A wafer conversion device for semiconductor processing

Abstract

The present invention belongs to the technical field of semiconductor manufacturing, and discloses a wafer conversion device for semiconductor processing, including a mounting base. A connecting sleeve is fixedly sleeved in the middle of the mounting base. A plurality of guiding grooves are equidistantly formed in the circumferential direction of the bottom surface of the mounting base. A clamping mechanism is slidably sleeved in the middle of each of the plurality of guiding grooves. The clamping mechanism includes a sliding seat, which is slidably sleeved with the guiding groove. A middle block is fixedly installed on one side of the bottom surface of the sliding seat away from the mounting base. Nitrogen with required temperature and humidity is sprayed onto the bottom surface of the wafer through a conduit and a jet block, and is sprayed onto the upper surface of the wafer through a through groove and a fixing plug, so as to form a nitrogen protection layer with required temperature and humidity on the upper and lower surfaces of the wafer, isolating the adverse effects of external changing air, humidity and temperature on the wafer, and solving the problem that the wafer is deformed and damaged due to the clamping device, dust in the environment, changing temperature and humidity during the wafer conversion process.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor manufacturing, and specifically relates to a wafer conversion device for semiconductor processing. Background Art

[0002] A wafer conversion device for semiconductor processing is a device specifically designed to safely and efficiently transfer wafers between different processing platforms during the semiconductor manufacturing process. This device is very important for ensuring the integrity and non-damage of wafers throughout the manufacturing process, especially when different process steps need to be frequently switched.

[0003] When the existing clamping device clamps the wafer during the operation, the wafer is usually fixed by clamping the edge of the wafer. Due to the uneven distribution of the clamping force and the force applied to the edge of the wafer, the edge of the wafer will be subjected to the clamping force, causing the wafer to bend and deform, and then reducing the flatness of the wafer surface, resulting in an increase in the defective rate of the chips produced after the wafer. In addition, during the transfer process of the wafer, dust, temperature fluctuations, and humidity changes in the environment will cause internal stress in the wafer, resulting in internal deformation and surface damage of the wafer. This will not only reduce the manufacturing accuracy of the wafer, but also significantly increase the production cost. Therefore, it is necessary to ensure dust prevention, constant temperature and humidity, etc. during the wafer conversion process. Summary of the Invention

[0004] The purpose of the present invention is to provide a wafer conversion device for semiconductor processing to solve the problems raised in the above background art.

[0005] To achieve the above object, the present invention provides the following technical solution: A wafer conversion device for semiconductor processing, including a mounting base, a connecting sleeve is fixedly sleeved in the middle of the mounting base, a plurality of guiding grooves are equidistantly arranged on the circumference of the bottom surface of the mounting base, a clamping mechanism is slidably sleeved in the middle of each of the plurality of guiding grooves, the clamping mechanism includes a sliding seat, the sliding seat is slidably sleeved with the guiding groove, a middle block is fixedly installed on one side of the bottom surface of the sliding seat away from the mounting base, a side block is fixedly installed on the upper part of the side of the middle block away from the mounting base, an air jet block is movably sleeved at the bottom end of the middle block, a conduit is fixedly sleeved on one side of the air jet block, the conduit is fixedly sleeved with the mounting base, a pulling belt is fixedly installed at the end of the air jet block away from the mounting base, the top end of the pulling belt passes through the inner cavity of the sliding seat and is fixedly connected with the connecting sleeve, a first movable seat is fixedly installed on one side of the upper surface of the air jet block away from the mounting base, a sleeve is fixedly installed on the bottom surface of the side block, an elastic member is fixedly installed on the top surface of the inner cavity of the sleeve, a sleeve rod is fixedly installed at the bottom end of the elastic member, the sleeve rod is slidably sleeved with the sleeve, and the bottom end of the sleeve rod is movably sleeved with the first movable seat. An installation shell is fixedly installed on the upper surface of the mounting base, a plurality of side grooves are equidistantly arranged on the outer curved surface of the installation shell in the circumferential direction, a pushing mechanism is arranged between the plurality of side grooves and the clamping mechanism, a top plate is fixedly installed at the top end of the installation shell, a plurality of input pipes are fixedly sleeved equidistantly in the circumferential direction in the middle of the top plate, a main shaft is movably sleeved in the middle of the mounting base, a temperature and humidity mechanism is arranged in the upper part of the inner cavity of the installation shell, a storage mechanism is arranged in the middle of the inner cavity of the installation shell, and an auxiliary driving mechanism is arranged at the bottom of the inner cavity of the installation shell.

