Medical imaging system and thermal management method thereof

Abstract

The invention provides a medical imaging system and a thermal management method thereof. The system comprises a detector assembly and a temperature adjusting assembly. The detector assembly comprises: a first group of detector modules located in a central area of the detector assembly; and the second group of detector modules are positioned in a peripheral area on at least one side of the central area of the detector assembly. The temperature adjusting assembly comprises a first temperature adjusting device which applies a first thermal control strategy for performing same temperature control on all the detector modules of the first group of detector modules; and a second temperature adjusting device which applies a second thermal control strategy for respectively controlling the temperature of each detector module of the second group of detector modules.

Description

Technical Field

[0001] The present disclosure relates generally to medical imaging and, more particularly, to medical imaging systems and methods of thermal management thereof. Background Art

[0002] Non-invasive radiographic techniques allow images of the internal structures of a scanned object (e.g., a patient) to be obtained without performing an invasive procedure on the scanned object. Specifically, techniques such as computed tomography (CT) use various physical principles (such as differential transmission of x-rays through a target volume) to acquire image data and construct a tomographic image (e.g., a three-dimensional representation of the interior of a human body or other imaged structure).

[0003] In modern CT imaging systems, after being emitted from an x-ray tube, an x-ray beam passes through the scanned object. After being attenuated by the scanned object, the x-ray beam hits the scintillator of the x-ray detector assembly and is converted into light energy. The photodiode of the detector assembly detects the light energy and generates a corresponding electrical signal, which is then converted by an application-specific integrated circuit (ASIC) A / D and transmitted to the data processing system for image reconstruction. The detector assembly of the CT imaging system is arranged in an arc shape, consumes a high power when working, and is highly sensitive to changes in the working temperature, that is, the detector assembly is required to work within a specific temperature range and maintain a small change amplitude. If the detector working temperature exceeds the specific temperature range or changes greatly, the quality of the subsequent reconstructed image will be affected. Summary of the invention

[0004] The present disclosure aims to overcome the above and / or other problems in the prior art, provide a method for improving the stability of the operating temperature of the detector assembly, and a method for reducing power consumption. It is also desirable to provide a medical imaging system using these methods.

[0005] According to a first aspect of the present invention, a medical imaging system is provided, the system comprising a detector assembly and a temperature adjustment assembly, wherein the detector assembly comprises: a first group of detector modules located in a central area of ​​the detector assembly; and a second group of detector modules located in a peripheral area on at least one side of the central area of ​​the detector assembly, and the temperature adjustment assembly comprises: a first temperature adjustment device that applies a first thermal control strategy for performing the same temperature control on all detector modules of the first group of detector modules; and a second temperature adjustment device that applies a second thermal control strategy for performing separate temperature control on each detector module of the second group of detector modules.

[0006] Preferably, the first group of detector modules includes 3-5 detector modules.

[0007] Preferably, the first temperature adjustment device includes at least one detector module heater, and the first temperature adjustment device is configured to control the at least one detector module heater so that the temperature of each detector module in the first group of detector modules is increased or decreased based on the average value of the temperatures measured for all detector modules in the first group of detector modules.

[0008] Preferably, the first temperature adjustment device is configured to control the at least one detector module heater based on an average value of temperatures measured for all detector modules in the first group of detector modules so that the temperature of each detector module in the first group of detector modules increases or decreases simultaneously.

[0009] Preferably, the at least one detector module heater comprises a plurality of detector module heaters, each of the plurality of detector module heaters being used to heat a corresponding detector module in the first group of detector modules.

[0010] Preferably, the second temperature adjustment device includes a plurality of detector module heaters, each of the plurality of detector module heaters is used to heat a corresponding detector module in the second group of detector modules, and the second temperature adjustment device is configured to control the corresponding detector module heater in the second temperature adjustment device so as to increase or decrease the temperature of each detector module in the second group of detector modules based on the temperature measured for the detector module.

[0011] Preferably, the detector assembly also includes a third group of detector modules, which are located in the outer edge area of ​​at least one side of the detector assembly, and the temperature adjustment assembly further includes a third temperature adjustment device, which applies a third thermal control strategy for separately controlling the temperature of each detector module of the third group of detector modules, and the third temperature adjustment device includes a plurality of detector module heaters, each of the plurality of detector module heaters is used to heat a corresponding detector module in the third group of detector modules, and the third temperature adjustment device is configured to control the corresponding detector module heater in the third temperature adjustment device for each detector module in the third group of detector modules based on the temperature measured for the detector module so as to increase or decrease the temperature of the detector module.

[0012] Preferably, the first temperature control device is configured to provide power to at least part of the detector module heater included therein at a first maximum power, the second temperature control device is configured to provide power to at least part of the detector module heater included therein at a second maximum power, wherein the second maximum power is greater than the first maximum power, and the third temperature control device is configured to provide power to at least part of the detector module heater included therein at a third maximum power, wherein the third maximum power is greater than the second maximum power.

[0013] Preferably, the first maximum power is 50%-60% of the maximum or average rated power of at least part of the detector module heater in the first temperature adjustment device, the second maximum power is 70%-80% of the maximum or average rated power of at least part of the detector module heater in the second temperature adjustment device, and the third maximum power is 90%-100% of the maximum or average rated power of at least part of the detector module heater in the third temperature adjustment device.

[0014] Preferably, the first temperature control device, the second temperature control device and the third temperature control device include the same detector module heater, the first temperature control device is configured to apply a power supply having a first maximum pulse width modulation duty cycle or a first maximum voltage to at least part of the detector module heater included therein, so as to provide power to at least part of the detector module heater included therein at the first maximum power, the second temperature control device is configured to apply a power supply having a second maximum pulse width modulation duty cycle or a second maximum voltage to at least part of the detector module heater included therein, so as to provide power to at least part of the detector module heater included therein at the second maximum power, and the third temperature control device is configured to apply a power supply having a third maximum pulse width modulation duty cycle or a third maximum voltage to at least part of the detector module heater included therein, so as to provide power to at least part of the detector module heater included therein at the third maximum power.

[0015] According to a second aspect of the present invention, there is provided a thermal management method for a medical imaging system, in which a detector assembly comprises a first group of detector modules and a second group of detector modules, the first group of detector modules being located in a central area of ​​the detector assembly, and the second group of detector modules being located in a peripheral area on at least one side of the central area of ​​the detector assembly, the thermal management method comprising: executing a first thermal control strategy for performing the same temperature control on all detector modules of the first group of detector modules; and executing a second thermal control strategy for performing separate temperature control on each detector module of the second group of detector modules.

[0016] Preferably, the first group of detector modules includes 3-5 detector modules, and the first thermal control strategy for performing the same temperature control on all detector modules of the first group of detector modules includes: based on an average value of each temperature measured for all detector modules in the first group of detector modules, controlling the detector module heater associated with the first group of detector modules so that the temperature of each detector module in the first group of detector modules is increased or decreased.

[0017] Preferably, executing a first thermal control strategy for performing the same temperature control on all detector modules in the first group of detector modules includes: based on an average value of each temperature measured for all detector modules in the first group of detector modules, controlling the detector module heater associated with the first group of detector modules so that the temperature of each detector module in the first group of detector modules increases or decreases simultaneously.

[0018] Preferably, executing a second thermal control strategy for separately controlling the temperature of each detector module of the second group of detector modules includes: for each detector module in the second group of detector modules, based on the temperature measured for the detector module, controlling a corresponding detector module heater among a plurality of detector module heaters associated with the second group of detector modules to increase or decrease the temperature of the detector module.

[0019] Preferably, the detector assembly also includes a third group of detector modules, which are located in the outer edge area of ​​at least one side of the detector assembly, and the thermal management method also includes: executing a third thermal control strategy for separately controlling the temperature of each detector module of the third group of detector modules, wherein executing the third thermal control strategy for separately controlling the temperature of each detector module of the third group of detector modules includes: for each detector module in the third group of detector modules, based on the temperature measured for the detector module, controlling a corresponding detector module heater among a plurality of detector module heaters associated with the third group of detector modules to increase or decrease the temperature of the detector module.

