Signal ball data acquisition system

Abstract

The invention belongs to the technical field of acquisition systems, and particularly relates to a signal ball data acquisition system. The invention provides a signal ball data acquisition system capable of directly acquiring actual pressure and temperature of a fracturing section. The device comprises a signal ball and a memory ball cage collector, and is characterized in that the signal ball comprises a dissolvable hollow spherical shell, and a pressure sensor, a temperature sensor, a pressure transmitter, a temperature transmitter, a power supply, a controller and a memory ball are arranged in the hollow spherical shell; a detection signal output port of the pressure sensor is connected with a detection signal input port of the controller through the pressure transmitter, a detection signal output port of the temperature sensor is connected with a detection signal input port of the controller through the temperature transmitter, and an electric energy output port of the power source is connected with a power source port of the controller. A signal transmission port of the controller is connected with the memory; a pressure guide hole is formed in the position, corresponding to the pressure sensor, of the hollow spherical shell.

Description

Technical Field

[0001] The invention belongs to the technical field of acquisition systems, and in particular relates to a signal ball data acquisition system. Background Art

[0002] The oil well flowback technology has always been a hot topic of research. One of the core issues is that the flowback objects are heavy and large in volume, which requires a large flowback pressure. At present, during fracturing construction, the downhole pressure is usually inferred by collecting the surface wellhead pressure. The actual pressure and temperature of the fracturing section cannot be directly obtained. Summary of the invention

[0003] The present invention aims at solving the above problems and provides a signal ball data acquisition system which can directly obtain the actual pressure and temperature of the fracturing section.

[0004] To achieve the above-mentioned purpose, the present invention adopts the following technical scheme, which includes a signal ball and a storage ball cage collector, characterized in that the signal ball includes a soluble hollow spherical shell, in which a pressure sensor, a temperature sensor, a pressure transmitter, a temperature transmitter, a power supply, a controller and a storage ball are arranged, the detection signal output port of the pressure sensor is connected to the detection signal input port of the controller through the pressure transmitter, the detection signal output port of the temperature sensor is connected to the detection signal input port of the controller through the temperature transmitter, the power output port of the power supply is connected to the power port of the controller, and the signal transmission port of the controller is connected to the storage; a pressure guide hole is arranged on the hollow spherical shell at a position corresponding to the pressure sensor; the inlet of the storage ball cage collector is connected to the wellhead, the outlet of the storage ball cage collector is connected to the inlet of the blowout control valve, and a storage ball screen is arranged at the outlet of the storage ball cage collector; the controller regularly collects pressure data of the pressure sensor and temperature sensor data, and saves the collected pressure and temperature data in the storage ball for subsequent data reading and playback.

[0005] As a preferred solution, the soluble hollow spherical shell of the present invention adopts a soluble magnesium alloy shell.

[0006] As another preferred solution, the storage balls described in the present invention are multiple.

[0007] As another preferred solution, the power source of the present invention is a battery.

[0008] As another preferred solution, the hollow spherical shell of the present invention includes an upper hemispherical shell and a lower hemispherical shell.

[0009] As another preferred embodiment, the present invention has four pressure sensors, one of which is arranged in the upper hemispherical shell pressure sensor placement groove in the middle of the upper hemispherical shell, the pressure sensor in the upper hemispherical shell is connected to the corresponding pressure transmitter in the upper hemispherical shell, the pressure transmitter in the upper hemispherical shell is arranged in the upper hemispherical shell pressure transmitter placement area on the outer periphery of the upper hemispherical shell pressure sensor placement groove, and the storage ball is arranged in the storage ball placement area on the outer periphery of the upper hemispherical shell pressure sensor placement groove;

[0010] The other three pressure sensors are evenly distributed in the lower hemispherical shell pressure sensor placement groove along the circumferential direction. A pressure transmitter is correspondingly arranged on the outer side of each pressure sensor arranged in the lower hemispherical shell; the lower hemispherical shell pressure transmitter is arranged in the lower hemispherical shell pressure transmitter placement groove above the corresponding lower hemispherical shell pressure sensor side; the middle part of the lower hemispherical shell is a battery placement groove.

[0011] As another preferred solution, the memory ball of the present invention comprises an upper hemisphere shell and a lower hemisphere shell, between which is a memory circuit board, which is connected to the annular circuit board via a soluble wire.

[0012] As another preferred embodiment, the soluble conductive wire of the present invention is a soluble magnesium alloy drawn wire.

[0013] As another preferred solution, the diameter of the storage ball of the present invention may be between 16.18 mm and 24.27 mm.

[0014] As another preferred solution, the inlet of the storage ball cage collector of the present invention can be connected to the wellhead via an inlet flange, and the outlet of the storage ball cage collector can be connected to the inlet of the blowdown control valve via an outlet flange.

[0015] As another preferred scheme, the controller described in the present invention is arranged on an annular circuit board, and a pressure sensor interface, a power input interface, and a host computer debugging interface are arranged circumferentially on one side of the annular circuit board; a temperature sensor, a controller, and a storage ball interface are arranged circumferentially on the other side of the annular circuit board.

