Shell, manufacturing method thereof and electronic equipment

Abstract

The invention relates to the technical field of shell manufacturing of electronic equipment, provides a shell and a manufacturing method thereof, and electronic equipment, and can solve the problem that the shell of the electronic equipment in the related technology is poor in waterproofness. The shell is used in the electronic equipment and comprises a frame, the frame comprises an outer frame and an inner frame arranged in a space defined by the outer frame, the outer frame is a metal frame or an alloy frame, the inner frame is an insulating frame and is integrally formed with the outer frame in an injection molding mode, and a bonding layer is arranged between the joint faces of the inner frame and the outer frame. The method can be applied to electronic equipment such as smart watches and mobile phones.

Description

Technical Field

[0001] The present application relates to the technical field of shell manufacturing of electronic equipment, and in particular to a shell and a manufacturing method thereof, and an electronic equipment. Background Art

[0002] With the development of electronic technology, electronic devices such as smart watches are becoming more and more widely used because of their small size and portability. In life, such electronic devices will inevitably come into contact with water. Since there are usually many electronic components inside the electronic devices, once water enters from the outside of the electronic devices, the electronic components are prone to short circuit and burn out, causing the electronic devices to fail to work properly. Therefore, electronic devices have high requirements for waterproof performance. The housing is one of the main components of electronic devices and plays an important role in the waterproofness of electronic devices. Whether the housing design is reasonable is directly related to the waterproof performance of electronic devices.

[0003] A frame of a shell of an electronic device in the related art includes an inner frame and an outer frame arranged outside the inner frame, the inner frame is a plastic frame, the outer frame is a metal frame or an alloy frame, and the inner frame and the outer frame are integrally formed by injection molding. However, in the shell of the related art, the connection strength between the inner frame and the outer frame is easily affected by the different materials of the outer frame. Different outer frame materials will result in different connection strengths between the inner frame and the outer frame, which makes the joint firmness of the inner frame and the outer frame unstable, and the inner frame and the outer frame are prone to cracking due to insufficient connection strength, thereby reducing the waterproofness of the electronic device, and external water can easily enter the interior of the electronic device along the gap to affect the normal operation of the electronic device. Summary of the invention

[0004] The embodiments of the present application provide a housing and a manufacturing method thereof, and an electronic device, which are used to solve the problem of poor waterproofness of the housing of the electronic device in the related art.

[0005] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0006] In the first aspect, an embodiment of the present application provides a shell for use in an electronic device, comprising a frame, the frame comprising an outer frame and an inner frame arranged in the space enclosed by the outer frame, the outer frame is a metal frame or an alloy frame, the inner frame is an insulating frame and is injection molded as one piece with the outer frame, and an adhesive layer is provided between the joint surfaces of the inner frame and the outer frame.

[0007] The shell in the embodiment of the present application is provided with an adhesive layer between the joint surfaces of the inner frame and the outer frame, which is beneficial to improving the connection strength between the joint surfaces of the inner frame and the outer frame, overcoming the problem of reduced connection strength caused by using different materials for the outer frame and the inner frame, making the joint between the inner frame and the outer frame more secure, thereby avoiding cracks between the inner frame and the outer frame due to insufficient connection strength, which is beneficial to improving the waterproofness of the shell, and further ensuring the normal operation of the electronic device.

[0008] In some embodiments, the inner frame includes an inner frame body and a first connecting wall disposed on the inner circumference of the inner frame body; the outer frame includes an outer frame body, a second connecting wall disposed on the inner circumference of the outer frame body, and a protrusion disposed on the second connecting wall, the second connecting wall is embedded in the first connecting wall; the first connecting wall is provided with an avoidance hole, the avoidance hole allows the protrusion to extend out of the first connecting wall; an adhesive layer is provided between the joint surfaces of the first connecting wall and the second connecting wall. In this way, water can be prevented from entering between the inner frame and the outer frame, thereby preventing water outside the housing from entering the interior of the housing at the starting end of the waterproof path.

[0009] In some embodiments, the protrusion is an antenna feed point, the outer frame as a whole constitutes the antenna, and the protrusion is electrically connected to the outer frame through the second connecting wall. Such an arrangement is conducive to improving the performance of the antenna.

[0010] In some embodiments, the protrusion is a nut column, and the nut column is used to connect with the circuit board. Such a configuration not only facilitates the fixing of the circuit board, but also helps to save space in the central area inside the frame.

[0011] In some embodiments, the outer frame includes an outer frame body, the inner frame includes an inner frame body and a flange disposed at an end edge of the inner frame body along the axial direction, the flange extending toward a side close to the outer peripheral surface of the outer frame body; an adhesive layer is disposed between the joint surface of the inner frame body and the outer frame body, and between the joint surface of the flange and the outer frame body. Such an arrangement can increase the connection strength between the inner frame body and the outer frame body, increase the connection strength between the flange and the outer frame body, and increase the connection strength between the flange and the outer frame body, thereby preventing water outside the housing from entering the interior of the housing at the starting end of the waterproof path.

[0012] In some embodiments, the inner frame and the outer frame are integrally formed by nano injection molding; the joint surface of the outer frame has a first micropore, a portion of the adhesive layer covers the hole wall of the first micropore, and the joint surface of the inner frame has a first microstructure, the first microstructure extends into the first micropore and is bonded to the adhesive layer. In this way, the first microstructure can be firmly fixed in the first micropore, thereby increasing the connection strength between the inner frame and the outer frame.

[0013] In some embodiments, the inner frame and the outer frame are integrally formed by nano injection molding; the joint surface of the outer frame has a second micropore, and the joint surface of the inner frame has a second microstructure, and the second microstructure passes through the adhesive layer and extends into the second micropore. In this way, the second microstructure can be firmly fixed in the second micropore, and the connection strength between the inner frame and the outer frame can still meet the requirements in the area where the adhesive layer is thinner.

[0014] In some embodiments, the joint surface of the outer frame has a third micropore, part of the adhesive layer fills the third micropore, and the joint surface of the inner frame is bonded to the adhesive layer. This arrangement increases the contact area between the adhesive layer and the outer frame, making it difficult for the adhesive layer to peel off from the joint surface of the outer frame, thereby facilitating the improvement of the connection strength between the inner frame and the outer frame.

[0015] In some embodiments, the inner frame further comprises a first connecting wall disposed on the inner circumference of the inner frame body; the outer frame further comprises a second connecting wall disposed on the inner circumference of the outer frame body, and a protrusion disposed on the second connecting wall, the second connecting wall being embedded in the interior of the first connecting wall; the first connecting wall is provided with an avoidance hole, the avoidance hole allowing the protrusion to extend out of the first connecting wall; a receiving groove is formed between the hole wall of the avoidance hole and the protrusion, a gap is provided between the joint surfaces of the first connecting wall and the second connecting wall, the gap is connected to the receiving groove, and a sealing layer is filled in the receiving groove and the gap. With such a configuration, the sealing layer can block the gap and the receiving groove to prevent water from entering the interior of the shell from the receiving groove, and the sealing layer and the adhesive layer prevent water outside the shell from entering the interior of the shell at the end and the starting end of the waterproof path respectively.

[0016] In some embodiments, the surface hardness of the joint surface of the outer frame is greater than the core hardness of the outer frame, and there is a crystal phase change at the joint surface of the outer frame; the crystal phase change includes at least one of crystal distortion, crystal dislocation and crystal slip. In this way, during the nano injection molding process, the corrosion sensitivity of the joint surface of the outer frame to the T treatment liquid is improved, so that the effect of the T treatment is better, which is conducive to improving the connection strength between the inner frame and the outer frame.

[0017] In a second aspect, an embodiment of the present application provides an electronic device, comprising a shell as described in any embodiment of the first aspect; the shell comprises a front panel, a rear cover and a frame, the front panel, the rear cover and the frame form a storage space, and the storage space is used to arrange electronic components.

[0018] The beneficial effects of the electronic device in the embodiment of the present application are the same as the beneficial effects of the shell in the first aspect, and will not be repeated here.

[0019] In some embodiments, the electronic device is a smart watch.

[0020] In a third aspect, an embodiment of the present application provides a method for manufacturing a shell, the shell is used in an electronic device, the shell includes a frame, the frame includes an outer frame and an inner frame arranged in a space surrounded by the outer frame, the outer frame is a metal frame or an alloy frame, and the inner frame is an insulating frame and is integrally formed with the outer frame by injection molding. The method for manufacturing the shell includes: covering an adhesive layer on a joint surface of the outer frame for joining with the inner frame; joining an insulating material to a joint surface of the outer frame by an injection molding process to form an inner frame; wherein the adhesive layer is located between the joint surfaces of the inner frame and the outer frame.

