuit board provided in an embodiment of the present application.

[0086] Fig.17 It is a schematic diagram of a support plate of a first circuit board provided in an embodiment of the present application.

[0087] Fig.18 It is a schematic diagram of a support frame of a first circuit board provided in an embodiment of the present application.

[0088] Fig.19 It is a schematic diagram of the second circuit board provided in an embodiment of the present application. DETAILED DESCRIPTION

[0089] Embodiments of the present application are described in detail below, and examples of the embodiments of the present application are shown in the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0090] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by persons having ordinary skills in the technical field to which this application belongs. In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0091] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be used as limitations on the present application. The terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first", "second", etc. can explicitly or implicitly include one or more of the features. The term "and / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist; for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the associated objects before and after are in an "or" relationship. The terms "include", "comprise", "have" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0092] Before introducing the embodiments of the present application, some terms that may be used in the following content are first explained.

[0093] Voice coil motor, also known as voice coil motor (VCM), is named because its structure is similar to the voice coil of a speaker. It has the characteristics of high frequency response and high precision.

[0094] Image sensor stabilization (SOIS) improves image stability by driving the image sensor to move and compensate for operator jitter during use.

[0095] Mobile power supply, in image sensor anti-shake, it is necessary to solve the power supply problem of the image sensor during movement. Generally, conventional wires, flexible printed circuits (FPC), printed circuit boards (PCB) and wiring on reeds are selected to meet the electrical performance requirements of the sensor.

[0096] Optical image stabilization (OIS) refers to the use of optical components in cameras or other similar imaging instruments to avoid or reduce instrument jitter that occurs in the process of capturing light signals, thereby improving image quality.

[0097] Halbach magnets, or Halbach arrays, are a special type of permanent magnet array that increases the magnetic field on one side of the array while weakening the magnetic field to near zero on the other side of the array.

[0098] Figure 1An electronic device 100 provided in an embodiment of the present application is shown. The electronic device 100 may include a front camera module 110 and / or a rear camera module 120 .

[0099] When a user uses the electronic device 100 to perform a shooting operation, the front camera module 110 and / or the rear camera module 120 may undergo one or more of rotation around the optical axis, deflection along the optical axis, and translation in a plane perpendicular to the optical axis.

[0100] Figure 2 A schematic diagram of the composition of a camera module 200 of an electronic device 100 is exemplarily provided. The camera module 200 may be the aforementioned front camera module 110 or the aforementioned rear camera module 120 .

[0101] The camera module 200 may include a lens 210, an image sensor 220, an image sensor anti-shake component 300, and an image processing chip (not shown in the figure). When the camera module 200 is used for shooting, the incident light 10 is incident on the lens 210 from the photographed object, and the incident light 10 can be incident on the image sensor 220 after being modulated by the lens 210. The image sensor 220 can be a complementary metal oxide semiconductor device (CMOS) or a charge coupled device (CCD). The image sensor 220 can convert the incident light signal into an electrical signal. The image signal processor (ISP) in the camera module 200 can convert the electrical signal output by the image sensor 220 into a digital image signal and output it to the digital signal processor (DSP), and the digital signal processor can convert the input signal into an image signal in a standard format (for example, red green blue (RGB) format, etc.). The image sensor anti-shake component 300 can be used to load the image sensor 220 and power the image sensor 220 and provide a channel for transmitting data.

[0102] In some examples, the camera module 200 may also include one or more of other components such as a voice coil motor (VCM), a filter, and a holder. Among them, the voice coil motor can be used to implement the autofocus function of the camera module and improve the clarity of the image captured by the camera module 200. The filter can improve the quality of the image captured by the camera to a certain extent, for example, by filtering out unnecessary light to improve the contrast and saturation of the image. The holder can be used to fix the lens 210.

[0103] As mentioned above, it is difficult for the electronic device 100 to remain completely still relative to the subject during the shooting process. When relative movement occurs between the subject and the electronic device, the position of the incident point from the lens 210 to the image sensor 220 may change. This change may, to a certain extent, adversely affect the quality of the image captured by the camera module 200. In order to improve the imaging quality of the camera module 200, it is necessary to improve the anti-shake performance of the image sensor 220.

[0104] In order to improve the anti-shake performance of the image sensor, the present application provides an anti-shake component 300 of an image sensor, which can be used to implement the multi-axis anti-shake function of the image sensor, reduce the adverse effects of the translation, deflection, and rotation of the image sensor on the imaging quality of the camera module of the electronic device 100, and improve the imaging quality of the camera module, which is further explained below.

[0105] Figure 3 and Figure 4 FIG. 3 is an anti-shake component 300 of an image sensor provided in an embodiment of the present application. Figure 3 FIG. 1 is a three-dimensional view of the anti-shake assembly 300. Figure 4 The figure shows a schematic diagram of the component combination of the anti-shake assembly 300. The anti-shake assembly 300 may include a housing 310, a first magnet 320, a coil 330, a first circuit board 400 and a bottom plate 340.

[0106] The housing 310 may include a side wall 311 and a cover plate 312. The side wall 311 may be formed by extending a distance from the connection position with the cover plate 312 in a direction away from the cover plate 312. For example, the side wall 311 may be formed along the normal direction ( Figure 3 The side wall 311 is formed by extending a distance in the direction away from the cover plate 312 (in the direction OO'). That is, the plane where the side wall 311 is located is perpendicular to the plane where the cover plate 312 is located.

[0107] In some examples, an opening may be provided in the middle area of ​​the cover 312 , and the opening may be used to accommodate devices such as the image sensor 220 , an optical module (eg, the lens 210 ) that cooperates with the anti-shake assembly 300 , and the like.

[0108] When the housing 310 is covered on the bottom plate 340, a storage space may be formed between the housing 310 and the bottom plate 340, and the storage space may be used to store other devices or components of the anti-shake assembly 300, such as the aforementioned first magnet 320, coil 330, first circuit board 400, etc. Part or all of the components or devices in the storage space may be exposed at the opening position of the cover 312. In some examples, the connection portion 301 of device A may extend out of the opening position into the storage space, and the connection portion 301 may be used to achieve electrical connection with components outside the anti-shake assembly 300.

[0109] When the housing 310 is covered on the bottom plate 340, one end of the side wall 311 away from the cover plate 312 may contact the bottom plate 340. In some examples, the housing 310 and the bottom plate 340 may be fixedly connected by one or more of gluing, snaps, and screws.

[0110] The first magnet 320 and the coil 330 may be disposed opposite to each other, and an interaction force may be generated therebetween.

[0111] In some examples, the first magnet 320 is fixedly connected to the shell 310, and the coil 330 is fixedly connected to the first circuit board 400. When an interaction force is generated between the first magnet 320 and the coil 330, the force can push the coil 330 to cause the first circuit board 400 to deform and / or move.

