SPD burning device and method

Abstract

The embodiment of the invention provides an SPD burning device and method. The SPD burning device comprises a test mainboard and a processing chip. The test mainboard is provided with a BIOS chip and a memory module interface; the BIOS chip is connected with the processing chip, a BIOS program is stored in the BIOS chip, the BIOS program comprises false SPD data, the BIOS chip responds to an initialization instruction sent by the processing chip, and the BIOS chip initializes the memory module chip inserted into the memory module interface based on the false SPD data by running the BIOS program; and the processing chip is connected with the memory module interface and is used for acquiring the reference SPD data after the memory module chip is initialized and burning the reference SPD data into the memory module chip inserted into the memory module interface. According to the scheme, the SPD burning of the memory module can be realized.

Description

Technical Field

[0001] The present disclosure relates to the field of memory technology, and in particular to an SPD programming device and method. Background Art

[0002] With the development of memory technology, memory is widely used in various fields. For example, dynamic random access memory (DRAM) is a semiconductor memory that writes and reads data at high speed and randomly, and is widely used in data storage devices or apparatuses.

[0003] In actual applications, in order to ensure that the memory can be used normally, the SPD data needs to be burned into the electrically erasable programmable read-only memory (EEPROM) in the memory module chip before leaving the factory. The SPD data includes relevant information of the memory module chip, such as module manufacturer, operating frequency, operating voltage, speed, capacity, voltage, row and column address bandwidth, etc.

[0004] In the prior art, SPD burning of a memory module can be realized by connecting an SPD burner. The current SPD burner can only be adapted to a specific memory module and cannot realize SPD burning of other memory modules. Summary of the invention

[0005] The embodiments of the present disclosure provide an SPD programming device and method.

[0006] According to some embodiments, the first aspect of the present disclosure provides an SPD burning device, comprising: the SPD burning device comprises: a test mainboard and a processing chip; the test mainboard is provided with a BIOS chip and a memory module interface; the BIOS chip is connected to the processing chip, the BIOS chip stores a BIOS program, the BIOS program includes false SPD data, the BIOS chip is used to respond to the initialization instruction issued by the processing chip, by running the BIOS program, the memory module chip inserted into the memory module interface based on the false SPD data to initialize; the processing chip is connected to the memory module interface, and is used to obtain benchmark SPD data after the memory module chip is initialized, and burn the benchmark SPD data into the memory module chip inserted into the memory module interface.

[0007] In some embodiments, the processing chip is integrated on the test mainboard; the processing chip is electrically connected to the BIOS chip.

[0008] In some embodiments, the SPD burning device also includes: a remote device, the processing chip is integrated on the remote device; the test mainboard is also provided with a network card; the network card is connected to the BIOS chip and the memory module interface; the network card is used to receive the initialization instructions and burning instructions sent by the processing chip, and the burning instructions include the benchmark SPD data; the BIOS chip is used to respond to the initialization instructions forwarded by the network card, and initialize the memory module chip inserted into the memory module interface based on the false SPD data by running the BIOS program; the memory module interface is used to transmit the burning instructions forwarded by the network card to the memory module chip connected to the memory module interface, so that the memory module chip burns the benchmark SPD data according to the burning instructions.

[0009] In some embodiments, the memory module interface includes: a connector; the connector is arranged corresponding to a first external pin of a memory module chip inserted into the memory module interface; the first external pin of the memory module chip is connected to an HSA pin of an SPD chip in the memory module chip.

[0010] In some embodiments, the test mainboard includes: a switch; one end of the switch is connected to the connector, and the other end of the switch is grounded, and the switch is used to disconnect when the write protection of the memory module chip is turned on; and to turn on when the write protection of the memory module chip is turned off.

[0011] In some embodiments, the switch includes a dip switch; the test mainboard also includes: a first resistor; the moving end of the dip switch is connected to the connecting piece, the first fixed end of the dip switch is connected to one end of the first resistor, and the second fixed end of the dip switch is grounded; the other end of the first resistor is grounded.

[0012] In some embodiments, the switch includes a jumper cap; the test mainboard also includes: a second resistor, a first pin, a second pin and a third pin; one end of the second resistor is connected to the first pin, and the other end of the second resistor is grounded; the second pin is connected to the connector; the third pin is grounded; when the write protection of the memory module chip is turned on, one end of the jumper cap is inserted into the first pin, and the other end of the jumper cap is inserted into the second pin; and, when the write protection of the memory module chip is turned off, one end of the jumper cap is inserted into the third pin, and the other end of the jumper cap is inserted into the second pin.

[0013] In some embodiments, the switch includes a controllable switch; one end of the controllable switch is connected to the connecting member, the other end of the controllable switch is grounded, the control end of the controllable switch receives a control signal sent by the processing chip, and the controllable switch is used to turn on or off in response to the control signal.

[0014] In some embodiments, the processing chip includes: a memory and a processor; the memory is used to store UEFI system files and an SPD burning program; the processor is used to read the UEFI system files from the memory and run the UEFI system according to the UEFI system files; and, under the UEFI system, call the SPD burning program in the memory to obtain baseline SPD data, and burn the baseline SPD data into the memory module chip.

[0015] According to some embodiments, the second aspect of the present disclosure provides an SPD burning method, which is applied to a processing chip in an SPD burning device, wherein the SPD burning device comprises: a test mainboard and the processing chip, wherein the test mainboard is provided with a BIOS chip and a memory module interface; the method comprises: sending an initialization instruction to the BIOS chip so that the BIOS chip responds to the initialization instruction, and initializes the memory module chip inserted into the memory module interface based on false SPD data by running the BIOS program; wherein the BIOS chip stores a BIOS program, and the BIOS program includes false SPD data; after the memory module chip is initialized, obtaining a baseline SPD data, and burning the baseline SPD data into the memory module chip.

[0016] In some embodiments, before obtaining the baseline SPD data and burning the baseline SPD data into the memory module chip, the method also includes: detecting whether the write protection of the memory module chip is in a closed state; if the write protection of the memory module chip is in a closed state, obtaining the baseline SPD data and burning the baseline SPD data into the memory module chip; otherwise, turning off the write protection of the memory module chip.

[0017] In some embodiments, the detection of whether the write protection of the memory module chip is in a closed state includes: detecting whether the potential state at the connector of the memory module interface is in a grounded state; the connector is set corresponding to the first external pin of the memory module chip inserted into the memory module interface; the first external pin of the memory module chip is connected to the HSA pin of the SPD chip in the memory module chip; if the potential state at the connector is in a grounded state, it is determined that the write protection of the memory module chip is in a closed state; otherwise, it is determined that the write protection of the memory module chip is in an open state.

[0018] In some embodiments, turning off the write protection of the memory module chip includes: sending a control signal for turning off the controllable switch to a control end of the controllable switch; one end of the controllable switch is connected to the connector, and the other end of the controllable switch is grounded.

[0019] In some embodiments, the SPD burning device also includes: a remote device, the processing chip is integrated on the remote device; the test mainboard is also provided with a network card; the network card is connected to the BIOS chip and the memory module interface; the sending of initialization instructions to the BIOS chip includes: sending an initialization instruction to the network card, so that the network card forwards the initialization instruction to the BIOS chip; the burning of the benchmark SPD data into the memory module chip includes: sending a burning instruction to the network card, so that the network card transmits the burning instruction to the memory module chip through the memory module interface, and the memory module chip is used to burn the benchmark SPD data according to the burning instruction; wherein, the burning instruction includes the benchmark SPD data.

[0020] In some embodiments, obtaining the baseline SPD data and burning the baseline SPD data into the memory module chip includes: running the UEFI system according to the UEFI system file; calling the SPD burning program under the UEFI system to obtain the baseline SPD data, and burning the baseline SPD data into the memory module chip.

