Circuit board processing method, device, equipment and medium
By using surface treatment diagrams to define the plasma gas reaction area during the circuit board manufacturing process and using plasma gas for blind hole treatment, the hole position deviation and hole position deformation problems caused by laser drilling are solved, and a higher opening is achieved Pore accuracy and stability.
Patent Information
- Application Number
- CN202411441926.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-16
- Publication Date
- 2025-02-18
AI Technical Summary
In the existing circuit board blind hole manufacturing technology, laser drilling can easily lead to hole position deviation and hole position deformation.
The circuit board to be treated is opened through the surface treatment diagram to define the reaction area of the plasma gas, and the window area of the initial treatment circuit board is blinded by using plasma gas, using gases such as nitrogen, methane and silicon tetrachloride. React with the resin to generate an inert substance to protect the resin side wall and improve the accuracy of opening.
It effectively avoids hole position deviation and hole position deformation of blind holes, improves the accuracy of hole openings, and ensures the accuracy and stability of the blind holes on the circuit board.
Smart Images
Figure CN119485924A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to but is not limited to the field of circuit board manufacturing, and in particular to a circuit board processing method, device, equipment and medium. Background Art
[0002] At present, laser drilling is mainly used in the blind hole manufacturing technology of circuit boards. Laser drilling is a process that uses the high energy and collimation characteristics of lasers to guide the laser to the processing position through optical devices, remove unnecessary materials, and form holes. However, laser drilling has strict limitations on the position, and slight errors may cause hole position deviation and hole position deformation. Summary of the invention
[0003] The embodiments of the present application provide a circuit board processing method, device, equipment and medium, which can effectively solve the problem of hole position deviation of blind holes.
[0004] In a first aspect, an embodiment of the present application provides a circuit board processing method comprising:
[0005] Obtain the circuit board to be processed and the surface processing map;
[0006] Performing window processing on the surface of the circuit board to be processed according to the surface processing map to obtain an initially processed circuit board;
[0007] Plasma gas is used to perform blind hole processing on the window opening area of the initially processed circuit board to obtain a target circuit board.
[0008] Among them, the circuit board to be processed includes a substrate, a resin layer adhered to both sides of the substrate and a copper layer adhered to the outside of the resin layer, the plasma gas includes nitrogen, methane and silicon tetrachloride, and in the blind hole opening process, the ionization frequency of the plasma gas is 2GHz to 2.5GHz.
[0009] According to the circuit board processing method of the first aspect of the present application, there are at least the following beneficial effects: by performing window processing on the surface of the circuit board to be processed through the surface processing map, the reaction area of the plasma gas can be limited to avoid the hole position deviation of the blind hole. By using plasma gas to open blind holes in the window opening area of the initial processing circuit board, the hole position deformation caused by laser hole opening in the related art can be avoided. Since the plasma gas includes nitrogen, methane and silicon tetrachloride, it will react with both sides of the resin to generate inert substances during the reaction process, which will passivate and protect the side walls of the resin and improve the accuracy of the hole opening.
[0010] According to some embodiments of the first aspect of the present application, before performing window processing on the surface of the circuit board to be processed according to the surface processing map, the method further includes:
[0011] The circuit board to be processed is subjected to super-roughening treatment to increase the roughness of the circuit board to be processed.
[0012] According to some embodiments of the first aspect of the present application, after the circuit board to be processed is subjected to super-roughening treatment, the method further includes:
[0013] According to the surface treatment diagram, the upper surface and the lower surface of the circuit board to be processed are subjected to film pasting treatment.
[0014] According to some embodiments of the first aspect of the present application, after the upper surface and the lower surface of the circuit board to be processed are subjected to film processing according to the surface processing diagram, the method further includes:
[0015] The circuit board to be processed is subjected to a developing process to expose the window area on the surface of the circuit board to be processed.
[0016] According to some embodiments of the first aspect of the present application, the circuit board processing method further includes:
[0017] The initially processed circuit board is subjected to a film stripping treatment to remove the residual dry film on the initially processed circuit board.
[0018] According to some embodiments of the first aspect of the present application, after the film stripping treatment is performed on the pre-processed circuit board, the method further includes:
[0019] The initially processed circuit board is pickled to remove residues produced by the window opening process.
[0020] According to some embodiments of the first aspect of the present application, the step of using plasma gas to perform blind hole processing on the window opening area of the initially processed circuit board to obtain a target circuit board includes:
[0021] Get the depth of the hole to be opened;
[0022] Determine the number of working times according to the depth of the hole to be opened;
[0023] According to the working times, plasma gas is used to perform blind hole processing on the window opening area of the initially processed circuit board to obtain a target circuit board.