[0021] The beneficial effects of the method for manufacturing the shell in the embodiment of the present application are the same as the beneficial effects of the shell in the first aspect, and will not be repeated here.

[0022] In some embodiments, the inner frame includes an inner frame body and a first connecting wall disposed on the inner circumference of the inner frame body; the outer frame includes an outer frame body, a second connecting wall disposed on the inner circumference of the outer frame body, and a protrusion disposed on the second connecting wall, the second connecting wall is embedded in the interior of the first connecting wall, and the first connecting wall is provided with an avoidance hole, and the avoidance hole allows the protrusion to extend out of the first connecting wall. The bonding surface of the outer frame for bonding with the inner frame is covered with an adhesive layer, including: the bonding surface of the second connecting wall for bonding with the first connecting wall is covered with an adhesive layer. In this way, the connection strength between the first connecting wall and the second connecting wall can be increased, thereby preventing water outside the shell from entering the interior of the shell at the end of the waterproof path.

[0023] In some embodiments, the outer frame includes an outer frame body, the inner frame includes an inner frame body and a flange arranged at an end edge of the inner frame body along the axial direction, and the flange extends to one side close to the outer peripheral surface of the outer frame body. The bonding surface of the outer frame used to engage with the inner frame is covered with an adhesive layer, including: covering the bonding surface of the outer frame body used to engage with the inner frame body with an adhesive layer, and covering the bonding surface of the outer frame body used to engage with the flange with an adhesive layer. In this way, the connection strength between the inner frame body and the outer frame body can be increased, and the connection strength between the flange and the outer frame body can be increased, and water can be prevented from entering between the inner frame and the outer frame, thereby preventing water outside the shell from entering the interior of the shell at the starting end of the waterproof path.

[0024] In some embodiments, the bonding surface of the outer frame for bonding with the inner frame is covered with an adhesive layer; the insulating material is bonded to the bonding surface of the outer frame by an injection molding process to form the inner frame, including: performing T treatment on the bonding surface of the outer frame for bonding with the inner frame to form micropores on the bonding surface of the outer frame; arranging an adhesive layer on the bonding surface of the outer frame to cover the micropores; bonding the insulating material to the bonding surface of the outer frame by a nano injection molding process to form the inner frame; wherein the micropores include first micropores, part of the adhesive layer covers the hole wall of the first micropores, the bonding surface of the inner frame has a first microstructure, the first microstructure extends into the first micropore and is bonded to the adhesive layer; and / or the micropores include second micropores, the bonding surface of the inner frame has a second microstructure, and the second microstructure extends into the second micropore through the adhesive layer. In this way, the first microstructure can be firmly fixed in the first micropore, and the second microstructure can be firmly fixed in the second micropore, thereby increasing the connection strength between the inner frame and the outer frame.

[0025] In some embodiments, the inner frame further comprises a first connecting wall disposed on the inner circumference of the inner frame body; the outer frame further comprises a second connecting wall disposed on the inner circumference of the outer frame body, and a protrusion disposed on the second connecting wall, the second connecting wall being embedded in the interior of the first connecting wall; a avoidance hole is provided on the first connecting wall, the avoidance hole allowing the protrusion to extend out of the first connecting wall; a receiving groove is formed between the hole wall of the avoidance hole and the protrusion, a gap is provided between the joint surfaces of the first connecting wall and the second connecting wall, the gap being connected to the receiving groove. After the insulating material is joined to the joint surface of the outer frame through an injection molding process to form the inner frame, the method further comprises: injecting a sealing material into the receiving groove to form a first sealing layer covering the gap; pressurizing the interior of the receiving groove to allow part of the first sealing layer to fill the gap; injecting a sealing material into the receiving groove to form a second sealing layer covering the first sealing layer; wherein the first sealing layer and the second sealing layer form a sealing layer. Such an arrangement can reduce the amount of sealant material injected into the receiving groove each time, and avoid the generation of more bubbles during the curing process in the receiving groove when the amount of sealant material injected is large, thereby facilitating the improvement of the sealing performance of the sealant layer.

[0026] In some embodiments, before the pressure treatment is applied to the interior of the receiving tank, the process further includes: applying negative pressure to the receiving tank to remove bubbles in the first sealant layer. This arrangement can further reduce the bubbles in the sealant layer, thereby facilitating the improvement of the sealing performance of the sealant layer.

[0027] In some embodiments, after the second sealant layer is formed, the method further includes: applying negative pressure to the receiving groove to remove bubbles in the second sealant layer. This arrangement can further reduce the bubbles in the sealant layer, thereby facilitating the improvement of the sealing performance of the sealant layer.

[0028] In some embodiments, before the bonding surface of the outer frame for bonding with the inner frame is covered with the adhesive layer, the method further includes: performing a surface phase change treatment on the bonding surface of the outer frame for bonding with the inner frame, wherein the surface phase change treatment includes at least one of sandblasting, shot peening, and laser shot peening. In this way, the corrosion sensitivity of the bonding surface of the outer frame to the T treatment liquid is increased, thereby making the T treatment effect better, which is beneficial to improving the connection strength between the inner frame and the outer frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram of a nano injection molding process in the related art is shown;

[0030] Figure 2 It is a structural schematic diagram of an electronic device housing in the related art;

[0031] Figure 3 This is a schematic diagram of the structure of an electronic device in some embodiments of the present application;

[0032] Figure 4 for Figure 3 An exploded view of a housing of an electronic device;

[0033] Figure 5 for Figure 3 A cross-sectional view of an electronic device at AA after removing the internal electronic components;

[0034] Figure 6 for Figure 3 A cross-sectional view of an electronic device at BB after removing the internal electronic components;

[0035] Figure 7 for Figure 4 An exploded view of the frame shown in ;

[0036] Figure 8 It is a cross-sectional view of the frame in the first embodiment of the present application;

[0037] Fig. 9 is a cross-sectional view of a frame in the second embodiment of the present application;

[0038] Fig.10 is a cross-sectional view of a frame in a third embodiment of the present application;

[0039] Fig.11 is a cross-sectional view of a frame in a fourth embodiment of the present application;

[0040] Fig.12 Schematic diagram of the connection structure at the joint surface of the inner frame and the outer frame in some embodiments of the present application Figure 1 ;

[0041] Fig.13Schematic diagram of the connection structure at the joint surface of the inner frame and the outer frame in some embodiments of the present application Figure 2 ;

[0042] Fig.14 Schematic diagram of the connection structure at the joint surface of the inner frame and the outer frame in some embodiments of the present application Figure 3 ;

[0043] Fig.15 A microscopic image showing the effect of the treatment of the joint surface T of the outer frame in some embodiments of the present application;

[0044] Fig.16 for Fig.15 A partial enlarged view of the central area in FIG.

[0045] Fig.17 Microscopic images of the treatment effect of the joint surface T of the outer frame in other embodiments of the present application;

[0046] Fig.18 for Fig.17 A partial enlarged view of the central area in FIG.

[0047] Fig.19 A flowchart of making a frame in some embodiments of the present application;

[0048] Fig. 20 A schematic diagram of a frame manufacturing process in some embodiments of the present application;

[0049] Fig.21 A schematic diagram of the crystal structure of the outer frame from the joint surface to the inside in some embodiments of the present application;

[0050] Fig. 22 for Fig.21 Vickers hardness values ​​at different depths of hardness test points;

[0051] Fig.23 A process flow chart of setting a sealant layer in a receiving groove in some embodiments of the present application;

[0052] Fig.24a Schematic diagram of the process of setting a sealant layer in a receiving groove in some embodiments of the present application Figure 1 ;

[0053] Figure 24b Schematic diagram of the process of setting a sealant layer in a receiving groove in some embodiments of the present application Figure 2 ;

[0054] Fig.24c Schematic diagram of the process of setting a sealant layer in a receiving groove in some embodiments of the present application Figure 3 ;

[0055] Fig.24dSchematic diagram of the process of setting a sealant layer in a receiving groove in some embodiments of the present application Figure 4 ;

[0056] Fig.24e Schematic diagram of the process of setting a sealant layer in a receiving groove in some embodiments of the present application Figure 5 . DETAILED DESCRIPTION

[0057] In order to better understand the contents of the embodiments of the present application, the relevant technical terms involved in the embodiments of the present application are explained and described below.