[0020] Preferably, at a first maximum power, power is provided to at least part of the detector module heaters associated with the first group of detector modules, at a second maximum power, power is provided to at least part of the detector module heaters associated with the second group of detector modules, wherein the second maximum power is greater than the first maximum power, and at a third maximum power, power is provided to at least part of the detector module heaters associated with the third group of detector modules, wherein the third maximum power is greater than the second maximum power.

[0021] Preferably, the first maximum power is 50%-60% of the maximum or average rated power of at least part of the detector module heaters associated with the first group of detector modules, the second maximum power is 70%-80% of the maximum or average rated power of at least part of the detector module heaters associated with the second group of detector modules, and the third maximum power is 90%-100% of the maximum or average rated power of at least part of the detector module heaters associated with the third group of detector modules.

[0022] Preferably, all detector module heaters are identical, and providing power to at least part of the detector module heaters associated with the first group of detector modules at a first maximum power includes: applying power having a first maximum pulse width modulation duty cycle or a first maximum voltage to at least part of the detector module heaters associated with the first group of detector modules, providing power to at least part of the detector module heaters associated with the second group of detector modules at a second maximum power includes: applying power having a second maximum pulse width modulation duty cycle or a second maximum voltage to at least part of the detector module heaters associated with the second group of detector modules, and providing power to at least part of the detector module heaters associated with the third group of detector modules at a third maximum power includes: applying power having a third maximum pulse width modulation duty cycle or a third maximum voltage to at least part of the detector module heaters associated with the third group of detector modules.

[0023] According to a third aspect of the present invention, a thermal management method for a medical imaging system is provided, in which a detector assembly comprises a first group of detector modules, a second group of detector modules, and a third group of detector modules, wherein the first group of detector modules are located in a central area of ​​the detector assembly, the second group of detector modules are located in a peripheral area on at least one side of the central area of ​​the detector assembly, and the third group of detector modules are located in an outer edge area on at least one side of the detector assembly, and the thermal management method comprises: performing temperature control on the first group of detector modules at a first maximum power, wherein the first maximum power is 50%-60% of a maximum or average rated power of a detector module heater associated with the first group of detector modules; performing temperature control on the second group of detector modules at a second maximum power, wherein the second maximum power is 70%-80% of a maximum or average rated power of a detector module heater associated with the second group of detector modules, and the second maximum power is greater than the first maximum power; and performing temperature control on the third group of detector modules at a third maximum power, wherein the third maximum power is 90%-100% of a maximum or average rated power of a detector module heater associated with the third group of detector modules, and the third maximum power is greater than the second maximum power.

[0024] According to a fourth aspect of the present invention, a medical imaging system is provided, the system comprising: a detector assembly, the detector assembly comprising: a first group of detector modules located in a central area of ​​the detector assembly; a second group of detector modules located in a peripheral area on at least one side of the central area of ​​the detector assembly; a third group of detector modules located in an outer edge area on at least one side of the detector assembly, and a thermal controller configured to perform the thermal management method as described in the third aspect of the present invention.

[0025] The present disclosure provides a thermal management method that adopts different temperature control strategies for different areas of the detector assembly. By performing the same temperature control on all detector modules in the central area of ​​the detector assembly, image artifacts caused by the increase in temperature of some detector modules and the decrease in temperature of other detector modules during the temperature control process can be improved / eliminated. By performing separate temperature control on each detector module in the peripheral area of ​​the detector assembly, more accurate temperature control can be performed on each detector module in the peripheral area.

[0026] The present disclosure also provides a thermal management method for zoned power management of the detector module heater. The method provides bat-shaped maximum power management for the central area, the peripheral area and the edge area, which has many advantages, including at least: (1) improving energy efficiency, reducing the power requirements of the power supply system, and saving electricity; (2) providing lower power for the detector heater in the central area can help improve image quality; and (3) providing higher power for the detector module heater in the edge area can help compensate for more heat dissipation in the edge area. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present invention can be better understood by describing the exemplary embodiments of the present invention in conjunction with the accompanying drawings. It should be understood that these drawings only depict typical embodiments of the present invention and should not be considered as limiting the scope of protection claimed by the present invention. In the accompanying drawings,

[0028] Figure 1 is a perspective schematic diagram of an exemplary CT imaging system 100;

[0029] Figure 2 is similar to Figure 1 A block schematic diagram of an exemplary imaging system 200 of the illustrated CT imaging system 100;

[0030] Figure 3A is a block diagram for performing zoned temperature control on the detector assembly 108 according to an embodiment of the present invention;

[0031] Figure 3B2 is a block diagram of another embodiment of the present invention for performing zoned temperature control on the detector assembly 108 .

[0032] Figure 4 is a flow chart of a thermal management method 400 for performing the same temperature control on all detector modules in a central area according to an embodiment of the present invention;

[0033] Figure 5 is a flow chart of a thermal management method 500 for separately controlling the temperature of each detector module in a peripheral area according to an embodiment of the present invention;

[0034] Figure 6 is a flow chart of a thermal management method 600 for separately controlling the temperature of each detector module in an edge region according to an embodiment of the present invention;

[0035] Figure 7 4 is a schematic diagram of maximum power distribution for performing zoned power management on a detector module heater according to an embodiment of the present invention.

[0036] In the drawings, similar components and / or features may have the same numerical reference numeral. In addition, components of the same type may be distinguished by following the reference numeral with a letter that distinguishes between similar components and / or features. If only the first numerical reference numeral is used in the specification, the description applies to any similar component and / or feature having the same first numerical reference numeral, regardless of the subsequent letters.

[0037] In the accompanying drawings, some structural or method features may be shown in a particular arrangement and / or order. However, it should be understood that such a particular arrangement and / or order may not be required. Rather, in some embodiments, these features may be arranged in a manner and / or order different from that shown in the accompanying drawings of the specification. In addition, the inclusion of structural or method features in a particular figure does not imply that such features are required in all embodiments, and in some embodiments, these features may not be included or may be combined with other features. DETAILED DESCRIPTION

[0038] The specific embodiments of the present invention will be described below. It should be noted that in the specific description of these embodiments, in order to be concise and clear, this specification cannot provide a detailed description of all the features of the actual embodiments. It should be understood that in the actual implementation of any embodiment, just as in the process of any engineering project or design project, in order to achieve the specific goals of the developer and to meet system-related or business-related restrictions, various specific decisions are often made, and this will also change from one embodiment to another. In addition, it can also be understood that although the efforts made in this development process may be complex and lengthy, for ordinary technicians in the field related to the content disclosed by the present invention, some changes in design, manufacturing or production based on the technical content disclosed in this disclosure are just conventional technical means, and should not be understood as insufficient content of this disclosure.

[0039] References in the specification to "one embodiment", "an embodiment", "an example embodiment", etc. indicate that the described embodiment may include a particular feature, structure, or characteristic, but not every embodiment may include the particular feature, structure, or characteristic. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, it is considered that it is within the knowledge of those skilled in the art to affect such feature, structure, or characteristic in conjunction with other embodiments (whether or not explicitly described).

[0040] For purposes of this disclosure, the phrase "A and / or B" means (A), (B), or (A and B) and the phrase "A, B, and / or C" means (A), (B), (C), (A and B), (A and C), (B and C), or (A, B, and C).

[0041] Unless otherwise defined, the technical terms or scientific terms used in the claims and the specification shall have the usual meanings understood by persons with ordinary skills in the technical field to which the invention belongs. The words "first", "second" and similar words used in the patent application specification and the claims of the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "one" or "a" do not indicate a quantity limitation, but indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalent elements, and do not exclude other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, nor are they limited to direct or indirect connections. "Scanning objects" generally include but are not limited to patients, animals, inanimate objects, one or more manufactured parts, industrial parts and / or foreign objects (such as implants, stents and / or contrast agents present in the body), etc. The "same temperature control" used in the patent application specification and claims of the present invention refers to the unified control of the temperature of all components in a group of components so that the temperature rise and fall behaviors of all components remain consistent, and the "separate temperature control" refers to the independent control of the temperature of each component in a group of components.

