A flip-up material taking mechanism for a crystal bonding machine

Abstract

A flip-up material-picking mechanism for a crystal bonding machine includes a support arm, an R-axis motor, a first shaft, a second shaft, a first return spring, a second return spring, an upper limit member, a lower limit member, and a nozzle assembly. The R-axis motor is arranged on the support arm and drives the first shaft. The first shaft has an axially extending accommodating cavity, and the second shaft is arranged in the accommodating cavity; the outer wall of the first shaft is provided with a guide groove connected to the accommodating cavity. The second shaft is provided with a pillar passing through the guide groove; the first return spring and the second return spring are respectively connected to the pillar and the first shaft, so that the second shaft rotates with the first shaft. The upper limit member and the lower limit member are used to limit the rotation of the pillar. The nozzle assembly is arranged on the second shaft and rotates with the second shaft. This flip-up material-picking mechanism drives the first shaft through the R-axis motor, and the first shaft drives the second shaft through the return spring, and accurately limits the rotation angle of the second shaft through the limit member, which not only ensures the flipping accuracy of the second shaft driving the nozzle assembly, but also reduces the accuracy requirements for the R-axis motor.

Description

Technical Field

[0001] The present invention relates to the technical field of crystal bonding machines, and in particular to a flip-loading and material-retrieving mechanism for a crystal bonding machine. Background Art

[0002] A die bonder is a device that places chips on the die. Common die bonders use a flip-chip structure to first absorb the die and then flip it over for placement. The flip-chip structure of a die bonder is typically driven by a motor, with the motor shaft rotating to drive the flip-chip structure. The flip-chip structure of existing die bonders has the following drawbacks when used in actual operation:

[0003] 1) Due to the need for frequent flipping and the hard contact between the flip axis and the limiter of the flip-chip structure, the flipping accuracy may not meet the standard after a period of operation. When placing chips, the accuracy requirements are very high, and the flipping accuracy that does not meet the standard will lead to serious quality problems;

[0004] 2) To solve the problem of decreased flipping accuracy after long-term operation, the goal can be achieved by replacing high-precision motors. However, high-precision motors are much more expensive than ordinary motors currently used, which will undoubtedly increase production costs.

[0005] 3) The size of a suitable high-precision motor is much larger than that of an existing ordinary motor, which makes it difficult to equip a high-precision motor within the limited space of a production line. Summary of the Invention

[0006] In view of the deficiencies in the prior art, the present invention provides a flip-loading and material-retrieving mechanism for a die-bonding machine to overcome the deficiencies in the prior art.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] A flip-up material-picking mechanism for a crystal bonding machine, comprising a support arm, an R-axis motor, a first shaft, a second shaft, a first return spring, a second return spring, an upper limit member, a lower limit member and a suction nozzle assembly, wherein the R-axis motor is arranged on the support arm; the first shaft is connected to the R-axis motor, and the R-axis motor is used to drive the first shaft to rotate; the first shaft has an accommodating cavity extending along the axial direction of the first shaft, and the second shaft is arranged in the accommodating cavity; the outer wall of the first shaft is provided with a guide groove extending along the circumference of the first shaft, and the guide groove is connected to the accommodating cavity, and the outer wall of the first shaft also has a first mounting position and a second mounting position, and the first mounting position and the second mounting position are respectively located at the position where the guide groove is located. On both sides of the circumference of the first shaft; the second shaft, whose outer wall is provided with a pillar, the pillar passes through the guide slot and extends to the outside of the first shaft; the first return spring is arranged between the first mounting position and the pillar; the second return spring is arranged between the second mounting position and the pillar; the second shaft can rotate with the first shaft through the first return spring and the second return spring; the upper limit member and the lower limit member are arranged at intervals on the side of the support arm facing the pillar, and are both located within the rotation trajectory of the pillar, the upper limit member and the lower limit member are used to limit the rotation of the pillar; the suction nozzle assembly is arranged on the second shaft and can rotate with the second shaft.

[0009] Furthermore, a first lug and a second lug are protrudingly provided on the outer wall of the first shaft, and the first lug and the second lug are respectively located on both sides of the guide groove in the circumferential direction of the first shaft, the first mounting position is provided on the first lug, and the second mounting position is provided on the second lug.

