Chip driving assembly and camera module

Abstract

The invention discloses a chip driving assembly and a camera module, the chip driving assembly comprises a circuit board, a movable carrier, a packaging body and an anti-shake conductive part, the packaging body is integrally combined on the front surface of the circuit board, the movable carrier is mounted on the mounting surface of the packaging body, the anti-shake conductive part is arranged on the packaging body, and the anti-shake conductive part is arranged on the packaging body. The circuit board through hole of the circuit board, the light window of the packaging body and the carrier through hole of the movable carrier correspond to each other, the anti-shake conductive part comprises a fixed circuit board, a movable circuit board and at least one flexible connecting part, the fixed circuit board surrounds the movable circuit board, and the flexible connecting part is arranged on the movable circuit board. The outer end of the flexible connecting part is connected to the fixed circuit board, the inner end of the flexible connecting part is connected to the movable circuit board, the front face of the movable circuit board is attached to the back face of the circuit board, the circuit board and the flexible connecting part are provided with an overlapped part from the overlook view, and the overlapped part is connected with the movable circuit board. Therefore, the area of the mounting surface of the packaging body is increased, and the movable carrier can be reliably mounted.

Description

Technical Field

[0001] The invention relates to a camera module, and in particular to a chip driving component and a camera module. Background Art

[0002] With the popularity of mobile electronic devices, the relevant technologies of camera modules used in mobile electronic devices (e.g., smart phones) to help users obtain images have been rapidly developed and improved. At present, in the market, consumers have increasingly higher and more diverse requirements for the functions and performance of camera modules configured in mobile electronic devices. For example, consumers require camera modules to have anti-shake functions. The reason is that when holding a mobile electronic device to take pictures, the imaging effect of the camera module will be reduced due to the physiological tremor of a certain frequency and the shaking caused by movement in the human body under normal circumstances. Therefore, mobile electronic devices are usually equipped with anti-shake motors to drive optical lenses and / or photosensitive chips to achieve anti-shake functions. However, with the development trend of large image surfaces of photosensitive chips, the camera module has higher and higher requirements for the driving force of the anti-shake motor, and the current mobile electronic devices need to meet the development trend of thinness at the same time, which has a large restriction on the size and volume of the camera module, resulting in the anti-shake motor cannot be increased accordingly with the increase in the size of the photosensitive chip. Therefore, how to provide a camera module that can achieve good optical image stabilization function and has a smaller size to meet the trend of lightweight and thin development of mobile electronic devices is a technical problem that the inventors of the present invention are committed to solving. Summary of the invention

[0003] An object of the present invention is to provide a chip driving component and a camera module, wherein the camera module can achieve a good optical image stabilization effect and has a smaller size to meet the development trend of lightweight and thin mobile electronic devices.

[0004] One object of the present invention is to provide a chip driving component and a camera module, wherein at least one frame of a circuit board of the chip driving component has a wider dimension, so that at least one frame of a package body integrally combined with the circuit board has a wider dimension, so that the area of ​​the mounting surface of the package body can be increased, which is conducive to reliable and stable mounting of a movable carrier.

[0005] One object of the present invention is to provide a chip driving component and a camera module, wherein the anti-shake conductive part of the chip driving component provides an active circuit board, a fixed circuit board surrounding the active circuit board, and at least one flexible conductive part connecting the active circuit board and the fixed circuit board, and the flexible conductive part enables the active circuit board and the circuit board connected to the active circuit board to translate relative to the fixed circuit board, thereby providing basic conditions for realizing the optical image stabilization function, thereby improving imaging quality.

[0006] One object of the present invention is to provide a chip driving component and a camera module, wherein the flexible connection portion is bent multiple times between the movable circuit board and the fixed circuit board to allow the flexible circuit board to deform as the movable circuit board translates, and in this process, the reaction force generated by the flexible circuit board is small to avoid affecting the anti-shake effect of the camera module.

[0007] One object of the present invention is to provide a chip driving component and a camera module, wherein on at least one side of the chip driving component, the outer edge of the circuit board is located outside the outer edge of the active circuit board, so that on this side of the chip driving component, the circuit board has a wider dimension to increase the width dimension of the package on this side, thereby increasing the area of ​​the top surface of the package.

[0008] An object of the present invention is to provide a chip driving component and a camera module, wherein from a top view, the circuit board and the flexible connecting portion of the anti-shake conductive portion have an overlapping portion, so as to increase the area of ​​the top surface of the package. Preferably, the circuit board and the fixed circuit board of the anti-shake conductive portion have an overlapping portion.

[0009] One object of the present invention is to provide a chip driving component and a camera module, wherein in some embodiments, glue is provided at the bonding positions of the solder pads of the circuit board and the solder pads of the photosensitive chip, so that it can not only protect the solder but also enhance the connection strength between the circuit board and the photosensitive chip, and reduce the force on the bonding position during the falling process.

[0010] One object of the present invention is to provide a chip driving component and a camera module, wherein in some embodiments, glue is provided at the bonding positions of the solder pads of the active circuit board and the solder pads of the photosensitive chip, so that it can not only protect the solder but also enhance the connection strength between the active circuit board and the photosensitive chip, and reduce the force on the bonding setting during the falling process.

[0011] According to one aspect of the present invention, the present invention provides a chip driving component, comprising:

[0012] a circuit board having a circuit board through hole;

[0013] a movable carrier having carrier perforations;

[0014] a driving unit configured to drive the movable carrier to move;

[0015] a package having a light window and a mounting surface surrounding a top opening of the light window, wherein the package is integrally combined with a front surface of the circuit board, the movable carrier is mounted on the mounting surface of the package, and the circuit board through-hole of the circuit board, the light window of the package, and the carrier through-hole of the movable carrier correspond to each other; and

[0016] The anti-shake conductive part includes a fixed circuit board, a movable circuit board and at least one flexible connection part, wherein the fixed circuit board surrounds the movable circuit board, the outer end of the flexible connection part is connected to the fixed circuit board, the inner end of the flexible connection part is connected to the movable circuit board, the front side of the movable circuit board is mounted on the back side of the circuit board, wherein the package body and the flexible connection part have an overlapping portion when viewed from a top view.

[0017] According to an embodiment of the present invention, from a top view perspective, the package body and the fixed circuit board have an overlapping portion.

[0018] According to one embodiment of the present invention, on at least one side of the chip driving component, the distance between the outer edge of the package body and the central axis of the chip driving component is greater than the distance between the outer edge of the active circuit board and the central axis of the chip driving component.

[0019] According to one embodiment of the present invention, on at least one side of the chip driving component, the distance between the outer edge of the circuit board and the central axis of the chip driving component is greater than the distance between the outer edge of the movable circuit board and the central axis of the chip driving component.

[0020] According to one embodiment of the present invention, on at least one side of the chip driving component, the distance between the outer edge of the circuit board and the central axis of the chip driving component is greater than the distance between the inner edge of the fixed circuit board and the central axis of the chip driving component.

