Modularized integrated air communication equipment

Abstract

The invention discloses a modular integrated air communication device. The equipment comprises a signal processing module, a power amplification module, a tuning filtering module, a mother board, a power supply module, a power amplification filtering module, a mainframe box, a power supply case and a mounting seat, the signal processing module, the power amplification module, the tuning filtering module and the mother board are mounted in the mainframe box, and the power supply module and the power amplification filtering module are mounted in the power supply case; the host case and the power supply case are mounted together to form an equipment main body, the mounting seat is fixedly mounted on a system platform, and the equipment main body is mounted on the mounting seat through pins and screws. The multifunctional communication device is high in integration level, high in space utilization rate, small in size, multiple in function, good in mechanical performance, good in heat dissipation performance, modular in design, easy to install and overhaul and suitable for the multifunctional communication device installation requirement of a novel air platform in the future.

Description

Technical Field

[0001] The invention relates to the technical field of communication equipment structure and electronic circuit, in particular to a modular integrated airborne communication equipment. Background Art

[0002] Existing airborne communication equipment mainly adopts an integrated chassis structure and a bread module structure. The integrated chassis structure adopts a frame form, and the internal modules are stacked or arrayed. It cannot be quickly disassembled and assembled during maintenance, and the space utilization rate is low. It cannot take into account the requirements of miniaturization, heat dissipation and electromagnetic compatibility at the same time. The outstanding features of the bread module structure are high modularity and strong scalability, but its disadvantages are that the equipment components are scattered, the overall rigidity is poor, and the mechanical properties such as vibration resistance and impact resistance are poor. It is not suitable for airborne communication equipment without vibration isolators.

[0003] With the continuous improvement of integrated circuit design and process level, its scale is getting larger and more complex, resulting in a higher degree of integration and more functions for air communication equipment, and more concentrated heat consumption of core modules or circuits. The new air platform requires communication equipment to be miniaturized, lightweight, multi-functional and high-performance. The existing structural form can no longer meet the installation and use requirements. Summary of the invention

[0004] The object of the present invention is to provide an airborne communication device with small size, fast heat dissipation, high mechanical strength, good accessibility, high electromagnetic compatibility, multiple functions and high performance.

[0005] The technical solution to achieve the purpose of the present invention is: a modular integrated airborne communication device, including a signal processing module, a power amplifier module, a tuning filter module, a motherboard, a power module, a power amplifier filter module, a main chassis, a power chassis and a mounting seat;

[0006] The signal processing module, power amplification module, tuning and filtering module and motherboard are installed in the main chassis, and the power module and power amplifier and filtering module are installed in the power chassis; the main chassis and the power chassis are installed together to form the device body, the mounting base is fixedly installed on the system platform, and the device body is installed on the mounting base by pins and screws.

[0007] As a specific example, the signal processing module, power amplifier module, tuning filter module, motherboard, power supply module and power amplifier filter module are all installed in independent cavities, and shielding card slots are set between the modules. By placing conductive sealing gaskets, each module forms a relatively complete shielding body to ensure physical isolation between the modules;

[0008] The external low-frequency interfaces of the modular integrated airborne communication equipment all use filter electrical connectors with a shielded outer frame structure, and capacitors of different capacities are selected for targeted filtering according to the characteristics of each signal;

[0009] The external radio frequency interfaces of the modular integrated airborne communication equipment all adopt flange-type threaded sleeve self-locking coaxial connectors;

[0010] The low-frequency connector and the radio frequency connector of the modular integrated airborne communication equipment both adopt high-conductivity electromagnetic sealing gaskets, and the shielding effectiveness of the sealing gaskets is greater than 35dB.

[0011] As a specific example, the main chassis is provided with a positioning hole, the power chassis is provided with a guide pin, the guide pin introduction part is a cone, the length of the positioning part is greater than the height of the electrical connector, the main chassis and the power chassis are installed through the positioning holes and the guide pins, and are connected and fixed by 8 M5 screws to form the device main body; the electrical connections between the main chassis and the power chassis are all achieved by blind plugging; the mounting base is fixedly installed on the system platform, the pin hole of the device main body is aligned with the guide pin on the mounting base and pushed into the designed matching state, and fixed by the screws on the front side of the device main body.