[0010] Furthermore, a third lug and a fourth lug are protrudingly provided on the outer wall of the pillar; the third lug of the pillar corresponds to the first lug on the first shaft, and the first return spring is connected between the first lug and the third lug; the fourth lug of the pillar corresponds to the second lug on the first shaft, and the second return spring is connected between the second lug and the fourth lug.

[0011] Preferably, the distance between the outer end of the support and the circumferential surface of the first shaft is greater than the distance between the outer ends of the first lug and the second lug and the circumferential surface of the first shaft.

[0012] Furthermore, the suction nozzle assembly includes a connecting seat, a Z-axis motor, a suction nozzle, a support seat and a force control spring; the connecting seat is connected to the second axis; the Z-axis motor is arranged on the connecting seat and is transmission-connected to the support seat; a transmission slide is provided on the support seat, the force control spring is arranged in the transmission slide, and one end of the force control spring is connected to the support seat, and the other end is connected to the suction nozzle; the suction end of the suction nozzle is detachably connected.

[0013] Preferably, a grating scale sensor is further connected to the second shaft, the sensing direction of the grating scale sensor is toward the suction nozzle and the support seat, and the grating scale sensor rotates along with the second shaft.

[0014] Preferably, the outer wall of the first shaft is also provided with an assembly groove, which is connected to the accommodating cavity so that the circumferential surface of the second shaft is exposed from the assembly groove, and the connecting seat is installed in the assembly groove and connected to the second shaft, so that the suction nozzle assembly rotates with the second shaft through the connecting seat.

[0015] Preferably, the support arm is provided with a mounting hole, the R-axis motor is provided on one side of the support arm, and the output end of the R-axis motor passes through the mounting hole and is connected to the first shaft.

[0016] Preferably, both the upper limit member and the lower limit member are recessed with an arc-shaped avoidance portion.

[0017] Preferably, the R-axis motor is a servo motor; and the Z-axis motor is a linear voice coil motor.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1) In this case, a flip-chip material-retrieving mechanism for a crystal bonding machine drives the first axis through an R-axis motor, and the first axis drives the second axis to rotate through the first return spring and the second return spring, and the second axis drives the suction nozzle assembly to flip, and the upper limit member and the lower limit member only accurately limit the rotation angle of the second axis, without the need to accurately limit the rotation angle of the first axis; thus, the flip-chip material-retrieving structure of the crystal bonding machine in this case does not need to be equipped with an expensive high-precision drive motor to drive the first axis, but only needs to use a lower-priced ordinary R-axis motor to achieve the required rotation angle, which not only reduces the equipment manufacturing cost but also meets the production requirements for precision.

[0020] 2) In this case, a flip-chip material-picking mechanism for a crystal bonding machine connects the first shaft and the second shaft through a first return spring and a second return spring, so that the support on the second shaft has a buffering effect when it contacts the upper limit member and the upper limit member, avoiding long-term hard contact that causes the support on the second shaft or the upper and lower limit members to deform and affect the limit accuracy, further ensuring the production accuracy and stability of the equipment after long-term operation.

[0021] 3) In this case, a flip-chip material-picking mechanism for a die-bonding machine is also provided with a grating scale sensor that rotates synchronously with the second axis to identify the stroke of the suction nozzle driven by the Z-axis motor (linear voice coil motor), thereby further ensuring the accuracy and stability of the suction nozzle in adsorbing material chips; at the same time, the grating scale sensor is set on the second axis and rotates with the second axis. On the one hand, it can effectively utilize space and avoid the use of bracket assembly to occupy too much space. On the other hand, it is also convenient for the connection of the wiring harness, which is conducive to the miniaturization of the die-bonding machine equipment.

[0022] 4) In this case, a flip-chip material-picking mechanism for a crystal bonding machine is used. In its suction nozzle assembly, the pressure between the suction nozzle and the material chip is adjusted by a force-control spring arranged in a transmission slide, so that the buffering force when the suction nozzle contacts the material to be sucked can be adjusted, further avoiding deformation of the suction nozzle or damage to the sucked material due to hard contact after long-term operation. At the same time, the stroke accuracy requirement of the Z-axis motor is also reduced. When the stroke accuracy of the Z-axis motor decreases after long-term operation, the pressure between the suction nozzle and the material can be adjusted by re-adjusting the force-control spring without affecting the suction accuracy of the suction nozzle, thereby reducing the accuracy requirement for the Z-axis motor and ensuring the stability of the suction nozzle assembly. At the same time, the suction nozzle is quick-change type, which reduces manual operation time and improves efficiency.

