Electronic component and electronic equipment

Abstract

According to the electronic assembly and the electronic equipment provided by the embodiment of the invention, the electronic assembly comprises the printed circuit board and the flexible circuit board, the first surface of the printed circuit board is provided with the first bonding pad, the second surface of the flexible circuit board is provided with the second bonding pad, and the first bonding pad and the second bonding pad are in welded connection. Therefore, physical connection and signal connection between the printed circuit board and the flexible circuit board can be realized. In order to improve the welding effect, a supporting structure is arranged between the printed circuit board and the flexible circuit board, so that a preset gap is formed between the printed circuit board and the flexible circuit board. The preset gap forms a gas outlet channel, and gas generated by a welding process is discharged between the printed circuit board and the flexible circuit board through the gas outlet channel, so that welding flux is not extruded, the welding reliability of the first bonding pad and the second bonding pad is improved, and the efficiency and reliability of signal transmission between the printed circuit board and the flexible circuit board are improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic component and an electronic equipment. Background Art

[0002] Flexible circuit board (FPC) has the advantages of high density and lightness. FPC can be welded to printed circuit board (PCB) to connect FPC and PCB and realize the transmission of signals on the board. In order to ensure the reliability of signal transmission between PCB and FPC, welding quality control should be done well to achieve high yield and high quality welding between PCB and FPC.

[0003] Figure 1 FIG. 1 is a schematic diagram of a cross-sectional structure of an electronic component in the prior art. Figure 1 As shown, in the prior art, the electronic component includes an FPC1 and a PCB2 connected by welding. For welding of FPC1 and PCB2, it is usually necessary to add a pressure head on the surface of FPC1 away from PCB2 to ensure that during the entire welding process, the surface of FPC1 facing PCB2 contacts the surface of PCB2 facing FPC1, thereby facilitating welding of the pads of the FPC and the pads of the PCB. Gas will be generated during the welding process. If the gas squeezes the molten solder, various defects will occur in the solder joints, the welding yield will be low, and the reliability of signal transmission between the PCB and the FPC will be poor. Summary of the invention

[0004] An electronic component and an electronic device provided in the embodiments of the present application improve the welding strength between a printed circuit board and a flexible circuit board, and improve the efficiency and reliability of signal transmission between the printed circuit board and the flexible circuit board.

[0005] In a first aspect, the present application provides an electronic component. The electronic component includes a printed circuit board and a flexible circuit board, wherein a first solder pad is provided on the first surface of the printed circuit board, and a second solder pad is provided on the second surface of the flexible circuit board, and the first solder pad and the second solder pad are connected by welding, so that the physical connection and signal connection between the printed circuit board and the flexible circuit board can be achieved. In order to improve the welding effect, a support structure is provided between the printed circuit board and the flexible circuit board, so that there is a preset gap between the printed circuit board and the flexible circuit board. The preset gap is formed as an air outlet channel, and the gas generated by the welding process is discharged between the printed circuit board and the flexible circuit board through the air outlet channel, so that the solder will not be squeezed, the welding reliability of the first solder pad and the second solder pad is improved, and the efficiency and reliability of signal transmission between the printed circuit board and the flexible circuit board are improved.

[0006] When the above-mentioned support structure is specifically formed, the support structure can be a single body structure. The support structure can be fixed to a printed circuit board or a flexible circuit board. For example, the above-mentioned support structure can be fixedly arranged on the first surface of the printed circuit board, and one end of the support structure away from the printed circuit board abuts against the second surface of the flexible circuit board. Alternatively, the above-mentioned support structure can also be fixedly arranged on the second surface of the flexible circuit board, and one end of the support structure principle flexible circuit board abuts against the first surface of the printed circuit board. In this solution, the support structure is relatively simple, and the precision requirements for the position manufacturing and design of the support structure are relatively low.

[0007] In another possible technical solution, the above-mentioned support structure is a split structure, for example, the support structure includes two parts. Specifically, the support structure includes a first support structure and a second support structure, the first support structure is fixedly arranged on the first surface of the printed circuit board, and the second support structure is fixedly arranged on the second surface of the flexible circuit board. The first support structure and the second support structure are offset from each other and supported between the flexible circuit board and the printed circuit board to form the above-mentioned preset gap. In this solution, the first support structure and the second support structure can be made shorter respectively, simplifying the preparation process of the support structure.

[0008] A plurality of supporting structures may be arranged between the flexible circuit board and the printed circuit board, and the plurality of supporting structures are evenly distributed between the printed circuit board and the flexible circuit board to form a relatively uniform air outlet channel.

