Sensor circuit board and manufacturing method thereof
By designing the sensor circuit board and using the cooperation of the suspension and actuator, the problems of increased packaging size and signal interference in the sensor anti-shake device are solved, and the stable movement of the sensor on the XY plane is achieved and the stability of the image quality is achieved.
Patent Information
- Application Number
- CN202311004086.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-10
- Publication Date
- 2025-02-18
AI Technical Summary
In sensor anti-shake device, the package size of voice coil motor increases and the interference of permanent magnets on signals.
A sensor circuit board is designed, including a movable unit, a fixed unit, a suspension, an X-axis actuator and a Y-axis actuator. Through the cooperation of the suspension and the actuator, stable welding and anti-shake of the sensor are achieved. Effects avoid the use of permanent magnets.
The stable movement of the sensor on the XY plane is achieved, ensuring the stability of image quality, and solving the problems of increased package size and signal interference.
Smart Images
Figure CN119485920A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a circuit board, and in particular to a sensor circuit board and a manufacturing method thereof. Background Art
[0002] In order to improve the stability of the camera lens, a sensor anti-shake device is currently provided. The sensor anti-shake device uses a voice coil motor as the power for the sensor to move. Since the voice coil motor includes a coil and a permanent magnet, the package size is increased, and the permanent magnet may interfere with the signal. Summary of the invention
[0003] Therefore, an object of the present invention is to provide a sensor circuit board and a manufacturing method thereof, thereby solving the problems of increased package size and permanent magnet interference signal.
[0004] According to the above-mentioned purpose of the present invention, a sensor circuit board is proposed. The sensor circuit board includes a movable unit, a fixed unit, a plurality of suspensions, a plurality of X-axis actuators and a plurality of Y-axis actuators. The movable unit includes a first movable block and a plurality of second movable blocks. The second movable block is arranged on both outer sides of the first movable block along the Y-axis. The fixed unit is arranged at intervals from the movable unit and includes a plurality of fixed blocks. The fixed block is arranged on the other two outer sides of the first movable block along the X-axis. Each suspension connects the movable unit and the fixed unit. The X-axis actuators are each located between the fixed block and one of the suspensions, and connect the fixed block and the first movable block. The Y-axis actuators are each located between the second movable block and one of the suspensions, and connect the first movable block and the second movable block.
[0005] In at least one embodiment of the present invention, the movable unit further comprises a plurality of sensor connection pads. The sensor connection pads are disposed on the first movable block.
[0006] In at least one embodiment of the present invention, the fixing unit further includes a connecting portion connected to one of the fixing blocks.
[0007] In at least one embodiment of the present invention, the suspension is a suspension wire.
[0008] In at least one embodiment of the present invention, the suspension is a spring.
[0009] In at least one embodiment of the present invention, the X-axis actuator comprises a pair of first comb-shaped electrodes facing each other, wherein the first comb-shaped electrodes comprise a plurality of first fingers, and the first fingers are spaced and arranged in parallel.
[0010] In at least one embodiment of the present invention, the minimum distance between two adjacent first fingers is less than 30 micrometers. The aspect ratio of the first fingers is greater than 5.
[0011] In at least one embodiment of the present invention, the Y-axis actuator includes a pair of second comb-shaped electrodes facing each other, wherein the second comb-shaped electrodes include a plurality of second fingers, and the second fingers are spaced apart and arranged in parallel.
[0012] In at least one embodiment of the present invention, the minimum distance between two adjacent second fingers is less than 30 micrometers. The aspect ratio of the second fingers is greater than 5.
[0013] According to the above-mentioned purpose of the present invention, a method for manufacturing a sensor circuit board is proposed. The method for manufacturing a sensor circuit board includes providing a substrate; forming a plurality of vias on the substrate; patterning the substrate; after patterning the substrate, bonding a metal layer with an insulating medium on the top and bottom surfaces of the substrate respectively; patterning the metal layer; removing a portion of the metal layer on the top surface of the substrate; after removing a portion of the metal layer on the top surface of the substrate, forming a protective film on the metal layer; and cutting the insulating medium and the base layer of the substrate.