[0023] 5) In this case, a flip-chip material-removing mechanism for a die-bonding machine is provided, in which the output end of the R-axis motor is inserted into the mounting hole of the support arm, which is beneficial for further saving equipment assembly space and is more conducive to the miniaturization of the die-bonding machine.

[0024] In order to more clearly understand the present invention, preferred embodiments of the present invention will be described below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the installation position of the present invention;

[0026] Figure 2 It is a structural schematic diagram of the present invention;

[0027] Figure 3 It is a side view of the structure of the present invention;

[0028] Figure 4 This is a schematic diagram of the assembly of the first shaft and the second shaft of the present invention;

[0029] Figure 5 A cross-sectional view of the first and second axes of the present invention;

[0030] Figure 6 It is a structural schematic diagram of the second axis of the present invention.

[0031] Figure ID:

[0032] 1. Support arm; 2. R-axis motor; 3. First axis; 31. Guide groove; 32. Assembly groove; 33. First lug; 34. Second lug; 4. Second axis; 41. Support column; 411. Third lug; 412. Fourth lug; 5. First return spring; 6. Second return spring; 7. Upper limit member; 71. Avoidance part; 8. Lower limit member; 9. Nozzle assembly; 91. Connecting seat; 92. Z-axis motor; 93. Nozzle; 94. Support seat; 95. Force control spring; 96. Grating scale sensor. DETAILED DESCRIPTION

[0033] In the description of the present invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0034] In addition, if terms such as "first" and "second" are used for descriptive purposes only, they are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components, and cannot be understood as indicating or implying relative importance.

[0035] In addition, it should be noted that, unless otherwise clearly stipulated and limited, the terms "installed", "provided with", "mounted / connected", "connected", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a connection between the internal parts of two components; for ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] See also Figure 1-6 The present invention provides a flip-chip material-removing mechanism for a crystal bonding machine, comprising a support arm 1, an R-axis motor 2, a first shaft 3, a second shaft 4, a first return spring 5, a second return spring 6, an upper limit member 7, a lower limit member 8 and a suction nozzle assembly 9, and the R-axis motor 2 is arranged on the support arm 1.

[0037] The support arm 1 is provided with a mounting hole. The R-axis motor 2 is disposed on one side of the support arm 1. The output end of the R-axis motor 2 passes through the mounting hole and is connected to the first shaft 3. The R-axis motor 2 is used to drive the first shaft 3 to rotate. Providing the output end of the R-axis motor 2 through the mounting hole of the support arm 1 helps save equipment assembly space and also facilitates miniaturization of the die bonder equipment.

[0038] The first shaft 3 has a receiving cavity extending along its own axial direction, and the second shaft 4 is disposed in the receiving cavity; the outer wall of the first shaft 3 is provided with a guide groove 31 extending along the circumference of the first shaft 3, and the guide groove 31 is connected to the receiving cavity;

[0039] The outer wall of the first shaft 3 is further provided with a fitting groove 32, which is connected to the accommodating cavity so that the circumferential surface of the second shaft 4 is exposed from the fitting groove 32, and the fitting groove 32 is used to accommodate the connecting seat 91 of the suction nozzle assembly 9;

[0040] A first lug 33 and a second lug 34 are protrudingly provided on the outer wall of the first shaft 3 . The first lug 33 and the second lug 34 are respectively located on both sides of the guide slot 31 in the circumferential direction of the first shaft 3 .

[0041] The second shaft 4 has a support 41 on its outer wall. The support 41 passes through the guide slot 31 and extends to the outside of the first shaft 3. The distance between the outer end of the support 41 and the circumferential surface of the first shaft 3 is greater than the distance between the outer ends of the first lug 33 and the second lug 34 and the circumferential surface of the first shaft 3.