[0024] In a second aspect, an embodiment of the present application provides an operation control device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the circuit board processing method described in the first aspect is implemented.
[0025] In a third aspect, an embodiment of the present application provides an electronic device, comprising an operation control device as described in the embodiment of the second aspect.
[0026] In a fourth aspect, the present application also provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the circuit board processing method as described in the first aspect of the embodiment.
[0027] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained by the structures specifically pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] The accompanying drawings are used to provide a further understanding of the technical solution of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the technical solution of the present invention and do not constitute a limitation on the technical solution of the present invention.
[0029] Figure 1 A step diagram of a circuit board processing method provided in an embodiment of the present application;
[0030] Figure 2 A specific flow chart of the circuit board processing method provided in the embodiment of the present application;
[0031] Figure 3 for Figure 1 Specific flow chart of step S300;
[0032] Figure 4 An operation control device is provided for an embodiment of the present application. DETAILED DESCRIPTION
[0033] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0034] It is understood that although the functional modules are divided in the device schematic diagram and the logical order is shown in the flow chart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flow chart. The terms "first", "second", etc. in the specification, claims or the above drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.
[0035] At present, laser drilling is mainly used in the blind hole manufacturing technology of circuit boards. Laser drilling is a process that uses the high energy and collimation characteristics of lasers to guide the laser to the processing position through optical devices, remove unnecessary materials, and form holes. However, laser drilling has strict limitations on the position, and slight errors may cause hole position deviation and hole position deformation.
[0036] Based on this, the embodiments of the present application provide a circuit board processing method, device, equipment and medium. By performing window processing on the surface of the circuit board to be processed through the surface processing map, the reaction area of the plasma gas can be limited to avoid the hole position deviation of the blind hole. By using plasma gas to open blind holes in the window area of the initial processing circuit board, the hole position deformation caused by laser hole opening in the related technology can be avoided. Since the plasma gas includes nitrogen and methane, it will react with both sides of the resin to generate inert substances during the reaction process, which will passivate and protect the side walls of the resin and improve the accuracy of the hole opening.
[0037] Reference Figure 1 , Figure 1 The step diagram of the circuit board processing method provided in the embodiment of the present application includes but is not limited to the following steps:
[0038] Step S100, obtaining the circuit board to be processed and the surface treatment diagram;
[0039] Step S200, performing window processing on the surface of the circuit board to be processed according to the surface processing diagram to obtain an initially processed circuit board;
[0040] Step S300: using plasma gas to perform blind hole processing on the window opening area of the initial processing circuit board to obtain a target circuit board.
[0041] It can be understood that the circuit board to be processed includes a substrate, a resin layer bonded to both sides of the substrate and a copper layer bonded to the outside of the resin layer. The surface treatment pattern includes the positions of blind holes on the surface of the circuit board to be processed. In the blind hole processing, the plasma gas is ionized so that the plasma only physically bombards and chemically reacts with the resin layer. Therefore, the surface of the circuit board to be processed is subjected to window processing according to the surface treatment pattern to obtain an initial processed circuit board. When the blind hole processing is performed on the window area of the initial processed circuit board using plasma gas, the plasma gas only reacts with the resin layer in the window area, which can effectively avoid the occurrence of hole position deformation or hole position error.
[0042] It should be noted that in the blind hole opening process, the plasma gas is ionized by an electric field, and then the unstable separated gas substances are used to modify and bombard the surface of the resin layer under the window opening area to achieve the purpose of etching the resin. Among them, the ionization frequency of the plasma gas is 2GHz to 2.5GHz, which can effectively increase the ion concentration and the reaction speed at this ionization frequency, thereby reducing the reaction time.
[0043] It should be noted that, in some embodiments, a microwave plasma device is used to open blind holes in the window area of the initial processing circuit board. The operating frequency of the microwave plasma device is 2GHz to 2.5GHz (i.e., the ionization frequency of the plasma gas is 2GHz to 2.5GHz). The microwave plasma device uses microwave energy to form plasma gas in a low-pressure environment. Compared with the use of radio frequency plasma equipment to ionize the plasma gas, the microwave plasma device has no positive and negative electrodes, and the self-bias voltage is very small, and no discharge pollution will be generated, which effectively prevents electrostatic damage. In addition, the ion concentration generated by the microwave plasma device is high, which can effectively increase the reaction speed. In addition, if the radio frequency plasma device is used to ionize the plasma gas, the ionization frequency required by the processing method of this application cannot be reached.