[0014] Based on the above, the X-axis actuator and the Y-axis actuator of the sensor circuit board of the present invention can generate thrust or tension after voltage is applied. And the suspension connects the movable unit and the fixed unit. Through the cooperation of the suspension, the X-axis actuator and the Y-axis actuator, the sensor welded on the movable unit can be stabilized to achieve an anti-shake effect. Therefore, the sensor can only move on the XY plane, and the height will not change, thereby ensuring the image quality. Among them, in addition to providing support and rebound functions, the suspension can also provide signal and electrical energy transmission functions without the current problem of permanent magnets interfering with signals. In addition, the configuration of the suspension, the X-axis actuator and the Y-axis actuator can solve the problem of increased packaging size of the current voice coil motor. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to make the above and other objects, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows:
[0016] Figure 1 A schematic top plan view showing circuit connections of a sensor circuit board according to at least one embodiment of the present invention;
[0017] Figure 2 Draw the sensor circuit board edge Figure 1 A schematic cross-sectional view of line AA in FIG.
[0018] Figure 3 A schematic diagram showing a sensor circuit board in use according to at least one embodiment of the present invention is shown;
[0019] Figure 4 A schematic top view of a comb-shaped electrode is shown;
[0020] Figure 5 Draw Figure 4 A schematic cross-sectional view of line BB in FIG.
[0021] Figure 6 Draw Figure 1 Schematic diagram of X-axis displacement state of the circuit of the sensor circuit board;
[0022] Figure 7 Draw Figure 1 A schematic diagram of the Y-axis displacement state of the circuit of the sensor circuit board; and
[0023] FIG. 8A to FIG. 8H Draw Figure 2 A cross-sectional schematic diagram of a sensor circuit board manufacturing method. DETAILED DESCRIPTION
[0024] The following is a detailed discussion of embodiments of the present invention. However, it is understood that the embodiments provide many applicable concepts that can be implemented in a variety of specific contexts. The embodiments discussed and disclosed are for illustration only and are not intended to limit the scope of the present invention. For example, the description of "a first feature formed on a second feature" includes embodiments in which the first feature is in direct contact with the second feature, and also includes embodiments in which other features are formed between the first feature and the second feature so that the first feature and the second feature are not in direct contact.
[0025] In addition, spatially relative terms, such as "below," "below," "above," "above," etc., are used to simply describe the relationship of an element or feature illustrated in the drawings to other elements or features. These spatially relative terms also cover different orientations of use or operation in addition to the orientation depicted in the drawings. When an element can be oriented in other ways (rotated 90 degrees or in other orientations), the spatially relative descriptions used herein can be interpreted accordingly.
[0026] See also Figure 1 and Figure 2 ,in Figure 1 FIG. 1 is a top plan view schematically showing circuit connections of a sensor circuit board 100 according to at least one embodiment of the present invention. Figure 2 The sensor circuit board 100 is shown Figure 1 The sensor circuit board 100 includes a movable unit 110, a fixed unit 120, a plurality of suspensions 130, 131, 132, 133, 134, 135, 136 and 137, a plurality of X-axis actuators 140, 141, 142 and 143, and a plurality of Y-axis actuators 150 and 151.
[0027] Continue reading Figure 1 The movable unit 110 includes a first movable block 111 and a plurality of second movable blocks 112t and 112b. The second movable blocks 112t and 112b are disposed on both outer sides of the first movable block 111 along the Y-axis DY. Figure 1 , the second active block 112t is located above the first active block 111. The second active block 112b is located below the first active block 111. In one example, the active unit 110 further includes a plurality of sensor connection pads 113. The sensor connection pads 113 are disposed on the first active block 111. Figure 1 and Figure 3 ,in Figure 3 The schematic diagram of the sensor circuit board 100 in use according to at least one embodiment of the present invention is shown. In the camera lens 200 , the sensor 300 can be soldered on the sensor connection pad 113 of the first active block 111 .
[0028] like Figure 1 The fixed unit 120 is spaced apart from the movable unit 110 and includes a plurality of fixed blocks 121 and 121'. The fixed blocks 121 and 121' are arranged on the other two outer sides of the first movable block 111 along the X-axis direction DX. Figure 1 The fixed block 121 is located on the left side of the first movable block 111. The fixed block 121' is located on the right side of the first movable block 111. In one example, the fixed unit 120 further includes a connecting portion 122. The connecting portion 122 is connected to one of the fixed blocks 121'. Figure 1 , the connecting portion 122 is located on the right side of the first movable block 111 and connected to the fixed block 121 ′.
