Power-off protection switch and power-off protection method

Abstract

The invention relates to the technical field of power-off protection, in particular to a power-off protection switch and a power-off protection method.The power-off protection switch comprises a base material and a conductive protection layer, the conductive protection layer can be disconnected along with damage of the base material, the conductive protection layer can be electrically connected with external electric control equipment to form a power-on loop, and when the base material is damaged, the power-on loop is disconnected to trigger power-off protection. The base material is provided with the conductive protection layer which can be broken along with the damage of the base material, the conductive protection layer is connected with the external electric control equipment used for triggering power-off protection to form a power-on loop, and when the base material is damaged or broken by external force, the conductive protection layer attached to the base material is also broken; the power-off protection is triggered by the damage of the base material, the power-off protection can be quickly implemented when the base material is damaged on the physical level, the triggering process is stable and reliable, the structure is simple, the size is smaller than that of a traditional circuit break protection switch, and the cost is low. And users can use conveniently.

Description

Technical Field

[0001] The invention relates to the technical field of power-off protection, in particular to a power-off protection switch and a power-off protection method. Background Art

[0002] In daily life, most electronic products, electric devices, power supply equipment or power systems and other equipment and facilities with live operation may suffer physical damage caused by external factors during use. Traditional power-off protection switches or power-off protection methods mainly focus on protecting the circuit from risk types such as circuit breaking, overvoltage or overload, but physical damage is different from circuit abnormalities. In fact, when equipment and facilities with live operation do not automatically cut off the power and stop after suffering different degrees of physical damage (such as severe vibration, shaking, impact, explosion shock, compression deformation, etc.), they may still continue to operate with power on. The occurrence of this situation will directly or indirectly cause safety hazards such as leakage, electric shock, circuit damage, etc. to the surrounding environment and personnel. In severe cases, it may even develop into a fire hazard that endangers families or businesses, which is not conducive to circuit protection, personal safety protection and power-off emergency repair and maintenance.

[0003] In view of the above shortcomings, we need to develop a power-off protection switch and a power-off protection method to meet the needs of the majority of users. Summary of the invention

[0004] In view of the above-mentioned problems that the existing power-off protection method has an incomplete protection range, may continue to operate with power when physically damaged, and is not conducive to safety protection, the technical solution adopted by the present invention to solve the technical problem is: A power-off protection switch comprises a substrate and a conductive protective layer arranged on the substrate, wherein the conductive protective layer can be disconnected as the substrate is damaged, and the conductive protective layer can be electrically connected to an external electric control device for triggering power-off protection to form a power-on circuit. When the substrate is damaged, the conductive protective layer is disconnected, resulting in the disconnection of the power-on circuit to trigger the power-off protection.

[0005] Furthermore, the conductive protective layer includes a conductive layer arranged in a surrounding shape, one end of the conductive layer has a first endpoint, the other end of the conductive layer has a second endpoint, a gap G is provided between the first endpoint and the second endpoint, and the first endpoint and the second endpoint are respectively connected to an external electrical control device to form a power-on circuit.

[0006] Furthermore, the distance between the first endpoint and the center of the substrate is smaller than the distance between the second endpoint and the center of the substrate, an imaginary straight line k is formed between the second endpoint and the center of the substrate, the first endpoint and the straight line k are offset, the direction of the straight line k toward the first endpoint is direction p, and the conductive layer extends from the second endpoint toward direction p and connects to the first endpoint after circling the center of the substrate at least once.

[0007] Furthermore, it also includes a conductive heating layer arranged on the substrate, the conductive protective layer is located in the area between the outer edge of the substrate and the outer edge of the conductive heating layer, and the conductive protective layer and the conductive heating layer are spaced apart.

[0008] Furthermore, the conductive shielding layer is connected end to end in a surrounding shape to form a shielding area surrounding the conductive heating layer, and the conductive shielding layer extends a conductive lead toward the conductive heating layer, and the conductive shielding layer additionally leads out a grounding lead.

[0009] Furthermore, the conductive layer extends from one of the first endpoint and the second endpoint and passes through an area between the other of the first endpoint and the second endpoint and the center of the substrate, and the conductive layer surrounds the center of the substrate so that there is at least one encircling ring structure composed of the conductive layer between the center of the substrate and the outer edge of the substrate.

[0010] A power-off protection method, the protection method comprising: The electric control device for triggering the power-off protection is connected to the conductive protective layer on the substrate to form an electric circuit; When the substrate is damaged, the conductive protective layer is disconnected, causing the power circuit to be disconnected; The disconnection of the power circuit triggers the power-off protection of the electronic control equipment.

[0011] Furthermore, the electric control device determines whether the environment is in a safe state by either connecting or disconnecting the power circuit, and the electric control device determines whether the environment is in a dangerous state by either connecting or disconnecting the power circuit.

[0012] Furthermore, the conductive protective layer surrounds the conductive heating layer to form a protective area. When the environment is in a safe state, the circuit of the conductive heating layer can be turned on to achieve a heating effect. When the environment is in a dangerous state, the power-off protection can be triggered to stop the heating effect of the conductive heating layer.

[0013] Furthermore, the substrate is made of a brittle material, and when the substrate breaks, the conductive protection layer is disconnected, causing the power circuit to be disconnected to trigger power-off protection.

[0014] Furthermore, the conductive protective layer is attached to the substrate by coating, adhesion, screen printing, physical vapor deposition or the like to form an easily fractured layer structure without toughness and ductility.

[0015] The beneficial effects of the present invention are as follows: 1. The present invention provides a conductive protective layer on the substrate that can be disconnected as the substrate is damaged. The conductive protective layer is connected to an external electric control device for triggering power-off protection to form a power-on circuit. When the substrate is damaged or broken by external force, the conductive protective layer attached to the substrate is also disconnected. The disconnection of the conductive protective layer causes the power-on circuit to be disconnected to trigger the power-off protection of the external electric control device. The power-off protection is triggered by the damage of the substrate. When the substrate is damaged at the physical level, the power-off protection can be quickly implemented. The triggering process is stable and reliable, the structure is simple, and the volume can be smaller than that of a traditional circuit breaker protection switch, which is convenient for users to use.