[0112] Exemplarily, when the coil 330 is fixedly connected to the first circuit board 400, the coil 330 is taken as the research object. When the first magnet 320 interacts with the coil 330, the coil 330 can be subjected to at least two forces in the same plane that are perpendicular to each other, so that the image sensor 220 in the anti-shake component 300 can be subjected to driving forces in two directions in the same plane that are perpendicular to each other, and can thus undergo translation or rotation in the plane.

[0113] In some examples, the coil 330 is fixedly connected to the housing 310, and the first magnet 320 is fixedly connected to the first circuit board 400. When an interaction force is generated between the first magnet 320 and the coil 330, the force can push the first magnet 320 to drive the first circuit board 400 to deform and / or move.

[0114] Exemplarily, when the first magnet 320 is fixedly connected to the first circuit board 400, the first magnet 320 is taken as the research object. When the first magnet 320 interacts with the coil 330, the first magnet 320 can be subjected to at least two forces in the same plane that are perpendicular to each other, so that the image sensor 220 in the anti-shake component 300 can be subjected to driving forces in two directions in the same plane that are perpendicular to each other, and can then undergo translation or rotation in the plane.

[0115] When the first magnet 320 is fixedly connected to the housing 310 , one or more fixing members may be provided on the side wall 311 or the cover plate 312 , and the one or more fixing members may be used to fix the first magnet 320 on the housing 310 .

[0116] Exemplarily, the one or more fixing members may be a slot-shaped structure, and the shape of the fixing member may match the shape of the first magnet 320. The first magnet 320 may be installed in the slot-shaped structure, and the housing 310 and the first magnet 320 may be fixedly connected by the friction between the side wall of the slot-shaped structure and the first magnet 320.

[0117] Exemplarily, an adhesive material may be adhered to the surface of the first magnet 320, and the first magnet 320 may be fixedly connected to a side of the cover plate 312 facing the bottom plate 340 through the adhesive material, or the first magnet 320 may also be fixedly connected to a side of the side wall 311 facing the accommodating space through the adhesive material.

[0118] When the first magnet 320 is fixedly connected to the housing 310 , one or more fixing members may be provided on the side wall 311 or the cover plate 312 , and the one or more fixing members may be used to fix the coil 330 on the housing 310 .

[0119] Exemplarily, the one or more fixing members may be a slot-shaped structure or an annular structure, and the shape of the fixing member may match the shape of the coil 330. The coil 330 may be installed in the slot-shaped structure or the annular structure, and the coil 330 may be fixedly connected to the housing 310 by the friction between the side wall of the slot-shaped structure or the annular structure and the first magnet 320.

[0120] Exemplarily, an adhesive material may be adhered to the surface of the coil 330, and the coil 330 may be fixedly connected to the side of the cover plate 312 facing the bottom plate 340 through the adhesive material, or the coil 330 may also be fixedly connected to the side of the side wall 311 facing the accommodating space through the adhesive material.

[0121] The above merely provides some exemplary ways of connecting the first magnet 320 or the coil 330 to the shell 310. It should be understood that the first magnet 320 or the coil 330 can be connected to the shell 310 in more ways, and the present application does not limit this.

[0122] One of the first magnet 320 and the coil 330 (for example, called the first component) can be fixedly connected to the housing 310, and the other component (for example, called the second component) can be arranged opposite to the first component, and the first component and the second component can interact with each other through magnetic force, and the interaction caused by the magnetic force can drive the image sensor to displace or rotate.

[0123] In the following embodiments, the first magnet 320 is fixedly connected to the housing 310, and the coil 330 is fixedly connected to the first circuit board 400. In some examples, the first magnet 320 may be fixedly connected to the first circuit board 400, and the coil 330 may be fixedly connected to the housing 310. In other words, the first magnet 320 and the coil 330 may be relatively fixed, and when the coil 330 is passed with current, an interaction force may be generated between the first magnet 320 and the coil 330.

[0124] Since the coil 330 needs to be electrically connected, the anti-shake component 300 provided in the present application can use the first circuit board 400 as a power supply circuit (this part of the content is described in detail below), so the coil 330 can be arranged close to the first circuit board 400, or in other words, the coil 330 is fixedly connected to the first circuit board 400, which is conducive to simplifying the wiring inside the anti-shake component 300 and improving the utilization rate of the internal space of the anti-shake component 300. In the case where the interconnection line inside the first circuit board 400 is not used as the power supply line of the coil 330, or in other words, the power supply line of the coil 330 does not pass through the first circuit board 400, the number of interconnection lines in the first circuit board 400 is less, the elastic modulus of the first circuit board 400 can be larger, and under the same force, the first circuit board 400 has a larger deformation, which is more conducive to the anti-shake component 300 driving the image sensor.

[0125] like Figure 5 As shown, the first magnet 320 may include a first sub-magnet 321 , a second sub-magnet 322 , a third sub-magnet 323 and a fourth sub-magnet 324 , and these four sub-magnets may be disposed along the outer frame of the cover plate 312 .

[0126] Exemplarily, the cover plate 312 may be rectangular or approximately rectangular, and when the first magnet 320 is fixedly connected to the housing 310, the first sub-magnet 321, the second sub-magnet 322, the third sub-magnet 323 and the fourth sub-magnet 324 may be respectively arranged near the four outer frames of the cover plate 312. Among them, the first sub-magnet 321 and the third sub-magnet 323 are arranged opposite to each other, and the second sub-magnet 322 and the fourth sub-magnet 324 are arranged opposite to each other. The shape, size and magnetic field strength distribution of the four sub-magnets included in the aforementioned first magnet 320 may be basically consistent, so as to help improve the production and assembly efficiency of the anti-shake component 300.

[0127] In some examples, the first magnet 320 may include only any three sub-magnets of the first sub-magnet 321 , the second sub-magnet 322 , the third sub-magnet 323 and the fourth sub-magnet 324 , for example: the first sub-magnet 321 , the second sub-magnet 322 and the third sub-magnet 323 .

[0128] In some examples, the first magnet 320 may include two adjacent sub-magnets of the first sub-magnet 321, the second sub-magnet 322, the third sub-magnet 323, and the fourth sub-magnet 324. For example: the first sub-magnet 321 and the second sub-magnet 322, the third sub-magnet 323 and the fourth sub-magnet 324, the second sub-magnet 322 and the third sub-magnet 323, etc.

[0129] The first magnet 320 may be a single magnet. Figure 6 A schematic diagram of a single magnet is provided as an example, wherein the first magnet 320 includes an A surface and a B surface that are arranged opposite to each other. Outside the first magnet 320, magnetic flux lines are emitted from the A surface and enter the inside of the magnet from the B surface. Inside the first magnet 320, magnetic flux lines are directed from the B surface to the A surface. The direction of the arrow in the figure is used to indicate the direction of the magnetic flux lines inside the magnet.

[0130] The density of the magnetic flux lines of the first magnet 320 on the A side is similar to that on the B side. The points corresponding to the A side and the B side (for example Figure 6 The magnetic field strengths at points p1 and p2 in the figure are substantially equal, and the magnetic field strength distribution on the A side is similar to the magnetic field strength distribution on the B side. In this case, when the A side of the first magnet 320 faces the coil 330 and when the B side of the first magnet 320 faces the coil 330, the interaction force generated between the first magnet 320 and the coil 330 is substantially the same. In other words, in this case, either the A side of the first magnet 320 faces the coil 330 or the B side of the first magnet 320 faces the coil 330.