[0029] See also Figure 1 , the suspensions 130, 131, 132, 133, 134, 135, 136 and 137 connect the movable unit 110 and the fixed unit 120. The suspensions 130, 131, 132 and 133 are spaced apart from each other and are located at the periphery of the first movable block 111, and the suspensions 134, 135, 136 and 137 are spaced apart from each other and are located between the first movable block 111 and the peripheral suspensions 130, 131, 132 and 133.
[0030] Specifically, the suspension 130 connects the second movable block 112t and the fixed block 121. The suspension 131 connects the second movable block 112b and the fixed block 121. The suspension 132 connects the second movable block 112t and the fixed block 121'. The suspension 133 connects the second movable block 112b and the fixed block 121'. The suspension 134 connects one end of the first movable block 111 adjacent to the second movable block 112t and the fixed block 121. The suspension 135 connects one end of the first movable block 111 adjacent to the second movable block 112b and the fixed block 121. The suspension 136 connects one end of the first movable block 111 adjacent to the second movable block 112t and the fixed block 121'. The suspension 137 connects one end of the first movable block 111 adjacent to the second movable block 112b and the fixed block 121'. Among them, the suspensions 134, 135, 136 and 137 are located at the corners and have greater rigidity and bending fatigue resistance. In addition to providing support and rebound functions, the suspensions 134, 135, 136 and 137 can also provide signal, power and other transmission. That is, the signal of the sensor 300 can be transmitted to the fixed block 121 'through the suspensions 134, 135, 136 and 137, and then transmitted to the connecting portion 122.
[0031] In one example, the suspensions 130, 131, 132, 133, 134, 135, 136 and 137 may be components with support and resilience, such as suspension wires or spring sheets. In one example, the materials of the suspensions 130, 131, 132, 133, 134, 135, 136 and 137 may be alloys such as titanium copper. Further, by etching into different sizes, such as a smaller width and a larger thickness, that is, a high aspect ratio, movement and rebound in the plane direction, as well as high anti-bending properties in the height direction are achieved.
[0032] See also Figure 1 Each X-axis actuator 140, 141, 142 and 143 is located between adjacent fixed blocks 121 and 121' and adjacent suspensions 134, 135, 136 and 137. Each X-axis actuator 140, 141, 142 and 143 connects adjacent fixed blocks 121 and 121' and the first movable block 111. Specifically, the X-axis actuator 140 is located between the fixed block 121 and the suspension 134, and connects the fixed block 121 and one end of the first movable block 111 adjacent to the second movable block 112t.
[0033] The X-axis actuator 141 is located between the fixed block 121 and the suspension 135, and is connected to the fixed block 121 and one end of the first movable block 111 adjacent to the second movable block 112b. The X-axis actuator 142 is located between the fixed block 121' and the suspension 136, and is connected to the fixed block 121' and one end of the first movable block 111 adjacent to the second movable block 112t. The X-axis actuator 143 is located between the fixed block 121' and the suspension 137, and is connected to the fixed block 121' and one end of the first movable block 111 adjacent to the second movable block 112b.
[0034] See also Figure 1 , each Y-axis actuator 150 and 151 is located between the adjacent second active blocks 112t and 112b and the adjacent suspensions 134, 135, 136 and 137. Each Y-axis actuator 150 and 151 connects the first active block 111 and the adjacent second active blocks 112t and 112b. Specifically, the Y-axis actuator 150 is located between the second active block 112t and the suspension 134 (and the suspension 136), and the Y-axis actuator 150 connects the first active block 111 and the second active block 112t. The Y-axis actuator 151 is located between the second active block 112b and the suspension 135 (and the suspension 137), and the Y-axis actuator 151 connects the first active block 111 and the second active block 112b.
[0035] See also Figure 1 , Figure 4 and Figure 5 ,in Figure 4 A schematic top view of a comb-shaped electrode is shown. Figure 5 Draw Figure 4 BB in FIG. The structures of the X-axis actuators 140, 141, 142 and 143 are the same. Taking the X-axis actuator 140 as an example, the X-axis actuator 140 includes a pair of first comb electrodes 140b opposite to each other. The first comb electrode 140b includes a plurality of first fingers 140f. These first fingers 140f are spaced apart and arranged in parallel. The minimum spacing D between adjacent first fingers 140f is less than 30 microns. The aspect ratio of the first finger 140f is greater than 5, as shown in FIG. Figure 5 , the aspect ratio is the ratio of the height H to the width W.
