Connecting device and multilayer circuit board

Abstract

The invention discloses a connecting device and a multilayer circuit board. The connecting device comprises a connecting plate; a plurality of connecting holes and a plurality of hole grooves are formed in the connecting plate in a penetrating manner; the connecting holes and the hole grooves are arranged at intervals; and the connecting hole is provided with a bonding pad. The multi-layer circuit board comprises connecting devices and at least two single-layer circuit boards, every two adjacent single-layer circuit boards are connected through at least one connecting device, and connection between the single-layer circuit board on the upper layer and the single-layer circuit board on the lower layer is achieved. Connection among multiple layers of circuit boards is achieved through the connecting device, assembling is convenient, welding is achieved through the bonding pads, disassembling is convenient, the whole board is prevented from being scrapped, and a flexible circuit board and a connector do not need to be used.

Description

Technical Field

[0001] The present invention belongs to the technical field of multilayer circuit boards, and in particular relates to a multilayer circuit board and a multilayer circuit board. Background Art

[0002] In many circuit packaging scenarios, a multi-layer circuit stacking design is required to reduce the signal transmission distance and loss, while saving space to adapt to the constraints of various scene structures. This structure is often achieved by connecting the upper and lower circuit structures through a soft-hard combination board, or through a connector, such as a B2B connector, such as Figure 1 As shown, B2B connectors are used between circuit boards to achieve connection between circuit boards. However, B2B connectors have poor reliability, high thickness, and difficulty in assembly. In the case of a rigid-flex board, they will take up more space. Once there is a defect, the entire board will be scrapped, and the cost is too high. Summary of the invention

[0003] In order to overcome the above technical defects, the present invention provides a multi-layer circuit board and a multi-layer circuit board, which are easy to assemble.

[0004] The present invention is implemented according to the following technical solutions:

[0005] A connecting device, comprising: a connecting plate;

[0006] The connecting plate is provided with a plurality of connecting holes and a plurality of hole slots;

[0007] The connecting holes and the hole slots are arranged at intervals;

[0008] The connection hole is provided with a pad.

[0009] As a further improvement of the present invention, the connection holes include: a reference ground hole, a signal hole, a differential line hole, and a single-ended line hole.

[0010] As a further improvement of the present invention, two side walls of the hole groove form shielding side walls.

[0011] As a further improvement of the present invention, a plurality of the connection holes are distributed on the connection plate in a matrix.

[0012] As a further improvement of the present invention, the hole grooves are arranged between each adjacent column of the connection holes or each adjacent row of the connection holes.

[0013] As a further improvement of the present invention, the material of the connecting plate is one of polymer materials, glass, ceramics, and silicon wafers.

[0014] The present invention also provides a multi-layer circuit board, comprising the above-mentioned connecting device and at least two single-layer circuit boards, wherein two adjacent single-layer circuit boards are connected by at least one of the connecting devices to achieve connection between the upper single-layer circuit board and the lower single-layer circuit board.

[0015] As a further improvement of the present invention, the connecting device is located at an edge of the single-layer circuit board.

[0016] As a further improvement of the present invention, the connecting device is arranged close to the components of the single-layer circuit board.

[0017] As a further improvement of the present invention, the single-layer circuit board is a single-sided or double-sided printed component.

[0018] Compared with the prior art, the present invention has the following beneficial effects: a connection device is used to realize the connection between multi-layer circuit boards, which is convenient for assembly; a soldering pad is used to realize welding, which is convenient for disassembly and avoids the scrapping of the entire board; and there is no need to use a flexible circuit board and a connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The specific embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings, wherein:

[0020] Figure 1 It is a structural schematic diagram of a multi-layer circuit board in the prior art;

[0021] Figure 2 This is a schematic diagram of the structure of the connecting device described in Example 1;

[0022] Figure 3 This is another schematic diagram of the structure of the connecting device described in Example 1;

[0023] Figure 4 This is another structural schematic diagram of the connecting device described in Example 1;

[0024] Figure 5 is a cross-sectional view (BB) of the connecting device described in Example 1;

[0025] Figure 6 is a cross-sectional view (AA) of the connecting device described in Example 1;

[0026] Figure 7 This is a schematic diagram of the structure of the multi-layer circuit board described in Example 2.