[0021] According to one embodiment of the present invention, on each side of the chip driving component, the distance between the outer edge of the circuit board and the central axis of the chip driving component is greater than the distance between the inner edge of the fixed circuit board and the central axis of the chip driving component.

[0022] According to an embodiment of the present invention, the outer end and the inner end of the flexible connection portion are connected to non-corresponding sides of the fixed circuit board and the movable circuit board, respectively.

[0023] According to another aspect of the present invention, the present invention further provides a camera module, comprising:

[0024] Photosensitive chip;

[0025] an optical lens, wherein the optical lens is held in the light sensing path of the light sensing chip; and

[0026] The chip driving component further comprises:

[0027] a circuit board having a circuit board through hole;

[0028] a movable carrier having carrier perforations;

[0029] a package having a light window and a mounting surface surrounding a top opening of the light window, wherein the package is integrally combined with a front surface of the circuit board, the movable carrier is mounted on the mounting surface of the package, and the circuit board through-hole of the circuit board, the light window of the package, and the carrier through-hole of the movable carrier correspond to each other; and

[0030] The anti-shake conductive part includes a fixed circuit board, a movable circuit board and at least one flexible connection part, wherein the fixed circuit board surrounds the movable circuit board, the outer end of the flexible connection part is connected to the fixed circuit board, the inner end of the flexible connection part is connected to the movable circuit board, the front side of the movable circuit board is mounted on the back side of the circuit board, wherein the circuit board and the flexible connection part have an overlapping part when viewed from a top view, wherein the photosensitive chip is located on the back side of the circuit board, and the photosensitive chip is constructed to translate along with the translation of the circuit board.

[0031] According to one embodiment of the present invention, the active circuit board has an active circuit board through-hole, and the active circuit board through-hole of the active circuit board corresponds to the circuit board through-hole of the circuit board, wherein the photosensitive chip is mounted on the back side of the active circuit board, and the photosensitive area of ​​the photosensitive chip corresponds to the active circuit board through-hole of the active circuit board.

[0032] According to one embodiment of the present invention, the photosensitive chip is mounted on the back side of the circuit board, and the photosensitive area of ​​the photosensitive chip corresponds to the circuit board through-hole of the circuit board.

[0033] According to one embodiment of the present invention, the pads of the active circuit board and the pads of the photosensitive chip are connected by solder through a thermocompression bonding process.

[0034] According to one embodiment of the present invention, the pads of the circuit board and the pads of the photosensitive chip are connected by solder through a thermocompression bonding process.

[0035] According to one embodiment of the present invention, glue is provided at the bonding positions of the pads of the active circuit board and the pads of the photosensitive chip.

[0036] According to one embodiment of the present invention, glue is provided at the bonding positions of the solder pads of the circuit board and the solder pads of the photosensitive chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a three-dimensional schematic diagram of a camera module according to a preferred embodiment of the present invention.

[0038] Figure 2 It is a schematic diagram of a decomposition of the camera module according to the above preferred embodiment of the present invention from a viewing angle.

[0039] Figure 3 It is a schematic diagram of the decomposition of the camera module from another perspective according to the above preferred embodiment of the present invention.

[0040] Figure 4 It is a schematic cross-sectional view of the camera module in one direction according to the above preferred embodiment of the present invention.

[0041] Figure 5 It is a schematic cross-sectional view of the camera module in another direction according to the above preferred embodiment of the present invention.

[0042] Figure 6 yes Figure 5 A magnified schematic diagram of the local location.

[0043] Figure 7 It is a cross-sectional schematic diagram of a deformation example of the camera module according to the above-mentioned preferred embodiment of the present invention.

[0044] Figure 8 It is a cross-sectional schematic diagram of another modified example of the camera module according to the above-mentioned preferred embodiment of the present invention. DETAILED DESCRIPTION

[0045] Before describing in detail any embodiment of the present invention, it should be understood that the present invention is not limited in its application to the construction and arrangement details of the components described below or illustrated in the following figures. The present invention can have other embodiments and can be practiced or carried out in various ways. In addition, it should be understood that the words and terms used here are for descriptive purposes and should not be considered restrictive. The use of "including", "comprising" or "having" and its variations herein is intended to cover the items and their equivalents and additional items displayed below. Unless otherwise specified or limited, the terms "install", "connect", "support" and "couple" and their variations are widely used and cover direct installation and indirect installation, connection, support and connection. In addition, "connect" and "couple" are not limited to physical or mechanical connections or connections.

[0046] Furthermore, on the first aspect, in the disclosure of the present invention, the orientation or positional relationship indicated by terms such as "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or positional relationship shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore the above terms cannot be understood as limitations on the present invention; on the second aspect, the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" cannot be understood as a limitation on the quantity.

[0047] With reference to the accompanying drawings of the present invention Figures 1 to 6 A camera module according to a preferred embodiment of the present invention will be disclosed and described in the following description, wherein the camera module includes a chip driving component 10, a photosensitive chip 20 and an optical lens 30, wherein the photosensitive chip 20 is connected to the chip driving component 10, and the optical lens 30 is maintained in the photosensitive path of the photosensitive chip 20. After passing through the optical lens 30, the incident light reaches the photosensitive chip 20, and the photosensitive chip 20 performs photoelectric conversion to form an image, wherein the chip driving component 10 is configured to be able to translate the photosensitive chip 20 to achieve the optical image stabilization function of the camera module.

[0048] It is worth mentioning that the “chip driving component 10 is configured to translate the photosensitive chip 20” referred to in the present invention means that the photosensitive chip 20 can drive the photosensitive chip 20 to move in a direction perpendicular to the optical axis of the camera module to achieve the optical image stabilization function of the camera module. Figure 1 The optical axis direction of the camera module is the Z-axis direction in the coordinate system, and the chip driving component 10 is constructed to be able to drive the photosensitive chip 20 to move along the X-axis and Y-axis directions to realize the optical image stabilization function of the camera module.

[0049] Specifically, refer to the attached Figures 2 to 5 The chip driving component 10 includes a circuit board 11, a package body 12, an anti-shake conductive part 13 and a movable carrier 14, wherein the circuit board 11 is mounted on the anti-shake conductive part 13, the package body 12 is integrally combined with the circuit board 11, and the movable carrier 14 is mounted on the package body 12.

[0050] More specifically, the circuit board 11 has a circuit board front side 111, a circuit board back side 112 and a circuit board through hole 113. The circuit board front side 111 and the circuit board back side 112 correspond to each other to define the thickness dimension of the circuit board 11. The circuit board through hole 113 extends from the circuit board front side 111 to the circuit board back side 112, that is, the circuit board through hole 113 passes through the opposite sides of the circuit board 11.

