A soldering wire processing and forming device and a forming method

Abstract

The present invention relates to the technical field of solder wire processing, and particularly relates to a solder wire processing and forming device and a forming method. The method includes: obtaining the actual temperature of each area of the heating plate during the solder wire processing; judging whether to adjust the heating temperature of the heating plate according to the difference between the actual temperature of each area of the heating plate and the preset optimal fusion temperature; if adjustment is needed, combining the difference between the actual temperature and the preset optimal fusion temperature and the heating temperature to obtain the temperature to be adjusted and make the adjustment; comprehensively obtaining the overall uniform value of the tin liquid temperature by considering the temperature distribution of each image block in the infrared image on the surface of the tin liquid, the dispersion of the actual temperatures of different areas of the heating plate, and the overall difference between the temperature distribution of the tin liquid at the bottom of the tin box and the temperature distribution of the tin liquid at the top of the tin box, and then judging whether the temperature meets the requirements. If not, continue to adjust the heating temperature of the heating plate. The present invention realizes the intelligent adjustment of the tin liquid temperature during the solder wire processing, and improves the processing quality of the solder wire.

Description

Technical Field

[0001] The present invention relates to the technical field of solder wire processing, and specifically relates to a solder wire processing and forming device and a forming method. Background Art

[0002] Solder wire is a hardware material used for electronic soldering, mainly composed of tin alloy and additives. It has a wide range of applications in the fields of electronic manufacturing, home appliance repair, and automobile manufacturing. Solder wire is usually used for soldering electronic components, such as resistors, capacitors, integrated circuits, etc., and can effectively achieve non-destructive connection between components, ensuring the stability and performance of the equipment.

[0003] The existing utility model patent with the publication number of CN217991218U provides a molten tin furnace structure for solder wire, which is used for the preparation of molten tin, so that the molten tin flows into the casting groove; however, this device has the following problems: the heating of the molten tin by the heating tube is affected by the position, and the temperatures of the molten tin at different positions and different heights are inconsistent, resulting in a large difference in the temperature of the molten tin used for casting, so that the quality of the obtained solder wire is poor, reducing the strength and toughness of the solder wire and causing deformation. Summary of the Invention

[0004] In order to solve the problem that the existing molten tin furnace structure for solder wire has inconsistent temperatures at different positions during the processing and forming of solder wire, which affects the quality of the formed solder wire, the purpose of the present invention is to provide a solder wire processing and forming device and a forming method, and the specific technical solutions adopted are as follows:

[0005] In the first aspect, the present invention provides a solder wire processing and forming method, which includes the following steps:

[0006] Obtain the heating temperature of the heating plate and the actual temperature of each area during the solder wire processing;

[0007] Judge whether to adjust the heating temperature of the heating plate according to the difference between the actual temperature of each area of the heating plate and the preset optimal fusion temperature; if adjustment is required, combine the difference between the actual temperature of each area of the heating plate and the preset optimal fusion temperature and the heating temperature to obtain the temperature to be adjusted of the heating plate and adjust it;

[0008] Obtain the infrared image of the surface of the molten tin, and obtain the tin liquid temperature consistency index of each image block based on the temperature distribution of each image block in the infrared image; comprehensively consider the dispersion of the actual temperatures of different areas of the heating plate, the overall difference between the temperature distribution of the molten tin at the bottom of the tin box and the temperature distribution of the molten tin at the top of the tin box, and the tin liquid temperature consistency index to obtain the overall uniformity value of the tin liquid temperature;

[0009] Use the overall uniformity value of the tin liquid temperature to judge whether the temperature meets the requirements. If not, continue to adjust the heating temperature of the heating plate.

[0010] Preferably, judging whether the temperature meets the requirements by using the overall uniformity value of the tin bath temperature includes:

[0011] If the overall uniformity value of the tin bath temperature is greater than a preset consistency threshold, it is determined that the temperature meets the requirements;

[0012] If the overall uniformity value of the tin bath temperature is less than or equal to the preset consistency threshold, it is determined that the temperature does not meet the requirements.

[0013] Preferably, judging whether to adjust the heating temperature of the heating plate according to the difference between the actual temperature of each area of the heating plate and the preset optimal fusion temperature includes:

[0014] Calculate the difference between the actual temperature of the candidate area and the preset optimal fusion temperature; determine the ratio of the absolute value of the difference to the preset optimal fusion temperature as the difference factor of the candidate area; the candidate area is any area of the heating plate;

[0015] If the difference factors of all areas of the heating plate are less than the preset difference threshold, the heating temperature of the candidate area is not adjusted; otherwise, the heating temperature of the heating plate is adjusted.

[0016] Preferably, combining the difference between the actual temperature of each area of the heating plate and the preset optimal fusion temperature and the heating temperature to obtain the temperature to be adjusted of the heating plate includes:

[0017] Calculate the product of the preset temperature adjustment factor and the difference, and determine the difference between the heating temperature of the heating plate and the product as the temperature to be adjusted of the heating plate.

