Support-free photocuring 3D printing system and method

Abstract

The invention relates to the technical field of 3D printing, and discloses an unsupported photocuring 3D printing system and method.The system comprises a laser module and a printing module, the laser module comprises a laser and is used for generating scanning laser beams to cure printing raw materials, and the printing module comprises a raw material bin, a double-scraper unit and a forming bin; the raw material bin is used for containing printing raw materials, the double-scraper unit comprises a first scraper and a second scraper, and the second scraper is used for heating the surfaces of the printing raw materials to be in a liquid state and scraping the printing raw materials to a forming platform in the forming bin. The first scraper is used for cooling the printing raw material on the surface layer of the forming platform below a freezing point temperature to solidify the printing raw material; the forming bin comprises a second lifting platform. By arranging the double-scraper unit, combining the physical characteristics of the printing material and finely controlling the heating and cooling of the printing material, the 3D object containing the complex geometric structure is printed under the condition that no supporting structure needs to be constructed.

Description

Technical Field

[0001] The present invention relates to the technical field of 3D printing, and in particular to a support-free light-curing 3D printing system and method. Background Art

[0002] Stereolithography metal 3D printing is a method of 3D printing using a slurry of metal suspended in a photosensitive resin. This technology combines the advantages of photolithography (such as SLA, DLP) and metal to produce high-precision metal parts. Achieving support-free printing is an important direction for the development of this technology.

[0003] However, in the existing photocuring metal 3D printing technology, since the metal slurry as its raw material is usually in liquid form, it is necessary to construct a support structure during the printing process to support and cantilever complex structural features, and the support has certain contact points and contact surfaces with the parts. After printing is completed, it takes manpower and material resources to remove the support, which not only increases material and labor costs, but may also have a negative impact on the quality of the final product. For example, the support removal process at the contact points and contact surfaces may make the surface of the part rougher, and the dimensional accuracy and surface accuracy are greatly reduced, and even part damage may occur. These phenomena cause major defects in the manufacturing of parts and cannot truly meet the needs of industrial manufacturing. Summary of the invention

[0004] In view of this, the present invention provides a support-free photocuring 3D printing system and method to solve the cost and labor waste problems caused by the need to establish supports for printing in the existing photocuring metal 3D printing technology.

[0005] In a first aspect, the present invention provides a support-free light-curing 3D printing system, the system comprising:

[0006] A laser module, including a laser, for generating a scanning laser beam to solidify a printing material, wherein the printing material is in a solid state at room temperature and is in a liquid state when heated to a preset temperature;

[0007] Printing module, including raw material bin, double scraper unit and forming bin;

[0008] The raw material bin is used to accommodate the printing raw materials, and a first lifting platform is provided in the raw material bin to push the printing raw materials upwards;

[0009] The double scraper unit comprises a first scraper and a second scraper, wherein the second scraper is used to heat the surface of the printing material in the material bin to a liquid state and then scrape it onto a molding platform in the molding bin; the molding platform is located on the surface of the molding bin;

[0010] The first scraper is used to cool the printing material on the surface of the forming platform to a temperature below the solidification point, so that the printing material on the surface of the forming platform solidifies;

[0011] The molding bin includes a second lifting platform, and the second lifting platform is used to accommodate the printing material downward.

[0012] The support-free photocuring 3D printing system provided by an embodiment of the present invention is provided with a double scraper unit, wherein the second scraper heats the surface of the printing material contained in the material bin to a liquid state, and scrapes it onto the printing platform in the molding bin and coats it on its surface, and recycles the excess printing material in a preset manner, and then the first scraper cools the printing material coated on the surface of the molding platform to solidify to enhance the laser curing effect. Since the printing material is solid at room temperature, support-free photocuring printing can be achieved in the molding bin, avoiding the waste of materials for printing supports and the cumbersome process of removing supports after printing.

[0013] In an optional embodiment, the printing material is a thermosensitive resin-metal mixed slurry.

[0014] The support-free photocuring 3D printing system provided in an embodiment of the present invention suspends metal powder in a photosensitive resin slurry to prepare a thermosensitive resin-metal mixed slurry, so that the printing material is solid at room temperature and becomes liquid after being heated to a preset temperature, thereby solving the problem of the need for raw material support in photocuring printing and the easy sedimentation of metal in the mixed slurry.

[0015] In an optional embodiment, a first cooling device is built into the molding chamber, and the first cooling device is used to maintain the uncured printing material in a solid state to support the cured print part.

[0016] The unsupported photocuring 3D printing system provided by an embodiment of the present invention provides a first cooling device in the molding chamber to maintain the uncured printing material that is liquid at room temperature in a solid state during the photocuring printing process to support the cured print part, thereby expanding the types and range of printing materials applicable to the system.

[0017] In an optional embodiment, a second cooling device is built into the material bin to maintain the unsolidified printing material in a solid state.

