Electronic device

Abstract

The invention provides electronic equipment which comprises a display screen, a heat source device, a first cooling fin and a second cooling fin, the first cooling fin is attached to the surface, corresponding to the heat source device, of the display screen, and the second cooling fin is attached to one side of the heat source device. The first radiating fin and the second radiating fin are correspondingly arranged, and a gap is formed between the first radiating fin and the second radiating fin. According to the electronic equipment provided by the embodiment of the invention, the first cooling fin and the second cooling fin are arranged between the display screen and the heat source device, and the gap is formed between the first cooling fin and the second cooling fin, so that the core temperature of the second cooling fin attached to one side of the heat source device is increased under the heat insulation effect of the gap; therefore, the soaking effect of the cold end of the second cooling fin is enhanced, the display effect of the display screen is prevented from being affected by direct conduction to the display screen, and the touch temperature of the display screen is increased.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation structures of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] Currently, in order to cope with fierce market competition and cost pressure, major mobile phone manufacturers have eliminated the internal graphite sheet in display modules, which has become a development trend in recent years in order to further reduce the black border of the screen. However, after eliminating the structure of the graphite sheet inside the screen, the temperature of the display screen has a serious problem of overheating in high-power consumption scenarios. Summary of the invention

[0003] An embodiment of the present application provides an electronic device, which includes a display screen, a heat source device, a first heat sink and a second heat sink, wherein the first heat sink is attached to a surface of the display screen corresponding to the heat source device, and the second heat sink is attached to a side of the heat source device, wherein the first heat sink and the second heat sink are arranged correspondingly, and a gap is provided between the first heat sink and the second heat sink.

[0004] The electronic device provided in the embodiment of the present application is provided with a first heat sink and a second heat sink between a display screen and a heat source device, and a gap is provided between the first heat sink and the second heat sink. Due to the heat insulation effect of the gap, the core temperature of the second heat sink attached to one side of the heat source device increases, thereby enhancing the heat equalization effect of the cold end of the second heat sink, avoiding direct conduction to the display screen to affect the display effect of the display screen, and increasing the tactile temperature of the display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0006] Figure 1 It is a partial structural diagram of an embodiment of the electronic device of the present application;

[0007] Figure 2 It is a partial structural diagram of another embodiment of the electronic device of the present application;

[0008] Figure 3 This is a comparison chart of the temperature curves of the front display screen of the three structures under transient simulation with the heat source power consumption assigned to 3W;

[0009] Figure 4 is a structural schematic diagram of a comparative embodiment of an electronic device;

[0010] Figure 5 is a schematic structural diagram of another comparative embodiment of an electronic device;

[0011] Figure 6 It is a partial structural diagram of another embodiment of the electronic device of the present application;

[0012] Figure 7 It is a schematic diagram of the structural composition block diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0013] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0014] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", and "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. The terms "including" and "having" in the embodiments of the present application and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products, or devices.

[0015] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0016] As used herein, "electronic devices" (or simply "terminals") include, but are not limited to, devices configured to receive / send communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). Communication terminals configured to communicate via a wireless interface may be referred to as "wireless communication terminals", "wireless terminals" or "mobile terminals". Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephones with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, organizers, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.

[0017] See also Figure 1 , Figure 1 This is a partial structural diagram of an embodiment of an electronic device of the present application. It should be noted that the electronic device in the present application may include electronic devices with display screens and heating devices, such as mobile phones, tablet computers, laptop computers, and wearable devices. The electronic device includes but is not limited to the following structures: a display screen 100, a heat source device 200, a first heat sink 300, and a second heat sink 400.

[0018] In order to pursue thinner and lighter displays, many manufacturers have begun to remove the graphite sheet inside the screen. After the graphite sheet inside the screen is removed, the heat dissipation capacity of the mobile phone display screen deteriorates. The temperature of the game scene such as Genshin Impact deteriorates by about 0.3-2°C, affecting the user's front grip experience. The display screen 100 in the embodiment of the present application can be a structure without a graphite sheet inside.