[0016] 2. The present invention triggers power-off protection by causing the conductive protective layer to break due to the substrate fragmentation. In actual use, the power-off protection effect can be quickly achieved. The power-off protection mechanism of the electric control device is triggered by the fragmentation characteristics of the brittle material used in the substrate and the instantaneous feedback of the disconnection of the power-on circuit. It has rapid trigger response efficiency and stable trigger reliability, and can protect equipment and facilities from external physical damage by achieving power-off effect through substrate fragmentation. The triggering cost is low and the response efficiency is high. 3. The substrate of the present invention can be made of brittle materials to further enhance the degree of fragmentation and decomposition of the substrate. When damaged by external force, the conductive protective layer can be disconnected at an instant. On this basis, a conductive heating layer is provided in the open enclosed area of ​​the conductive protective layer. The conductive heating layer can be used to heat the object. When the heating environment is dangerous and causes the substrate to break, the circuit can be disconnected at an instant to avoid continued ineffective heating. In particular, when there is liquid in the surrounding environment, it can also avoid the hidden danger of leakage after the danger occurs, thereby protecting the user's safety.

[0017] 4. The present invention can enclose the conductive protective layer to form a closed enclosed area, and the effect of leakage grounding can be achieved by leading out the grounding lead. On this basis, the conductive protective layer extends a conductive lead toward the conductive heating layer, which can guide the leakage of the heating layer to the grounding position, avoiding the risk of electric shock caused by accidental touch by the user, and further ensuring the user's safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of a power-off protection switch according to the present invention.

[0019] Figure 2 The second schematic diagram of a power-off protection switch of the present invention.

[0020] Figure 3 The third schematic diagram of a power-off protection switch of the present invention.

[0021] Figure 4 for Figure 2 3D exploded view of .

[0022] Figure 5 The fourth schematic diagram of a power-off protection switch of the present invention.

[0023] Figure 6 The fifth schematic diagram of a power-off protection switch of the present invention.

[0024] Figure 7 It is a schematic diagram showing that the conductive protection layer and the conductive heating layer of the present invention are located on different surfaces.

[0025] Figure 8 The sixth schematic diagram of a power-off protection switch of the present invention.

[0026] Fig. 9 The seventh schematic diagram of a power-off protection switch of the present invention.

[0027] Fig.10 for Fig. 9 3D exploded view of .

[0028] Fig.11 The eighth schematic diagram of a power-off protection switch of the present invention.

[0029] Fig.12 A schematic diagram of a power-off protection method. DETAILED DESCRIPTION

[0030] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0031] Optionally, in some embodiments, the substrate 1 can be made of one of the brittle materials such as glass, ceramic, stone, plastic, etc. Preferably, the substrate 1 is made of glass or ceramic. Glass or ceramic has a brittle property that can be broken. After being broken by external force, the conductive protective layer 2 is disconnected, resulting in the disconnection of the power circuit, which is more likely to trigger the power-off protection. Among them, glass has good light transmittance and beauty, and is good in appearance when applied to product appearance. Glass or ceramic has good tolerance to most chemicals, is not easily corroded, and has a high hardness. It will not be easily worn out after long-term use. The thermal expansion coefficient of glass or ceramic is low under high temperature conditions, and it is not easy to expand and deform.

[0032] Optionally, in some embodiments, the conductive protective layer 2, the conductive layer 23 or the electrode layer 32 can be made of one material with good conductivity such as gold, silver, copper, aluminum, tin, etc. Preferably, the conductive protective layer 2, the conductive layer 23 or the electrode layer 32 is laid with silver paste made of silver material. The silver paste has high conductivity, can effectively conduct current, reduce power loss, and is easy to form on the surface of the substrate 1, which is convenient for processing and production.

[0033] Optionally, in some embodiments, the electrode member 6 can be made of a metal material with good conductivity such as gold, silver, copper, aluminum, tin, etc. to form a metal connector. Preferably, the electrode member 6 is made of silver material, and the silver contact has better contact convenience and conductivity.

[0034] Embodiment 1: like Figures 1 to 11 A power-off protection switch shown includes a substrate 1 and a conductive protective layer 2 arranged on the substrate 1, wherein the substrate 1 is a hard and brittle matrix for carrying the conductive protective layer 2, has good structural stability, and is not easy to deform or bend, and the conductive protective layer 2 is arranged on the surface of the substrate 1. More specifically, the conductive protective layer 2 is a conductive material formed on the substrate 1 by coating, film or adhesion, and the conductive protective layer 2 can be disconnected as the substrate 1 is damaged. The laying thickness of the conductive protective layer 2 is less than 1 mm, and the conductive protective layer 2 is located on the surface of the substrate 1 and is arranged in a surrounding shape at a position close to the outer edge of the surface of the substrate 1, forming a circle of open ring structure with non-overlapping end points, and connecting the external electric control equipment for triggering the power-off protection through the end points to form a power-on circuit, and the external electric control equipment can determine whether the substrate 1 has been damaged or broken by real-time detection of the integrity of the power-on circuit.

[0035] During use, when the substrate 1 is intact, the power circuit is turned on and it is in a normal state of use. When the substrate 1 is damaged or broken, the conductive protective layer 2 is disconnected synchronously due to the damage of the substrate 1, resulting in the disconnection of the power circuit, which can be judged as an abnormal state of use. Since the conductive protective layer 2 is formed on the substrate 1 by an attachment method such as coating, adhesion, silk screen printing or physical vapor deposition, the conductive protective layer 3 itself does not have toughness and ductility. Therefore, when the substrate 1 is damaged or broken, the damaged or broken part must first pass through the conductive protective layer 2 surrounding it. When the adhesion layer of the conductive protective layer 2 is broken, it also means that the power circuit is broken. The power circuit disconnection can immediately trigger the power-off protection mechanism of the external electric control equipment, thereby achieving a power-off protection effect with fast response speed and high protection efficiency.

[0036] As another embodiment of embodiment 1, the surface of the substrate 1 can be divided into at least two or more planes, or curved surfaces, or a combination of planes and curved surfaces.

[0037] As another embodiment of embodiment 1, the conductive protective layer 2 can also be arranged inside the substrate 1 to form a single-line connected surrounding structure that covers the entire interior of the substrate 1. The conductive protective layer 2 is led out to the surface of the substrate 1 and connected to an external electrical control device.

[0038] Embodiment 2: On the basis of Example 1, Figures 1 to 7 A power-off protection switch shown in the figure, the conductive protection layer 2 includes a conductive layer 23 arranged in a circumferential shape, the conductive layer 23 is a conductive material attachment path formed on the substrate 1 by coating, film or adhesion and arranged circumferentially along the outer edge of the substrate 1, the conductive layer 23 adopts an open ring structure, the laying thickness of the conductive layer 23 is less than 1mm, one end of the conductive layer 23 has a first terminal 21, and the other end of the conductive layer 23 has a second terminal 22, the first terminal 21 and the second terminal 22 are both connection terminals for connecting the conductive layer 23 to an external electric control device, after connecting to the external electric control device, the first terminal 21, the conductive layer 23, the second terminal 22 and the external electric control device form a power-on circuit, when the conductive layer 23 is damaged or broken by the substrate 1 and is disconnected, the power-on circuit will be broken, and the power-off protection mechanism of the external electric control device can be triggered after the circuit is disconnected.

