Novel probe high-temperature glue curing tool

Abstract

The invention relates to a novel probe high-temperature glue curing tool, which is designed based on the high-temperature curing process requirement between a probe shell and a probe wafer in a sensor, and comprises a bottom plate, one end of the bottom plate is provided with a fixing foot, and the bottom plate is assembled and connected with the fixing foot through a fixing bolt; meanwhile, a plurality of probe working positions, a locking unit and a pressing plate are arranged on the working tabletop at the other end of the bottom plate; wherein one probe working position comprises a rotating seat, a threaded hole is formed in one end of the rotating seat, and the bottom plate is assembled and connected with the rotating seat through a hexagon socket screw; meanwhile, a turncap is arranged at the other end of the rotary seat and is assembled and connected with the rotary seat through an external thread, and a spring is further arranged at the hollow axis of the turncap; the rotating seat is used for forming a telescopic piece with the spring and the rotating cap and supporting the pressing force transmitted from the bottom of the shell. According to the high-temperature glue curing tool, the high-temperature curing requirement that after 60 probes are bonded through high-temperature glue at a time, fixing and pressing are conducted is met, and the labor efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of processing equipment in integrated circuits, in particular to a novel high-temperature glue curing tool for a probe. Background Art

[0002] In the existing sensor manufacturing process, after providing high-temperature glue bonding, it is required to press the probe chip so that it is located at the center position inside the probe housing without shifting after high-temperature curing. Therefore, there is an urgent need for a solution that can improve the operator's labor efficiency and ensure product quality, so that the position of the high-temperature cured chip does not shift and affect the probe. Summary of the invention

[0003] In order to solve the above technical problems, the present invention provides a novel probe high temperature glue curing tooling, which is designed based on the high temperature curing process requirements between the probe housing and the probe wafer in the sensor, and comprises: a bottom plate, one end of which is provided with a fixed foot, and is connected to the fixed foot by a fixing bolt, wherein the fixed foot is used to support the glue curing tooling bottom plate; at the same time, a plurality of probe working positions, a locking unit, and a pressing plate are provided on the working table at the other end of the bottom plate;

[0004] One of the probe working positions includes a rotary seat, a threaded hole is provided at one end of the rotary seat, and the base plate is connected to the rotary seat through a hexagon socket bolt; at the same time, a rotary cap is provided at the other end of the rotary seat, which is connected to the rotary cap through an external thread, and a spring is also provided at the hollow axis of the rotary cap; the rotary seat is used to form a telescopic part with the spring and the rotary cap and support the clamping force transmitted from the bottom of the shell.

[0005] The probe housing is provided at one hollow end of the screw cap, wherein the screw cap and the probe housing are coaxially assembled and have the freedom to move up and down in the z-axis; at the same time, a plug is provided in the concave area at the other end of the probe housing, and a probe wafer is provided at the working contact surface end between the plug and the probe housing. The probe wafer is used to be installed into the probe housing for bonding after the plug fixing foot is fixed in position and high temperature glue is applied; the probe housing is used to be supported by the main body which is tightly bonded by applying high temperature glue at the bottom of the probe wafer.

[0006] In one embodiment of the present invention, a plurality of locking units are arranged outside the area of ​​the probe working positions at both ends along the vertical center axis and the horizontal center axis of the base plate, and one of the locking units includes a fastener base, which is arranged on the base plate, and a fastener connector is provided at the other end of the fastener base, and the other end of the fastener connector is connected to a fastener adjustment rod and a clamping wrench in sequence through a locking nut, and then the clamping wrench is adjusted to fold the clamping plate, and the pressure is transmitted to the plug so that the probe housing and the probe wafer are combined according to the process size, and then the subsequent curing manufacturing process is run.

[0007] In one embodiment of the present invention, the base plate is connected to the fixed foot, the rotating seat and the fastener base by bolt parts, and the base plate is also used to support the clamping force transmitted to the clamping wrench.

[0008] In one embodiment of the present invention, the rotary seat, the spring and the rotary cap form an adjustable telescopic member assembly acted upon by the spring force.

[0009] In one embodiment of the present invention, the spring is used to buffer the force transmitted by the clamping wrench to compress the solidified probe wafer, thereby protecting and avoiding damage to the probe wafer due to excessive force transmitted when the probe wafer is compressed.

[0010] In one embodiment of the present invention, the plug is used to fix the probe wafer and ensure that it is pressed and cured at a central position at the bottom of the probe housing.

[0011] In one embodiment of the present invention, the fastener base is assembled with the fastener connector via pins, and a hinge structure is formed between the fastener base and the fastener connector, and the fastener base and the fastener connector have the freedom to be laid flat or erected.