[0044] It should be noted that the plasma gas includes methane, nitrogen and silicon tetrachloride gas. After the plasma gas is ionized by an electric field, the silicon tetrachloride gas will be ionized into chloride ions and silicon ions, and the methane will be ionized into carbon ions and hydrogen ions. In the blind hole opening process, the ions will continuously physically etch and chemically react with the resin under the window opening area. In this process, the silicon ions will react with the resin to generate silicon dioxide, which passivates the surface of the resin and hinders the chemical reaction. However, since the bottom of the resin will be mainly bombarded by the ions, the silicon dioxide generated at the bottom of the resin in the window opening area will be removed during the bombardment, and then the bottom of the resin in the window opening area will be chemically etched. However, the side wall of the resin in the window opening area is less impacted, resulting in the silicon dioxide on the side wall of the resin in the window opening area not being removed, so that the side wall of the resin in the window opening area will not be chemically etched. That is, by adding silicon tetrachloride to the plasma gas, the side wall of the resin in the window opening area can be protected to avoid the hole position deviation caused by lateral etching.
[0045] In addition, by adding methane to the plasma gas, polymer can be deposited while depositing silicon dioxide to protect the side walls of the resin in the window area. By adding nitrogen to the plasma gas, since the inert nitrogen gas can reduce the concentration of other precursor gases (methane and silicon tetrachloride gas), the reaction rate is slowed down, which helps to form more uniform and dense silicon dioxide on the side walls of the resin in the window area.
[0046] Reference Figure 2 , Figure 2 A specific flow chart of the circuit board processing method provided in an embodiment of the present application.
[0047] It is understandable that before the window opening treatment is performed, the circuit board to be processed will also be subjected to super-roughening treatment, which can make the surface of the copper layer rough, so as to increase the adhesion between the copper foil and the subsequently attached dry film. After the circuit board to be processed is subjected to super-roughening treatment, the upper and lower surfaces of the circuit board to be processed will also be subjected to film treatment according to the surface treatment diagram, wherein the film treatment is to attach a dry film on the surface of the copper layer. After the film treatment, the dry film will also be subjected to exposure treatment, wherein the unexposed area is the window opening area. After the exposure treatment, the circuit board to be processed will also be subjected to development treatment, and the exposed circuit board to be processed will be placed in a developer to dissolve the unexposed dry film portion and expose the window opening area on the copper layer. After the development treatment, the surface of the circuit board to be processed will be subjected to window opening treatment to obtain an initial processing circuit board. After the window opening treatment, the initial processing circuit board will be subjected to film stripping treatment to remove the residual dry film on the initial processing circuit board. After the film stripping treatment, the initially processed circuit board is pickled to remove the residues produced by the window opening treatment to avoid affecting the subsequent blind hole opening treatment. Finally, plasma gas is used to open blind holes in the window opening area of the initially processed circuit board to obtain the target circuit board.
[0048] Furthermore, in some embodiments, the target circuit board is electroplated to connect the substrate and the copper layer on the surface.
[0049] Reference Figure 3 , Figure 3 for Figure 1 The specific flow chart of step S300 includes but is not limited to the following steps:
[0050] Step S310, obtaining the depth of the hole to be opened;
[0051] Step S320, determining the number of operations according to the depth of the hole to be drilled;
[0052] Step S330: According to the working times, plasma gas is used to perform blind hole processing on the window opening area of the initial processing circuit board to obtain a target circuit board.
[0053] It is understandable that in the blind hole opening process, the deeper the depth of the blind hole to be processed, the more likely the resin in the window area will be incompletely etched during the processing. Therefore, the depth of the hole to be opened can be obtained, and the number of working times can be determined based on the depth of the hole to be opened. Then, according to the number of working times, plasma gas is used to open the blind hole in the window area of the initial circuit board to avoid the phenomenon of incomplete blind hole etching. The depth of the hole to be opened is the thickness of the resin layer. In some embodiments, when the depth of the hole to be opened is less than the first preset threshold, the number of working times is one; when the depth of the hole to be opened is greater than the second preset threshold, the number of working times is three.
[0054] It should be noted that in the blind hole opening process, if multiple operations are required, that is, the number of operations is greater than or equal to two, vacuum extraction will be performed at the end of each operation and new plasma gas will be injected to prevent the ions in the gas from being completely consumed, thereby reducing the efficiency of blind hole etching.