[0039] More specifically, there is a gap G between the first terminal 21 and the second terminal 22 . The size of the gap G determines the separation distance between the first terminal 21 and the second terminal 22 . The gap G is provided to prevent the power-on circuit from being short-circuited under normal circumstances.

[0040] As another embodiment of embodiment 2, Figure 3 and Figure 7 As shown, in actual use, due to the gap G in the power circuit, when the substrate 1 is damaged or broken, the path of the damage or breakage just passes through the gap G, which will not easily cause the conductive protective layer 2 to be disconnected, and there may be a situation where the conductive protective layer 2 is avoided by chance and the power-off protection fails to be triggered. Therefore, this embodiment further defines that the first endpoint 21 is located between the second endpoint 22 and the center of the substrate 1, and by defining the location of the first endpoint 21, it is ensured that the damaged or broken path will not easily pass directly through the gap G. More specifically, the second endpoint 22 and the center of the substrate 1 form a virtual straight line segment with the shortest distance, and the first endpoint 21 is located along the virtual straight line segment. On this basis, since the first endpoint 21 and the second endpoint 22 both have a certain size of outer diameter laying range, it is difficult for the path of the damage or breakage of the substrate 1 to directly avoid the conductive protective layer 2 and only pass through the gap G, which greatly reduces the situation where the power-off protection fails to be triggered by avoiding the conductive protective layer 2 by chance, thereby achieving the effect that the power-off protection can be stably triggered when the substrate 1 is damaged.

[0041] As another embodiment of embodiment 2, Figure 5 and Figure 6 As shown, when the conductive layer 23 is wound around the outer edge of the substrate 1 clockwise or counterclockwise from the first terminal 21 and connected to the second terminal 22, the winding path of the conductive layer 23 can adopt a spiral line structure to wind around the outer edge of the substrate 1 from the inside to the outside in multiple layers, so as to minimize the situation where the path of the damaged or broken substrate 1 accidentally avoids the conductive protective layer 2 so that the power-off protection cannot be triggered, thereby achieving the effect that the power-off protection can be further stably triggered when the substrate 1 is damaged.

[0042] As another embodiment 201 of embodiment 2, since there is a gap G in the conductive protection layer 2 of the power-on circuit, when the substrate 1 is damaged or broken, the path of damage or breakage happens to pass through the gap G, and it is not easy to cause the conductive protection layer 2 to be disconnected. There may be a situation where the conductive protection layer 2 is avoided by chance and the power-off protection fails to be triggered, such as Fig.11 In the power-off protection switch shown, the conductive layer 23 extends from the first terminal 21 and passes through the area between the second terminal 22 and the center of the substrate 1. The conductive layer 23 surrounds the center of the substrate 1 so that there is at least one encircling ring structure composed of the conductive layer 23 between the center of the substrate 1 and the outer edge of the substrate 1. More specifically, the encircling ring structure surrounding the center of the substrate 1 is adopted so that the conductive layer 23 can form a protective ring structure without an obvious direct gap to the outside world, and there is no longer a straight line or nearly straight line through-type gap between the center of the substrate 1 and the outer edge of the substrate 1, so as to avoid the situation that when the substrate 1 is damaged or broken, the damaged or broken path accidentally avoids the conductive protective layer 2 so that the power-off protection fails to be triggered. The problem that the broken path accidentally avoids the conductive protective layer 2 can be effectively avoided, and it is ensured that when the substrate 1 is damaged or broken, the conductive protective layer 2 can be disconnected to trigger the power-on circuit to disconnect and realize power-off protection.

[0043] As another embodiment 202 (not shown) of embodiment 201, different from embodiment 201, the conductive layer 23 extends from the second end point 22 and passes through the area between the first end point 21 and the center of the substrate 1, and the conductive layer 23 surrounds the center of the substrate 1 so that there is at least one layer of an encircling ring structure composed of the conductive layer 23 between the center of the substrate 1 and the outer edge of the substrate 1.

[0044] Embodiment 3: In actual use, since there is a gap G in the conductive protective layer 2 of the power-on circuit, when the substrate 1 is damaged or broken, the path of damage or breakage happens to pass through the gap G, which will not easily cause the conductive protective layer 2 to be disconnected. It is possible that the conductive protective layer 2 is avoided by chance and the power-off protection may not be triggered.

[0045] On the basis of Example 2, Figure 5 and Figure 6In the power-off protection switch shown, the distance between the first terminal 21 and the center of the substrate 1 is smaller than the distance between the second terminal 22 and the center of the substrate 1. An imaginary straight line k is formed between the second terminal 22 and the center of the substrate 1. The first terminal 21 and the straight line k are offset, and the direction of the straight line k toward the first terminal 21 is the direction p. The conductive layer 23 extends from the second terminal 22 toward the direction p and connects to the first terminal 21 after wrapping around the center of the substrate 1 at least once.

[0046] More specifically, after the first endpoint 21 and the second endpoint 22 are staggered on the surface of the substrate 1, the distance between the first endpoint 21 and the center of the substrate 1 is smaller than the distance between the second endpoint 22 and the center of the substrate 1, and a fictitious straight line k for auxiliary positioning is formed between the second endpoint 22 and the center of the substrate 1. The first endpoint 21 is located at a non-overlapping position outside the straight line k, and the direction of the straight line k toward the first endpoint 21 is taken as the direction p. The conductive layer 23 extends from the second endpoint 22 toward the direction p and wraps around the center of the substrate 1 for at least one circle before connecting to the first endpoint 21, forming a protective coil structure surrounded by a single line. Preferably, the first endpoint 21 and the substrate 1 are connected to each other. The smaller the difference between the distance between the center of the substrate 1 and the distance between the second endpoint 22 and the center of the substrate 1, the smaller the probability that the path of the damaged or broken substrate 1 can avoid avoiding the conductive protective layer 2 by chance. Conversely, the larger the difference between the distance between the first endpoint 21 and the center of the substrate 1 and the distance between the second endpoint 22 and the center of the substrate 1, the easier it is for the path of the damaged or broken substrate 1 to pass through. On this basis, after the conductive layer 23 wraps around the center of the substrate 1 twice, the problem of the broken path avoiding the conductive protective layer 2 by chance can be effectively avoided, thereby ensuring that when the substrate 1 is damaged or broken, the conductive protective layer 2 can be disconnected to trigger the disconnection of the power-on circuit to achieve power-off protection.

