Multicolor integrated optical packaging device

Abstract

The invention relates to the technical field of semiconductor light emitting, and discloses a multicolor integrated optical packaging device which comprises a plurality of light-emitting chips and a lens covering the light-emitting chips. The lens comprises an upper optical interface used for outputting light, and the upper optical interface is arranged to be a plane or a free-form surface. And the light-emitting surface of the light-emitting chip is tightly attached to the lens or a cavity structure is arranged between the light-emitting surface and the lens. The light-emitting chips at least comprise a first light-emitting chip and a second light-emitting chip. The shape and the size of a light spot formed by light emission of the single first light-emitting chip or light emission of the combination of the multiple first light-emitting chips are equivalent to those of a light spot formed by light emission of the single second light-emitting chip or light emission of the combination of the multiple second light-emitting chips. According to the invention, a single optical packaging device is integrated with light-emitting chips with different colors, and light spots of emitted light with different colors are basically consistent with an application view field, so that the cost of the whole system is saved, and meanwhile, the light energy utilization rate is greatly improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor light emitting, and in particular, relates to a multi-color integrated optical packaging device. Background Art

[0002] With the development of semiconductor materials and microelectronics technology in recent years, the processing technology and process of luminescent materials and optical components have made great progress. At the same time, with the continuous improvement of living standards, people have higher and higher requirements for luminous effects in commercial lighting, furniture lighting, film and television lighting and other application fields, especially for combining light sources of multiple colors to meet people's needs for different luminous effects.

[0003] Conventional cameras need both white light and infrared light for fill-in in some special scenes. The field of view of a general camera sensor is rectangular. Existing technologies use independent white light sources and infrared light sources for fill-in. Most white light sources and infrared light sources are optically controlled with secondary lenses when in use. Such a setting system has high cost, and the spot shape, size, and position of white light and infrared light are inconsistent with the field of view of the camera sensor, resulting in a waste of light energy. In addition, in order to save costs, some white light sources and infrared light sources used for fill-in do not use secondary lenses, which will lead to excessive energy waste.

[0004] Based on the above, the current problem to be solved is: to provide a multi-color integrated optical packaging device to achieve the integration of multi-color light-emitting chips in a single packaging device, and the light spots of different colors are basically consistent with the field of view of the application scenario, thereby reducing the cost of the entire system and greatly improving the utilization rate of light energy. Summary of the invention

[0005] The purpose of the present invention is to provide a multi-color integrated optical packaging device, aiming to solve the problems in the prior art of inconsistent light spots of different colors, high cost of the entire system and low light energy utilization.

[0006] The present invention is implemented as follows: a multi-color integrated optical package device includes a plurality of light-emitting chips and a lens covering the plurality of light-emitting chips;

[0007] The lens comprises an upper optical interface for outputting light, and the upper optical interface is configured as a plane or a free-form surface;

[0008] The light emitting surface of the light emitting chip is closely attached to the lens or a cavity structure is provided between the light emitting chip and the lens; the light emitting chip comprises at least a first light emitting chip and a second light emitting chip;

[0009] The shape and size of the light spot of a single first light-emitting chip or a combination of a plurality of the first light-emitting chips are comparable to the shape and size of the light spot of a single second light-emitting chip or a combination of a plurality of the second light-emitting chips.

[0010] Furthermore, a protrusion is provided on the side of the lens away from the upper optical interface; the protrusion includes a connecting surface at the bottom and a reflecting surface on the side; the connecting surface is tightly connected to the light-emitting chip or is connected to the light-emitting chip through a first light-transmitting adhesive layer; the first light-transmitting adhesive layer has optical functions and connecting effects; the connecting surface at least covers the light-emitting surface of the light-emitting chip; the reflecting surface is set as a plane or a curved surface with a certain inclination angle to the light-emitting surface of the light-emitting chip; the cross-section of the protrusion decreases along the direction approaching the light-emitting chip.

[0011] Further, it comprises a first light-emitting chip and two second light-emitting chips symmetrically arranged on both sides of the first light-emitting chip; the color of the light emitted by the first light-emitting chip is different from the color of the light emitted by the second light-emitting chip;

[0012] The optical axis of the first light-emitting chip is parallel to or overlaps with the optical axis of the upper optical interface; the light spot emitted by the first light-emitting chip is comparable in shape and size to the light spot emitted by the combination of the two second light-emitting chips.