[0006] Preferably, the pushing mechanism includes a plurality of second movable seats, the plurality of second movable seats are respectively fixedly installed on one side of the upper surfaces of the plurality of sliding seats away from the mounting base, a curved rod is movably sleeved in the middle of each of the plurality of second movable seats, a third movable seat is movably sleeved at the top of each of the plurality of curved rods, a slider is fixedly installed on one side of each of the plurality of third movable seats close to the installation shell, the plurality of sliders are respectively slidably sleeved with the adjacent side grooves, the contact surface between the slider and the side groove is a smooth surface, wear-resistant coatings are arranged on the contact surfaces between the sliders and the side grooves, a connecting ring is fixedly installed at the top end of each of the plurality of sliders, telescopic rods are fixedly installed equidistantly on the outer curved surface of the installation shell in the circumferential direction, and the telescopic ends of the telescopic rods are fixedly connected with the connecting ring.

[0007] Preferably, a plurality of through grooves are equidistantly arranged on the circumference of the bottom surface of the main shaft, the through grooves are located above the mounting base, a fixed plug is fixedly sleeved on the inner curved surface of the bottom of the main shaft, the fixed plug is located above the through grooves, a nozzle is fixedly sleeved on the inner curved surface of the bottom of the main shaft, the nozzle is located below the through grooves, a driving member is arranged in the middle of the top plate, the main shaft is fixedly sleeved in the middle of the driving sleeve of the driving member, and the top end of the main shaft is connected with the power device of the external device that drives the wafer conversion device to move.

[0008] Preferably, the temperature and humidity mechanism includes a solution shell fixedly sleeved on the upper part of the inner curved surface of the installation shell. A plurality of electro-hydraulic plates are fixedly sleeved on the middle part of the solution shell at equal intervals. The middle part of the electro-hydraulic plate is made of hard metal material. A plurality of partition plates are fixedly sleeved on the upper part of the outer curved surface of the temperature and humidity mechanism at equal intervals. The plurality of partition plates are respectively located at the middle positions between two adjacent partition plates. A plurality of centrifugal blades are fixedly installed on the upper surface of the partition plate at equal intervals along the circumference.

[0009] Preferably, the storage mechanism includes two separation plates fixedly sleeved on the upper and lower parts of the inner curved surface of the installation shell respectively. A one-way valve is arranged between the upper separation plate and the main shaft. The one-way valve is fixedly connected to the upper separation plate and movably sleeved on the main shaft. The gas flow direction of the one-way valve is from top to bottom. A pressure valve is arranged between the bottom separation plate and the main shaft. The pressure valve is fixedly sleeved on the bottom separation plate and movably sleeved on the main shaft.

[0010] Preferably, the auxiliary drive mechanism includes a guide disk fixedly sleeved on the bottom of the outer curved surface of the main shaft. A scroll disk is fixedly sleeved on the bottom of the outer curved surface of the main shaft. The scroll disk is located at the bottom of the guide disk. A plurality of scroll blades are fixedly installed on the outer curved surface of the guide disk at equal intervals along the circumference. There are gaps between the guide disk and the scroll disk and the lower separation plate respectively.

[0011] Preferably, the air outlet holes on one side of the jet block close to the mounting seat deflect counterclockwise. The conduit is made of rubber material. The pull belt is woven with high-strength material. The installation shell is made of heat-insulating material.

[0012] The beneficial effects of the present invention are as follows:

[0013] 1. First, by starting the temperature and humidity mechanism of the present invention, the temperature and humidity mechanism heats, humidifies and pressurizes the nitrogen flowing through the gap between the electro-hydraulic plate and the partition plate. After the nitrogen flowing through the temperature and humidity mechanism reaches the required temperature, humidity and pressure, the nitrogen flows through the one-way valve into the sealed space formed between the upper and lower separation plates in the inner cavity of the installation shell, so that the space formed between the upper and lower separation plates in the inner cavity of the installation shell is filled with high-pressure nitrogen gas with the required temperature and humidity. When the gas pressure reaches the set requirement of the pressure valve, the pressure valve is pushed to open the valve, and the gas flows through the pressure valve to the bottom of the pressure valve. At this time, since the space at the bottom of the pressure valve increases, the high-pressure gas starts to automatically decompress to a suitable pressure range, and finally sprays the nitrogen gas with the required temperature and humidity onto the bottom surface of the wafer through the conduit and the jet block, and sprays the nitrogen gas with the required temperature and humidity onto the upper surface of the wafer through the through groove and the fixed plug, so as to form a nitrogen protection layer with the required temperature and humidity on the upper and lower surfaces of the wafer, isolating the adverse effects caused by the changes of external air, humidity and temperature on the deformation of the wafer.