[0042] The following will take the example of Figures 1 to 7 To describe the embodiments of the present disclosure.

[0043] I. Imaging System

[0044] Although the operating environment of the present invention is described for an x-ray computed tomography (CT) imaging system, it should be understood that the technology of the present invention is also applicable to medical imaging systems and / or medical imaging devices that utilize other imaging modalities to acquire images, such as x-ray imaging systems, magnetic resonance imaging (MRI) systems, positron emission tomography (PET) imaging systems, single photon emission computed tomography (SPECT) imaging systems, and combinations thereof (e.g., multi-modality imaging systems, such as PET / CT, PET / MR imaging systems). The description of the CT imaging system is provided only as an example of a suitable imaging system.

[0045] Figure 1is a perspective schematic diagram of an exemplary CT imaging system 100. Specifically, the CT imaging system 100 is configured to image a subject 112 (such as a patient, an inanimate object, one or more manufactured parts, industrial parts) and / or a foreign object (such as an implant, a stent, and / or a contrast agent present in the body). Throughout this disclosure, the terms "subject" and "scanned object" may be used interchangeably, and it should be understood that, at least in some embodiments, a patient is a type of subject that can be imaged by the CT imaging system 100, and the subject may include a patient. In some embodiments, the CT imaging system 100 includes a gantry 102, which in turn may also include at least one x-ray radiation source 104, which at least one x-ray radiation source 104 may be configured to project an x-ray beam (or x-rays) 106 (see Figure 2 ) for imaging the subject 112. Specifically, the x-ray radiation source 104 can be configured to project the x-ray beam 106 toward a detector array (or detector assembly) 108 positioned on an opposite side of the gantry 102. Figure 1 Only a single x-ray radiation source 104 is depicted, but in some embodiments, multiple x-ray radiation sources 104 may be employed to project multiple x-ray beams 106 toward multiple detectors to acquire projection data corresponding to the subject 112 at different energy levels.

[0046] In some embodiments, the x-ray radiation source 104 projects a fan-shaped or cone-shaped x-ray beam 106 that is collimated to lie in an XY plane (generally referred to as an "imaging plane" or "scanning plane") of a Cartesian coordinate system. The x-ray beam 106 passes through a subject 112. The x-ray beam 106 is incident on a detector array 108 after being attenuated by the subject 112. The intensity of the attenuated radiation beam received at the detector array 108 depends on the attenuation of the x-ray beam 106 by the subject 112. Each detector element in the detector array 108 generates a separate electrical signal that is a measure of the intensity of the x-ray beam at the corresponding detector element position. Intensity measurements from all detector elements are acquired separately to produce a transmission distribution.

[0047] In a third generation CT imaging system, a gantry 102 may include a rotatable annular frame 103, with at least one x-ray radiation source 104 and a detector array (or detector assembly) 108 arranged on opposite sides of the annular frame 103. The rotation of the frame 103 causes the x-ray radiation source 104 and the detector array 108 to rotate around the subject 112 in the imaging plane, causing the angle at which the x-ray beam 106 intersects the subject 112 to change continuously. A full gantry rotation occurs when the frame 103 completes a full 360 degree rotation. A set of x-ray attenuation measurements (e.g., projection data) from the detector array 108 at one frame angle is referred to as a "view". Thus, a view is each incremental position of the frame 103. A "scan" of the subject 112 includes a set of views made at different frame angles or viewing angles for one rotation cycle of the x-ray radiation source 104 and the detector array 108.

[0048] In an axial scan, the projection data is processed to construct an image corresponding to a two-dimensional slice taken through the subject 112. One method of reconstructing an image from a set of projection data is known in the art as a filtered back projection technique. This method converts attenuation measurements from the scan into integers known as "CT numbers" or "Houëts units" (HU).

[0049] In some embodiments, the CT imaging system 100 may include a depth camera 114 positioned on or outside the gantry 102. Figure 1As shown, the depth camera 114 is mounted on a ceiling 116 located above the subject 112 and is oriented to image the subject when the subject 112 is at least partially outside the rack 102. The depth camera 114 may include one or more light sensors, and the one or more light sensors may include one or more visible light sensors and / or one or more infrared (IR) light sensors. In some embodiments, the one or more IR sensors may include one or more sensors in both the near IR range and the far IR range to achieve thermal imaging. In some embodiments, the depth camera 114 may also include an IR light source. The light sensor may be any 3D depth sensor, such as a time of flight (ToF) sensor, a stereo sensor, or a structured light depth sensor, which is operable to generate a 3D depth image, while in other embodiments, the light sensor may be a two-dimensional (2D) sensor, which is operable to generate a 2D image. In some such embodiments, the 2D light sensor can be used to infer depth based on an understanding of light reflection phenomena to estimate the 3D depth. Regardless of whether the optical sensor is a 3D depth sensor or a 2D sensor, the depth camera 114 may be configured to output a signal encoding an image to a suitable interface, which may be configured to receive the signal encoding the image from the depth camera 114. In other embodiments, the depth camera 114 may also include other components, such as a microphone, to enable reception and analysis of directional and / or non-directional sounds from an observed subject and / or other sound sources.

[0050] In some embodiments, the CT imaging system 100 may further include an image processing unit 110 configured to reconstruct an image of a target volume of a subject using a suitable reconstruction method, such as an iterative image reconstruction method or an analytical image reconstruction method. For example, the image processing unit 110 may reconstruct an image of a target volume of a subject using an analytical image reconstruction method, such as filtered back projection (FBP). As another example, the image processing unit 110 may reconstruct an image of a target volume of a subject using an iterative image reconstruction method, such as adaptive statistical iterative reconstruction (ASIR), conjugate gradient (CG), maximum likelihood expectation maximization (MLEM), model-based iterative reconstruction (MBIR), etc.

[0051] As used herein, the phrase "reconstructing an image" is not intended to exclude embodiments in which data representing an image is generated rather than a visible image. Thus, as used herein, the term "image" broadly refers to both a visible image and data representing a visible image. However, many embodiments generate (or are configured to generate) at least one visible image.

[0052] The CT imaging system 100 further includes a table 115 on which the subject 112 is positioned for imaging. The table 115 may be motorized so as to be movable in the horizontal direction (XZ plane) and the vertical direction (Y). The horizontal direction includes the transverse direction (X direction of the medical imaging system) and the longitudinal direction (Z direction of the medical imaging system). During scanning imaging, the table 115 moves in the longitudinal direction. Therefore, as will be described below with respect to Figure 2 As described, the table 115 may include a motor and a motor controller. The table motor controller moves the table 115 by adjusting the motor so as to properly position the subject in the gantry 102 to acquire projection data corresponding to a target volume of the subject. The table motor controller may adjust the height of the table 115 (e.g., a vertical position relative to the ground on which the table is located) and the horizontal position of the table 115 (e.g., a horizontal position parallel to a transverse direction or a longitudinal direction).

[0053] Figure 2 is a block diagram showing a diagram similar to Figure 1 1. An exemplary imaging system 200 of the CT imaging system 100 is shown. In some embodiments, the imaging system 200 includes a detector array 108 (see Figure 1 ). The detector array 108 also includes a plurality of detector elements 202 that together collect the x-ray beam 106 that passes through the subject 112 (see Figure 1 ) to obtain corresponding projection data. Therefore, in some embodiments, the detector array 108 is manufactured in a multi-slice configuration including multiple rows of units or detector elements 202. In such a configuration, one or more additional rows of detector elements 202 are arranged in a parallel configuration for collecting projection data. In some examples, the individual detectors or detector elements 202 of the detector array 108 may include photon counting detectors that register the interaction of individual photons into one or more energy bins. It should be understood that the methods described herein may also be implemented using energy integrating detectors.