[0019] Among them, the first heat sink 300 is attached to the surface of the display screen 100 corresponding to the heat source device 200. The first heat sink 300 is used to achieve uniform heat dissipation of the display screen 100 on the one hand, and to block and uniformly dissipate heat radiated from the second heat sink 400 on the other hand. The second heat sink 400 is attached to one side of the heat source device 200. The second heat sink 400 is used to uniformly dissipate heat of the heat source device 200.

[0020] Optionally, the heat source device 200 in this embodiment can be a motherboard (processor), a battery, a small board, etc. of an electronic device, which is not specifically limited here. Among them, the first heat sink 300 and the second heat sink 400 are arranged correspondingly, and a gap 304 is provided between the first heat sink 300 and the second heat sink 400. The width of the gap 304 is 0.06mm-0.1mm, and can specifically be 0.06mm, 0.065mm, 0.07mm, 0.076mm, 0.08mm, 0.09mm and 0.10mm. Among them, the width value of the gap 304 considers the safety avoidance design of the drop test of the display screen 100 on the one hand (taking into account the overall structure of the electronic device to be thin and light), and on the other hand, the heat dissipation gap design of the first heat sink 300 and the second heat sink 400 is considered. After verification and research, the inventor found that the gap width in the range of 0.06mm-0.1mm is the optimal solution for taking into account the above two requirements.

[0021] Optionally, the first heat sink 300 in the embodiment of the present application may be a graphite sheet, and the thickness of the first heat sink 300 is 0.05mm-0.10mm, specifically 0.05mm, 0.055mm, 0.06mm, 0.063mm, 0.07mm, 0.078mm, 0.08mm, 0.09mm and 0.10mm.

[0022] Optionally, the second heat sink 400 in the embodiment of the present application may be a graphite sheet, and the thickness of the second heat sink 400 may be 0.05mm-0.20mm, specifically 0.05mm, 0.055mm, 0.06mm, 0.063mm, 0.07mm, 0.078mm, 0.08mm, 0.09mm, 0.10mm, 0.12mm, 0.14mm, 0.15mm, 0.18mm, 0.20mm and the like.

[0023] The electronic device provided in the embodiment of the present application is provided with a first heat sink and a second heat sink between a display screen and a heat source device, and a gap is provided between the first heat sink and the second heat sink. Due to the heat insulation effect of the gap, the core temperature of the second heat sink attached to one side of the heat source device increases, thereby enhancing the heat equalization effect of the cold end of the second heat sink, avoiding direct conduction (direct contact and bonding with the display screen) to the display screen to affect the display effect of the display screen and increase the tactile temperature of the display screen.

[0024] See also Figure 2 , Figure 21 is a partial structural diagram of another embodiment of the electronic device of the present application, and the electronic device includes but is not limited to the following structures: a display screen 100, a heat source device 200, a first heat sink 300, and a second heat sink 400. The display screen 100 in the embodiment of the present application may be a structure without a graphite sheet inside. Different from the above-mentioned embodiment, the electronic device in this embodiment further includes a metal middle frame 500.

[0025] Among them, the first heat sink 300 is attached to the surface of the display screen 100 corresponding to the heat source device 200. The first heat sink 300 is used to achieve uniform heat dissipation of the display screen 100 on the one hand, and to block and uniformly heat the heat radiated from the second heat sink 400 on the other hand. The second heat sink 400 and the heat source device 200 are respectively attached to the two sides of the metal middle frame 500, and the second heat sink 400 is used to uniformly heat the metal middle frame 500.

[0026] Optionally, the heat source device 200 in this embodiment may include a mainboard 210 (processor), a battery 220, and a small board 230 of an electronic device, etc., which are not specifically limited here. Among them, the first heat sink 300 and the second heat sink 400 are correspondingly arranged, and a gap 304 is provided between the first heat sink 300 and the second heat sink 400. The width of the gap 304 is 0.06mm-0.1mm, and can be specifically 0.06mm, 0.065mm, 0.07mm, 0.076mm, 0.08mm, 0.09mm and 0.10mm. Among them, the width value of the gap 304 considers the safety avoidance design of the drop test of the display screen 100 on the one hand (taking into account the overall structure of the electronic device to be thin and light), and on the other hand, the heat dissipation gap design of the first heat sink 300 and the second heat sink 400 is considered. After verification and research, the inventor found that the gap width in the range of 0.06mm-0.1mm is the optimal solution for achieving the above two requirements.