[0018] Preferably, obtaining the tin bath temperature consistency index of each image block based on the temperature distribution of each image block in the infrared image includes:

[0019] Perform curve fitting on the temperature values of all pixel points in the image block to be analyzed to obtain a fitting curve, where the abscissa of the fitting curve is the order of the pixel points and the ordinate is the temperature value; take the area enclosed by the curve segment within the neighborhood of the maximum value of the fitting curve and the horizontal axis as the tin bath temperature consistency index of the image block to be analyzed;

[0020] The image block to be analyzed is any image block in the infrared image.

[0021] Preferably, obtaining the overall uniformity value of the tin bath temperature by comprehensively considering the dispersion of the actual temperatures of different areas of the heating plate, the overall difference between the tin bath temperature distribution at the bottom of the tin box and the tin bath temperature distribution at the top of the tin box, and the tin bath temperature consistency index includes:

[0022] Count the number of pixel points corresponding to each temperature value in each image block of the infrared image, and take the temperature value corresponding to the maximum value of the number as the target temperature value of the corresponding image block;

[0023] According to the overall temperature distribution difference of the pixel points in all every two image blocks in the infrared image, the sum value of the tin liquid temperature consistency indexes of every two image blocks, and the difference between the target temperature values of every two image blocks, obtain a temperature similarity index. Both the overall temperature distribution difference and the difference between the target temperature values of the two image blocks are negatively correlated with the temperature similarity index, and the sum value is positively correlated with the temperature similarity index;

[0024] According to the overall difference between the tin liquid temperature distribution at the bottom of the tin box and the tin liquid temperature distribution at the top of the tin box, the dispersion degree of the actual temperatures in different areas of the heating plate, and the temperature similarity index, obtain an overall uniformity value of the tin liquid temperature. Both the overall difference and the dispersion degree are negatively correlated with the overall uniformity value of the tin liquid temperature, and the temperature similarity index is positively correlated with the overall uniformity value of the tin liquid temperature.

[0025] Preferably, the obtaining of the overall temperature distribution difference of the pixel points in every two image blocks includes:

[0026] Take the DTW distance between the temperature sequences corresponding to the two image blocks as the overall temperature distribution difference of the pixel points in the two image blocks, and the temperature sequence is composed of the temperature values of all pixel points in the image block.

[0027] Preferably, before continuing to adjust the heating temperature of the heating plate, it further includes:

[0028] Stir the tin liquid and let it stand for a preset time;

[0029] Obtain a new infrared image of the tin liquid surface, and obtain a new tin liquid temperature consistency index between every two image blocks based on the temperature distribution of every two image blocks in the new infrared image; obtain the new actual temperature of each area of the heating plate; comprehensively consider the dispersion of the new actual temperatures in different areas of the heating plate, the overall difference between the tin liquid temperature distribution at the bottom of the tin box and the tin liquid temperature distribution at the top of the tin box, and the new tin liquid temperature consistency index, and obtain a new overall uniformity value of the tin liquid temperature;

[0030] If the new overall uniformity value of the tin liquid temperature is greater than a preset consistency threshold, it is determined that the temperature meets the requirements;

[0031] If the new overall uniformity value of the tin liquid temperature is less than or equal to the preset consistency threshold, it is determined that the temperature does not meet the requirements.

[0032] Preferably, the obtaining of the stirring frequency when stirring the tin liquid includes:

[0033] Take the difference between the constant 1 and the overall uniform value of the new tin liquid temperature as the adjustment coefficient, and determine the stirring frequency as the product of the adjustment coefficient and the preset maximum stirring frequency of the tin liquid.

[0034] In a second aspect, the present invention provides a device for processing and forming solder wire, which includes a heating plate, a stirring component, a thermal imager, a temperature acquisition module, and a control center. The heating plate is used to heat the tin liquid, the stirring component is used to stir the tin liquid, the thermal imager is used to collect the infrared image of the surface of the tin liquid, the temperature acquisition module is used to collect the actual temperature of each area of the heating plate (120) during the processing of the solder wire, and the control center is used to convert the calculated result into an instruction and make corresponding adjustments.