[0054] In some embodiments, the imaging system 200 is configured to traverse different angular positions around the subject 112 to obtain the desired projection measurement data. Therefore, the frame 103 and the components mounted thereon can be configured to rotate around the rotation periphery 206 to obtain, for example, projection measurement data at different energy levels. Alternatively, in embodiments where the projection angle relative to the subject 112 varies over time, the mounted components can be configured to move along a general arc rather than along a section of a circle.

[0055] In some embodiments, the imaging system 200 includes a control mechanism 208 to control the movement of components, such as the rotation of the frame 103 and the operation of the x-ray radiation source 104. In some embodiments, the control mechanism 208 also includes an x-ray controller 210, which is configured to provide power and timing signals to the x-ray radiation source 104. In addition, the control mechanism 208 includes a gantry motor controller 212, which is configured to control the rotation speed and / or position of the frame 103 based on imaging requirements.

[0056] In some embodiments, the control mechanism 208 also includes a data acquisition system (DAS) 214 that is configured to sample analog data received from the detector elements 202 and convert the analog data into digital signals for subsequent processing. The data sampled and digitized by the DAS 214 is transmitted to a computer or computing device 216. In one example, the computing device 216 stores the data in a mass storage device 218. For example, the storage device 218 may include a hard drive, a floppy disk drive, a compact disk-read / write (CD-R / W) drive, a digital versatile disk (DVD) drive, a flash drive, and / or a solid-state storage drive.

[0057] In addition, the computing device 216 provides commands and parameters to one or more of the DAS 214, the x-ray controller 210, and the gantry motor controller 212 to control system operations, such as data acquisition and / or processing. In some embodiments, the computing device 216 controls system operations based on operator input. The computing device 216 receives operator input, which includes, for example, commands and / or scan parameters, via an operator console 220 operatively coupled to the computing device 216. The operator console 220 may include a keyboard (not shown) or a touch screen to allow an operator to specify commands and / or scan parameters.

[0058] Although Figure 2 Only one operator console 220 is shown, but more than one operator console may be coupled to the imaging system 200 for use, for example, in inputting or outputting system parameters, requesting exams, and / or viewing images. Additionally, in some embodiments, the imaging system 200 may be coupled to multiple displays, printers, workstations, and / or the like located locally or remotely, for example, within an institution or hospital or at an entirely different location, via one or more configurable wired and / or wireless networks, such as the Internet and / or a virtual private network.

[0059] In some embodiments, for example, the imaging system 200 may include or be coupled to a picture archiving and communication system (PACS) 224. In an exemplary embodiment, the PACS 224 is further coupled to a remote system (such as a radiology department information system, a hospital information system) and / or to an internal or external network (not shown) to allow operators at different locations to provide commands and parameters and / or gain access to image data.

[0060] The computing device 216 may use operator-supplied and / or system-defined commands and parameters to operate the table motor controller 226, which in turn may control the table motor to adjust the Figure 1 102. Specifically, the table motor controller 226 moves the table 115 via the table motor so as to appropriately position the subject 112 in the gantry 102 to acquire projection data corresponding to a target volume of the subject 112. For example, the computing device 216 may send a command to the table motor controller 226, thereby instructing the table motor controller 226 to adjust the vertical position and / or horizontal position of the table 115 via the motor.

[0061] As described above, DAS 214 samples and digitizes the projection data collected by detector elements 202. Subsequently, image reconstructor 230 (similar to Figure 1 An image processor unit 110 is shown to perform high-speed reconstruction using the sampled and digitized x-ray data. Figure 2 The image reconstructor 230 is shown as a separate entity, but in some embodiments, the image reconstructor 230 may be formed as part of the computing device 216. Alternatively, the image reconstructor 230 may not be present in the imaging system 200, and instead the computing device 216 may perform one or more functions of the image reconstructor 230. In addition, the image reconstructor 230 may be located locally or remotely, and may be operably connected to the imaging system 200 using a wired or wireless network. In particular, one exemplary embodiment may use computing resources in a "cloud" network cluster for the image reconstructor 230.

[0062] In some embodiments, the image reconstructor 230 stores the reconstructed image in the mass storage device 218. Alternatively, the image reconstructor 230 transmits the reconstructed image to the computing device 216 to generate available subject information (also referred to as scan object information) for diagnosis and evaluation. In some embodiments, the computing device 216 transmits the reconstructed image and / or subject information to a display 232, which is communicatively coupled to the computing device 216 and / or the image reconstructor 230. In some embodiments, the display 232 allows an operator to evaluate the imaged anatomical structure. The display 232 can also allow the operator to select a volume of interest (VOI) and / or request subject information, for example, via a graphical user interface (GUI), for subsequent scanning or processing.

[0063] The computing device 216 may include computer-readable instructions executable to send commands and / or control parameters to one or more of the DAS 214, the x-ray controller 210, the gantry motor controller 212, and the table motor controller 226 according to an examination imaging plan. In addition, the computing device 216 may set and / or adjust various scan parameters (e.g., dose, gantry rotation angle, kV, mA, attenuation filter) according to the imaging plan. For example, the imaging plan may be selected by an operator from a plurality of imaging plans stored in a memory on the computing device 216 and / or a remote computing device, or the imaging plan may be automatically selected by the computing device 216 according to received subject information.

[0064] The depth camera 114 may be operably and / or communicatively coupled to the computing device 216 to provide image data to determine the structure of the subject, including posture and orientation. In addition, various methods and processes for determining the structure of the patient based on the image data generated by the depth camera 114 may be stored as executable instructions in the non-transitory memory of the computing device 216.

[0065] In some examples, computing device 216 may include a camera image data processor (not shown) that includes instructions for processing information received from depth camera 114. Information received from depth camera 114 (which may include depth information and / or visible light information) may be processed to determine various subject parameters, such as subject identity, subject build (e.g., height, weight, patient thickness), and current subject position relative to the table and depth camera 114. In some embodiments, information from depth camera 114 may be used by camera image data processor 215 to perform tracking of one or more subjects in the field of view of depth camera 114.

[0066] Figure 3Ais a block diagram of a method for performing zone temperature control on the detector assembly 108 according to an embodiment of the present invention. Figure 3A As shown, the medical imaging system 200 includes the detector assembly 108 and the temperature regulation assembly 350 .

[0067] The detector assembly 108 may include a first group of detector modules 310 and a second group of detector modules 320, each of which may include a plurality of detector elements 202. The first group of detector modules 310 may include a small number of detector modules located in a central region of the detector assembly 108. The second group of detector modules 320 may include a larger number of detector modules located in a peripheral region on at least one side of the central region. Figure 3A In the illustrated embodiment, the second group of detector modules 320 are located in the peripheral regions on both sides of the central region.

[0068] The temperature adjustment assembly 350 may include a first temperature adjustment device 312 and a second temperature adjustment device 322. The first temperature adjustment device 312 may include one or more central module temperature sensors 314, which may be located on the first group of detector modules 310, for sensing the temperature of the first group of detector modules in the central area. In some embodiments, the first temperature adjustment device 312 may be configured with a corresponding temperature sensor for each of the first group of detector modules 310, for sensing the temperature of each detector module. The first temperature adjustment device 312 may also include one or more central module heaters 316, which may be located at the bottom of the first group of detector modules, for heating the first group of detector modules. In some embodiments, the first temperature adjustment device 312 may be configured with a corresponding heater for each of the first group of detector modules 310, for heating each detector module. The first temperature regulating device 312 may also include a central module thermal controller 318, which is configured to control the central module heater 316 to heat the first group of detector modules 310 according to a first thermal control strategy based on the temperatures measured by each central module temperature sensor 314 (for example, based on the maximum value or average value of the measured temperatures), so as to perform the same temperature control on all detector modules of the first group of detector modules. In some embodiments, the first thermal control strategy for performing the same temperature control on all detector modules of the first group of detector modules is to increase or decrease the temperature of each detector module in the first group of detector modules. In other embodiments, the first thermal control strategy for performing the same temperature control on all detector modules of the first group of detector modules is to increase or decrease the temperature of each detector module in the first group of detector modules at the same time.