[0042] The outer wall of the pillar 41 is protrudingly provided with a third lug 411 and a fourth lug 412; the third lug 411 corresponds to the first lug 33, and the first return spring 5 is connected between the first lug 33 and the third lug 411; the fourth lug 412 corresponds to the second lug 34, and the second return spring 6 is connected between the second lug 34 and the fourth lug 412, so that the second shaft 4 can rotate with the first shaft 3 through the first return spring 5 and the second return spring 6, and then the second shaft 4 drives the suction nozzle assembly 9 to flip when it rotates, thereby realizing the function of inverting and taking materials by the crystal bonding machine.

[0043] The upper limit member 7 and the lower limit member 8 are spaced apart on the side of the support arm 1 facing the pillar 41, and are both located within the rotation trajectory of the pillar 41. The upper limit member 7 and the lower limit member 8 are used to limit the rotation of the pillar 41; the upper limit member 7 and the lower limit member 8 are both recessed with an arc-shaped avoidance portion 70; the avoidance portion 70 is used to avoid the first lug 33 and the second lug 34 protruding from the first shaft 3, so that the first lug 33 and the second lug 34 do not interfere with the upper limit member 7 or the lower limit member 8 when rotating, but because the protruding height of the pillar 41 on the second shaft 4 is greater than the protruding height of the first lug 33 and the second lug 34, the upper limit member 7 and the lower limit member 8 can only limit the pillar 41 on the second shaft 4, thereby limiting the rotation angle of the second shaft 4.

[0044] In actual working conditions, due to the presence of the upper limit member 7, the lower limit member 8, the first return spring 5 and the second return spring 6, and the upper limit member 7 and the lower limit member 8 only accurately limit the rotation angle of the second shaft 4, but not the rotation angle of the first shaft 3, after the second shaft 4 stops due to the limit, the first shaft 3 can continue to rotate a certain angle, so that the flip-chip material picking structure of the solid crystal machine in this case does not need to be equipped with an expensive high-precision drive motor to drive the first shaft 3, but only needs to use a lower-priced ordinary R-axis motor 2 to meet the production accuracy requirements; if the rotation accuracy of the ordinary R-axis motor 2 decreases after long-term operation, the first return spring 5 and the second return spring 6 can also be used to drive the second shaft 4 to rotate accurately, which not only reduces the equipment manufacturing cost, but also meets the production accuracy requirements.

[0045] Furthermore, since the first return spring 5 and the second return spring 6 drive the second shaft 4 to rotate, the support 41 on the second shaft 4 will have a buffering effect when it contacts the upper limit member 7 or the upper and lower limit members 8, avoiding long-term hard contact that causes the support 41 of the second shaft 4 or the upper and lower limit members to deform, thereby ensuring the production accuracy and stability of the equipment after long-term operation.

[0046] The suction nozzle assembly 9 includes a connecting seat 91, a Z-axis motor 92, a suction nozzle 93, a support seat 94 and a force control spring 95; the connecting seat 91 is installed in the assembly groove 32 of the first shaft 3 and is connected to the second shaft 4, so that the suction nozzle assembly 9 rotates with the second shaft 4 through the connecting seat 91; the Z-axis motor 92 is arranged on the connecting seat 91 and is connected to the support seat 94 for transmission; a transmission slide groove is provided on the support seat 94, and the force control spring 95 is arranged in the transmission slide groove, and one end of the force control spring 95 is connected to the support seat 94, and the other end is connected to the suction nozzle 93.

[0047] Preferably, in this embodiment, the suction end of the suction nozzle 93 is detachably connected.

[0048] In the suction nozzle assembly 9 of the present case, the pressure between the suction nozzle 93 and the material chip is adjusted by the force control spring 95 arranged in the transmission slide, so that the buffering force when the suction nozzle 93 contacts the material to be sucked can be adjusted, further avoiding the deformation of the suction nozzle 93 or damage to the material due to hard contact after long-term work, and at the same time, it also reduces the requirements for the stroke accuracy of the Z-axis motor 92. When the stroke accuracy of the Z-axis motor 92 decreases after long-term operation, the pressure between the suction nozzle 93 and the material chip can be adjusted by re-adjusting the force control spring 95 without affecting the suction accuracy of the suction nozzle, which not only reduces the accuracy requirements for the Z-axis motor 92, but also helps to ensure the stability of the operation of the suction nozzle assembly 9.