[0035] The present invention has at least the following beneficial effects:

[0036] The present invention first collects the actual temperature of each area of the heating plate during the processing of the solder wire. Since there is a certain difference between the heating temperature and the actual temperature during the heating of the tin liquid, and there are also certain differences between the actual temperatures of different areas, the unevenness of the tin liquid temperature affects the forming of the solder wire and the quality of the solder wire during the casting process. Therefore, the present invention first determines whether it is necessary to adjust the heating temperature of the heating plate according to the difference between the actual temperature of each area of the heating plate and the preset optimal fusion temperature. If adjustment is needed, the temperature to be adjusted is obtained and adjusted by combining the difference between the actual temperature of each area of the heating plate and the preset optimal fusion temperature and the heating temperature; based on the temperature distribution of every two image blocks in the infrared image of the surface of the tin liquid, the discrete situation of the actual temperatures of different areas of the heating plate, and the overall difference between the temperature distribution of the tin liquid at the bottom of the tin box and the temperature distribution of the tin liquid at the top of the tin box, the uniformity of the overall temperature of the tin liquid is evaluated, and the overall uniform value of the tin liquid temperature is obtained. Further, the overall uniform value of the tin liquid temperature is used to judge whether the temperature meets the requirements, that is, whether further adjustment is needed, ensuring the temperature consistency at different positions during the heating process of the tin liquid. The present invention takes into account the uniformity of the tin liquid temperature during the preparation of the tin liquid, prevents problems with the quality of the solder wire caused by uneven tin liquid temperature during preparation, realizes intelligent control of the heating temperature of the tin liquid, and can improve the processing quality of the solder wire. Description of the Drawings

[0037] In order to more clearly illustrate the technical solutions and advantages in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0038] Figure 1Internal mechanical structure diagram of a solder wire processing and forming device provided by an embodiment of the present invention;

[0039] Figure 2 Cross-sectional view of a solder wire processing and forming device provided by an embodiment of the present invention;

[0040] Figure 3 Flow chart of a solder wire processing and forming method provided by an embodiment of the present invention;

[0041] Among them, 120 is a heating plate; 610 is a stirring assembly; 620 is a thermal imager; 630 is a through-hole valve. Detailed implementation manners

[0042] In order to further elaborate on the technical means and effects adopted by the present invention to achieve the intended invention purpose, the following provides a detailed description of a solder wire processing and forming device and a forming method according to the present invention in conjunction with the accompanying drawings and preferred embodiments.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs.

[0044] The following specifically describes the specific solutions of a solder wire processing and forming device and a forming method provided by the present invention in conjunction with the accompanying drawings.

[0045] An embodiment of a solder wire processing and forming device:

[0046] This embodiment proposes a solder wire processing and forming device, as shown in Figure 1 and Figure 2 shown, Figure 1 shows an internal mechanical structure diagram cross-sectional view of a solder wire processing and forming device, Figure 2 shows a cross-sectional view of a solder wire processing and forming device.

[0047] The solder wire processing and forming device proposed in this embodiment is an improvement based on the existing molten tin furnace structure for solder wire (publication number: CN217991218U). The newly added components of the solder wire processing and forming device in this embodiment include: a control center, a heating plate 120, a thermal imager 620, a stirring assembly 610, a through-hole valve 630, and a temperature acquisition module. Among them, the control center realizes the storage of data and the calculation of relevant parameters, and converts the calculated results into instructions to complete the adjustment of relevant aspects such as cylinders, temperature, and stirring; the heating plate 120 is installed at the bottom of the tin bath and is used to heat the tin liquid, and the temperature control of the heating plate 120 is completed through the instructions of the control center; the thermal imager 620 is installed on the top of the tin box and is used to collect the infrared image of the tin liquid; the stirring assembly 610 is installed in the tin box and is used to stir the tin liquid; the through-hole valve 630 is used to control the outflow of the tin liquid to prevent it from entering the diversion plate when not necessary.

[0048] An embodiment of a method for processing and forming solder wire:

[0049] This embodiment proposes a method for processing and forming solder wire. As Figure 3 shown, an embodiment of a method for processing and forming solder wire in this embodiment includes the following steps:

[0050] Step S1, obtain the heating temperature of the heating plate 120 and the actual temperature of each area during the processing of the solder wire.

[0051] First, close the through-hole valve 630, turn on the melting furnace, preheat the device, obtain the metal materials to be prepared, melt the metal raw materials, add these metal materials into the melting furnace according to a certain ratio and order according to the chemical composition of the solder wire to be prepared, set the heating temperature of the metal fusion through the temperature controller, and heat the tin liquid through the heating plate 120, thereby completing the initial operation of the tin liquid preparation device during the solder wire preparation process. It should be noted that: the heating temperature of the metal fusion is set by the implementer according to specific circumstances.

[0052] Due to the large area of the heating plate 120, although a single heating temperature is set for the overall heating process, there are still differences in the actual temperatures at different positions. The actual temperature near the heating element is relatively high first, while the actual temperature at a relatively far position or at the edge of the heating plate 120 is relatively low. Therefore, there are differences in the actual temperatures at different positions. After heating the tin liquid for a certain period of time, the temperature acquisition module acquires the actual temperature of each area of the heating plate 120 during the soldering wire processing. One actual temperature is acquired for each area. In this embodiment, the temperature acquired for each area is the actual temperature at the center point of each area. In this embodiment, the acquisition frequency of the actual temperature is set to once every 10 seconds. As other implementation manners, the position selection and the acquisition frequency of the actual temperature can be determined according to specific situations. The areas of the heating plate 120 are obtained by evenly dividing according to the size of the heating plate 120, that is, the entire heating plate 120 is divided into multiple areas of equal size, and the size of each area is set according to specific situations. The acquired data is stored in the calculation module of the control center, relevant parameters are obtained through the calculation module, and the obtained parameters are transmitted to the instruction module, and the control of components such as the heating plate 120 and the stirring assembly 610 is completed through the instruction module.