[0016] As another preferred solution, the upper hemispherical shell of the present invention is provided with an annular step for placing an annular circuit board, the lower hemispherical shell is provided with an annular boss for pressing the annular circuit board, and the inner wall of the upper hemispherical shell inside the annular boss is provided with a temperature sensor placement groove;

[0017] The annular circuit board is clamped between the annular step and the annular boss. The outer wall of the annular boss is provided with external threads. The inner wall of the upper hemispherical shell outside the annular step is provided with internal threads corresponding to the external threads of the outer wall of the annular boss.

[0018] As another preferred solution, the pressure sensor of the present invention adopts a silicon piezoresistive pressure sensor.

[0019] As another preferred solution, the pressure transmitter of the present invention communicates with the controller via RS-485.

[0020] As another preferred solution, the controller of the present invention communicates with the memory ball via SPI.

[0021] As another preferred solution, the pressure transmitter of the present invention adopts the V8L pressure transmitter produced by Nanjing Hangjia Electronic Technology Co., Ltd.

[0022] As another preferred solution, a W25Q128FV chip U1 is arranged in the memory ball of the present invention, and pins 1, 2, 5, and 6 of U1 are respectively connected to CS, MISO, MOSI, and SCK.

[0023] As another preferred solution, the power supply of the present invention adopts TLV1117-33IDCYR module U4, pin 3 of U4 is connected to VIN, and pins 2 and 4 of U4 are connected to VDD_3.3V.

[0024] As another preferred solution, the controller of the present invention adopts STM32L151CC chip U2, MAX3485EESA chip U3 and MAX3485EESA chip U5, and pins 12 to 17, 30, 31, 34, 38, 18, 20, 39, 21, 22 and 44 of U2 are respectively connected to PA2_4852C, PA3_SPI1_CS1, PA4_SPI1_CS2, PA5_SPI1_SCK, PA6_SPI1_MISO, PA7_SPI1_MISI, PA9_U1TX, PA10_U1RX, SWIO, SWCK, PA15_TEM, PB0_SPI1_CS3, ARM_BOOT1, PB3_4851C, PB10_U3TX, PB11_U3RX and ARM_BOOT0;

[0025] Pin 1 of U3 is connected to PB11_U3RX, pins 2 and 3 of U3 are connected to PA2_4852C, pin 4 of U3 is connected to PB10_U3TX, and pins 6 and 7 of U3 are connected to 4851A and 4851B respectively;

[0026] Pin 1 of U5 is connected to PA10_U1RX, pins 2 and 3 of U3 are connected to PB3_4851C, pin 4 of U5 is connected to PA9_U1TX, and pins 6 and 7 of U5 are connected to 4852A and 4852B respectively.

[0027] As another preferred solution, the temperature sensor of the present invention adopts a DS18B20 chip U1, and pin 2 of U1 is connected to PA15_TEM.

[0028] As another preferred solution, the time interval for collecting pressure and temperature by the controller of the present invention may be: during fracturing, a set of pressure and temperature is recorded every 1 second.

[0029] Secondly, the memory ball of the present invention is calculated based on the data volume of storing 4 pressure values ​​and 1 temperature value per second. Both pressure and temperature are stored in single-precision format, occupying 4 bytes, 32 bits. The data stored per second occupies 32*5=160 bits; the storage time of a W25Q128FV is: 128000000 / 160=800000 seconds=222 hours.

[0030] In addition, the data structure received by the present invention is defined as follows:

[0031] Table 1 Received data structure definition

[0032] Structure Name describe PC_COM_REV Receive data structure Member Name describe unsigned char PC_Head1 Packet header 1 unsigned char PC_Head2 Packet header 2 unsigned char PC_CMD1 Control command word 1 unsigned char PC_CMD2 Control command word 2 unsigned char PC_CMDRSV1 Control command word reserved 1 unsigned char PC_CMDRSV2 Control command word reserved 2 unsigned char PC_PARIDL Parameter ID low unsigned char PC_PARIDH Parameter ID high UNION_CHAR_FLOATPC_PAR Parameter Value unsigned char PC_SUM Checksum

[0033] The sending data structure is defined as follows:

[0034] Table 2 Sending data structure definition

[0035]

[0036]

[0037] The pressure sensor acquisition data structure is defined as follows:

[0038] Table 3 Definition of pressure sensor acquisition data structure

[0039] Structure Name describe UNION_CHAR_FLOAT Float-char union Member Name describe char fchar[4] 4-byte characters float value float value Pressure value variable describe float g_fPressor1 Pressure value 1 float g_fPressor2 Pressure value 2 float g_fPressor3 Pressure value 3 float g_fPressor4 Pressure value 4 unsigned char g_u8SensorOk1 Pressure sensor 1 status flag unsigned char g_u8SensorOk2 Pressure sensor 2 status flag unsigned char g_u8SensorOk3 Pressure sensor 3 status flag unsigned char g_u8SensorOk4 Pressure sensor 4 status flag

[0040] The data structure for saving data is defined as follows:

[0041] Table 4. Definition of data structure for saving data

[0042] Structure Name describe AVE_DATA Save data structure Member Name describe float fP1 Pressure 1 float fP2 Pressure 2 float fP3 Pressure 3 float fP4 Pressure 4 float fT1 temperature .

[0043] The invention has beneficial effects.

[0044] The present invention integrates the pressure ball body (hollow spherical shell) with the information acquisition system (pressure sensor, temperature sensor, pressure transmitter, temperature transmitter, power supply, controller and storage ball) to form a signal ball overall structure. The pressure sensor and temperature sensor can collect the fluid pressure above and below the signal ball and the surrounding temperature. The data storage ball is used to store the collected pressure signal and temperature signal.