[0047] Embodiment 4: Based on any of the above embodiments, Fig. 9 and Fig.10 The power-off protection switch shown also includes a switch housing 5 for installing a substrate 1. Since the substrate 1 is preferably made of brittle material, the switch housing 5 can facilitate the installation of the substrate 1 on other equipment, or directly install it on the surface of an object, and can also play a role in fixing the position. The switch housing 5 is independently provided with two electrode parts 6 for connecting to an external electrical control device. The two electrode parts 6 are respectively connected to the conductive protective layer 2. The electrode parts 6 serve as connecting parts between the conductive protective layer 2 and the external electrical control device, which can conveniently expand the connection range of the conductive protective layer 2 and reduce the difficulty of assembling the circuit connection during the production process. If the external electrical control device is directly connected to the conductive protective layer 2, it is necessary to consider processing the connection point on the substrate 1, which can easily cause damage to the substrate 1 and increase the defective rate. Using the electrode parts 6 as adapter parts can facilitate installation and connection, and can also improve the stability of the connection.

[0048] When in use, the substrate 1 is installed on other equipment or places of use through the switch housing 5. Under normal circumstances, the external electronic control device is connected to the conductive protective layer 2 through the electrode member 6 to form a power-on circuit. At this time, it can be judged that the device or the use scene is in a safe state. When the substrate 1 is damaged or broken, the conductive protective layer 2 is disconnected, resulting in the disconnection of the power-on circuit, triggering the power-off protection mechanism of the external electronic control device. The control circuit of the external electronic control device is disconnected to prevent the circuit from continuously outputting electrical energy to the outside world, thereby avoiding safety hazards such as electric shock and leakage.

[0049] Embodiment 5: Based on any of the above embodiments, Figures 1 to 4 The power-off protection switch shown in the figure also includes a conductive heating layer 3 arranged on the substrate 1. The conductive heating layer 3 can be used as the heating end of the electric heating product. The heated object to be heated can be placed on the conductive heating layer 3 to be heated and heated to achieve a heating effect. The conductive heating layer 3 includes a heating layer 31 for heating by power and an electrode layer 32 for connecting to a power source. The heating layer 31 can be formed of a planar heating layer using one of nano-metal oxides, nano-semiconductor metal oxides, graphene materials, and carbon paste materials. Preferably, the heating layer 31 uses nano-semiconductor metal oxides as the conductive heating material. The laying thickness of the heating layer 31 and the electrode layer 32 is less than 1 mm. The nano-semiconductor metal oxide can be made of one or more materials such as tin, antimony, nickel, and ammonium. The combination is used as nanoparticles. During production, the nano-semiconductor metal oxide can be attached to the surface of the substrate 1 by physical vapor deposition (PVD), chemical vapor deposition (CVD), silk screen (SS), far infrared spectroscopy (FI), etc., and a fixed heating area is formed after high-temperature sintering. At least two separate electrode layers 32 are respectively located on both sides of the heating layer 31. The electrode layer 32 includes a first electrode 321 and a second electrode 322. The first electrode 321 and the second electrode 322 are respectively arranged on both sides of the heating layer 31 to facilitate connection to an external power supply. Preferably, the electrode layer 32 can also use silver paste as a conductive material. The silver paste has high conductivity, can effectively conduct current, and reduce power loss. The silver paste is easy to form on the surface of the substrate 1, which is convenient for processing and production.

[0050] More specifically, the conductive protective layer 2 is located in the area between the outer edge of the substrate 1 and the outer edge of the conductive heating layer 3. The conductive protective layer 2 and the conductive heating layer 3 are spaced apart. The conductive protective layer 2 surrounds the outer side of the conductive heating layer 3 in a circumferential shape to form an open surrounding area with a gap G. When the substrate 1 is damaged or broken, the damaged or broken path first passes through the conductive protective layer 2 and then enters the conductive heating layer 3, which means that when the conductive heating layer 3 is damaged, the conductive protective layer 2 will also be disconnected in advance, and the circuit can be disconnected immediately to stop the heating of the conductive heating layer 3, thereby preventing the conductive heating layer 3 from continuing to heat up when damaged, and avoiding safety hazards caused by circuit leakage.

[0051] As another embodiment of Example 5, the substrate 1 can be produced using one of the microcrystalline materials such as microcrystalline glass or microcrystalline ceramics. Preferably, the substrate 1 uses microcrystalline glass as the main preparation material. Microcrystalline glass has good vertical thermal conductivity and light transmittance. The vertical thermal conductivity effectively enhances the efficiency and speed of heat transfer, making the overall heating rapid and uniform. Microcrystalline glass has a low thermal expansion coefficient and hardly deforms when the temperature changes. It is suitable for heating components with frequent temperature changes. Moreover, the microcrystalline glass will shatter more thoroughly when damaged, avoiding shattering to the layout path of the conductive protective layer 2 to prevent the power-off protection from being triggered.

[0052] As another embodiment of Example 5, the heating layer 31 can use graphene film as a conductive heating material. Graphene has high thermal conductivity and excellent conductivity. During production, the graphene film is molded on the surface of the insulating layer 3 to form a fixed heating area.

[0053] As another embodiment of embodiment 5, Figure 7 As shown, the conductive protective layer 2 and the conductive heating layer 3 can be respectively located on different surfaces of the substrate 1. The substrate 1 at least includes a surface A and a surface B. Surface A and surface B are independent surfaces located on the substrate 1. Surface A is one of the front and back sides of the substrate 1, and surface B is the other of the front and back sides of the substrate 1. In this embodiment, the conductive protective layer 2 is arranged on the surface A of the substrate 1, and the conductive heating layer 3 is arranged on the surface B of the substrate 1. The conductive heating layer 3 is located within the axial surrounding range of the conductive protective layer 2. When the substrate 1 is damaged or broken, the damaged or broken path can still pass through the conductive protective layer 2 and then enter the conductive heating layer 3. With such a structure, the layout position of the conductive protective layer 2 can be enriched, and the conductive protective layer 2 can be prevented from being arranged on the surface where the conductive heating layer 3 is located, affecting the use of the conductive protective layer 2, or the conductive heating layer 3 can be prevented from being arranged on the surface where the conductive protective layer 2 is located, affecting the use of the conductive heating layer 3.