[0009] In addition, the position of the support structure can be designed according to the actual distribution of the solder joints between the flexible circuit board and the printed circuit board. For example, the support structure is provided on at least two sides of the first solder pad. This solution can form an air outlet channel around the solder joints between the printed circuit board and the flexible circuit board in a targeted manner to discharge the gas generated by the solder joints.

[0010] The specific material forming the above-mentioned support structure is not limited. For example, the above-mentioned support structure includes at least one of a copper layer, a green oil layer, a white oil layer, a cover film and an adhesive film. The support structure formed on the surface of the printed circuit board is preferably made of materials required for preparing the printed circuit board, and the support structure formed on the surface of the flexible circuit board is preferably made of materials required for preparing the flexible circuit board, so as to simplify the preparation process of the support structure.

[0011] In another possible arrangement of the support structure, the support structure can also be arranged in the solder between the first pad and the second pad. This solution does not require the support structure to be formed when forming the printed circuit board or the flexible circuit board, and the support structure can be added during welding. The process of preparing the printed circuit board and the process of preparing the flexible circuit board are relatively simple, and the support structure is directly arranged at the welding point, which is more targeted.

[0012] In this solution, the shape of the support structure can have a variety of options, for example, the support structure can be a gasket, a ball or an irregular block.

[0013] In order to make the support structure more reliably fixed to the solder, at least the surface of the support structure is a metal surface. For example, the support structure can be a metal support structure with high support strength. Alternatively, the support structure can have a metal layer on the surface and a core made of a polymer material inside, which is low in cost.

[0014] In a second aspect, the present application further provides an electronic device. The electronic device comprises a housing and the electronic component provided in the first aspect, wherein the electronic component is disposed in the housing. The electronic device has high signal transmission efficiency and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of a cross-sectional structure of an electronic component in the prior art;

[0016] Figure 2 A schematic diagram of the structure of an electronic device in an embodiment of the present application;

[0017] Figure 3 A schematic diagram of the structure of an electronic component in an embodiment of the present application;

[0018] Figure 4 Another structural schematic diagram of an electronic component in an embodiment of the present application;

[0019] Figure 5 Another structural schematic diagram of an electronic component in an embodiment of the present application;

[0020] Figure 6 Another structural schematic diagram of an electronic component in an embodiment of the present application;

[0021] Figure 7 Another structural schematic diagram of an electronic component in an embodiment of the present application;

[0022] Figure 8 Another structural schematic diagram of an electronic component in an embodiment of the present application;

[0023] Fig. 9 Another structural schematic diagram of an electronic component in an embodiment of the present application;

[0024] Fig.10 Another structural schematic diagram of an electronic component in an embodiment of the present application;

[0025] Fig.11 A schematic diagram of the structure of a flexible circuit board in an embodiment of the present application;

[0026] Fig.12Another structural schematic diagram of a flexible circuit board in an embodiment of the present application;

[0027] Fig.13 A schematic diagram of a partial cross-sectional structure of an electronic component in an embodiment of the present application;

[0028] Fig.14 Another partial cross-sectional structural schematic diagram of an electronic component in an embodiment of the present application;

[0029] Fig.15 Another partial cross-sectional structural schematic diagram of an electronic component in an embodiment of the present application;

[0030] Fig.16 Another partial cross-sectional structural schematic diagram of an electronic component in an embodiment of the present application;

[0031] Fig.17 Another partial cross-sectional structural schematic diagram of an electronic component in an embodiment of the present application;

[0032] Fig.18 Another partial cross-sectional structural schematic diagram of an electronic component in an embodiment of the present application;

[0033] Fig.19 Another partial cross-sectional structural schematic diagram of an electronic component in an embodiment of the present application;

[0034] Fig. 20 Another partial cross-sectional structural schematic diagram of an electronic component in an embodiment of the present application.

[0035] Reference numerals:

[0036] 1- Printed circuit board;

[0037] 11- first surface;

[0038] 12- first pad;

[0039] 13- First line;

[0040] 2-Flexible circuit board;

[0041] 21- second surface;

[0042] 22- second pad;

[0043] 23- Second line;

[0044] 3- Connector;

[0045] 4-Packaging structure;

[0046] 5-Support structure;

[0047] 51- first supporting structure;

[0048] 52- second supporting structure;

[0049] 6-Preset gap;

[0050] 100-housing;

[0051] 200-Electronic components. DETAILED DESCRIPTION

[0052] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0053] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context.

