High-strength carrier tape and manufacturing method thereof

Abstract

The invention discloses a high-strength carrier tape and a manufacturing method thereof.The high-strength carrier tape comprises a base layer, an upper surface layer and a lower surface layer, the upper end face and the lower end face of the base layer are each coated with an adhesive layer, the upper surface layer and the lower surface layer are fixedly connected to the top end and the bottom end of the base layer through the adhesive layers respectively, the upper surface layer is a high-strength polystyrene layer, and the lower surface layer is a high-strength polystyrene layer. The upper surface layer is a base layer, the lower surface layer is a copper foil layer, the surface of one end, facing the base layer, of the copper foil layer is coated with a thermosetting resin layer, the base layer is an anti-static PC layer, and the weight ratio of the upper surface layer to the base layer to the lower surface layer is 2: 5: 3. The thermosetting resin layer is arranged between the copper foil and the adhesive layer, the bonding performance of the copper foil and the base layer is improved, the overall structural strength is high, the anti-static performance is good, the production process is simple and easy to achieve, and the cost is low.

Description

Technical Field

[0001] The invention relates to the technical field of carrier tapes, in particular to a high-strength carrier tape and a manufacturing method thereof. Background Art

[0002] SMD: It is the abbreviation of Surface Mounted Devices, which means: Surface Mount Device, which is a type of SMT (Surface Mount Technology) components. Carrier Tape refers to a strip product used in the field of electronic packaging. It has a specific thickness, and holes (also known as pockets) for holding electronic components and positioning holes for index positioning are evenly distributed along its length. At present, the carrier tapes of the existing technology often have poor anti-static effects, and often have problems such as insufficient strength and easy breakage and tearing. Summary of the invention

[0003] The object of the present invention is to provide a high-strength carrier tape and a method for manufacturing the same, so as to solve the problems raised in the above-mentioned background technology.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] A high-strength carrier tape comprises a base layer, an upper surface layer and a lower surface layer, wherein both upper and lower end surfaces of the base layer are coated with an adhesive layer, and the upper surface layer and the lower surface layer are respectively fixedly connected to the top and bottom ends of the base layer by the adhesive layers, the upper surface layer is a high-strength polystyrene layer, and the lower surface layer is a copper foil layer, and the surface of the copper foil layer at one end facing the base layer is coated with a thermosetting resin layer.

[0006] As a further solution of the present invention: the base layer is an antistatic PC layer.

[0007] As a further solution of the present invention: the weight ratio of the upper surface layer, the base layer and the lower surface layer is 2:5:3.

[0008] As a further solution of the present invention: the adhesive layer is any one of thermoplastic polyester adhesive, rubber modified epoxy adhesive and polyurethane adhesive.

[0009] As a further solution of the present invention: the thermosetting resin layer comprises the following components by weight percentage: 40-50% epoxy resin, 10-20% silicone resin, 5-10% phenolic resin, and 30-35% polyimide.

[0010] As a further solution of the present invention: the high-strength polystyrene layer comprises the following components by weight percentage: 50-60% polystyrene, 10-20% polyethylene, 10-20% polyolefin, 9-18% antioxidant, and 1-2% antistatic dispersant.

[0011] As a further solution of the present invention: the antistatic dispersant comprises the following components by weight percentage: 40-50% carbon nanotubes, 5-10% polyacrylamide, 5-10% sodium dodecyl sulfate, and the rest is water.

[0012] A method for manufacturing a high-strength carrier tape comprises the following steps:

[0013] S1, adding carbon nanotubes and an appropriate amount of organic solvent into a ball mill, grinding them thoroughly to obtain carbon nanotube slurry, adding the carbon nanotube slurry, polyacrylamide, and sodium dodecyl sulfate into an ultrasonic disperser, and ultrasonically dispersing for 15-20 minutes to obtain an antistatic dispersant;

[0014] S2, adding antistatic dispersant, script laundry, polyethylene, polyolefin, and antioxidant into a mixer, stirring at a speed of 300-500r / min for 30-60min, adding the mixture into a twin-screw extruder after mixing, and extruding into a molding die to obtain an upper surface carrier material;

