Display panel and display device

Abstract

The invention provides a display panel. The display panel comprises a substrate, an isolation structure, a first packaging layer and a plurality of light emitting devices, the isolation structure is provided with a plurality of first openings defining the light emitting devices respectively, the isolation structure comprises a supporting part and a crown part located on the side, away from the substrate, of the supporting part, and the orthographic projection of the supporting part on the substrate is located within the orthographic projection of the crown part on the substrate. The first packaging layer is located on the side, away from the substrate, of the isolation structure and the light-emitting device and covers the isolation structure and the light-emitting device. In each first opening and at an edge of the crown, a portion of the first encapsulation layer covering the crown is closed with a portion covering the light emitting device. The design can improve the packaging reliability of the display panel.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a display panel and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is an organic thin film electroluminescent device. It has attracted great attention and is widely used in electronic display products due to its advantages such as simple preparation process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display.

[0003] However, current electronic display products are limited by their own structural design, making it difficult to further improve the packaging effect of OLED while further increasing the pixel density PPI. Summary of the invention

[0004] The first aspect of the present disclosure provides a display panel, which includes a substrate and an isolation structure, a first encapsulation layer and a plurality of light-emitting devices located on the substrate. The isolation structure has a plurality of first openings that respectively define the light-emitting devices, and the isolation structure includes a support portion and a crown portion located on the side of the support portion facing away from the substrate, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate. The first encapsulation layer is located on the side of the isolation structure and the light-emitting device facing away from the substrate, and covers the isolation structure and the light-emitting device. In each first opening and at the edge of the crown portion, the portion of the first encapsulation layer covering the crown portion is closed to the portion covering the light-emitting device.

[0005] In the above scheme, after each preparation of some light-emitting devices, the space formed at the edge of the isolation structure is sealed by using the first encapsulation layer. During the preparation of other light-emitting devices and subsequent process, no corrosive liquid (or etching gas) or other harmful materials will invade the space and damage the first encapsulation layer and the light-emitting devices thereunder, thereby improving the reliability of the display panel packaging.

[0006] In a specific embodiment of the first aspect of the present disclosure, the first encapsulation layer includes a first part, the first part covers a portion of the crown portion facing away from the substrate, the thickness of the first part is a first thickness crown, at the edge of the crown portion, the distance from the edge of the surface of the crown portion facing the substrate to the surface of the light-emitting device facing away from the substrate is a first distance, and the ratio of the first thickness to the first distance is not less than 1.

[0007] In the above solution, under the condition that the ratio of the first thickness to the first distance is not less than 1, it can be ensured that the first encapsulation layer can completely seal the space formed at the edge of the isolation structure in the actual process.

[0008] In a specific embodiment of the first aspect of the present disclosure, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence on a substrate, the light-emitting functional layer and the second electrode of each light-emitting device are located in the corresponding first opening, and the orthographic projection of the edge of the crown on the substrate is located within the orthographic projection of the light-emitting functional layer and the second electrode on the substrate.

[0009] In a specific embodiment of the first aspect of the present disclosure, the support portion of the isolation structure is located in a gap between adjacent first electrodes and is spaced apart from the first electrode, and the difference between the sum of the thicknesses of the first electrode, the light-emitting functional layer, and the portion of the second electrode overlapping the edge of the crown and the height of the support portion is equal to the first distance.

[0010] In another specific embodiment of the first aspect of the present disclosure, the display panel also includes a pixel defining layer located between the substrate and the isolation structure, the pixel defining layer defines a plurality of second openings corresponding to the first openings respectively, the orthographic projections of the second openings on the substrate are located within the orthographic projections of the corresponding first openings on the substrate, the light-emitting functional layer and the second electrode fill the second openings and extend to the surface of the pixel defining layer away from the substrate, and the difference between the sum of the thicknesses of the portions of the light-emitting functional layer and the second electrode overlapping with the pixel defining layer and the height of the supporting portion is equal to the first distance.

[0011] In a specific embodiment of the first aspect of the present disclosure, the support portion and the crown portion are an integrated structure, the isolation structure is a conductive structure, and the second electrode of the light-emitting device is connected to the support portion.