[0021] In some embodiments, obtaining the benchmark SPD data includes: opening a file system protocol to obtain the benchmark SPD data from an input file; before burning the benchmark SPD data into the memory module chip, it also includes: opening a protocol corresponding to a bus service program, running the bus service program to drive a bus, and the bus is used to transmit the benchmark SPD data to the memory module chip.

[0022] In some embodiments, after obtaining the baseline SPD data and burning the baseline SPD data into the memory module chip, the method also includes: reading the current SPD data in the memory module chip through the memory module interface; comparing whether the current SPD data is consistent with the SPD data in the input file; if they are consistent, outputting a first message indicating that the burning is successful, otherwise, outputting a second message indicating that the burning fails.

[0023] The SPD burning device and method provided by the embodiment of the present disclosure include a test motherboard and a processing chip; the test motherboard is provided with a BIOS chip and a memory module interface; the BIOS chip is connected to the processing chip, the BIOS chip stores a BIOS program, the BIOS program includes false SPD data, the BIOS chip responds to the initialization instruction issued by the processing chip, and initializes the memory module chip inserted into the memory module interface based on the false SPD data by running the BIOS program; the processing chip is connected to the memory module interface, and is used to obtain the reference SPD data after the memory module chip is initialized, and burn the reference SPD data into the memory module chip inserted into the memory module interface. In this solution, the BIOS chip stores a BIOS program including false SPD data, and running the BIOS program can initialize the memory module chip, so that the memory module chip is in a power-on state, so that after the processing chip is initialized, the reference SPD data can be obtained and the reference SPD data can be burned into the memory module chip. Therefore, for different types of memory module chips, the burning of SPD data can be realized without connecting an SPD burner, so the reliability of SPD burning can be further guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 This is an example diagram of the chip manufacturing process;

[0026] Figure 2 A schematic diagram of SPD burning of an example memory module;

[0027] Figure 3 A structural example diagram of an SPD burning device provided by an embodiment;

[0028] Figure 4 The structure diagram of an exemplary SPD burning device is shown in FIG.

[0029] Figure 5 is a structural example diagram of another example SPD burning device;

[0030] Figure 6 A structural diagram of another exemplary SPD burning device;

[0031] Figure 7 A structural diagram of another exemplary SPD burning device;

[0032] Figure 8 This is a flowchart of an SPD burning method provided by an embodiment.

[0033] The above drawings show clear embodiments of the present disclosure, which will be described in more detail below. These drawings and text descriptions are not intended to limit the scope of the present disclosure in any way, but to illustrate the concepts of the present disclosure to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0034] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0035] The terms "including" and "having" in the present disclosure are used to express an open-ended inclusion, and mean that in addition to the listed elements / components / etc., there may be additional elements / components / etc.; the terms "first" and "second" etc. are only used as markings or distinctions, and are not intended to limit the order or quantity of their objects. In addition, the different elements and regions in the drawings are only shown schematically, and are therefore not limited to the sizes or distances shown in the drawings. The technical solution is described in detail below with specific embodiments. The following specific embodiments may be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present disclosure will be described below in conjunction with the accompanying drawings.

[0036] Chip, also known as integrated circuit, or microcircuit, microchip, can be understood as a circuit that is miniaturized. Specifically, a chip is a part of a computer or electronic device that performs calculations, processing tasks, and storage functions, such as memory. Figure 1 This is an example diagram of the chip manufacturing process. Figure 1 As shown, the chip manufacturing process generally includes: chip design, wafer production, packaging production, cost testing and other links.

[0037] In practice, the memory type and capacity supported by the chip are determined by the memory slot. The memory module is the interface of the memory chip, and the number of standard memory slots that the chipset can support can be determined based on the memory module. Exemplarily, the memory module can be a single inline memory module (SIMM), a dual inline memory module (DIMM), a small dual inline memory module (SODIMM), a compression attached memory module (CAMM), etc.

[0038] In actual applications, in order to ensure the reliability of the product, the SPD data needs to be burned into an erasable EEPROM on the memory module before the chip leaves the factory. The SPD data includes the memory module chip and module manufacturer, operating frequency, operating voltage, speed, capacity, voltage, row and column address bandwidth and other parameters.

[0039] In some example technologies, SPD burning of the memory module can be achieved by connecting an SPD burner. Figure 2 A schematic diagram of SPD programming of an exemplary memory module is shown in FIG. Figure 2 As shown, the SPD burner 210 is provided with an interface 211 corresponding to the memory module chip 200, and the memory module chip 200 is connected to the SPD burner 210 by inserting the interface 211 corresponding to the memory module chip 200, and the other end of the SPD burner 210 is connected to the server 220. In actual application, the server 220 runs the SPD burning program, drives the SPD burner 210, and burns the SPD data into the memory module chip 200.

[0040] However, this solution found that when the memory module is SPD burned through the above SPD burning method, although the SPD burner can burn the SPD data into the memory module chip, the SPD burner needs to be set up with an interface adapted to the memory module chip. There are differences between different memory module chips, and the current SPD burner can only be adapted to specific memory modules. Therefore, the SPD burning method of the above solution cannot realize SPD burning of other types of memory modules, especially the SPD burning of the new memory module CAMM, which affects the reliability of SPD burning of the memory module.

[0041] Some aspects of the embodiments of the present disclosure relate to the above considerations. The following is an example introduction of the solution in combination with some embodiments.

[0042] Figure 3The structure of the SPD burning device provided by an embodiment is shown as follows: Figure 3 As shown, the SPD burning device includes: a test motherboard 30 and a processing chip 31; the test motherboard 30 is provided with a BIOS chip 301 and a memory module interface 302;

[0043] The BIOS chip 301 is connected to the processing chip 31. The BIOS chip 301 stores a BIOS program. The BIOS program includes false SPD data. The BIOS chip 301 is used to respond to the initialization instruction issued by the processing chip 31, and initialize the memory module chip 32 inserted into the memory module interface 302 based on the false SPD data by running the BIOS program.

[0044] The processing chip 31 is connected to the memory module interface 302 , and is used to obtain the reference SPD data after the memory module chip 32 is initialized, and burn the reference SPD data into the memory module chip 32 inserted into the memory module interface 302 .

[0045] In practical applications, the SPD programming device provided in this embodiment can be applied to a memory to be programmed, and as an example, can be applied to, including but not limited to, a compression attached memory module (CAMM for short).

[0046] In one example, the processing chip 31 may be a central processing unit (CPU). In this embodiment, the BIOS chip 301 is connected to the processing chip 31. It should be noted that the connection between the BIOS chip 301 and the processing chip 31 may be an electrical connection or a communication connection, which is not limited here. In practice, the BIOS chip 301 is a chip used to test the initialization and detection of various hardware devices during the booting process of the motherboard 30. As an example, the BIOS chip 301 stores a program for testing the initialization and detection of various hardware devices during the booting process of the motherboard 30.

[0047] Among them, the BIOS program is a basic input and output program, including a self-test program after power-on and a system self-start program. In the application process after the chip is manufactured, the chip is integrated into the terminal device, such as various electronic devices, for example, laptops, computers, servers, mobile phones, tablets, etc. In practice, BIOS chips are also integrated into electronic devices, and the BIOS program is stored in the BIOS chip. During the power-on process of the electronic device, the BIOS program is run to obtain SPD data from the memory module chip and initialize the chip.

[0048] It should be noted that the false SPD data is different from the reference SPD data. The false SPD data is low-frequency data, which is used to initialize the memory module chip 32 so that the memory module chip 32 is in a power-on state, which is convenient for subsequently burning the reference SPD data into the memory module chip 32. The reference SPD data is the SPD data that needs to be burned into the memory module chip 32. It can be understood that when the BIOS program in the BIOS chip 301 is running, the memory module chip 301 can be initialized without obtaining the SPD data from the memory module chip 32.