[0013] Furthermore, the side of the lens away from the upper optical interface is provided with the cavity structure recessed into the interior of the lens, and the cavity structure includes a lower optical interface for inputting light;

[0014] The light-emitting surface of the first light-emitting chip is covered with a second light-transmitting adhesive layer, the second light-transmitting adhesive layer is arranged in the cavity structure, the second light-transmitting adhesive layer is spaced apart from the lower optical interface or is tightly connected to the lower optical interface through the first light-transmitting adhesive layer; the second light-transmitting adhesive layer is set to be a light-transmitting medium including at least phosphor;

[0015] The protrusions are provided on both sides of the cavity structure, and the light-emitting surface of the second light-emitting chip is tightly fitted with the connecting surface of the protrusions or is connected to the connecting surface through the first light-transmitting adhesive layer.

[0016] Furthermore, the first light-emitting chip and the second light-emitting chip are arranged in a straight line along the X-axis direction, and the Z-axis overlaps or is arranged parallel to the optical axis of the first light-emitting chip;

[0017] The upper optical interface is set as a convex surface, the X-axis and Z-axis planes intersect the upper optical interface at a first curve, the curvature of the middle part of the first curve is the largest, and the curvature of the first curve gradually decreases from the middle part to both sides;

[0018] The first light-emitting chip is disposed corresponding to the middle of the first curve, and the two second light-emitting chips are disposed corresponding to both sides of the first curve respectively.

[0019] Furthermore, the Y-axis and Z-axis planes intersect the upper optical interface at a second curve, the curvature of the middle part of the second curve is the largest, and the curvature of the second curve gradually decreases from the middle part to both sides; the first light-emitting chip and the second light-emitting chip are arranged corresponding to the middle part of the second curve.

[0020] Furthermore, the curvature of the second curve is greater than the curvature of the first curve.

[0021] Furthermore, the first light emitting chip is a blue light chip, and the second light emitting chip is an infrared light chip.

[0022] Furthermore, the lower optical interface is configured as a continuous plane or curved surface or an axisymmetric irregular surface.

[0023] Furthermore, the distance between the light emitting chips is W, the length of the light emitting chip is L, and 0 <W≤3L。

[0024] Compared with the prior art, the photosensitive packaging device provided by the present invention has the following beneficial effects:

[0025] The present invention encapsulates a first light-emitting chip and a second light-emitting chip in a single lens. The shape and size of the light spot emitted by a single first light-emitting chip or a combination of multiple first light-emitting chips are comparable to those of a single second light-emitting chip or a combination of multiple second light-emitting chips. The light spots of different colors are consistent with the application field of view, for example, consistent with the shape, size, and position of the field of view of a camera sensor. In the application scenario, lights of different colors can be filled in separately or simultaneously, and a light field that is the same or similar to the required fill-in light field can be formed during fill-in, which not only saves the cost of the entire system, but also greatly improves the utilization rate of light energy. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic cross-sectional structure diagram of a multi-color integrated optical packaging device embodiment 1 provided by the present invention;

[0027] Figure 2 is a schematic cross-sectional structure diagram of a multi-color integrated optical packaging device embodiment 2 provided by the present invention;

[0028] Figure 3 It is a schematic diagram of the cross-sectional structure of the multi-color integrated optical packaging device provided by the present invention in the X-axis and Z-axis planes and a light path diagram of the first light-emitting chip emitting light alone;

[0029] Figure 4 yes Figure 3A light path diagram of the second light-emitting chip independently emitting light in the X-axis and Z-axis planes;

[0030] Figure 5 yes Figure 3 A light path diagram of the two second light-emitting chips emitting light in combination in the X-axis and Z-axis planes;

[0031] Figure 6 yes Figure 3 A top view of a combination of a first light-emitting chip and a second light-emitting chip;

[0032] Figure 7 It is a schematic diagram of the cross-sectional structure and optical path diagram of the multi-color integrated optical packaging device provided by the present invention in the Y-axis and Z-axis planes;

[0033] Figure 8 is a comparison chart of the first curve and the second curve;

[0034] In the figure: 1-light-emitting chip; 11-first light-emitting chip; 12-second light-emitting chip; 2-lens; 21-upper optical interface; 211-first curve; 212-second curve; 3-cavity structure; 31-lower optical interface; 4-protrusion; 41-connecting surface; 42-reflecting surface; 5-first light-transmitting adhesive layer; 6-second light-transmitting adhesive layer. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0036] The implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0037] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0038] Reference Figure 1-8 The figure shows a preferred embodiment of the present invention.