[0069] The second temperature adjustment device 322 may include a plurality of peripheral module temperature sensors 324, which may be located on the second group of detector modules 320, and are used to sense the temperature of the second group of detector modules 320 in the peripheral area. In some embodiments, the second temperature adjustment device 322 may configure a corresponding temperature sensor for each of the second group of detector modules 320, and is used to sense the temperature of each detector module. The second temperature adjustment device 322 may also include a plurality of peripheral module heaters 326, which may be located at the bottom of the second group of detector modules, and are used to heat the second group of detector modules. In some embodiments, the second temperature adjustment device 322 may configure a corresponding peripheral module heater 326 for each of the second group of detector modules 320, and is used to heat each detector module. The second temperature adjustment device 322 may also include a peripheral module thermal controller 328, which is configured to control the heating of the second group of detector modules 320 by the peripheral module heater 326 according to the second thermal control strategy based on the temperature measured by each peripheral module temperature sensor 324, so as to perform temperature control on each detector module of the second group of detector modules respectively.

[0070] Figure 3B FIG. 1 is a block diagram of another embodiment of the present invention for performing zone temperature control on the detector assembly 108. Figure 3A Similar to the embodiment, Figure 3B The embodiment of the detector assembly 108 also performs zoned temperature control for the central area and the peripheral area. The difference is that the detector assembly 108 may also include a third group of detector modules 330, and the third group of detector modules 330 may be located in the edge area of ​​at least one side of the detector assembly 108. Figure 3B In the illustrated embodiment, the third group of detector modules 330 are located at edge regions on both sides of the detector assembly 108 .

[0071] The temperature adjustment assembly 350 may further include a third temperature adjustment device 332. In some embodiments, the third temperature adjustment device 332 may have a function similar to that of the second temperature adjustment device 322, that is, it may be configured to control the edge module heater 336 to heat the third group of detector modules 330 based on the temperature measured by each edge module temperature sensor 334 according to a third thermal control strategy, so as to perform temperature control on each detector module in the third group of detector modules separately. In other embodiments, the third temperature adjustment device 332 may have a function similar to that of the first temperature adjustment device 312, that is, it may be configured to control the edge module heater 336 to heat the third group of detector modules based on the temperature measured by each edge module temperature sensor 334 (for example, based on the maximum value or average value of the measured temperature) according to a third thermal control strategy, so as to perform the same temperature control on all detector modules in the third group of detector modules.

[0072] In some embodiments, the first group of detector modules 310 may include 3-5 detector modules. In some embodiments, the second group of detector modules 320 may include all or part of all remaining detector modules in the detector assembly 108 except the first group of detector modules 310. In other embodiments, the second group of detector modules 320 may include all or part of all remaining detector modules in the detector assembly 108 except the first group of detector modules 310 and the third group of detector modules 330. In some embodiments, the third group of detector modules 330 may include 1-4 detector modules.

[0073] In some embodiments, the detector module temperature sensor and / or the detector module heater may not be present in the temperature adjustment assembly 350. In some embodiments, the computing device 216 may also include a thermal controller 215 (see Figure 2 ), the thermal controller 215 can be configured to perform the functions of the central module thermal controller 318, the peripheral module thermal controller 328 and / or the edge module thermal controller 338. In some embodiments, the rack 102 may also include at least one detector assembly fan for dissipating heat from the detector assembly. The thermal controller 215 may be configured to control the rotation speed of the detector assembly fan according to the thermal control requirements based on the temperature measured by each detector module temperature sensor to dissipate heat from the detector assembly.

[0074] In the process of analyzing the causes of image artifacts, the inventor of the present application unexpectedly discovered that, during the temperature control process, if the temperature of one or some of the detector modules located in the central area increases while the temperature of another or some other detector modules decreases, image artifacts are likely to occur. However, if all the detector modules of the first group of detector modules located in the central area are subjected to the same temperature control, so that the temperature of each detector module in the first group of detector modules increases or decreases at the same time, the image artifacts can be eliminated.

[0075] Further, in some embodiments, the first temperature adjustment device 312 may be configured to apply a first thermal control strategy of performing the same temperature control on all detector modules of the first group of detector modules in the central area at a first maximum power, the second temperature adjustment device 322 may be configured to apply a second thermal control strategy of performing separate temperature control on each detector module of the second group of detector modules in the peripheral area at a second maximum power, and the third temperature adjustment device 322 may be configured to apply a third thermal control strategy of performing separate temperature control on each detector module of the third group of detector modules in the edge area at a third maximum power or to apply a third thermal control strategy of performing the same temperature control on all detector modules of the third group of detector modules in the edge area at a third maximum power. In the partitioned power management scheme, the first maximum power is less than the second maximum power, and the second maximum power is less than the third maximum power. Figure 7 Maximum power distribution for partitioned power management is illustrated.

[0076] In some embodiments, the first maximum power may be 50%-60% (e.g., 55%) of the maximum or average rated power of the center module heater 316 in the first thermostat 312. The second maximum power may be 70%-80% (e.g., 75%) of the maximum or average rated power of the peripheral module heater 326 in the second thermostat 322. The third maximum power may be 90%-100% (e.g., 95%) of the maximum or average rated power of the edge module heater 336 in the third thermostat 332.

[0077] In some embodiments, the detector assembly 108 can be zoned for power management regardless of the thermal control strategy applied to the detector modules of each zone (for example, whether the thermal control strategy of applying the same temperature control, the thermal control strategy of applying the separate temperature control, or the thermal control strategy of applying other temperature control). For example, the first temperature regulating device 312 can be configured to apply a power supply having a first maximum pulse width modulation duty cycle or a first maximum voltage to the central module heater, so as to implement the thermal control strategy of the same or separate temperature control to the first group of detector modules in the central area at the first maximum power, the second temperature regulating device 322 can be configured to apply a power supply having a second maximum pulse width modulation duty cycle or a second maximum voltage to the peripheral module heater, so as to implement the thermal control strategy of the same or separate temperature control to the second group of detector modules in the peripheral area at the second maximum power, and the third temperature regulating device is configured to apply a power supply having a third maximum pulse width modulation duty cycle or a third maximum voltage to the edge module heater, so as to implement the thermal control strategy of the same or separate temperature control to the third group of detector modules in the edge area at the third maximum power, wherein the first maximum power is less than the second maximum power, and the second maximum power is less than the third maximum power. In some embodiments, the first temperature adjustment device 312, the second temperature adjustment device 322, and the third temperature adjustment device 332 may include the same detector module heater. In these embodiments, the first maximum power, the second maximum power, and the third maximum power may be 50%-60%, 70%-80%, and 90%-100% of the rated power of the detector module heater, respectively. Preferably, the first maximum power, the second maximum power, and the third maximum power may be 55%, 75%, and 95% of the rated power of the detector module heater, respectively.

[0078] In some embodiments, the zone division for temperature control may be the same as the zone division for power management. In other embodiments, the zone division for temperature control may be different from the zone division for power management.

[0079] The following will be combined Figure 4 - Figure 7 A method for eliminating image artifacts according to an embodiment of the present invention, a method for optimizing power management according to an embodiment of the present invention, and a combination of the two are described.

[0080] II. Thermal Management Methods

[0081] Figure 44 is a flow chart of a thermal management method 400 for performing the same temperature control on the detector modules in the central area according to an embodiment of the present invention. The thermal management method 400 may be a first thermal control strategy for performing the same temperature control on all the detector modules of the first group of detector modules in the central area 310. In some embodiments, Figure 4 As shown, in step 402, the central module temperature sensor 314 senses the temperature of each detector module in the first group of detector modules 310. In step 404, the central module thermal controller 318 compares the average temperature of the first group of detector modules 310 with a predetermined threshold value (e.g., 42°C). In step 406, if the average temperature of the first group of detector modules 310 is greater than the predetermined threshold value, the central module thermal controller 318 controls the heating amount of the central module heater 316 to the first group of detector modules 310, so that the temperature of each detector module in the first group of detector modules 310 is reduced compared to the temperature before control. For example, the central module thermal controller 318 can reduce the temperature of the detector modules by reducing the power provided to the central module heater 316. In step 408, if the average temperature of the first group of detector modules 310 is less than the predetermined threshold value, the central module thermal controller 318 controls the heating amount of the central module heater 316 to the first group of detector modules, so that the temperature of each detector module in the first group of detector modules 310 is increased compared to the temperature before control. For example, the central module thermal controller 318 may increase the temperature of the detector modules by increasing the power provided to the central module heater 316. In step 410, if the average temperature of the first group of detector modules 310 is equal to the predetermined threshold, the central module thermal controller 318 controls the amount of heating of the first group of detector modules by the central module heater 316 so that each detector module in the first group of detector modules 310 maintains the current temperature.