[0131] The first magnet 320 may also be a Halbach magnet. Figure 7 A schematic diagram of a Halbach magnet is provided as an example. The first magnet 320 includes an A surface and a B surface that are arranged opposite to each other. The direction of the arrow in the figure can be used to indicate the direction of the magnetic flux lines inside the first magnet 320.

[0132] The directions of the magnetic flux lines at different regions inside the first magnet 320 are different. Figure 7 The first magnet 320 shown has a higher magnetic flux density and a larger magnetic field strength on the A side, while a lower magnetic flux density and a smaller magnetic field strength on the B side. According to Ampere's law, for wires of the same length and equal current, the greater the magnetic flux density, the greater the force on the wire in the coil. In this case, it can be considered to face the A side of the first magnet to the coil 330 to increase the force on the coil.

[0133] As mentioned above, the use of Halbach magnets can increase the force generated between the first magnet 320 and the coil 330 to a certain extent, and this force can be used to drive the image sensor to displace or rotate. In other words, compared with a single magnet, the Halbach magnet can increase the driving force of the anti-shake component 300 on the image sensor to a certain extent. From another perspective, in order to obtain an equal driving force, the use of Halbach magnets requires a smaller driving current and a smaller coil length (or volume) than the use of a single magnet.

[0134] It should be noted that Figure 7 The structure of a Halbach magnet is merely provided as an example. The Halbach magnet may also be in other shapes such as annular or circular. These Halbach magnets in different forms may be applied to the anti-shake assembly 300 , and the present application does not impose any limitation on this.

[0135] The coil 330 may be arranged in cooperation with the first magnet 320 , so that when the coil 330 is energized, an interaction force may be generated between the coil 330 and the first magnet 320 .

[0136] like Figure 4 As shown, when the first magnet 320 is fixedly connected to the shell 310, the coil 330 can be arranged directly below the first magnet 320, or in other words, the coil 330 and the first magnet 320 can be stacked along the direction of the optical axis OO', and the coil 330 is located on the side close to the first circuit board 400, and the first magnet 320 is located on the side close to the cover 311 of the shell 310.

[0137] In some examples, combined Figure 4 and Figure 8 As shown, the coil 330 may include a first sub-coil 331A, a second sub-coil 332A, a third sub-coil 333A, a fourth sub-coil 331B, a fifth sub-coil 332B and a sixth sub-coil 333B.

[0138] The first sub-coil 331A and the fourth sub-coil 331B can be regarded as a first sub-coil group, which can interact with the first magnet 320 arranged opposite thereto, so as to generate a Fig. 9 The second sub-coil 332A and the fifth sub-coil 332B can be regarded as a second sub-coil group, which can interact with the first magnet 320 arranged opposite thereto, so that the second sub-coil group can be used to generate Fig. 9 Similarly, the third sub-coil 333A and the sixth sub-coil 333B can be regarded as a third sub-coil group, which can be used to generate a force in the positive direction of the Y axis or in the negative direction of the Y axis. Fig. 9The force along the positive direction of the Y axis or along the negative direction of the Y axis.

[0139] Combination Figure 8 and Fig. 9 In some examples, the forces F1 and F2 acting on the first sub-coil group both pass through the optical axis OO', that is, the length of the force arm of F1 and F2 acting on the optical axis is zero, and F1 and F2 cannot generate a torque that causes the first sub-coil group to rotate.

[0140] In some examples, the forces F3 and F4 acting on the second sub-coil group do not pass through the optical axis OO', and F3 and F4 can generate a torque that causes the second sub-coil group to rotate around the optical axis OO'. Exemplarily, by controlling the shapes of the second sub-coil 332A and the fifth sub-coil 332B and the magnitude of the current passing therethrough, so that the magnitude of the torque acting on the second sub-coil 332A and the magnitude of the torque acting on the fifth sub-coil 332B are equal and the direction is the same, the combined torque of the second sub-coil group can drive the first circuit board 400 fixedly connected thereto to rotate.

[0141] In some examples, the forces acting on the third sub-coil group do not pass through the optical axis OO', and the forces acting on the third sub-coil group can generate a torque that causes the third sub-coil group to rotate around the optical axis OO'. Exemplarily, the torque acting on the third sub-coil 333A and the torque acting on the sixth sub-coil 333B have the same direction and are equal in magnitude, and the third sub-coil group can drive the first circuit board 400 fixedly connected thereto to rotate.

[0142] In some examples, in order to control the size of the driving force that the anti-shake module 300 can generate to drive the image sensor to translate or rotate, the controller can control the size of the current passing through one or more sub-coils included in the coil 330, or the controller can simultaneously energize one or more sub-coils in the coil 330, that is, use one or more sub-coils in the coil 330 in combination.

[0143] For example, the coil 330 may include a plurality of Fig. 9 In the case where the image sensor needs to move a small distance along the X-axis direction, it can be achieved by passing current through a smaller number of sub-coils, for example, passing current only through the first sub-coil 331A, or passing a smaller current through the same coil. Correspondingly, when the image sensor needs to move a large distance along the X-axis direction, it can be achieved by passing current through a larger number of sub-coils, for example, passing current through the first sub-coil 331A and the fourth sub-coil 331B at the same time, or passing a larger current through the same coil.

[0144] Also exemplarily, the coil 330 may include a plurality of sub-coils (such as the aforementioned second sub-coil 332A, third sub-coil 333A, fifth sub-coil 332B and sixth sub-coil 333B) for generating a driving force for driving the image sensor to rotate around the optical axis OO'. In the case where the image sensor needs to rotate around the optical axis OO' by a smaller angle, this can be achieved by passing current through a smaller number of sub-coils, for example, passing current only through the second sub-coil 332A, or passing a smaller current through the same coil. In the case where the image sensor needs to rotate around the optical axis OO' by a larger angle, this can be achieved by passing current through a larger number of sub-coils, for example, passing current through the second sub-coil 332A, the third sub-coil 333A, the fifth sub-coil 332B and the sixth sub-coil 333B at the same time, or passing a larger current through the same coil.

[0145] In addition, when multiple sub-coils are capable of generating the same type of driving force, different numbers of turns can be set for different sub-coils (e.g., the second sub-coil 332A and the third sub-coil 333A), so that for the same current, coils with different numbers of turns can generate different driving forces. When a smaller driving force is required, current can be passed through the coil with fewer turns, that is, the driving force is provided by the coil with fewer turns; when a larger driving force is required, current can be passed through the coil with more turns, that is, the driving force is provided by the coil with more turns.

[0146] The above only provides some exemplary ways of controlling the size and direction of the driving force generated by the coil 330 by controlling the properties of the coil, the size of the current inside the coil and the combination of coils. It should be understood that the above control methods should not be regarded as limitations on the embodiments of the present application.