[0051] In some embodiments of the present invention, the circuit board 11 is a square plate. For example, the projection figure of the circuit board 11 on the projection plane perpendicular to the optical axis of the camera module can be a square or a rectangle, so that the circuit board 11 is a square plate. The circuit board through hole 113 of the circuit board 11 is a square through hole, and its shape and size match the shape and size of the photosensitive area of ​​the photosensitive chip 20, so that the circuit board 11 has four circuit board frames 114 connected end to end.

[0052] For ease of understanding and description, the four circuit board frames 114 of the circuit board 11 are defined as a first circuit board frame 1141, a second circuit board frame 1142, a third circuit board frame 1143 and a fourth circuit board frame 1144 in sequence, the first circuit board frame 1141 and the third circuit board frame 1143 are located on a pair of opposite sides of the circuit board through hole 113 of the circuit board 11, the second circuit board frame 1142 and the fourth circuit board frame 1144 are located on another pair of opposite sides of the circuit board through hole 113 of the circuit board 11, and the The opposite ends of the first frame 1141 of the circuit board are respectively extended to be connected to one end of the second frame 1142 of the circuit board and one end of the fourth frame 1144 of the circuit board, and the opposite ends of the third frame 1143 of the circuit board are respectively extended to be connected to the other end of the second frame 1142 of the circuit board and the other end of the fourth frame 1144 of the circuit board, so that the first frame 1141 of the circuit board, the second frame 1142 of the circuit board, the third frame 1143 of the circuit board and the fourth frame 1144 of the circuit board are surrounded to form the circuit board through hole 113.

[0053] The package body 12 is integrally combined with the circuit board front side 111 of the circuit board 11, and the package body 12 has a light window 121 and a mounting surface 122 surrounding the top opening of the light window 121. The light window 121 of the package body 12 corresponds to the circuit board through-hole 113 of the circuit board 11. The incident light entering the camera module through the optical lens 30 passes through the light window 121 of the package body 12 and the circuit board through-hole 113 of the circuit board 11 in sequence and then reaches the photosensitive chip 20, and the photosensitive chip 20 performs photoelectric conversion to form an image.

[0054] In some embodiments of the camera module of the present invention, the package body 12 can be integrally combined with the circuit board front side 111 of the circuit board 11 through a molding process. During the molding process, the light window 121 and the mounting surface 122 of the package body 12 are formed at the same time as the package body 12 is formed, and by virtue of the mold advantage, the mounting surface 122 of the package body 12 has good flatness. Moreover, compared with the traditional solution of mounting the lens holder on the circuit board, in the camera module of the present invention, the package body 12 can be integrally combined with the circuit board front side 111 of the circuit board 11 through a molding process. On the one hand, no glue is required between the package body 12 and the circuit board 11, which is conducive to reducing the height dimension of the camera module. On the other hand, the height dimension of the package body 12 can be smaller than the lens holder, which is conducive to reducing the height dimension of the camera module.

[0055] Specifically, the package body 12 is in a square frame shape, and has four package body frames 123 connected end to end. The four package body frames 123 are defined in sequence as a first package body frame 1231, a second package body frame 1232, a third package body frame 1233, and a fourth package body frame 1234. The first package body frame 1231 and the third package body frame 1233 are located on a pair of opposite sides of the light window 121 of the package body 12, and the second package body frame 1232 and the fourth package body frame 1234 are located on the other pair of opposite sides of the light window 121 of the package body 12. On the reverse side, the two opposite ends of the first frame 1231 of the package body are respectively extended to be connected to one end of the second frame 1232 of the package body and one end of the fourth frame 1234 of the package body, and the two opposite ends of the third frame 1233 of the package body are respectively extended to be connected to the other end of the second frame 1232 of the package body and the other end of the fourth frame 1234 of the package body, so that the first frame 1231 of the package body, the second frame 1232 of the package body, the third frame 1233 of the package body and the fourth frame 1234 of the package body surround and form the light window 121.

[0056] The package body first frame 1231 of the package body 12 is integrally combined with the circuit board first frame 1141 of the circuit board 11, and the width dimension of the package body first frame 1231 is proportional to the width dimension of the circuit board first frame 1141, that is, the larger the width dimension of the circuit board first frame 1141, the larger the width dimension of the package body first frame 1231, and the larger the area of ​​the mounting surface 122 of the package body 12 formed on the top of the package body first frame 1231, and the easier it is to reliably and stably mount the movable carrier 14, and And the carrier through hole 141 of the movable carrier 14 corresponds to the light window 121 of the package body 12. Therefore, in the camera module of the present invention, the area of ​​the mounting surface 122 of the package body 12 can be increased by increasing the width dimension of the first frame 1141 of the circuit board of the circuit board 11, so that the movable carrier 14 can be reliably and stably mounted on the mounting surface 122 of the package body 12. For example, in some embodiments of the present invention, the movable carrier 14 can be reliably and stably mounted on the mounting surface 122 of the package body 12 by glue. Correspondingly, by increasing the width dimension of the second frame 1142 of the circuit board 11, the area of ​​the mounting surface 122 of the package body 12 can be increased, so that the movable carrier 14 can be reliably and stably mounted on the mounting surface 122 of the package body 12; by increasing the width dimension of the third frame 1143 of the circuit board 11, the area of ​​the mounting surface 122 of the package body 12 can be increased, so that the movable carrier 14 can be reliably and stably mounted on the mounting surface 122 of the package body 12; by increasing the width dimension of the fourth frame 1144 of the circuit board 11, the area of ​​the mounting surface 122 of the package body 12 can be increased, so that the movable carrier 14 can be reliably and stably mounted on the mounting surface 122 of the package body 12.

[0057] Reference Figures 2 to 6The anti-shake conductive part 13 further includes a fixed circuit board 131, a movable circuit board 132 and at least one flexible connection part 133. The fixed circuit board 131 has a fixed circuit board front 1311, a fixed circuit board back 1312 and a fixed circuit board through hole 1313. The fixed circuit board front 1311 and the fixed circuit board back 1312 correspond to each other to define the thickness of the fixed circuit board 131. The fixed circuit board through hole 1313 extends from the fixed circuit board front 1311 to the fixed circuit board back 1312, that is, the fixed circuit board through hole 1313 passes through the opposite sides of the fixed circuit board 131. Correspondingly, the movable circuit board 132 has a movable circuit board front face 1321, a movable circuit board back face 1322, and a movable circuit board through hole 1323. The movable circuit board front face 1321 and the movable circuit board back face 1322 correspond to each other to define the thickness of the movable circuit board 132. The movable circuit board through hole 1323 extends from the movable circuit board front face 1321 to the movable circuit board back face 1322, that is, the movable circuit board through hole 1323 passes through opposite sides of the movable circuit board 132. The movable circuit board 132 and the flexible connection portion 133 are both located in the fixed circuit board through hole 1313 of the fixed circuit board 131, and opposite ends of the flexible connection portion 133 extend to and are connected to the fixed circuit board 131 and the movable circuit board 132, respectively, so as to allow the flexible connection portion 133 to suspend the movable circuit board 132 in the fixed circuit board through hole 1313 of the fixed circuit board 131. That is, the movable circuit board 132 is disposed inside the fixed circuit board 131 , and the movable circuit board 132 is connected to the fixed circuit board 131 through the flexible connection portion 133 .