[0082] Alternatively, in some embodiments, the central module thermal controller 318 compares the maximum temperature of the first group of detector modules with a predetermined threshold value (e.g., 43° C.). If the maximum temperature of the first group of detector modules 310 is greater than the predetermined threshold value, the central module thermal controller 318 controls the heating amount of the central module heater 316 to the first group of detector modules so that the temperature of each detector module in the first group of detector modules is reduced compared to the temperature before the control. If the maximum temperature of the first group of detector modules 310 is less than the predetermined threshold value, the central module thermal controller 318 controls the heating amount of the central module heater 316 to the first group of detector modules so that the temperature of each detector module in the first group of detector modules is increased compared to the temperature before the control. If the maximum temperature of the first group of detector modules 310 is equal to the predetermined threshold value, the central module thermal controller 318 controls the heating amount of the central module heater 316 to the first group of detector modules so that each detector module in the first group of detector modules maintains the current temperature.

[0083] In some embodiments, the thermal management method 400 may control the central module heater 316 to heat the first group of detector modules based on a comparison of the average temperature or the maximum temperature of the first group of detector modules 310 with a predetermined threshold, so that the temperature of each detector module in the first group of detector modules 310 increases or decreases simultaneously.

[0084] The thermal management method for performing the same temperature control on the detector modules in the central area according to an embodiment of the present invention can be used to improve / eliminate image artifacts caused by the increase in temperature of some detector modules in the first group of detector modules and the decrease in temperature of other detector modules during the temperature control process. In some embodiments, the first group of detector modules includes 3-5 detector modules. In some embodiments, the central module heater includes a plurality of detector module heaters, each of which is used to heat a corresponding detector module in the first group of detector modules. In some embodiments, the number of central module heaters is less than the number of detector modules in the first group of detector modules, for example, the number of central module heaters can be one. In some embodiments, each detector module heater in the central module heater is the same.

[0085] In some embodiments, the thermal management method 400 performs the above-mentioned first thermal control strategy of performing the same temperature control on all detector modules of the first group of detector modules 310 in the central area at a first maximum power. The first maximum power can be 50%-60% (e.g., 55%) of the maximum or average rated power of the central module heater associated with the first group of detector modules 310. In some embodiments, a power supply having a first maximum pulse width modulation duty cycle or a first maximum voltage is applied to the central module heater 316 associated with the first group of detector modules 310 to implement the first thermal control strategy at the first maximum power. In some embodiments, the power provided to the central module heater 316 is changed by adjusting the duty cycle or the power supply voltage of the power supply control signal (e.g., pulse width modulation, PWM) applied to the central module heater 316. In some embodiments, the power provided to the central module heater 316 has a minimum adjustment amount associated with the first maximum power, for example, the minimum adjustment amount can be 1 / 50, 1 / 100, etc. of the first maximum power.

[0086] Figure 5 is a flow chart of a thermal management method 500 for separately controlling the temperature of each detector module in the peripheral area according to an embodiment of the present invention. The thermal management method 500 may be a second thermal control strategy for separately controlling the temperature of each detector module in the second group of detector modules 320 in the peripheral area. In some embodiments, Figure 5As shown, in step 502, the peripheral module temperature sensor 324 senses the temperature of each detector module in the second group of detector modules 320. In step 504, the peripheral module thermal controller 328 compares the temperature of each detector module in the second group of detector modules 320 with a predetermined threshold value (e.g., 42°C). In step 506, if the temperature of a detector module in the second group of detector modules 320 is greater than the predetermined threshold value, the peripheral module thermal controller 328 controls the heating amount of the corresponding peripheral module heater 326 to the detector module so that the temperature of the detector module is lowered compared to the temperature before the control. For example, the peripheral module thermal controller 328 reduces the temperature of the detector module by reducing the power provided to the corresponding peripheral module heater 316. In step 508, if the temperature of a detector module in the second group of detector modules is less than the predetermined threshold value, the peripheral module thermal controller 328 controls the heating amount of the corresponding peripheral module heater 326 to the detector module so that the temperature of the detector module is increased compared to the temperature before the control. For example, the peripheral module thermal controller 328 can increase the power provided to the corresponding peripheral module heater 316 so that the temperature of the detector module is increased. In step 510 , if the temperature of a detector module in the second group of detector modules 310 is equal to the predetermined threshold, the peripheral module thermal controller 328 controls the heating amount of the corresponding peripheral module heater 326 for the detector module so that the detector module maintains the current temperature.

[0087] The thermal management method 500 may be used to more accurately control the temperature of each detector module in the second group of detector modules 320 .

[0088] In some embodiments, the second group of detector modules 320 may include all or part of all remaining detector modules in the detector assembly 108 except the first group of detector modules 310. In other embodiments, the second group of detector modules 320 may include all or part of all remaining detector modules in the detector assembly 108 except the first group of detector modules 310 and the third group of detector modules 330. In some embodiments, the peripheral module heater 326 may include a plurality of detector module heaters, each of which is used to heat a corresponding detector module in the second group of detector modules 320. In some embodiments, each detector module heater in the peripheral module heater 326 is identical.

[0089] In some embodiments, the thermal management method 500 implements the second thermal control strategy for separately controlling the temperature of each detector module of the second group of detector modules 320 in the peripheral area at the second maximum power. The second maximum power may be 70%-80% (e.g., 75%) of the maximum or average rated power of the peripheral module heater associated with the second group of detector modules 320. In some embodiments, a power supply having a second maximum pulse width modulation duty cycle or a second maximum voltage is applied to the peripheral module heater 326 associated with the second group of detector modules 320 to implement the second thermal control strategy at the second maximum power. In some embodiments, the power provided to the peripheral module heater 326 is changed by adjusting the duty cycle or the power supply voltage of the power supply control signal (e.g., pulse width modulation, PWM) applied to the peripheral module heater 326. In some embodiments, the power provided to the peripheral module heater 326 may have a minimum adjustment amount associated with the second maximum power, for example, the minimum adjustment amount may be 1 / 50, 1 / 100, etc. of the second maximum power.

[0090] Figure 6 6 is a flow chart of a thermal management method 600 for separately controlling the temperature of each detector module in the edge region according to an embodiment of the present invention. The thermal management method 600 may be a third thermal control strategy for separately controlling the temperature of each detector module of the third group of detector modules 330 in the edge region. In some embodiments, Figure 6As shown, in step 602, the edge module temperature sensor 334 senses the temperature of each detector module in the third group of detector modules 330. In step 604, the edge module thermal controller 338 compares the temperature of each detector module in the third group of detector modules 330 with a predetermined threshold (e.g., 42°C). In step 606, if the temperature of a detector module in the third group of detector modules 330 is greater than the predetermined threshold, the edge module thermal controller 338 controls the heating amount of the corresponding edge module heater 336 to the detector module so that the temperature of the detector module is lowered compared to the temperature before control. For example, the edge module thermal controller 338 reduces the temperature of the detector module by reducing the power provided to the corresponding edge module heater 336. In step 608, if the temperature of a detector module in the third group of detector modules 330 is less than the predetermined threshold, the edge module thermal controller 338 controls the heating amount of the corresponding edge module heater 336 to the detector module so that the temperature of the detector module is increased compared to the temperature before control. For example, the edge module thermal controller 338 can increase the power provided to the corresponding edge module heater 336 to increase the temperature of the detector module. In step 610 , if the temperature of a detector module of the third group of detector modules 330 is equal to the predetermined threshold, the edge module thermal controller 338 controls the heating amount of the corresponding edge module heater 336 on the detector module so that the detector module maintains the current temperature.