[0053] Step S2: Determine whether to adjust the heating temperature of the heating plate according to the difference between the actual temperature of each area of the heating plate 120 and the preset optimal fusion temperature; if adjustment is required, combine the difference between the actual temperature of each area of the heating plate 120 and the preset optimal fusion temperature and the heating temperature to obtain the temperature to be adjusted for the heating plate 120 and make the adjustment.

[0054] Due to the differences in the actual temperatures at different positions of the heating plate 120, the temperatures of the tin liquid at different positions are inconsistent, and the unevenness of the tin liquid temperature affects the formation of the soldering wire and the quality of the soldering wire during the casting process. Therefore, it is necessary to adjust the temperature of the heating plate 120 to ensure that the actual heating temperature of the tin liquid is consistent.

[0055] Next, taking one area of the heating plate 120 as an example for illustration, the method provided in this embodiment can be used to process the gas area of the heating plate 120.

[0056] Denote any area of the heating plate 120 as a candidate area, and calculate the difference between the actual temperature of the candidate area and the preset optimal fusion temperature; determine the ratio of the absolute value of the difference to the preset optimal fusion temperature as the difference factor of the candidate area.

[0057] In this embodiment, a specific calculation formula for the difference factor is given. The difference factor of the candidate area can be expressed as:

[0058]

[0059] where Represents the difference factor of the candidate area, Represents the actual temperature of the candidate area, Represents the preset optimal fusion temperature, Represents the absolute value symbol.

[0060] It is used to characterize the difference between the actual temperature of the candidate area and the preset optimal fusion temperature. The greater this difference, the greater the difference between the temperature distribution difference of the candidate area and the optimal temperature distribution standard, that is, the greater the difference factor of the candidate area.

[0061] By using the above method, the difference factor of each area of the heating plate 120 can be obtained. If the difference factors of all areas of the heating plate 120 are less than the preset difference threshold, the heating temperature of the candidate area is not adjusted; otherwise, the heating temperature of the heating plate 120 is adjusted. In this embodiment, the preset difference threshold is 0.2. In specific applications, the implementer can set it according to the specific situation.

[0062] Next, the temperature to be adjusted of the heating plate 120 will be determined by combining the difference between the actual temperature and the preset optimal fusion temperature of each area of the heating plate 120 and the heating temperature.

[0063] Specifically, calculate the product of the preset temperature adjustment factor and the difference value, and determine the difference between the heating temperature of the heating plate 120 and the product as the temperature to be adjusted of the heating plate 120. The temperature to be adjusted of the heating plate 120 can be expressed as:

[0064]

[0065] Among them, Represents the temperature to be adjusted of the heating plate 120, Represents the heating temperature of the heating plate 120, Represents the actual temperature of the candidate area, Represents the preset optimal fusion temperature, Represents the preset temperature adjustment factor.

[0066] The value of is between 0 and 1. In this embodiment, the preset temperature adjustment factor is 0.5. In specific applications, the implementer can set it according to the specific situation.

[0067] After determining the temperature to be adjusted of the heating plate 120, the control center adjusts it to achieve the adjustment of the heating temperature.

[0068] In step S3, an infrared image of the surface of the tin bath is obtained, and a tin bath temperature consistency index for each image block in the infrared image is obtained based on the temperature distribution of each image block; the overall tin bath temperature uniformity value is obtained by synthesizing the dispersion of the actual temperatures in different regions of the heating plate 120, the overall difference between the tin bath temperature distribution at the bottom of the tin box and the tin bath temperature distribution at the top of the tin box, and the tin bath temperature consistency index.

[0069] Since there is a certain height of the tin bath in the tin box, and the heating of the tin bath is through heat transfer from the bottom of the tin box to the upper layer, there are also differences in the tin bath temperatures at different heights. To ensure the forming effect of the solder wire, it is necessary to ensure that all temperatures in the tin box are consistent.

[0070] The thermal imager 620 acquires an infrared image of the surface of the tin bath. Different colors in the infrared image represent different temperatures, and there is a corresponding temperature value for each pixel point in the infrared image; the infrared image is divided into several image blocks of equal size. In specific applications, the implementer can set the size of each image block according to the specific situation.

[0071] The more concentrated the temperature distribution in the same image block, the stronger the consistency and the higher the uniformity of the tin bath temperature in the area corresponding to the image block. Among different image blocks, the higher the similarity of the temperature distribution between the image blocks, the stronger the consistency of the temperature distribution on the entire tin bath surface.