[0039] Reference Figure 1-2The multi-color integrated optical package device includes a plurality of light-emitting chips 1 and a lens 2 covering the plurality of light-emitting chips 1. The lens 2 has an optical function and is used to encapsulate the light-emitting chip 1. The lens 2 includes an outer surface and an inner surface, the outer surface is an upper optical interface 21 for outputting light, and the inner surface is used for inputting light and covering the light-emitting chip 1. The upper optical interface 21 can be set to a plane or a free-form surface as required.

[0040] The light-emitting chip 1 at least includes a first light-emitting chip 11 and a second light-emitting chip 12. The colors of the emitted light of the first light-emitting chip 11 and the second light-emitting chip 12 are the same or different. The light-emitting mode can be set to the first light-emitting chip 11 and the second light-emitting chip 12 to emit light independently; or to set multiple first light-emitting chips 11 to emit light at the same time; or to set multiple second light-emitting chips 11 to emit light at the same time; or to set several first light-emitting chips 11 and several second light-emitting chips 12 to emit light at the same time. The above-mentioned multiple light-emitting modes can be set to switch at will. At the same time, the light spot of a single first light-emitting chip 11 emitting light or a combination of multiple first light-emitting chips 11 emitting light is the same or similar to the light spot of a single second light-emitting chip 12 emitting light or a combination of multiple second light-emitting chips 12 emitting light, including the shape, size, position, brightness and uniformity of the light spot. It is preferred that the optical axes of the above two light spots overlap or are parallel. Further, the light spot is set to be an ellipse or a rectangle or a quasi-ellipse between an ellipse and a rectangle. Thereby, the same optical package device can emit multiple colors of light, and the light spot of each color of light is the same or approximately the same, forming a basically consistent light spot, and the optical axes overlap or are parallel. In application scenarios, lights of different colors can be used to fill in the light individually or simultaneously. When filling in the light, a light field that is the same or similar to the required fill-in light field can be formed, which not only saves the cost of the entire system, but also greatly improves the utilization rate of light energy.

[0041] The first light emitting chip 11 and the second light emitting chip 21 are arranged at intervals, and different structures covering the light emitting chip 1 are arranged inside the lens 2:

[0042] 1. The inner surface of the lens 2 tightly covers the light-emitting surface of the light-emitting chip 1 or the light-emitting surface and side surface of the light-emitting chip 1. The lens 2 and the light-emitting chip 1 can also be connected by setting a first light-transmitting adhesive layer 5. The first light-transmitting adhesive layer 5 has optical functions and connection effects.

[0043] Second, the inner surface of the lens 2 is provided with a cavity structure 3 that is recessed into the lens 2. The light-emitting surface of the light-emitting chip 1 is provided in the cavity structure 3. The cavity structure 3 is used to accommodate the light-emitting chip 1 and light propagation. The cavity structure 3 includes a lower optical interface 31 for inputting light. The lower optical interface 31 is provided as a continuous plane or a curved surface or an axially symmetrical irregular surface. After propagating in the cavity structure 3, the light emitted by the light-emitting chip 1 is refracted by the lower optical interface 31 and enters the lens 2, and then refracted by the upper optical interface 21 and then emitted.

[0044] Third, the lens 2 is closely connected to the light-emitting surfaces of several light-emitting chips 1 or connected through a first light-transmitting adhesive layer 5; a cavity structure 3 is provided between the lens 2 and the light-emitting surfaces of several other light-emitting chips 1, that is, the lens 2 and the light-emitting surfaces of the dry light-emitting chips 1 are arranged at intervals.