[0012] As a specific example, the signal processing module is provided with a low-frequency interface at the side panel of the cavity of the main chassis, and the low-frequency interface adopts a filter connector with a shielded outer frame structure; a radio frequency interface is provided on the mounting surface of the main chassis, and the radio frequency interface adopts a push-in flange structure coaxial connector, and is connected to the printed circuit board of the signal processing module through a radio frequency line;

[0013] The power amplifier module is provided with a low-frequency control interface at the side panel of the cavity of the main box, and the low-frequency control interface adopts a filter connector with a shielded outer frame structure, and is connected to the printed circuit board through a soft wire inside the cavity; the power supply connector of the power amplifier module is arranged on the printed circuit board of the power amplifier module, and a feed-through filter is installed with a "Faraday cage" for shielding and filtering before use; the radio frequency interface of the power amplifier module is arranged on the printed circuit board of the power amplifier module, and is connected to the tuning filter module through a radio frequency line;

[0014] The low-frequency interface of the tuning and filtering module is plug-connected with the power amplification module; the radio frequency interface of the tuning and filtering module is arranged on the printed circuit board of the tuning and filtering module, and is connected with the signal processing module through a radio frequency line via a flange coaxial connector;

[0015] All external low-frequency control interfaces and internal low-frequency interfaces of the equipment are arranged on the motherboard, and the internal low-frequency interfaces realize signal transfer of each module through a soft wire via a cavity channel.

[0016] As a specific example, the power module is provided with a system power input interface on the front side of the power chassis, and the output interface is plug-connected with the power amplifier module in the main chassis through an isolation cabin channel;

[0017] The power amplifier filter module is provided with low-frequency and radio frequency interfaces at the cavity cover plate. The low-frequency interface adopts a filter connector with a shielded outer frame structure, and is connected to the printed circuit board through a soft wire inside the cavity; the small-signal radio frequency interface adopts a flange structure coaxial connector, and is connected to the printed circuit board of the power amplifier filter module through a radio frequency line inside; the high-power radio frequency interface adopts a miniature push-in radio frequency coaxial connector, which is blindly connected to the power amplifier module.

[0018] As a specific example, the main chassis and the power chassis are both made of a heat sink and are manufactured by machining and vacuum laser welding.

[0019] The main chassis is divided into a left and a right shell, which are formed by split processing and then welded into one body with a mortise and tenon structure by laser welding; cooling fins are arranged on the top and the middle of the main chassis, and two axial flow fans are installed at the rear end of the main chassis to dissipate heat for the middle cooling fins, adopting a cooling form of rear air inlet and front air outlet; the left and right sides of the middle cooling fins are the installation surfaces of the modules inside the left and right shells, and each module is cooled by the rear fan through the middle air duct; since a low-frequency interface cross-linked with the system is arranged at the front end of the main chassis, which occupies a certain space, the middle air duct is narrow in front and wide in the back, with only the left shell cooling fins at the front end, with a height of 27mm, the left shell cooling fins at the rear end are 63.5mm high, the right shell cooling fins are 5.5mm high, and the cooling fin spacing is 5mm; in order to prevent the heat dissipation of the heat sources of the modules inside the left and right shells from affecting each other, a 1mm disconnected gap is arranged at the connection between the left and right shells for the cooling fins.

[0020] As a specific example, the mounting surface of the left shell of the main chassis is installed with a power amplifier module and a tuning filter module; the thickness of the left shell is 4 mm, and its internal heat-averaging chamber is a vacuum structure filled with cooling working fluid; the heat-averaging chamber uses a base material 6063 aluminum plate to be processed into multiple groups of cylindrical support points for structural support under a vacuum state, and then high-frequency diffusion welding is used to form a vacuum chamber to ensure the airtightness of the welding, and internal module mounting holes and heat dissipation bosses are set at the same time, and thermal conductive silicone grease is coated on the heat dissipation boss to reduce contact thermal resistance, and the heat source is fixed to the heat dissipation boss by screws and fits tightly to ensure good heat dissipation performance; the coolant circulates in the heat-averaging chamber, conducts heat to the heat dissipation fins, and then dissipates the heat through forced air cooling.