[0027] Optionally, the first heat sink 300 in the embodiment of the present application may be a graphite sheet, and the thickness of the first heat sink 300 is 0.05mm-0.10mm, specifically 0.05mm, 0.055mm, 0.06mm, 0.063mm, 0.07mm, 0.078mm, 0.08mm, 0.09mm and 0.10mm.

[0028] Optionally, the second heat sink 400 in the embodiment of the present application may be a graphite sheet, and the thickness of the second heat sink 400 may be 0.05mm-0.20mm, specifically 0.05mm, 0.055mm, 0.06mm, 0.063mm, 0.07mm, 0.078mm, 0.08mm, 0.09mm, 0.10mm, 0.12mm, 0.14mm, 0.15mm, 0.18mm, 0.20mm and the like.

[0029] Please continue reading Figure 2 The electronic device in this embodiment may further include a back cover 600 , and the back cover 600 is disposed on a side of the heat source device 200 facing away from the display screen 100 .

[0030] In order to verify the heat dissipation effect of the electronic device structure in the embodiment of the present application, please refer to Figure 3 , Figure 3 The following is a comparison of the temperature curves of the front display screen of the three structures with the heat source power consumption assigned to 3W. Figure 4 As shown, Figure 4 is a schematic diagram of the structure of a comparative embodiment of an electronic device. In this embodiment, a second heat sink 400 is attached only to one side of a metal middle frame 500, and a gap 304 is provided between the display screen 100 and the second heat sink 400. The structure of curve b is as shown in FIG. Figure 5 As shown, Figure 5 2 is a schematic diagram of the structure of another comparative embodiment of an electronic device. In this embodiment, a first heat sink 300 is attached only to one side of a display screen 100, and a gap 304 is provided between the first heat sink 300 and a metal middle frame 500. The heat source device is indicated by 200 in the figure. Figure 3 The structure of the middle curve c is the Figure 2 Structure in the embodiment.

[0031] from Figure 3 It can be clearly seen from the comparison that by comparing the simulation results of the above three different graphite sheet stacking structures, it can be seen that curve c has the lowest screen temperature, which is about 1.2°C lower than the graphite full-mount middle frame solution (i.e. curve a), and about 0.4°C lower than the graphite full-mount display screen (i.e. curve b).

[0032] In the electronic device of this embodiment, the graphite originally attached to the middle frame or the display screen is split into two, which are attached to the middle frame and the display screen respectively, and a gap is provided between the two graphite sheets. Due to the heat insulation effect of the gap, the core temperature of the second heat sink attached to one side of the heat source device increases, thereby enhancing the heat equalization effect of the cold end of the second heat sink, avoiding direct conduction to the display screen to affect the display effect of the display screen, and increasing the touch temperature of the display screen.

[0033] See also Figure 6 , Figure 6 It is a partial structural diagram of another embodiment of the electronic device of the present application, which includes but is not limited to the following structures: a display screen 100, a heat source device 200, a first heat sink 300 and a second heat sink 400, a metal middle frame 500, a back cover 600 and a heat spreader 700.

[0034] Among them, the first heat sink 300 is attached to the surface of the display screen 100 corresponding to the heat source device 200. The function of the first heat sink 300 is to achieve uniform heat dissipation of the display screen 100 on the one hand, and to block and uniformly heat the heat radiated from the second heat sink 400 on the other hand. The heat spreader 700 is attached to the metal middle frame 500 and is arranged between the second heat sink 400 and the metal middle frame 500. The heat spreader 700 and the second heat sink 400 are used to uniformly dissipate heat for the metal middle frame 500. Among them, the specific structure of the heat spreader 700 is a chamber and an internal capillary structure, and a heat conductive medium is encapsulated in the chamber. The detailed structure of the heat spreader 700 is within the understanding of those skilled in the art and will not be repeated here.