[0027] Explanation of the accompanying drawings: 1. connecting plate; 2. connecting hole; 21. reference ground hole; 22. signal hole; 23. differential line hole; 24. single-ended line hole; 3. hole groove; 4. shielding side wall; 5. single-layer circuit board. DETAILED DESCRIPTION

[0028] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0029] Example 1

[0030] This embodiment discloses a connection device, such as Figure 2-Figure 5 As shown, it includes: a connecting plate 1; a plurality of connecting holes 2 and a plurality of hole slots 3 are provided through the connecting plate 1; the connecting holes 2 and the hole slots 3 are arranged at intervals; and a welding pad is provided on the connecting hole 2.

[0031] like Figure 3 and Figure 6 As shown, the connection hole 2 includes: a reference ground hole 21, a signal hole 22, a differential line hole 23, and a single-ended line hole 24. The signal hole 22 is used for signal transmission, and the reference ground hole 21 is used for grounding to increase isolation, based on which, the anti-interference performance and signal integrity can be improved.

[0032] In addition, the connection hole 2 can transmit high-speed and high-frequency signals and low-speed and low-frequency signals, and can be used as a heat dissipation hole to dissipate the heat of the device outside the package.

[0033] like Figure 6 As shown, two side walls of the aperture 3 form shielding side walls 4 .

[0034] A plurality of connection holes 2 are distributed on the connection plate 1 in a matrix manner. The aperture of each connection hole 2 is 0.35 mm. In addition, the aperture of the connection holes 2 can be set according to the actual use requirements.

[0035] A hole slot 3 is provided between each adjacent column of connection holes 2 or each adjacent row of connection holes 2 , and the connection holes 2 are isolated by the hole slot 3 .

[0036] The material of the connecting plate 1 is one of polymer materials, glass, ceramics, and silicon wafers. In specific use, based on the different materials, the pads, the apertures of the connecting holes 2, and the hole spacing of the connecting holes 2 need to be adjusted accordingly.

[0037] The connecting device of this embodiment can reduce the overall height of the multi-layer circuit board. The connecting holes running through the connecting board are used to realize signal transmission. The soldering pads on the connecting holes can facilitate rapid welding between circuit boards and between circuit boards and components. The hole grooves can play the role of isolation and reference ground.

[0038] Example 2

[0039] This embodiment discloses a multi-layer circuit board, such as Figure 7As shown, it includes the connection device in embodiment 1 and at least two single-layer circuit boards 5. Two adjacent single-layer circuit boards 5 are connected by at least one connection device to achieve the connection between the upper single-layer circuit board 5 and the lower single-layer circuit board 5. The single-layer circuit board 5 is a single-sided or double-sided component.

[0040] The connecting device is located at the edge of the single-layer circuit board 5 to achieve connection between adjacent circuit boards.

[0041] The connection device is arranged close to the components of the single-layer circuit board 5, and the nearby connection reduces the loss, reduces the interference, and optimizes the routing of the circuit board.

[0042] The connection device can be set at any position to achieve the desired effect, such as a short link.

[0043] A connection device is used to achieve connection between multi-layer circuit boards, which is easy to assemble. A soldering pad is used to achieve welding, which is easy to disassemble and avoids scrapping of the entire board. There is no need to use a flexible circuit board and a connector.

[0044] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A connection device, characterized in that: include: Connecting plate; The connecting plate is provided with a plurality of connecting holes and a plurality of hole slots; The connecting holes and the hole slots are arranged at intervals; The connection hole is provided with a pad.

2. The connection device according to claim 1, characterized in that: The connection holes include: a reference ground hole, a signal hole, a differential line hole, and a single-ended line hole.

3. The connection device according to claim 1, characterized in that: Two side walls of the hole groove form shielding side walls.

4. The connection device according to claim 1, characterized in that: A plurality of the connection holes are distributed on the connection plate in a matrix manner.

5. The connection device according to claim 5, characterized in that: The hole grooves are arranged between each adjacent column of the connection holes or each adjacent row of the connection holes.

6. The connection device according to any one of claims 1 to 5, characterized in that: The material of the connecting plate is one of polymer materials, glass, ceramics and silicon wafer.

7. A multi-layer circuit board, characterized in that: It comprises a connecting device as described in any one of claims 1 to 6 and at least two single-layer circuit boards, wherein two adjacent single-layer circuit boards are connected by at least one of the connecting devices to achieve connection between the upper single-layer circuit board and the lower single-layer circuit board.

8. The multi-layer circuit board according to claim 7, characterized in that: The connecting device is located at an edge of the single-layer circuit board.

9. The multi-layer circuit board according to claim 7, characterized in that: The connecting device is arranged close to the components of the single-layer circuit board.

10. The multi-layer circuit board according to claim 7, characterized in that: The single-layer circuit board is a single-sided or double-sided printed component.

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