[0058] Metal: refers to a class of substances that have a unique luster (i.e., reflect visible light) but are opaque, ductile, and have thermal and electrical conductivity. In a narrow sense, metal refers to a single substance composed of metal elements. Metals are generally solid at room temperature (except mercury), most of which are excellent conductors of electricity and heat, have high density, and high melting point.

[0059] Alloy is a mixture with metallic properties synthesized by two or more metals and metals, or two or more metals and non-metals through a certain method. It is generally obtained by melting into a uniform liquid and solidifying. According to the number of constituent elements, it can be divided into binary alloys, ternary alloys and multi-element alloys.

[0060] Plastic (also known as plastics): Mainly composed of carbon, oxygen, hydrogen, nitrogen and other organic or inorganic elements. The finished product is solid, and it is a molten liquid during the manufacturing process. Therefore, it can be heated to melt, pressurized to make it flow, and cooled to solidify, so that it can be formed into various shapes. This large and varied family of materials is called plastics.

[0061] Injection molding process: refers to the process of making semi-finished products of a certain shape by pressurizing, injecting, cooling, and separating molten raw materials. The injection molding process of plastic parts mainly includes six stages: mold closing - filling - pressure holding - cooling - mold opening - demoulding. Injection molding process includes insert injection molding process and nano injection molding process.

[0062] Insert Molding: It is a process that the insert is fixed in the appropriate position in the injection mold in advance, and then non-metallic materials (such as plastic) are injected to form the mold. After the mold is opened, the insert is tightly wrapped by the cooled and solidified non-metallic material and buried in the non-metallic material to obtain a product with inserts such as threads and electrodes. The molded parts embedded or connected inside the non-metallic material are called inserts. The materials of the inserts are usually metal, glass, wood, fiber, paper, rubber, etc. The most common material of the insert is metal.

[0063] Nano injection molding technology refers to nano molding technology (NMT, full name Nano Molding Technology), which is a process that combines metal and non-metallic materials (such as plastics) with nano technology, that is, the metal surface is first nano-treated, and then the non-metallic material is directly injected and molded on the metal surface, so that the metal and non-metallic materials can be integrally formed and finally combined into a product. The "nano" here refers to a microporous process, that is, the metal surface is treated with nano-level microporous treatment through a specific solution, the main purpose of which is to make the metal surface and non-metallic materials better combined and improve the connection strength.

[0064] like Figure 1 As shown, Figure 1 The schematic diagram of the nano injection molding process in the related art is shown. The key point of the nano injection molding process is the nano treatment of metal materials. The process flow mainly includes:

[0065] (1) Metal parts processing: Figure 1 As shown in (a) in the figure, the metal part is processed (such as stamping, forging, etc.) into a preset shape.

[0066] (2) Alkali treatment: Figure 1 As shown in (b), the metal parts are immersed in alkaline liquid to remove the grease attached to the surface of the metal parts.

[0067] (3) Acid treatment: Figure 1 As shown in (c), an acidic liquid is used to remove the metal oxide layer on the joint surface of the metal part (the upper surface of the metal part in the figure) and activate it, and then larger nanopores are corroded on the joint surface of the metal part. At the same time, the acidic liquid can neutralize the alkalinity after the alkali treatment, so that the metal part is in a neutral state.

[0068] (4) T treatment: Figure 1 As shown in (d) in the figure, by immersing the joint surfaces of the metal parts in a T treatment agent (weakly acidic), smaller nanoscale pores are further formed on the joint surfaces of the metal parts.

[0069] (5) Injection molding: Figure 1 As shown in (e), the metal part is placed in the mold for injection molding, and the non-metallic material (such as plastic material) forms a tightly combined structure with the metal part, and the injection molding is completed.

[0070] High temperature resistant glue, also known as high temperature resistant adhesive, can maintain good bonding performance and corrosion resistance at high temperatures (such as 200℃-2300℃), has a long service life, and is used for bonding asbestos, ceramics, metals, gold carbide, etc. High temperature resistant glue can be divided into two categories according to its properties: organic high temperature resistant glue and inorganic high temperature resistant glue.

[0071] Organic high temperature resistant adhesives generally have a temperature range below 500°C, and mainly include silicone adhesives, phenolic resin adhesives, urea-formaldehyde resin adhesives, heat-resistant epoxy adhesives, polyimide adhesives, etc. This type of adhesive can be soft and elastic, or tough, or hard and rigid. This type of adhesive can generally be added with functional fillers to give it insulation, thermal conductivity, magnetic conductivity, fire resistance, flame retardancy and other functions.

[0072] Inorganic high temperature resistant adhesive has a temperature resistance value of over 500°C and can reach up to 2300°C. It can be used for a long time in fire. Inorganic high temperature resistant adhesive is a high temperature resistant inorganic nano-composite adhesive made by condensation reaction of inorganic nano-materials. By screening the ingredient ratio and preparation process parameters, the adhesive is a suspended dispersion system with a neutral pH value. It not only has strong bonding strength and is non-corrosive to metal substrates, but also can maintain good bonding properties and corrosion resistance at high temperatures and has a long service life.

[0073] Sandblasting: The process of cleaning and roughening the surface of the substrate by the impact of high-speed sand flow. Compressed air can be used as the power to form a high-speed jet beam to spray the material (copper ore sand, quartz sand, corundum, iron sand, Hainan sand) at high speed onto the surface of the workpiece to be processed, so that the appearance or shape of the outer surface of the workpiece surface changes. Due to the impact and cutting action of the material on the workpiece surface, the surface of the workpiece obtains a certain degree of cleanliness and different roughness, and the mechanical properties of the workpiece surface are improved, thereby improving the fatigue resistance of the workpiece, increasing the adhesion between it and the coating, extending the durability of the coating, and also facilitating the leveling and decoration of the coating.

[0074] Sealant: refers to a sealing material that deforms with the shape of the sealing surface, is not easy to flow, and has a certain degree of adhesion. It is an adhesive used to fill the gap of the configuration to play a sealing role. Sealant has the functions of preventing leakage, waterproofing, vibration prevention, sound insulation, and heat insulation. Sealant is usually made of dry or non-dry viscous substances such as asphalt, natural resin or synthetic resin, natural rubber or synthetic rubber, etc., with inert fillers such as talcum powder, white clay, carbon black, titanium dioxide and asbestos, and then added with plasticizers, solvents, curing agents, accelerators, etc. It can be divided into three categories: elastic sealant, liquid sealing gasket and sealing putty. It is widely used in the sealing of construction, transportation, electronic instruments and parts.

[0075] Shot peening: It is a surface strengthening process, that is, a cold processing process that uses pellets to bombard the surface of the workpiece and implant residual compressive stress to improve the fatigue strength of the workpiece. It is widely used to improve the mechanical strength of parts and their wear resistance, fatigue resistance and corrosion resistance. The medium used in shot peening can be round particles, such as steel shot, iron shot, glass shot and ceramic shot. The difference between shot peening and shot blasting is that shot peening uses high-pressure wind or compressed air as the power, while shot blasting generally uses a high-speed rotating flywheel to eject steel sand at high speed.

[0076] Laser shot peening: refers to the process in which a laser beam is shot at the surface of the part, generating a pulse pressure (such as 7GPa) and passing through the part in the form of a shock wave. The residual compressive stress generated can be more than 10 times that of ordinary shot peening.

[0077] The technical solutions in some embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0078] With the development of electronic technology, electronic devices such as smart watches, smart bracelets, and mobile phones are becoming more and more widely used because of their small size and portability. In life, such electronic devices will inevitably come into contact with water. For example, water is easy to splash onto electronic devices when bathing, swimming, or rafting. Since electronic devices usually have many electronic components inside, once water enters from the outside of the electronic device, the electronic components are prone to short circuit and burn out, causing the electronic device to fail to work properly. Therefore, electronic devices have high requirements for waterproof performance.

[0079] The housing is one of the main components of electronic equipment and plays an important role in the waterproofing of electronic equipment. Whether the housing is designed reasonably is directly related to the waterproofing performance of the electronic equipment. Therefore, how to design the structure of the housing has become an important topic in the industry.