[0054] As another embodiment of Example 5, the substrate 1 can be produced by using one of the microcrystalline materials such as microcrystalline glass or microcrystalline ceramics. Preferably, the substrate 1 uses microcrystalline glass as the main preparation material. Electrostatic ions will appear on the surface of the microcrystalline glass under high temperature. When the temperature of the microcrystalline glass exceeds 300 degrees, the microcrystalline glass may have conductive properties. On this basis, the first terminal 21 extends a conductive lead 24 that can be used for grounding toward the conductive heating layer 3 to shorten the distance between the conductive protective layer 2 and the conductive heating layer 3. When the microcrystalline glass exhibits conductive properties at a specific temperature, the conductive heating layer 3 is connected to the conductive lead 24 via the substrate 1, which can trigger a short circuit in the power-on circuit. The short circuit of the power-on circuit triggers the power-off protection of the external electrical control equipment, thereby achieving power-off protection to prevent the conductive heating layer 3 from overheating.

[0055] As another embodiment of embodiment 5, Fig.10 The first electrode 321 and the second electrode 322 on both sides of the heating layer 31 shown can be connected to an external power source for supplying power and generating heat through different electrode parts 6 respectively. The external electrical control device controls the start and stop of the external power source by the on and off state of the power-on circuit of the conductive protective layer 2. When the power-on circuit of the conductive protective layer 2 is connected, power continues to be supplied to the conductive heating layer 3 for heating. When the power-on circuit of the conductive protective layer 2 is disconnected, the connection between the external power source and the electrode layer 32 is disconnected, thereby achieving the effect of power-off protection and stopping heating.

[0056] Embodiment 6: On the basis of Example 5, Figure 2 , Fig. 9 and Fig.10 A power-off protection switch shown in the figure has a substrate 1 installed with a temperature measuring probe for detecting the heating temperature of the conductive heating layer 3 or the temperature of the heated object. The temperature measuring probe is installed within the range where the conductive heating layer 3 is arranged on the surface of the substrate 1, so that the temperature measuring probe is closer to the conductive heating layer 3 for easy temperature detection. The substrate 1 is provided with a mounting hole 11 for installing the temperature measuring probe. The temperature measuring probe can be installed on the mounting hole 11 in a plug-in, threaded, snap-on or other manner. The temperature measuring probe can be a detection device for checking temperature, such as an NTC thermistor, an infrared temperature sensor, a thermocouple, etc. The real-time temperature changes can be intuitively known through the temperature measuring probe, and the heating temperature of the conductive heating layer 3 can also be adjusted according to the data of the temperature measuring probe.

[0057] Embodiment 7: On the basis of Example 6, Figure 2 and Figure 4 In the power-off protection switch shown, the conductive heating layer 3 includes a plurality of independently arranged heating areas, and the heating areas include at least heating area a, heating area b, heating area c and heating area d. All heating areas are circumferentially arranged around the mounting hole 11 where the temperature measuring probe is located.

[0058] More specifically, the conductive heating layer 3 includes a heating area a, a heating area b, a heating area c and a heating area d, which are independently arranged. The heating area c and the heating area d are located between the heating area a and the heating area b. The electrode layer 32 includes a third electrode 323. The heating area c and the heating area d are connected via the third electrode 323. The third electrode 323 is used to bypass the mounting hole 11 to ensure the circuit connection between the heating area c and the heating area d, so as to ensure that the heating area c and the heating area d can be connected and achieve conductive heating.

[0059] More specifically, the two ends of the heating area a are respectively connected to the first electrode 321 and the second electrode 322, the two ends of the heating area b are respectively connected to the first electrode 321 and the second electrode 322, the heating area c and the heating area d are connected through the third electrode 323 to form a middle heating area, the end of the heating area c away from the third electrode 323 is connected to one of the first electrode 321 and the second electrode 322, and the end of the heating area d away from the third electrode 323 is connected to the other of the first electrode 321 and the second electrode 322. At this time, the heating area a, the heating area b and the middle heating area are in a parallel connection relationship.

[0060] As another embodiment of Example 7, a series connection relationship can also be formed between the heating zone c, the heating zone d, the heating zone a and the heating zone b. More specifically, the current flows into one of the first electrode 221 and the second electrode 222 and passes through the heating zone a, the heating zone c, the third electrode 223, the heating zone d and the heating zone b in sequence, and then flows out from the other of the first electrode 221 and the second electrode 222 to form a series circuit.

[0061] As another embodiment of Example 7, the shapes of heating area a, heating area b, heating area c and heating area d can be the shape of the area contour formed by straight lines and / or curves to meet the heating contact surface requirements of different users.

[0062] As another embodiment of Embodiment 7, the sum of the length of heating area c and the length of heating area d is equal to the length of heating area a. The design using this structure is more beautiful in terms of partitioning.

[0063] As another embodiment of Embodiment 7, the sum of the length of heating area c and the length of heating area d is equal to the length of heating area b. The design using this structure is more beautiful in terms of partitioning.

[0064] As another embodiment of Embodiment 7, the area of ​​the heating region c is the same as the area of ​​the heating region d. The design using this structure is more beautiful in terms of partitioning.

[0065] As another embodiment of Embodiment 7, the shape of the heating area c is the same as the shape of the heating area d. The design using this structure is more beautiful in terms of partitioning.

[0066] As another embodiment of Embodiment 7, the shape of the heating area c and the shape of the heating area d are symmetrically arranged with the mounting hole 11 as the center. The design using this structure is more beautiful and visually symmetrical in terms of partitioning.

[0067] As another embodiment of Embodiment 7, the shape of the heating area a is the same as the shape of the heating area b. The design using this structure is more beautiful in terms of partitioning.

[0068] As another embodiment of Embodiment 7, the shape of heating area a and the shape of heating area b are symmetrically arranged with the mounting hole 11 as the center. The design using this structure is more beautiful and visually symmetrical in partitioning.

[0069] As another embodiment of Example 7, the shape of heating area a and the shape of heating area b are symmetrically arranged with the mounting hole 11 as the center, and the shape of heating area c and the shape of heating area d are symmetrically arranged with the mounting hole 11 as the center, and the symmetry center line of heating area a and heating area b is perpendicular to the symmetry center line of heating area c and heating area d. The design using this structure is more beautiful and visually symmetrical in partitioning.