[0058] The active circuit board front side 1321 of the active circuit board 132 is mounted on the circuit board back side 112 of the circuit board 11, and the active circuit board through-hole 1323 of the active circuit board 132 corresponds to the circuit board through-hole 113 of the circuit board 11. For example, the active circuit board front side 1321 of the active circuit board 132 and the circuit board back side 112 of the circuit board 11 can be bonded by glue so that the active circuit board front side 1321 of the active circuit board 132 is mounted on the circuit board back side 112 of the circuit board 11. The photosensitive chip 20 is mounted on the back side 1322 of the active circuit board 132, and the active circuit board through-hole 1323 of the active circuit board 132 corresponds to the photosensitive area of ​​the photosensitive chip 20. In this way, the incident light entering the interior of the camera module through the optical lens 30 passes through the carrier through-hole 141 of the movable carrier 14, the light window 121 of the package body 12 and the circuit board through-hole 113 of the circuit board 11 in sequence and then reaches the photosensitive chip 20, and the photosensitive chip 20 performs photoelectric conversion to form an image.

[0059] When the movable carrier 14 drives the packaging body 12, the circuit board 11, the movable circuit board 132 and the photosensitive chip 20 to translate to realize the optical image stabilization function of the camera module, the flexible connection part 133 can be deformed and always connect the movable circuit board 132 and the fixed circuit board 131.

[0060] In some specific examples of the present invention, the flexible connection portion 133 is bent multiple times between the fixed circuit board 131 and the movable circuit board 132 to allow the flexible connection portion 133 to deform with the translation of the movable circuit board 132, and in this process, the reaction force generated by the flexible connection portion 133 is small to avoid affecting the optical image stabilization effect of the camera module.

[0061] In the attached Figures 1 to 6In this specific example of the camera module of the present invention shown, the fixed circuit board 131 and the movable circuit board 132 of the anti-shake conductive part 13 are both square frames, and the fixed circuit board 131 surrounds the outside of the movable circuit board 132, wherein one end of the flexible connection part 133 is connected to one side of the movable circuit board 132, and the other end of the flexible connection part 133 is connected to the non-corresponding side of the fixed circuit board 131, so as to reduce the reaction force generated by the flexible connection part 133 when the movable circuit board 132 translates. That is to say, each side of the movable circuit board 132 faces the corresponding side of the fixed circuit board 131, and the flexible connection part 133 is provided with at least three bending positions, one of the bending positions is close to the end of the flexible connection part 133 connected to the movable circuit board 132, another of the bending positions is close to the end of the flexible connection part 133 connected to the fixed circuit board 131, and another of the bending positions spans the corner of the movable circuit board 132, so that one end of the flexible connection part 133 is connected to one side of the movable circuit board 132, and the other end of the flexible connection part 133 is connected to the non-corresponding side of the fixed circuit board 131.

[0062] More specifically, see Attachment Figure 2 , Figure 3 , Figure 5 and Figure 6 The fixed circuit board 131 has four fixed circuit board frames 1314 connected end to end, which are defined as a first fixed circuit board frame 13141, a second fixed circuit board frame 13142, a third fixed circuit board frame 13143 and a fourth fixed circuit board frame 13144 in sequence. The first fixed circuit board frame 13141 and the third fixed circuit board frame 13143 are located on a pair of opposite sides of the fixed circuit board through hole 1313 of the fixed circuit board 131, and the second fixed circuit board frame 13142 and the fourth fixed circuit board frame 13144 are located on a pair of opposite sides of the fixed circuit board through hole 1313 of the fixed circuit board 131. The frame 13144 is located on another pair of opposite sides of the fixed circuit board through-hole 1313 of the fixed circuit board 131, and the opposite ends of the first frame 13141 of the fixed circuit board are respectively extended to be connected to one end of the second frame 13142 of the fixed circuit board and the other end of the fourth frame 13144 of the fixed circuit board, and the opposite ends of the third frame 13143 of the fixed circuit board are respectively extended to be connected to the other end of the second frame 13142 of the fixed circuit board and the other end of the fourth frame 13144 of the fixed circuit board.

[0063] The active circuit board 132 has four active circuit board frames 1324 connected end to end, which are defined as a first active circuit board frame 13241, a second active circuit board frame 13242, a third active circuit board frame 13243 and a fourth active circuit board frame 13244, wherein the first active circuit board frame 13241 and the third active circuit board frame 13243 are located on a pair of opposite sides of the active circuit board through hole 1323 of the active circuit board 132, and the second active circuit board frame 13242 and the third active circuit board frame 13244 are located on a pair of opposite sides of the active circuit board through hole 1323 of the active circuit board 132. The four side frames 13244 are located on the other opposite sides of the active circuit board through-hole 1323 of the active circuit board 132, and the opposite ends of the first side frame 13241 of the active circuit board are respectively extended to be connected to one end of the second side frame 13242 of the active circuit board and one end of the fourth side frame 13244 of the active circuit board, and the opposite ends of the third side frame 13243 of the active circuit board are respectively extended to be connected to the other end of the second side frame 13242 of the active circuit board and the other end of the fourth side frame 13244 of the active circuit board.

[0064] The positions of the fixed circuit board first frame 13141, the fixed circuit board second frame 13142, the fixed circuit board third frame 13143 and the fixed circuit board fourth frame 13144 of the fixed circuit board 131 respectively correspond to the positions of the movable circuit board first frame 13241, the movable circuit board second frame 13242, the movable circuit board third frame 13243 and the movable circuit board fourth frame 13244 of the movable circuit board 132, and the positions of the movable circuit board first frame 13241, the movable circuit board second frame 13242, the movable circuit board third frame 13243 and the movable circuit board fourth frame 13244 of the movable circuit board 132 respectively correspond to the positions of the circuit board first frame 1141, the circuit board second frame 1142, the circuit board third frame 1143 and the circuit board fourth frame 1144 of the circuit board 11. That is to say, the first frame 13241 of the active circuit board 132 can be attached to the first frame 1141 of the circuit board 11 by glue, the second frame 13242 of the active circuit board can be attached to the second frame 1142 of the circuit board by glue, the third frame 13243 of the active circuit board can be attached to the third frame 1143 of the circuit board by glue, and the fourth frame 13244 of the active circuit board can be attached to the fourth frame 1144 of the circuit board by glue.