[0080] like Figure 2 As shown, Figure 2 The structure diagram of the housing of an electronic device (such as a smart watch) in the related art. The housing of the electronic device includes a frame 01, a front cover plate 02 and a rear cover plate 03. The front cover plate 02 is arranged on one side of the frame 01, and the rear cover plate 03 is arranged on the other side of the frame 01. The front cover plate 02, the rear cover plate 03 and the frame 01 enclose a housing space 04, and the housing space 04 is used to accommodate electronic components such as circuit boards. The frame 01 includes an inner frame 011 and an outer frame 012 arranged outside the inner frame 011. The inner frame 011 is a plastic frame, and the outer frame 012 is a metal frame or an alloy frame. The inner frame 011 and the outer frame 012 are integrally formed by injection molding.

[0081] In the shell of the electronic device in the related art, the connection strength between the inner frame 011 and the outer frame 012 is easily affected by the different materials of the outer frame 012. Different materials of the outer frame 012 will result in different connection strengths between the inner frame 011 and the outer frame 012, which makes the joining firmness of the inner frame 011 and the outer frame 012 unstable. The inner frame 011 and the outer frame 012 are prone to cracking and forming a gap due to insufficient connection strength, thereby reducing the waterproofness of the electronic device. External water can easily enter the interior of the electronic device along the gap to affect the normal operation of the electronic device.

[0082] To this end, the present application provides a shell and a manufacturing method thereof, and an electronic device, wherein an adhesive layer is provided between the joint surfaces of the inner frame and the outer frame so that the joint strength between the inner frame and the outer frame is relatively stable, thereby improving the waterproofness of the shell of the electronic device.

[0083] The electronic device in the embodiments of the present application may be a wearable device, such as a smart watch or a smart bracelet, or may be an electronic device such as a mobile phone, a tablet computer, a laptop computer, etc., without specific limitation herein.

[0084] The following takes a smart watch as an example to illustrate the shell structure of the electronic device in the embodiment of the present application. Other types of electronic devices can be specifically configured with reference to the shell structure in the smart watch embodiment, which will not be repeated here.

[0085] like Figure 3 to Figure 6 As shown, Figure 3 This is a schematic diagram of the structure of an electronic device (smart watch) in some embodiments of the present application. Figure 4 for Figure 3 An exploded view of the housing of an electronic device in Figure 5 for Figure 3 The cross-section of the electronic device at AA after removing the internal electronic components. Figure 6 for Figure 3 The electronic device is a cross-sectional view at BB after removing the internal electronic components. The electronic device is a smart watch, comprising a housing, the housing comprising a front panel 1, a frame 2 and a back cover 3, the front panel 1, the back cover 3 and the frame 2 enclose a receiving space 4, and the receiving space 4 is used to set the electronic components.

[0086] In some embodiments, Figure 5 and Figure 6 As shown, the front panel 1 is a display panel. In other embodiments, the front panel 1 includes a stacked display panel and a protective cover, and the protective cover is located outside the display panel (that is, the side of the display panel away from the accommodating space 4).

[0087] The display panel may be a liquid crystal display panel or an OLED (Organic Light-Emitting Diode) display panel, which is not specifically limited here. The electronic components include a circuit board, which is electrically connected to the display panel.

[0088] like Figure 5 , Figure 6 and Figure 7 As shown, Figure 7 for Figure 4The frame 2 (also called the middle frame or the front shell) includes an outer frame 21 and an inner frame 22 arranged in the space 7 surrounded by the outer frame 21. The outer frame 21 is a metal frame or an alloy frame, and the inner frame 22 is an insulating frame. The inner frame 22 and the outer frame 21 are integrally formed by injection molding.

[0089] Among them, the inner frame 22 and the outer frame 21 can be integrally formed by nano injection molding, or integrally formed by insert injection molding. The outer frame 21 can be an aluminum frame, a stainless steel frame, an aluminum alloy frame, a titanium alloy frame, a magnesium alloy frame, etc. The inner frame 22 is an insulating frame; the insulating frame can be a plastic frame, and the plastic frame can be a PPS (Polyphenylene sulfide) frame, a PBT (polybutylene terephthalate) frame, a PPSU (Polyphenylene sulfoneresins) frame, a PEEK (polyether-ether-ketone) frame, etc. In addition to the plastic frame, the insulating frame can also be a ceramic frame, which can be determined according to actual conditions.

[0090] In some embodiments, Figure 5 and Figure 6 As shown, the inner frame 22 includes an inner frame body 221 and a first connecting wall 222 arranged on the inner circumference of the inner frame body 221. The outer frame 21 includes an outer frame body 211, a second connecting wall 212 arranged on the inner circumference of the outer frame body 211, and a protrusion 213 arranged on the second connecting wall 212, and the outer circumference of the inner frame 22 is connected to the inner circumference of the outer frame 21.

[0091] The second connecting wall 212 is embedded in the first connecting wall 222, and a avoidance hole 2221 is provided on the first connecting wall 222, and the avoidance hole 2221 allows the protrusion 213 to extend out of the first connecting wall 222. Specifically, the second connecting wall 212 is embedded in the embedding groove 2222 on the first connecting wall 222, and the second connecting wall 212 is engaged with the groove wall of the embedding groove 2222, and the avoidance hole 2221 is a through hole opened on the groove wall of the embedding groove 2222, and the protrusion 213 protrudes from the outer surface of the first connecting wall 222 through the avoidance hole 2221.

[0092] The structure of the protrusion 213 is not unique. In some embodiments, for example Figure 5As shown, the protrusion 213 is the antenna feeding point, the outer frame 211 as a whole constitutes the antenna, and the protrusion 213 is electrically connected to the outer frame 211 through the second connecting wall 212. The protrusion 213 is used to abut against the spring sheet provided on the circuit board, and the protrusion 213 feeds power to the outer frame 211. By setting the outer frame 211 as the antenna, the antenna is exposed to the outside, avoiding the shielding of the antenna by other parts of the shell, so that the antenna can better send and receive signals, thereby helping to improve the performance of the antenna.

[0093] In other embodiments, Figure 6 As shown, the protrusion 213 is a nut column, and the nut column is used to connect with the circuit board. Specifically, the circuit board is threadedly connected with the nut column through a fastener (such as a screw). By setting the protrusion 213 as a nut column, it is not only convenient to fix the circuit board, but also the nut column makes full use of the space on the second connecting wall 212 located at the inner edge of the frame 2, so that there is no need to set an additional structure for fixing the circuit board in the central area inside the frame 2, which is conducive to saving space in the central area inside the frame 2.

[0094] In addition to being an antenna feed point and a nut column, the protrusion 213 can also be a positioning column, which extends into a positioning hole on the circuit board to position the circuit board.

[0095] The second connecting wall 212 may be provided with one protrusion 213 or multiple protrusions 213, for example Figure 7 As shown, two protrusions 213 are provided on the second connecting wall 212, one protrusion 213 is an antenna feeding point, and the other protrusion 213 is a nut column; of course, it is not limited to this, and both protrusions 213 can also be antenna feeding points or nut columns.

[0096] like Figure 7 As shown, the number of the first connecting wall 222 can also be one. However, it is not limited thereto, and the number of the first connecting walls 222 can also be multiple, such as four, and the multiple first connecting walls 222 are arranged at intervals along the circumference of the inner frame 22, and the second connecting wall 212 is respectively embedded in each first connecting wall 222. In this way, the multiple first connecting walls 222 can provide better support for the circuit board.

[0097] In some embodiments, Figure 6 and Figure 7 As shown, the inner frame 22 also includes an edge (such as Figure 6The flange 223 is provided at the upper edge of the inner frame 221 as shown in the figure, and the flange 223 extends to one side close to the outer peripheral surface of the outer frame 211, and the flange 223 is engaged with the outer frame 211. By providing the flange 223, the joint area of ​​the inner frame 22 and the outer frame 21 can be increased, and the length of the gap between the inner frame 22 and the outer frame 21 is increased, so that the path for water outside the shell to enter the inside of the shell is increased, thereby greatly reducing the probability of water outside the shell entering the inside of the shell.

[0098] In addition to the above structure, the inner frame 22 may not be provided with the first connecting wall 222, and the outer frame 21 may not be provided with the second connecting wall 212. A bracket is provided on the back cover 3, and the circuit board is provided on the bracket.

[0099] like Figure 8 , Fig. 9 and Fig.10 As shown, Figure 8 is a cross-sectional view of the frame 2 in the first embodiment of the present application, Fig. 9 is a cross-sectional view of the frame 2 in the second embodiment of the present application, Fig.10 It is a cross-sectional view of the frame 2 in the third embodiment of the present application. An adhesive layer 5 is provided between the joint surfaces of the inner frame 22 and the outer frame 21. The adhesive layer 5 may be a glue layer, the thickness of which ranges from 0.05 mm to 0.5 mm, and the glue layer may be a high temperature resistant glue layer.

