Circuit board structure and electronic equipment
By welding and electrically connecting electronic devices such as shrapnel to the side wall of the circuit board, the problem of shrapnel occupying the PCB board area and stuck other components is solved, and the utilization rate of the circuit board is improved.
Patent Information
- Application Number
- CN202411678525.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-22
- Publication Date
- 2025-02-18
AI Technical Summary
In the existing circuit board structure, shrapnel occupies a large amount of PCB board area and easily jammed other components.
By welding electronic devices such as shrapnel to the side wall of the circuit board, and electrically connecting the pads to the internal wiring of the circuit board, the electrical connection between the electronic devices on the side wall of the circuit board and the circuit board is achieved.
It effectively avoids the problem of shrapnel occupying the space on the front and back of the PCB board, and avoids the situation of jamming with other components, thereby improving the area utilization of the circuit board.
Smart Images
Figure CN119485915A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of electronic technology, and specifically relates to a circuit board structure and an electronic device. Background Art
[0002] Shrapnel is a commonly used component on the printed circuit board (PCB) of electronic equipment. It is usually designed on the front and back sides of the PCB. Other components such as antennas, receivers, speakers, flashlights, etc. are connected to the main board through contact with the shrapnel. In addition, the shrapnel also has functions such as grounding. However, this design method makes the shrapnel occupy a large area of the PCB and easily get stuck on other components on the PCB. Summary of the invention
[0003] The purpose of the embodiments of the present application is to provide a circuit board structure and an electronic device that can solve the problem that the spring clips in the existing circuit board structure design occupy a large area of the PCB board and are easy to jam other components on the PCB board.
[0004] In a first aspect, an embodiment of the present application proposes a circuit board structure, including: a circuit board and an electronic device, wherein the electronic device is welded to a first side wall of the circuit board, a soldering pad is arranged on the first side wall, the electronic device is welded on the soldering pad, and the soldering pad is electrically connected to the internal wiring of the circuit board.
[0005] In a second aspect, an embodiment of the present application provides an electronic device, comprising the circuit board structure described in the first aspect.
[0006] In an embodiment of the present application, the circuit board structure includes: a circuit board and an electronic device, the electronic device is welded to a first side wall of the circuit board, the first side wall is provided with a soldering pad, the electronic device is welded to the soldering pad, and the soldering pad is electrically connected to the internal wiring of the circuit board. In this way, by welding electronic devices such as springs to the side walls of the circuit board, the device layout space on the front and back sides of the circuit board can be avoided, and the problem of other components on the board being stuck can be avoided.
[0007] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0009] Figure 1 It is a schematic diagram of the circuit board structure provided in an embodiment of the present application;
[0010] Figure 2 It is a cross-sectional schematic diagram of designing a through hole and an exposed copper layer on a circuit board provided in an embodiment of the present application;
[0011] Figure 3 It is a cross-sectional view of the circuit board structure provided in an embodiment of the present application. DETAILED DESCRIPTION
[0012] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.
[0013] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally a class, and the number of objects is not limited. For example, the first object can be one or more. In the description of the present application, unless otherwise specified, the meaning of "multiple" is two or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally represents that the front and back associated objects are a kind of "or" relationship.
[0014] In the description of the present application, it should be understood that the terms "upper", "lower", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0015] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0016] The circuit board structure provided in the embodiment of the present application is described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.
[0017] See also Figure 1 , Figure 1 This is a schematic diagram of the circuit board structure provided in the embodiment of the present application. Figure 1 As shown, the circuit board structure 100 includes:
[0018] The circuit board 10 and the electronic device 20 , the electronic device 20 is welded on the first side wall 11 of the circuit board 10 , the first side wall 11 is provided with a soldering pad 12 , the electronic device 20 is welded on the soldering pad 12 , and the soldering pad 12 is electrically connected to the internal wiring of the circuit board 10 .
[0019] like Figure 1 As shown, the circuit board structure 100 provided in the embodiment of the present application includes a circuit board 10 and an electronic device 20, wherein the circuit board 10 can be a PCB board, and in specific applications, can be a main board or a cavity board. In the embodiment of the present application, in order to avoid occupying too much area of the PCB board due to the layout of spring pieces on the front or back of the PCB board to connect with other external devices, so that the overall area of the PCB board is not fully utilized, an innovative spring piece layout method is proposed, that is, the spring pieces, components, etc. are arranged on the side walls other than the front and back of the PCB board, so that functional connections can be achieved with other components without occupying the front and back areas of the PCB board, thereby improving the utilization rate of the area of the PCB board.