[0147] In some examples, the coil 330 may include a portion of the aforementioned plurality of sub-coils, for example, the coil 330 may include only the first sub-coil 331A and the second sub-coil 332A. In this case, the first sub-coil 331A is used to generate the Fig. 9 The second sub-coil 332A is used to generate a force in the positive direction of the X-axis or in the negative direction of the X-axis. Fig. 9 The second sub-coil 332A can also be used to generate a force along the positive direction of the Y-axis or along the negative direction of the Y-axis, and the second sub-coil 332A can also be used to generate a torque acting on the second sub-coil 332A with the optical axis OO' as the rotation axis.

[0148] For another example, the coil 330 may include only a first sub-coil 331A, a second sub-coil 332A, and a third sub-coil 333A. In this case, the first sub-coil 331A is used to generate an edge Fig. 9The second sub-coil 332A and / or the third sub-coil 333A are used to generate a force in the positive direction of the X-axis or in the negative direction of the X-axis. Fig. 9 The second sub-coil 332A and / or the third sub-coil 333A can also be used to generate a torque acting on the second sub-coil 332A or the third sub-coil 333A with the optical axis OO' as the rotation axis.

[0149] The coil 330 may also include other combinations of multiple sub-coils in the first sub-coil 331A to the sixth sub-coil 333B, and the multiple sub-coils can meet the following requirements: Fig. 9 The force in the X-axis direction or the Y-axis direction may also generate a torque acting on the second coil group or the third coil group with the optical axis OO' as the rotation axis.

[0150] As described above, when the coil 330 is energized, the coil 330 can generate a force or torque. In some examples, the coil 330 can be fixedly connected to the connecting arm 420 of the first circuit board 400, so that the force or torque can form a driving force that causes the first circuit board 400 to translate or rotate.

[0151] For example, the force generated by the coil 330 can act on the connecting arm 420 of the first circuit board 400. The connecting arm 420 will deform and generate stress after being subjected to the force. The stress can act on the fixed outer frame 410 and the movable platform 430 fixedly connected to the connecting arm 420. Since the fixed outer frame 410 is fixedly connected to the cover 310 or the bottom plate 340, it is difficult to cause obvious deformation or displacement, while the movable platform 430 can be displaced accordingly under the action of the connecting arm 420. Similarly, after the torque acts on the connecting arm 420, the connecting arm 420 can be deformed, thereby driving the movable platform 430 to rotate accordingly.

[0152] In some examples, the coil 330 may be fixedly connected to the movable platform 430 of the first circuit board 400 , so that the force or torque may form a driving force that causes the movable platform 430 to translate or rotate.

[0153] Exemplarily, the force generated by the coil 330 can act on the movable platform 430 of the first circuit board 400, causing the connecting arm 420 fixedly connected to the movable platform 430 to deform or displace accordingly, thereby achieving translation or rotation of the movable platform 430.

[0154] In general, the coil 330 may include at least coil #A and coil #B, wherein coil #A may generate a first force with the first magnet 320 when powered on, and coil #B may generate a second force with the first magnet 320 when powered on. In other words, when powered on, coil #A may be subjected to the first force, and coil #B may be subjected to the second force. Here, the direction of the first force and the direction of the second force may be perpendicular to each other, and at least one of the first force and the second force does not pass through the optical axis OO'. In this way, the coil 330 can drive the image sensor on the anti-shake assembly 300 to displace and / or rotate.

[0155] It should be noted that the anti-shake component 300 does not need to implement Fig. 9 In the case of the anti-shake function in the X direction, the coil 330 may not include a Fig. 9 Similarly, the anti-shake component 300 does not need to implement the force along the X-axis direction. Fig. 9 In the case of the anti-shake function in the Y direction, the coil 330 may not include a device for generating an anti-shake function along the Y direction. Fig. 9 In the case where the anti-shake assembly 300 does not need to realize the function of anti-shake around the optical axis OO', the coil 330 may not include a coil for generating a torque around the optical axis OO'.

[0156] Fig.10 A structure of a first circuit board 400 is exemplarily provided, and the first circuit board 400 may include a fixed outer frame 410, a connecting arm 420 and a movable platform 430, wherein the connecting arm 420 is located between the fixed outer frame 410 and the movable platform 430, and the connecting arm 420 is used to connect the fixed outer frame 410 and the movable platform 430.

[0157] The first circuit board 400 can be fixedly connected to the coil 330. When an interaction force is generated between the coil 330 and the first magnet 320, the coil 330 can drive the first circuit board 400 to displace or rotate, so that the image sensor installed on the first circuit board 400 can move with the movement of the first circuit board 400.

[0158] The coil 330 can be fixedly connected to the movable platform 430 of the first circuit board 400, and the coil 330 can directly push the movable platform to move or rotate. The coil 330 can also be fixedly connected to the connecting arm 420 of the first circuit board 400, and the deformation and / or displacement of the connecting arm 420 can push the movable platform 430 to move or rotate.

[0159] In some examples, combined Fig.10 and Fig.11The fixed outer frame 410 is generally in the shape of a square frame, and the fixed outer frame 410 is used to fix the first circuit board 400 in the accommodation space between the cover body 310 and the bottom plate 340. In some examples, the first circuit board 400 can be fixedly connected to the housing 310 through the fixed outer frame 410.

[0160] In some examples, the fixed outer frame 410 may be provided with a connecting portion 411, and the first connecting portion 411 is connected to one end of the connecting arm 420. Fig.11 As shown, the fixed outer frame 410 may include four sub-connection parts (respectively, a first sub-connection part 411A, a second sub-connection part 411B, a third sub-connection part 411C, and a fourth sub-connection part 411D), each of which may be provided with one or more connection points, and the connection points on each sub-connection part may be used to connect with one end of the connection arm 420. The four sub-connection parts are centrally symmetrical about the rotation center of the first circuit board 400, and the connection points provided on the four sub-connection parts may also be centrally symmetrical about the rotation center O of the first circuit board 400.

[0161] In other words, Fig.11 The fixed outer frame 410 shown may include 8 connection points, of which two connection points form a group, forming 4 groups of connection points, and the positions of the 4 groups of connection points on the fixed outer frame 410 are centrally symmetrical about the rotation center O of the first circuit board 400. The 4 groups of connection points are fixedly connected to one end of the 4 groups of connection arms respectively.

[0162] The connecting arm 420 is used to connect the fixed outer frame 410 and the movable platform 430. The number of the connecting arms 420 can be multiple. Fig.10 and Fig.12 The first circuit board 400 may include eight connecting arms 420, wherein two connecting arms form a group, forming four groups of connecting arms. The four groups of connecting arms 420 are substantially centrally symmetrical about the rotation center O of the first circuit board 400. Each of the eight connecting arms 420 is connected to the fixed outer frame 410 at one end and to the movable platform 430 at the other end.