[0049] The form of the false SPD data in the BIOS program is not limited. As an example, the false SPD data can be pre-embedded in the BIOS program when the BIOS program is written. For example, when writing the BIOS program, an SPD table is established, and the false SPD data is stored in the SPD table. The mapping address of the SPD table is pre-embedded in the BIOS program. When the BIOS program is run, the false SPD data is obtained from the SPD table to initialize the memory module chip 32.

[0050] Correspondingly, after the memory module chip 32 is initialized, the memory module chip 32 is in a power-on state, the processing chip 31 obtains the reference SPD data, and burns the SPD data of the SPD reference into the memory module chip 32 inserted into the memory module interface 302 .

[0051] In this embodiment, the test motherboard 30 is provided with a memory module interface 302, and the memory module interface 302 corresponds to the memory module chip 32. In practice, different types of memory module chips 320 have different structures and different memory module interfaces 302. Optionally, the test motherboard 30 is provided with at least one memory module interface 302, and different memory module interfaces 302 correspond to different types of memory module chips 32. By inserting the memory module chip 32 into the memory module interface 302 corresponding to the memory module chip 32, SPD burning of the memory module chip 32 can be achieved.

[0052] Optionally, in an example, the test motherboard 30 is provided with a plurality of memory module interfaces 302 to support SPD burning of a plurality of memory module chips 32. Specifically, each memory module chip 32 is inserted into the memory module interface 302 corresponding to the memory module chip 32, and the BIOS chip 301 responds to the initialization instruction sent by the processing chip 31, runs the BIOS program in the BIOS chip 301, and initializes each memory module chip 32 inserted into the memory module interface 302.

[0053] In practice, different types of memory module chips 32 have different structures, and the baseline SPD data that need to be burned into the memory module chip 32 are different. Specifically, the processing chip 31 obtains the baseline SPD data corresponding to each memory module chip 32, and burns the baseline SPD data corresponding to each memory module chip 32 into the corresponding memory module chip 32.

[0054] In this embodiment, a BIOS program including false SPD data is stored in the BIOS chip. Running the BIOS program can initialize the memory module chip so that the memory module chip is in a power-on state, thereby being able to obtain baseline SPD data after the processing chip is initialized and burn the baseline SPD data into the memory module chip. Therefore, for different types of memory module chips, the SPD data can be burned without connecting an SPD burner, thereby further ensuring the reliability of SPD burning.

[0055] It should be noted that the implementation structure of each chip in this embodiment is not limited. As an example of the structure of the processing chip, in one example, Figure 4 The structure diagram of an exemplary SPD burning device is shown in FIG. Figure 4 As shown, the processing chip 31 is integrated on the above-mentioned test mainboard 30;

[0056] The processing chip 31 is electrically connected to the BIOS chip 301 .

[0057] like Figure 4 As shown, the processing chip 31 is integrated on the test motherboard 30, the processing chip 31 is electrically connected to the BIOS chip, and the processing chip 31 is connected to the memory module interface 302. Specifically, the memory module chip 32 is inserted into the memory module interface 302, and the processing chip 31 sends an initialization instruction to the BIOS chip 301; the BIOS chip 301 responds to the initialization instruction, runs the BIOS program, and initializes the memory module chip 32 inserted into the memory module interface 302 based on the false SPD data in the BIOS program; after the memory module chip is initialized, the processing chip 31 obtains the benchmark SPD data, and transmits the benchmark SPD data to the memory module interface 302, and burns the benchmark SPD data into the memory module chip 32 inserted into the memory module interface 302.

[0058] In this example, the processing chip 31 is integrated on the test mainboard 30, and the test mainboard 30 can realize SPD burning of the memory module chip 32 inserted into the memory module interface 302. Therefore, for different types of memory module chips, SPD data burning can be realized without connecting an SPD burner, so the reliability of SPD burning can be further guaranteed.

[0059] In addition, the SPD burning device also supports a remote control SPD burning method. Optionally, in one example, Figure 5 FIG. 1 is a structural example diagram of another example SPD burning device, such as Figure 5 As shown, the SPD burning device also includes: a remote device 50, the processing chip 31 is integrated on the remote device 50; the test motherboard 30 is also provided with a network card 303; the network card 303 is connected to the BIOS chip 301 and the memory module interface 302;

[0060] The network card 303 is used to receive the initialization instruction and the burning instruction sent by the processing chip 31, and the burning instruction includes the SPD data of the reference;

[0061] The BIOS chip 301 is used to respond to the initialization instruction forwarded by the network card 303, and initialize the memory module chip 32 inserted into the memory module interface 302 based on the false SPD data by running the BIOS program;

[0062] The memory module interface 302 is used to transmit the burning instruction forwarded by the network card 303 to the memory module chip 32 connected to the memory module interface 302, so that the memory module chip 32 burns the reference SPD data according to the burning instruction.

[0063] In this example, the network card 303 supports network booting. As an example, the network card 303 supports the Pre-boot Execution Environment (PXE). Specifically, the remote device 50 can be an intelligent device, such as a server, a computer, a laptop computer, a tablet computer, etc. The remote device 50 can be connected to the network card 303 through a local area network (LAN), a wide area network (WAN), a wireless local area network (WLAN), or other networks.

[0064] Specifically, the initialization process of the memory module chip 32 includes: the network card 303 receives the initialization instruction sent by the processing chip 31 integrated in the remote device 50, the network card 303 forwards the initialization instruction to the BIOS chip 301, the BIOS chip 301 runs the BIOS program, obtains false SPD data, and initializes the memory module chip 32 inserted into the above-mentioned memory module interface 302 based on the false SPD data.

[0065] Correspondingly, the SPD burning process of the memory module chip 32 includes: after the memory module chip 32 is initialized, the network card 303 receives the burning instruction sent by the processing chip 31 integrated in the remote device 50, the network card 303 forwards the burning instruction to the memory module interface 302, the memory module interface 302 transmits the burning instruction to the memory module chip 32 inserted into the memory module interface 302, the memory module chip 32 obtains the benchmark SPD data from the burning instruction and burns the benchmark SPD data.

[0066] In this example, the processing chip 31 is integrated on the remote device 50, and the test mainboard 30 is connected to the processing chip 31 on the remote device 50 through the network card 303. The processing chip 31 sends initialization instructions and burning instructions to the network card 303 to realize SPD burning of the memory module chip 32 inserted into the memory module interface 302. Therefore, for different types of memory module chips, SPD data can be burned without connecting an SPD burner, so the reliability of SPD burning can be further guaranteed.

[0067] Optionally, in one example, Figure 6 FIG. 4 is a structural example diagram of another exemplary SPD burning device, such as Figure 6 As shown, the memory module interface 302 includes: a connector 3021;

[0068] The above-mentioned connecting piece 3021 is set corresponding to the first external pin 321 of the memory module chip 32 inserted into the above-mentioned memory module interface 302; the first external pin 321 of the memory module chip 32 is connected to the HSA pin 323 of the SPD chip 322 in the memory module chip 32.

[0069] In this example, the SPD chip 322 is used to store the reference SPD data, and burning the reference SPD data into the memory module chip 32 is essentially burning the reference SPD data into the SPD chip 322 in the memory module chip 32. Among them, the HSA pin 323 of the SPD chip 322 is used to burn the reference SPD data into the SPD chip 322.