[0012] The above technical scheme of the present invention has the following advantages over the prior art: the high-temperature glue curing tooling of the present invention supports the requirement of high-temperature curing after fixing and pressing 60 probes after high-temperature glue bonding at one time, while improving the labor efficiency of the operator, with a simple structure, reliable high-temperature curing quality and good safety performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings.

[0014] Figure 1 It is a three-dimensional structural schematic diagram of the probe high-temperature glue curing tooling of the utility model;

[0015] Figure 2 It is a side view of the high temperature adhesive curing tooling of the utility model;

[0016] Figure 3 It is a cross-sectional view of the high-temperature adhesive curing tooling described in the utility model.

[0017] As shown in the figure, 1. fixing foot, 2. fixing bolt, 3. base plate, 4. swivel seat, 5. spring, 6. screw cap, 7. probe housing, 8. probe wafer, 9. plug, 10. fastener base, 11. rivet, 12. fastener connector, 13. locking nut, 14. fastener adjusting rod, 15. tightening wrench, 16. pressure plate. DETAILED DESCRIPTION

[0018] like Figure 1 and Figure 2As shown, this embodiment provides a new type of probe high-temperature glue curing tooling, which is designed based on the high-temperature curing process requirements between the probe housing 7 and the probe wafer 8 in the sensor, and includes: a bottom plate 3, one end of the bottom plate 3 is provided with a fixed foot 1, and is assembled and connected to the fixed foot 1 through a fixing bolt 2, wherein the fixed foot 1 is used to support the glue curing tooling bottom plate; at the same time, a plurality of probe working positions, a locking unit, and a pressing plate 16 are provided on the working table at the other end of the bottom plate 3;

[0019] like Figure 3 As shown, one of the probe working positions includes a rotary seat 4, a threaded hole is provided at one end of the rotary seat 4, and the base plate 3 is assembled and connected to the rotary seat 4 through a hexagon socket bolt; at the same time, a screw cap 6 is provided at the other end of the rotary seat 4, which is assembled and connected to the screw cap 6 through an external thread, and a spring 5 is also provided at the hollow axis of the screw cap 6; the rotary seat 4 is used to form a telescopic part with the spring 5 and the screw cap 6 and support the clamping force transmitted from the bottom of the shell.

[0020] A probe housing 7 is provided at one hollow end of the screw cap 6, wherein the screw cap 6 and the probe housing 7 are coaxially assembled and have the freedom to move up and down in the z-axis; at the same time, a plug 9 is provided in the concave area at the other end of the probe housing 7, and a probe wafer 8 is provided at the working contact surface end between the plug 9 and the probe housing 7. The probe wafer 8 is used to be installed into the probe housing 7 for bonding after the plug 9 is fixed at a fixed position and high-temperature glue is applied; the probe housing 7 is used to be supported by the main body that is tightly bonded by applying high-temperature glue at the bottom of the probe wafer 8.

[0021] Specifically, a plurality of locking units are arranged outside the area of ​​the probe working positions at both ends along the vertical center axis and the horizontal center axis of the base plate 3. One of the locking units includes a fastener base 10, and the fastener base 10 is arranged on the base plate 3. At the same time, a fastener connector 12 is provided at the other end of the fastener base 10. The other end of the fastener connector 12 is connected to a fastener adjustment rod 14 and a clamping wrench 15 in sequence through a locking nut 13. Then, the clamping wrench 15 is adjusted to fold and clamp the pressure plate 16, and the pressure is transmitted to the plug 9, so that the probe housing 7 and the probe wafer 8 are combined according to the process size, and then the subsequent curing manufacturing process is run.

[0022] Specifically, the base plate 3 is connected to the fixed foot 1 , the rotating seat 4 , and the fastener base 10 by bolt parts. At the same time, the base plate 3 is also used to support the clamping force transmitted to the clamping wrench 15 .

[0023] Specifically, the rotary seat 4, the spring 5 and the rotary cap 6 form an adjustable telescopic component assembly acted upon by the spring force.

[0024] Specifically, the spring 5 is used to buffer the force transmitted by the clamping wrench 15 to compress and solidify the probe wafer 8, so as to protect and avoid damage to the probe wafer 8 caused by excessive force when the clamping force is too large.

[0025] Specifically, the plug 9 is used to fix the probe wafer 8 and ensure that it is pressed and cured at a central position at the bottom of the probe housing 7 .

[0026] Specifically, the fastener base 10 is assembled with the fastener connector 12 via the pin 11, and a hinge structure is formed between the fastener base 10 and the fastener connector 12, and the fastener base 10 and the fastener connector 12 have the freedom to be laid flat or erected.

[0027] Furthermore, the fastener adjusting rod 14 is used to connect the fastener connector 12 and freely adjust to a suitable height of the pressure plate 16 to assemble and connect the locking nut 13 and the fastener connector 12.