[0045] The present invention adopts a soluble hollow spherical shell. After the signal ball is put into the well, the pressure and temperature signal collection is completed. After the signal ball dissolves in the well, the storage ball is separated and discharged to the ground along with the spraying liquid. The storage ball is collected on the ground. The collected data of the storage ball is read to directly obtain the actual pressure and temperature of the fracturing section. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. The protection scope of the present invention is not limited to the following description.

[0047] Figure 1 It is a system block diagram of the present invention.

[0048] Figure 2 It is an exploded view of the signal ball of the present invention.

[0049] Figure 2 In the figure, 1 is the upper hemispherical shell, 101 is the upper hemispherical shell pressure sensor placement groove, 102 is the storage ball placement area, 103 is the upper hemispherical shell pressure transmitter placement area, 104 is the annular step, 105 is the temperature sensor placement groove, 2 is the lower hemispherical shell, 201 is the lower hemispherical shell pressure transmitter placement groove, 202 is the lower hemispherical shell pressure sensor placement groove, 203 is the battery placement groove, 204 is the annular boss, 205 is the pressure conducting hole, 3 is the annular circuit board, and 4 is the storage ball.

[0050] Figure 3 It is a schematic diagram of the signal ball return process of the present invention.

[0051] Figure 4 It is a schematic diagram of the circuit of the data storage ball of the present invention.

[0052] Figure 5 It is a circuit schematic diagram of the power supply part of the present invention.

[0053] Figure 6 It is a circuit schematic diagram of the single chip microcomputer and the temperature collection part of the present invention.

[0054] Figure 7 This is the circuit schematic diagram of the RS-485 communication and external interface part of the present invention.

[0055] Figure 8 It is a ring circuit board signal acquisition circuit and interface definition diagram of the present invention.

[0056] Fig. 9 It is the overall block diagram of the data acquisition and storage software of the present invention.

[0057] Fig.10 It is a flow chart of the data acquisition and storage software of the present invention.

[0058] Fig.11 It is a schematic diagram of reading information of the memory ball of the present invention. DETAILED DESCRIPTION

[0059] As shown in the figure, the present invention includes a signal ball and a storage ball cage collector. The signal ball includes a soluble hollow spherical shell. A pressure sensor, a temperature sensor, a pressure transmitter, a temperature transmitter, a power supply, a controller and a storage ball are arranged in the hollow spherical shell. The detection signal output port of the pressure sensor is connected to the detection signal input port of the controller through the pressure transmitter, the detection signal output port of the temperature sensor is connected to the detection signal input port of the controller through the temperature transmitter, the power output port of the power supply is connected to the power port of the controller, and the signal transmission port of the controller is connected to the storage; a pressure conducting hole is arranged on the hollow spherical shell at a position corresponding to the pressure sensor.

[0060] The soluble hollow spherical shell is a soluble magnesium alloy shell. Soluble magnesium alloy is a new type of metal material prepared by alloying with magnesium as the main component and adding other metal elements such as aluminum and zinc. It has the characteristics of high strength, light weight, corrosion resistance and easy processing, and is widely used in aviation, automobile, electronics and oil and gas mining.

[0061] The signal ball of the present invention can cooperate with the soluble bridge plug to complete the fracturing work. The soluble bridge plug can adopt the soluble bridge plug with patent number 2019108891806 and the name "a kind of all-metal soluble bridge plug". The working principle of fracturing is detailed in the content of the specific implementation method in the patent. The soluble hollow ball of the present invention plays the role of a fracturing ball; the soluble bridge plug is fixed at a certain position of the well and cooperates with the fracturing ball to realize the fracturing process. The existing fracturing ball can only play a plugging role and cannot collect the pressure and temperature information of the fracturing process. The signal ball of the present invention can not only play a plugging role, but also collect the pressure and temperature information of the entire fracturing process. For details, see the animation demonstration: https: / / v.qq.com / x / page / d063731eq7z.html.

[0062] The present invention is a signal ball based on a fracturing soluble ball, which collects the upper and lower pressures of a sealing ball seat and the temperature of a sealing area.

[0063] The memory ball comprises an upper hemisphere shell and a lower hemisphere shell. A memory circuit board is disposed between the upper hemisphere shell and the lower hemisphere shell. The memory circuit board is connected to the annular circuit board through a soluble wire.

[0064] The soluble conductive wire is a soluble magnesium alloy drawn wire.

[0065] The diameter of the storage ball can be between 16.18 mm and 24.27 mm.

[0066] The inlet of the storage ball cage collector is connected to the wellhead, the outlet of the storage ball cage collector is connected to the inlet of the blowout control valve, and a storage ball screen is arranged at the outlet of the storage ball cage collector. The backflow output from the wellhead enters the storage ball cage, and the storage ball size is larger than the mesh size of the storage ball screen. The backflow of the storage ball with a size smaller than the mesh size of the storage ball screen is discharged, and the storage ball remains in the storage ball cage collector.

[0067] The inlet of the storage ball cage collector can be connected to the wellhead through an inlet flange, and the outlet of the storage ball cage collector can be connected to the inlet of the blowout control valve through an outlet flange.