[0045] In order to better cut off light, make full use of light energy, and improve the spot quality, a protrusion 4 is provided on the side of the lens 2 facing away from the upper optical interface 21. Refer to Figure 1 , Figure 4 , that is, the protrusion 4 is a protrusion of the inner surface of the lens 2 in a direction away from the upper optical interface 21. The protrusion 4 includes a connecting surface 41 for connecting to the light-emitting chip 1 at the bottom and a reflecting surface 42 for reflecting large-angle light at the edge on the side. The connection mode between the connecting surface 41 and the light-emitting chip 1 can be set to closely cover the light-emitting surface of the light chip 1, or a first light-transmitting adhesive layer 5 for connection and light transmission is covered on the light-emitting surface of the light-emitting chip 1, and the connecting surface 41 closely covers the light-emitting surface of the first light-transmitting adhesive layer 5. The connecting surface 41 at least covers the light-emitting surface of the light-emitting chip 1. The reflecting surface 42 is set as a plane or a curved surface at a certain angle with the light-emitting surface of the light-emitting chip 1. The area of the cross-section of the protrusion 4 gradually decreases in the direction close to the light-emitting chip 1.

[0046] The reflecting surface 42 is the intersection interface of the lens 2 and the filling medium (including but not limited to air). The refractive index of the lens 2 is greater than that of the filling medium. The light emitted by the light-emitting chip 1 enters the lens 2 through the connecting surface 41. The light near the optical axis in the lens 2 reaches the upper optical interface 21 and is refracted and emitted through the upper optical interface 21. The large-angle incident light on both sides of the optical axis reaches the reflecting surface 42 and undergoes total reflection and propagates towards the direction close to the optical axis, that is, the light enters from the optically denser medium (lens 2) into the optically thinner medium (filling medium), and total reflection occurs at its interface (reflecting surface 42) because the incident angle is greater than or equal to the critical angle. The large angles on both sides are fully utilized, not only the light energy utilization rate is high, but also the edge cut-off effect of the spot is good, and the spot quality is improved.

[0047] In a preferred solution, refer to Figure 1 , the distance between adjacent light-emitting chips 1 is W, and the length of the light-emitting chip 1 is L. Preferably, 0 < W ≤ 3L is satisfied. Further, preferably, the length of the first light-emitting chip 11 is greater than the length of the second light-emitting chip 12.

[0048] Example 1: Refer to Figure 1The multi-color integrated optical packaging device includes a first light-emitting chip 11 and two second light-emitting chips 12 symmetrically arranged on both sides of the first light-emitting chip 11. The first light-emitting chip 11 is arranged parallel to the optical axis of the two second light-emitting chips 12 respectively. The color of the light emitted by the first light-emitting chip 11 is different from the color of the light emitted by the second light-emitting chip 12. Preferably, the first light-emitting chip 11 is a blue light chip, and the second light-emitting chip 12 is an infrared light chip. The light-emitting surface of the first light-emitting chip 11 is covered with a second light-transmitting adhesive layer 6, and the second light-transmitting adhesive layer 6 at least includes phosphor. The second light-transmitting adhesive layer 6 is used to excite the blue light of the first light-emitting chip 11 into white light.

[0049] A cavity structure 3 is provided on the side of the lens 2 facing away from the upper optical interface 21, and the optical axis of the lower optical interface 31 of the cavity structure 3 overlaps or is parallel to the optical axis of the upper optical interface 21. Protrusions 4 are symmetrically provided on both sides of the cavity structure 3. The first light-emitting chip 11 is provided corresponding to the cavity structure 3, and the lower optical interface 31 covers the light-emitting surface of the second light-transmitting adhesive layer 6 at intervals. The light-emitting surfaces of the two second light-emitting chips 12 are closely attached to the connecting surfaces 41 of the two protrusions 4, respectively, or are closely connected to the connecting surfaces 41 through the first light-transmitting adhesive layer 5, and the connecting surfaces 41 cover the light-emitting surface of the second light-emitting chip 12 or the light-emitting surface and side surface of the second light-emitting chip 12.

[0050] Reference Figure 6 The first light-emitting chip 11 and the two second light-emitting chips 12 are arranged in a straight line at intervals, the X-axis is parallel to the straight line where the three are located; the Y-axis is perpendicular to the straight line where the three are located; the Z-axis overlaps or is parallel to the optical axis of the first light-emitting chip 11; the X-axis, Y-axis, and Z-axis are rectangular coordinate axes in three-dimensional space.