[0072] Next, an example of an image block in the infrared image is used for illustration. The same method provided in this embodiment can be used to process other image blocks in the infrared image.

[0073] Any image block in the infrared image is denoted as the image block to be analyzed. Curve fitting is performed on the temperature values of all pixel points in the image block to be analyzed to obtain a fitting curve, where the abscissa of the fitting curve is the order of the pixel points, and the ordinate is the temperature value; it should be noted that: in this embodiment, the order of the pixel points is sorted from left to right and from top to bottom. In specific applications, the implementer can also set the order of the pixel points by himself. Curve fitting is a prior art and will not be elaborated here. The area enclosed by the curve segment within the neighborhood range of the maximum value of the fitting curve and the horizontal axis is used as the tin bath temperature consistency index of the image block to be analyzed. The larger the area enclosed by the curve segment within the neighborhood range of the maximum value of the fitting curve and the horizontal axis, the more concentrated the temperature distribution of the pixel points in the image block, that is, the more consistent the temperatures of the tin bath at each position in the image block. In this embodiment, the process of obtaining the neighborhood range of the maximum value of the fitting curve is: taking the maximum value of the fitting curve as the center point, a preset length interval adjacent to the maximum value of the fitting curve and on the left side of the maximum value of the fitting curve and a preset length interval on the right side of the maximum value of the fitting curve are used as the neighborhood range of the maximum value of the fitting curve. In specific applications, the implementer can set the neighborhood range according to the specific situation.

[0074] Count the number of pixel points corresponding to each temperature value in each image block of the infrared image respectively, and take the temperature value corresponding to the maximum value of the number as the target temperature value of the corresponding image block. There is a target temperature value for each image block in the infrared image. It should be noted that if the number of pixel points corresponding to two or more temperature values in a certain image block is equal and both are the maximum value, in this case, the average value of these temperature values is taken as the target temperature value of the pixel block.

[0075] According to the overall temperature distribution difference of the pixel points in every two image blocks in the infrared image, the sum value of the tin liquid temperature consistency indexes of every two image blocks, and the difference between the target temperature values of every two image blocks, obtain the temperature similarity index. Both the overall temperature distribution difference and the difference between the target temperature values of the two image blocks are negatively correlated with the temperature similarity index, and the sum value is positively correlated with the temperature similarity index.

[0076] Among them, the positive correlation relationship means that the dependent variable will increase as the independent variable increases, and the dependent variable will decrease as the independent variable decreases. It can be an additive relationship, a multiplicative relationship, etc., which is determined by the actual application; the negative correlation relationship means that the dependent variable will decrease as the independent variable increases, and the dependent variable will increase as the independent variable decreases. It can be a subtractive relationship, a division relationship, etc., which is determined by the actual application.

[0077] The process of obtaining the overall temperature distribution difference of the pixel points in every two image blocks is as follows: Take the dynamic time warping (DTW) distance between the temperature sequences corresponding to the two image blocks as the overall temperature distribution difference of the pixel points in the two image blocks. The temperature sequence is composed of the temperature values of all pixel points in the image block.

[0078] The process of obtaining the DTW distance between two sequences is a prior art and will not be elaborated here too much.

[0079] In this embodiment, a specific calculation formula for the temperature similarity index is given. The temperature similarity index can be expressed as:

[0080]

[0081] Among them, A represents the temperature similarity index, N represents the number of image blocks in the infrared image, represents the tin liquid temperature consistency index of the i-th image block in the infrared image, represents the tin liquid temperature consistency index of the j-th image block in the infrared image, represents the target temperature value of the i-th image block in the infrared image, represents the target temperature value of the j-th image block in the infrared image, represents the temperature sequence corresponding to the \(i\)-th image block in the infrared image, represents the temperature sequence corresponding to the \(j\)-th image block in the infrared image, represents calculating the DTW distance, represents the DTW distance between the temperature sequence corresponding to the \(i\)-th image block and the temperature sequence corresponding to the \(j\)-th image block in the infrared image, represents the normalization function, represents the preset first adjustment parameter, represents the normalization function, represents the absolute value symbol.

[0082] In this embodiment, a preset first adjustment parameter is introduced into the calculation formula of the temperature similarity index to prevent the denominator from being zero. The preset first adjustment parameter in this embodiment is 0.01. In specific applications, the implementer can set it according to specific situations.

[0083] characterizes the difference between the target temperature values of the \(i\)-th image block and the \(j\)-th image block. The smaller this value is, the smaller the difference between the two is, the closer the concentrated temperatures of the temperature distributions of different image blocks are, and thus the stronger the consistency of the tin bath temperature. The greater the similarity of the tin bath temperature between different positions, the greater the consistency of the overall temperature distribution of the tin bath, that is the greater. When the overall temperature distribution difference of different pixel blocks in the infrared image is smaller, the tin bath temperature consistency index is greater, and the DTW distance between the temperature sequences corresponding to different image blocks is smaller, it indicates that the temperatures at different positions of the tin bath are more similar, that is, the temperature similarity index is greater.