[0054] References to "one embodiment" or "a specific embodiment" described in this specification mean that one or more embodiments of the present application include a particular feature, structure or characteristic described in conjunction with the embodiment. The terms "include", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0055] In order to facilitate understanding of the electronic components and electronic devices provided in the embodiments of the present application, their application scenarios are first introduced below.

[0056] The electronic device in the embodiment of the present application can be a communication device (such as a router), a computing device (such as a server), a network device (such as a switch) or a storage device (such as a storage array) or other electronic devices, or it can also be an electronic device such as an optical module, a vehicle-mounted device or a terminal device. The present application does not limit the specific type of electronic device, as long as the electronic device includes an electronic component connected to a flexible circuit board and a printed circuit board, the technical solution provided in the present application can be adopted.

[0057] For ease of description, the embodiments of the present application are described by taking the electronic device as a server as an example. Figure 2 is a schematic diagram of the structure of an electronic device in an embodiment of the present application, such as Figure 2 As shown, the electronic device may include a housing 100 and an electronic component 200 disposed in the housing 100. Specifically, when the electronic device is a cabinet server, the housing 100 may be understood as a cabinet of the cabinet server, and the electronic component 200 may include a node. Figure 2As shown, the electronic component 200 specifically includes a flexible circuit board 2 and a printed circuit board 1 , and the flexible circuit board 2 is connected to the printed circuit board 1 by welding to achieve physical connection and signal connection between the flexible circuit board 2 and the printed circuit board 1 .

[0058] The electronic components mentioned above can be applied to different application scenarios, or the electronic components can include different composition forms. For example, Figure 3 is a schematic diagram of the structure of an electronic component in an embodiment of the present application, such as Figure 3 As shown, in a specific embodiment, the flexible circuit board 2 in the above electronic assembly is used to implement a single-board jumper of the printed circuit board 1. Specifically, both ends of the flexible circuit board 2 are welded to the printed circuit board 1 to achieve signal transmission between two positions in the printed circuit board 1. Figure 4 is another structural schematic diagram of the electronic component in the embodiment of the present application, such as Figure 4 As shown, in another specific embodiment, the electronic assembly may include two printed circuit boards 1, and the two printed circuit boards 1 are approximately located in the same plane. The two ends of the flexible circuit board 2 are respectively welded to the two printed circuit boards 1, so that the flexible circuit board 2 is connected between the two printed circuit boards 1, so that the signal between the two printed circuit boards 1 can be transmitted through the flexible circuit board 2, and the interconnection between the boards is realized. Figure 5 is another structural schematic diagram of the electronic component in the embodiment of the present application, such as Figure 5 As shown, in another specific embodiment, the electronic assembly may include two printed circuit boards 1, and the two printed circuit boards 1 are located in different planes. The two ends of the flexible circuit board 2 are respectively welded to the two printed circuit boards 1, so that the flexible circuit board 2 is connected between the two printed circuit boards 1, so that the signal between the two printed circuit boards 1 can be transmitted through the flexible circuit board 2, and a cross-board connection is realized. Figure 6 is another structural schematic diagram of the electronic component in the embodiment of the present application, such as Figure 6 As shown, in another specific embodiment, one end of the flexible circuit board 2 in the electronic component is welded to the printed circuit board 1, and the other end is connected to the connector 3, so that the connector 3 and the printed circuit board 1 can be transmitted through the flexible circuit board 2, and then the printed circuit board 1 can be connected to an external device through the connector 3, and the flexible circuit board 2, the printed circuit board 1 and the connector 3 form an electronic module. Figure 7 is another structural schematic diagram of the electronic component in the embodiment of the present application, such as Figure 7 As shown, in another specific embodiment, the flexible circuit board 2 realizes the connection between the packaging structure 4 and the printed circuit board 1, so that signals can be transmitted between the packaging structure 4 and the printed circuit board 1. Specifically, one end of the flexible circuit board 2 is connected to the packaging structure 4, and the other end is connected to the printed circuit board 1.