[0068] The acquisition time interval can be: during fracturing, a set of pressure and temperature is recorded every 1 second.

[0069] There are multiple storage balls.

[0070] The ball shell is made of soluble material. After the well is sealed, it will gradually dissolve under the action of the fracturing fluid downhole. The sensor and the circuit, as well as the memory ball and the circuit board are connected by soluble wires, which will also dissolve and disconnect, leaving only the memory ball.

[0071] The signal storage ball is released after the soluble ball dissolves and breaks, and the power supply, control chip, sensor, circuit board, etc. are separated. After the storage ball is collected through blowback, the signal data during the fracturing process is interpreted on the ground. The power supply and control chip are made on the circuit board, and the storage ball is connected to the circuit board through a soluble wire; the pressure sensor is connected to the circuit board through a soluble wire; after the wire is melted, the storage ball is separated. After separation, the sensor and circuit board are useless. The useful data has been stored in the storage ball, and you only need to recover the storage ball and read the stored data.

[0072] The hollow spherical shell includes an upper hemispherical shell and a lower hemispherical shell.

[0073] There are four pressure sensors, one of which is arranged in the upper hemispherical shell pressure sensor placement groove in the middle of the upper hemispherical shell, the pressure sensor in the upper hemispherical shell is connected to the corresponding pressure transmitter in the upper hemispherical shell, the pressure transmitter in the upper hemispherical shell is arranged in the upper hemispherical shell pressure transmitter placement area on the outer periphery of the upper hemispherical shell pressure sensor placement groove, and the storage ball is arranged in the storage ball placement area on the outer periphery of the upper hemispherical shell pressure sensor placement groove;

[0074] The other three pressure sensors are evenly distributed in the lower hemispherical shell pressure sensor placement groove along the circumferential direction. A pressure transmitter is correspondingly arranged on the outer side of each pressure sensor arranged in the lower hemispherical shell; the lower hemispherical shell pressure transmitter is arranged in the lower hemispherical shell pressure transmitter placement groove above the corresponding lower hemispherical shell pressure sensor side; the middle part of the lower hemispherical shell is a battery placement groove.

[0075] The upper hemispherical shell pressure sensor placement groove and the lower hemispherical shell pressure sensor placement groove are cylindrical grooves; the lower hemispherical shell pressure transmitter placement groove and the battery placement groove are square grooves; the three lower hemispherical shell pressure sensor placement grooves are set at the three vertices of the same equilateral triangle.

[0076] The cylindrical slot is convenient for placing pressure sensors. The square slot is convenient for placing pressure transmitters and batteries.

[0077] Four pressure sensors are used, with the vertex layout of a truncated regular tetrahedron in a sphere, to ensure that the pressure above and below the soluble hollow spherical shell can be collected simultaneously in any direction of the ball seal.

[0078] The pressure sensor adopts the vertex layout of the truncated tetrahedron in the ball to ensure that the pressure above and below the soluble ball seat can be collected simultaneously in any direction of the ball sealing. The space of the spherical shell is fully utilized to ensure the installation of the pressure sensor, pressure transmitter, memory, ring circuit board and battery. There are small holes at the four vertices of the hollow ball installation pressure sensor to ensure that the force-bearing surface of the pressure sensor contacts the measured pressure. The temperature sensor is installed close to the inner surface of the hollow ball to ensure that the surrounding temperature can be measured.

[0079] Four silicon piezoresistive pressure sensors sense the pressure in four directions of the signal ball. After conversion by the pressure transmitter, the pressure value is transmitted to the controller via RS-485. The controller integrates a digital temperature sensor to collect the ambient temperature, and then saves the pressure and temperature data to three memory balls through the SPI interface. Both the pressure transmitter and the controller can adopt low-power design to ensure that the system meets the storage time requirements when powered by batteries.

[0080] The controller is arranged on a ring-shaped circuit board, and a pressure sensor interface, a power input interface, and a host computer debugging interface are arranged circumferentially on one side of the ring-shaped circuit board; a temperature sensor, a controller, and a memory ball interface are arranged circumferentially on the other side of the ring-shaped circuit board. The use of a ring-shaped circuit board is convenient for matching with a hollow spherical shell, and is convenient for wiring and placing batteries.

[0081] The pressure sensor adopts a silicon piezoresistive pressure sensor, and an HP10 silicon piezoresistive pressure sensor can be used. The HP10 silicon piezoresistive pressure sensor adopts a 316L stainless steel shell. The external pressure is transmitted to the sensitive chip through the stainless steel diaphragm and the internally sealed silicone oil. The sensitive chip does not directly contact the measured section, forming a fully solid-state structure for pressure measurement, which is suitable for harsh corrosive media environments. The pressure sensor converts the change in pressure into a change in resistance, and the pressure transmitter converts the resistance signal into a voltage signal, which is then converted into a digital signal through AD and output through RS-485.

[0082] The pressure transmitter communicates with the controller via RS-485.

[0083] The controller communicates with the memory ball via SPI.

[0084] The pressure transmitter is the V8L pressure transmitter produced by Nanjing Hangjia Electronic Technology Co., Ltd.

[0085] A W25Q128FV chip U1 is arranged in the memory ball, and pins 1, 2, 5, and 6 of U1 are respectively connected to CS, MISO, MOSI, and SCK.