[0070] Among them, the connecting piece 3021 is set corresponding to the first external pin 321 of the memory module chip 32. For example, the first external pin 321 of the memory module chip 32 is a metal sheet, and the connecting piece 3021 is a metal slot; for another example, the first external pin 321 of the memory module chip 32 is a slot, and the connecting piece 3021 is a metal sheet.

[0071] Specifically, the first external pin 321 of the memory module chip 32 is inserted into the memory module interface 302, and the connector 3021 is connected to the HSA pin 323 of the SPD chip 322 in the memory module chip 32 through the first external pin 321 of the memory module chip 32. After the memory module interface 302 obtains the reference SPD data, the reference SPD data is burned into the SPD chip 322 in the memory module chip 32 through the connector 3021.

[0072] In this example, the memory module interface 302 includes a connector 3021 corresponding to the first external pin 321 of the memory module chip 32. When the memory module chip 32 is inserted into the memory module interface 302, the connector 3021 is connected to the HSA pin 323 of the SPD chip 322 in the memory module chip 32 through the first external pin 321 of the memory module chip 32, so that the benchmark SPD data can be burned into the SPD chip 322 in the memory module chip 32, that is, the SPD burning of the memory module chip 32 inserted into the memory module interface 302 is realized. Therefore, for different types of memory module chips, the SPD data can be burned without connecting an SPD burner, so the reliability of SPD burning can be further guaranteed.

[0073] In actual applications, in order to prevent the SPD data in the memory module chip 32 from being modified, a write protection function of the memory module chip 32 is set. When the write protection of the memory module chip 32 is turned on, data cannot be written into the memory module chip 32; only when the write protection of the memory module chip 32 is turned off, data can be written into the memory module chip 32. Accordingly, before the processing chip 31 burns the reference SPD data into the memory module chip 32 inserted into the memory module interface 302, the write protection of the memory module chip 32 needs to be turned off first. Optionally, in one example, Figure 7 FIG. 4 is a structural example diagram of another exemplary SPD burning device, such as Figure 7 As shown, the above-mentioned test mainboard 30 includes: a switch 304;

[0074] One end of the switch 304 is connected to the connector 3021, and the other end of the switch 304 is grounded. The switch 304 is used to be disconnected when the write protection of the memory module chip 32 is turned on; and to be turned on when the write protection of the memory module chip 32 is turned off.

[0075] In combination with the above example, the HSA pin 323 is connected to the connector 3021 through the first external pin 321, and the HSA pin 323 is used to burn the reference SPD data into the SPD chip 322. In one example, the connector 3021 is connected to the bus, and the processing chip 31 drives the bus to burn the reference SPD data into the SPD chip 322. In practice, the bus includes multiple addresses, and an address of the bus can be set for SPD burning. For example, the bus address 000 is used for SPD burning.

[0076] In practice, the HSA pin 323 is an external pin of the SPD chip 322. By controlling whether the HSA pin is directly grounded, the connection address between the HSA pin 323 and the bus is adjusted. For example, when the HSA pin 323 is directly grounded, the connection address between the HSA pin 323 and the bus is 000, and when the HSA pin 323 is not directly grounded, the connection address between the HSA pin 323 and the bus is 001.

[0077] Specifically, when the HSA pin 323 is directly grounded, the HSA pin 323 is connected to the bus address 000, and the reference SPD data can be burned into the SPD chip 322 through the HSA pin 323, that is, the write protection of the memory module chip 32 is turned off. Correspondingly, when the HSA pin 323 is not directly grounded, the HSA pin 323 is connected to the bus address 001, and the reference SPD data cannot be burned into the SPD chip 322 through the HSA pin 323, that is, the write protection of the memory module chip 32 is turned on.

[0078] In combination with the above example, the memory module chip 32 is inserted into the memory module interface 302, and the connector 3021 is connected to the HSA pin 323 of the SPD chip 322 in the memory module chip 32 via the first external pin 321 of the memory module chip 32. Specifically, except for the time when the benchmark SPD data needs to be burned into the memory module chip 32, it is necessary to turn on the write protection of the memory module chip 32, turn off the switch 304, and the connector 3021 is not directly, so that the HSA pin 323 of the SPD chip 322 is not directly, and the write protection of the memory module chip 32 is turned on. Correspondingly, after the memory module chip 32 is initialized, it is necessary to turn off the write protection of the memory module chip 32, turn on the switch 304, and the connector 3021 is directly, so that the HSA pin 323 of the SPD chip 322 is directly, and the write protection of the memory module chip 32 is turned off, and then, the benchmark SPD data can be burned into the memory module chip 32.

[0079] In this example, a switch 304 is set on the test motherboard 30. By controlling the conduction or disconnection of the switch 304, the write protection of the memory module chip 32 can be turned on or off, which can prevent the SPD data in the memory module chip 32 from being modified and further ensure the reliability of SPD burning.

[0080] It should be noted that the type of the switch 304 in this embodiment is not limited. Optionally, in an example, the switch 304 includes a dip switch; the test mainboard 30 also includes: a first resistor;

[0081] The movable end of the DIP switch is connected to the connecting member 3021, the first fixed end of the DIP switch is connected to one end of the first resistor, and the second fixed end of the DIP switch is grounded;

[0082] The other end of the first resistor is grounded.

[0083] Specifically, except for the time when the benchmark SPD data needs to be burned into the memory module chip 32, it is necessary to turn on the write protection of the memory module chip 32, connect the moving end of the dip switch to the first fixed end, and connect the first resistor in series with the connector 3021 to the ground. Thus, the HSA pin 323 of the SPD chip 322 is not directly connected, and the write protection of the memory module chip 32 is turned on.

[0084] Correspondingly, after the memory module chip 32 is initialized, it is necessary to turn off the write protection of the memory module chip 32, connect the moving end of the dip switch to the second fixed end, and the connector 3021 directly, so that the HSA pin 323 of the SPD chip 322 is directly connected, and the write protection of the memory module chip 32 is turned off, and then, the benchmark SPD data can be burned into the memory module chip 32.

[0085] In this example, by connecting the moving end of the dip switch to the first moving end of the dip switch or the first moving end of the dip switch, the write protection of the memory module chip 32 can be turned on or off, which can prevent the SPD data in the memory module chip 32 from being modified and further ensure the reliability of SPD burning.

[0086] Optionally, in an example, the switch 304 includes a jumper cap; the test mainboard 30 further includes: a second resistor, a first pin, a second pin, and a third pin;

[0087] One end of the second resistor is connected to the first pin, and the other end of the second resistor is grounded;

[0088] The second pin is connected to the connector 3021; ​​the third pin is grounded;

[0089] When the write protection of the memory module chip 32 is turned on, one end of the jumper cap is inserted into the first pin, and the other end of the jumper cap is inserted into the second pin; and, when the write protection of the memory module chip 32 is turned off, one end of the jumper cap is inserted into the third pin, and the other end of the jumper cap is inserted into the second pin.

[0090] Specifically, except for the time when the benchmark SPD data needs to be burned into the memory module chip 32, it is necessary to turn on the write protection of the memory module chip 32, insert one end of the jumper cap into the first pin, insert the other end of the jumper cap into the second pin, and connect the second resistor in series with the connector 3021 to the ground. Therefore, the HSA pin 323 of the SPD chip 322 is not directly connected, and the write protection of the memory module chip 32 is turned on.

[0091] Correspondingly, after the memory module chip 32 is initialized, it is necessary to turn off the write protection of the memory module chip 32, insert one end of the jumper cap into the third pin, insert the other end of the jumper cap into the second pin, and directly connect the connector 3021, thereby directly connecting the HSA pin 323 of the SPD chip 322, and turning off the write protection of the memory module chip 32. Then, the baseline SPD data can be burned into the memory module chip 32.