[0084] Regarding the uniformity of the temperature distribution at different heights, if the temperature distributions of the tin bath at different heights in the tin box are consistent, then the temperature at the bottom of the tin bath is the same as the temperature at the top surface. Therefore, the consistency between the bottom and the top is poor, and the temperature difference at the bottom and the temperature difference at the top are large, which indicates that the temperature consistency of the tin bath inside the tin box is worse.

[0085] Therefore, next, according to the overall difference between the tin bath temperature distribution at the bottom of the tin box and the tin bath temperature distribution at the top of the tin box, the dispersion degree of the actual temperatures in different regions of the heating plate 120, and the temperature similarity index, the overall tin bath temperature uniformity value is obtained. Both the overall difference and the dispersion degree are negatively correlated with the overall tin bath temperature uniformity value, and the temperature similarity index is positively correlated with the overall tin bath temperature uniformity value.

[0086] Among them, a positive correlation means that the dependent variable increases as the independent variable increases and decreases as the independent variable decreases. It can be an additive relationship, a multiplicative relationship, etc., which is determined by the actual application. A negative correlation means that the dependent variable decreases as the independent variable increases and increases as the independent variable decreases. It can be a subtractive relationship, a division relationship, etc., which is determined by the actual application.

[0087] The process of obtaining the dispersion degree of the actual temperatures of different regions of the heating plate 120 is as follows: According to the actual temperature of each region of the heating plate 120, calculate the standard deviation of the actual temperatures of all regions of the heating plate 120, and use the normalized result of this standard deviation as the dispersion degree of the actual temperatures of different regions of the heating plate 120. When normalizing the standard deviation, a linear normalization method can be used for processing, which will not be elaborated here.

[0088] In this embodiment, a specific calculation formula for the overall uniformity value of the tin bath temperature is given. The overall uniformity value of the tin bath temperature can be expressed as:

[0089]

[0090] Among them, Q represents the overall uniformity value of the tin bath temperature, A represents the temperature similarity index, B represents the dispersion degree of the actual temperatures of different regions of the heating plate 120, represents the mean value of the tin bath temperature values at all positions on the bottom of the tin box, represents the mean value of the tin bath temperature values at all positions on the top of the tin box, represents a preset second adjustment parameter, represents a normalization function, represents the absolute value symbol, and e is the natural constant.

[0091] In this embodiment, a preset first adjustment parameter is introduced into the calculation formula of the overall uniformity value of the tin bath temperature to prevent the denominator from being 0. The preset first adjustment parameter in this embodiment is 0.01. In specific applications, the implementer can set it according to specific circumstances.

[0092] It is used to characterize the overall difference between the tin bath temperature distribution at the bottom of the tin box and the tin bath temperature distribution at the top of the tin box. The smaller this value is, the smaller the temperature difference between the top and the bottom. When the dispersion degree of the actual temperatures of different regions of the heating plate 120 is smaller, the temperature similarity index is larger, and the overall difference between the tin bath temperature distribution at the bottom of the tin box and the tin bath temperature distribution at the top of the tin box is smaller, it indicates that the consistency of the tin bath temperature in the tin box is stronger, that is, the overall uniformity value of the tin bath temperature is larger.

[0093] So far, the overall uniformity value of the tin bath temperature has been obtained.

[0094] Step S4: Use the overall uniform value of the molten tin temperature to determine whether the temperature meets the requirements. If not, continue to adjust the heating temperature of the heating plate 120.

[0095] The larger the overall uniform value of the molten tin temperature, the better the heating effect of the molten tin. Therefore, if the overall uniform value of the molten tin temperature is greater than the preset consistent threshold, it is determined that the temperature meets the requirements, and at this time, the molten tin is no longer stirred; if the overall uniform value of the molten tin temperature is less than or equal to the preset consistent threshold, it is determined that the temperature does not meet the requirements, and at this time, the molten tin is stirred and left standing for a preset duration. In this embodiment, the stirring duration and the standing duration of the molten tin are both 1 minute. In specific applications, the implementer can set them according to specific circumstances. The preset consistent threshold in this embodiment is 0.9. In specific applications, the implementer can set it according to specific circumstances.

[0096] Among them, the process of obtaining the stirring frequency of the stirring component 610 when stirring the molten tin is as follows: Take the difference between the constant 1 and the new overall consistent value of the molten tin temperature as the adjustment coefficient, and determine the product of the adjustment coefficient and the preset maximum stirring frequency of the molten tin as the stirring frequency.