[0012] In another specific embodiment of the first aspect of the present disclosure, the support portion is a conductive structure, and the second electrode of the light-emitting device is connected to the support portion.

[0013] In a specific embodiment of the first aspect of the present disclosure, the ratio of the first thickness to the first distance is not less than 1.1, and the width of the contact interface between the portion of the first encapsulation layer covering the crown and the portion covering the light-emitting device is greater than zero.

[0014] In the above solution, it can be ensured that the first encapsulation layer has a larger closing width at the closing portion, so as to improve the closing effect of the first encapsulation layer.

[0015] In a specific embodiment of the first aspect of the present disclosure, the ratio of the first thickness to the first distance is not less than 1.4, and the width of the contact interface between the portion of the first encapsulation layer covering the crown and the portion covering the light-emitting device is not less than 3000 angstroms.

[0016] In a specific embodiment of the first aspect of the present disclosure, the ratio of the first thickness to the first distance is 1.4-2.4, and the width of the contact interface between the portion of the first encapsulation layer covering the crown and the portion covering the light-emitting device is 3000-8000 angstroms.

[0017] Within the above numerical range, it is possible to ensure that the first encapsulation layer has a sufficient encapsulation width at the encapsulation portion while preventing the first encapsulation layer from being too thick to cause adverse effects on the performance (eg, flexibility, encapsulation) of the display panel.

[0018] A second aspect of the present disclosure provides a display device, which includes the display panel in the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of a planar structure of a display panel provided in one embodiment of the present disclosure.

[0020] Figure 2 for Figure 1 An enlarged view of area S1 of the display panel is shown.

[0021] Figure 3 for Figure 2 The display panel is shown in a cross-sectional view along MN.

[0022] Figure 4 for Figure 3 An enlarged view of a portion of the display panel is shown.

[0023] Figure 5 A schematic structural diagram of another display panel provided as a comparative example according to an embodiment of the present disclosure.

[0024] FIG. 6A to FIG. 6D For forming a method according to an embodiment of the present disclosure Figure 5 A process diagram of a method for preparing a display panel is shown.

[0025] Figure 7 A schematic diagram of the positional relationship between a partial film layer of a display panel and an evaporation source during evaporation provided by an embodiment of the present disclosure.

[0026] Figure 8 A cross-sectional view of a partial area of ​​a display panel provided by an embodiment of the present disclosure. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0028] In display products, some functional film layers in the light-emitting devices are formed by evaporation, and there are multiple functional film layers in each light-emitting device, and the materials of some functional film layers (such as light-emitting layers) in the light-emitting devices that emit different light are different. Therefore, when evaporating these functional film layers through a mask plate (such as a fine mask plate), multiple alignments are required. In order to solve the position offset problem caused by the alignment accuracy error, sufficient space (and safety margin related to the alignment error) needs to be reserved between different light-emitting devices to ensure that the position of the actual light-emitting area of ​​the light-emitting device can have a certain overlap rate with the designed position (design area), which is equivalent to compressing the design area of ​​the light-emitting area of ​​the light-emitting device, which not only limits the light-emitting area of ​​the light-emitting device, but also prevents the arrangement density of the light-emitting device from being further increased, thereby making it difficult to further improve the PPI (pixel density) of the display panel.

[0029] In the present disclosure, an isolation structure is provided at the gap between the light-emitting devices to separate the functional film layers of the adjacent light-emitting devices. Thus, in the evaporation process of the functional film layer, it is only necessary to perform evaporation on the entire surface of the display panel without using a mask plate to prepare the functional film layer of each light-emitting device separately. The process does not need to consider the alignment accuracy during evaporation, so that the gap between the light-emitting devices can be designed to be smaller in size to increase the PPI (the principle can be referred to in the following and FIG. 6A to FIG. 6D (See also the relevant description in the relevant embodiments).