[0163] like Fig.10 As shown, a certain interval can be set between the connecting arm 420 and the fixed outer frame 410, between the connecting arm 420 and the movable platform, and between two adjacent connecting arms in the same group of connecting arms. Therefore, when the connecting arm 420 is deformed or displaced by force, the aforementioned interval can provide deformation or displacement space for the connecting arm 420, which is conducive to the force between the coil 330 and the first magnet 320 to drive the movable platform 430 to displace or rotate.

[0164] In some examples, the connecting arms 420 may include a first group of connecting arms, a second group of connecting arms, a third group of connecting arms, and a fourth group of connecting arms. The first group of connecting arms includes the first connecting arm and the second connecting arm, the second group of connecting arms includes the third connecting arm and the fourth connecting arm, the third group of connecting arms includes the fifth connecting arm and the sixth connecting arm, and the fourth group of connecting arms includes the seventh connecting arm and the eighth connecting arm.

[0165] For example, Fig.12 As shown, the first group of connecting arms is located at the upper right corner, the second group of connecting arms is located at the lower right corner, the third group of connecting arms is located at the lower left corner, and the fourth group of connecting arms is located at the upper left corner. The first group of connecting arms includes a first connecting arm 421 and a second connecting arm 422. In some examples, a connecting rod 423 may be provided between the first connecting arm 421 and the second connecting arm 422. The connecting rod 423 may be used to achieve relative fixation between the first connecting arm 421 and the second connecting arm 422, or in other words, when the connecting rod 423 is provided, the deformation of the first connecting arm 421 and the deformation of the second connecting arm 422 may be relatively synchronized, or the displacement of the first connecting arm 421 and the displacement of the second connecting arm 422 may be relatively synchronized, thereby being more conducive to achieving the control of the movable platform 430 by the first group of connecting arms.

[0166] The connecting rod 423 may have the same structure as the first connecting arm 421 and / or the second connecting arm 422. For example, when interconnecting wires are arranged inside the first connecting arm 421 and the second connecting arm 422, interconnecting wires may also be laid inside the connecting rod 423, so that the interconnecting wires inside the first connecting arm 421 and the second connecting arm 422 can be electrically connected through the interconnecting wires inside the connecting rod 423, thereby providing flexibility in the arrangement of interconnecting wires inside the first circuit board 400. The relevant contents of the interconnecting wires are described in detail below and will not be expanded here.

[0167] One or more connecting rods may be provided between multiple connecting arms in the same group of connecting arms, and the connecting rods may be located at the position where the force direction changes on the connecting arms. Fig.12 In the embodiment, the first connecting arm 421 includes a horizontal portion and a vertical portion connected to each other. The force direction of the connecting arm is generally along the axis direction of the arm. The position where the connecting rod 423 is set on the first connecting arm 421 can be the connection between the horizontal portion and the vertical portion. The connecting rod can also be set at other positions of the connecting arm. For example, the connecting rod can also be set at one end of the connecting arm close to the fixed outer frame 410, and the connecting rod can also be set at one end of the connecting arm close to the movable platform 430. The present application does not limit this. The connecting rod can be perpendicular to the connecting arm, thereby reducing the length of the connecting rod. The connecting rod can also be set obliquely with the connecting arm, which is conducive to improving the flexibility of the setting of the connecting rod.

[0168] The first circuit board 400 may further include more or fewer connecting arms 420, for example, the first circuit board 400 may include 2 or 6 connecting arms 420. The multiple connecting arms 420 may be centrally symmetrical about the rotation center O of the first circuit board 400, and a smaller number of connecting arms may simplify the structure of the first circuit board 400 and improve the production efficiency of the first circuit board 400. A larger number of connecting arms is beneficial to improving the reliability and stability of the force between the coil 330 and the first magnet 320 to drive the image sensor 220.

[0169] In some examples, such as Fig.13 As shown, the connecting arm 420 includes a first connecting end 424A and a second connecting end 424B. The first connecting end 424A is fixedly connected to the fixed outer frame 410 , and the second connecting end 424B is fixedly connected to the movable platform 430 .

[0170] In some examples, the angle between the line connecting the first connection end 424A of the connection arm 420 and the rotation center O of the first circuit board 400 and the line connecting the second connection end 424B and the rotation center O of the first circuit board 400 is greater than or equal to 90°, or in other words, the angle between the line connecting the first connection end 424A of the connection arm 420 and the rotation center O of the first circuit board 400 and the line connecting the second connection end 424B and the rotation center O of the first circuit board 400 is a non-acute angle. Here, the direction from the rotation center O to the first connection end 424A or the second connection end 424B is the positive direction of both sides of the angle.

[0171] The above technical solution can also be understood as: taking the rotation center O of the multiple connecting arms 420 as the symmetry center, two mutually perpendicular straight lines passing through the rotation center can divide the plane formed by the multiple connecting arms 420 into the following Fig.12 The connecting arm 420 should pass through at least two of the four quadrants.

[0172] In some examples, the connecting arm 420 may pass through two of the above four quadrants, for example, the connecting arm 420 may pass through quadrants I and II, or through quadrants II and III, or through quadrants IV and I.

[0173] In some examples, the connecting arm 420 can pass through three of the above-mentioned four quadrants, for example, the connecting arm 420 can pass through quadrants I, II and III, or through quadrants II, III and IV, or through quadrants III, IV and I, etc.

[0174] In some examples, the connecting arm 420 may pass through the above four quadrants at the same time, that is, the connecting arm 420 may pass through the following four quadrants: Fig.12 Quadrants I, II, III and IV are shown.

[0175] The connecting arm 420 may be composed of multiple connecting arms, and the multiple connecting arms may be formed into different shapes. In other words, the connecting arm 420 may have a variety of different shapes. For example, Fig.10 or Fig.13 In the embodiment, the connecting arm 420 is substantially in an "L" shape. In some examples, the connecting arm 420 can also be substantially in a "U" shape, a "Z" shape, etc. Fig.14 Some possible shapes of the connecting arms 420 are provided as examples. In these connecting arms 420, each connecting arm includes a first end connected to the fixed outer frame 410 and a second end connected to the movable platform, and the angle α formed between the line connecting the first end and the rotation center O and the connection between the second end and the rotation center O is greater than or equal to 90°.

[0176] like Fig.14 In (a), the connecting arm 420 can be regarded as comprising three connecting arms, two adjacent connecting arms are perpendicular to each other, and the connecting arm 420 is roughly in a "U" shape. The angle formed by the line between the two ends of the connecting arm and the rotation center O is an obtuse angle, that is, the angle α in the figure is greater than 90°. Fig.14 The connecting arm 420 shown in (a) can also be regarded as having passed through the Fig.12 Three of the four quadrants shown.

[0177] like Fig.14 In (b), the connecting arm 420 can be regarded as comprising four sub-connecting arms, and the angle formed between two adjacent sub-connecting arms 420 can be an acute angle, a right angle or an obtuse angle, for example, Fig.14 In (b), β1<90°, β2>90°, β3=90°. The angle formed by the line between the two ends of the connecting arm and the rotation center O is an obtuse angle, that is, the angle α in the figure is>90°. Fig.13 The connecting arm 420 shown in (b) can also be regarded as having passed through the Fig.12 Four of the four quadrants shown.