[0097] Use the thermal imager 620 to collect a new infrared image on the surface of the molten tin after stirring and standing for a preset duration. Obtain a new molten tin temperature consistency index between every two image blocks based on the temperature distribution of every two image blocks in the new infrared image; obtain the new actual temperature of each area of the heating plate 120; Integrate the discreteness of the new actual temperatures of different areas of the heating plate 120, the overall difference between the temperature distribution of the molten tin at the bottom of the tin box and the temperature distribution of the molten tin at the top of the tin box, and the new molten tin temperature consistency index to obtain the new overall uniform value of the molten tin temperature. It should be noted that: The method for obtaining the new overall uniform value of the molten tin temperature is the same as the method for obtaining the overall uniform value of the molten tin temperature in step S3, except that the corresponding temperature values are replaced. Therefore, the process of obtaining the new overall uniform value of the molten tin temperature will not be elaborated here too much.

[0098] If the new overall consistent value of the molten tin temperature is greater than the preset consistent threshold, it is determined that the temperature meets the requirements; if the new overall consistent value of the molten tin temperature is less than or equal to the preset consistent threshold, it is determined that the temperature does not meet the requirements, recalculate the temperature to be adjusted of the heating plate 120, and adjust it to complete the subsequent processing technology.

[0099] After the prepared molten tin meets the requirements, open the through-hole valve so that the prepared molten tin enters the flow guide plate through the through-hole. Adjust the height of the flow guide plate through the cylinder so that the flow rate of the molten tin at the tin outlet is appropriate. After pouring is completed, close the through-hole valve 630 and transmit this signal to the damping shaft so that the collection box moves forward, and the excess molten tin enters the interior of the collection box. Open the through-hole valve 630 when the pouring of the next solder wire is required.

[0100] So far, the method provided by this embodiment has realized the adjustment of the temperature during the processing and forming of the solder wire, and completed the processing of the solder wire.

[0101] In this embodiment, the actual temperature of each area of the heating plate 120 during the processing of the solder wire is first collected. Since there is a certain difference between the heating temperature and the actual temperature during the heating of the tin liquid, and there are also certain differences between the actual temperatures of different areas, the unevenness of the tin liquid temperature affects the forming of the solder wire and the quality of the solder wire during the casting process. Therefore, in this embodiment, it is first determined whether it is necessary to adjust the heating temperature of the heating plate 120 according to the difference between the actual temperature of each area of the heating plate 120 and the preset optimal fusion temperature. If adjustment is needed, the temperature to be adjusted is obtained and adjusted by combining the difference between the actual temperature of each area of the heating plate 120 and the preset optimal fusion temperature and the heating temperature; based on the temperature distribution of every two image blocks in the infrared image on the surface of the tin liquid, the discrete situation of the actual temperatures of different areas of the heating plate 120, and the overall difference between the temperature distribution of the tin liquid at the bottom of the tin box and the temperature distribution of the tin liquid at the top of the tin box, the uniformity of the overall temperature of the tin liquid is evaluated, and the overall uniform value of the tin liquid temperature is obtained. Further, the overall uniform value of the tin liquid temperature is used to judge whether the temperature meets the requirements, that is, whether further adjustment is needed, ensuring the temperature consistency at different positions during the heating of the tin liquid. This embodiment considers the uniformity of the tin liquid temperature during the preparation of the tin liquid, prevents problems with the quality of the solder wire caused by uneven tin liquid temperature during preparation, realizes the intelligent control of the heating temperature of the tin liquid, and can improve the processing quality of the solder wire.

[0102] It should be noted that the above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for processing and forming solder wire, characterized in that, The method includes the following steps: Obtain the heating temperature of the heating plate and the actual temperature of each area during the solder wire processing; Judge whether to adjust the heating temperature of the heating plate according to the difference between the actual temperature of each area of the heating plate and the preset optimal fusion temperature; if adjustment is needed, combine the difference between the actual temperature of each area of the heating plate and the preset optimal fusion temperature and the heating temperature to obtain the temperature to be adjusted of the heating plate and make the adjustment; Obtain the infrared image of the surface of the molten tin, and obtain the molten tin temperature consistency index of each image block based on the temperature distribution of each image block in the infrared image; comprehensively consider the discreteness of the actual temperatures of different areas of the heating plate, the overall difference between the molten tin temperature distribution at the bottom of the tin box and the molten tin temperature distribution at the top of the tin box, and the molten tin temperature consistency index to obtain the overall uniformity value of the molten tin temperature; Use the overall uniformity value of the molten tin temperature to judge whether the temperature meets the requirements. If not, continue to adjust the heating temperature of the heating plate; The obtaining of the molten tin temperature consistency index of each image block based on the temperature distribution of each image block in the infrared image includes: Perform curve fitting on the temperature values of all pixel points in the image block to be analyzed to obtain a fitting curve, where the abscissa of the fitting curve is the order of the pixel points and the ordinate is the temperature value; take the area enclosed by the curve segment within the neighborhood of the maximum value of the fitting curve and the horizontal axis as the molten tin temperature consistency index of the image block to be analyzed; The image block to be analyzed is any image block in the infrared image.