[0014] 2. In addition, when the device suddenly loses power during the conversion process, loses power, has its nitrogen supply cut off, or when the nitrogen cylinder of the external nitrogen output device is replaced, the one-way valve closes at this time. The high-pressure nitrogen with the required temperature and humidity between the two separation plates in the inner cavity of the installation shell continues to push the pressure valve open. When passing through the scroll blades, the scroll disk is driven to rotate by the scroll blades. The scroll disk drives the main shaft fixedly connected to it to rotate, and the main shaft continues to drive the external moving device connected to it to drive the wafer protected by nitrogen with the required temperature and humidity to be transferred to the storage area.

[0015] 3. When the present invention clamps the wafer, the pushing mechanism is started. The pushing mechanism pushes the sliding seat to move away from the mounting seat. The sliding seat drives the middle block to move away from the mounting seat, and the middle block drives the air jet block to move away from the mounting seat. At the same time, since the length of the pulling belt is fixed, at this time, the pulling belt pulls the air jet block to rotate downward away from the mounting seat, and the air outlet hole on the side of the pulling belt close to the mounting seat moves downward. At the same time, the air jet block squeezes the elastic member to contract through the first movable seat and the sleeve rod, so that the gas ejected from the air outlet hole of the air jet block always points to the middle of the multiple air jet blocks. When the air jet blocks open until the wafer is located in the middle position of the multiple air jet blocks, and when it is converted to move downward until the air jet blocks are located below the wafer, the nitrogen with the required temperature and humidity ejected from the outlet holes of the air jet blocks pushes the wafer to move upward and rotate at the same time. At this time, since the linear velocity in the middle of the wafer is less than the linear velocity on the outer side of the wafer, the gas sprayed on the middle part moves toward the outer side and adheres to the surface of the wafer under the action of atmospheric pressure, forming a protective layer on the surface and edge of the wafer, thereby preventing the edge of the wafer from contacting and colliding with the middle block and the air jet block. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall external structure of the present invention;

[0017] Figure 2 It is a schematic diagram of the clamping mechanism structure of the present invention;

[0018] Figure 3 It is a schematic diagram of the mounting seat structure of the present invention;

[0019] Figure 4 It is a schematic diagram of the temperature and humidity mechanism structure of the present invention;

[0020] Figure 5 It is a schematic diagram of the main shaft structure of the present invention.

[0021] In the figure: 1. Mounting base; 101. Connecting sleeve; 102. Guide groove; 2. Clamping mechanism; 201. Sliding seat; 202. Middle block; 203. Side block; 204. Jet block; 205. Conduit; 206. Pulling belt; 207. First movable seat; 208. Sleeve; 209. Elastic member; 210. Sleeve rod; 3. Mounting shell; 301. Side groove; 302. Top plate; 303. Input pipe; 4. Pushing mechanism; 401. Second movable seat; 402. Curved rod; 403. Third movable seat; 404. Slide block; 405. Connecting ring; 406. Telescopic rod; 5. Main shaft; 501. Through groove; 502. Fixed plug; 503. Nozzle; 504. Driving member; 6. Temperature and humidity mechanism; 601. Solution shell; 602. Electro-hydraulic plate; 603. Partition plate; 604. Centrifugal blade; 7. Storage mechanism; 701. Separation plate; 702. Check valve; 703. Pressure valve; 8. Auxiliary driving mechanism; 801. Guide disk; 802. Vortex disk; 803. Vortex blade. Detailed implementation mode