[0178] like Fig.14 In (c), the connecting arm 420 can be regarded as comprising three sub-connecting arms, and two adjacent sub-connecting arms 420 are perpendicular to each other, and the connecting arm 420 is roughly in a "Z" shape. The angle formed by the line between the two ends of the connecting arm and the rotation center O is approximately a straight angle, that is, the angle α in the figure is 180°. Fig.14 The connecting arm 420 shown in (c) can also be regarded as having passed through the Fig.12Three of the four quadrants shown.

[0179] like Fig.14 In (d), the connecting arm 420 may be a curved rod, and the angle formed by the line connecting the two ends of the connecting arm and the rotation center O is an obtuse angle, that is, the angle α in the figure is greater than 90°. Fig.14 The connecting arm 420 shown in (d) can also be regarded as having passed through the Fig.12 Three of the four quadrants shown.

[0180] Fig.15 An active platform 430 is exemplarily provided. The active platform 430 is substantially in the shape of a square frame. An internal opening 432 of the active platform 430 can be used to accommodate an image sensor.

[0181] The movable platform 430 may be provided with a second connecting portion 431, and the second connecting portion 431 is connected to the other end of the connecting arm 420 connected to the fixed outer frame 410. For example, Fig.15 In the embodiment, the movable platform 430 may include four sub-connecting parts (respectively, a fifth sub-connecting part 431A, a sixth sub-connecting part 431B, a seventh sub-connecting part 431C, and an eighth sub-connecting part 431D). Each of the four sub-connecting parts may be provided with one or more connection points, and the connection points on each sub-connecting part may be used to connect with one end of the connecting arm 420. The four connecting parts are symmetrical about the rotation center of the first circuit board 400, and the connection points provided on the four sub-connecting parts may also be symmetrical about the rotation center of the first circuit board 400.

[0182] In other words, each sub-connection portion on the movable platform 430 can be connected to the ends of multiple connecting arms at the same time. Fig.10 and Fig.15 , one sub-connection portion of the movable platform 430 can be connected to the ends of the two connecting arms 420 at the same time. Fig.15 The movable platform 430 shown may include 8 connection points, of which two connection points form a group, forming 4 groups of connection points, and the positions of the 4 groups of connection points on the movable platform 430 are centrally symmetrical about the rotation center O of the first circuit board 400. The 4 groups of connection points are respectively fixedly connected to one end of the 4 groups of connection arms away from the fixed outer frame 410.

[0183] refer to Fig.10 and Fig.11 , interconnection wires may be laid inside the first circuit board 400, or in other words, interconnection wires may be laid inside the fixed outer frame 410, the connecting arm 420 and the movable platform 430 of the first circuit board 400, and the interconnection wires may be used to connect the electronic components inside the anti-shake assembly 300 with the external power supply.

[0184] In some examples, the fixed outer frame 410 may be provided with an extension portion 412, on which a power interface (e.g., a B2B interface) is provided, one end of which may be connected to an external power supply, and the other end of which may be connected to an interconnection line inside the first circuit board 400, thereby achieving electrical conduction between the internal interconnection line of the first circuit board 400 and the external power supply.

[0185] The interconnection line laid in the fixed outer frame 410 can be called a first interconnection line, and the power interface on the extension portion 412 can be connected to the first interconnection line. The interconnection line laid in the connecting arm 420 can be called a second interconnection line, and the interconnection line laid in the movable platform 430 can be called a third interconnection line. One end of the second interconnection line can be connected to (or electrically connected to) an end of the first interconnection line away from the power interface, and the other end of the second interconnection line can be connected to (or electrically connected to) the third interconnection line. The other end of the third interconnection line connected to the second interconnection line can be connected to electronic components such as image sensors on the anti-shake assembly 300.

[0186] Electrical connection points (e.g., pins or contacts) may be provided on the inner sidewalls of the movable platform 430, and the electrical connection points may be used to electrically connect to electronic components such as image sensors, so that the external power provided via the power interface of the first circuit board 400 can power the image sensor. In some examples, the electrical connection points may also be used to power the coil 330 and other electronic components (e.g., control chips, Hall components, etc.) in the aforementioned anti-shake assembly 300.

[0187] Fig.16 An exemplary embodiment provides a Fig.10 AA section diagram of the first circuit board 400. In the AA section, the solid part located on the outside is the section of the fixed outer frame 410, the section between the fixed outer frame 410 is the section of the connecting arm 420, and the section located in the middle area of ​​the AA section is the section of the movable platform 430. As shown in the figure, the first interconnection line 401 can be laid in the fixed outer frame 410, the second interconnection line 402 can be laid in the connecting arm 420, and the third interconnection line 403 can be laid in the movable platform 430.

[0188] The number of the first interconnection line 401, the second interconnection line 402, and the third interconnection line 403 may be one or more. In the case where the number of interconnection lines is multiple, the multiple interconnection lines may be stacked, and a dielectric layer is provided between the multiple interconnection lines. The dielectric layer may be a poor conductor, or the conductivity of the dielectric layer is less than a preset threshold. For example, the dielectric layer may be made of an organic material with low conductivity such as epoxy resin.

[0189] When the same connection part of the fixed outer frame 410 and the same connection part of the movable platform 430 are connected to each other through multiple connection arms 420, and a connection rod is provided between the multiple connection arms 420, an interconnection line may also be laid inside the connection rod, and the interconnection line inside the connection rod may be used to connect the interconnection lines inside the two connection arms 420. Alternatively, the connection rod may be made of a conductive material (e.g., a metal material), or the connection rod may include a conductive part, and the connection rod or the conductive part of the connection rod may be used to connect the interconnection lines inside the two connection arms. When the connection rod is made of a metal material, the connection rod may also be called a metal flexure.

[0190] In some examples, the first circuit board 400 can be prepared by laminating multiple conductive layers and multiple dielectric layers and then pressing them together to form a plate, and then hollowing out a local area of ​​the plate structure (for example, the area between multiple connecting arms 420, the spacing area between the connecting arm 420 and the fixed outer frame 410, the spacing area between the connecting arm 420 and the movable platform 430, and the opening area in the middle of the movable platform, etc.). Among them, the conductive layer is a structure including the aforementioned first interconnection line 401, the second interconnection line 402 and the third interconnection line 403, and the dielectric layer is a structure that is arranged between the conductive layers and has an insulating effect.

[0191] In some examples, the conductive layer and the dielectric layer may be pre-processed as follows: Fig.10 The shape of the first circuit board 400 is formed by laminating the multiple conductive layers and the multiple dielectric layers to form the first circuit board 400.

[0192] In some examples, the fixed outer frame 410, the connecting arm 420, and the movable platform 430 of the first circuit board 400 can be prepared separately, and the first circuit board 400 can be prepared by connecting the fixed outer frame 410, the connecting arm 420, and the movable platform 430 as shown in the following figure. Fig.10 The shapes shown are assembled.