[0092] In this example, by inserting a jumper cap into a blocked pin, the write protection of the memory module chip 32 can be turned on or off, thereby preventing the SPD data in the memory module chip 32 from being modified and further ensuring the reliability of SPD burning.

[0093] Optionally, in one example, the switch 304 includes a controllable switch;

[0094] One end of the controllable switch is connected to the connector 3021 , and the other end of the controllable switch is grounded. The control end of the controllable switch receives a control signal sent by the processing chip 31 , and the controllable switch is used to turn on or off in response to the control signal.

[0095] Among them, the controllable switch is an electrical signal controlled switch. As an example, the control end of the controllable switch is turned on in response to a control signal in a high level state, and is turned off in response to a control signal in a low level state. Specifically, after the memory module chip 32 is initialized, it is necessary to turn off the write protection of the memory module chip 32, and the processing chip 31 sends a control signal in a high level state to the control end of the controllable switch. The controllable switch responds to the control signal in a high level state. The controllable switch is turned on in response to the control signal, and the connector 3021 is directly connected, thereby directly connecting the HSA pin 323 of the SPD chip 322, and the write protection of the memory module chip 32 is turned off, and then, the benchmark SPD data can be burned into the memory module chip 32.

[0096] Correspondingly, except for the time when the benchmark SPD data needs to be burned into the memory module chip 32, the write protection of the memory module chip 32 needs to be turned on, and the processing chip 31 sends a control signal in a low level state to the control end of the controllable switch, and the controllable switch responds to the control signal in a low level state. The controllable switch disconnects in response to the control signal, and the connector 3021 is not directly, thereby, the HSA pin 323 of the SPD chip 322 is not directly, and the write protection of the memory module chip 32 is turned on.

[0097] In combination with the above examples, the processing chip 31 can be integrated on the test mainboard 30, and the processing chip 31 can also be integrated on the remote device 50. The connection method between the processing chip 31 and the controllable switch is described as follows. Specifically, when the processing chip 31 is integrated on the test mainboard 30, the control end of the controllable switch is electrically connected to the processing chip 31. As an example, the electrical connection between the control end of the controllable switch and the processing chip 31 can be achieved through a wire or metal wiring. Correspondingly, when the processing chip 31 is integrated on the remote device 50, the control end of the controllable switch is connected to the network card 303, and the control end of the controllable switch is connected to the network of the processing chip 31 through the network card 303.

[0098] In this example, the controllable switch is turned on or off in response to the control signal sent by the processing chip 31, thereby controlling the opening or closing of the write protection of the memory module chip 32, which can prevent the SPD data in the memory module chip 32 from being modified and further ensure the reliability of SPD burning.

[0099] Optionally, in one example, the processing chip 31 includes: a memory and a processor;

[0100] The memory is used to store UEFI system files and SPD burning programs;

[0101] The processor is used to read the UEFI system file from the memory and run the UEFI system according to the UEFI system file; and, under the UEFI system, call the SPD burning program in the memory to obtain the benchmark SPD data, and burn the benchmark SPD data into the memory module chip 32.

[0102] Among them, UEFI refers to a unified extensible firmware interface, and the SPD burning program can be called in the UEFI system. Specifically, the UEFI system is run, the SPD burning program is called in the UEFI system, the benchmark SPD data is obtained, and the hardware device is driven to write the benchmark SPD data into the memory module chip 32. As an example, the memory module interface 302 is connected to the bus, the memory module chip 32 is inserted into the memory module interface 302, and the processing chip 31 obtains the benchmark SPD data after the memory module chip 32 is initialized, and drives the bus to burn the benchmark SPD data into the memory module chip 32 through the bus.

[0103] In combination with the above example, when the processing chip 31 is integrated on the test motherboard 30, the processing chip 31 is connected to the memory module interface 302. Specifically, after the memory module chip 32 is initialized, the processor runs the UEFI system, calls the SPD burning program in the memory, drives the bus connected to the memory module interface 302, and burns the benchmark SPD data into the memory module chip 32.

[0104] Correspondingly, when the processing chip 31 is integrated on the remote device 50, the processing chip 31 is connected to the memory module interface 302 through the network card 303, and the processor calls the SPD burning program in the UEFI system, which can drive the hardware device connected to the memory module interface 302 to write the benchmark SPD data into the memory module chip 32. Specifically, after the memory module chip 32 is initialized, the processor runs the UEFI system of the remote device 50, calls the SPD burning program in the UEFI system, obtains the benchmark SPD data, and encapsulates the benchmark SPD data into the burning instruction. The processing chip 31 sends the burning instruction to the network card 303 through the network, and the network card 303 forwards the burning instruction to the memory module interface 302, drives the hardware device connected to the memory module interface 302, and writes the benchmark SPD data into the memory module chip 32.

[0105] In this example, after the memory module chip 32 is initialized, the processor obtains the UEFI system file and the SPD burning program from the memory, runs the UEFI system, and calls the SPD burning program in the UEFI system, so as to burn the SPD data into the memory module chip 32.

[0106] The SPD burning device provided in this embodiment includes a test motherboard and a processing chip; the test motherboard is provided with a BIOS chip and a memory module interface; the BIOS chip is connected to the processing chip, the BIOS chip stores a BIOS program, the BIOS program includes false SPD data, the BIOS chip responds to the initialization instruction issued by the processing chip, and initializes the memory module chip inserted into the memory module interface based on the false SPD data by running the BIOS program; the processing chip is connected to the memory module interface, and is used to obtain the reference SPD data after the memory module chip is initialized, and burn the reference SPD data into the memory module chip inserted into the memory module interface. In this solution, the BIOS chip stores a BIOS program including false SPD data, and running the BIOS program can initialize the memory module chip, so that the memory module chip is in the power-on state, so that the reference SPD data can be obtained after the processing chip is initialized, and the reference SPD data can be burned into the memory module chip. Therefore, for different types of memory module chips, the burning of SPD data can be realized without connecting an SPD burner, so the reliability of SPD burning can be further guaranteed.

[0107] Figure 8 The flowchart of the SPD burning method provided by an embodiment is applied to a processing chip in an SPD burning device. The SPD burning device includes: a test motherboard and a processing chip. The test motherboard is provided with a BIOS chip and a memory module interface; Figure 8 As shown, the SPD burning method includes:

[0108] Step 801: sending an initialization instruction to a BIOS chip, so that the BIOS chip responds to the initialization instruction and initializes the memory module chip inserted into the memory module interface based on false SPD data by running the BIOS program; wherein the BIOS chip stores the BIOS program, and the BIOS program includes the false SPD data;

[0109] Step 802: Obtain benchmark SPD data, and burn the benchmark SPD data into the memory module chip.

[0110] Among them, the BIOS program is a basic input and output program, including a self-test program after power-on and a system self-start program. In the application process after the chip is manufactured, the chip is integrated into the terminal device, such as various electronic devices, for example, laptops, computers, servers, mobile phones, tablets, etc. In practice, BIOS chips are also integrated into electronic devices, and the BIOS program is stored in the BIOS chip. During the power-on process of the electronic device, the BIOS program is run to obtain SPD data from the memory module chip and initialize the chip.

[0111] It should be noted that the false SPD data is different from the reference SPD data. The false SPD data is low-frequency data, which is used to initialize the memory module chip so that the memory module chip is in the power-on state, which is convenient for the subsequent burning of the reference SPD data into the memory module chip. The reference SPD data is the SPD data that needs to be burned into the memory module chip. It can be understood that when the BIOS program in the BIOS chip is running, the memory module chip can be initialized without obtaining the SPD data from the memory module chip.