[0021] As a specific example, the shell below the installation surface of the power amplifier module is thickened to 7 mm toward the middle heat dissipation fins, which is used to quickly dissipate the heat of the final power amplifier tube in the power amplifier module.

[0022] As a specific example, a signal processing module is installed on the mounting surface of the right shell of the main case, and a heat dissipation boss is provided at the mounting surface position corresponding to the main heat source of the signal processing module. A thermal conductive pad is mounted between the main heat source and the heat dissipation boss. The thickness of the thermal conductive pad is 0.7 mm and is used to improve the heat dissipation performance of the signal processing module.

[0023] As a specific example, the DC / DC module of the power module in the power chassis is close to the outer shell and coated with thermal grease, and the shell adopts a diamond / aluminum composite material with high thermal conductivity to improve the heat dissipation performance of the power module.

[0024] Compared with the prior art, the present invention has the following significant advantages: (1) high integration, high space utilization, small size, and multiple functions, which is suitable for air communication scenarios with small space, high integration requirements, and multiple functions; (2) good mechanical properties and good heat dissipation performance, which solves the operation and heat dissipation requirements of large-scale, highly complex integrated circuits; (3) modular design, easy installation and maintenance, and suitable for the installation requirements of multi-functional communication equipment on future new air platforms. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of a modular integrated airborne communication device of the present invention.

[0026] Figure 2 It is a schematic diagram of the connection structure between the main chassis and the power chassis in an embodiment of the present invention.

[0027] Figure 3 It is a schematic diagram of the structure of the main chassis shell in an embodiment of the present invention.

[0028] Figure 4 It is a schematic diagram of the fan heat dissipation principle of the main chassis in an embodiment of the present invention.

[0029] Figure 5 It is a front view of the heat dissipation fins of the main chassis in an embodiment of the present invention.

[0030] Figure 6 It is a rear view of the heat dissipation fins of the main chassis in the embodiment of the present invention.

[0031] Figure 7 It is a side view of the heat dissipation fins of the right shell of the main chassis in an embodiment of the present invention.

[0032] Figure 8 It is a schematic diagram of the structure of the left shell of the main chassis in an embodiment of the present invention.

[0033] Fig. 9 It is a schematic diagram of the structure of the right shell of the main chassis in an embodiment of the present invention. DETAILED DESCRIPTION

[0034] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0035] like Figure 1 As shown, the modular integrated airborne communication device of the present invention includes a signal processing module, a power amplification module, a tuning and filtering module, a motherboard, a power module, a power amplifier and filtering module, a main chassis, a power chassis and a mounting base;

[0036] The signal processing module, power amplification module, tuning and filtering module and motherboard are installed in the main chassis, and the power module and power amplifier and filtering module are installed in the power chassis; the main chassis and the power chassis are installed together to form the device body, the mounting base is fixedly installed on the system platform, and the device body is installed on the mounting base by pins and screws.

[0037] As a specific example, the signal processing module, power amplifier module, tuning filter module, motherboard, power supply module and power amplifier filter module are all installed in independent cavities, and shielding card slots are set between the modules. By placing conductive sealing gaskets, each module forms a relatively complete shielding body to ensure physical isolation between the modules;

[0038] The external low-frequency interfaces of the modular integrated airborne communication equipment all use filter electrical connectors with a shielded outer frame structure, and capacitors of different capacities are selected for targeted filtering according to the characteristics of each signal;

[0039] The external radio frequency interfaces of the modular integrated airborne communication equipment all adopt flange-type threaded sleeve self-locking coaxial connectors;

[0040] The low-frequency connector and the radio frequency connector of the modular integrated airborne communication equipment both adopt high-conductivity electromagnetic sealing gaskets, and the shielding effectiveness of the sealing gaskets is greater than 35dB.

[0041] As a specific example, Figure 2 As shown, the main chassis is provided with a positioning hole, the power chassis is provided with a guide pin, the guide pin introduction part is a cone, the length of the positioning part is greater than the height of the electrical connector, the main chassis and the power chassis are installed through the positioning holes and the guide pins, and are connected and fixed by 8 M5 screws to form the device main body; the electrical connections between the main chassis and the power chassis are all achieved by blind plugging; the mounting base is fixedly installed on the system platform, the pin hole of the device main body is aligned with the guide pin on the mounting base and pushed into the designed matching state, and fixed by the screws on the front side of the device main body.