[0030] It should be noted that when preparing light-emitting devices through an isolation structure, because the light-emitting devices are prepared in batches according to different light-emitting colors, after the preparation of the previous batch of light-emitting devices is completed, a packaging structure will be formed thereon for protection, so as to reduce the damage to the previous batch of light-emitting devices caused by the preparation process when preparing the next batch of light-emitting devices. Therefore, the packaging effect of the packaging structure will directly affect the preparation yield of the light-emitting device. However, due to the setting of the isolation structure, the packaging structure will form an open space (similar to a groove) at the edge of the isolation structure. In this space, the thickness of the packaging structure is limited and the film quality is low. In the subsequent preparation process of the light-emitting device, the space may also store a large amount of corrosive liquid (or etching gas, such as for removing photoresist), thereby damaging the packaging structure at the space, which will not only lead to poor packaging, but also may cause damage to the light-emitting device to cause poor display.

[0031] The embodiment of the present disclosure provides a display panel to at least solve the above technical problems. The display panel includes a substrate and an isolation structure, a first encapsulation layer and a plurality of light-emitting devices located on the substrate. The isolation structure has a plurality of first openings that define the light-emitting devices respectively, and the isolation structure includes a support portion and a crown portion located on the side of the support portion away from the substrate, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate. The first encapsulation layer is located on the side of the isolation structure and the light-emitting device away from the substrate, and covers the isolation structure and the light-emitting device. In each first opening and at the edge of the crown portion, the portion of the first encapsulation layer covering the crown portion is closed with the portion covering the light-emitting device. For example, the portion of the first encapsulation layer covering the crown portion is combined with or in contact with the portion covering the light-emitting device. Based on the design of the display panel, after each preparation of a portion of the light-emitting device, the space formed at the edge of the isolation structure is closed by using the first encapsulation layer, and in the preparation of other light-emitting devices and subsequent process, no corrosive liquid (or etching gas) or other harmful materials will invade the space and damage the first encapsulation layer and the light-emitting device thereunder, thereby improving the reliability of the display panel encapsulation.

[0032] The structure of the display panel in at least one embodiment of the present disclosure is described in detail below with reference to the accompanying drawings. In addition, in these drawings, a spatial rectangular coordinate system is established with the substrate as a reference to more intuitively present the positional relationship of the relevant structures in the display panel, and in the spatial rectangular coordinate system, the X-axis and the Y-axis are parallel to the surface where the substrate is located, and the Z-axis is perpendicular to the surface where the substrate is located.

[0033] like Figures 1 to 4 As shown, the plane area of ​​the display panel 10 can be divided into a display area 11 and a border area 12 surrounding the display area 11. Sub-pixels (which may be called sub-pixels, etc.) may be arranged in the display area 11, such as R, G, and B sub-pixels. The physical structure of the sub-pixel may be a light-emitting device. Adjacent sub-pixels with different colors of emitted light constitute a pixel (which may be called a pixel unit, a large pixel, etc.). The arrangement density of the pixel in the display area 11 represents the pixel density PPI. It should be noted that in some embodiments of the present disclosure, part of the wiring in the border area 12 may be arranged in the display area 11, so that the border area 12 may be designed as a single-sided border.

[0034] The physical structure of the display panel 10 may include a substrate 100 and a display function layer and an isolation structure 300 located on the substrate 100 , wherein the display function layer includes a plurality of light emitting devices 200 .

[0035] The isolation structure 300 is located on the substrate 100 and defines a plurality of first openings 301, that is, the planar shape of the isolation structure 300 is a grid-like pattern, and the first openings 301 are meshes of the grid-like pattern. The isolation structure 300 includes a support portion 310 facing the substrate 100 and a crown portion 320 facing away from the substrate 100, and the orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100, that is, the isolation structure 300 as a whole is wide at the top and narrow at the bottom, so that when a part of the film layer (such as the light-emitting functional layer described below) in the light-emitting device 200 is evaporated, it is disconnected at the edge of the isolation structure 300 to reduce the risk of crosstalk between adjacent light-emitting devices.

[0036] The light emitting device 200 and the isolation structure 300 are covered with a first encapsulation layer 410 on one side away from the substrate 100. Due to the isolation structure 300 being designed to be wide at the top and narrow at the bottom, the first encapsulation layer 410 forms a space 401 on one side of the isolation structure 300. In addition, the portion of the first encapsulation layer 410 covering the crown 320 is closed (contacted) with the portion covering the light emitting device 200, so that the space 401 is a closed space. In this way, in the process of preparing different types of light emitting devices, no harmful materials such as corrosive liquid or etching gas will flow into the closed space.