[0112] The form of the false SPD data in the BIOS program is not limited. As an example, the false SPD data can be pre-embedded in the BIOS program when the BIOS program is written. For example, when writing the BIOS program, an SPD table is established, and the false SPD data is stored in the SPD table. The mapping address of the SPD table is pre-embedded in the BIOS program. When the BIOS program is run, the false SPD data is obtained from the SPD table to initialize the memory module chip.

[0113] Correspondingly, after the memory module chip is initialized, the memory module chip is in a power-on state, the benchmark SPD data is obtained, and the SPD data of the SPD benchmark is burned into the memory module chip inserted into the memory module interface.

[0114] In this embodiment, the test mainboard is provided with a memory module interface, and the memory module interface corresponds to the memory module chip. In practice, different types of memory module chips have different structures and different memory module interfaces. Optionally, the test mainboard is provided with at least one memory module interface, and different memory module interfaces correspond to different types of memory module chips. By inserting the memory module chip into the memory module interface corresponding to the memory module chip, SPD burning of the memory module chip can be realized.

[0115] Optionally, in one example, the test motherboard is provided with multiple memory module interfaces to support SPD burning of multiple memory module chips. Specifically, each memory module chip is inserted into the memory module interface corresponding to the memory module chip, and the BIOS chip responds to the initialization instruction, runs the BIOS program in the BIOS chip, and initializes each memory module chip inserted into the memory module interface.

[0116] In practice, different types of memory module chips have different structures, and the baseline SPD data that needs to be burned into the memory module chips is different. Specifically, the baseline SPD data corresponding to each memory module chip is obtained, and the baseline SPD data corresponding to each memory module chip is burned into the corresponding memory module chip.

[0117] In this embodiment, a BIOS program including false SPD data is stored in the BIOS chip. Running the BIOS program can initialize the memory module chip so that the memory module chip is in a power-on state, thereby being able to obtain baseline SPD data after the processing chip is initialized and burn the baseline SPD data into the memory module chip. Therefore, for different types of memory module chips, the SPD data can be burned without connecting an SPD burner, thereby further ensuring the reliability of SPD burning.

[0118] In practical applications, in order to further ensure the reliability of SPD burning, before obtaining the reference SPD data and burning the reference SPD data into the memory module chip, it is possible to detect whether the write protection of the memory module chip is in a closed state. Optionally, in an example, before the above step 802, the above SPD burning method further includes:

[0119] Check whether the write protection of the memory module chip is in the off state;

[0120] If the write protection of the memory module chip is in a closed state, the benchmark SPD data is obtained and the benchmark SPD data is burned into the memory module chip; otherwise, the write protection of the memory module chip is closed.

[0121] In actual applications, when the write protection of the memory module chip is in the off state, the memory module interface is directly grounded; when the write protection of the memory module chip is in the on state, the memory module interface is not directly grounded. Therefore, by detecting whether the memory module interface is directly grounded, it can be determined whether the write protection state of the memory module chip is in the off state.

[0122] As an example, when the write protection of the memory module chip is in the on state, the memory module interface is connected to the ground through a series resistor; when the write protection of the memory module chip is in the off state, the memory module interface is directly connected to the ground without a series resistor. Specifically, the resistance between the memory module interface and the ground is detected. If the resistance is 0, it means that the memory module interface is directly connected to the ground and the write protection of the memory module chip is in the off state. Correspondingly, the resistance between the memory module interface and the ground is detected. If the resistance is not 0, it means that the memory module interface is not directly connected to the ground and the write protection of the memory module chip is in the on state.

[0123] In this example, before obtaining the benchmark SPD data and burning the benchmark SPD data into the memory module chip, check whether the write protection of the current memory module chip is in the off state. When ensuring that the write protection of the memory module chip is in the off state, obtain the benchmark SPD data and burn the benchmark SPD data into the memory module chip to ensure the reliability of SPD burning.

[0124] Optionally, in an example, the above-mentioned detecting whether the write protection of the memory module chip is in a closed state includes:

[0125] Detect whether the potential state at the connector of the memory module interface is in a grounding state; the connector is set corresponding to the first external pin of the memory module chip inserted into the memory module interface; the first external pin of the memory module chip is connected to the HSA pin of the SPD chip in the memory module chip;

[0126] If the potential state at the connection piece is in a grounding state, it is determined that the write protection of the memory module chip is in a closed state; otherwise, it is determined that the write protection of the memory module chip is in an open state.

[0127] In this example, the SPD chip is used to store the baseline SPD data, and burning the baseline SPD data into the memory module chip is essentially burning the baseline SPD data into the SPD chip in the memory module chip. Among them, the HSA pin of the SPD chip is used to burn the baseline SPD data into the SPD chip. In practice, when the HSA pin is directly grounded, the write protection of the memory module chip is in the off state, and correspondingly, when the HSA pin is not directly grounded, the write protection of the memory module chip is in the on state.

[0128] The connector is set corresponding to the first external pin of the memory module chip. Specifically, the first external pin of the memory module chip is inserted into the memory module interface, and the connector is connected to the HSA pin of the SPD chip in the memory module chip through the first external pin of the memory module chip. After the memory module interface obtains the reference SPD data, the reference SPD data is burned into the SPD chip in the memory module chip through the connector.

[0129] Therefore, it is possible to determine whether the write protection state of the memory module chip is in the on state by detecting whether the potential state of the connector of the memory module interface is in the grounding state. Specifically, if the potential state of the connector of the memory module interface is detected to be in the grounding state, it means that the HSA pin of the SPD chip is directly grounded, and the write protection of the memory module chip is determined to be in the off state; correspondingly, if the potential state of the connector of the memory module interface is detected to be not in the grounding state, it means that the HSA pin of the SPD chip is not directly grounded, and the write protection of the memory module chip is determined to be in the on state.

[0130] In this example, before obtaining the benchmark SPD data and burning the benchmark SPD data into the memory module chip, it is determined whether the write protection of the current memory module chip is in the off state by detecting whether the potential state at the connector of the memory module interface is in the grounded state. When it is ensured that the write protection of the memory module chip is in the off state, the benchmark SPD data can be obtained and burned into the memory module chip to ensure the reliability of SPD burning.

[0131] In practice, the write protection of the memory module chip can be turned off by a switch. As an example, the switch can be a manual switch, such as a dip switch, a key cap, etc.; the switch can also be a controllable switch. Specifically, for the manual switch, before obtaining the benchmark SPD data and burning the benchmark SPD data into the memory module chip, it is detected that the write protection of the memory module chip is in the on state, and the write protection of the memory module chip is turned off by the manual switch.

[0132] Correspondingly, for the controllable switch, before obtaining the reference SPD data and burning the reference SPD data into the memory module chip, it is detected that the write protection of the memory module chip is in the on state, and the controllable switch turns off the write protection of the memory module chip in response to the control signal. Optionally, in an example, turning off the write protection of the memory module chip includes:

[0133] A control signal for turning off the controllable switch is sent to the control end of the controllable switch; one end of the controllable switch is connected to the connecting piece, and the other end of the controllable switch is grounded.

[0134] Among them, the controllable switch is an electrical signal control switch. As an example, the control end of the controllable switch is turned on in response to a control signal in a high level state, and is turned off in response to a control signal in a low level state. Specifically, after the memory module chip is initialized, it is necessary to turn off the write protection of the memory module chip, send a control signal in a high level state to the control end of the controllable switch, and the controllable switch responds to the control signal in a high level state. The controllable switch is turned on in response to the control signal, and the connector is directly connected, so that the HSA pin of the SPD chip is directly connected, and the write protection of the memory module chip is turned off, and then, the benchmark SPD data can be burned into the memory module chip.