[0100] The shell in the embodiment of the present application is provided with an adhesive layer 5 between the joint surfaces of the inner frame 22 and the outer frame 21, which is beneficial to improving the connection strength between the joint surfaces of the inner frame 22 and the outer frame 21, overcoming the problem of reduced connection strength caused by using different materials for the outer frame 21 and the inner frame 22, making the connection between the inner frame 22 and the outer frame 21 more firmly, thereby avoiding cracks between the inner frame 22 and the outer frame 21 due to insufficient connection strength, which is beneficial to improving the waterproofness of the shell, and further ensuring the normal operation of the electronic device.

[0101] The adhesive layer 5 is not arranged in a unique position. Figure 8 An embodiment of a first setting position of the adhesive layer 5 is shown, in which an adhesive layer 5 is provided between the joint surfaces of the first connecting wall 222 and the second connecting wall 212. Such a configuration can increase the connection strength between the first connecting wall 222 and the second connecting wall 212, and prevent the first connecting wall 222 and the second connecting wall 212 from cracking due to insufficient connection strength, thereby preventing water outside the housing from entering the interior of the housing at the end of the waterproof path.

[0102] It should be noted that: Figure 6As shown, water outside the shell can easily enter the space between the first connecting wall 222 and the front panel 1 along the gap between the front panel 1 and the outer frame 21, the gap between the inner frame 221 and the outer frame 211, the gap between the first connecting wall 222 and the second connecting wall 212, and the avoidance hole 2221, so the path formed by the above gaps is called a waterproof path.

[0103] Among them, Figure 8 As shown, an embedding groove 2222 is provided on the first connecting wall 222, and the second connecting wall 212 is embedded in the embedding groove 2222. The second connecting wall 212 includes two end walls arranged opposite to each other, and a side wall connected between the two end walls. An adhesive layer 5 is provided between each end wall and the groove wall of the embedding groove 2222, and between the side wall and the groove wall of the embedding groove 2222.

[0104] Fig. 9 An embodiment of the second setting position of the adhesive layer 5 is shown. In this embodiment, an adhesive layer 5 is provided between the joint surfaces of the inner frame 221 and the outer frame 211 and between the joint surfaces of the flange 223 and the outer frame 211. Such an arrangement can increase the connection strength between the inner frame 221 and the outer frame 211, and increase the connection strength between the flange 223 and the outer frame 211, avoid cracking between the inner frame 221 and the outer frame 211 and between the flange 223 and the outer frame 211 due to insufficient connection strength, and avoid water from entering between the inner frame 22 and the outer frame 21, thereby preventing water from entering the interior of the housing at the starting end of the waterproof path, and increasing the waterproof effect of the housing.

[0105] In some embodiments, Fig.11 As shown, Fig.11 It is a cross-sectional view of the frame in the fourth embodiment of the present application. A receiving groove 23 is formed between the hole wall of the avoidance hole 2221 and the raised portion 213, and a gap 24 is provided between the joint surfaces of the first connecting wall 222 and the second connecting wall 212, the gap 24 is connected to the receiving groove 23, and the receiving groove 23 and the gap 24 are filled with a sealant layer 6. In this way, the sealant layer 6 can block the gap 24 and the receiving groove 23 to prevent water from entering the interior of the shell from the receiving groove 23, and the sealant layer 6 and the adhesive layer 5 prevent water outside the shell from entering the interior of the shell at the end and the starting end of the waterproof path, respectively, so as to make the waterproof effect of the shell better.

[0106] The sealant layer 6 may be a hot melt adhesive layer, a UV curing adhesive layer, an epoxy adhesive layer, a silicone layer, etc., which are not specifically limited here. The gap 24 may be located at the position of the receiving groove 23, or may be located at other positions of the joint surface of the first connecting wall 222 and the second connecting wall 212, as long as it is connected to the receiving groove 23. The cross-section of the gap 24 may be rectangular, but is not limited thereto, and may also be other regular or irregular shapes.

[0107] It should be noted that the joint surface of the first connecting wall 222 and the second connecting wall 212 is prone to poor joint at the position near the receiving groove 23 (that is, the end of the waterproof path) and a gap 24 is formed. Filling the gap 24 with a sealant layer 6 is a remedial measure for the poor joint. If the joint surface of the first connecting wall 222 and the second connecting wall 212 is well joined and no gap 24 occurs, then filling the sealant layer 6 into the receiving groove 23 can prevent water from entering the interior of the housing at the end of the waterproof path.

[0108] Fig.10 An embodiment of the third setting position of the adhesive layer 5 is shown. In this embodiment, an adhesive layer 5 is provided between the joint surfaces of the first connecting wall 222 and the second connecting wall 212, and an adhesive layer 5 is provided between the joint surfaces of the inner frame 221 and the outer frame 211, and between the joint surfaces of the flange 223 and the outer frame 211. In this way, the connection strength between the first connecting wall 222 and the second connecting wall 212, the connection strength between the inner frame 221 and the outer frame 211, and the connection strength between the flange 223 and the outer frame 211 are increased respectively, and water outside the housing can be prevented from entering the interior of the housing at the starting end and the end of the waterproof path, thereby making the housing more waterproof.

[0109] In some embodiments, Fig.12 As shown, Fig.12 Schematic diagram of the connection structure at the joint surface of the inner frame 22 and the outer frame 21 in some embodiments of the present application Figure 1 The inner frame 22 and the outer frame 21 are integrally formed by nano injection molding; the joint surface of the outer frame 21 has a first micropore 214, and part of the adhesive layer 5 covers the hole wall of the first micropore 214, and the joint surface of the inner frame 22 has a first microstructure 224, which extends into the first micropore 214 and is bonded to the adhesive layer 5.

[0110] Among them, after the adhesive layer 5 covers the joint surface of the outer frame 21, part of the adhesive layer 5 can be pressed to cover the hole wall of the first micropore 214. During the nano injection molding process, the adhesive layer 5 can be softened under the high temperature and high pressure environment inside the injection mold and recessed into the first micropore 214 and cover the hole wall of the first micropore 214.

[0111] The first microstructure 224 is bonded to the adhesive layer 5 on the hole wall of the first micropore 214, so that the first microstructure 224 can be firmly fixed in the first micropore 214, thereby increasing the connection strength between the inner frame 22 and the outer frame 21, and the inner frame 22 and the outer frame 21 are not easy to crack, thereby improving the waterproofness of the shell.

[0112] The joint surface of the outer frame 21 (eg Fig.12The upper surface of the outer frame 21 shown in the figure may be at least one of a joining surface of the outer frame body 211 for joining with the inner frame body 221, a joining surface of the outer frame body 211 for joining with the flange 223, and a joining surface of the second connecting wall 212 for joining with the first connecting wall 222.

[0113] The joint surface of the inner frame 22 (eg Fig.12 The lower surface of the inner frame 21 shown in the figure may be at least one of a joining surface of the inner frame 221 for joining with the outer frame 211, a joining surface of the flange 223 for joining with the outer frame 211, and a joining surface of the first connecting wall 222 for joining with the second connecting wall 212.

[0114] In some embodiments, Fig.13 As shown, Fig.13 Schematic diagram of the connection structure at the joint surface of the inner frame 22 and the outer frame 21 in some embodiments of the present application Figure 2 The inner frame 22 and the outer frame 21 are integrally formed by nano injection molding, the joint surface of the outer frame 21 has a second micro hole 215 , and the joint surface of the inner frame 22 has a second micro structure 225 , and the second micro structure 225 passes through the adhesive layer 5 and extends into the second micro hole 215 .

[0115] During the nano injection molding process, part of the plastic material can pass through the adhesive layer 5 from the gaps in the thinner area of ​​the adhesive layer 5 under the high temperature and high pressure environment inside the injection mold and enter the second micropores 215 to form the second microstructure 225 after solidification.

[0116] Since the second microstructure 225 passes through the adhesive layer 5 and extends into the second micropore 215, the second microstructure 225 can be firmly fixed in the second micropore 215, and the connection strength between the inner frame 22 and the outer frame 21 can still meet the requirements in the area where the adhesive layer 5 is thinner. In this way, the inner frame 22 and the outer frame 21 are not easily cracked in the area where the adhesive layer 5 is thinner, thereby improving the waterproofness of the shell.