[0037] It should be noted that the first packaging layer 410 can be formed by vapor deposition (for example, chemical vapor deposition CVD). During the film formation process, the packaging material will be deposited on the surface of the isolation structure 300 and the surface of the light-emitting device 200. At the location of the space 401, the packaging material will form a thinner film layer. In this case, the space 401 is still an open space (connected to the outside world). As the thickness of the material deposition increases, the width of the opening of the space 401 gradually decreases, thereby hindering the packaging material from entering the space 401. Therefore, the thickness of the first packaging layer 410 located in the space 401 is much smaller than the thickness of the part located outside the space 401.

[0038] In the embodiment of the present disclosure, the height of the isolation structure 300 and the thickness of the first encapsulation layer 410 are designed so that the first encapsulation layer 410 closes the space 401. In this case, even if the thickness of the portion of the first encapsulation layer 410 located in the space 401 is thinner, the encapsulation effect of the first encapsulation layer 410 on the light-emitting device 200 will not be reduced.

[0039] like Figure 3 and Figure 4As shown, the isolation structure 300 is used to isolate part of the film layer in the light-emitting device 200. Accordingly, part of the film layer of the light-emitting device 200 will extend to the edge of the isolation structure 300. At this edge, the light-emitting device 200 has a certain thickness and affects the height of the first packaging layer 410 covering it, that is, affects the thickness of the first packaging layer 410 required for the closed space 401.

[0040] Thus, in at least one embodiment of the present disclosure, Figure 3 and Figure 4 As shown, the portion of the first encapsulation layer 410 covering the crown 320 facing away from the surface of the substrate 100 (eg, Figure 4 The thickness of the first portion 410 shown in FIG. 3 is a first thickness H1, and at the edge of the crown 320, the distance from the edge of the surface of the crown 320 facing the substrate 100 to the surface of the light-emitting device 200 facing away from the substrate 100 is a first distance H2, and the ratio of the first thickness H1 to the first distance H2 is not less than 1. In this way, under the condition that the ratio of the first thickness H1 to the first distance H2 is not less than 1, it can be ensured that the first encapsulation layer 410 can completely seal the space 401 formed at the edge of the isolation structure 300 in the actual process.

[0041] like Figure 3 and Figure 4 As shown, a larger ratio of the first thickness H1 to the first distance H2 means that the thickness of the first encapsulation layer 410 is larger relative to the first distance H2, which also makes the width of the contact interface 402 of the first encapsulation layer 410 at the closed part of the space 401 larger, thereby making the sealing effect better.

[0042] In at least one embodiment of the present disclosure, the ratio of the first thickness H1 to the first distance H2 may be set to be no less than 1.1. Figure 3 and Figure 4 As shown, the width of the contact interface 402 between the portion of the first encapsulation layer 410 covering the crown 320 and the portion covering the light-emitting device 200 can be greater than zero. In this way, the first encapsulation layer 410 can be ensured to have a larger closed width at the closed portion to improve the sealing effect of the first encapsulation layer 410.

[0043] In at least one embodiment of the present disclosure, the ratio of the first thickness H1 to the first distance H2 can be set to be no less than 1.4. In this case, the width of the contact interface 402 between the portion of the first encapsulation layer 410 covering the crown 320 and the portion covering the light-emitting device 200 is no less than 3000 angstroms. During the preparation of different types of light-emitting devices, the etching liquid (or etching gas) will corrode the first encapsulation layer 410 to a certain extent. In these embodiments, the contact interface 402 can have a sufficient width, and even if the first encapsulation layer 410 is corroded and thinned, the space 401 can still be completely closed.

[0044] In at least one embodiment, the ratio of the first thickness H1 to the first distance H2 is 1.4 to 2.4, and the width of the contact interface between the portion of the first encapsulation layer covering the crown and the portion covering the light-emitting device is 3000 to 8000 angstroms. If the thickness of the first encapsulation layer 410 is too large, the stress generated during deformation (for example, the display panel is a flexible display panel) will increase, and it is easy to be damaged due to stress concentration. The ratio of the first thickness H1 to the first distance H2 is within the above numerical range, which can ensure that the first encapsulation layer 410 has a sufficient closed width at the closed portion, while avoiding the first encapsulation layer 410 being too thick and causing adverse effects on the performance of the display panel (for example, flexibility, encapsulation).