[0193] The above only provides some exemplary methods for preparing the first circuit board 400 , and these methods should not be understood as limiting the first circuit board 400 in the present application.

[0194] Combination Figure 4 and Fig.17 The anti-shake assembly 300 may further include a support plate 360, which may be disposed between the first circuit board 400 and the bottom plate 340. The support plate 360 ​​may reduce direct friction between the image sensor and the bottom plate 340, thereby reducing wear on the image sensor.

[0195] In some examples, an opening may be provided in the middle region of the support plate 360, and the position of the opening may correspond to the position of the opening in the middle region of the movable platform 430 on the first circuit board 400. When the image sensor is mounted at the opening position of the movable platform 430, the opening provided on the support plate 360 ​​may be used to accommodate a portion of the image sensor, which may be referred to as a protrusion of the image sensor.

[0196] In some examples, the size and shape of the opening of the support plate 360 ​​may be determined by the shape and size of the protrusion of the image sensor. For example, when the image sensor is mounted on the movable platform 430, the protrusion of the image sensor may be stuck in the opening of the support plate 360. When the image sensor is in the process of translation or rotation, the image sensor may drive the support plate 360 ​​to translate or rotate.

[0197] One or more feet 361 may be provided on the side of the support plate 360 ​​facing the bottom plate 340, and the height of the feet 361 may be greater than the height of the protrusion of the image sensor extending out of the opening of the support plate 360 ​​when the protrusion is clamped on the support plate 360. In this way, when the image sensor drives the support plate 360 ​​to move, the feet of the support plate 360 ​​may contact the bottom plate 340, thereby facilitating the image sensor to avoid direct contact with the bottom plate 340 and reducing the probability of wear and damage to the image sensor.

[0198] The number of the feet provided on the support plate 360 ​​may be multiple, for example, Fig.17 As shown, the support plate 360 ​​may include three feet, namely a first foot 361A, a second foot 361B and a third foot 361C. The positions of the three feet may be centrally symmetrical about the rotation center O of the support plate 360. The heights of the three feet may be substantially the same, so that the contact between the support plate 360 ​​and the base plate 340 is relatively stable, and the probability of causing jitter in the optical axis direction is small.

[0199] The support plate 360 ​​may also be provided with other numbers or positions of feet. For example, the number of the feet may be four, and the feet may be distributed in an axisymmetric manner about the axis of symmetry of the support plate 360 ​​. Fig.17 This is only an exemplary description and should not be construed as limiting the present application.

[0200] In some examples, a friction medium (or lubricating material), such as grease, may be filled between the support plate 360 ​​and the bottom plate 340. In some examples, a surface coating may be provided on one side of the support plate 360 ​​facing the bottom plate 340, and the surface coating may be used to reduce the friction between the support plate 360 ​​and the bottom plate 340.

[0201] In order to improve the stability of the friction between the support plate 360 ​​and the bottom plate 340, and reduce the probability of the support plate 360 ​​shaking during the friction process. In some examples, the bottom plate 340 can be composed of a magnetic material, and the magnetic material can contain one or more of iron, cobalt or nickel. The anti-shake component 300 can also include a second magnet, which can be arranged directly above the first circuit board 400. The second magnet and the bottom plate 340 can generate mutual attraction, so that the first circuit board 400 and the support plate 360 ​​located between the second magnet and the bottom plate 340 can be pressed on the bottom plate 340. The position of the second magnet can correspond to the position of the pad 261 on the support plate 360. When the second magnet generates attraction with the bottom plate 340, the pad 361 in direct contact with the bottom plate 340 can be subjected to pressure perpendicular to the bottom plate 340, so that the contact between the pad 361 and the bottom plate 340 is more firm, and the nature and magnitude of the friction between the two are more stable and reliable.

[0202] In some examples, such as Figure 4 As shown, the support plate 360 ​​may be located inside the bottom plate 340. Since the support plate 360 ​​has a certain thickness, and the support plate 360 ​​is disposed between the bottom plate 340 and the first circuit board 400, there is a portion of a spaced area between the first circuit board 400 and the bottom plate 340 at the periphery of the support plate 360. In some examples, such as Figure 4 As shown, a sleeve such as Fig.18 The support frame 370 shown in the figure may have a thickness that matches the height of the spacing space between the first circuit board 400 and the bottom plate 340. Specifically, when the support plate 360 ​​is not provided with the foot 361, the thickness of the support frame 370 may be similar to or the same as the thickness of the support plate 360. When the support plate 360 ​​is provided with the foot 361, the thickness of the support frame 370 may be similar to or the same as the sum of the thickness of the support plate 360 ​​and the height of the foot 361.

[0203] In some embodiments, the support frame 370 can be placed between the fixed outer frame 410 of the first circuit board 400 and the bottom plate 340. In other words, the support frame 370 can avoid the connecting arm 420 of the first circuit board 400, so that when the connecting arm 420 is deformed or displaced by the driving force, the friction force caused by the contact between the connecting arm 420 and other components will not have an adverse effect on the deformation or displacement of the connecting arm 420.

[0204] In some examples, combined Figure 4 and Fig.19, the anti-shake assembly 300 may further include a second circuit board 350, which may be disposed directly above the first circuit board 400. The second circuit board 350 may also be referred to as a fixing plate 350, which may be used to fix the components included in the anti-shake assembly 300. For example, the second circuit board 350 may be used to fix the coil 330 or the first magnet 320. In this case, the second circuit board 350 may be fixedly connected to the first circuit board 400.

[0205] In some examples, the second circuit board 350 can be fixedly connected to the movable platform 430 of the first circuit board 400. When magnetic force is generated between the coil 330 and the first magnet 320, the second circuit board 350 can directly drive the movable platform 430 to displace or rotate under the drive of the coil 330 or the first magnet 320.

[0206] The interaction force between the coil 330 and the first magnet can directly push the movable platform 430 , so the conversion efficiency of mechanical energy into kinetic energy is higher, and the energy utilization efficiency of the anti-shake component 300 is higher.

[0207] In some examples, the second circuit board 350 may also be fixedly connected to the connecting arm 420 of the first circuit board 400. When a magnetic force is generated between the coil 330 and the first magnet 320, the second circuit board 350 may drive the connecting arm 420 to displace or deform under the drive of the coil 330 or the first magnet 320, thereby causing the image sensor installed on the first circuit board 400 to translate or rotate.

[0208] The solution of fixedly connecting the second circuit board 350 and the connecting arm 420 can be regarded as an alternative solution. When the area of ​​the movable platform 430 is limited, or it is difficult to fix the second circuit board 350 and the movable platform 430, it can be considered to use the connecting arm 420 to fix the second circuit board 350. This is beneficial to improving the space utilization efficiency inside the anti-shake component 300 to a certain extent.