2. A method for processing and forming solder wire according to claim 1, characterized in that, Using the overall uniformity value of the molten tin temperature to judge whether the temperature meets the requirements includes: If the overall uniformity value of the molten tin temperature is greater than the preset consistency threshold, it is determined that the temperature meets the requirements; If the overall uniformity value of the molten tin temperature is less than or equal to the preset consistency threshold, it is determined that the temperature does not meet the requirements.

3. A method for processing and forming a solder wire according to claim 1, wherein The judging whether to adjust the heating temperature of the heating plate according to the difference between the actual temperature of each area of the heating plate and the preset optimal fusion temperature includes: Calculate the difference between the actual temperature of the candidate area and the preset optimal fusion temperature; determine the ratio of the absolute value of the difference to the preset optimal fusion temperature as the difference factor of the candidate area; the candidate area is any area of the heating plate; If the difference factors of all areas of the heating plate are less than the preset difference threshold, do not adjust the heating temperature of the candidate area; otherwise, adjust the heating temperature of the heating plate.

4. A method for processing and forming a soldering wire according to claim 3, characterized in that, Combining the difference between the actual temperature of each area of the heating plate and the preset optimal fusion temperature and the heating temperature to obtain the temperature to be adjusted of the heating plate includes: Calculate the product of the preset temperature adjustment factor and the difference, and determine the difference between the heating temperature of the heating plate and the product as the temperature to be adjusted of the heating plate.

5. A method for processing and forming a solder wire according to claim 1, characterized in that, The comprehensively considering the discreteness of the actual temperatures of different areas of the heating plate, the overall difference between the molten tin temperature distribution at the bottom of the tin box and the molten tin temperature distribution at the top of the tin box, and the molten tin temperature consistency index to obtain the overall uniformity value of the molten tin temperature includes: Count the number of pixel points corresponding to each temperature value in each image block in the infrared image, and take the temperature value corresponding to the maximum value of the number as the target temperature value of the corresponding image block; A temperature similarity index is obtained based on the overall temperature distribution difference of pixel points within every two image blocks in the infrared image, the sum value of the tin bath temperature consistency indexes of every two image blocks, and the difference between the target temperature values of every two image blocks. Both the overall temperature distribution difference and the difference between the target temperature values of the two image blocks are negatively correlated with the temperature similarity index, and the sum value is positively correlated with the temperature similarity index. An overall tin bath temperature uniformity value is obtained based on the overall difference between the tin bath temperature distribution at the bottom of the tin box and that at the top of the tin box, the dispersion degree of the actual temperatures in different regions of the heating plate, and the temperature similarity index. Both the overall difference and the dispersion degree are negatively correlated with the overall tin bath temperature uniformity value, and the temperature similarity index is positively correlated with the overall tin bath temperature uniformity value.

6. A method for processing and forming a soldering wire according to claim 5, characterized in that, The obtaining of the overall temperature distribution difference of pixel points within every two image blocks includes: Taking the DTW distance between the temperature sequences corresponding to the two image blocks as the overall temperature distribution difference of pixel points within the two image blocks, where the temperature sequence is composed of the temperature values of all pixel points within the image block.

7. A method for processing and forming a solder wire according to claim 1, characterized in that, Before continuing to adjust the heating temperature of the heating plate, it further includes: Stirring the tin bath and allowing it to stand for a preset duration. Obtaining a new infrared image of the tin bath surface, obtaining a new tin bath temperature consistency index between every two image blocks based on the temperature distribution of every two image blocks in the new infrared image; obtaining the new actual temperature of each region of the heating plate; comprehensively considering the dispersion of the new actual temperatures in different regions of the heating plate, the overall difference between the tin bath temperature distribution at the bottom of the tin box and that at the top of the tin box, and the new tin bath temperature consistency index to obtain a new overall tin bath temperature uniformity value. If the new overall tin bath temperature uniformity value is greater than a preset consistency threshold, it is determined that the temperature meets the requirements. If the new overall tin bath temperature uniformity value is less than or equal to the preset consistency threshold, it is determined that the temperature does not meet the requirements.

8. A method for processing and forming a soldering wire according to claim 7, characterized in that, The obtaining of the stirring frequency during the stirring of the tin bath includes: Taking the difference between the constant 1 and the new overall tin bath temperature uniformity value as the adjustment coefficient, and determining the product of the adjustment coefficient and the preset maximum tin bath stirring frequency as the stirring frequency.

9. A soldering wire processing and forming device, which is used to implement the method described in claim 1, characterized in that, The device includes a heating plate (120), a stirring component (610), a thermal imager (620), a temperature acquisition module, and a control center. The heating plate (120) is used to heat the tin bath, the stirring component (610) is used to stir the tin bath, the thermal imager (620) is used to collect the infrared image of the tin bath surface, the temperature acquisition module is used to collect the actual temperature of each region of the heating plate (120) during the soldering wire processing, and the control center is used to convert the calculated result into an instruction and make corresponding adjustments.

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