[0042] As a specific example, the signal processing module is provided with a low-frequency interface at the side panel of the cavity of the main chassis, and the low-frequency interface adopts a filter connector with a shielded outer frame structure; a radio frequency interface is provided on the mounting surface of the main chassis, and the radio frequency interface adopts a push-in flange structure coaxial connector, and is connected to the printed circuit board of the signal processing module through a radio frequency line;

[0043] The power amplifier module is provided with a low-frequency control interface at the side panel of the cavity of the main box, and the low-frequency control interface adopts a filter connector with a shielded outer frame structure, and is connected to the printed circuit board through a soft wire inside the cavity; the power supply connector of the power amplifier module is arranged on the printed circuit board of the power amplifier module, and a feed-through filter is installed with a "Faraday cage" for shielding and filtering before use; the radio frequency interface of the power amplifier module is arranged on the printed circuit board of the power amplifier module, and is connected to the tuning filter module through a radio frequency line;

[0044] The low-frequency interface of the tuning and filtering module is plug-connected with the power amplification module; the radio frequency interface of the tuning and filtering module is arranged on the printed circuit board of the tuning and filtering module, and is connected with the signal processing module through a radio frequency line via a flange coaxial connector;

[0045] All external low-frequency control interfaces and internal low-frequency interfaces of the equipment are arranged on the motherboard, and the internal low-frequency interfaces realize signal transfer of each module through a soft wire via a cavity channel.

[0046] As a specific example, the power module is provided with a system power input interface on the front side of the power chassis, and the output interface is plug-connected with the power amplifier module in the main chassis through an isolation cabin channel;

[0047] The power amplifier filter module is provided with low-frequency and radio frequency interfaces at the cavity cover plate. The low-frequency interface adopts a filter connector with a shielded outer frame structure, and is connected to the printed circuit board through a soft wire inside the cavity; the small-signal radio frequency interface adopts a flange structure coaxial connector, and is connected to the printed circuit board of the power amplifier filter module through a radio frequency line inside; the high-power radio frequency interface adopts a miniature push-in radio frequency coaxial connector, which is blindly connected to the power amplifier module.

[0048] As a specific example, the total heat consumption of the equipment is about 420W, of which the heat consumption of the signal processing module is no more than 50W, the total heat consumption of the power amplifier module, the power amplifier filter module and the tuning filter module is no more than 320W, and the heat consumption of the power module is no more than 50W. Considering that the high temperature working temperature of the equipment is 70℃ and the power amplifier module generates a lot of heat, the main chassis and the power chassis are both made of heat spreaders through machining and vacuum laser welding.

[0049] like Figure 3As shown, the main chassis is divided into two left and right shells, which are formed by split processing, matched with the mortise and tenon structure, and are welded into one by laser welding; Figure 4 As shown, the mainframe case is provided with heat dissipation fins at the top and the middle, and two axial flow fans are installed at the rear end of the mainframe case to dissipate heat from the middle heat dissipation fins, adopting a heat dissipation form of rear air intake and front air outlet; the left and right sides of the middle heat dissipation fins are the module installation surfaces inside the left and right shells, and each module is cooled by the rear fan through the middle air duct; Figure 5 , Figure 6 and Figure 7 As shown, since the front end of the main chassis is provided with a low-frequency interface interconnected with the system, which occupies a certain space, the middle air duct is narrow in front and wide in the back. There is only the left shell cooling fin at the front end, which is 27mm long, and the left shell cooling fin at the rear end is 63.5mm long. The right shell cooling fin is 5.5mm long, and the cooling fin spacing is 5mm. In order to prevent the heat dissipation of the module heat sources inside the left and right shells from affecting each other, the cooling fins are provided with a 1mm disconnected gap at the connection between the left and right shells.