[0117] In some embodiments, Fig.14 As shown, Fig.14 Schematic diagram of the connection structure at the joint surface of the inner frame 22 and the outer frame 21 in some embodiments of the present application Figure 3 The joint surface of the outer frame 21 has a third micro hole 216 , a part of the adhesive layer 5 fills the third micro hole 216 , and the joint surface of the inner frame 22 is bonded to the adhesive layer 5 .

[0118] During the nano injection molding process, in the thicker area of ​​the adhesive layer 5, part of the adhesive layer 5 enters the third micropores 216 under the high temperature and high pressure environment inside the injection mold, and fills the third micropores 216. In this way, the contact area between the adhesive layer 5 and the outer frame 21 is increased, so that the adhesive layer 5 is not easy to peel off from the joint surface of the outer frame 21, which is conducive to improving the connection strength between the inner frame 22 and the outer frame 21, and the inner frame 22 and the outer frame 21 are not easy to crack, thereby improving the waterproofness of the shell.

[0119] Among them, the bonding surface of the outer frame 21 may have only the first micropore 214, or only the second micropore 215, or any two or all of the first micropore 214, the second micropore 215, and the third micropore 216. Correspondingly, the bonding surface of the inner frame 22 may have one or all of the first microstructure 224 and the second microstructure 225.

[0120] In some embodiments, Fig.12 As shown, the surface hardness of the joint surface of the outer frame 21 is greater than the core hardness of the outer frame 21 (i.e., the hardness inside the outer frame 21), and there is a crystal phase change (such as a martensitic phase change) at the joint surface of the outer frame 21, and the crystal phase change includes at least one of crystal distortion, crystal dislocation, and crystal slip. In this way, during the nano injection molding process, the corrosion sensitivity of the joint surface of the outer frame 21 to the T treatment liquid is increased, and the T treatment liquid is more likely to penetrate into the interior of the outer frame 21 to corrode more micropores, thereby making the T treatment effect better, which is beneficial to improve the connection strength between the inner frame 22 and the outer frame 21.

[0121] It should be understood that the corrosion sensitivity of the joint surface of the outer frame 21 to the T treatment liquid is related to the hardness of the joint surface of the outer frame 21 and whether there is a crystal phase change at the joint surface of the outer frame 21. (1) The higher the hardness of the joint surface of the outer frame 21, the higher the corrosion sensitivity of the joint surface of the outer frame 21 to the T treatment liquid, and the better the T treatment effect. Conversely, the T treatment effect is worse. Figure 15 to Figure 18 As shown, Fig.15 , Fig.17 The microscopic images of the bonding surface of the outer frame 21 at different hardnesses are compared. Fig.15 The Vickers hardness of the joint surface of the outer frame 21 is 239.47. Fig.17 The Vickers hardness of the joint surface of the outer frame 21 is 270.07. Fig.16 for Fig.15 A partial enlarged view of the central area (the area in the dotted box in the figure), Fig.18 for Fig.17 A partial enlarged view of the central area (the area in the dotted box in the figure). Fig.16 and Fig.18 It can be seen that Fig.18The micropores at the joint surface of the outer frame 21 shown in the figure are arranged more evenly, and the T treatment effect is better. (2) If there is a crystal phase change at the joint surface of the outer frame 21, the T treatment liquid can easily penetrate from between the crystals into the interior, so it is easier to corrode deeper and more micropores, and the T treatment effect is better.

[0122] The present application also provides a method for manufacturing a housing. Figure 3 to Figure 6 As shown, the housing is used in an electronic device, the housing includes a frame 2, the frame 2 includes an outer frame 21 and an inner frame 22 arranged in a space surrounded by the outer frame 21, the outer frame 21 is a metal frame or an alloy frame, the inner frame 22 is an insulating frame and is integrally formed with the outer frame 21 by injection molding, wherein the manufacturing method of the housing includes:

[0123] The bonding surface of the outer frame 21 for bonding with the inner frame 22 is covered with an adhesive layer 5 ; the insulating material is bonded to the bonding surface of the outer frame 21 by an injection molding process to form the inner frame 22 .

[0124] The adhesive layer 5 is located between the joint surfaces of the inner frame 22 and the outer frame 21. The melting temperature of the adhesive layer 5 should be greater than the injection temperature of the insulating material. For example, the adhesive layer 5 can be a high temperature resistant adhesive layer. The melting temperature of the high temperature resistant adhesive layer is greater than 600°C. The injection temperature of the insulating material can be within 600°C, such as between 300°C and 400°C. The high temperature resistant adhesive layer can be cured at the injection temperature to maintain a fixed shape. The above-mentioned insulating material can be a plastic material, such as PPS, PBT, PPSU, PEEK, etc. In addition, the insulating material can also be a ceramic material, etc.

[0125] By providing the adhesive layer 5, it is helpful to improve the connection strength between the joint surfaces of the inner frame 22 and the outer frame 21, so that the joint between the inner frame 22 and the outer frame 21 is more firmly connected, thereby avoiding cracks between the inner frame 22 and the outer frame 21 due to insufficient connection strength, which is helpful to improve the waterproofness of the shell, and further ensure the normal operation of the electronic device.

[0126] In some embodiments, before the insulating material is joined to the joint surface of the outer frame 21 through the injection molding process, the process further includes: preheating the joint surface of the outer frame 21, for example, at a temperature between 150° C. and 300° C. In this way, the adhesive layer 5 can be activated to increase the viscosity of the adhesive layer 5, thereby increasing the connection strength between the inner frame 22 and the outer frame 21 after the injection molding is completed.

[0127] In some embodiments, Fig.19 and Fig. 20 As shown, Fig.19 This is a flowchart of the border 2 produced in some embodiments of the present application. Fig. 20 This is a schematic diagram of the manufacturing process of the frame 2 in some embodiments of the present application.

[0128] The bonding surface of the outer frame 21 for bonding with the inner frame 22 is covered with an adhesive layer 5; the plastic material is bonded to the bonding surface of the outer frame 21 by an injection molding process to form the inner frame 22, including:

[0129] S1, such as Fig. 20 As shown in (b) in FIG. 1 , a T-treatment is performed on the joint surface of the outer frame 21 for joining with the inner frame 22 to form micro holes on the joint surface of the outer frame 21 .

[0130] S2, such as Fig. 20 As shown in (c) in FIG. 1 , an adhesive layer 5 is provided on the bonding surface of the outer frame 21 to cover the microholes.

[0131] S3, such as Fig. 20 As shown in (d) in the figure, the plastic material is joined to the joint surface of the outer frame 21 through a nano injection molding process to form the inner frame 22.

[0132] Wherein, in some embodiments, Fig. 20 As shown in (b), the micropores include a first micropore 214, a portion of the adhesive layer 5 covers the hole wall of the first micropore 214, and the bonding surface of the inner frame 22 has a first microstructure 224, which extends into the first micropore 214 and is bonded to the adhesive layer 5.

[0133] In some embodiments, Fig.13 As shown, the micropores include second micropores 215 , and the joint surface of the inner frame 22 has a second microstructure 225 . The second microstructure 225 penetrates the adhesive layer 5 and extends into the second micropores 215 .

[0134] In some embodiments, Fig.14 As shown, the micropores include third micropores 216 , a portion of the adhesive layer 5 fills the third micropores 216 , and the bonding surface of the inner frame 22 is bonded to the adhesive layer 5 .

[0135] Through the arrangement of S1-S3, the connection strength between the inner frame 22 and the outer frame 21 can be increased, and the inner frame 22 and the outer frame 21 are not easily cracked, thereby improving the waterproofness of the shell.

[0136] In some embodiments, Fig.19 and Fig. 20 As shown, before S1, it also includes:

[0137] S0, such as Fig. 20 As shown in (a) of FIG. 1 , the surface of the outer frame 21 for joining with the inner frame 22 is subjected to a surface phase change treatment, and the surface phase change treatment includes at least one of sandblasting, shot peening and laser shot peening, wherein: Fig. 20 The surface transformation treatment shown in (a) is shot peening.

[0138] Such a configuration can not only increase the surface hardness of the joint surface of the outer frame 21, change the morphology of the joint surface of the outer frame 21, and cause a phase change in the crystal structure of the joint surface of the outer frame 21, thereby increasing the corrosion sensitivity of the joint surface of the outer frame 21 to the T treatment liquid, but also make it easier for the T treatment liquid to penetrate into the interior of the outer frame 21 to corrode more micropores, thereby making the T treatment effect better, which is beneficial to improving the connection strength between the inner frame 22 and the outer frame 21.