[0086] It can be calculated based on the amount of data stored per second: 4 pressure values ​​and 1 temperature value. Both pressure and temperature are stored in single-precision format, occupying 4 bytes, 32 bits. The data stored per second occupies 32*5=160 bits. The storage time of one W25Q128FV is: 128000000 / 160=800000 seconds=222 hours.

[0087] The power supply adopts TLV1117-33IDCYR module U4, pin 3 of U4 is connected to VIN (VIN is connected to the battery), and pins 2 and 4 of U4 are connected to VDD_3.3V.

[0088] The controller adopts STM32L151CC chip U2, MAX3485EESA chip U3 and MAX3485EESA chip U5, and pins 12 to 17, 30, 31, 34, 38, 18, 20, 39, 21, 22 and 44 of U2 are respectively connected with PA2_4852C, PA3_SPI1_CS1, PA4_SPI1_CS2, PA5_SPI1_SCK, PA6_SPI1_MISO, PA7_SPI1_MISI, PA9_U1TX, PA10_U1RX, SWIO, SWCK, PA15_TEM, PB0_SPI1_CS3, ARM_BOOT1, PB3_4851C, PB10_U3TX, PB11_U3RX and ARM_BOOT0;

[0089] Pin 1 of U3 is connected to PB11_U3RX, pins 2 and 3 of U3 are connected to PA2_4852C, pin 4 of U3 is connected to PB10_U3TX, and pins 6 and 7 of U3 are connected to 4851A and 4851B respectively;

[0090] Pin 1 of U5 is connected to PA10_U1RX, pins 2 and 3 of U3 are connected to PB3_4851C, pin 4 of U5 is connected to PA9_U1TX, and pins 6 and 7 of U5 are connected to 4852A and 4852B respectively.

[0091] The STM32L151CC chip is a low-power single-chip microcomputer with two external RS-485 interfaces, one for collecting signals from four pressure sensors and one for debugging soft communication with the host computer. The SPI interface is used to communicate with three memory balls to store and read pressure and temperature data.

[0092] The temperature sensor adopts DS18B20 chip U1, and the 2nd pin of U1 is connected to PA15_TEM. The DS18B20 digital temperature sensor is used to collect the ambient temperature, with a temperature measurement accuracy of ±0.5°C and a temperature measurement range of -55°C to 125°C.

[0093] The controller communicates with the host computer through the RS-485 interface to initialize the configuration of the controller. The controller regularly collects the pressure data of the four pressure sensors and the temperature sensor data, and saves the collected pressure and temperature data into the memory ball for subsequent data reading and playback.

[0094] The RS-485 communication interface is used to read the data of four pressure sensors through the standard modbus communication protocol. The controller reads the temperature value of the DS18B20 temperature sensor and the temperature value of the temperature sensor inside the controller chip, and stores the pressure and temperature data in three external memory balls using the SPI interface.

[0095] The circuit runs automatically after power-on, and the working process is as follows:

[0096] (1) Initialize the system clock and delay function;

[0097] (2) IO port initialization;

[0098] (3) DS18B20 temperature sensor initialization;

[0099] (4) External data memory 1 is initialized;

[0100] (5) External data memory 2 initialization;

[0101] (6) External data memory 3 initialization;

[0102] (7) Chip temperature acquisition initialization;

[0103] (8) Serial port 1 initialization;

[0104] (9) Serial port 3 initialization;

[0105] (10) Watchdog initialization;

[0106] (11) Timer 2 initialization;

[0107] (12) Enter the main function and collect and store pressure and temperature data according to the status flags, perform storage initialization, and return stored data.

[0108] The serial port 1 (UART1) of STM32L151CC is used to realize RS-485 level conversion through the MAX3485 chip.

[0109] The received data structure stores the received data and stores it according to the communication protocol.

[0110] Table 1 Received data structure definition

[0111] Structure Name describe PC_COM_REV Receive data structure Member Name describe unsigned char PC_Head1 Packet header 1 unsigned char PC_Head2 Packet header 2 unsigned char PC_CMD1 Control command word 1 unsigned char PC_CMD2 Control command word 2 unsigned char PC_CMDRSV1 Control command word reserved 1 unsigned char PC_CMDRSV2 Control command word reserved 2 unsigned char PC_PARIDL Parameter ID low unsigned char PC_PARIDH Parameter ID high UNION_CHAR_FLOAT PC_PAR Parameter Value unsigned char PC_SUM Checksum

[0112] The sent data structure stores the sent data and stores it according to the communication protocol.

[0113] Table 2 Sending data structure definition

[0114]

[0115]

[0116] Function Design

[0117] 1) Serial port initialization

[0118] Function definition: void uart1_init(u32 bound)

[0119] Workflow:

[0120] a) Enable the relevant GPIO clock and USAR1 clock;

[0121] b) USART1 port multiplexing function is enabled;

[0122] c) USART1 port configuration;

[0123] d) USART1 initialization settings, including start bit, stop bit, parity bit, baud rate, etc.;

[0124] e) Set the USART1 interrupt priority and enable the USART1 receive interrupt;

[0125] f) Enable USART1.

[0126] 2) Serial port sends data

[0127] Function definition: void uart1_SendData(u8*buf,u8 len)

[0128] Write the data bytes to be sent to the USART1 transmit register in a loop and wait for each byte to be sent until len length bytes are sent.