[0045] There are many ways to set up the isolation structure, and the types of each film layer in the light-emitting device can be selected according to different needs. These designs will affect the calculation of the first distance. Therefore, the specific structure of the light-emitting device and the isolation structure is briefly introduced below to illustrate the calculation method of the above-mentioned first distance H2.

[0046] like Figure 3 and Figure 4 As shown, the light-emitting device 200 includes a first electrode 210, a light-emitting functional layer 220 and a second electrode 230 sequentially stacked on a substrate 100. The light-emitting functional layer 220 and the second electrode 230 of each light-emitting device 200 are located in the corresponding first opening 301, and the orthographic projection of the edge of the crown 320 on the substrate 100 is located within the orthographic projection of the light-emitting functional layer 220 and the second electrode 230 on the substrate 100, that is, when calculating the first distance H2, the thickness of the light-emitting functional layer 220 and the second electrode 230 needs to be considered.

[0047] For example, the light-emitting functional layer may further include a light-emitting layer 222 and a second functional layer 223, and the first functional layer 221, the light-emitting layer 222 and the second functional layer 223 are sequentially stacked on the first electrode 210. The first functional layer 221 may include a hole injection layer, a hole transport layer, an electron blocking layer, etc. The second functional layer 223 may include an electron injection layer, an electron transport layer, a hole blocking layer, etc. It should be noted that since the carriers (holes, electrons) mainly crosstalk between adjacent light-emitting devices 200 through the first functional layer 221, the isolation structure 300 needs to be set so that the first functional layers 221 of each light-emitting device 200 are electrically disconnected from each other.

[0048] For example, in at least one embodiment of the present disclosure, the first electrode may be set as an anode, and the second electrode may be set as a cathode.

[0049] Because the isolation structure 300 is wide at the top and narrow at the bottom, the first functional layer 221 will be disconnected at the edge of the crown 320 during the evaporation process. That is, the first functional layer 221 will not be connected to the conductive part of the isolation structure 300 (such as the support part 310) to cause crosstalk between adjacent light-emitting devices 200.

[0050] In the embodiment of the present disclosure, the isolation structure is used to connect the second electrode. In order to avoid the isolation structure from being connected to the first electrode, the size of the first electrode can be reduced to be spaced from the isolation structure, or an insulating layer can be provided between the first electrode and the isolation structure.

[0051] For example, in some embodiments of the present disclosure, Figure 3 and Figure 4 As shown, the display panel may further include a pixel defining layer 330 located between the substrate 100 and the isolation structure 300, the pixel defining layer 330 defines a plurality of second openings 302 corresponding to the first openings 301 respectively, the orthographic projections of the second openings 302 on the substrate 100 are located within the orthographic projections of the corresponding first openings 301 on the substrate 100, the light-emitting functional layer 220 and the second electrode 230 fill the second openings 302 and extend to the surface of the pixel defining layer 330 that is away from the substrate 100, and the sum of the thicknesses of the portions of the light-emitting functional layer 220 and the second electrode 230 that overlap with the pixel defining layer 330, and the difference between the height of the support portion 310 and the first distance H2.

[0052] It should be noted that, in the embodiments of the present disclosure, the “height of the support portion” refers to the distance from the surface of the support portion facing the base to the surface in contact with the crown portion.

[0053] For example, in some designs, the support portion 310 and the crown portion 320 may be an integrated structure, the isolation structure 300 is a conductive structure, and the second electrode 230 of the light-emitting device 200 is connected to the support portion 310. The integrated structure may be an independent film layer, and there is no physical interface in the film layer, and the support portion 310 and the crown portion 320 are two parts of the integrated structure. For example, further, along the direction perpendicular to the substrate 100, the cross-sectional shape of the crown portion 320 is an inverted trapezoid, and the top edge of the inverted trapezoid faces the substrate 100, that is, the top edge of the inverted trapezoid is located between the substrate 100 and the bottom edge of the inverted trapezoid.