[0022] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0023] As Figures 1 to 5As shown in the figure, an embodiment of the present invention provides a wafer conversion device for semiconductor processing, including a mounting base 1. A connecting sleeve 101 is fixedly sleeved in the middle of the mounting base 1. A plurality of guiding grooves 102 are equidistantly arranged on the circumference of the bottom surface of the mounting base 1. A clamping mechanism 2 is slidably sleeved in the middle of each of the plurality of guiding grooves 102. The clamping mechanism 2 includes a sliding seat 201 which is slidably sleeved with the guiding groove 102. A middle block 202 is fixedly installed on one side of the bottom surface of the sliding seat 201 away from the mounting base 1. A side block 203 is fixedly installed on the upper part of the side of the middle block 202 away from the mounting base 1. An air jet block 204 is movably sleeved at the bottom end of the middle block 202. The air outlet holes on the side of the air jet block 204 close to the mounting base 1 are deflected counterclockwise, so as to realize that the nitrogen gas ejected from the air outlet holes of the air jet block 204 pushes the wafer floating above it to rotate. According to the principle that the linear velocity inside the wafer is less than that outside the wafer and Bernoulli's principle, the pressure on the side with a large flow rate is less than the pressure on the side with a small flow rate. The nitrogen gas sprayed on the middle part of the wafer surface flows along the middle part of the wafer and adheres to the wafer surface towards the outside of the wafer, improving the nitrogen gas density on the wafer surface and further improving the wafer protection effect. A conduit 205 is fixedly sleeved on one side of the air jet block 204. The upper part of the conduit 205 is fixedly sleeved with the mounting base 1. The conduit 205 is made of rubber material, so as to improve the bending performance of the conduit 205 and avoid breaking the conduit 205 when the air jet block 204 moves away from the mounting base 1. A pulling belt 206 is fixedly installed at one end of the air jet block 204 away from the mounting base 1. The top end of the pulling belt 206 passes through the inner cavity of the sliding seat 201 and is fixedly connected with the connecting sleeve 101. The pulling belt 206 is woven with high-strength materials and is made of carbon fiber, so as to improve the strength and service life of the pulling belt 206, avoid breaking of the pulling belt 206 when pulling the air jet block 204 to rotate, and improve the service life of the pulling belt 206;

[0024] Among them, a first movable seat 207 is fixedly installed on one side of the upper surface of the jet block 204 away from the mounting seat 1. A sleeve 208 is fixedly installed on the bottom surface of the side block 203. An elastic member 209 is fixedly installed on the top surface of the inner cavity of the sleeve 208. The bottom end of the elastic member 209 is fixedly installed with a sleeve rod 210. The sleeve rod 210 is slidably sleeved with the sleeve 208. The bottom end of the sleeve rod 210 is movably sleeved with the first movable seat 207. An installation shell 3 is fixedly installed on the upper surface of the mounting seat 1. The installation shell 3 is made of a heat-insulating material. The installation shell 3 is made of high-carbon steel, so as to prevent a large amount of heat of the required temperature and humidity nitrogen in the container formed by the upper and lower separation plates 701 in the inner cavity of the installation shell 3 from flowing to the outside through the installation shell 3, resulting in a poor heat preservation effect of the wafer. A plurality of side grooves 301 are equidistantly arranged on the outer curved surface circumference of the installation shell 3. A pushing mechanism 4 is arranged between the plurality of side grooves 301 and the clamping mechanism 2. A top plate 302 is fixedly installed at the top end of the installation shell 3. A plurality of input pipes 303 are fixedly sleeved on the circumference of the middle part of the top plate 302 at equal intervals. A main shaft 5 is movably sleeved in the middle of the mounting seat 1. A temperature and humidity mechanism 6 is arranged in the upper part of the inner cavity of the installation shell 3. A storage mechanism 7 is arranged in the middle of the inner cavity of the installation shell 3. An auxiliary drive mechanism 8 is arranged at the bottom of the inner cavity of the installation shell 3.

[0025] As Figure 1 、 Figure 2 shown, the pushing mechanism 4 includes a plurality of second movable seats 401. The plurality of second movable seats 401 are respectively fixedly installed on one side of the upper surface of the plurality of sliding seats 201 away from the mounting seat 1. The middle parts of the plurality of second movable seats 401 are movably sleeved with curved rods 402. The top parts of the plurality of curved rods 402 are movably sleeved with third movable seats 403. A slider 404 is fixedly installed on one side of each of the plurality of third movable seats 403 close to the installation shell 3. The plurality of sliders 404 are respectively slidably sleeved with adjacent side grooves 301. The contact surface between the slider 404 and the side groove 301 is a smooth surface. Wear-resistant coatings are provided on the contact surfaces between the sliders 404 and the side grooves 301, so as to reduce the frictional resistance between the curved rod 402 and the side groove 301, reduce the load when the telescopic rod 406 pushes the second movable seat 401 to slide up and down along the side groove 301 through the connecting ring 405, reduce the wear between the curved rod 402 and the side groove 301, and reduce the subsequent friction vibration between the curved rod 402 and the side groove 301. A connecting ring 405 is fixedly installed at the top end of each of the plurality of sliders 404. Telescopic rods 406 are fixedly installed on the outer curved surface circumference of the installation shell 3 at equal intervals. The telescopic end of the telescopic rod 406 is fixedly connected with the connecting ring 405.