[0129] 3)Serial port data conversion

[0130] Function definition: BOOL TransToPCCom(unsigned char inChar[],struct

[0131] PC_COM_REV*pcComRe)

[0132] Calculate the checksum of the USART1 receive buffer data and compare it with the received checksum. If correct, convert the receive buffer data into PC_COM_REV structure data and return true. If the checksum is wrong, return false.

[0133] Serial port data decoding

[0134] Function definition: void DecodePC(unsigned char ch)

[0135] Workflow:

[0136] a) Determine whether packet header 1 and packet header 2 have been received. If not, continue to determine. If received, execute 2);

[0137] b) Cache the received data and determine whether the specified length of data is received. If the length is not reached, continue caching. If the length is reached, execute c);

[0138] c) Convert the received data into PC_COM_REV structure data, and perform parameter parsing or command parsing according to the specific results;

[0139] d) Initialize the receiving buffer and receiving length, and start judging the next frame of data.

[0140] 5) Serial port sends platform status data

[0141] Function definition: void PC_Send(unsigned char uCom,struct PC_COM_SENDpcComSend)

[0142] Convert the platform status data into PC_COM_SEND structure data, then call the serial port data sending function to send the set result.

[0143] The data of the four pressure sensors are collected using the RS-485 interface, using the serial port 3 (UART3) of the STM32L151CC and the RS-485 level conversion through the MAX3485 chip.

[0144] Define relevant data structures to read and parse pressure sensor data.

[0145] Table 3 Definition of pressure sensor acquisition data structure

[0146]

[0147]

[0148] 1) Serial port initialization

[0149] Function definition: void uart3_init(u32 bound)

[0150] Workflow:

[0151] a) Enable the relevant GPIO clock and USAR3 clock;

[0152] b) USART31 port multiplexing function is enabled;

[0153] c) USART3 port configuration;

[0154] d) USART3 initialization settings, including start bit, stop bit, parity bit, baud rate, etc.;

[0155] e) Set the USART3 interrupt priority and enable the USART3 receive interrupt;

[0156] f) Enable USART3.

[0157] 2) Serial port sends data

[0158] Function definition: void uart3_SendData(u8*buf,u8 len)

[0159] Write the data bytes to be sent to the USART3 transmit register in a loop and wait for each byte to be sent until len length bytes are sent.

[0160] 3) Send pressure data reading command

[0161] Function definition: void Sensor_Read(unsigned char uAddr)

[0162] Function: Send a pressure data reading command to the sensor at the specified address.

[0163] 4)Serial port data decoding

[0164] Function definition: void DecodeSensor(unsigned char ch)

[0165] Workflow:

[0166] a) Determine whether packet header 1 and packet header 2 have been received. If not, continue to determine. If received, execute b);

[0167] b) Cache the received data and determine whether the specified length of data is received. If the length is not reached, continue caching. If the length is reached, execute c);

[0168] c) Determine the received sensor address and determine which sensor returned the data;

[0169] d) Analyze the pressure data and cache it into the corresponding pressure storage variable;

[0170] e) Initialize the receiving buffer and receiving length, and start judging the next frame of data.

[0171] The ambient temperature is collected using the DS18B20 digital temperature sensor, and the chip temperature is collected using the STM32L151CC internal temperature sensor.

[0172] 1) DS18B20 initialization

[0173] Function definition: u8 DS18B20_Init(void)

[0174] Function: Initialize DS18B20 related GPIO and sensor registers.

[0175] 2) Write a byte to DS18B20

[0176] Function definition: void DS18B20_Write_Byte(u8 dat)

[0177] Function: Write a byte to DS18B20.

[0178] 3) Read a byte from DS18B20

[0179] Function definition: u8 DS18B20_Read_Byte(void)

[0180] Function: Read a byte from DS18B20.

[0181] 4) Check if DS18B20 exists

[0182] Function definition: u8 DS18B20_Check(void)

[0183] Function: Detect whether the data bus is connected to DS18B20.

[0184] 5) Reset DS18B20

[0185] Function definition: void DS18B20_Rst(void)

[0186] Function: Reset DS18B20.

[0187] 6) Start a temperature conversion

[0188] Function definition: void DS18B20_Start(void)

[0189] Function: Send a start temperature conversion instruction to DS18B20.

[0190] 7) Read the temperature conversion result

[0191] Function definition: short DS18B20_Get_Temp(void)

[0192] Function: Read a temperature conversion result.

[0193] 8) Initialization of AD conversion of internal temperature sensor of chip

[0194] Function definition: void MY_ADC_Init(void)

[0195] Function: Initialize the STM2L151CC internal temperature sensor AD converter.

[0196] 9) Read the internal temperature of the chip

[0197] Function definition: float Get_Temp(void)

[0198] Function: Read the internal temperature of the chip.

[0199] The collected pressure and temperature data are saved in 3 external memories, and the interface uses the SPI1 interface of STM32L151CC.

[0200] Design and save data structures to facilitate reading and writing of memory.

[0201] Table 4. Definition of data structure for saving data

[0202] Structure Name describe AVE_DATA Save data structure Member Name describe float fP1 Pressure 1 float fP2 Pressure 2 float fP3 Pressure 3 float fP4 Pressure 4 float fT1 temperature

[0203] 1) SPI1 interface initialization

[0204] Function definition: void SPI1_Init(void)

[0205] Workflow:

[0206] a) Enable the relevant GPIO clock and SPI1 clock;

[0207] b) SPI1 port multiplexing function is enabled;

[0208] c) SPI1 port configuration;

[0209] d) SPI1 initialization settings, including working mode, read and write timing, number of data bits, clock frequency, etc.;

[0210] e) Enable SPI1.