[0135] Correspondingly, except for the time when the benchmark SPD data needs to be burned into the memory module chip 32, it is necessary to turn on the write protection of the memory module chip, send a control signal in a low level state to the control end of the controllable switch, and the controllable switch responds to the control signal in a low level state. The controllable switch disconnects in response to the control signal, and the connector is not directly connected, thereby, the HSA pin of the SPD chip is not directly connected, and the write protection of the memory module chip is turned on.

[0136] In this example, the controllable switch is turned on or off in response to the control signal to realize the control of opening or closing the write protection of the memory module chip, which can prevent the SPD data in the memory module chip from being modified and further ensure the reliability of SPD burning.

[0137] It should be noted that the SPD burning method in this embodiment can be a proximal control SPD burning method, and correspondingly, the processing chip can be integrated on the test motherboard. Specifically, the memory module chip is inserted into the memory module interface and sends an initialization instruction to the BIOS chip; the BIOS chip responds to the initialization instruction, runs the BIOS program, and initializes the memory module chip inserted into the memory module interface based on the false SPD data in the BIOS program; after the memory module chip is initialized, the benchmark SPD data is obtained, and the benchmark SPD data is transmitted to the memory module interface, and the benchmark SPD data is burned into the memory module chip inserted into the memory module interface.

[0138] In addition, the SPD burning method in this embodiment can be a remote control SPD burning method. Optionally, in an example, the SPD burning device further includes: a remote device, a processing chip integrated on the remote device; the test mainboard is also provided with a network card; the network card is connected to the BIOS chip and the memory module interface; sending an initialization instruction to the BIOS chip in the above step 801 includes:

[0139] Sending an initialization instruction to the network card so that the network card forwards the initialization instruction to the BIOS chip;

[0140] Step 802 burns the reference SPD data into the memory module chip, including:

[0141] Send a burning instruction to the network card so that the network card transmits the burning instruction to the memory module chip through the memory module interface, and the memory module chip is used to burn the reference SPD data according to the burning instruction; wherein the burning instruction includes the reference SPD data.

[0142] In this example, the network card supports network booting, and the remote device can be connected to the network card through the network. Specifically, the initialization process of the memory module chip includes: the network card receives the initialization instruction, the network card forwards the initialization instruction to the BIOS chip, the BIOS chip runs the BIOS program, obtains false SPD data, and initializes the memory module chip inserted into the above memory module interface based on the false SPD data.

[0143] Correspondingly, the SPD burning process of the memory module chip includes: after the memory module chip is initialized, the network card receives the burning instruction, the network card forwards the burning instruction to the memory module interface, the memory module interface transmits the burning instruction to the memory module chip inserted into the memory module interface, the memory module chip obtains the baseline SPD data from the burning instruction and burns the baseline SPD data.

[0144] In this example, the processing chip is integrated on the remote device. The test mainboard is connected to the processing chip on the remote device through the network card. The processing chip sends initialization instructions and burning instructions to the network card to realize SPD burning of the memory module chip inserted into the memory module interface. Therefore, for different types of memory module chips, SPD data can be burned without connecting an SPD burner, so the reliability of SPD burning can be further guaranteed.

[0145] Optionally, in an example, the step 802 includes:

[0146] Run the UEFI system according to the UEFI system file;

[0147] In the UEFI system, the SPD burning program is called to obtain the baseline SPD data, and the baseline SPD data is burned into the memory module chip.

[0148] Among them, UEFI refers to the unified extensible firmware interface, and the SPD burning program can be called in the UEFI system. Specifically, run the UEFI system, call the SPD burning program in the UEFI system, obtain the baseline SPD data, and drive the hardware device to write the baseline SPD data into the memory module chip. As an example, the memory module interface is connected to the bus, the memory module chip is inserted into the memory module interface, and the processing chip obtains the baseline SPD data after the memory module chip is initialized, and drives the bus to burn the baseline SPD data into the memory module chip through the bus.

[0149] In combination with the above example, when the processing chip is integrated on the test motherboard, the processing chip is connected to the memory module interface. Specifically, after the memory module chip is initialized, the UEFI system is run, the SPD burning program is called, the bus connected to the memory module interface is driven, and the benchmark SPD data is burned into the memory module chip.

[0150] Correspondingly, when the processing chip is integrated on a remote device, it is connected to the memory module interface through a network card, and the SPD burning program is called in the UEFI system, which can drive the hardware device connected to the memory module interface to write the benchmark SPD data into the memory module chip. Specifically, after the memory module chip is initialized, the UEFI system on the remote device side is run, and the SPD burning program is called in the UEFI system to obtain the benchmark SPD data, encapsulate the benchmark SPD data into the burning instruction, and send the burning instruction to the network card through the network. The network card forwards the burning instruction to the memory module interface, drives the hardware device connected to the memory module interface, and writes the benchmark SPD data into the memory module chip.

[0151] In this example, after the memory module chip is initialized, the UEFI system file and the SPD burning program are obtained, the UEFI system is run according to the UEFI system file, and the SPD burning program is called in the UEFI system, so that the SPD data can be burned into the memory module chip.

[0152] Optionally, in an example, obtaining the benchmark SPD data in step 802 includes:

[0153] Open the file system protocol and obtain the benchmark SPD data from the input file;

[0154] Before burning the reference SPD data into the memory module chip in the above step 802, the following steps are also included:

[0155] Open the protocol corresponding to the bus service program and run the bus service program to drive the bus, which is used to transmit the benchmark SPD data to the memory module chip.

[0156] The file system protocol is used to obtain the input file. As an example, the file system protocol includes the address of the input file, the transmission method of the input file, etc. Specifically, the file system protocol is opened to obtain the input file, the input file includes the SPD table, and the benchmark SPD data corresponding to the memory module chip is obtained from the SPD table.

[0157] In practice, the bus is connected to the memory module interface, and after the memory module chip is inserted into the memory module interface, the bus is connected to the memory module chip. Specifically, based on the protocol corresponding to the bus service program, the bus service program is run to drive the bus, and the bus transmits the reference SPD data to the memory module chip, thereby achieving the goal of burning the reference SPD data into the memory module chip.

[0158] In this example, after the memory module chip is initialized, the benchmark SPD data is obtained from the input file by opening the file system protocol, and the bus service program is run to drive the bus to transfer the benchmark SPD data to the memory module chip, so that the SPD data can be burned into the memory module chip.

[0159] In practical applications, in order to further ensure the accuracy of SPD burning, after obtaining the benchmark SPD data and burning the benchmark SPD data into the memory module chip, the current SPD data in the memory module chip can be detected. Optionally, in an example, after step 802, the above SPD burning method further includes:

[0160] Read the current SPD data in the memory module chip through the memory module interface;

[0161] Compare the current SPD data with the SPD data in the input file to see if they are consistent;

[0162] If they are consistent, a first message indicating that the burning is successful is output; otherwise, a second message indicating that the burning is failed is output.

[0163] In this example, the first message and the second message include but are not limited to numerical values, for example, the first message is numerical value 1, and the second message is numerical value 0. Optionally, the first message and the second message may also be text displays, for example, the first message indicates that the burning is successful, and the second message indicates that the burning fails.

[0164] In combination with the above example, when the processing chip is integrated on the test motherboard, after the benchmark SPD data is burned into the memory module chip, the processing chip directly reads the current SPD data in the memory module chip through the memory module interface; compares the current SPD data with the SPD data in the input file to see if they are consistent, and outputs the comparison result.

[0165] Correspondingly, when the processing chip is integrated on a remote device, the processing chip reads the current SPD data in the memory module chip through the memory module interface via the network card; compares the current SPD data with the SPD data in the input file to see if they are consistent, and outputs the comparison result.

[0166] Optionally, in an example, after the second message indicating that the burning failed is output, the above SPD burning process is performed again until the first message indicating that the burning is successful is output.