[0139] like Fig.21 and Fig. 22 As shown, Fig.21 This is a schematic diagram of the crystal structure of the outer frame 21 from the joint surface to the inside in some embodiments of the present application. Fig.21 The square black dots in the middle are hardness test points, which are hardness test points a to g. Fig. 22 for Fig.21 Vickers hardness values ​​at different depths of hardness test points, Fig. 22 The horizontal axis X in the graph is the joint surface from the hardness test point to the outer frame 21 ( Fig.21 The distance value of the upper surface of the outer frame 21 is 10 μm, and the vertical axis Y is the Vickers hardness value at the hardness test point. Fig. 22 It can be seen that as the depth of the outer frame 21 (that is, the distance to the joint surface of the outer frame 21) increases, the hardness value at the hardness test point gradually decreases. Therefore, it can be concluded that the surface phase change treatment of the joint surface of the outer frame 21 can significantly increase the hardness of the joint surface of the outer frame 21, and has little effect on the overall hardness of the outer frame 21. Therefore, the outer frame 21 does not need to increase the annealing time to improve the hardness of the joint surface of the outer frame 21, thereby reducing the wear caused by the tool when machining the harder outer frame 21 before the surface phase change treatment, which is beneficial to improving the life of the tool; at the same time, there is no need to increase the annealing time of the outer frame 21, which is beneficial to reducing the manufacturing time of the outer frame 21. This is beneficial to improving the manufacturing efficiency of the outer frame 21.

[0140] In some embodiments, after S0 and before S1 , the process further includes: performing alkali treatment and acid treatment on the joint surface of the outer frame 21 .

[0141] In some embodiments, Figure 8 As shown, the inner frame 22 includes an inner frame body 221 and a first connecting wall 222 arranged on the inner circumference of the inner frame body 221; the outer frame 21 includes an outer frame body 211, a second connecting wall 212 arranged on the inner circumference of the outer frame body 211, and a protrusion 213 arranged on the second connecting wall 212, the second connecting wall 212 is embedded in the interior of the first connecting wall 222, and the first connecting wall 222 is provided with an avoidance hole 2221, and the avoidance hole 2221 allows the protrusion 213 to extend out of the first connecting wall 222.

[0142] The bonding surface of the outer frame 21 for bonding with the inner frame 22 is covered with the adhesive layer 5 , including: the bonding surface of the second connecting wall 212 for bonding with the first connecting wall 222 is covered with the adhesive layer 5 .

[0143] With such a configuration, the connection strength between the first connection wall 222 and the second connection wall 212 can be increased, thereby preventing water outside the housing from entering the interior of the housing at the end of the waterproof path.

[0144] In some embodiments, Fig. 9 As shown, the inner frame 22 further includes a flange 223 disposed at an edge of one end of the inner frame body 221 along the axial direction, and the flange 223 extends toward a side close to the outer peripheral surface of the outer frame body 211 .

[0145] The bonding surface of the outer frame 21 for bonding with the inner frame 22 is covered with an adhesive layer 5, including: the bonding surface of the outer frame body 211 for bonding with the inner frame body 221 is covered with an adhesive layer 5, and the bonding surface of the outer frame body 211 for bonding with the flange 223 is covered with an adhesive layer 5.

[0146] Such a configuration can increase the connection strength between the inner frame 221 and the outer frame 211, as well as the connection strength between the flange 223 and the outer frame 211, and can prevent water from entering between the inner frame 22 and the outer frame 21, thereby preventing water outside the shell from entering the interior of the shell at the starting end of the waterproof path, thereby increasing the waterproof effect of the shell.

[0147] In some embodiments, Fig.23 as well as Figure 24a to Figure 24e As shown, Fig.23 This is a process flow chart of setting the sealant layer 6 in the receiving groove 23 in some embodiments of the present application. Figure 24a to Figure 24e Schematic diagram of the process of setting the sealant layer 6 in the receiving groove 23 in some embodiments of the present application. After the plastic material is joined to the joint surface of the outer frame 21 by the injection molding process to form the inner frame 22, it also includes:

[0148] S4, such as Fig.24a As shown, the sealant material is injected into the receiving groove 23 to form a first sealant layer 61 covering the gap 24;

[0149] S5, such as Fig.24c As shown, the interior of the receiving groove 23 is pressurized so that part of the first sealant layer 61 fills the gap 24. The mold cavity of the mold in which the outer frame 21 is placed can be pressurized to achieve pressurization of the interior of the receiving groove 23, and the pressure value can be greater than 500Kpa (that is, 5atm).

[0150] S6, such as Fig.24dAs shown, the sealant material is injected into the receiving groove 23 to form a second sealant layer 62 covering the first sealant layer 61 ; wherein the first sealant layer 61 and the second sealant layer 62 form a sealant layer 6 .

[0151] The gap 24 and the receiving groove 23 are blocked by the sealant layer 6 to prevent water from entering the interior of the housing through the receiving groove 23, thereby improving the waterproof effect of the housing. By injecting the sealant material into the receiving groove 23 twice (that is, gradient dispensing), the amount of the sealant material injected into the receiving groove 23 each time can be reduced, and more bubbles are avoided in the curing process of the receiving groove 23 when the amount of the sealant material injected is large, which is conducive to improving the sealing performance of the sealant layer 6, and further improving the waterproof effect of the housing.

[0152] It should be understood that the sealant layer 6 is usually cured gradually from the surface to the inside. If the sealant material is injected into the receiving groove 23 at one time, the injection amount of the sealant material is relatively large, which increases the time difference between the curing of the surface and the inside of the sealant layer 6. When the surface of the sealant layer 6 is cured, the inside of the sealant layer 6 is still fluid. The flow of the sealant layer 6 located inside will easily cause more bubbles to be generated inside the entire sealant layer 6.

[0153] In some embodiments, Fig.23 and Figure 24b As shown, before the pressure treatment is applied to the interior of the receiving groove 23, the following step is further included: S4.5, negative pressure treatment (that is, vacuum treatment) is applied to the receiving groove 23 to remove bubbles in the first sealant layer 61. This arrangement can avoid the generation of bubbles in the first sealant layer 61, and after the sealant layer 6 is formed, the bubbles in the sealant layer 6 can be further reduced, which is beneficial to improving the sealing performance of the sealant layer 6, thereby improving the waterproof effect of the housing.

[0154] In some embodiments, Fig.23 and Fig.24e As shown, after the second sealant layer 62 is formed, the method further includes: S7, negative pressure treatment is performed on the receiving groove 23 to remove bubbles in the second sealant layer 62. In this way, bubbles can be avoided from being generated inside the second sealant layer 62, so that after the sealant layer 6 is formed, the bubbles in the sealant layer 6 can be further reduced, which is beneficial to improving the sealing performance of the sealant layer 6, thereby improving the waterproof effect of the housing.

[0155] The mold cavity of the mold in which the outer frame 21 is placed may be subjected to negative pressure treatment to achieve negative pressure treatment of the receiving groove 23 , and the pressure value of the mold cavity of the mold may be less than 100 Kpa, such as 0.05 Pa.

[0156] In some embodiments, after S6, the process further includes: detecting the sealing between the inner frame 22 and the outer frame 21. In this way, the frame 2 with poor sealing between the inner frame 22 and the outer frame 21 can be detected in time to prevent the frame 2 with poor sealing from flowing into the next process.

[0157] In the embodiment of the present application, in addition to being integrally formed with the outer frame 21 by nano injection molding, the inner frame 22 can also be integrally formed with the outer frame 21 by insert injection molding. Specifically, after the adhesive layer 5 is provided on the joint surface of the outer frame 21, the inner frame 22 is formed by the insert injection molding process, so that the adhesive layer 5 is located between the joint surfaces of the outer frame 21 and the inner frame 22.

[0158] The types of section lines in the drawings of this application are used to distinguish different components and should not be understood as limiting the materials of the components. The drawings of this application are mainly used to illustrate the structure of the product and are not shown according to the actual proportion of the product.

[0159] Although the description of this application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation mode. On the contrary, the purpose of introducing the application in conjunction with the implementation mode is to cover other options or modifications that may be extended based on the claims of this application. In order to provide a deep understanding of this application, many specific details will be included in the following description. This application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of this application, some specific details will be omitted in the description. It should be noted that the embodiments in this application and the features in the embodiments can be combined with each other without conflict.

[0160] In the embodiments of the present application, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include one or more of the features.