[0065] There are four flexible connection parts 133 , which are defined as a first flexible connection part 1331 , a second flexible connection part 1332 , a third flexible connection part 1333 , and a fourth flexible connection part 1334 . The inner end of the first flexible connection part 1331 is connected to the first frame 13241 of the movable circuit board 132, and the outer end of the first flexible connection part 1331 is connected to the second frame 13142 of the fixed circuit board 131, so that the first flexible connection part 1331 is used to connect the non-corresponding sides of the fixed circuit board 131 and the movable circuit board 132; the inner end of the second flexible connection part 1332 is connected to the second frame 13242 of the movable circuit board 132, and the outer end of the second flexible connection part 1332 is connected to the third frame 13143 of the fixed circuit board 131, so that the second flexible connection part 1332 is used to connect the non-corresponding sides of the fixed circuit board 131 and the movable circuit board 132; the inner end of the third flexible connection part 1333 is connected to the third frame 13243 of the movable circuit board 132, and the outer end of the third flexible connection part 1333 is connected to the fixed circuit board 131 The fourth frame 13144 of the fixed circuit board is connected, so that the third flexible connection part 1333 is used to connect the non-corresponding sides of the fixed circuit board 131 and the movable circuit board 132; the inner end of the fourth flexible connection part 1334 is connected to the movable circuit board fourth frame 13244 of the movable circuit board 132, and the outer end of the fourth flexible connection part 1334 is connected to the fixed circuit board first frame 13141 of the fixed circuit board 131, so that the fourth flexible connection part 1334 is used to connect the fixed circuit board 131 and the non-corresponding sides of the movable circuit board 132; through the above-mentioned structure, when the movable carrier 14 drives the packaging body 12, the circuit board 11, the movable circuit board 132 and the photosensitive chip 20 to translate to realize the optical image stabilization function of the camera module, the first flexible connection part 1331, the second flexible connection part 1332, the third flexible connection part 1333 and the fourth flexible connection part 1334 can generate a smaller reaction force to avoid affecting the optical image stabilization effect of the camera module.

[0066] Optionally, in other examples of the camera module of the present invention, the inner end of the first flexible connection part 1331 is connected to the first frame 13241 of the movable circuit board 132, and the outer end of the first flexible connection part 1331 can be connected to the third frame 13143 of the fixed circuit board or the fourth frame 13144 of the fixed circuit board 131. Correspondingly, the inner end of the second flexible connection part 1332 is connected to the second frame 13242 of the movable circuit board 132, the outer end of the second flexible connection part 1332 can be connected to the fourth frame 13144 of the fixed circuit board 131 or the first frame 13141 of the fixed circuit board, the inner end of the third flexible connection part 1333 is connected to the third frame 13243 of the movable circuit board 132, the outer end of the third flexible connection part 1333 can be connected to the first frame 13141 of the fixed circuit board 131 or the second frame 13142 of the fixed circuit board, the inner end of the fourth flexible connection part 1334 is connected to the movable circuit board The fourth frame 13244 of the movable circuit board 132, the outer end of the fourth flexible connection part 1334 can be connected to the second frame 13142 of the fixed circuit board or the third frame 13143 of the fixed circuit board 131. Through the above structure, when the movable carrier 14 drives the package body 12, the circuit board 11, the movable circuit board 132 and the photosensitive chip 20 to translate to realize the optical image stabilization function of the camera module, the first flexible connection part 1331, the second flexible connection part 1332, the third flexible connection part 1333 and the fourth flexible connection part 1334 can generate a smaller reaction force to avoid affecting the optical image stabilization effect of the camera module.

[0067] Reference Figure 4 and Figure 5 From a top view, the package body 12 and the flexible connection portion 133 of the anti-shake conductive portion 13 have an overlapping portion, so that at least one package body frame 123 of the package body 12 can have a wider size to increase the mounting area of ​​the mounting surface 122 of the package body 12, thereby facilitating reliable and stable mounting of the movable carrier 14.

[0068] Continue to refer to the attached Figure 4 and Figure 5The package body 12 is integrally combined with the circuit board front side 111 of the circuit board 11, and the width dimension of the package body frame 123 of the package body 12 is limited by the width dimension of the circuit board frame 114 of the circuit board 11, that is, on the same side of the camera module, the width dimension of the package body frame 123 of the package body 12 is less than or equal to the dimension of the circuit board frame 114 of the circuit board 11, and the active circuit board front side 1321 of the active circuit board 132 of the anti-shake conductive part 13 is mounted on the circuit board back side 112 of the circuit board 11. In the camera module of the present invention, at least one of the circuit board 11 The circuit board frame 114 extends outward to above the flexible connection part 133 of the anti-shake conductive part 13 and does not contact the flexible connection part 133. In this way, at least one of the circuit board frames 114 of the circuit board 11 can have a wider size without affecting the deformation of the flexible connection part 133. In this way, at least one of the package frames 123 of the package body 12 can also have a wider size, so that the package body 12 and the flexible connection part 133 have an overlapping part when viewed from a top view, so as to increase the mounting area of ​​the mounting surface 122 of the package body 12, so as to facilitate reliable and stable mounting of the movable carrier 14.

[0069] For example, see Attachment Figure 4 , the first frame 1141 of the circuit board 11 extends outward to the top of the first flexible connection part 1331 and does not contact the first flexible connection part 1331, that is, the outer edge of the first frame 1141 of the circuit board 11 is located outside the outer edge of the first frame 13241 of the movable circuit board 132, so that the distance L2 between the outer edge of the first frame 1141 of the circuit board and the central axis of the chip driving component 10 is greater than the distance L1 between the outer edge of the first frame 13241 of the movable circuit board and the central axis of the chip driving component 10, so that the The first frame 1141 of the circuit board 11 can have a wider size without affecting the deformation of the first flexible connection part 1331, so that the first frame 1231 of the package body 12 can also have a wider size. For example, the distance between the outer edge of the first frame 1231 of the package body 12 and the central axis of the chip driving component 10 is greater than the distance between the outer edge of the first frame 13241 of the movable circuit board and the central axis of the chip driving component 10, thereby increasing the mounting area of ​​the mounting surface 122 of the package body 12, so as to facilitate reliable and stable mounting of the movable carrier 14.

[0070] In some specific examples of the camera module of the present invention, refer to the attached Figure 4 and Figure 5 , the first frame 1141 of the circuit board 11 extends outward to the top of the first flexible connection part 1331 and does not contact the first flexible connection part 1331, the second frame 1142 of the circuit board 11 extends outward to the top of the second flexible connection part 1332 and does not contact the second flexible connection part 1332, the third frame 1143 of the circuit board 11 extends outward to the top of the third flexible connection part 1333 and does not contact the third flexible connection part 1333, the fourth frame 1144 of the circuit board 11 extends outward to the top of the fourth flexible connection part 1334 and does not contact the fourth flexible connection part 1334, so that the package body 12 The first frame 1231 of the package body, the second frame 1232 of the package body, the third frame 1233 of the package body and the fourth frame 1234 of the package body all have wider dimensions. For example, from a top view, the first frame 1231 of the package body and the first flexible connection part 1331 have an overlapping portion, the second frame 1232 of the package body and the second flexible connection part 1332 have an overlapping portion, the third frame 1233 of the package body and the third flexible connection part 1333 have an overlapping portion, and the fourth frame 1234 of the package body and the fourth flexible connection part 1334 have an overlapping portion, thereby increasing the mounting area of ​​the mounting surface 122 of the package body 12, so as to facilitate reliable and stable mounting of the movable carrier 14.