[0167] In this example, after obtaining the benchmark SPD data and burning the benchmark SPD data into the memory module chip, by comparing the current SPD data in the memory module chip with the SPD data in the input file, it is possible to determine whether the accurate SPD data is burned into the memory module chip, thereby improving the accuracy of SPD burning.

[0168] In the SPD burning method provided in this embodiment, an initialization instruction is sent to the BIOS chip so that the BIOS chip responds to the initialization instruction, and the memory module chip inserted into the memory module interface is initialized based on the false SPD data by running the BIOS program; wherein the BIOS program is stored in the BIOS chip, and the BIOS program includes false SPD data; the benchmark SPD data is obtained, and the benchmark SPD data is burned into the memory module chip. In this solution, the BIOS chip stores a BIOS program including false SPD data, and running the BIOS program can initialize the memory module chip so that the memory module chip is in the power-on state, so that after the processing chip is initialized, the benchmark SPD data can be obtained and the benchmark SPD data can be burned into the memory module chip. Therefore, for different types of memory module chips, the SPD data can be burned without connecting the SPD burner, so the reliability of SPD burning can be further guaranteed.

[0169] In the description of the embodiments of the present disclosure, it should be understood that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, or it can be indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances. The orientation or position relationship indicated by the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure. In the description of the present disclosure, the meaning of "multiple" is two or more, unless otherwise precisely and specifically specified.

[0170] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present disclosure described herein, for example, can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0171] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An SPD burning device, characterized in that: The SPD burning device comprises: a test mainboard and a processing chip; the test mainboard is provided with a BIOS chip and a memory module interface; The BIOS chip is connected to the processing chip, the BIOS chip stores a BIOS program, the BIOS program includes false SPD data, and the BIOS chip is used to respond to an initialization instruction issued by the processing chip, and initialize the memory module chip inserted into the memory module interface based on the false SPD data by running the BIOS program; The processing chip is connected to the memory module interface, and is used to obtain the reference SPD data after the memory module chip is initialized, and burn the reference SPD data into the memory module chip inserted into the memory module interface.

2. The SPD burning device according to claim 1, characterized in that: The processing chip is integrated on the test mainboard; The processing chip is electrically connected to the BIOS chip.

3. The SPD burning device according to claim 1, characterized in that: The SPD burning device also includes: a remote device, the processing chip is integrated on the remote device; the test mainboard is also provided with a network card; the network card is connected to the BIOS chip and the memory module interface; The network card is used to receive the initialization instruction and the burning instruction sent by the processing chip, and the burning instruction includes the SPD data of the reference; The BIOS chip is used to initialize the memory module chip inserted into the memory module interface based on the false SPD data by running the BIOS program in response to the initialization instruction forwarded by the network card; The memory module interface is used to transmit the burning instruction forwarded by the network card to the memory module chip connected to the memory module interface, so that the memory module chip burns the reference SPD data according to the burning instruction.

4. The SPD burning device according to claim 1, characterized in that: The memory module interface includes: a connector; The connector is arranged corresponding to the first external pin of the memory module chip inserted into the memory module interface; the first external pin of the memory module chip is connected to the HSA pin of the SPD chip in the memory module chip.

5. The SPD burning device according to claim 4, characterized in that: The test mainboard includes: a switch; One end of the switch is connected to the connector, and the other end of the switch is grounded. The switch is used to be disconnected when the write protection of the memory module chip is turned on; and to be turned on when the write protection of the memory module chip is turned off.

6. The SPD burning device according to claim 5, characterized in that: The switch comprises a dip switch; The test mainboard further includes: a first resistor; The movable end of the dip switch is connected to the connecting member, the first fixed end of the dip switch is connected to one end of the first resistor, and the second fixed end of the dip switch is grounded; The other end of the first resistor is grounded.

7. The SPD burning device according to claim 5, characterized in that: The switch includes a jumper cap; The test mainboard also includes: a second resistor, a first pin, a second pin and a third pin; One end of the second resistor is connected to the first pin, and the other end of the second resistor is grounded; The second pin is connected to the connector; the third pin is grounded; When the write protection of the memory module chip is turned on, one end of the jumper cap is inserted into the first pin, and the other end of the jumper cap is inserted into the second pin; and, when the write protection of the memory module chip is turned off, one end of the jumper cap is inserted into the third pin, and the other end of the jumper cap is inserted into the second pin.

8. The SPD burning device according to claim 5, characterized in that: The switch comprises a controllable switch; One end of the controllable switch is connected to the connecting member, the other end of the controllable switch is grounded, the control end of the controllable switch receives a control signal sent by the processing chip, and the controllable switch is used to turn on or off in response to the control signal.

9. The SPD burning device according to any one of claims 1 to 8, characterized in that: The processing chip includes: a memory and a processor; The memory is used to store UEFI system files and SPD burning programs; The processor is used to read the UEFI system file from the memory and run the UEFI system according to the UEFI system file; and, under the UEFI system, call the SPD burning program in the memory to obtain the benchmark SPD data, and burn the benchmark SPD data into the memory module chip.

10. A SPD burning method, characterized in that: A processing chip used in an SPD burning device, the SPD burning device comprising: a test mainboard and the processing chip, the test mainboard being provided with a BIOS chip and a memory module interface; the method comprising: Sending an initialization instruction to a BIOS chip, so that the BIOS chip responds to the initialization instruction and initializes the memory module chip inserted into the memory module interface based on the false SPD data by running the BIOS program; wherein the BIOS chip stores the BIOS program, and the BIOS program includes the false SPD data; After the memory module chip is initialized, the benchmark SPD data is acquired and the benchmark SPD data is burned into the memory module chip.

11. The method according to claim 10, characterized in that Before obtaining the reference SPD data and burning the reference SPD data into the memory module chip, the method further includes: Detecting whether the write protection of the memory module chip is in a closed state; If the write protection of the memory module chip is in a closed state, the reference SPD data is obtained and the reference SPD data is burned into the memory module chip; otherwise, the write protection of the memory module chip is closed.

12. The method according to claim 11, characterized in that The detecting whether the write protection of the memory module chip is in a closed state includes: Detecting whether the potential state at the connector of the memory module interface is in a grounding state; the connector is arranged corresponding to a first external pin of a memory module chip inserted into the memory module interface; the first external pin of the memory module chip is connected to an HSA pin of an SPD chip in the memory module chip; If the potential state at the connection piece is a grounding state, it is determined that the write protection of the memory module chip is in a closed state; otherwise, it is determined that the write protection of the memory module chip is in an open state.

13. The method according to claim 12, characterized in that The step of disabling the write protection of the memory module chip includes: A control signal for turning off the controllable switch is sent to a control end of the controllable switch; one end of the controllable switch is connected to the connecting member, and the other end of the controllable switch is grounded.

14. The method according to claim 10, characterized in that The SPD burning device further includes: a remote device, the processing chip is integrated on the remote device; the test mainboard is also provided with a network card; the network card is connected to the BIOS chip and the memory module interface; the sending of the initialization instruction to the BIOS chip includes: Sending an initialization instruction to the network card, so that the network card forwards the initialization instruction to the BIOS chip; The step of burning the reference SPD data into the memory module chip comprises: A burning instruction is sent to the network card so that the network card transmits the burning instruction to the memory module chip through the memory module interface, and the memory module chip is used to burn the benchmark SPD data according to the burning instruction; wherein the burning instruction includes the benchmark SPD data.

15. The method according to any one of claims 10 to 14, characterized in that: The obtaining of the benchmark SPD data and burning the benchmark SPD data into the memory module chip includes: Run the UEFI system according to the UEFI system file; An SPD burning program is called under the UEFI system to obtain benchmark SPD data, and the benchmark SPD data is burned into the memory module chip.

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