[0049] Furthermore, a scale sensor 96 is connected to the second shaft 4. Its sensing direction is toward the suction nozzle 93 and support base 94, and it rotates with the second shaft 4. The scale sensor 96 is used to identify the lifting stroke of the support base 94 and suction nozzle 93 in the suction nozzle assembly 9 driven by the Z-axis motor 92, thereby ensuring the accuracy and stability of the suction nozzle 93 in adsorbing the chip. In this embodiment, the scale sensor 96 is arranged on the second shaft 4 and rotates with the second shaft 4. On the one hand, it can effectively utilize space, avoiding the excessive space occupied by the bracket assembly, and on the other hand, it also facilitates the connection of the wiring harness.

[0050] Preferably, in this embodiment, the R-axis motor 2 is a servo motor; the Z-axis motor 92 is a linear voice coil motor; the linear voice coil motor has the advantages of high sensitivity, high speed, simple structure, small size, and easy control, which is conducive to the miniaturization of the crystal bonding machine equipment.

[0051] In this case, a flip-up material removal mechanism for a die bonder is used. The working principle or workflow in actual working conditions is as follows:

[0052] A: The R-axis motor 2 rotates forward, driving the first axis 3 to rotate forward. The first axis 3 drives the second axis 4 to rotate forward through the first return spring 5 and the second return spring 6. The forward rotation of the second axis 4 drives the suction nozzle 93 downward.

[0053] B: Since the first shaft 3, which rotates forward first, does not contact the upper limit member 7 and is not limited, and the R-axis motor 2 drives the first shaft 3 to move a certain angle further, when the second shaft 4 rotates forward until the support 41 on the second shaft 4 contacts the upper limit member 7, the second shaft 4 is precisely limited by the upper limit member 7 and will no longer rotate forward, thereby ensuring that the second shaft 4 can drive the nozzle assembly 9 to rotate forward accurately to the position;

[0054] C: The Z-axis motor 92 moves out, driving the support base 94 and thus the suction nozzle 93 to move downward. After the suction nozzle 93 contacts the chip, it will continue to move downward, compressing the force control spring 95 and applying pressure to the chip in the opposite direction. The related vacuum adsorption mechanism is turned on, and the suction nozzle 93 adsorbs the chip.

[0055] D: The R-axis motor 2 reverses to drive the first axis 3 to reverse, the first axis 3 drives the second axis 4 to reverse, and the second axis 4 drives the nozzle 93 upward and flips;

[0056] E: Since the first axis 3 that reversed first does not contact the lower limiter 8 and is not limited, and the R-axis motor 2 will drive the first axis 3 to move a certain angle more, when the second axis 4 reverses until the support 41 on the second axis 4 contacts the lower limiter 8, the second axis 4 is accurately limited by the lower limiter 8 and will no longer reverse, thereby ensuring that the first axis 3 can reverse and accurately position the second axis 4. After the second axis 4 reverses and positions the nozzle assembly 9, the chip on the nozzle 93 is transferred to the placement head for post-processing;

[0057] F: After the chip on the nozzle 93 is transferred to the placement head, the R-axis motor 2 drives the relevant components to reset and start a new round of action cycle.

[0058] Compared with the existing technology, the flip-chip material-picking mechanism for a crystal bonding machine in this case drives the first axis through an R-axis motor, and the first axis drives the second axis to rotate through the first return spring and the second return spring, and the second axis drives the suction nozzle assembly 9 to flip, and the upper limit member and the lower limit member only accurately limit the rotation angle of the second axis, without the need to accurately limit the rotation angle of the first axis; thus, the flip-chip material-picking structure of the crystal bonding machine in this case does not need to be equipped with an expensive high-precision drive motor to drive the first axis, but only needs to use a lower-priced ordinary R-axis motor to achieve the required rotation angle, which not only reduces the equipment manufacturing cost, but also meets the production requirements for precision.

[0059] The above-described embodiments merely illustrate several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, and all such variations and improvements fall within the scope of protection of the present invention.