[0209] The second circuit board 350 and the first circuit board 400 can be fixedly connected by one or more of welding, riveting, etc., and the present application does not limit this. The second circuit board 350 and the first circuit board 400 can be electrically connected, so that the second circuit board 350 can obtain external power supply through the power interface of the first circuit board 400.

[0210] The second circuit board 350 may also be used to fix the aforementioned second magnet, and the second circuit board 350 may also be used to install one or more electronic components such as a Hall sensor and a controller.

[0211] The anti-shake assembly 300 provided in the embodiment of the present application can realize electrical connection between electronic components (for example, the image sensor 220) inside the anti-shake assembly 300 and an external power supply by laying interconnection lines inside the first circuit board 400.

[0212] The interaction force between the first magnet 320 and the coil 330 inside the anti-shake component 300 can be used to drive the movable platform 430 on the first circuit board 400 to displace or rotate. When the movable platform 430 is displaced or rotated, the image sensor 220 mounted on the movable platform 430 can be displaced or rotated accordingly. The Hall sensor and other sensors inside the anti-shake component 300 can determine the target displacement and / or target deflection angle of the image sensor 220. The controller inside the anti-shake component 300 can control the interaction force between the coil 330 and the first magnet 320 by controlling the magnitude and direction of the current in the coil 330, so that the image sensor 220 is translated by the target displacement and / or rotated by the target deflection angle, thereby realizing anti-shake of the image sensor 220.

[0213] In addition, since the interconnection wires for power supply are laid inside the connecting arm 420, the connecting arm 420 can drive the interconnection wires inside it to rotate together when it rotates. The first circuit board 400 is arranged inside the anti-shake component 300 to ensure good rotation anti-shake performance of the anti-shake component 300 while supplying power.

[0214] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0215] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An anti-shake component for an image sensor, characterized in that: include: a housing, a first magnet, a coil and a first circuit board, The first magnet, the coil and the first circuit board are accommodated in the housing. The first circuit board includes: an outer frame, a connecting arm, a movable platform and interconnection lines, The outer frame includes a first interface, and the first interface is used to connect an external power supply of the anti-shake component; A gap is provided between the movable platform and the outer frame, and the movable platform is used for loading the image sensor; The connecting arm is located in the gap, the connecting arm connects the outer frame and the movable platform, there are multiple connecting arms, and the multiple connecting arms are centrally symmetrical about the rotation center of the first circuit board; The interconnection line is located inside the first circuit board, and the interconnection line connects the first interface and the image sensor; The first magnet or the coil is fixedly connected to the movable platform, and when current is passed through the coil, the first magnet or the coil drives the movable platform to translate or rotate.

2. The anti-shake assembly according to claim 1, characterized in that: The first end of the connecting arm is connected to the outer frame, the second end of the connecting arm is connected to the movable platform, and the angle formed by the line connecting the first end and the rotation center and the line connecting the second end and the rotation center is greater than or equal to 90°.

3. The anti-shake assembly according to claim 1 or 2, characterized in that: There are multiple connecting arms, and the multiple connecting arms include a first connecting arm and a second connecting arm. The first connecting arm and the second connecting arm are both used to connect the first connecting portion of the outer frame and the second connecting portion of the movable platform.

4. The anti-shake assembly according to claim 3, characterized in that: A connecting rod is connected between the first connecting arm and the second connecting arm.

5. The anti-shake assembly according to claim 4, characterized in that: The connecting rod includes a conductive portion, and the conductive portion is used to conduct a first interconnection line located inside the first connecting arm and a second interconnection line located inside the second connecting arm.

6. The anti-shake assembly according to any one of claims 1 to 5, characterized in that: There are multiple interconnection lines, and the multiple interconnection lines are located at different positions in the thickness direction of the first circuit board.

7. The anti-shake assembly according to any one of claims 1 to 6, characterized in that: The connecting arm includes a plurality of sub-connecting arms, and an angle formed between two adjacent sub-connecting arms among the plurality of sub-connecting arms is equal to 90°.

8. The anti-shake assembly according to any one of claims 1 to 7, characterized in that: The anti-shake assembly also includes a bottom plate and a support plate. The bottom plate is located at a side of the first circuit board away from the cover plate of the housing, the support plate is located between the first circuit board and the bottom plate, and the support plate is in contact with the bottom plate.

9. The anti-shake assembly according to claim 8, characterized in that: The movable platform includes a first opening, the supporting plate includes a second opening, the first opening is communicated with the second opening, and the first opening and the second opening are used to accommodate the image sensor.

10. The anti-shake assembly according to claim 8 or 9, characterized in that: A pad is provided on one side of the support plate facing the bottom plate, and the pad is in contact with the bottom plate.

11. The anti-shake assembly according to any one of claims 8 to 10, characterized in that: The anti-shake component also includes a second magnet. The bottom plate is made of magnetic material. The second magnet is located above the movable platform. The second magnet and the bottom plate attract each other.

12. The anti-shake assembly according to any one of claims 9 to 11, characterized in that: The anti-shake component also includes a support frame, which is located between the bottom plate and the first circuit board, and the support frame is located on the outside of the support plate. The thickness of the support frame is the same as the height of the support plate.

13. The anti-shake assembly according to claim 12, characterized in that: The support frame avoids the connecting arm.

14. The anti-shake assembly according to any one of claims 1 to 13, characterized in that: The coil includes a first sub-coil and a second sub-coil, the first sub-coil is used to drive the movable platform to translate along a first direction, and the second sub-coil is used to drive the movable platform to translate along a second direction, and the first direction is perpendicular to the second direction.

15. The anti-shake assembly according to any one of claims 1 to 14, characterized in that: The coil includes a third sub-coil, and the third sub-coil is used to drive the movable platform to rotate around the rotation center of the first circuit board.

16. The anti-shake assembly according to any one of claims 1 to 15, characterized in that: The first magnet is a Halbach magnet.

17. The anti-shake assembly according to any one of claims 1 to 16, characterized in that: The anti-shake component also includes a fixing plate, the fixing plate is fixedly connected to the movable platform, and the first magnet or the coil is fixed on the fixing plate.

18. A circuit board, characterized in that: include: Outer frame, connecting arm, movable platform and interconnecting wires, The outer frame is provided with a first interface, and the first interface is used to connect the external power supply of the anti-shake component; A gap is provided between the movable platform and the outer frame, and the movable platform is used for loading the image sensor; The connecting arm is located in the gap, the connecting arm connects the outer frame and the movable platform, there are multiple connecting arms, and the multiple connecting arms are centrally symmetrical about the rotation center of the circuit board; The interconnection line is located inside the circuit board, and the interconnection line connects the first interface and the image sensor.

19. A camera module, characterized in that: It comprises a lens, an image sensor and an anti-shake component according to any one of claims 1 to 17, wherein the image sensor is installed in the middle area of ​​the anti-shake component, the lens is relatively fixed to the anti-shake component, and imaging light is incident on the image sensor through the lens.

20. An electronic device, characterized in that: It comprises a main board and the camera module as claimed in claim 19, wherein the camera module is electrically connected to the main board.

Images