[0059] Figure 8is another structural schematic diagram of the electronic component in the embodiment of the present application, such as Figure 8 As shown, in another specific embodiment, a single-layer flexible circuit board 2 may be welded on the surface of the printed circuit board 1 . Fig. 9 is another structural schematic diagram of the electronic component in the embodiment of the present application, such as Fig. 9 As shown, in another specific embodiment, the surface of the printed circuit board 1 can be welded with a multi-layer stacked flexible circuit board 2. In addition, the flexible circuit board 2 can be connected to one side of the printed circuit board 1, such as Figure 8 and Fig. 9 as shown. Alternatively, Fig.10 is another structural schematic diagram of the electronic component in the embodiment of the present application, such as Fig.10 As shown, in another specific embodiment, both sides of the printed circuit board 1 may be connected to the flexible circuit board 2 respectively.

[0060] The specific form of the flexible circuit board 2 in the embodiment of the present application is not limited. Fig.11 This is a schematic diagram of the structure of the flexible circuit board 2 in the embodiment of the present application. Fig.12 FIG. 2 is another structural diagram of the flexible circuit board 2 in the embodiment of the present application. In a possible embodiment, as Fig.11 As shown, the flexible circuit board 2 can be a one-to-one type flexible circuit board 2, that is, the flexible circuit board 2 is used to realize signal transmission between two points. Specifically, the flexible circuit board 2 includes two second pads 22, and the two second pads 22 are respectively located at two ends of the flexible circuit board 2. Fig.12 As shown, the flexible circuit board 2 can be a one-to-many type flexible circuit board 2, that is, the flexible circuit board 2 is used to realize signal transmission between one point and multiple points. Specifically, the flexible circuit board 2 includes multiple second pads 22, one of which is located at one end of the flexible circuit board 2, and at least two second pads 22 are located at the other end of the flexible circuit board 2.

[0061] Fig.13 FIG. 1 is a schematic diagram of a partial cross-sectional structure of an electronic component in an embodiment of the present application. Fig.13As shown, the surface of the printed circuit board 1 facing the flexible circuit board 2 is the first surface 11, and the first surface 11 of the printed circuit board 1 is provided with a first pad 12. The printed circuit board 1 also includes a first circuit 13, and the first pad 12 is connected to the first circuit 13. The surface of the flexible circuit board 2 facing the printed circuit board 1 is the second surface 21, and the second surface 21 of the flexible circuit board 2 is provided with a second pad 22. The flexible circuit board 2 also includes a second circuit 23, and the second pad is connected to the second circuit 23. The first pad 12 and the second pad 22 are welded and connected, so that the first circuit 13 and the second circuit 23 are connected, thereby realizing the physical connection and signal connection between the printed circuit board 1 and the flexible circuit board 2. A support structure 5 is provided between the printed circuit board 1 and the flexible circuit board 2, and the support structure 5 is supported between the printed circuit board 1 and the flexible circuit board 2, so that there is a preset gap 6 between the printed circuit board 1 and the flexible circuit board 2. The preset gap 6 forms an air outlet channel. When welding the first soldering pad 12 and the second soldering pad 22, the gas generated by the welding process is discharged from between the printed circuit board 1 and the flexible circuit board 2 through the air outlet channel, thereby not squeezing the solder, improving the welding reliability of the first soldering pad 12 and the second soldering pad 22, and improving the efficiency and reliability of signal transmission between the printed circuit board 1 and the flexible circuit board 2.

[0062] In a specific embodiment, the width of the preset gap 6 can be 10 microns to 500 microns, for example, 15 microns, 50 microns, 60 microns, 80 microns, 100 microns, 120 microns, 150 microns, 160 microns, 200 microns, 230 microns, 250 microns, 300 microns, 350 microns, 380 microns, 400 microns, 420 microns, 450 microns or 490 microns. The width of the preset gap 6 is at least 10 microns, so that the manufacturing process requirements are relatively low, and it is sufficient to allow the gas generated by the welding process to be discharged through the preset gap 6, and it is not easy for residual gas to squeeze the solder. In addition, the width of the preset gap 6 does not exceed 500 microns, the thickness of the solder between the pads is low, the strength is high, and the connection between the first pad 12 and the second pad 22 is more reliable. In short, the setting of the gap needs to enable the gas to be fully discharged, and the first pad 12 and the second pad 22 can be reliably connected.