[0028] Furthermore, the clamping wrench 15 is used to connect the fastener adjusting rod 14 with a pin, and then press the clamping wrench 15 in the vertical downward direction to clamp the pressure plate 16 to provide pressure between the pressure plate 16 and the plug 9.

[0029] Furthermore, the pressing plate 16 is used to cooperate with the four pressing wrenches 15 to press the plug 9 downward after pressing, and to cure the high temperature glue at the same time.

[0030] During the use of the high temperature glue curing tooling described in this embodiment, first put the plug 9 flat on the workbench, then reverse the probe wafer 8, and use two bayonet clips to fix it at the two feet of the plug 9 and lay it flat, so that the high temperature glue is evenly applied on the back of the probe wafer 8. Reverse the probe housing 7 and insert it onto the probe wafer 8 and the plug 9 to make them fit precisely. Reverse the probe housing 7, the probe wafer 8, and the plug 9 together again, and insert them into the screw cap 6 of the curing tooling. Repeat the operation in sequence until all 60 pieces of high temperature glue are applied and respectively inserted into the screw cap 6 of the curing tooling. Finally, place the pressing plate 16 flat on the 60 plugs 9, and finally close the fastener connector 12, the locking nut 13, the fastener adjustment rod 14, and the clamping wrench 15. Adjust the fastener adjustment rod 14 to a suitable height, and lock it with the locking nut 13, and finally tighten the clamping wrench 15 with force. Close the clamping wrench 15 on the edges in turn, then put it into the oven for curing according to the process requirements, take it out of the oven, wait for the tooling to cool down, loosen the clamping wrench 15 again, take out the plug 9, and observe that the probe chip 8 is cured at the center of the probe housing 7. Finally, take out the assembly of the probe housing 7 and the probe chip 8.

[0031] Obviously, the above embodiments are merely examples for clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the protection scope of the invention.

Claims

1. A novel probe high temperature glue curing tooling, the high temperature glue curing tooling is designed based on the high temperature curing process requirements between the probe housing (7) and the probe wafer (8) in the sensor, and is characterized by: include: A base plate (3), wherein a fixing foot (1) is provided at one end of the base plate (3) and is connected to the fixing foot (1) by means of fixing bolts (2), wherein the fixing foot (1) is used to support the base plate of the glue pouring and curing tooling; and a plurality of probe working positions, a locking unit, and a pressure plate (16) are provided on a working table at the other end of the base plate (3); One of the probe working positions includes a rotary seat (4), one end of which is provided with a threaded hole, and the base plate (3) is assembled and connected to the rotary seat (4) through a hexagon socket bolt; at the same time, the other end of the rotary seat (4) is provided with a rotary cap (6), which is assembled and connected to the rotary cap (6) through an external thread, and a spring (5) is also provided at the hollow axis of the rotary cap (6); A probe housing (7) is provided at one hollow end of the screw cap (6), wherein the screw cap (6) and the probe housing (7) are coaxially assembled and have the freedom to move up and down along the z-axis; at the same time, a plug (9) is provided in a concave area at the other end of the probe housing (7), and a probe wafer (8) is provided at the working contact surface end between the plug (9) and the probe housing (7).

2. The high temperature adhesive curing tool according to claim 1, characterized in that: A plurality of locking units are arranged outside the area of ​​the probe working positions at both ends along the vertical center axis and the horizontal center axis of the base plate (3), and one of the locking units includes a fastener base (10), the fastener base (10) is arranged on the base plate (3), and a fastener connector (12) is arranged at the other end of the fastener base (10), and the other end of the fastener connector (12) is connected to a fastener adjustment rod (14) and a clamping wrench (15) in sequence through a locking nut (13), and then the clamping wrench (15) is adjusted to fold the clamping plate (16), and the pressure is transmitted to the plug (9), so that the probe housing (7) and the probe wafer (8) are combined according to the process size, and then the next curing manufacturing process is run.

3. The high temperature adhesive curing tool according to claim 1, characterized in that: The bottom plate (3) is connected to the fixed foot (1), the rotating seat (4) and the fastener base (10) by means of bolt parts.

4. The high temperature adhesive curing tooling according to claim 1, characterized in that: The rotary seat (4), the spring (5) and the rotary cap (6) form an adjustable telescopic component assembly acted upon by the spring force.

5. The high temperature adhesive curing tool according to claim 4, characterized in that: The spring (5) is used to buffer the force transmitted by the clamping wrench (15) to clamp the solidified probe wafer (8).

6. The high temperature adhesive curing tool according to claim 1, characterized in that: The plug (9) is used to fix the probe wafer (8) and ensure that it is pressed and cured at high temperature at the center of the bottom of the probe housing (7).

7. The high temperature adhesive curing tooling according to claim 2, characterized in that: The fastener base (10) is assembled with the fastener connector (12) via a pin (11), and a hinge structure is formed between the fastener base (10) and the fastener connector (12).

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