[0036] The structures of the Y-axis actuators 150 and 151 are substantially the same as the structures of the X-axis actuators 140, 141, 142 and 143. Figure 4 and Figure 5 As shown. With the Y-axis actuator 150, Figure 4 and Figure 5For example, the Y-axis actuator 150 includes a pair of second comb electrodes 150b opposite to each other. The second comb electrode 150b includes a plurality of second fingers 150f. These second fingers 150f are spaced apart and arranged side by side. The minimum spacing D between adjacent second fingers 150f is less than 30 microns. The aspect ratio of the second fingers 150f is greater than 5. In one example, the X-axis actuators 140, 141, 142 and 143 and the Y-axis actuators 150 and 151 can be actuators driven by thermal expansion. In one example, the X-axis actuators 140, 141, 142 and 143 and the Y-axis actuators 150 and 151 can be actuators driven by piezoelectricity.
[0037] See also Figure 6 , which shows Figure 1 Schematic diagram of the X-axis displacement state of the circuit of the sensor circuit board 100. The movable unit 110 can be displaced in the direction parallel to the X-axis by driving the X-axis actuators 140, 141, 142 and 143. Specifically, after the voltage is applied, the X-axis actuator 140 and the X-axis actuator 141 generate thrust, and the X-axis actuator 142 and the X-axis actuator 143 generate tension.
[0038] See also Figure 7 , which shows Figure 1 Schematic diagram of the Y-axis displacement state of the circuit of the sensor circuit board 100. The first active block 111 in the active unit 110 can be displaced in the direction parallel to the Y-axis by driving the Y-axis actuators 150 and 151. Specifically, after the voltage is applied, the Y-axis actuator 150 generates thrust and the Y-axis actuator 151 generates tension.
[0039] It can be seen that the X-axis actuators 140, 141, 142 and 143 can drive the first active block 111 to generate displacement in the X-axis direction, and the Y-axis actuators 150 and 151 can drive the first active block 111 to generate displacement in the Y-axis direction. Further, the suspensions 134, 135, 136 and 137 have greater rigidity and bending fatigue resistance, and realize movement and rebound in the plane direction, as well as high bending resistance in the height direction. Therefore, when vibrating, the sensor 300 set on the first active block 111 only moves in the plane (i.e., the XY plane), and the height does not change, and thus does not affect the image quality.
[0040] See also FIG. 8A to FIG. 8H , which shows Figure 2 Schematic cross-sectional view of the manufacturing method of the sensor circuit board 100. Fig. 8A , first provide a substrate 400. Then Figure 8B , forming a plurality of via holes 400h on the substrate 400. Figure 8C, patterning the substrate 400, that is, using a photolithography method to pattern the substrate 400. Fig.8D After patterning the substrate 400, the metal layers 600 and 600' are bonded to the top surface 400t and the bottom surface 400b of the substrate 400 respectively with the insulating medium 500, and a cavity 700 is formed between the metal layer 600 on the top surface 400t of the substrate 400 and the metal layer 600' on the bottom surface 400b of the substrate 400. Fig. 8E , patterning metal layers 600 and 600'. Figure 8F , a portion of the metal layer 600 on the top surface 400t of the substrate 400 is removed. That is, the metal layer 600 above the cavity portion 700 is removed. Figure 8G After removing a portion of the metal layer 600 on the top surface 400t of the substrate 400, a protective film 800 is formed on the metal layers 600 and 600' on the top surface 400t and the bottom surface 400b of the substrate 400. The protective film 800 is a solder mask. Figure 8H , cutting the insulating medium 500 and the base layer 400y of the substrate 400. That is, cutting the insulating medium 500, and cutting and removing the base layer 400y located in the cavity portion 700 of the substrate 400.