[0015] S3, adding epoxy resin, silicone resin, phenolic resin and polyimide into a mixer, stirring for 20-40 minutes at a speed of 120-150 r / min to obtain a thermosetting resin, and coating the thermosetting resin on the surface of the copper foil to obtain a lower surface carrier material;

[0016] S4. Coat the upper and lower ends of the antistatic PC layer with adhesive layers respectively, and place them in a laminator for hot pressing in the order of upper surface layer, antistatic PC layer, and lower surface layer from top to bottom, and then bake at 160-200°C for 30-120 minutes for curing to obtain a finished carrier tape.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] By adopting antistatic PC as the base layer, the antistatic performance is enhanced, and an antistatic dispersant is added to the upper surface layer to further improve the overall antistatic ability of the carrier tape. A thermosetting resin layer is arranged between the copper foil and the adhesive layer to improve the bonding performance of the copper foil and the base layer. The overall structure of the present invention has high strength and good antistatic performance, and the production process is simple, easy to implement, and low cost. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] Embodiment 1:

[0021] A high-strength carrier tape comprises a base layer, an upper surface layer and a lower surface layer, wherein both upper and lower end surfaces of the base layer are coated with an adhesive layer, wherein the upper surface layer and the lower surface layer are respectively fixedly connected to the top and bottom ends of the base layer by the adhesive layers, wherein the upper surface layer is a high-strength polystyrene layer, and the lower surface layer is a copper foil layer, wherein the surface of one end of the copper foil layer facing the base layer is coated with a thermosetting resin layer, wherein the carrier tape using the copper foil layer is suitable for situations where high requirements are placed on conductivity and hardness and the carrier tape depth is less than 0.5 mm, and for requirements where the depth is greater than 0.5 mm, a high-strength polystyrene layer may also be used for the carrier tape lower surface layer.

[0022] The base layer is an antistatic PC layer.

[0023] The weight ratio of the upper surface layer, the base layer and the lower surface layer is 2:5:3.

[0024] The adhesive layer is any one of thermoplastic polyester adhesive, rubber modified epoxy adhesive and polyurethane adhesive.

[0025] The thermosetting resin layer includes the following components by weight: 40% epoxy resin, 20% silicone resin, 10% phenolic resin, and 30% polyimide.

[0026] The high-strength polystyrene layer comprises the following components by weight percentage: 50% polystyrene, 20% polyethylene, 20% polyolefin, 9% antioxidant, and 1% antistatic dispersant.

[0027] The antistatic dispersant comprises the following components by weight percentage: 40% of carbon nanotubes, 10% of polyacrylamide, 10% of sodium dodecyl sulfate, and the rest is water.

[0028] A method for manufacturing a high-strength carrier tape comprises the following steps:

[0029] S1, adding carbon nanotubes and an appropriate amount of organic solvent into a ball mill, grinding them thoroughly to obtain carbon nanotube slurry, adding the carbon nanotube slurry, polyacrylamide, and sodium dodecyl sulfate into an ultrasonic disperser, and ultrasonically dispersing for 15 minutes to obtain an antistatic dispersant;

[0030] S2, adding antistatic dispersant, script laundry, polyethylene, polyolefin, and antioxidant into a mixer, stirring at a speed of 300r / min for 60min, adding the mixed mixture into a twin-screw extruder, and extruding into a molding die to obtain an upper surface carrier material;

[0031] S3, adding epoxy resin, silicone resin, phenolic resin and polyimide into a mixer, stirring for 40 minutes at a speed of 120 r / min to obtain a thermosetting resin, and coating the thermosetting resin on the surface of the copper foil to obtain a lower surface carrier material;

[0032] S4. Coat the upper and lower ends of the antistatic PC layer with an adhesive layer respectively, and place them in a laminator for hot pressing in the order of upper surface layer, antistatic PC layer, and lower surface layer from top to bottom, and then bake at 160°C for 120 minutes for curing to obtain a finished carrier tape.

[0033] Embodiment 2:

[0034] A high-strength carrier tape comprises a base layer, an upper surface layer and a lower surface layer, wherein both upper and lower end surfaces of the base layer are coated with an adhesive layer, wherein the upper surface layer and the lower surface layer are respectively fixedly connected to the top and bottom ends of the base layer by the adhesive layers, wherein the upper surface layer is a high-strength polystyrene layer, and the lower surface layer is a copper foil layer, wherein the surface of one end of the copper foil layer facing the base layer is coated with a thermosetting resin layer, wherein the carrier tape using the copper foil layer is suitable for situations where high requirements are placed on conductivity and hardness and the carrier tape depth is less than 0.5 mm, and for requirements where the depth is greater than 0.5 mm, a high-strength polystyrene layer may also be used for the carrier tape lower surface layer.