[0055] Second, refer to Figure 4 The present application embodiment provides an operation control device 400, including a memory 410, a processor 420, and a computer program stored in the memory 410 and executable on the processor 420. The processor 420 executes the program to implement the circuit board processing method of the first embodiment, for example, Figure 1 Method steps S100 to S300 and Figure 3 Steps S310 to S330.
[0056] The memory 410 is a non-transitory computer-readable storage medium that can be used to store non-transitory software programs and non-transitory computer executable programs, such as the circuit board processing method in the above embodiment of the present application. The processor 420 implements the circuit board processing method in the above embodiment of the present application by running the non-transitory software programs and instructions stored in the memory 410.
[0057] The memory 410 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required by at least one function; the data storage area may store data required to execute the circuit board processing method in the above embodiment, etc. In addition, the memory 410 may include a high-speed random access memory 410, and may also include a non-transitory memory 410, such as at least one disk storage device, a flash memory device, or other non-transitory solid-state storage device. It should be noted that the memory 410 may optionally include a memory 410 remotely arranged relative to the processor 420, and these remote memories 410 may be connected to the terminal via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.
[0058] In a third aspect, an embodiment of the present application provides an electronic device, comprising an operation control device 400 as described in the embodiment of the second aspect above.
[0059] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, and a computer-executable instruction is used to enable a computer to execute a circuit board processing method as in the embodiment of the first aspect, for example, to execute Figure 1 Method steps S100 to S300 and Figure 3 Steps S310 to S330.
[0060] It will be appreciated by those skilled in the art that all or some of the steps and systems in the disclosed methods above may be implemented as software, firmware, hardware and appropriate combinations thereof. Some physical components or all physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium or a non-transitory medium and a communication medium or a temporary medium. As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information such as computer-readable instructions, data structures, program modules or other data. Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disk DVD or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage or other magnetic storage devices, or any other medium that may be used to store desired information and may be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically embodies computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.
[0061] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present application.
Claims
1. A circuit board processing method, characterized in that: include: Obtain the circuit board to be processed and the surface processing map; Performing window processing on the surface of the circuit board to be processed according to the surface processing map to obtain an initially processed circuit board; Using plasma gas to perform blind hole processing on the window opening area of the initially processed circuit board to obtain a target circuit board; Among them, the circuit board to be processed includes a substrate, a resin layer adhered to both sides of the substrate and a copper layer adhered to the outside of the resin layer, the plasma gas includes nitrogen, methane and silicon tetrachloride, and in the blind hole opening process, the ionization frequency of the plasma gas is 2GHz to 2.5GHz.
2. The circuit board processing method according to claim 1, characterized in that: Before performing window processing on the surface of the circuit board to be processed according to the surface processing map, the method further includes: The circuit board to be processed is subjected to super-roughening treatment to increase the roughness of the circuit board to be processed.
3. The circuit board processing method according to claim 2, characterized in that: After the circuit board to be processed is subjected to super-roughening treatment, the method further comprises: According to the surface treatment diagram, the upper surface and the lower surface of the circuit board to be processed are subjected to film pasting treatment.
4. The circuit board processing method according to claim 3, characterized in that: After the upper and lower surfaces of the circuit board to be processed are subjected to film treatment according to the surface treatment diagram, the method further includes: The circuit board to be processed is subjected to a developing process to expose the window area on the surface of the circuit board to be processed.
5. The circuit board processing method according to claim 1, characterized in that: The circuit board processing method further comprises: The initially processed circuit board is subjected to a film stripping treatment to remove the residual dry film on the initially processed circuit board.
6. The circuit board processing method according to claim 5, characterized in that: After the film stripping treatment is performed on the initially processed circuit board, the method further includes: The initially processed circuit board is pickled to remove residues produced by the window opening process.
7. The circuit board processing method according to claim 1, characterized in that: The method of using plasma gas to perform blind hole processing on the window opening area of the initially processed circuit board to obtain a target circuit board includes: Get the depth of the hole to be opened; Determine the number of working times according to the depth of the hole to be opened; According to the working times, plasma gas is used to perform blind hole processing on the window opening area of the initially processed circuit board to obtain a target circuit board.
8. An operation control device, characterized in that: The invention comprises a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the circuit board processing method according to any one of claims 1 to 7.
9. An electronic device, characterized in that: Comprising the operation control device as claimed in claim 8.
10. A computer storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the circuit board processing method according to any one of claims 1 to 7.