[0054] For example, in some other designs, the support portion 310 and the crown portion 320 are two independent film layers, the support portion 310 is a conductive structure, and the second electrode 230 of the light-emitting device 200 is connected to the support portion. For example, further, along the direction perpendicular to the substrate 100, the cross-sectional shape of the support portion is a regular trapezoid, and the crown portion is located at the top edge of the support portion. In this case, it is convenient for the vapor deposition material of the second electrode 230 to be deposited on the side wall of the support portion to improve the overlap yield of the second electrode 230 and the support portion.

[0055] For example, in some embodiments of the present disclosure, the support portion of the isolation structure is located in the gap between adjacent first electrodes and is spaced apart from the first electrode, and the sum of the thicknesses of the first electrode, the light-emitting functional layer, and the second electrode overlapping the edge of the crown portion, and the height of the support portion, is equal to the first distance.

[0056] The present disclosure provides a display panel with an unenclosed space on one side of an isolation structure as a comparative example to illustrate why the first encapsulation layer is prone to encapsulation failure during the preparation of the display panel when the design mentioned in the above embodiment is not adopted, as described below.

[0057] like Figure 5As shown, on the side of the isolation structure 300, the space enclosed by the first encapsulation layer 410a is not closed. It should be noted that the light-emitting devices 200 with different emitted lights are independently manufactured, but the film layer (evaporated film layer such as the light-emitting functional layer, etc.) in each light-emitting device 200 is evaporated on the entire surface of the display panel during evaporation. For example, the light-emitting device 200 is classified into light-emitting devices that emit red light (R), green light (G) and blue light (B), respectively. During the preparation process, the light-emitting devices R, G, and B are prepared in sequence. When preparing the light-emitting device R, a light-emitting device R is formed in each first opening 301. The first encapsulation layer 410a is prepared on the display panel to cover the light-emitting device G. Then, the first encapsulation layer 410a in part of the first opening 301 (used to form the light-emitting devices G and B in the final product) and the second electrode and the light-emitting functional layer of the light-emitting device R are removed. In this process, the first encapsulation layer 410a is used to protect the light-emitting devices R in other first openings 301. Based on this method, the light-emitting devices G and B are prepared in sequence, and finally formed as shown in the figure. Figure 5 The first encapsulation layer 410a shown, that is, the first encapsulation layer 410a on the entire display panel is prepared in multiple processes, that is, the first encapsulation layer 410a formed in the process of preparing the light-emitting device R will be corroded and damaged in the process of preparing the light-emitting devices G and B.

[0058] It should be noted that in the embodiments of the present disclosure, there is no restriction on the preparation order of the three types of light-emitting devices R, G, and B, and it can be designed according to the actual process requirements. For example, the preparation process can also be implemented based on the order of light-emitting devices B, G, and R.

[0059] The preparation process of the display panel can be referred to as follows FIG. 6A to FIG. 6D Related descriptions in the illustrated embodiments.

[0060] like Fig. 6A As shown, a substrate 100 is provided and an array-arranged first electrode 210 is formed on the substrate 100; an insulating material film layer (e.g., an inorganic material film layer) is deposited on the substrate 100 on which the first electrode 210 is formed; a support portion 310 and a crown portion 320 are formed on the display panel; and a composition process is performed on the insulating material film layer to form a pixel defining layer 330 (the plane shape is a grid shape), and the pixel defining layer 330 covers the gaps between adjacent first electrodes 210, so that the plane shape of the pixel defining layer 330 is a grid shape.

[0061] In an embodiment of the present disclosure, the patterning process may be a photolithography patterning process, which may include, for example, coating a photoresist on a structure layer to be patterned, exposing the photoresist using a mask, developing the exposed photoresist to obtain a photoresist pattern, etching the structure layer using the photoresist pattern (optionally wet etching or dry etching), and then optionally removing the photoresist pattern. It should be noted that, in the case where the material of the structure layer (such as the photoresist pattern 500 described below) includes photoresist, the structure layer may be directly exposed through a mask to form a desired pattern.