Claims

1. A flip-chip material removal mechanism for a die bonder, characterized by: It includes a support arm, an R-axis motor, a first shaft, a second shaft, a first return spring, a second return spring, an upper limit member, a lower limit member and a nozzle assembly, wherein the R-axis motor is provided on the support arm; The first shaft is connected to the R-axis motor, and the R-axis motor is used to drive the first shaft to rotate; the first shaft has an accommodating cavity extending along the axial direction of the first shaft, and the second shaft is arranged in the accommodating cavity; the outer wall of the first shaft is provided with a guide groove extending along the circumferential direction of the first shaft, and the guide groove is connected to the accommodating cavity, and the outer wall of the first shaft is further provided with a first mounting position and a second mounting position, and the first mounting position and the second mounting position are respectively located on both sides of the guide groove in the circumferential direction of the first shaft; the outer wall of the second shaft is provided with a pillar, and the pillar passes through the guide groove and extends to the outside of the first shaft; The first return spring is arranged between the first installation position and the support, the second return spring is arranged between the second installation position and the support, and the second shaft can rotate with the first shaft through the first return spring and the second return spring; The upper limit member and the lower limit member are spaced apart on the side of the support arm facing the pillar, and are both located within the rotation trajectory of the pillar. The upper limit member and the lower limit member are used to limit the rotation of the pillar; the suction nozzle assembly is arranged on the second axis and can rotate with the second axis.

2. The flip-chip material removal mechanism for a die bonder according to claim 1, characterized in that: A first lug and a second lug are protruding from the outer wall of the first shaft. The first lug and the second lug are respectively located on both sides of the guide groove in the circumferential direction of the first shaft. The first mounting position is located on the first lug, and the second mounting position is located on the second lug.

3. The flip-chip material removal mechanism for a die bonder according to claim 2, characterized in that: The outer wall of the pillar is protrudingly provided with a third lug and a fourth lug; the third lug of the pillar corresponds to the first lug on the first shaft, and the first return spring is connected between the first lug and the third lug; the fourth lug of the pillar corresponds to the second lug on the first shaft, and the second return spring is connected between the second lug and the fourth lug.

4. The flip-chip material removal mechanism for a die bonder according to claim 2, characterized in that: The distance between the outer end of the support and the circumferential surface of the first shaft is greater than the distance between the outer ends of the first lug and the second lug and the circumferential surface of the first shaft.

5. The flip-chip material removal mechanism for a die bonder according to claim 1, characterized in that: The suction nozzle assembly includes a connecting seat, a Z-axis motor, a suction nozzle, a support seat and a force control spring; the connecting seat is connected to the second axis; the Z-axis motor is arranged on the connecting seat and is transmission-connected to the support seat; a transmission slide is provided on the support seat, the force control spring is arranged in the transmission slide, and one end of the force control spring is connected to the support seat, and the other end is connected to the suction nozzle; the suction end of the suction nozzle is detachably connected.

6. The flip-chip material removal mechanism for a die bonder according to claim 5, characterized in that: The second shaft is also connected to a grating scale sensor, the sensing direction of the grating scale sensor is toward the suction nozzle and the support seat, and the grating scale sensor rotates along with the second shaft.

7. The flip-chip material removal mechanism for a die bonder according to claim 5, characterized in that: The outer wall of the first shaft is also provided with an assembly groove, which is connected to the accommodating cavity so that the circumferential surface of the second shaft is exposed from the assembly groove. The connecting seat is installed in the assembly groove and connected to the second shaft, so that the suction nozzle assembly rotates with the second shaft through the connecting seat.

8. The flip-chip material removal mechanism for a die bonder according to claim 1, characterized in that: The support arm is provided with a mounting hole, the R-axis motor is arranged on one side of the support arm, and the output end of the R-axis motor passes through the mounting hole and is connected to the first shaft.

9. The flip-chip material removal mechanism for a die bonder according to claim 1, characterized in that: The upper limit member and the lower limit member are both recessed with arc-shaped avoidance portions.

10. The flip-chip material removal mechanism for a die bonder according to claim 5, characterized in that: The R-axis motor is a servo motor; the Z-axis motor is a linear voice coil motor.

Images