[0071] Continue to refer to the attached Figure 4, the first frame 1141 of the circuit board 11 extends outward to the top of the first frame 13141 of the fixed circuit board 131 and does not contact the first flexible connection portion 133, that is, the outer edge of the first frame 1141 of the circuit board 11 is located outside the inner edge of the first frame 13141 of the fixed circuit board 131, so that the distance L2 between the outer edge of the first frame 1141 of the circuit board and the central axis of the chip driving component 10 is greater than the distance L3 between the inner edge of the first frame 13141 of the fixed circuit board and the central axis of the chip driving component 10, so that the fixed The first frame 13141 of the fixed circuit board is retracted inward to help reduce the width of the camera module. At the same time, the first frame 1141 of the circuit board of the circuit board 11 can have a wider size without affecting the deformation of the first flexible connection part 1331. In this way, the first frame 1231 of the package body 12 can also have a wider size. For example, the first frame 1231 of the package body 12 can also extend outward to above the first frame 13141 of the fixed circuit board 131, thereby increasing the mounting area of ​​the mounting surface 122 of the package body 12, so as to facilitate reliable and stable mounting of the movable carrier 14.

[0072] In some specific examples of the camera module of the present invention, refer to the attached Figure 4 and Figure 5, the first frame 1141 of the circuit board 11 extends outward to the top of the first frame 13141 of the fixed circuit board 131 and does not contact the first flexible connection portion 1331, the second frame 1142 of the circuit board 11 extends outward to the top of the second frame 13142 of the fixed circuit board 131 and does not contact the second flexible connection portion 1332, the third frame 1143 of the circuit board 11 extends outward to the top of the third frame 13143 of the fixed circuit board 131 and does not contact the third flexible connection portion 1333, the fourth frame 1144 of the circuit board 11 extends outward to the top of the fourth frame 13144 of the fixed circuit board 131 and does not contact the fourth flexible connection portion 1334, so that the first frame 13141 of the fixed circuit board, the second frame 13142 of the fixed circuit board, The third frame 13143 of the fixed circuit board and the fourth frame 13144 of the fixed circuit board are both retracted inward to facilitate reducing the length and width of the camera module. At the same time, the first frame 1231 of the package body, the second frame 1232 of the package body, the third frame 1233 of the package body and the fourth frame 1234 of the package body 12 all have wider dimensions. For example, the first frame 1231 of the package body can extend outward to above the first frame 13141 of the fixed circuit board, the second frame 1232 of the package body can extend outward to above the second frame 13142 of the fixed circuit board, the third frame 1233 of the package body can extend outward to above the third frame 13143 of the fixed circuit board, and the fourth frame 1234 of the package body can extend outward to above the fixed circuit board frame 13144, thereby increasing the mounting area of ​​the mounting surface 122 of the package body 12 to facilitate reliable and stable mounting of the movable carrier 14.

[0073] Continue to refer to the attached Figure 4 and Figure 5 , the chip driving assembly 10 further includes at least one electronic component 15, which can be a passive electronic component such as a resistor, a capacitor, or an active electronic component such as a driver chip, a memory chip, etc., the electronic component 15 is mounted on the front side 111 of the circuit board 11, and the electronic component 15 is covered by the package 12, so that the electronic component 15 is protected by the package 12 to prevent the electronic component 15 from being damp and oxidized. In some specific examples of the camera module of the present invention, at least one of the first frame 1141, the second frame 1142, the third frame 1143, and the fourth frame 1144 of the circuit board 11 is provided with the electronic component 15.

[0074] Reference Figures 4 to 6 The active circuit board 132 has at least one column of circuit board pads 1325, and the circuit board pads 1325 are arranged on the active circuit board back side 1322 of the active circuit board 132 and are adjacent to the active circuit board through-holes 1323 of the active circuit board 132. The photosensitive chip 20 has at least one column of chip pads 21, and the chip pads 21 are arranged in the non-photosensitive area of ​​the photosensitive chip 20 and are adjacent to the photosensitive area, wherein the circuit board pads 1325 of the active circuit board 132 and the chip pads 21 of the photosensitive chip 20 are soldered by hot pressing to mount the photosensitive chip 20 on the active circuit board back side 1322 of the active circuit board 132 and conduct electricity between the photosensitive chip 20 and the active circuit board 132.

[0075] That is to say, the camera module of the present invention adopts a flip-chip bonding method to achieve the connection and conduction between the photosensitive chip 20 and the active circuit board 132. The flip-chip bonding method allows the camera module of the present invention to eliminate the lead space, so as to reduce the length and width of the camera module. For example, in a specific example of the camera module of the present invention, the length and width of the camera module can be reduced by 0.7mm-1.075mm on one side. In addition, compared with the lead connection method, the active circuit board pad 1325 of the active circuit board 132 of the camera module of the present invention and the chip pad 21 of the photosensitive chip 20 are directly connected by hot pressing bonding, and the interconnection line is short and the impedance is small. In addition, the camera module of the present invention adopts a flip-chip bonding method to achieve the connection and conduction between the photosensitive chip 20 and the active circuit board 132, so that the photosensitive chip 20 moves down to a position lower than the active circuit board 132, which is conducive to reducing the height dimension of the camera module, and the design of the height dimension of the package body 12 does not need to consider the photosensitive chip 20, so that the height dimension of the package body 12 can be consistent with the height dimension of the front side 111 of the circuit board 11 of the electronic component 15 protruding from the circuit board 11. It can be understood that in the embodiment of the camera module where the package body 12 is not required to cover the electronic component 15, the height dimension of the package body 12 can be further reduced to reduce the height dimension of the camera module.

[0076] It is worth mentioning that the bonding material between the circuit board pads 1325 of the active circuit board 132 and the chip pads 21 of the photosensitive chip 20 can be selected as needed. For example, in some embodiments of the camera module of the present invention, the bonding material between the circuit board pads 1325 of the active circuit board 132 and the chip pads 21 of the photosensitive chip 20 can be a gold-gold material, that is, the solder of the circuit board pads 1325 of the active circuit board 132 is gold, and the solder of the chip pads 21 of the photosensitive chip 20 is gold, and the two solders are bonded by hot pressing to achieve connection and conduction between the active circuit board 132 and the photosensitive chip 20. In some other embodiments of the camera module of the present invention, the bonding material between the circuit board pads 1325 of the active circuit board 132 and the chip pads 21 of the photosensitive chip 20 may be a tin-gold material, that is, the solder of the circuit board pads 1325 of the active circuit board 132 is tin, and the solder of the chip pads 21 of the photosensitive chip 20 is gold. The two solders are bonded by hot pressing to achieve connection and conduction between the active circuit board 132 and the photosensitive chip 20.