[0062] like Figure 6B As shown, the light-emitting functional layer 220 and the second electrode 230 are evaporated on the substrate 100 to form a light-emitting device 200 in each first opening 301 of the isolation structure 300. No mask is used in the evaporation in the process, so the evaporated material is also deposited on the crown 320; then the first encapsulation layer 410a is deposited to cover the light-emitting device 200. For example, the light-emitting layer in the evaporated light-emitting functional layer 220 can emit red light, that is, at this stage, a light-emitting device 200 emitting red light is formed in each first opening 301 of the isolation structure 300.

[0063] like Figure 6C As shown, a photoresist is formed (eg, coated) on the substrate 100 formed with the first encapsulation layer 410 a , and then patterned to form a photoresist pattern 500 , which only covers a portion of the first opening 301 of the isolation structure 300 .

[0064] like Fig.6D As shown, the surface of the display panel is etched using the photoresist pattern 500 as a mask to remove the first encapsulation layer 410a, the second electrode 230 and the light-emitting functional layer 220 that are not covered by the photoresist pattern 500; and then the remaining photoresist pattern 500 is removed.

[0065] In this process, a corrosive liquid (or an etching gas) is used to remove the remaining photoresist pattern 500 , and the corrosive liquid may enter the space at the side wall of the support portion 310 to damage the first encapsulation layer 410 a .

[0066] Repeat the above FIG. 6A to FIG. 6D The steps are as follows, so as to form a light emitting device 200 emitting green light and a light emitting device 200 emitting blue light in the other first openings 301, and form Figure 5 The display panel shown.

[0067] In the process of forming the light-emitting device 200 that emits green light and the light-emitting device 200 that emits blue light, two steps are performed again to form the photoresist pattern 500 and remove the remaining photoresist pattern 500. The corrosive liquid (or etching gas) used twice will enter the space at the side wall of the support part 310 (the space in the first opening 301 corresponding to the light-emitting device 200 that emits green light) again to cause multiple damages to the first encapsulation layer 410a.

[0068] In the embodiments of the present disclosure, Figure 3 and Figure 4 As shown, when executing Figure 6B In the step shown, the space has been sealed by the first packaging layer 410 , thereby preventing the corrosive liquid (or etching gas) from entering the space 401 .

[0069] It should be noted that in the edge area of ​​the light-emitting device, the thickness of the film layer included in the light-emitting device is relatively small. Therefore, when calculating the first distance in the actual process, the thickness of the light-emitting device can be directly ignored, and the thickness of the supporting part (the thickness of the supporting part) can be directly used as the first distance. The specific analysis is as follows.

[0070] like Figure 7 As shown, when evaporating the light-emitting functional layer (for example, the first functional layer), if the evaporation source P moves to face the isolation structure 300, the boundary of the evaporation angle corresponds to the line L1 and the line L2 on the display panel, that is, the area before the line L1 and the line L2 will not be evaporated in this case, while the area on the side of the line L1 and the line L2 away from the isolation structure 300 will be evaporated no matter where the evaporation source P moves. That is, starting from the line L1 or the line L2 area, the closer to the isolation structure 300, the smaller the thickness of the light-emitting functional layer.

[0071] In at least one embodiment of the present disclosure, Figure 8 As shown, the substrate 100 may include a substrate and a driving circuit layer located on the substrate, the driving circuit layer includes a plurality of pixel driving circuits located in the display area, and the display function layer is located on the driving circuit layer. For example, the pixel driving circuit may include a plurality of transistors TFT, capacitors, etc., for example, formed in various forms such as 2T1C (i.e., 2 transistors (TFT) and 1 capacitor (C)), 3T1C or 7T1C. The pixel driving circuit is connected to the light emitting device 200 to control the switching state and the light emitting brightness of the light emitting device 200.

[0072] In at least one embodiment of the present disclosure, Figure 8As shown, the display panel may further include a second encapsulation layer 420 and a third encapsulation layer 430 covering the first encapsulation layer 410, the second encapsulation layer 420 being located between the first encapsulation layer 410 and the third encapsulation layer 430, the first encapsulation layer 410 and the third encapsulation layer 430 being inorganic layers, the inorganic layers having high density to isolate water and oxygen, the second encapsulation layer 420 being an organic layer, and thus having a greater thickness to flatten the surface of the display panel.