[0091] In some embodiments, the third group of detector modules 330 may include 1-4 detector modules. These detector modules may be located at the edge area of ​​one side of the detector assembly 108, or may be distributed at the edge areas of both sides of the detector assembly 108. In some embodiments, the edge module heater 336 includes a plurality of detector module heaters, each of which is used to heat a corresponding detector module in the third group of detector modules 330. In some embodiments, each detector module heater in the edge module heater 336 is the same.

[0092] Alternatively, in some embodiments, a thermal control strategy similar to the first thermal control strategy may be adopted for temperature control of the third group of detector modules in the edge region, that is, the same temperature control is performed on all detector modules in the third group of detector modules in the edge region.

[0093] In some embodiments, the thermal management method 600 implements the third thermal control strategy of performing the same temperature control or separate temperature control on the third group of detector modules 330 in the edge region at the third maximum power. The third maximum power may be 90%-100% (e.g., 95%) of the maximum or average rated power of the edge module heater associated with the third group of detector modules 330. In some embodiments, a power supply having a third maximum pulse width modulation duty cycle or a third maximum voltage is applied to the edge module heater 336 associated with the third group of detector modules 330 to implement the third thermal control strategy at the third maximum power. In some embodiments, the power provided to the edge module heater 326 is changed by adjusting the duty cycle or the power supply voltage of the power supply control signal (e.g., pulse width modulation, PWM) applied to the edge module heater 336. In some embodiments, the power provided to the edge module heater 336 may have a minimum adjustment amount associated with the third maximum power, for example, the minimum adjustment amount may be 1 / 50, 1 / 100, etc. of the third maximum power.

[0094] In the above combination Figure 4 In the embodiment described in -6, the area division for temperature control is the same as the area division for power management. Alternatively, in some embodiments, the area division for temperature control may be different from the area division for power management.

[0095] Figure 7 1 is a schematic diagram of maximum power distribution for zoned power management of detector module heaters according to an embodiment of the present invention. In some embodiments, all detector module heaters of the detector assembly 108 may be the same. Figure 7 As shown, the first temperature adjustment device 312 is at the first maximum power ( Figure 7 The second temperature regulating device 322 controls the temperature of modules 5 to 9 in the central area at the second maximum power (55% of the rated power of the detector module heater). Figure 7 The temperature of the modules 2-4 and the modules 10-12 in the peripheral area is controlled at the third maximum power ( 75% of the rated power of the detector module heater) and the third temperature adjustment device 332 is controlled at the third maximum power ( Figure 7 The example shows that the temperature of modules 1 and 13 in the edge region is controlled at 95% of the rated power of the detector module heater.

[0096] The above thermal management method for zoned power management of the detector module heater can improve energy efficiency, reduce the power requirements of the power supply system, and save electricity. In addition, providing lower power to the detector module heater in the center area can help provide higher image quality, and providing higher power to the detector module heater in the edge area can help compensate for more heat dissipation in the edge area.

[0097] In some embodiments, the number of detector modules in the central region may be 3-5, and the number of detector modules in each side edge region may be 1-2.

[0098] In some embodiments, the power provided to the detector module heater can be changed by adjusting the duty cycle or supply voltage of the power supply control signal (such as pulse width modulation, PWM) applied to the detector module heater. In some embodiments, the temperature control of the detector module heater for each partition has a corresponding minimum power adjustment amount, which is associated with the maximum power of the partition. In some embodiments, each partition may apply the same equal division value (for example, 100 equal divisions) to its maximum power. Specifically, the temperature control of the detector module heater for the central area may have a first minimum power adjustment amount, which may be 1 / 100 of the first maximum power. The temperature control of the detector module heater for the peripheral area may have a second minimum power adjustment amount, which may be 1 / 100 of the second maximum power. The temperature control of the detector module heater for the edge area may have a third minimum power adjustment amount, which may be 1 / 100 of the third maximum power. Since the first maximum power is less than the second maximum power, and the second maximum power is less than the third maximum power, when the same equal division value is applied to each partition to obtain the minimum power adjustment amount, the first minimum power adjustment amount is less than the second minimum power adjustment amount, and the second minimum power adjustment amount is less than the third minimum power adjustment amount. This means that the temperature control of the detector module in the central area can have a higher control accuracy.

[0099] The technology described herein can be implemented in hardware, software, firmware, or any combination thereof, unless specifically described as being implemented in a particular manner. Any features described as modules or components can also be implemented together in an integrated logic device, or separately implemented as discrete but interoperable logic devices. If implemented in software, the technology can be implemented at least in part by a non-transient processor-readable storage medium including instructions, and when the instructions are executed, one or more of the above methods are executed. The non-transient processor-readable data storage medium can form a part of a computer program product that may include packaging materials. The program code can be implemented in a high-level procedural programming language or an object-oriented programming language to communicate with a processing system. If necessary, the program code can also be implemented in assembly language or machine language. In fact, the mechanism described herein is not limited to the scope of any particular programming language. In any case, the language can be a compiled language or an interpreted language.

[0100] One or more aspects of at least some embodiments may be implemented by representative instructions stored on a machine-readable medium that represent various logic within a processor, which when read by a machine causes the machine to fabricate logic for performing the techniques described herein.

[0101] Such machine-readable storage media may include, but are not limited to, a non-transitory tangible arrangement of articles manufactured or formed by a machine or apparatus, including storage media such as: a hard disk; any other type of disk, including floppy disks, optical disks, compact disk-read only memory (CD-ROM), compact disk-rewritable (CD-RW), and magneto-optical disks; semiconductor devices, such as read-only memory (ROM), random access memory (RAM) such as dynamic random access memory (DRAM) and static random access memory (SRAM), erasable programmable read-only memory (EPROM), flash memory, electrically erasable programmable read-only memory (EEPROM); phase change memory (PCM); magnetic or optical cards; or any other type of medium suitable for storing electronic instructions.

[0102] So far, the medical imaging system according to the present invention has been described, and the thermal control method for preventing overheating of the detector in the medical imaging system according to the present invention has also been described.

[0103] Some exemplary embodiments have been described above. However, it should be understood that various modifications may be made to the exemplary embodiments described above without departing from the spirit and scope of the present invention. For example, if the described techniques are performed in a different order and / or if the components in the described systems, architectures, devices, or circuits are combined in different ways and / or replaced or supplemented by other components or their equivalents, suitable results may be achieved, and accordingly, these modified other implementations also fall within the scope of protection of the claims.

Claims

1. A medical imaging system, comprising: A detector assembly, the detector assembly comprising: A first group of detector modules located in a central region of the detector assembly; and a second group of detector modules located in a peripheral area on at least one side of a central area of ​​the detector assembly; A temperature regulating component, the temperature regulating component comprising: a first temperature regulating device that applies a first thermal control strategy for identically controlling the temperature of all detector modules of the first group of detector modules; and A second temperature adjustment device applies a second thermal control strategy for individually controlling the temperature of each detector module of the second group of detector modules.

2. The medical imaging system of claim 1, wherein: The first group of detector modules includes 3-5 detector modules.

3. The medical imaging system of claim 1, wherein: The first temperature adjustment device includes at least one detector module heater, and The first temperature adjustment device is configured to control the at least one detector module heater so that the temperature of each detector module in the first group of detector modules is increased or decreased based on an average value of temperatures measured for all detector modules in the first group of detector modules.

4. The medical imaging system of claim 3, wherein: The first temperature adjustment device is configured to control the at least one detector module heater based on an average value of temperatures measured for all detector modules in the first group of detector modules so that the temperature of each detector module in the first group of detector modules increases or decreases simultaneously.