[0035] The base layer is an antistatic PC layer.

[0036] The weight ratio of the upper surface layer, the base layer and the lower surface layer is 2:5:3.

[0037] The adhesive layer is any one of thermoplastic polyester adhesive, rubber modified epoxy adhesive and polyurethane adhesive.

[0038] The thermosetting resin layer includes the following components by weight: 45% epoxy resin, 15% silicone resin, 7% phenolic resin, and 33% polyimide.

[0039] The high-strength polystyrene layer comprises the following components by weight percentage: 55% polystyrene, 15% polyethylene, 15% polyolefin, 14% antioxidant, and 1% antistatic dispersant.

[0040] The antistatic dispersant comprises the following components by weight percentage: 45% carbon nanotubes, 7% polyacrylamide, 7% sodium dodecyl sulfate, and the rest is water.

[0041] A method for manufacturing a high-strength carrier tape comprises the following steps:

[0042] S1, adding carbon nanotubes and an appropriate amount of organic solvent into a ball mill, grinding them thoroughly to obtain carbon nanotube slurry, adding the carbon nanotube slurry, polyacrylamide, and sodium dodecyl sulfate into an ultrasonic disperser, and ultrasonically dispersing for 18 minutes to obtain an antistatic dispersant;

[0043] S2, adding antistatic dispersant, script laundry, polyethylene, polyolefin, and antioxidant into a mixer, stirring at a speed of 400r / min for 45min, adding the mixture into a twin-screw extruder after mixing, and extruding into a molding die to obtain an upper surface carrier material;

[0044] S3, adding epoxy resin, silicone resin, phenolic resin and polyimide into a mixer, stirring for 30 minutes at a speed of 130 r / min to obtain a thermosetting resin, and coating the thermosetting resin on the surface of the copper foil to obtain a lower surface carrier material;

[0045] S4. Coat the upper and lower ends of the antistatic PC layer with an adhesive layer respectively, and place them in a laminator for hot pressing in the order of upper surface layer, antistatic PC layer, and lower surface layer from top to bottom, and then bake at 180°C for 60 minutes for curing to obtain a finished carrier tape.

[0046] Embodiment three:

[0047] A high-strength carrier tape comprises a base layer, an upper surface layer and a lower surface layer, wherein both upper and lower end surfaces of the base layer are coated with an adhesive layer, wherein the upper surface layer and the lower surface layer are respectively fixedly connected to the top and bottom ends of the base layer by the adhesive layers, wherein the upper surface layer is a high-strength polystyrene layer, and the lower surface layer is a copper foil layer, wherein the surface of one end of the copper foil layer facing the base layer is coated with a thermosetting resin layer, wherein the carrier tape using the copper foil layer is suitable for situations where high requirements are placed on conductivity and hardness and the carrier tape depth is less than 0.5 mm, and for requirements where the depth is greater than 0.5 mm, a high-strength polystyrene layer may also be used for the carrier tape lower surface layer.

[0048] The base layer is an antistatic PC layer.

[0049] The weight ratio of the upper surface layer, the base layer and the lower surface layer is 2:5:3.

[0050] The adhesive layer is any one of thermoplastic polyester adhesive, rubber modified epoxy adhesive and polyurethane adhesive.

[0051] The thermosetting resin layer includes the following components by weight: 50% epoxy resin, 10% silicone resin, 5% phenolic resin, and 35% polyimide.

[0052] The high-strength polystyrene layer comprises the following components by weight percentage: 60% polystyrene, 10% polyethylene, 10% polyolefin, 18% antioxidant, and 2% antistatic dispersant.

[0053] The antistatic dispersant comprises the following components by weight percentage: 50% carbon nanotubes, 5% polyacrylamide, 5% sodium dodecyl sulfate, and the rest is water.