[0073] At least one embodiment of the present disclosure provides a display device, which may be the display panel in the above embodiment. For example, the display device may include a touch structure, an optical film (such as a microlens, a polarizer), a cover plate, etc., which are arranged on the light-emitting side of the display panel.

[0074] For example, the display device may be any product or component having a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, or the like.

[0075] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, etc. made within the spirit and principles of this specification should be included in the protection scope of this specification.

Claims

1. A display panel, characterized in that: include: A substrate and a plurality of light emitting devices located on the substrate; an isolation structure, located on the substrate and having a plurality of first openings respectively defining the light-emitting devices, wherein the isolation structure comprises a support portion and a crown portion located on a side of the support portion away from the substrate, and an orthographic projection of the support portion on the substrate is located within an orthographic projection of the crown portion on the substrate; and a first encapsulation layer, located on a side of the isolation structure and the light-emitting device away from the substrate, and covering the isolation structure and the light-emitting device; Wherein, in each of the first openings and at the edge of the crown, a portion of the first encapsulation layer covering the crown is closed to a portion covering the light-emitting device.

2. The display panel according to claim 1, characterized in that: The first encapsulation layer includes a first portion, the first portion is located on a side of the crown portion facing away from the base, the first portion has a first thickness, and At the edge of the crown, a distance from an edge of a surface of the crown facing the substrate to a surface of the light-emitting device facing away from the substrate is a first distance, and a ratio of the first thickness to the first distance is not less than 1.

3. The display panel according to claim 2, characterized in that: The light emitting device comprises a first electrode, a light emitting functional layer and a second electrode which are sequentially stacked on the substrate. The light-emitting functional layer and the second electrode of each light-emitting device are located in the corresponding first opening, and the orthographic projection of the edge of the crown on the substrate is located within the orthographic projection of the light-emitting functional layer and the second electrode on the substrate.

4. The display panel according to claim 3, characterized in that: The support portion of the isolation structure is located in a gap between adjacent first electrodes and is spaced apart from the first electrodes, and a difference between the sum of the thicknesses of the first electrode, the light-emitting functional layer, and a portion of the second electrode overlapping an edge of the crown portion and the height of the support portion is equal to the first distance; or The display panel also includes a pixel defining layer located between the substrate and the isolation structure, the pixel defining layer defines a plurality of second openings corresponding to the first openings respectively, the orthographic projections of the second openings on the substrate are located within the orthographic projections of the corresponding first openings on the substrate, the light-emitting functional layer and the second electrode fill the second openings and extend to a surface of the pixel defining layer that is away from the substrate, and the difference between the sum of the thicknesses of the light-emitting functional layer and the second electrode that overlap with the pixel defining layer and the height of the supporting portion is equal to the first distance.

5. The display panel according to claim 3, characterized in that: The support portion and the crown portion are an integrated structure, the isolation structure is a conductive structure, and the second electrode of the light emitting device is connected to the support portion.

6. The display panel according to claim 3, characterized in that: The support portion is a conductive structure, and the second electrode of the light emitting device is connected to the support portion.

7. The display panel according to any one of claims 2 to 6, characterized in that: A ratio of the first thickness to the first distance is not less than 1.1, and a width of a contact interface between a portion of the first encapsulation layer covering the crown and a portion of the first encapsulation layer covering the light-emitting device is greater than zero.

8. The display panel according to claim 7, characterized in that: A ratio of the first thickness to the first distance is not less than 1.4, and a width of a contact interface between a portion of the first encapsulation layer covering the crown and a portion of the first encapsulation layer covering the light-emitting device is not less than 3000 angstroms.

9. The display panel according to claim 8, characterized in that: A ratio of the first thickness to the first distance is 1.4-2.4, and a width of a contact interface between a portion of the first encapsulation layer covering the crown and a portion of the first encapsulation layer covering the light-emitting device is 3000-8000 angstroms.

10. A display device, characterized in that: A display panel comprising any one of claims 1 to 9.

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