[0035] Optionally, the heat source device 200 in this embodiment may include a mainboard 210 (processor), a battery 220, and a small board 230 of an electronic device, etc., which are not specifically limited here. Among them, the first heat sink 300 and the second heat sink 400 are correspondingly arranged, and a gap 304 is provided between the first heat sink 300 and the second heat sink 400. The width of the gap 304 is 0.06mm-0.1mm, and can be specifically 0.06mm, 0.065mm, 0.07mm, 0.076mm, 0.08mm, 0.09mm and 0.10mm. Among them, the width value of the gap 304 considers the safety avoidance design of the drop test of the display screen 100 on the one hand (taking into account the overall structure of the electronic device to be thin and light), and on the other hand, the heat dissipation gap design of the first heat sink 300 and the second heat sink 400 is considered. After verification and research, the inventor found that the gap width in the range of 0.06mm-0.1mm is the optimal solution for achieving the above two requirements.

[0036] Optionally, the first heat sink 300 in the embodiment of the present application may be a graphite sheet, and the thickness of the first heat sink 300 is 0.05mm-0.10mm, specifically 0.05mm, 0.055mm, 0.06mm, 0.063mm, 0.07mm, 0.078mm, 0.08mm, 0.09mm and 0.10mm.

[0037] Optionally, the second heat sink 400 in the embodiment of the present application may be a graphite sheet, and the thickness of the second heat sink 400 may be 0.05mm-0.20mm, specifically 0.05mm, 0.055mm, 0.06mm, 0.063mm, 0.07mm, 0.078mm, 0.08mm, 0.09mm, 0.10mm, 0.12mm, 0.14mm, 0.15mm, 0.18mm, 0.20mm and the like.

[0038] See also Figure 7 , Figure 7It is a schematic diagram of the structural composition block diagram of an embodiment of an electronic device of the present application. The electronic device can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. The diagram of this embodiment takes a mobile phone as an example. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (which may be the display screen 100 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the heat source device 200 in the above embodiment) and a power supply 990, etc. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960 and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide power to the entire electronic device.

[0039] Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user approach signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 for receiving and sending sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process data information of the electronic device. For the specific structural features of the electronic device, please refer to the relevant description of the above embodiment, which will not be described in detail here.

[0040] The electronic device in this embodiment arranges a first heat sink and a second heat sink between the display screen and the heat source device, and a gap is provided between the first heat sink and the second heat sink. Due to the heat insulation effect of the gap, the core temperature of the second heat sink attached to the side of the heat source device increases, thereby enhancing the heat equalization effect of the cold end of the second heat sink, avoiding direct conduction (direct contact and bonding with the display screen) to the display screen, affecting the display effect of the display screen, and increasing the tactile temperature of the display screen.

[0041] The above descriptions are only some embodiments of the present application, and do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An electronic device, characterized in that: The electronic device includes a display screen, a heat source device, a first heat sink and a second heat sink, wherein the first heat sink is attached to a surface of the display screen corresponding to the heat source device, and the second heat sink is attached to a side of the heat source device, wherein the first heat sink and the second heat sink are arranged correspondingly, and a gap is provided between the first heat sink and the second heat sink.

2. The electronic device according to claim 1, characterized in that: The first heat sink is made of graphite.

3. The electronic device according to claim 2, characterized in that: The thickness of the first heat sink is 0.05 mm-0.10 mm.

4. The electronic device according to claim 1, characterized in that: The second heat sink is made of graphite.

5. The electronic device according to claim 4, characterized in that: The thickness of the second heat sink is 0.05 mm-0.20 mm.

6. The electronic device according to claim 1, characterized in that: The width of the gap is 0.06mm-0.1mm.

7. The electronic device according to claim 1, characterized in that: The electronic device further comprises a metal middle frame, and the second heat sink and the heat source device are respectively arranged on two sides of the metal middle frame.

8. The electronic device according to claim 7, characterized in that: The electronic device further includes a heat spreader, which is attached to the metal middle frame and disposed between the second heat sink and the metal middle frame.

9. The electronic device according to claim 1, characterized in that: No graphite sheet is arranged inside the display screen.

10. The electronic device according to claim 1, characterized in that: The heat source device includes any one or more of a main board, a battery, and a small board.

Images