[0161] In the embodiments of the present application, "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0162] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The directional terms mentioned in the embodiments of the present application, such as "upper", "lower", "left", "right", "inside", "outside", etc., are only reference directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. "Multiple" means at least two.

[0163] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0164] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A housing for use in an electronic device, characterized in that: The invention comprises a frame, which comprises an outer frame and an inner frame arranged in the space surrounded by the outer frame. The outer frame is a metal frame or an alloy frame, the inner frame is an insulating frame and is integrally formed with the outer frame by injection molding, and an adhesive layer is provided between the joint surfaces of the inner frame and the outer frame.

2. The housing according to claim 1, characterized in that The inner frame includes an inner frame body and a first connecting wall arranged on the inner circumferential surface of the inner frame body; The outer frame includes an outer frame body, a second connecting wall arranged on the inner circumference of the outer frame body, and a protruding portion arranged on the second connecting wall, wherein the second connecting wall is embedded in the interior of the first connecting wall; The first connecting wall is provided with an avoidance hole, and the avoidance hole allows the protrusion to extend out of the first connecting wall; the adhesive layer is provided between the joint surfaces of the first connecting wall and the second connecting wall.

3. The housing according to claim 2, characterized in that: The protrusion is an antenna feeding point, the outer frame as a whole constitutes the antenna, and the protrusion is electrically connected to the outer frame through the second connecting wall; or, the protrusion is a nut column, and the nut column is used to connect to a circuit board.

4. The housing according to any one of claims 1 to 3, characterized in that: The outer frame includes an outer frame body, and the inner frame includes an inner frame body and a flange arranged at an end edge of the inner frame body along the axial direction, and the flange extends to a side close to the outer peripheral surface of the outer frame body; the adhesive layer is respectively provided between the joint surfaces of the inner frame body and the outer frame body, and between the joint surfaces of the flange and the outer frame body.

5. The housing according to any one of claims 1 to 4, characterized in that: The inner frame and the outer frame are integrally formed by nano injection molding; The joint surface of the outer frame has a first micropore, and part of the adhesive layer covers the hole wall of the first micropore. The joint surface of the inner frame has a first microstructure, and the first microstructure extends into the first micropore and is bonded to the adhesive layer.

6. The housing according to any one of claims 1 to 5, characterized in that: The inner frame and the outer frame are integrally formed by nano injection molding; The joint surface of the outer frame has a second microhole, and the joint surface of the inner frame has a second microstructure, and the second microstructure passes through the adhesive layer and extends into the second microhole.

7. The housing according to claim 5 or 6, characterized in that: The joint surface of the outer frame has third micropores, a portion of the adhesive layer fills the third micropores, and the joint surface of the inner frame is bonded to the adhesive layer.

8. The housing according to any one of claims 4 to 7, characterized in that: The inner frame further comprises a first connecting wall disposed on the inner circumference of the inner frame body; the outer frame further comprises a second connecting wall disposed on the inner circumference of the outer frame body, and a protrusion disposed on the second connecting wall, wherein the second connecting wall is embedded in the interior of the first connecting wall; An avoidance hole is provided on the first connecting wall, and the avoidance hole allows the protrusion to extend out of the first connecting wall; a receiving groove is formed between the hole wall of the avoidance hole and the protrusion, and a gap is provided between the joint surfaces of the first connecting wall and the second connecting wall, and the gap is connected to the receiving groove, and a sealant layer is filled in the receiving groove and the gap.

9. The housing according to any one of claims 1 to 8, characterized in that: The surface hardness of the joint surface of the outer frame is greater than the core hardness of the outer frame, and a crystal phase change exists at the joint surface of the outer frame; the crystal phase change includes at least one of crystal distortion, crystal dislocation and crystal slip.

10. An electronic device, characterized in that: The invention comprises a shell as claimed in any one of claims 1 to 9; the shell comprises a front panel, a rear cover and the frame, the front panel, the rear cover and the frame form a storage space, and the storage space is used to arrange electronic components.

11. A method for manufacturing a shell, wherein the shell is used in an electronic device, the shell comprises a frame, the frame comprises an outer frame and an inner frame arranged in a space surrounded by the outer frame, the outer frame is a metal frame or an alloy frame, the inner frame is an insulating frame and is integrally formed with the outer frame by injection molding, characterized in that: The method for manufacturing the housing comprises: Covering the joint surface of the outer frame for joining with the inner frame with an adhesive layer; The insulating material is joined to the joint surface of the outer frame through an injection molding process to form an inner frame; wherein the adhesive layer is located between the joint surfaces of the inner frame and the outer frame.

12. The method for manufacturing a housing according to claim 11, characterized in that: The inner frame comprises an inner frame body and a first connecting wall arranged on the inner circumference of the inner frame body; the outer frame comprises an outer frame body, a second connecting wall arranged on the inner circumference of the outer frame body, and a protrusion arranged on the second connecting wall, the second connecting wall is embedded in the first connecting wall, and the first connecting wall is provided with an avoidance hole, and the avoidance hole allows the protrusion to extend out of the first connecting wall; The bonding surface of the outer frame for bonding with the inner frame is covered with an adhesive layer, comprising: The bonding layer is covered on a joining surface of the second connecting wall for joining with the first connecting wall.

13. The method for manufacturing a housing according to claim 11 or 12, characterized in that: The outer frame includes an outer frame body, and the inner frame includes an inner frame body and a flange arranged at an edge of one end of the inner frame body along the axial direction, and the flange extends toward a side close to an outer peripheral surface of the outer frame body; The bonding surface of the outer frame for bonding with the inner frame is covered with an adhesive layer, comprising: The bonding surface of the outer frame for bonding with the inner frame is covered with the bonding layer, and the bonding surface of the outer frame for bonding with the flange is covered with the bonding layer.

14. The method for manufacturing a housing according to any one of claims 11 to 13, characterized in that: Covering the joint surface of the outer frame for joining with the inner frame with an adhesive layer; The insulating material is joined to the joint surface of the outer frame by an injection molding process to form an inner frame, comprising: Performing T-treatment on the joint surface of the outer frame for joining with the inner frame to form micro holes on the joint surface of the outer frame; The adhesive layer is provided on the joint surface of the outer frame to cover the microholes; The insulating material is joined to the joint surface of the outer frame by a nano injection molding process to form an inner frame; Wherein, the micropores include first micropores, part of the adhesive layer covers the hole wall of the first micropores, the bonding surface of the inner frame has a first microstructure, the first microstructure extends into the first micropores and is bonded to the adhesive layer; and / or, the micropores include second micropores, the bonding surface of the inner frame has a second microstructure, and the second microstructure passes through the adhesive layer and extends into the second micropores.

15. The method for manufacturing a housing according to claim 13 or 14, characterized in that: The inner frame further comprises a first connecting wall disposed on the inner circumference of the inner frame body; the outer frame further comprises a second connecting wall disposed on the inner circumference of the outer frame body, and a protrusion disposed on the second connecting wall, wherein the second connecting wall is embedded in the interior of the first connecting wall; The first connecting wall is provided with an avoidance hole, wherein the protrusion extends out of the first connecting wall; a receiving groove is formed between the hole wall of the avoidance hole and the protrusion, and a gap is provided between the joint surfaces of the first connecting wall and the second connecting wall, wherein the gap is connected to the receiving groove; After the insulating material is joined to the joint surface of the outer frame by an injection molding process to form the inner frame, the method further includes: Injecting a sealant material into the receiving groove to form a first sealant layer covering the gap; Pressurizing the interior of the receiving groove so that part of the first sealant layer fills the gap; A sealant material is injected into the receiving groove to form a second sealant layer covering the first sealant layer; wherein the first sealant layer and the second sealant layer form a sealant layer.

16. The method for manufacturing a housing according to claim 15, characterized in that: Before the inside of the containing tank is subjected to a pressurization treatment, the method further includes: subjecting the containing tank to a negative pressure treatment to remove bubbles in the first sealant layer; And / or, after the second sealant layer is formed, the method further includes: subjecting the receiving groove to negative pressure treatment to remove bubbles in the second sealant layer.

17. The method for manufacturing a housing according to any one of claims 11 to 16, characterized in that: Before covering the bonding layer on the joint surface of the outer frame for bonding with the inner frame, the method further comprises: A surface phase change treatment is performed on a joint surface of the outer frame for joining with the inner frame, wherein the surface phase change treatment includes at least one of sand blasting, shot blasting and laser shot blasting.

Images