[0070] Embodiment 8: On the basis of Example 5, Figure 8 A power-off protection switch shown is different from Example 5 in that the conductive protective layer 2 is connected end to end in a surrounding shape to form a protection area surrounding the conductive heating layer 3, and the first end 21 and the second end 22 of the conductive protective layer 2 coincide with each other so that the conductive layer 23 forms a closed and closed surrounding area, and the conductive heating layer 3 is located in the surrounding area. On this basis, the substrate 1 adopts materials that are easy to conduct electricity under certain circumstances, such as microcrystalline glass or microcrystalline ceramics. The conductive protective layer 2 extends a conductive lead 24 that can be used for grounding in the direction of the conductive heating layer 3, and the conductive protective layer 2 extends a grounding lead 25 in the direction away from the conductive heating layer 3. When the conductive heating layer 3 is overheated and the substrate 1 exhibits conductive characteristics under high temperature, the current of the conductive heating layer 3 can be connected to the grounding lead 25 through the conductive lead 24 to be conducted to the grounding position to avoid the hidden danger of leakage.

[0071] Embodiment 9: On the basis of Example 8, the conductive protection layer 2 is further provided with an open enclosing area outside the closed enclosing area, and the conductive heating layer 3 forms two conductive protection layers 2 that are spaced apart and do not overlap, intersect, or contact each other. The conductive protection layer 2 close to the conductive heating layer 3 (i.e., located in the inner circle) is closed to form an enclosing circle for grounding and preventing leakage, and the conductive protection layer 2 away from the conductive heating layer 3 (i.e., located in the outer circle) is open to form an enclosing circle for power-off protection triggered by the fragmentation of the substrate 1. The conductive protection layer 2 at the inner circle is oriented toward the conductive heating layer 3. While the thermal layer 3 leads out a conductive lead that can be used for grounding, it also leads out a grounding lead 25 from the gap G through the conductive protective layer 2 at the outer circle position and is grounded. The conductive protective layer 2 at the inner circle position is closer to the conductive heating layer 3 than the conductive protective layer 2 at the outer circle position. Therefore, when the substrate may have conductive properties, the current leaked from the conductive heating layer 3 can be grounded from the conductive protective layer 2 at the inner circle position via the grounding lead 25, avoiding the hidden danger of leakage, and also preventing the current leaked from the conductive heating layer 3 from affecting the power circuit protection effect of the conductive protective layer 2 at the outer circle position.

[0072] Embodiment 10: like Fig.12 A power-off protection method is shown, the protection method comprising: The electric control device for triggering the power-off protection is connected to the conductive protection layer 2 on the substrate 1 to form a power-on circuit; When the substrate 1 is damaged, the conductive protective layer 2 is disconnected, causing the power circuit to be disconnected; The disconnection of the power circuit triggers the power-off protection of the electronic control equipment.

[0073] More specifically, the substrate 1 is a hard and brittle substrate for carrying the conductive protective layer 2, which has good structural stability and is not easy to deform or bend. The conductive protective layer 2 is arranged on the surface of the substrate 1. The conductive protective layer 2 can use conductive materials formed on the substrate 1 by coatings, films, etc. The conductive protective layer 2 can be disconnected as the substrate 1 is damaged. The laying thickness of the conductive protective layer 2 is less than 1 mm. The conductive protective layer 2 is located on the surface of the substrate 1 and is arranged in a surrounding shape near the outer edge of the surface of the substrate 1 to form an open ring structure with non-overlapping end points. The end points are connected to the electric control device for triggering the power-off protection to form a power-on circuit. The electric control device The device can be an electrical device or an electrical system. The electronic control device can determine whether the substrate 1 has been damaged or broken by the integrity of the power circuit. When the power circuit is disconnected, it is determined that the environment is in a situation where power-off protection needs to be immediately performed. When the power circuit is disconnected, the electronic control device disconnects the operating main circuit through the power-off protection mechanism. It can be applied to environmental scenarios such as electrical appliances that come into contact with liquids during transportation, heating devices, equipment that is being produced and processed, machines that are in operation, or power systems that are transmitting power. This is only used as an understanding of the application of the technical solution of the present application, and is not used as an enumeration to limit the scope of use of the present application.

[0074] During use, when the substrate 1 is intact, the power circuit is connected and is in a normal state of use. When the substrate 1 is damaged or broken, the conductive protective layer 2 is affected by the damage of the substrate 1 and is broken and separated synchronously, resulting in the power circuit being disconnected and disconnected. The electronic control device can be judged as being in an abnormal state of use. Since the conductive protective layer 2 is formed on the substrate 1 by an attachment method such as coating, adhesion, silk screen printing or physical vapor deposition, the conductive protective layer 3 itself does not have toughness and ductility. Therefore, when the substrate 1 is damaged or broken, the damaged or broken part must first pass through the conductive protective layer 2 surrounding it. When the adhesion layer of the conductive protective layer 2 is broken, it also means that the power circuit is broken. The power circuit break can immediately trigger the power-off protection mechanism of the electronic control device, thereby achieving a power-off protection effect with fast response speed and high protection efficiency.

[0075] More specifically, the power-off protection mechanism of the electronic control equipment can be an operating mechanism for disconnecting the main circuit, or an operating mechanism for disconnecting the main circuit, or a switching means for disconnecting the main circuit power system. This is only used as an application understanding of the technical solution of the present application and is not an enumeration to limit the scope of use of the present application.

[0076] As another embodiment 1001 of embodiment 10, when the substrate 1 is damaged or broken, and the path of the damage or breakage happens to pass through the gap G, it is not easy to cause the conductive protective layer 2 to be disconnected. There may be a situation where the conductive protective layer 2 is avoided by chance and the power-off protection fails to be triggered, such as Fig.11A power-off protection method is shown, in which there is at least one encircling ring structure composed of a conductive layer 23 between the center of the substrate 1 and the outer edge of the substrate 1. More specifically, an encircling ring structure surrounding the center of the substrate 1 is adopted, so that the conductive layer 23 can form a protective ring structure without an obvious direct gap to the outside world, and there is no longer a straight or nearly straight through gap between the center of the substrate 1 and the outer edge of the substrate 1, so as to avoid the situation that when the substrate 1 is damaged or broken, the damaged or broken path accidentally avoids the conductive protective layer 2 so that the power-off protection fails to be triggered. It can effectively avoid the problem that the broken path accidentally avoids the conductive protective layer 2, and ensures that when the substrate 1 is damaged or broken, the conductive protective layer 2 can be disconnected to trigger the power-on circuit to disconnect and realize power-off protection.

[0077] As another embodiment of Embodiment 10, the electric control device determines that the environment is in a safe state by connecting the power circuit, and determines that the environment is in a dangerous state by disconnecting the power circuit. More specifically, when the electric control device determines that the current environment is in a safe state, it can connect the main circuit to facilitate users to perform safe production operations or normal equipment operation. When the power circuit is connected, the electric control device maintains continuous connection of the main circuit. When the substrate is damaged or broken, it is determined that the current environment is in a dangerous state. The electric control device immediately activates the power-off protection mechanism, disconnects the main circuit to prevent the main circuit from continuing to output power to the outside world, stops the power supply capacity of the main circuit, and avoids hidden dangers such as leakage or fire.