[0020] Specifically, Figure 1 As shown, a pad 12 can be arranged at an appropriate position of the first side wall 11 of the circuit board 10, and then the electronic device 20 can be welded at the pad 12, so that the electronic device 20 can be connected to the side wall of the circuit board 10. For example, a common spring can be welded to the pad 12 on the side wall of the circuit board 10 through the surface mount technology (SMT) process, so that the spring is stably connected to the side wall of the circuit board 10. Among them, the pad 12 is electrically connected to the internal wiring of the circuit board 10, so that the circuit board 10 can be electrically connected to the electronic device 20 on the side wall.
[0021] According to some embodiments of the present application, the electronic device 20 is a spring or a component.
[0022] In some embodiments, the electronic device 20 can be a spring clip, that is, a spring clip can be attached to the side wall of the circuit board 10, so that the circuit board 10 can be conveniently connected to other components through the spring clip on the side wall. The electronic device 20 can also be a component, that is, components such as resistors and capacitors can be attached to the side wall of the circuit board 10, so that the circuit board 10 can be directly connected to other components through the side wall, thereby improving the utilization rate of the circuit board.
[0023] According to some embodiments of the present application, Figure 2 As shown, an exposed copper layer 13 is disposed at a first position of the first side wall 11 , and the pad 12 is electrically connected to the exposed copper layer 13 .
[0024] like Figure 2 As shown, a copper-exposed layer 13 can be arranged at a first position on the first side wall 11 of the circuit board 10, and a soldering pad 12 can be plated at the position of the copper-exposed layer 13, so that the soldering pad 12 and the internal wiring of the circuit board 10 are connected through the copper-exposed layer 13, thereby realizing electrical connection between the circuit board 10 and the electronic device 20.
[0025] According to a further embodiment of the present application, Figure 2 As shown, a first through hole 14 perpendicular to the surface of the circuit board 10 is provided at the second position of the circuit board 10 . The first through hole 14 is copper-plated, and the exposed copper layer 13 is electrically connected to the inner wall of the first through hole 14 . The second position is adjacent to the first side wall 11 .
[0026] like Figure 2 As shown, in order to realize the electrical connection between the spring on the side wall of the circuit board 10 and the circuit board, a mechanical through hole from top to bottom, i.e., a first through hole 14, can be opened at the second position of the circuit board 10 adjacent to the first side wall 11. The through hole is perpendicular to the front and back surfaces of the circuit board 10 and parallel to the first side wall 11. The first through hole 14 can be subjected to a copper plating process so that the inner wall of the first through hole 14 is plated with a copper layer. At this time, the first through hole 14 is electrically connected to the internal wiring of the circuit board 10. Then, by designing an exposed copper layer 13 on the first side wall 11, and the exposed copper layer 13 is electrically connected to the inner wall of the first through hole 14, the electronic device 20 such as the spring on the first side wall 11 is electrically connected to the internal wiring of the circuit board 10.
[0027] Through this implementation, the electrical connection between the spring sheet on the side wall of the circuit board and the internal wiring of the circuit board can be well achieved.
[0028] According to some other embodiments of the present application, an exposed copper layer 13 is disposed at multiple locations of the first side wall 11 , and solder pads 12 electrically connected to the exposed copper layer 13 are plated at the multiple locations, and an electronic device 20 is soldered to each solder pad 12 .
[0029] That is, in some embodiments, exposed copper layers 13 may be arranged at different positions of the first side wall 11, each exposed copper layer 13 is electrically connected to the inner wall of the first through hole 14, and then a soldering pad 12 is plated at each exposed copper layer 13, and a spring or other components are soldered at each soldering pad 12. In this way, a plurality of springs may be arranged on one side wall of the circuit board, further improving the utilization rate of the circuit board.
[0030] According to some other embodiments of the present application, the circuit board 10 is a cavity circuit board or a main board.
[0031] That is, the electronic components 20 such as springs can be attached not only to the side walls of the cavity board, but also to the side walls of the main board, so that the cavity board or the main board can be electrically connected to each component through the springs on the side walls, thereby improving the utilization rate of the cavity board or the main board.
[0032] According to some other embodiments of the present application, the circuit board 10 is a Cavity board 10 , the circuit board 10 is electrically connected to the main board 30 , and the electrical signal on the main board 30 reaches the electronic device 20 through the first through hole 14 , the exposed copper layer 13 and the pad 12 .
[0033] like Figure 2 As shown, the electronic device 20 can be arranged on the side wall of the cavity board 10, and the cavity board 10 can be installed on the main board 30. Specifically, the electronic device 20 can be soldered on the side pad 12 of the cavity board 10 through the SMT process, so that the electronic device 20 is stably connected to the side wall of the cavity board 0, and then the cavity board 10 is mounted on the main board 30 through the SMT process to complete the entire path connection.