[0063] Fig.14 FIG. 1 is another partial cross-sectional structural diagram of an electronic component in an embodiment of the present application. Fig.13 and Fig.14 As shown, when forming the above-mentioned support structure 5, the support structure 5 at a position between the printed circuit board 1 and the flexible circuit board 2 can be an independent integrated structure, and the support structure 5 is fixed to the printed circuit board 1 or the flexible circuit board 2. Specifically, as Fig.13As shown in FIG. 1 , in one possible implementation, the support structure 5 is fixedly disposed on the first surface 11 of the printed circuit board 1, and during welding, one end of the support structure 5 away from the printed circuit board 1 abuts against the second surface 21 of the flexible circuit board 2. It can be understood that the support structure 5 includes two opposite ends, one end is fixedly disposed on the printed circuit board 1, and the other end abuts against the flexible circuit board 2. In another possible implementation, as shown in FIG. Fig.14 As shown, the support structure 5 is fixedly arranged on the second surface 21 of the flexible circuit board 2, and during welding, one end of the support structure 5 away from the flexible circuit board 2 abuts against the first surface 11 of the printed circuit board 1. It can be understood that the support structure 5 includes two opposite ends, one end is fixedly arranged on the flexible circuit board 2, and the other end abuts against the printed circuit board 1. In the above two implementations, the requirements for the position of the support structure 5 against which the support structure 5 abuts are relatively low, and the requirements for the precision of the manufacturing and design of the position of the support structure 5 are relatively low. In addition, the preparation process can be simplified by preparing the support structure 5 only on one side.

[0064] Fig.15 FIG. 1 is another partial cross-sectional structural diagram of an electronic component in an embodiment of the present application. Fig.15 As shown, in another possible embodiment, the support structure 5 at a position between the printed circuit board 1 and the flexible circuit board 2 can be a split structure, including two parts, and the two parts specifically include a first support structure 51 and a second support structure 52. The first support structure 51 is fixedly arranged on the first surface 11 of the printed circuit board 1, and the second support structure 52 is fixedly arranged on the second surface 21 of the flexible circuit board 2. When the printed circuit board 1 and the flexible circuit board 2 are welded, the printed circuit board 1 and the flexible circuit board 2 are opposite, and the first support structure 51 and the second support structure 52 are offset to form the support structure 5 to support the printed circuit board 1 and the flexible circuit board 2 to form a preset gap 6, so that the preset gap 6 serves as an air outlet channel. In this solution, the support structure 5 includes two parts, so when forming a support structure 5 of a certain height, especially a higher support structure 5, the first support structure 51 and the second support structure 52 can be made shorter respectively, simplifying the preparation process of the support structure 5.

[0065] Fig.16 FIG. 1 is another partial cross-sectional structural diagram of an electronic component in an embodiment of the present application. Fig.16As shown, in a specific application, the printed circuit board 1 may include a plurality of first pads 12, and correspondingly, the flexible circuit board 2 may also be provided with a plurality of second pads 22, and the first pads are welded to the second pads to form a plurality of solder joints between the printed circuit board 1 and the flexible circuit board 2. A plurality of support structures 5 may be provided between the printed circuit board 1 and the flexible circuit board 2. When the plurality of support structures 5 are provided, there may be a variety of numbers and arrangements of the support structures 5. In a possible embodiment, the support structures 5 are evenly distributed between the printed circuit board 1 and the flexible circuit board 2, thereby forming a relatively uniform air outlet channel.

[0066] Alternatively, in another possible embodiment, the position of the support structure can also be designed according to the actual distribution of the solder joints between the printed circuit board 1 and the flexible circuit board 2. For example, the first solder pad 12 is provided with support structures 5 on both sides along a certain direction, that is, the solder joints are provided with support structures 5 on both sides along a certain direction. An air outlet channel is formed around the solder joints between the printed circuit board 1 and the flexible circuit board 2 to discharge the gas generated by the solder joints.

[0067] In another possible embodiment, the support structure 5 may be arranged in a set shape such as a ring to support between the printed circuit board 1 and the flexible circuit board 2 .

[0068] The specific material forming the above-mentioned support structure 5 is also not limited. For example, the above-mentioned support structure 5 can be at least one of a copper layer (copper wire or copper sheet), a green oil layer, a white oil layer, a covering film and an adhesive film. The materials of different support structures 5 can be the same or different, and can be selected and designed according to the specific form of the product. This application does not limit this. Specifically, the support structure 5 formed on the surface of the printed circuit board 1 preferably uses the material required for preparing the printed circuit board 1, and the support structure 5 formed on the surface of the flexible circuit board 2 preferably uses the material required for preparing the flexible circuit board 2, so as to simplify the preparation process of the support structure 5.