[0078] As another embodiment of Example 10, the electric control device determines whether the environment is in a dangerous state by connecting the power circuit, and determines whether the environment is in a safe state by disconnecting the power circuit. More specifically, in the use of some temporary generator sets or emergency power supply systems, when the main circuit is disconnected, the temporary generator set or emergency power supply system provides temporary power supply. At this time, the temporary power supply triggers the connection of the power circuit. When the main circuit is repaired and the power supply is restored, the operation of the mechanism or mechanism that destroys the substrate is triggered, so that the substrate is broken to disconnect the conductive protective layer and cause the power circuit to be disconnected. The electric control device determines that the environment is in a safe state, and triggers the electric control device to control the temporary generator set or emergency power supply system to stop operating. This control method can be used as a temporary emergency control means.

[0079] As another embodiment of Example 10, the substrate 1 is made of brittle material. The brittle material has the characteristics of high hardness and complete fragmentation and separation. When subjected to a certain degree of external pressure, impact or collision, it can instantly break and shatter. When the substrate 1 is broken, the conductive protective layer 2 is disconnected, causing the power-on circuit to be disconnected to trigger the power-off protection mechanism of the electronic control equipment, thereby achieving an instantaneous protection effect against substrate damage.

[0080] As another embodiment of the tenth embodiment, the conductive protective layer 2 is attached to the substrate 1 by coating, adhesion, screen printing, physical vapor deposition or the like to form an easily fractured layer structure without toughness and ductility.

[0081] More specifically, the conductive protective layer 2 is formed on the substrate 1 by an attachment method such as coating, adhesion, silk screen printing or physical vapor deposition. The conductive protective layer 3 itself does not have toughness and ductility. Therefore, when the substrate 1 is damaged or broken, the damaged or broken part must first pass through the conductive protective layer 2 surrounding it. When the adhesion layer of the conductive protective layer 2 is broken, it also means that the power-on circuit is broken. The power-on circuit break can immediately trigger the power-off protection mechanism of the electronic control equipment, thereby achieving a power-off protection effect with fast response speed and high protection efficiency.

[0082] Embodiment 11: On the basis of Example 10, the conductive heating layer 3 is arranged on the substrate 1, and the conductive protective layer 2 surrounds the conductive heating layer 3 to form a protective area. When the environment is in a safe state, the circuit of the conductive heating layer 3 can be turned on to achieve a heating effect. When the environment is in a dangerous state, the power-off protection can be triggered to stop the heating effect of the conductive heating layer 3. More specifically, on the basis of realizing the power-off protection, the heating function is introduced into the substrate 1 to meet the user's heating needs. Under normal conditions, the conductive heating layer 3 can be turned on and the conductive heating layer 3 can be used to heat the environment or the objects it contacts to achieve normal heating effects. When the power-on circuit is disconnected, the electronic control device determines that the environment is in a dangerous state, and triggers the power-off protection mechanism of the electronic control device to stop the heating effect of the conductive heating layer 3.

[0083] like Figures 1 to 6 As shown, one of the specific embodiments of the present invention is as follows: During the production, the substrate 1 is made of a brittle insulator. The outer structure of the substrate 1 is first processed to form a surface for the conductive protective layer 2 to adhere to. Then the conductive protective layer 2 is formed on the substrate 1 by an adhesion method such as coating, adhesion, silk screen printing or physical vapor deposition. The conductive layer 23 of the conductive protective layer 2 is formed in a surrounding single-line structure along the outer contour of the substrate 1 between the edge and the center of the surface of the substrate 1. The conductive layer 23 has a first terminal 21 and a second terminal 22 at both ends, respectively, and a gap G is formed between the first terminal 21 and the second terminal 22. The substrate 1 is installed on the switch housing 5, and the switch housing 5 can be installed on other equipment or objects. The first terminal 21 and the second terminal 22 are respectively connected to two electrode members 6 on the switch housing 5, and the electrode members 6 are respectively used to trigger the power-off protection of the electric control device to form a power-on circuit.

[0084] During use, when the substrate 1 is intact, the conductive protective layer 2 maintains the connectivity of the power circuit, and the external electronic control device judges that the use scenario of the substrate 1 is in a normal state. When the substrate 1 is damaged or broken, the conductive protective layer 2 is disconnected synchronously due to the damage of the substrate 1, resulting in the disconnection of the power circuit, which can be judged as an abnormal use state. Since the conductive protective layer 2 is formed on the substrate 1 by an attachment method such as coating, adhesion, silk screen printing or physical vapor deposition, the conductive protective layer 3 itself does not have toughness and ductility. Therefore, when the substrate 1 is damaged or broken, the damaged or broken part must first pass through the conductive protective layer 2 surrounding it. When the adhesion layer of the conductive protective layer 2 is broken, it also means that the power circuit is broken. The power circuit disconnection can immediately trigger the power-off protection mechanism of the external electronic control device, thereby achieving a power-off protection effect with fast response speed and high protection efficiency.

[0085] like Figures 1 to 4 As shown, the second specific implementation mode of the present invention is as follows: During the production, the substrate 1 is made of a brittle insulator. The outer structure of the substrate 1 is first processed to form a surface for the conductive protective layer 2 and the conductive heating layer 3 to attach. The heating layer 31 of the conductive heating layer 3 uses nano-semiconductor metal oxide as a conductive and heating material. The heating layer 31 can be attached to the surface of the substrate 1 by physical vapor deposition (PVD), chemical vapor deposition (CVD), silk screen (SS), far infrared spectroscopy (FI), etc., and a fixed heating area is formed after high-temperature sintering. The first electrode 321 and the second electrode 322 are respectively arranged on both sides of the heating layer 31. The conductive protective layer 3 is located in the area between the outer edge of the substrate 1 and the outer edge of the conductive heating layer 3, and surrounds the conductive heating layer 3 with an open structure to form a protective area. The conductive heating layer 3 is located in the protective area, and the conductive protective layer 3 and the conductive heating layer 3 are arranged at an interval.

[0086] When in use, the first electrode 221 and the second electrode 222 of the electrode layer 22 are electrically connected to an external power source respectively so that current is conducted through the heating layer 21 , and the heating layer 21 is energized to generate heat to achieve a normal heating effect.