[0051] Reference Figure 3-5 , the upper optical interface 21 is set as a convex surface, and the X-axis and Z-axis planes intersect the upper optical interface 21 at the first curve 211. Preferably, the first curve 211 is an axisymmetric curve, and the middle of the first curve 211 is provided with a highest point, the curvature of the highest point is the largest, and the curvature of the first curve 211 gradually decreases from the highest point to both sides.

[0052] The first light emitting chip 11 is disposed corresponding to the middle of the first curve 211 , and the two second light emitting chips 12 are disposed corresponding to both sides of the highest point of the first curve 211 .

[0053] Reference Figure 7, the Y-axis and Z-axis planes intersect with the upper optical interface 21 at the second curve 212. A peak is provided in the middle of the second curve 212, and the curvature of the peak is the largest. The curvature of the second curve 212 gradually decreases along the peak to both sides. The first light-emitting chip 11 and the second light-emitting chip 12 are arranged corresponding to the middle of the second curve 212. The optical axis of the first light-emitting chip 11 is parallel to or overlaps with the optical axis of the upper optical interface 21. And the optical axis of the first light-emitting chip 11 emitting light alone overlaps or is parallel to the optical axis of the combined light of the two second light-emitting chips 12.

[0054] The light spots formed by the first light emitting chip 11 emitting light alone are distributed axially symmetrically (refer to Figure 3 ). Two symmetrical second light emitting chips 12 emit light simultaneously to form two symmetrical and overlapping light spots (refer to Figure 4-5 The light spot formed by the overlapping combination of the light spots of the two second light-emitting chips 12 is the same as or similar to the light spot formed by the first light-emitting chip 11 alone, that is, several or all indicators of the shape, size, position, brightness and uniformity of the light spot are consistent.

[0055] A multi-color integrated optical packaging device of the present invention integrates two colors of light, infrared light and white light. The infrared light and the white light can emit light separately or simultaneously, and at the same time realize the same or similar light field as the camera sensor, which not only saves the cost of the entire system, but also greatly improves the utilization rate of light energy.

[0056] Reference Figure 8 The curvature of the second curve 212 is greater than the curvature of the first curve 211, the light spot is elliptical, rectangular, or elliptical between elliptical and rectangular, the major axis of the light spot is parallel to the X-axis, and the minor axis is parallel to the Y-axis.

[0057] Example 2: Reference Figure 2 , the configuration of Embodiment 2 is similar to that of Embodiment 1 for the most part, and the main difference is the way in which the lens 2 covers the light-emitting chip 1: a cavity structure 3 is provided on the side of the lens 2 facing away from the upper optical interface 21, and the optical axis of the lower optical interface 31 of the cavity structure 3 overlaps or is parallel to the optical axis of the upper optical interface 21. The first light-emitting chip 11 is arranged corresponding to the cavity structure 3, and the lower optical interface 31 is closely attached to the light-emitting surface of the second light-transmitting adhesive layer 6 or connected to the light-emitting surface of the second light-transmitting adhesive layer 6 through the first light-transmitting adhesive layer 5. The light emitted by the first light-emitting chip 11 enters the lens 2 directly from the second light-transmitting adhesive layer 6 or enters the lens 2 through the first light-transmitting adhesive layer 5, without the refraction effect of air or other filling media, and the edge of the entire light spot is more cut off, and the light energy utilization rate is high. The side surface of the second light-transmitting adhesive layer 6 is at a certain inclination angle with the light-emitting surface of the first light-emitting chip 11, which is used to reflect the large-angle edge light in the second light-transmitting adhesive layer 6, further improving the light energy utilization rate.

[0058] The present invention is not limited thereto; any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A multi-color integrated optical packaging device, characterized in that: Comprising a plurality of light-emitting chips (1) and a lens (2) covering the plurality of light-emitting chips (1); The lens (2) comprises an upper optical interface (21) for outputting light, wherein the upper optical interface (21) is configured as a plane or a free-form surface; The light-emitting surface of the light-emitting chip (1) is in close contact with the lens (2) or a cavity structure (3) is provided between the light-emitting chip and the lens (2); the light-emitting chip (1) comprises at least a first light-emitting chip (11) and a second light-emitting chip (12); The shape and size of a light spot produced by a single first light-emitting chip (11) or a combination of a plurality of first light-emitting chips (11) are comparable to those of a light spot produced by a single second light-emitting chip (12) or a combination of a plurality of second light-emitting chips (12).