[0026] As Figure 1 、 Figure 4 and Figure 5As shown in the figure, a plurality of through grooves 501 are equidistantly arranged on the bottom circumference of the curved surface of the main shaft 5. The through grooves 501 are located above the mounting base 1. A fixed plug 502 is fixedly sleeved at the bottom of the inner curved surface of the main shaft 5. The fixed plug 502 is located above the through grooves 501. A nozzle 503 is fixedly sleeved at the bottom of the inner curved surface of the main shaft 5. The nozzle 503 is located below the through grooves 501. A driving member 504 is provided in the middle of the top plate 302. The main shaft 5 is fixedly sleeved in the middle of the driving sleeve of the driving member 504. The top end of the main shaft 5 is connected to the power device of the external device that drives the wafer conversion device to move. Thus, when the device suddenly loses power during the conversion process, the nitrogen supply is lost, and the nitrogen cylinder of the external nitrogen output device is replaced, the storage mechanism 7 and the auxiliary drive mechanism 8 drive the main shaft 5 to rotate, and the main shaft 5 continues to drive the external moving device connected thereto to continue driving the wafer protected by nitrogen at the required temperature and humidity to be transferred to the storage area.

[0027] As Figure 4 shown, the temperature and humidity mechanism 6 includes a solution shell 601. The solution shell 601 is fixedly sleeved on the upper part of the inner curved surface of the mounting shell 3. A plurality of electro-hydraulic plates 602 are fixedly sleeved equidistantly in the middle of the solution shell 601. The middle part of the electro-hydraulic plate 602 is made of hard metal material. The electro-hydraulic plate 602 is made of nickel-chromium alloy. Thus, when the electro-hydraulic plate 602 is powered on, the electro-hydraulic plate 602 heats the pure water in the inner cavity of the solution shell 601, and at the same time prevents the electro-hydraulic plate 602 from bending and deforming and contacting the partition plate 603. Absorbent coatings are provided on the upper and lower surfaces of the electro-hydraulic plate 602. The absorbent coating is made of cotton material. Thus, the pure water in the inner cavity of the solution shell 601 is conducted from the pure water in the inner cavity of the solution shell 601 to the inner sides of the upper and lower surfaces of the electro-hydraulic plate 602. A plurality of partition plates 603 are fixedly sleeved equidistantly on the upper part of the outer curved surface of the temperature and humidity mechanism 6. The plurality of partition plates 603 are respectively located at the middle positions between two adjacent partition plates 603. A plurality of centrifugal blades 604 are fixedly installed equidistantly on the circumferential surface of the upper surface of the partition plate 603.

[0028] As Figure 4 shown, the storage mechanism 7 includes two separation plates 701. The two separation plates 701 are respectively fixedly sleeved on the upper and lower parts of the inner curved surface of the mounting shell 3. A one-way valve 702 is provided between the upper separation plate 701 and the main shaft 5. The one-way valve 702 is fixedly connected to the upper separation plate 701. The one-way valve 702 is movably sleeved on the main shaft 5. The gas flow direction of the one-way valve 702 is from top to bottom. Thus, when the external nitrogen output device suddenly stops inputting nitrogen, the one-way valve 702 closes, preventing the high-pressure nitrogen stored between the two separation plates 701 in the inner cavity of the mounting shell 3 from flowing back. A pressure valve 703 is provided between the bottom separation plate 701 and the main shaft 5. The pressure valve 703 is fixedly sleeved on the bottom separation plate 701. The pressure valve 703 is movably sleeved on the main shaft 5.