5. The medical imaging system of claim 3, wherein: The at least one detector module heater comprises a plurality of detector module heaters, each of the plurality of detector module heaters being configured to heat a corresponding detector module in the first group of detector modules.

6. The medical imaging system of claim 1, wherein: The second temperature adjustment device includes a plurality of detector module heaters, each of the plurality of detector module heaters is used to heat a corresponding detector module in the second group of detector modules, and The second temperature adjustment device is configured to control a corresponding detector module heater in the second temperature adjustment device for each detector module in the second group of detector modules based on a temperature measured for the detector module so as to increase or decrease a temperature of the detector module.

7. The medical imaging system according to any one of claims 1 to 6, wherein: The detector assembly further includes a third group of detector modules located at an outer edge region of at least one side of the detector assembly. The temperature adjustment assembly further includes a third temperature adjustment device, which applies a third thermal control strategy for separately controlling the temperature of each detector module of the third group of detector modules. The third temperature adjustment device includes a plurality of detector module heaters, each of the plurality of detector module heaters is used to heat a corresponding detector module in the third group of detector modules, and The third temperature adjustment device is configured to control a corresponding detector module heater in the third temperature adjustment device for each detector module in the third group of detector modules based on a temperature measured for the detector module so as to increase or decrease a temperature of the detector module.

8. The medical imaging system of claim 7, wherein: The first temperature regulating device is configured to provide power to at least a portion of the detector module heater included therein at a first maximum power, The second temperature regulating device is configured to provide power to at least a portion of the detector module heater included therein at a second maximum power, wherein the second maximum power is greater than the first maximum power, and The third temperature regulating device is configured to provide power to at least a portion of the detector module heater included therein at a third maximum power, wherein the third maximum power is greater than the second maximum power.

9. The medical imaging system of claim 8, wherein: The first maximum power is 50%-60% of the maximum or average rated power of the at least part of the detector module heater in the first temperature adjustment device, The second maximum power is 70% to 80% of the maximum or average rated power of the at least part of the detector module heater in the second temperature adjustment device, and The third maximum power is 90%-100% of the maximum or average rated power of the at least part of the detector module heaters in the third temperature adjustment device.

10. The medical imaging system of claim 9, wherein: The first temperature regulating device, the second temperature regulating device and the third temperature regulating device include the same detector module heater, The first temperature regulating device is configured to apply a power supply having a first maximum pulse width modulation duty cycle or a first maximum voltage to the at least part of the detector module heater included therein, so as to provide power to the at least part of the detector module heater included therein at the first maximum power. The second temperature regulating device is configured to apply a power supply having a second maximum pulse width modulation duty cycle or a second maximum voltage to the at least part of the detector module heater included therein, so as to provide power to the at least part of the detector module heater included therein at the second maximum power, and The third temperature adjustment device is configured to apply power having a third maximum pulse width modulation duty cycle or a third maximum voltage to at least part of the detector module heater included therein, so as to provide power to at least part of the detector module heater included therein at the third maximum power.

11. A thermal management method for a medical imaging system, wherein a detector assembly comprises a first group of detector modules and a second group of detector modules, wherein the first group of detector modules are located in a central region of the detector assembly, and the second group of detector modules are located in a peripheral region on at least one side of the central region of the detector assembly, The thermal management method comprises: executing a first thermal control strategy for performing the same temperature control on all detector modules of the first group of detector modules; as well as A second thermal control strategy is executed to individually temperature control each detector module of the second group of detector modules.

12. The thermal management method according to claim 11, wherein: The first group of detector modules includes 3-5 detector modules, and A first thermal control strategy for performing the same temperature control on all detector modules in the first group of detector modules includes: based on an average value of the temperatures measured for all detector modules in the first group of detector modules, controlling the detector module heater associated with the first group of detector modules so that the temperature of each detector module in the first group of detector modules is increased or decreased.

13. The thermal management method of claim 12, wherein: A first thermal control strategy for performing the same temperature control on all detector modules in the first group of detector modules includes: based on an average value of the temperatures measured for all detector modules in the first group of detector modules, controlling the detector module heater associated with the first group of detector modules so that the temperature of each detector module in the first group of detector modules increases or decreases simultaneously.

14. The thermal management method according to claim 11, wherein: A second thermal control strategy for performing separate temperature control on each detector module of the second group of detector modules includes: for each detector module in the second group of detector modules, based on the temperature measured for the detector module, controlling a corresponding detector module heater among a plurality of detector module heaters associated with the second group of detector modules to increase or decrease the temperature of the detector module.

15. The thermal management method according to any one of claims 11 to 14, wherein: The detector assembly further includes a third group of detector modules located in an outer edge region of at least one side of the detector assembly, and The thermal management method also includes: executing a third thermal control strategy for separately controlling the temperature of each detector module of the third group of detector modules, wherein executing the third thermal control strategy for separately controlling the temperature of each detector module of the third group of detector modules includes: for each detector module in the third group of detector modules, based on the temperature measured for the detector module, controlling a corresponding detector module heater among a plurality of detector module heaters associated with the third group of detector modules to increase or decrease the temperature of the detector module.

16. The thermal management method of claim 15, wherein: Also includes: providing power to at least a portion of the detector module heaters associated with the first group of detector modules at a first maximum power, providing power to at least a portion of the detector module heaters associated with the second group of detector modules at a second maximum power, wherein the second maximum power is greater than the first maximum power, and At least a portion of the detector module heaters associated with the third group of detector modules are powered at a third maximum power, wherein the third maximum power is greater than the second maximum power.

17. The thermal management method of claim 16, wherein: The first maximum power is 50%-60% of the maximum or average rated power of the at least part of the detector module heaters associated with the first group of detector modules, The second maximum power is 70% to 80% of the maximum or average rated power of the at least some of the detector module heaters associated with the second group of detector modules, and The third maximum power is 90%-100% of the maximum or average rated power of the at least some of the detector module heaters associated with the third group of detector modules.

18. The thermal management method of claim 17, wherein: All detector module heaters are identical, Providing power to at least some of the detector module heaters associated with the first group of detector modules at a first maximum power includes: applying power having a first maximum pulse width modulation duty cycle or a first maximum voltage to at least some of the detector module heaters associated with the first group of detector modules, Providing power to at least some of the detector module heaters associated with the second group of detector modules at a second maximum power includes: applying power having a second maximum pulse width modulation duty cycle or a second maximum voltage to the at least some of the detector module heaters associated with the second group of detector modules, and Providing power to at least some of the detector module heaters associated with the third group of detector modules at a third maximum power includes applying power having a third maximum pulse width modulation duty cycle or a third maximum voltage to at least some of the detector module heaters associated with the third group of detector modules.

19. A thermal management method for a medical imaging system, wherein the detector assembly comprises a first group of detector modules, a second group of detector modules, and a third group of detector modules, wherein the first group of detector modules are located in a central area of ​​the detector assembly, the second group of detector modules are located in a peripheral area on at least one side of the central area of ​​the detector assembly, and the third group of detector modules are located in an outer edge area on at least one side of the detector assembly, wherein the thermal management method comprises: Temperature controlling the first group of detector modules at a first maximum power, wherein the first maximum power is 50% to 60% of a maximum or average rated power of a detector module heater associated with the first group of detector modules; temperature controlling the second group of detector modules at a second maximum power, the second maximum power being 70% to 80% of a maximum or average rated power of a detector module heater associated with the second group of detector modules, the second maximum power being greater than the first maximum power; and The third group of detector modules is temperature controlled at a third maximum power, which is 90%-100% of the maximum or average rated power of the detector module heaters associated with the third group of detector modules, and the third maximum power is greater than the second maximum power.

20. A medical imaging system comprising: A detector assembly, the detector assembly comprising: A first group of detector modules located in a central region of the detector assembly; and a second group of detector modules located in a peripheral area on at least one side of a central area of ​​the detector assembly; A third group of detector modules is located in an outer edge area of ​​at least one side of the detector assembly, and a thermal controller is configured to perform the thermal management method as claimed in independent claim 19.

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