[0087] When the substrate 1 is damaged or broken, the damaged or broken path first passes through the conductive protective layer 2 and then enters the conductive heating layer 3. When the adhesion layer of the conductive protective layer 2 is broken, it also means that the power circuit is broken. The power circuit is broken and can immediately trigger the power-off protection mechanism of the external electronic control equipment, which can immediately disconnect the circuit to stop the heating of the conductive heating layer 3, prevent the conductive heating layer 3 from continuing to heat up when damaged, and avoid safety hazards caused by circuit leakage.

[0088] like Figure 7 As shown, the third specific implementation mode of the present invention is as follows: On the basis of the second specific implementation, during production, the substrate 1 is made of a brittle insulator, and the outer structure of the substrate 1 is first processed to form surface A and surface B, the conductive heating layer 3 is located on one of the surfaces A and B, and the conductive protective layer 3 is located on the other of the surfaces A and B.

[0089] like Figure 8 As shown, the fourth specific implementation mode of the present invention is as follows: The conductive protective layer 2 is connected end to end in a surrounding shape to form a protective area surrounding the conductive heating layer 3. The conductive layer 23 of the conductive protective layer 2 forms a closed and closed surrounding area. The conductive heating layer 3 is located in the surrounding area. The substrate 1 is made of materials that are easily conductive under certain circumstances, such as microcrystalline glass or microcrystalline ceramics. The conductive protective layer 2 extends a conductive lead 24 that can be used for grounding toward the conductive heating layer 3. The conductive protective layer 2 extends a grounding lead 25 away from the conductive heating layer 3. When the conductive heating layer 3 is overheated and the substrate 1 exhibits conductive characteristics under high temperature, the current of the conductive heating layer 3 can be connected to the grounding lead 25 through the conductive lead 24 to be conducted to the grounding position to avoid the risk of leakage.

[0090] like Fig.12 As shown, the fifth specific embodiment of the present invention is as follows: S11, the electric control device for triggering the power-off protection is connected to the conductive protective layer on the substrate to form a power-on circuit; S12, judging whether the power-off protection of the electric control device is triggered by the state of the power-on circuit; S13.1. The substrate is intact and the power circuit is connected; S13.2, the substrate is damaged and the power circuit is disconnected; S14, the power circuit is disconnected, triggering the power-off protection of the electric control equipment; S15, the electric control equipment disconnects the main circuit through the power-off protection mechanism; The above examples are only used to further illustrate the technical content of the present invention, so that readers can understand it more easily, but they do not mean that the implementation of the present invention is limited to this. Any technical extension or re-creation made according to the present invention is protected by the present invention. The protection scope of the present invention shall be subject to the claims.

Claims

1. A power-off protection switch, characterized in that: The invention comprises a substrate (1) and a conductive protective layer (2) arranged on the substrate (1); the conductive protective layer (2) can be disconnected as the substrate (1) is damaged; the conductive protective layer (2) can be electrically connected to an external electric control device for triggering power-off protection to form a power-on circuit; when the substrate (1) is damaged, the conductive protective layer (2) is disconnected, causing the power-on circuit to be disconnected, thereby triggering power-off protection.

2. A power-off protection switch according to claim 1, characterized in that: The conductive protective layer (2) comprises a conductive layer (23) arranged in a surrounding shape, one end of the conductive layer (23) having a first endpoint (21), the other end of the conductive layer (23) having a second endpoint (22), a gap G being provided between the first endpoint (21) and the second endpoint (22), the first endpoint (21) and the second endpoint (22) being respectively connected to an external electric control device to form a power-on circuit.

3. A power-off protection switch according to claim 2, characterized in that: The distance between the first endpoint (21) and the center of the substrate (1) is smaller than the distance between the second endpoint (22) and the center of the substrate (1); an imaginary straight line k is formed between the second endpoint (22) and the center of the substrate (1); the first endpoint (21) and the straight line k are offset; the direction of the straight line k toward the first endpoint (21) is direction p; the conductive layer (23) extends from the second endpoint (22) toward direction p and circles the center of the substrate (1) at least once before connecting to the first endpoint (21).

4. A power-off protection switch according to any one of claims 1 to 3, characterized in that: It also includes a conductive heating layer (3) arranged on the substrate (1), the conductive protective layer (2) is located in the area between the outer edge of the substrate (1) and the outer edge of the conductive heating layer (3), and the conductive protective layer (2) and the conductive heating layer (3) are arranged at a distance.

5. A power-off protection switch according to claim 1, characterized in that: The conductive protective layer (2) is connected end to end in a surrounding shape to form a protective area surrounding the conductive heating layer (3), the conductive protective layer (2) extends a conductive lead (24) in the direction of the conductive heating layer (3), and the conductive protective layer (2) additionally leads out a ground lead (25).

6. A power-off protection switch according to claim 2, characterized in that: The conductive layer (23) extends from one of the first end point (21) and the second end point (22) and passes through the area between the other of the first end point (21) and the second end point (22) and the center of the substrate (1). The conductive layer (23) surrounds the center of the substrate (1) so that there is at least one layer of an encircling ring structure composed of the conductive layer (23) between the center of the substrate (1) and the outer edge of the substrate (1).

7. A power-off protection method, characterized in that: Protection methods include: An electric control device for triggering power-off protection is connected to the conductive protective layer (2) on the substrate (1) to form an electric circuit; Determine whether to trigger the power-off protection of the electric control equipment by the state of the power-on circuit; When the substrate (1) is damaged, the conductive protective layer (2) is disconnected, causing the power circuit to be disconnected; The disconnection of the power circuit triggers the power-off protection of the electronic control equipment.

8. The power-off protection method according to claim 7, characterized in that: The electric control device determines whether the environment is in a safe state by either connecting or disconnecting the power circuit, and determines whether the environment is in a dangerous state by either connecting or disconnecting the power circuit.

9. The power-off protection method according to claim 8, characterized in that: The conductive protective layer (2) surrounds the conductive heating layer (3) to form a protective area; when the environment is in a safe state, the circuit of the conductive heating layer (3) can be turned on to achieve a heating effect; when the environment is in a dangerous state, a power-off protection can be triggered to stop the heating effect of the conductive heating layer (3).

10. The power-off protection method according to claims 7-9, characterized in that: The substrate (1) is made of a brittle material, and when the substrate (1) breaks, the conductive protective layer (2) is disconnected, causing the power circuit to be disconnected, thereby triggering power-off protection.

11. The power-off protection method according to claims 7-9, characterized in that: The conductive protective layer (2) is attached to the substrate (1) by one of the following methods: coating, adhesion, screen printing, physical vapor deposition, etc., to form an easily fractured layer structure that lacks toughness and ductility.

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