[0069] Fig.17 FIG. 1 is a schematic diagram of a partial cross-sectional structure of an electronic component in an embodiment of the present application. Fig.17As shown, in another possible embodiment, the support structure 5 can also be arranged in the solder between the first pad 12 and the second pad 22. Specifically, the first pad 12 and the second pad 22 are connected by welding through the solder, and the support structure 5 is arranged in the solder, so that a preset gap 6 can be formed. This solution does not need to form the support structure 5 when preparing the printed circuit board 1 or the flexible circuit board 2. The support structure 5 can be added during welding. The process of preparing the printed circuit board 1 and the process of preparing the flexible circuit board 2 are relatively simple, and the support structure 5 is directly arranged at the soldering point, which is more targeted. It is worth noting that the support structure 5 is arranged in the solder, which does not mean that the solder completely covers the support structure 5. It can be understood that the support structure 5 is fixed between the printed circuit board 1 and the flexible circuit board 2 by the solder.

[0070] In this embodiment, the shape of the support structure 5 is not limited, and it can be a gasket shape, a spherical shape, or an irregular shape, which can be set according to actual needs.

[0071] In addition, in an optional implementation, the support structure 5 may be a metal support structure, that is, the entire support structure 5 is made of metal material. The metal support structure has a strong strength and a good support effect. In another optional implementation, the support structure 5 may only have a metal layer on the surface and a non-metallic core inside. The support structure 5 of this solution has a low cost. In short, the support structure 5 needs to be weldable by a welding process, and at least the outer surface is made of metal.

[0072] Specifically, the printed circuit board 1 includes a plurality of first solder pads 12, and correspondingly, the flexible circuit board 2 may also be provided with a plurality of second solder pads 22. Each group of first solder pads 12 and second solder pads 22 welded together form a solder joint, thereby forming a plurality of solder joints between the printed circuit board 1 and the flexible circuit board 2. Figure 18 to Figure 20 FIG. 1 is a schematic diagram of a partial cross-sectional structure of an electronic component in different embodiments of the present application, showing a layout diagram of a support structure 5 provided in a solder joint, such as Fig.18 As shown, in a possible implementation, a support structure 5 may be provided in each solder joint, or a support structure 5 may be provided between each first solder pad 12 and the second solder pad 22. Fig.19 As shown in FIG. 1 , in another possible embodiment, a support structure 5 may be provided for each soldering point among the plurality of soldering points. In other words, a support structure 5 may be provided for each first soldering pad 12. Alternatively, as shown in FIG. Fig. 20 As shown, a support structure 5 may be provided every two or more welding points in a plurality of welding points, so as to reduce the number of support structures 5 and simplify the welding process.

[0073] The number of support structures 5 provided between a welding point can also be selected according to demand. In order to simplify the welding process and improve the supporting effect, only one support structure 5 can be provided in a welding point.

[0074] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. An electronic component, characterized in that: It comprises a printed circuit board and a flexible circuit board, wherein a first solder pad is arranged on a first surface of the printed circuit board, and a second solder pad is arranged on a second surface of the flexible circuit board, and the first solder pad and the second solder pad are connected by welding; A supporting structure is arranged between the printed circuit board and the flexible circuit board, so that a preset gap is formed between the printed circuit board and the flexible circuit board.

2. The electronic component according to claim 1, wherein: The support structure is fixedly disposed on the first surface of the printed circuit board and abuts against the second surface of the flexible circuit board; or, the support structure is fixedly disposed on the second surface of the flexible circuit board and abuts against the first surface of the printed circuit board.

3. The electronic component according to claim 1, wherein: The support structure includes a first support structure and a second support structure. The first support structure is fixedly disposed on the first surface of the printed circuit board, and the second support structure is fixedly disposed on the second surface of the flexible circuit board. The first support structure and the second support structure are against each other.

4. The electronic component according to any one of claims 1 to 3, characterized in that: The supporting structure is evenly distributed between the printed circuit board and the flexible circuit board.

5. The electronic component according to any one of claims 1 to 4, characterized in that: The supporting structure is disposed on at least two sides of the first pad.

6. The electronic component according to any one of claims 1 to 4, characterized in that: The support structure includes at least one of a copper layer, a green oil layer, a white oil layer, a covering film and an adhesive film.

7. The electronic component according to claim 1, wherein: The support structure is disposed in the solder between the first pad and the second pad.

8. The electronic component according to claim 7, wherein: The supporting structure is a gasket or a ball.

9. The electronic component according to claim 7 or 8, characterized in that: The support structure is a metal support structure, or the surface of the support structure has a metal layer.

10. An electronic device, characterized in that: The invention comprises a housing and the electronic component according to any one of claims 1 to 9, wherein the electronic component is arranged in the housing.

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