[0029] As Figure 5As shown in the figure, the auxiliary drive mechanism 8 includes a guide disk 801, which is fixedly sleeved on the bottom of the outer surface of the main shaft 5. A scroll disk 802 is fixedly sleeved on the bottom of the outer surface of the main shaft 5. The scroll disk 802 is located at the bottom of the guide disk 801. A plurality of scroll blades 803 are fixedly installed at equal intervals on the outer circumferential surface of the guide disk 801. There are gaps between the guide disk 801 and both the scroll disk 802 and the lower separation plate 701, so as to avoid mutual friction between the guide disk 801 and the scroll disk 802 and the lower separation plate 701, and reduce the resistance when the main shaft 5 rotates.

[0030] Working principle:

[0031] When the present invention is in use, pure water is first poured into the inner cavity of the solution shell 601, and the water level height is adjusted according to the humidity requirements during the wafer conversion process, so that the pure water immerses an appropriate number of electro-hydrolytic plates 602 from bottom to top. When the humidity requirement is higher, the adjusted water level is higher and the number of electro-hydrolytic plates 602 immersed is more; on the contrary, it is less. At this time, the pure water in the inner cavity of the solution shell 601 flows to the surface of the inner side of the electro-hydrolytic plate 602 in the inner cavity of the solution shell 601 under the adsorption and conduction action of the water-absorbing coating on the surface of the electro-hydrolytic plate 602. Then, the electro-hydrolytic plate 602 is powered on, and the electro-hydrolytic plate 602 heats the pure water to the temperature required during the wafer conversion process;

[0032] Next, start the driving member 504. The output end of the driving member 504 drives the main shaft 5 to rotate. The main shaft 5 drives the partition plate 603, the guide disk 801, and the scroll disk 802 fixedly connected thereto to rotate. Then, start the output device of the external nitrogen. At this time, the output device of the external nitrogen outputs nitrogen from multiple input pipes 303 to the middle of the solution shell 601 in the inner cavity of the installation shell 3. The nitrogen in the middle of the solution shell 601 in the inner cavity of the installation shell 3 passes through the gap between the electro-hydrolysis plate 602 and the partition plate 603 and is centrifugally accelerated and extruded by the rotating partition plate 603 and the centrifugal blade 604 to flow towards the one-way valve 702. After reaching the set pressure of the one-way valve 702, it pushes the valve of the one-way valve 702 to open. At the same time, when the gas flows through the gap between the electro-hydrolysis plate 602 and the partition plate 603, the flowing nitrogen contacts the water absorption layer on the surface of the electro-hydrolysis plate 602 that absorbs the required moisture and temperature, so that the nitrogen gas with the required temperature and humidity flows into the sealed space formed between the two separation plates 701 on the upper and lower sides of the inner cavity of the installation shell 3. Thus, the space formed between the two separation plates 701 on the upper and lower sides of the inner cavity of the installation shell 3 is filled with high-pressure nitrogen gas with the required temperature and humidity. When the gas pressure reaches the set requirement of the pressure valve 703, it pushes the valve of the pressure valve 703 to open, and the gas flows through the pressure valve 703 to the bottom of the pressure valve 703. At this time, due to the increase in the space at the bottom of the pressure valve 703, the high-pressure gas starts to automatically decompress to a suitable pressure range, and finally sprays the nitrogen gas with the required temperature and humidity onto the bottom surface of the wafer through the conduit 205 and the jet block 204, and sprays the nitrogen gas with the required temperature and humidity onto the upper surface of the wafer through the through groove 501 and the fixing plug 502, so as to form a nitrogen protection layer with the required temperature and humidity on the upper and lower surfaces of the wafer, isolating the adverse effects of the changing air, humidity, and temperature in the external environment on the wafer structure;

[0033] In addition, when the device suddenly loses power during the conversion process, the nitrogen supply is lost, and the nitrogen cylinder of the external nitrogen output device is replaced in the present invention. At this time, the one-way valve 702 closes, and the high-pressure nitrogen gas with the required temperature and humidity between the two separation plates 701 in the inner cavity of the installation shell 3 continues to push the pressure valve 703 to open. When passing through the scroll vane 803, it drives the scroll disk 802 to rotate through the scroll vane 803. The scroll disk 802 drives the main shaft 5 fixedly connected thereto to rotate. The main shaft 5 continues to drive the external moving device connected thereto to drive the wafer protected by the nitrogen gas with the required temperature and humidity to be transferred to the storage area;