[0054] A method for manufacturing a high-strength carrier tape comprises the following steps:

[0055] S1, adding carbon nanotubes and an appropriate amount of organic solvent into a ball mill, grinding them thoroughly to obtain carbon nanotube slurry, adding the carbon nanotube slurry, polyacrylamide, and sodium dodecyl sulfate into an ultrasonic disperser, and ultrasonically dispersing for 20 minutes to obtain an antistatic dispersant;

[0056] S2, adding antistatic dispersant, script laundry, polyethylene, polyolefin, and antioxidant into a mixer, stirring at a speed of 500r / min for 30min, adding the mixture into a twin-screw extruder, and extruding into a molding die to obtain an upper surface carrier material;

[0057] S3, adding epoxy resin, silicone resin, phenolic resin and polyimide into a mixer, stirring for 20 minutes at a speed of 150 r / min to obtain a thermosetting resin, and coating the thermosetting resin on the surface of the copper foil to obtain a lower surface carrier material;

[0058] S4. Coat the upper and lower ends of the antistatic PC layer with an adhesive layer respectively, and place them in a laminator for hot pressing in the order of upper surface layer, antistatic PC layer, and lower surface layer from top to bottom, and then bake at 200°C for 30 minutes for curing to obtain a finished carrier tape.

[0059] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

Claims

1. A high-strength carrier tape, comprising a base layer, an upper surface layer and a lower surface layer, characterized in that: The upper and lower end surfaces of the base layer are coated with an adhesive layer, and the upper surface layer and the lower surface layer are respectively fixedly connected to the top and bottom ends of the base layer by the adhesive layers. The upper surface layer is a high-strength polystyrene layer, and the lower surface layer is a copper foil layer. The surface of the copper foil layer at one end facing the base layer is coated with a thermosetting resin layer.

2. A high-strength carrier tape according to claim 1, characterized in that: The base layer is an antistatic PC layer.

3. A high-strength carrier tape according to claim 1, characterized in that: The weight ratio of the upper surface layer, the base layer and the lower surface layer is 2:5:

3.

4. A high-strength carrier tape according to claim 1, characterized in that: The adhesive layer is any one of thermoplastic polyester adhesive, rubber modified epoxy adhesive and polyurethane adhesive.

5. A high-strength carrier tape according to claim 1, characterized in that: The thermosetting resin layer comprises the following components by weight percentage: 40-50% epoxy resin, 10-20% silicone resin, 5-10% phenolic resin, and 30-35% polyimide.

6. A high-strength carrier tape according to claim 1, characterized in that: The high-strength polystyrene layer comprises the following components by weight percentage: 50-60% of polystyrene, 10-20% of polyethylene, 10-20% of polyolefin, 9-18% of antioxidant, and 1-2% of antistatic dispersant.

7. A high-strength carrier tape according to claim 6, characterized in that: The antistatic dispersant comprises the following components by weight percentage: 40-50% of carbon nanotubes, 5-10% of polyacrylamide, 5-10% of sodium dodecyl sulfate, and the rest is water.

8. A method for manufacturing a high-strength carrier tape according to any one of claims 1 to 7, characterized in that: The steps include: S1, adding carbon nanotubes and an appropriate amount of organic solvent into a ball mill, grinding them thoroughly to obtain carbon nanotube slurry, adding the carbon nanotube slurry, polyacrylamide, and sodium dodecyl sulfate into an ultrasonic disperser, and ultrasonically dispersing for 15-20 minutes to obtain an antistatic dispersant; S2, adding antistatic dispersant, script laundry, polyethylene, polyolefin, and antioxidant into a mixer, stirring at a speed of 300-500r / min for 30-60min, adding the mixture into a twin-screw extruder after mixing, and extruding into a molding die to obtain an upper surface carrier material; S3, adding epoxy resin, silicone resin, phenolic resin and polyimide into a mixer, stirring for 20-40 minutes at a speed of 120-150 r / min to obtain a thermosetting resin, and coating the thermosetting resin on the surface of the copper foil to obtain a lower surface carrier material; S4. Coat the upper and lower ends of the antistatic PC layer with adhesive layers respectively, and place them in a laminator for hot pressing in the order of upper surface layer, antistatic PC layer, and lower surface layer from top to bottom, and then bake at 160-200°C for 30-120 minutes for curing to obtain a finished carrier tape.