2. The multi-color integrated optical package device according to claim 1, characterized in that: A protrusion (4) is provided on the side of the lens (2) facing away from the upper optical interface (21); the protrusion (4) comprises a connecting surface (41) at the bottom and a reflecting surface (42) at the side; the connecting surface (41) is tightly connected to the light-emitting chip (1) or is connected to the light-emitting chip (1) via a first light-transmitting adhesive layer (5); the first light-transmitting adhesive layer (5) has an optical function and a connecting function; The connecting surface (41) at least covers the light-emitting surface of the light-emitting chip (1); the reflecting surface (42) is arranged as a plane or a curved surface with a certain inclination angle with the light-emitting surface of the light-emitting chip (1); and the cross section of the protrusion (4) decreases in a direction approaching the light-emitting chip (1).

3. The multi-color integrated optical package device according to claim 2, characterized in that: Comprising a first light-emitting chip (11) and two second light-emitting chips (12) symmetrically arranged on both sides of the first light-emitting chip (11); the color of light emitted by the first light-emitting chip (11) is different from the color of light emitted by the second light-emitting chip (12); The optical axis of the first light-emitting chip (11) is parallel to or overlaps with the optical axis of the upper optical interface (21); the light spot emitted by the first light-emitting chip (11) is comparable in shape and size to the light spot emitted by the combination of the two second light-emitting chips (12).

4. The multi-color integrated optical packaging device according to claim 3, characterized in that: The cavity structure (3) recessed into the interior of the lens (2) is provided on a side of the lens (2) facing away from the upper optical interface (21), and the cavity structure (3) comprises a lower optical interface (31) for inputting light; The light-emitting surface of the first light-emitting chip (11) is covered with a second light-transmitting adhesive layer (6), the second light-transmitting adhesive layer (6) is arranged in the cavity structure (3), the second light-transmitting adhesive layer (6) is spaced apart from the lower optical interface (31) or is tightly connected to the lower optical interface (31) through the first light-transmitting adhesive layer (5); the second light-transmitting adhesive layer (6) is arranged as a light-transmitting medium at least comprising phosphor; The protrusions (4) are provided on both sides of the cavity structure (3), and the light-emitting surface of the second light-emitting chip (12) is tightly fitted with the connecting surface (41) of the protrusion (4) or is connected to the connecting surface (41) via the first light-transmitting adhesive layer (5).

5. The multi-color integrated optical package device according to claim 3, characterized in that: The first light-emitting chip (11) and the second light-emitting chip (12) are arranged in a straight line along the X-axis direction, and the Z-axis overlaps with or is arranged parallel to the optical axis of the first light-emitting chip (11); The upper optical interface (21) is set as a convex surface, the X-axis and Z-axis planes intersect the upper optical interface (21) at a first curve (211), the middle of the first curve (211) has the largest curvature, and the curvature of the first curve (211) gradually decreases from the middle to both sides; The first light-emitting chip (11) is arranged corresponding to the middle of the first curve (211), and the two second light-emitting chips (12) are arranged corresponding to both sides of the first curve (211) respectively.

6. The multi-color integrated optical package device according to claim 5, characterized in that: The Y-axis and Z-axis planes intersect the upper optical interface (21) at a second curve (212); the curvature of the middle portion of the second curve (212) is the largest, and the curvature of the second curve (212) gradually decreases from the middle portion to both sides; the first light-emitting chip (11) and the second light-emitting chip (12) are arranged corresponding to the middle portion of the second curve (212).

7. The multi-color integrated optical package device according to claim 6, characterized in that: The curvature of the second curve (212) is greater than the curvature of the first curve (211).

8. The multi-color integrated optical package device according to claim 3, characterized in that: The first light emitting chip (11) is a blue light chip, and the second light emitting chip (12) is an infrared light chip.

9. The multi-color integrated optical package device according to claim 1, characterized in that: The lower optical interface (31) is configured as a continuous plane or curved surface or an axisymmetric irregular surface.

10. The multi-color integrated optical package device according to claim 1, characterized in that: The distance between the light-emitting chips (1) is W, the length of the light-emitting chip (1) is L, and 0 <W≤3L。

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