[0041] It can be seen from the above embodiments that one advantage of the present invention is that the X-axis actuator and the Y-axis actuator of the sensor circuit board of the present invention can generate thrust or tension after voltage is applied. And the suspension connects the movable unit and the fixed unit. Through the cooperation of the suspension, the X-axis actuator and the Y-axis actuator, the sensor welded on the movable unit can be stabilized to achieve an anti-shake effect. Therefore, the sensor can only move on the XY plane, and the height will not change, thereby ensuring the image quality. Among them, in addition to providing support and rebound functions, the suspension can also provide signal and electrical energy transmission functions without the current problem of permanent magnets interfering with signals. In addition, the configuration of the suspension, the X-axis actuator and the Y-axis actuator can solve the problem of increased packaging size of the current voice coil motor.
[0042] Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the attached claims.
[0043]
Explanation of symbols
[0044] 100:Sensor circuit board
[0045] 110:Activity Unit
[0046] 111: First activity block
[0047] 112b, 112t: Second active block
[0048] 113: Sensor connection pad
[0049] 120: Fixed unit
[0050] 121,121': Fixed block
[0051] 122: Connecting part
[0052] 130,131,132,133,134,135,136,137: Suspension
[0053] 140,141,142,143: X-axis actuator
[0054] 140b: first comb-shaped electrode
[0055] 140f: first finger
[0056] 150,151: Y-axis actuator
[0057] 150b: second comb electrode
[0058] 150f: second finger
[0059] 200: Camera lens
[0060] 300: Sensor
[0061] 400:Substrate
[0062] 400b: bottom
[0063] 400h: via
[0064] 400t: Top
[0065] 400y: Grassroots
[0066] 500: Insulation medium
[0067] 600,600':Metal layer
[0068] 700: Cavity
[0069] 800: Protective film
[0070] AA:Line
[0071] BB:Line
[0072] D: Minimum spacing
[0073] DX: X-axis
[0074] DY: Y axis
[0075] H: Height
[0076] W: width.
Claims
1. A sensor circuit board, characterized in that: include: Activity unit, which contains: First activity block; as well as A plurality of second active blocks are arranged on both outer sides of the first active block along the Y axis; A fixed unit is spaced apart from the movable unit and comprises: A plurality of fixed blocks are arranged on the other two outer sides of the first movable block along the X-axis direction; a plurality of suspensions, each of the suspensions connecting the movable unit and the fixed unit; a plurality of X-axis actuators, each of which is located between the fixed block and one of the suspensions and connects the fixed block and the first movable block; and A plurality of Y-axis actuators are each located between the second movable block and one of the suspensions, and connect the first movable block and the second movable block. 2 . The sensor circuit board according to claim 1 , wherein the active unit further comprises a plurality of sensor connection pads, and the sensor connection pads are disposed on the first active block. 3 . The sensor circuit board according to claim 1 , wherein the fixing unit further comprises a connecting portion, wherein the connecting portion is connected to one of the fixing blocks. The sensor circuit board according to claim 1 , wherein the suspension is a suspension wire. The sensor circuit board according to claim 1 , wherein the suspension is a spring. 6 . The sensor circuit board according to claim 1 , wherein the X-axis actuator comprises a pair of first comb-shaped electrodes facing each other, wherein the first comb-shaped electrodes comprise a plurality of first fingers, and the first fingers are spaced apart and arranged in parallel. 7 . The sensor circuit board according to claim 6 , wherein a minimum distance between two adjacent first fingers is less than 30 μm, and an aspect ratio of the first fingers is greater than 5. 8 . The sensor circuit board according to claim 1 , wherein the Y-axis actuator comprises a pair of second comb-shaped electrodes facing each other, wherein the second comb-shaped electrodes comprise a plurality of second fingers, and the second fingers are spaced apart and arranged in parallel. 9 . The sensor circuit board according to claim 8 , wherein the minimum distance between two adjacent second fingers is less than 30 μm, and the aspect ratio of the second fingers is greater than 5.
10. A method for manufacturing a sensor circuit board, characterized in that: Include: providing a substrate; forming a plurality of vias on the substrate; patterning the substrate; After patterning the substrate, bonding metal layers on the top and bottom surfaces of the substrate with insulating media respectively; patterning the metal layer; removing a portion of the metal layer on the top surface of the substrate; After removing a portion of the metal layer on the top surface of the substrate, forming a protective film on the metal layer; as well as The insulating medium and the base layer of the substrate are cut.