[0077] Continue to refer to the attached Figure 5 The bonding positions of the active circuit board pads 1325 of the active circuit board 132 and the chip pads 21 of the photosensitive chip 20 are provided with glue 16, so that it can not only protect the solder but also enhance the connection strength between the active circuit board 132 and the photosensitive chip 20, and reduce the force on the bonding position during the falling process.

[0078] Continue to refer to the attached Figures 2 to 5 The camera module further includes a filter element 40, which is mounted on the mounting surface 122 of the package body 12, and is held between the optical lens 20 and the photosensitive chip 20, wherein the filter element 40 is used to filter stray light in the incident light entering the camera module through the optical lens 20, so as to improve the imaging quality of the camera module.

[0079] Reference Figure 4 and Figure 5The filter element 40 can be mounted on the inner side of the mounting surface 122 of the packaging body 12 by glue, the movable carrier 14 can be mounted on the outer side of the mounting surface 122 of the packaging body 12 by glue, and the filter element 40 is located in the carrier through hole 14 of the movable carrier 14, so that the movable carrier 14 surrounds the filter element 40. In this way, when assembling the camera module, the movable carrier 14 can protect the filter element 40, and the setting of the filter element 40 will not increase the height dimension of the camera module.

[0080] It is worth mentioning that in the camera module of the present invention, the circuit board 11 can extend outward to above the flexible connection part 133 of the anti-shake conductive part 13 so that the width dimension of at least one circuit board frame 114 of the circuit board 11 can be increased, thereby enabling the width dimension of at least one package frame 123 of the package body 12 to be increased, that is, the width dimension of the part of the mounting surface 122 of the package body 12 formed on this package frame 123 is increased, so that the filter element 40 can be mounted on the inner side of the mounting surface 122 of the package body 12 and the movable carrier 145 can be mounted on the outer side of the mounting surface 122 of the package body 12.

[0081] Continue to refer to the attached Figures 1 to 5 The camera module includes a base 50 and a shell 60, the optical lens 20 is arranged on the base 50, the base 50 is accommodated in the shell 60, and the shell 60 is mounted on the fixed circuit board 131 of the anti-shake conductive part 13, so that the base 50 can keep the optical lens 20 in the photosensitive path of the photosensitive chip 20.

[0082] The anti-shake conductive part 13 further includes a reinforcement frame 134, and the reinforcement frame 134 is attached to the fixed circuit board back side 1312 of the fixed circuit board 131. For example, the reinforcement frame 134 can be attached to the fixed circuit board back side 1312 of the fixed circuit board 131 by glue, wherein the reinforcement frame 134 is used to reinforce the strength of the fixed circuit board 131 and improve the flatness of the reinforcement frame 134. The provision of the reinforcement frame 134 can prevent the base 50 attached to the fixed circuit board 131 from tilting, thereby ensuring the coaxiality of the camera module.

[0083] Reference Figure 4 and Figure 5, the chip driving component 10 includes a driving unit 17, and the driving unit 17 is configured to drive the movable carrier 14. In this specific example of the camera module of the present invention, the driving unit 17 includes at least one driving coil 171 and at least one driving magnet 172, one of the driving coil 171 and the driving magnet 172 is arranged on the movable carrier 14, and the other is arranged on the base 50. When the driving coil 171 is energized, based on the electromagnetic principle, the driving coil 171 and the driving magnet 172 interact with each other to drive the movable carrier 14 to drive the package body 12, the circuit board 11, the movable circuit board 132 and the photosensitive chip 20 to translate to realize the optical image stabilization function of the camera module.

[0084] In this specific example of the camera module of the present invention, the driving unit 17 further includes a driving circuit board 173 and at least one pin 174, the driving circuit board 173 is arranged on the movable carrier 14, the pin 174 extends downward from the driving circuit board 173 to and is connected to the circuit board 11, wherein the driving coil 171 is mounted on the driving circuit board 173 or the driving coil 171 is formed on the driving circuit board 173 to set the driving circuit board 173 on the movable carrier 14, wherein the driving magnet 172 is arranged on the base 50. When the circuit board 11 supplies power to the driving coil 171 through the pin 174 and the driving circuit board 173, the driving coil 171 generates a magnetic field, which cooperates with the driving magnet 172 to drive the movable carrier 14 to drive the package body 12, the circuit board 11, the movable circuit board 132 and the photosensitive chip 20 to translate to realize the optical image stabilization function of the camera module.

[0085] Further, see Attachment Figure 4 and Figure 5 The movable carrier 14 has a carrier groove 142, and the driving circuit board 63 and the driving coil 171 are located in the carrier groove 142 of the movable carrier 14 to prevent the driving coil 171 from protruding from the top of the movable carrier 14, which is conducive to reducing the height of the camera module. The base 50 has at least one mounting groove 51, and the driving magnet 172 is installed in the mounting groove 51 of the base 50 to set the driving magnet 172 on the base 50 and prevent the driving magnet 172 from protruding from the bottom of the base 50, which is conducive to reducing the height of the camera module.

[0086] Further, please refer to the attached Figure 4 and Figure 5The driving unit 17 includes at least one magnetic conductive plate 175, which is located on a side of the driving magnet 172 away from the driving coil 171, wherein the magnetic conductive plate 175 is used to gather the magnetic field of the driving magnet 172 toward the driving coil 171 to increase the driving force of the driving unit 17. In some specific examples of the camera module of the present invention, the magnetic conductive plate 175 and the driving magnet 172 are superimposedly installed in the installation slot 51 of the base 50.

[0087] Continue to refer to the attached Figures 1 to 6 The camera module further includes a base 70, and the reinforcement frame 134 of the anti-shake conductive part 13 is mounted on the base 70, so that the base 70 can seal the active circuit board 132 and the flexible connection part 133 of the anti-shake conductive part 13 and hide the photosensitive chip 20, so as to prevent the active circuit board 132 and the flexible connection part 133 of the anti-shake conductive part 13 and the photosensitive chip 20 from being visually visible.

[0088] In some specific examples of the camera module of the present invention, the base 70 has a base groove 71, and the photosensitive chip 20 corresponds to the base groove 71 of the base 70 to avoid the photosensitive chip 20 touching the base 70 when being driven to translate, thereby improving the reliability of the camera module.