[0034] In addition, when the present invention clamps the wafer, the telescopic rod 406 is activated. The telescopic end of the telescopic rod 406 drives the connecting ring 405 to move downward. The connecting ring 405 pushes the slider 404 to move downward. The slider 404 drives the third movable seat 403 to move downward. The third movable seat 403 pushes the second movable seat 401 to move away from the mounting seat 1 through the curved rod 402. The second movable seat 401 drives the sliding seat 201 to move away from the mounting seat 1. The sliding seat 201 drives the middle block 202 to move away from the mounting seat 1. The middle block 202 drives the air jet block 204 to move away from the mounting seat 1. At the same time, since the length of the pull belt 206 is fixed, at this time, the pull belt 206 pulls the air jet block 204 to rotate downward away from the mounting seat 1. The air outlet hole on the side of the pull belt 206 close to the mounting seat 1 moves downward. At the same time, the air jet block 204 squeezes the elastic member 209 to contract through the first movable seat 207 and the sleeve rod 210. Thus, the gas ejected from the air outlet hole of the air jet block 204 always points to the middle of the plurality of air jet blocks 204. When the air jet block 204 opens until the wafer is located at the middle position of the plurality of air jet blocks 204, and then moves downward until the air jet block 204 is located below the wafer, the nitrogen gas with the required temperature and humidity ejected from the outlet hole of the air jet block 204 pushes the wafer to move upward and rotate at the same time. At this time, since the linear velocity in the middle of the wafer is less than the linear velocity on the outer side of the wafer, the gas sprayed on the middle part moves toward the outer side and adheres to the surface of the wafer under the action of atmospheric pressure, forming a protective layer on the surface and edge of the wafer, and avoiding the contact and collision between the edge of the wafer and the middle block 202 and the air jet block 204, which may cause damage and deformation of the wafer.

[0035] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device.

[0036] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer conversion device for semiconductor processing, comprising a mounting base (1), characterized in that: A connecting sleeve (101) is fixedly sleeved in the middle of the mounting base (1). A plurality of guiding grooves (102) are equidistantly formed in the circumferential direction of the bottom surface of the mounting base (1). A clamping mechanism (2) is slidably sleeved in the middle of each of the plurality of guiding grooves (102). The clamping mechanism (2) includes a sliding seat (201) which is slidably sleeved with the guiding groove (102). A middle block (202) is fixedly installed on one side of the bottom surface of the sliding seat (201) away from the mounting base (1). An side block (203) is fixedly installed on the upper part of the side of the middle block (202) away from the mounting base (1). An air jet block (204) is movably sleeved at the bottom end of the middle block (202). A conduit (205) is fixedly sleeved on one side of the air jet block (204). The conduit (205) is fixedly sleeved with the mounting base (1). A pull belt (206) is fixedly installed at one end of the air jet block (204) away from the mounting base (1). The top end of the pull belt (206) passes through the inner cavity of the sliding seat (201) and is fixedly connected with the connecting sleeve (101). A first movable seat (207) is fixedly installed on one side of the upper surface of the air jet block (204) away from the mounting base (1). A sleeve (208) is fixedly installed on the bottom surface of the side block (203). An elastic member (209) is fixedly installed on the top surface of the inner cavity of the sleeve (208). A sleeve rod (210) is fixedly installed at the bottom end of the elastic member (209). The sleeve rod (210) is slidably sleeved with the sleeve (208). The bottom end of the sleeve rod (210) is movably sleeved with the first movable seat (207). An installation shell (3) is fixedly installed on the upper surface of the mounting base (1). A plurality of side grooves (301) are equidistantly formed in the circumferential direction of the outer curved surface of the installation shell (3). A pushing mechanism (4) is arranged between the plurality of side grooves (301) and the clamping mechanism (2). A top plate (302) is fixedly installed at the top end of the installation shell (3). A plurality of input pipes (303) are fixedly sleeved equidistantly in the circumferential direction in the middle of the top plate (302). A main shaft (5) is movably sleeved in the middle of the mounting base (1). A temperature and humidity mechanism (6) is arranged in the upper part of the inner cavity of the installation shell (3). A storage mechanism (7) is arranged in the middle of the inner cavity of the installation shell (3). An auxiliary driving mechanism (8) is arranged at the bottom of the inner cavity of the installation shell (3); When the device suddenly loses power during the conversion process, the nitrogen supply is lost, and the nitrogen cylinder of the external nitrogen output device is replaced, the storage mechanism and the auxiliary driving mechanism drive the main shaft to rotate. The main shaft continues to drive the external moving device connected thereto, and the moving device continues to drive the wafer protected by nitrogen at the required temperature and humidity to be transferred to the storage area.