[0050] As a specific example, Figure 8 As shown, the power amplifier module and the tuning filter module are installed on the mounting surface of the left shell of the main chassis; the thickness of the left shell is 4mm, and the internal heat-saturating cavity is a vacuum structure filled with cooling working fluid; the heat-saturating cavity is made of a base material 6063 aluminum plate processed into multiple groups of cylindrical support points for structural support under vacuum state, and then high-frequency diffusion welding is used to weld it into a vacuum cavity to ensure the airtightness of the welding, and internal module mounting holes and heat dissipation bosses are provided at the same time, and thermal conductive silicone grease is coated on the heat dissipation bosses to reduce contact thermal resistance, and the heat source is fixed to the heat dissipation bosses by screws and fits tightly to ensure good heat dissipation performance; the coolant circulates in the heat-saturating cavity, conducts the heat to the heat dissipation fins, and then dissipates the heat through forced air cooling.

[0051] As a specific example, the shell below the installation surface of the power amplifier module is thickened to 7 mm toward the middle heat dissipation fins, which is used to quickly dissipate the heat of the final power amplifier tube in the power amplifier module.

[0052] As a specific example, Fig. 9 As shown, the signal processing module is installed on the mounting surface of the right shell of the main case, and a heat dissipation boss is provided at the mounting surface position corresponding to the main heat source of the signal processing module. A thermal conductive pad is mounted between the main heat source and the heat dissipation boss. The thickness of the thermal conductive pad is 0.7mm, which is used to improve the heat dissipation performance of the signal processing module.

[0053] As a specific example, the DC / DC module of the power module in the power chassis is close to the outer shell and coated with thermal grease, and the shell adopts a diamond / aluminum composite material with high thermal conductivity to improve the heat dissipation performance of the power module.

[0054] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A modular integrated airborne communication device, characterized in that: It includes a signal processing module, a power amplifier module, a tuning filter module, a motherboard, a power module, a power amplifier filter module, a main chassis, a power chassis and a mounting base; The signal processing module, power amplification module, tuning and filtering module and motherboard are installed in the main chassis, and the power module and power amplifier and filtering module are installed in the power chassis; the main chassis and the power chassis are installed together to form the device body, the mounting base is fixedly installed on the system platform, and the device body is installed on the mounting base by pins and screws.

2. The modular integrated airborne communication device according to claim 1, characterized in that: The signal processing module, power amplifier module, tuning filter module, motherboard, power supply module and power amplifier filter module are all installed in independent cavities, and shielding slots are set between the modules. By placing conductive sealing gaskets, each module forms a complete shielding body to ensure physical isolation between the modules; The external low-frequency interfaces of the modular integrated airborne communication equipment all use filter electrical connectors with a shielded outer frame structure, and capacitors of different capacities are selected for targeted filtering according to the characteristics of each signal; The external radio frequency interfaces of the modular integrated airborne communication equipment all adopt flange-type threaded sleeve self-locking coaxial connectors; The low-frequency connector and the radio frequency connector of the modular integrated airborne communication equipment both adopt high-conductivity electromagnetic sealing gaskets, and the shielding effectiveness of the sealing gaskets is greater than 35dB.

3. The modular integrated airborne communication device according to claim 1, characterized in that: The main chassis is provided with a positioning hole, and the power chassis is provided with a guide pin. The guide pin introduction part is a cone, and the length of the positioning part is greater than the height of the electrical connector. The main chassis and the power chassis are installed through the positioning holes and the guide pins, and are connected and fixed by 8 M5 screws to form the device main body; the electrical connections between the main chassis and the power chassis are all achieved by blind plugging; the mounting base is fixedly installed on the system platform, the pin hole of the device main body is aligned with the guide pin on the mounting base and pushed into the designed matching state, and fixed by the screws on the front side of the device main body.

4. The modular integrated airborne communication device according to claim 1, characterized in that: The signal processing module is provided with a low-frequency interface at the side panel of the cavity of the main box, and the low-frequency interface adopts a filter connector with a shielded outer frame structure; a radio frequency interface is provided on the mounting surface of the main box, and the radio frequency interface adopts a push-in flange structure coaxial connector, and is connected to the printed circuit board of the signal processing module through a radio frequency line; The power amplifier module is provided with a low-frequency control interface at the side panel of the cavity of the main box, and the low-frequency control interface adopts a filter connector with a shielded outer frame structure, and is connected to the printed circuit board through a soft wire inside the cavity; the power supply connector of the power amplifier module is arranged on the printed circuit board of the power amplifier module, and a feed-through filter is installed with a Faraday cage for shielding and filtering before use; the radio frequency interface of the power amplifier module is arranged on the printed circuit board of the power amplifier module, and is connected to the tuning filter module through a radio frequency line; The low-frequency interface of the tuning and filtering module is plug-connected with the power amplification module; the radio frequency interface of the tuning and filtering module is arranged on the printed circuit board of the tuning and filtering module, and is connected with the signal processing module through a radio frequency line via a flange coaxial connector; All external low-frequency control interfaces and internal low-frequency interfaces of the equipment are arranged on the motherboard, and the internal low-frequency interfaces realize signal transfer of each module through a soft wire via a cavity channel.