[0211] 2)SPI1 read and write data

[0212] Function definition: u8 SPI1_ReadWriteByte(u8 TxData)

[0213] Parameter description: TXData - send byte data; the return value is a byte of data read

[0214] Function: Send one byte of data through SPI1 and read one byte of received data at the same time.

[0215] 3) Flash1 initialization

[0216] Function definition: void W25QXX1_Init(void)

[0217] Workflow:

[0218] a) Enable the relevant GPIO clock;

[0219] b) Chip select IO initialization;

[0220] c) SPI1 initialization;

[0221] d) Flash1 initialization;

[0222] 4) Flash1 read

[0223] Function definition: void W25QXX1_Read(u8*pBuffer,u32 ReadAddr,u16NumByteToRead)

[0224] Parameter description: pBuffer – buffer array for storing read data; ReadAddr – starting address for reading data; NumByteToRead – number of bytes to read;

[0225] Function: Read the specified bytes of data from the specified starting real address to the specified cache array.

[0226] 5) Flash1 write

[0227] Function definition: void W25QXX1_Write(u8*pBuffer,u32 WriteAddr,u16NumByteToWrite)

[0228] Parameter description: pBuffer – buffer array for storing written data; WriteAddr – starting address of written data; NumByteToWrite – number of bytes to be written;

[0229] Function: Write the data in the cache array to the Flash from the specified starting address and specify the number of bytes to be written.

[0230] 6) Collect data and write it into memory 1

[0231] Function definition: void SaveDataToFlash1(void)

[0232] Function: Write the collected pressure and temperature data into memory 1 and process the storage address.

[0233] 7) Read the saved data from memory 1

[0234] Function definition: u32 EEPROM1_Read_U32(unsigned long address)

[0235] Parameter description: unsigned long address – the address where the saved data is to be read;

[0236] Function: Read the data stored in the specified address of memory 1 and cache it to the specified variable.

[0237] 8) Flash2 initialization

[0238] Function definition: void W25QXX2_Init(void)

[0239] Workflow:

[0240] a) Enable the relevant GPIO clock;

[0241] b) Chip select IO initialization;

[0242] c)SPI2 initialization;

[0243] d) Flash2 initialization;

[0244] 9) Flash2 read

[0245] Function definition: void W25QXX2_Read(u8*pBuffer,u32 ReadAddr,u16NumByteToRead)

[0246] Parameter description: pBuffer – buffer array for storing read data; ReadAddr – starting address for reading data; NumByteToRead – number of bytes to read;

[0247] Function: Read the specified bytes of data from the specified starting real address to the specified cache array.

[0248] 10) Flash2 write

[0249] Function definition: void W25QXX2_Write(u8*pBuffer,u32 WriteAddr,u16NumByteToWrite)

[0250] Parameter description: pBuffer – buffer array for storing written data; WriteAddr – starting address of written data; NumByteToWrite – number of bytes to be written;

[0251] Function: Write the data in the cache array to the Flash from the specified starting address and specify the number of bytes to be written.

[0252] 11) Collect data and write it into memory 2

[0253] Function definition: void SaveDataToFlash2(void)

[0254] Function: Write the collected pressure and temperature data into memory 2 and process the storage address.

[0255] 12) Read the saved data from memory 2

[0256] Function definition: u32 EEPROM2_Read_U32(unsigned long address)

[0257] Parameter description: unsigned long address – the address where the saved data is to be read;

[0258] Function: Read the data stored in the specified address of memory 2 and cache it to the specified variable.

[0259] 13) Flash3 initialization

[0260] Function definition: void W25QXX3_Init(void)

[0261] Workflow:

[0262] 1) Enable the relevant GPIO clock;

[0263] 2) Chip select IO initialization;

[0264] 3)SPI1 initialization;

[0265] 4) Flash3 initialization;

[0266] 14) Flash3 read

[0267] Function definition: void W25QXX3_Read(u8*pBuffer,u32 ReadAddr,u16NumByteToRead)

[0268] Parameter description: pBuffer – buffer array for storing read data; ReadAddr – starting address for reading data; NumByteToRead – number of bytes to read;

[0269] Function: Read the specified bytes of data from the specified starting real address to the specified cache array.

[0270] 15) Flash1 write

[0271] Function definition: void W25QXX3_Write(u8*pBuffer,u32 WriteAddr,u16NumByteToWrite)

[0272] Parameter description: pBuffer – buffer array for storing written data; WriteAddr – starting address of written data; NumByteToWrite – number of bytes to be written;

[0273] Function: Write the data in the cache array to the Flash from the specified starting address and specify the number of bytes to be written.

[0274] 16) Collect data and write it into memory 3

[0275] Function definition: void SaveDataToFlash3(void)

[0276] Function: Write the collected pressure and temperature data into memory 3 and process the storage address.

[0277] 17) Read the saved data from memory 3

[0278] Function definition: u32 EEPROM3_Read_U32(unsigned long address)

[0279] Parameter description: unsigned long address – the address where the saved data is to be read;

[0280] Function: Read the data stored in the specified address of memory 3 and cache it to the specified variable.