[0089] Attached Figure 7 A modified example of the camera module of the above preferred embodiment of the present invention is shown, and Figures 1 to 6 The camera module shown is different in that Figure 7 In this specific example of the camera module of the present invention, the photosensitive chip 20 is mounted on the back side 112 of the circuit board 11 by flip-chip bonding. In other words, the photosensitive chip 20 is mounted on the inner side of the back side 112 of the circuit board 11, and the active circuit board 132 of the anti-shake conductive part 13 is mounted on the outer side of the back side 112 of the circuit board 11, and the active circuit board 132 surrounds the photosensitive chip 20.

[0090] In some specific examples of the camera module of the present invention, the bonding positions of the chip pads 21 of the photosensitive chip 20 and the circuit board pads of the circuit board 11 are provided with glue 16, so that it can not only protect the solder but also enhance the connection strength between the circuit board 11 and the photosensitive chip 20 and reduce the force on the bonding position during the falling process.

[0091] In some specific examples of the camera module of the present invention, the manufacturing process of the chip driving component 10 includes the following steps: first, the electronic component 15 is arranged on the front side 111 of the circuit board 11; second, the package body 12 is integrally combined with the front side 111 of the circuit board 11, and the package body 12 covers the electronic component 15; third, the portion of the circuit board 11 exposed to the light window 121 of the package body 12 is cut to form the circuit board through hole 113 of the circuit board 11, and the circuit board 11 The size and shape of the circuit board through-hole 113 match the size and shape of the photosensitive area of ​​the photosensitive chip 20; fourth, solder is respectively provided at the circuit board pad of the circuit board 11 and the chip pad 21 of the photosensitive chip 20, and hot pressing bonding is performed to mount the photosensitive chip 20 on the circuit board 11 and make the photosensitive chip 20 and the circuit board 11 conductive; fifth, the movable carrier 14 is mounted on the mounting surface 122 of the package body 12, and the movable circuit board 132 of the anti-shake conductive part 13 is mounted on the circuit board 11.

[0092] Attached Figure 8 A modified example of the camera module of the above preferred embodiment of the present invention is shown, and the attached Figures 1 to 6 The camera module shown is different in that Figure 8 In this specific example of the camera module of the present invention shown, the filter element 40 is mounted on the front side 111 of the circuit board 11 so that the filter element 40 is held between the optical lens 30 and the photosensitive chip 20 by the circuit board 11.

[0093] That is to say, in the attached Figure 8 In this specific example of the camera module of the present invention shown, the package body 12 is integrally combined with the outer side of the circuit board front side 111 of the circuit board 11, the filter element 40 is mounted on the inner side of the circuit board front side 111 of the circuit board 11, and the filter element 40 is located in the light window 121 of the package body 12, so that the package body 12 surrounds the filter element 40. In this way, when the camera module is assembled, the package body 12 can protect the filter element 40, and the setting of the filter element 40 will not increase the height dimension of the camera module.

[0094] It is worth mentioning that in the camera module of the present invention, the circuit board 11 can extend outward to above the flexible connection part 133 of the anti-shake conductive part 13 so that the width dimension of at least one circuit board frame 114 of the circuit board 11 can be increased. In this way, when the package body 12 is integrally combined with the outer side of the circuit board front side 111 of the circuit board 11 and the filter element 40 is mounted on the inner side of the circuit board front side 111 of the circuit board 11, the mounting surface 122 of the package body 12 can have a larger mounting area to reliably and stably mount the movable carrier 14.

[0095] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A chip driving component, characterized in that: include: a circuit board having a circuit board through hole; a movable carrier having carrier perforations; a driving unit configured to drive the movable carrier to move; a package having a light window and a mounting surface surrounding a top opening of the light window, wherein the package is integrally combined with a front surface of the circuit board, the movable carrier is mounted on the mounting surface of the package, and the circuit board through-hole of the circuit board, the light window of the package, and the carrier through-hole of the movable carrier correspond to each other; and The anti-shake conductive part includes a fixed circuit board, a movable circuit board and at least one flexible connection part, wherein the fixed circuit board surrounds the movable circuit board, the outer end of the flexible connection part is connected to the fixed circuit board, the inner end of the flexible connection part is connected to the movable circuit board, the front side of the movable circuit board is mounted on the back side of the circuit board, wherein the package body and the flexible connection part have an overlapping portion when viewed from a top view. 2 . The chip driving assembly according to claim 1 , wherein the package body and the fixed circuit board have an overlapping portion when viewed from a top view.

3. The chip driving component according to claim 1, wherein on at least one side of the chip driving component, the distance between the outer edge of the package body and the central axis of the chip driving component is greater than the distance between the outer edge of the active circuit board and the central axis of the chip driving component.

4. The chip driving component according to claim 3, wherein on at least one side of the chip driving component, the distance between the outer edge of the circuit board and the central axis of the chip driving component is greater than the distance between the outer edge of the active circuit board and the central axis of the chip driving component.

5. The chip driving component according to claim 4, wherein on at least one side of the chip driving component, the distance between the outer edge of the circuit board and the central axis of the chip driving component is greater than the distance between the inner edge of the fixed circuit board and the central axis of the chip driving component.

6. A chip driving component according to claim 5, wherein on each side of the chip driving component, the distance between the outer edge of the circuit board and the central axis of the chip driving component is greater than the distance between the inner edge of the fixed circuit board and the central axis of the chip driving component. 7 . The chip driving assembly according to claim 1 , wherein an outer end and an inner end of the flexible connection portion are connected to non-corresponding sides of the fixed circuit board and the movable circuit board, respectively.

8. A camera module, characterized in that: include: Photosensitive chip; An optical lens, wherein the optical lens is held in the light-sensing path of the light-sensing chip; as well as According to any one of claims 1 to 7, the photosensitive chip is located on the back side of the circuit board, and the photosensitive chip is constructed to translate along with the translation of the circuit board.

9. The camera module according to claim 8, wherein the active circuit board has an active circuit board through-hole, the active circuit board through-hole of the active circuit board corresponds to the circuit board through-hole of the circuit board, wherein the photosensitive chip is mounted on the back side of the active circuit board, and the photosensitive area of ​​the photosensitive chip corresponds to the active circuit board through-hole of the active circuit board.

10. The camera module according to claim 8, wherein the photosensitive chip is mounted on the back side of the circuit board, and the photosensitive area of ​​the photosensitive chip corresponds to the circuit board through-hole of the circuit board.

11. The camera module according to claim 9, wherein the pads of the active circuit board and the pads of the photosensitive chip are connected by solder through a thermal compression bonding process.

12. The camera module according to claim 10, wherein the solder pads of the circuit board and the solder pads of the photosensitive chip are connected by solder through a thermal compression bonding process.

13. The camera module according to claim 11, wherein glue is provided at the bonding positions of the pads of the active circuit board and the pads of the photosensitive chip.

14. The camera module according to claim 12, wherein glue is provided at the bonding positions of the solder pads of the circuit board and the solder pads of the photosensitive chip.

Images