5. The modular integrated airborne communication device according to claim 1, characterized in that: The power module is provided with a system power input interface on the front side of the power chassis, and the output interface is plug-connected with the power amplifier module in the main chassis through an isolation cabin channel; The power amplifier filter module is provided with low-frequency and radio frequency interfaces at the cavity cover plate. The low-frequency interface adopts a filter connector with a shielded outer frame structure, and is connected to the printed circuit board through a soft wire inside the cavity; the small-signal radio frequency interface adopts a flange structure coaxial connector, and is connected to the printed circuit board of the power amplifier filter module through a radio frequency line inside; the high-power radio frequency interface adopts a miniature push-in radio frequency coaxial connector, which is blindly connected to the power amplifier module.

6. The modular integrated airborne communication device according to claim 1, characterized in that: The main chassis and the power chassis are both made of a heat sink and are manufactured through a process of machining and vacuum laser welding; The main chassis is divided into a left and a right shell, which are formed by split processing and then welded into one body with a mortise and tenon structure by laser welding; cooling fins are arranged on the top and the middle of the main chassis, and two axial flow fans are installed at the rear end of the main chassis to dissipate heat for the middle cooling fins, adopting a cooling form of rear air inlet and front air outlet; the left and right sides of the middle cooling fins are the installation surfaces of the modules inside the left and right shells, and each module is cooled by the rear fan through the middle air duct; since a low-frequency interface cross-linked with the system is arranged at the front end of the main chassis, which occupies a certain space, the middle air duct is narrow in front and wide in the back, with only the left shell cooling fins at the front end, with a height of 27mm, the left shell cooling fins at the rear end are 63.5mm high, the right shell cooling fins are 5.5mm high, and the cooling fin spacing is 5mm; in order to prevent the heat dissipation of the heat sources of the modules inside the left and right shells from affecting each other, a 1mm disconnected gap is arranged at the connection between the left and right shells for the cooling fins.

7. The modular integrated airborne communication device according to claim 6, characterized in that: The power amplifier module and the tuning filter module are installed on the mounting surface of the left shell of the main box; the thickness of the left shell is 4mm, and the internal heat-saturating chamber is a vacuum structure filled with cooling working fluid; the heat-saturating chamber uses a base material 6063 aluminum plate to be processed into multiple groups of cylindrical support points for structural support under a vacuum state, and then high-frequency diffusion welding is used to form a vacuum chamber to ensure the airtightness of the welding, and internal module mounting holes and heat dissipation bosses are provided at the same time, and thermal conductive silicone grease is coated on the heat dissipation bosses to reduce contact thermal resistance, and the heat source is fixed to the heat dissipation bosses by screws and fits tightly to ensure heat dissipation performance; the coolant circulates in the heat-saturating chamber, conducts heat to the heat dissipation fins, and then dissipates the heat through forced air cooling.

8. The modular integrated airborne communication device according to claim 7, characterized in that: The shell below the installation surface of the power amplifier module is thickened to 7 mm toward the middle heat dissipation fins, which is used to dissipate heat for the final stage power amplifier tube in the power amplifier module.

9. The modular integrated airborne communication device according to claim 6, characterized in that: The signal processing module is installed on the mounting surface of the right shell of the main case, and a heat dissipation boss is set at the mounting surface position corresponding to the main heat source of the signal processing module. A thermal conductive pad is mounted between the main heat source and the heat dissipation boss, and the thickness of the thermal conductive pad is 0.7mm.

10. The modular integrated airborne communication device according to claim 1, characterized in that: The DC / DC module of the power module in the power chassis is closely attached to the outer shell and coated with thermal conductive silicone grease, and the shell is made of diamond / aluminum composite material with thermal conductivity meeting the requirements.

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