[0034] like Figure 3 As shown, the electrical signal output on the main board 30 can reach the electronic device 20 such as a spring through the first through hole 14, the exposed copper layer 13 and the pad 12 in the cavity board 10, and transmit the connection signal to the external connection device, that is, to the external device connected to the spring on the side wall of the cavity board 10.
[0035] Through this implementation, it is possible to transmit the electrical signals on the main board to the external connection device connected to the side wall of the cavity board, thereby expanding the application scenarios of the circuit board.
[0036] According to some embodiments of the present application, Figure 3 As shown, the electronic device 20 is a spring, and the circuit board 10 is connected to the external electronic device 40 via the spring.
[0037] In some embodiments, the electronic device 20 is a spring, that is, the spring can be connected through the side wall of the circuit board 10, and then connected to the external electronic device 40 through the spring. Specifically, a specific external electronic device can be connected according to actual application requirements to meet the needs of different application scenarios.
[0038] According to some embodiments of the present application, the second side wall of the circuit board 10 is also provided with a soldering pad, and a spring piece is welded to the second side wall through the soldering pad, and the spring piece is electrically connected to the internal wiring of the circuit board 10 .
[0039] That is, in some embodiments, structures similar to the first side wall 11 can be arranged on other side walls of the circuit board 10 to connect different external electronic devices by arranging spring clips on different side walls of the circuit board 10, thereby further improving the utilization rate of the PCB board. In actual application, the spring clips can be flexibly arranged on different side walls of the circuit board 10 according to specific needs.
[0040] The circuit board structure according to the embodiment of the present application includes: a circuit board and an electronic device, the electronic device is welded to the first side wall of the circuit board, the first side wall is provided with a soldering pad, the electronic device is welded to the soldering pad, and the soldering pad is electrically connected to the internal wiring of the circuit board. In this way, by welding electronic devices such as springs to the side wall of the circuit board, it is possible to avoid occupying the device layout space on the front and back sides of the circuit board, and also avoid the problem of other components on the board being stuck.
[0041] The present application also provides an electronic device, comprising the aforementioned Figures 1 to 3 Circuit board structure described in the embodiment. It should be noted that this embodiment is an embodiment of an electronic device corresponding to the embodiment of the circuit board structure described above. Its specific implementation can refer to the relevant introduction of the aforementioned embodiment, and can achieve the same technical effect as the aforementioned embodiment. To avoid repetition, it will not be described here.
[0042] Other components of the electronic device according to the embodiments of the present application, such as a processor and a controller, and operations are known to those of ordinary skill in the art and will not be described in detail here.
[0043] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0044] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.
Claims
1. A circuit board structure, characterized in that: include: A circuit board and an electronic device, wherein the electronic device is welded to a first side wall of the circuit board, the first side wall is provided with a welding pad, the electronic device is welded to the welding pad, and the welding pad is electrically connected to the internal wiring of the circuit board.
2. The circuit board structure according to claim 1, characterized in that: The electronic device is a spring or a component.
3. The circuit board structure according to claim 1, characterized in that: An exposed copper layer is disposed at a first position of the first side wall, and the pad is electrically connected to the exposed copper layer.
4. The circuit board structure according to claim 3, characterized in that: A first through hole perpendicular to the circuit board surface is provided at the second position of the circuit board. The first through hole is copper-plated. The exposed copper layer is electrically connected to the inner wall of the first through hole. The second position is adjacent to the first side wall.
5. The circuit board structure according to claim 4, characterized in that: The exposed copper layer is uniformly arranged at multiple positions of the first side wall, solder pads electrically connected to the exposed copper layer are plated at the multiple positions, and the electronic device is soldered at each solder pad.
6. The circuit board structure according to any one of claims 1 to 5, characterized in that: The circuit board is a cavity circuit board or a main board.
7. The circuit board structure according to claim 4, characterized in that: The circuit board is a cavity board, the circuit board is electrically connected to a main board, and the electrical signal on the main board reaches the electronic device through the first through hole, the exposed copper layer and the pad.
8. The circuit board structure according to claim 2, characterized in that: The electronic device is a spring, and the circuit board is connected to the external electronic device via the spring.
9. The circuit board structure according to claim 2, characterized in that: The second side wall of the circuit board is also provided with a soldering pad, and a spring sheet is welded to the second side wall through the soldering pad, and the spring sheet is electrically connected to the internal wiring of the circuit board.
10. An electronic device, characterized in that: A circuit board structure comprising any one of claims 1-9.