[0281] The working process of the present invention will be described below in conjunction with the accompanying drawings.

[0282] During fracturing, after the perforating tool string is extracted to the ground, the signal ball is dropped into the wellhead. Before dropping the signal ball, the signal ball power is turned on and the acquisition program is started. At the same time, the fracturing layer information and the corresponding signal ball number information are recorded.

[0283] After the signal ball dissolves underground, the information collection system is exposed, and the memory ball is separated from the circuit board and discharged to the ground along with the spray liquid. A ball cage collector is set on the ground to collect the return solids.

[0284] After the ground collects the storage ball, the collected downhole information is read and the collected pressure and temperature data are displayed in the form of lists and curves.

[0285] It can be understood that the above specific description of the present invention is only used to illustrate the present invention and is not limited to the technical solutions described in the embodiments of the present invention. Those skilled in the art should understand that the present invention can still be modified or replaced by equivalents to achieve the same technical effects; as long as the use requirements are met, they are within the protection scope of the present invention.

Claims

1. A signal ball data acquisition system, comprising a signal ball and a storage ball cage collector, characterized in that The signal ball includes a soluble hollow spherical shell, in which a pressure sensor, a temperature sensor, a pressure transmitter, a temperature transmitter, a power supply, a controller and a memory ball are arranged. The detection signal output port of the pressure sensor is connected to the detection signal input port of the controller through the pressure transmitter, the detection signal output port of the temperature sensor is connected to the detection signal input port of the controller through the temperature transmitter, the power output port of the power supply is connected to the power port of the controller, and the signal transmission port of the controller is connected to the memory; a pressure guide hole is arranged on the hollow spherical shell at a position corresponding to the pressure sensor; the inlet of the memory ball cage collector is connected to the wellhead, the outlet of the memory ball cage collector is connected to the inlet of the blowout control valve, and a memory ball screen is arranged at the outlet of the memory ball cage collector; the controller regularly collects pressure data of the pressure sensor and temperature sensor data, and saves the collected pressure and temperature data in the memory ball for subsequent data reading and playback.

2. The signal ball data acquisition system according to claim 1, characterized in that The inlet of the storage ball cage collector is connected to the wellhead through an inlet flange, and the outlet of the storage ball cage collector is connected to the inlet of the blowout control valve through an outlet flange.

3. The signal ball data acquisition system according to claim 1, characterized in that The pressure sensor is a silicon piezoresistive pressure sensor.

4. The signal ball data acquisition system according to claim 1, characterized in that A W25Q128FV chip U1 is arranged in the memory ball, and pins 1, 2, 5, and 6 of U1 are respectively connected to CS, MISO, MOSI, and SCK.

5. The signal ball data acquisition system according to claim 1, characterized in that The power supply adopts TLV1117-33IDCYR module U4, pin 3 of U4 is connected to VIN, and pins 2 and 4 of U4 are connected to VDD_3.3V.

6. The signal ball data acquisition system according to claim 1, characterized in that The controller adopts STM32L151CC chip U2, MAX3485EESA chip U3 and MAX3485EESA chip U5, and pins 12 to 17, 30, 31, 34, 38, 18, 20, 39, 21, 22 and 44 of U2 are respectively connected with PA2_4852C, PA3_SPI1_CS1, PA4_SPI1_CS2, PA5_SPI1_SCK, PA6_SPI1_MISO, PA7_SPI1_MISI, PA9_U1TX, PA10_U1RX, SWIO, SWCK, PA15_TEM, PB0_SPI1_CS3, ARM_BOOT1, PB3_4851C, PB10_U3TX, PB11_U3RX and ARM_BOOT0; Pin 1 of U3 is connected to PB11_U3RX, pins 2 and 3 of U3 are connected to PA2_4852C, pin 4 of U3 is connected to PB10_U3TX, and pins 6 and 7 of U3 are connected to 4851A and 4851B respectively; Pin 1 of U5 is connected to PA10_U1RX, pins 2 and 3 of U3 are connected to PB3_4851C, pin 4 of U5 is connected to PA9_U1TX, and pins 6 and 7 of U5 are connected to 4852A and 4852B respectively.

7. The signal ball data acquisition system according to claim 1, characterized in that The temperature sensor adopts DS18B20 chip U1, and pin 2 of U1 is connected to PA15_TEM.

8. The signal ball data acquisition system according to claim 1, characterized in that The controller collects pressure and temperature at a time interval of: during fracturing, a set of pressure and temperature is recorded every 1 second.

9. The signal ball data acquisition system according to claim 1, characterized in that The memory ball is calculated based on the amount of data stored in it, 4 pressure values ​​and 1 temperature value per second. Both pressure and temperature are stored in single-precision format, occupying 4 bytes, 32 bits. The data stored per second occupies 32*5=160 bits. The storage time of one W25Q128FV is: 128000000 / 160=800000 seconds=222 hours.

10. The signal ball data acquisition system according to claim 1, characterized in that The receiving data structure is defined as follows: Table 1 Received data structure definition The sending data structure is defined as follows: Table 2 Sending data structure definition The pressure sensor acquisition data structure is defined as follows: Table 3 Definition of pressure sensor acquisition data structure The data structure for saving data is defined as follows: Table 4. Definition of data structure for saving data

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