2. The wafer conversion device for semiconductor processing according to claim 1, wherein: The driving mechanism (4) includes a plurality of second movable seats (401). The plurality of second movable seats (401) are respectively fixedly installed on one side of the upper surfaces of the plurality of sliding seats (201) away from the mounting seat (1). A curved rod (402) is movably sleeved in the middle of each of the plurality of second movable seats (401). A third movable seat (403) is movably sleeved at the top of each of the plurality of curved rods (402). A slider (404) is fixedly installed on one side of each of the plurality of third movable seats (403) close to the mounting shell (3). The plurality of sliders (404) are respectively slidably sleeved in adjacent side grooves (301). The contact surface between the slider (404) and the side groove (301) is a smooth surface, and a wear-resistant coating is provided on the contact surface between the slider (404) and the side groove (301). A connecting ring (405) is fixedly installed at the top end of each of the plurality of sliders (404). The outer curved surface of the mounting shell (3) is fixedly installed with a plurality of telescopic rods (406) at equal intervals in the circumferential direction. The telescopic end of the telescopic rod (406) is fixedly connected to the connecting ring (405).

3. A wafer conversion device for semiconductor processing according to claim 1, characterized in that: A plurality of through grooves (501) are equidistantly formed in the circumferential direction at the bottom of the curved surface of the main shaft (5). The through grooves (501) are located above the mounting seat (1). A fixed plug (502) is fixedly sleeved at the bottom of the inner curved surface of the main shaft (5). The fixed plug (502) is located above the through groove (501). A spray head (503) is fixedly sleeved at the bottom of the inner curved surface of the main shaft (5). The spray head (503) is located below the through groove (501). A driving member (504) is provided in the middle of the top plate (302). The main shaft (5) is fixedly sleeved in the middle of the driving sleeve of the driving member (504). The top end of the main shaft (5) is connected to a power device that drives a device for moving a wafer conversion device externally.

4. A wafer conversion device for semiconductor processing according to claim 1, characterized in that: The temperature and humidity mechanism (6) includes a solution shell (601). The solution shell (601) is fixedly sleeved on the upper part of the inner curved surface of the mounting shell (3). A plurality of electro-hydraulic plates (602) are fixedly sleeved in the middle of the solution shell (601) at equal intervals. The middle part of the electro-hydraulic plate (602) is made of a hard metal material. A plurality of partition plates (603) are fixedly sleeved on the upper part of the outer curved surface of the temperature and humidity mechanism (6) at equal intervals. The plurality of partition plates (603) are respectively located at the middle positions between two adjacent partition plates (603). A plurality of centrifugal blades (604) are fixedly installed on the upper surface of the partition plate (603) at equal intervals in the circumferential direction.

5. A wafer conversion device for semiconductor processing according to claim 1, characterized in that: The storage mechanism (7) includes two separation plates (701). The two separation plates (701) are respectively fixedly sleeved on the upper and lower parts of the inner surface of the mounting shell (3). A one-way valve (702) is provided between the upper separation plate (701) and the main shaft (5). The one-way valve (702) is fixedly connected to the upper separation plate (701), and the one-way valve (702) is movably sleeved on the main shaft (5). The gas flow direction of the one-way valve (702) is from top to bottom. A pressure valve (703) is provided between the bottom separation plate (701) and the main shaft (5). The pressure valve (703) is fixedly sleeved on the bottom separation plate (701), and the pressure valve (703) is movably sleeved on the main shaft (5).

6. A wafer conversion device for semiconductor processing according to claim 1, characterized in that: The auxiliary drive mechanism (8) includes a guide disk (801). The guide disk (801) is fixedly sleeved on the bottom of the outer surface of the main shaft (5). A scroll disk (802) is fixedly sleeved on the bottom of the outer surface of the main shaft (5). The scroll disk (802) is located at the bottom of the guide disk (801). A plurality of scroll vanes (803) are fixedly installed equidistantly on the outer circumference of the outer surface of the guide disk (801). There are gaps between the guide disk (801) and the scroll disk (802) and the lower separation plate (701).

7. A wafer conversion device for semiconductor processing according to claim 1, characterized in that: The air outlet holes on the side of the jet block (204) close to the mounting seat (1) deflect counterclockwise. The conduit (205) is made of rubber material. The pull belt (206) is woven with high-strength material. The mounting shell (3) is made of heat-insulating material.

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