[0018] The unsupported photocuring 3D printing system provided by the embodiment of the present invention provides a first cooling device in the material bin to maintain the uncured printing material that is liquid at room temperature in a solid state during the photocuring printing process, thereby expanding the types and range of printing materials applicable to the system.

[0019] In a second aspect, the present invention provides a support-free photocuring 3D printing method, which is applied to the support-free photocuring 3D printing system. The system also includes a controller, and the method is executed by the controller. The method includes:

[0020] Controlling the second scraper to heat the surface of the printing material in the material bin to a liquid state, and scraping the printing material in the liquid state to the molding bin to coat it on the surface of the molding platform;

[0021] Controlling the first scraper to cool the printing material coated on the surface of the forming platform to a temperature below the solidification point, so that the printing material on the surface of the forming platform solidifies;

[0022] The laser is controlled to generate a scanning laser beam to the molding platform to solidify the printing material on the surface of the molding platform according to a preset shape until a printed part is generated.

[0023] The support-free photocuring 3D printing method provided by the embodiment of the present invention first heats the surface of the printing material contained in the material bin to a liquid state by the second scraper in the double scraper unit, scrapes it onto the printing platform in the molding bin and coats it on the surface, and the excess printing material is recovered in a preset manner, and then the first scraper is used to cool the printing material coated on the surface of the molding platform until it solidifies. The instant cooling and solidification improves the effect of laser curing and the quality of the print. In addition, since the printing material is solid at room temperature, support-free photocuring printing can be achieved in the molding bin, avoiding the waste of raw materials for printing supports and the cumbersome process of removing supports after printing.

[0024] In an optional embodiment, the method further includes:

[0025] During the printing process, the temperature of the first cooling device in the molding bin and the second cooling device in the raw material bin is controlled not to exceed the target temperature so that the printing raw material remains in a solid state.

[0026] After printing is completed, the first cooling device is controlled to heat up to a preset temperature to separate the printed part.

[0027] The support-free photocuring 3D printing method provided by an embodiment of the present invention controls the first cooling device and the second cooling device to not exceed the target temperature during the printing process so that the printing material remains in a solid state to support the printed part. After printing is completed, the first cooling device is controlled to heat up so that the printing material that has not been solidified by the laser melts naturally, thereby achieving natural separation of the printed parts and other materials.

[0028] In an optional embodiment, the method further includes:

[0029] Degreasing the printed part to remove the organic binder in the printed part;

[0030] The degreased printed parts are sintered to achieve the preset mechanical strength and density.

[0031] The unsupported light-curing 3D printing method provided by the embodiment of the present invention removes the internal organic binder through degreasing treatment of the printed parts to ensure that the printed parts have purer materials and more reliable quality. At the same time, through sintering heat treatment, the pores and gaps in the printed material can be filled or closed, thereby increasing the density of the printed parts and improving their overall physical properties and stability.

[0032] In a third aspect, the present invention provides a computer device, comprising: a memory and a processor, the memory and the processor being communicatively connected to each other, the memory storing computer instructions, and the processor executing the unsupported photocuring 3D printing method of the second aspect or any corresponding embodiment thereof by executing the computer instructions.

[0033] In a fourth aspect, the present invention provides a computer-readable storage medium having computer instructions stored thereon, the computer instructions being used to enable a computer to execute the unsupported photocuring 3D printing method of the second aspect or any corresponding embodiment thereof.

[0034] In a fifth aspect, the present invention provides a computer program product, comprising computer instructions, wherein the computer instructions are used to enable a computer to execute the support-free photocuring 3D printing method of the first aspect or any corresponding embodiment thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 is a schematic diagram of a support-free light-curing 3D printing system according to an embodiment of the present invention;

[0037] Figure 2 is a schematic flow chart of a support-free photocuring 3D printing method according to an embodiment of the present invention;

[0038] Figure 3 It is a schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0040] Traditional photocuring metal 3D printing has industry problems such as waste of raw materials in support printing, difficulty in removing physical contact supports, and easy sedimentation of printed materials. At the same time, the additional post-processing process of removing supports can easily cause deformation and damage to printed parts.

[0041] Some of the support-free printing methods used in the field of photocuring metal 3D printing in traditional technology mainly include self-support design, gradient curing, segmented printing, dynamic support, optimized printing path, oblique printing, etc. By designing a certain tilt angle or curved surface, each layer can be stably built on the basis of the previous layer, by controlling the intensity and exposure time of the light source, the curing speed of different areas can be different, and the complex model can be divided into multiple easy-to-print parts, and each part can be printed separately and then assembled, or the support structure can be dynamically generated and removed during the printing process.

[0042] However, none of them can realize the support-free 3D printing function, nor can they reasonably solve the problem of easy sedimentation of metal in the mixed slurry.

[0043] An embodiment of the present invention provides a support-free photocuring 3D printing system. By setting a dual scraper unit including a first scraper and a second scraper and utilizing the physical properties of the printing material, a 3D object with a complex geometric structure can be printed without constructing any support structure, thereby omitting the complicated procedure of removing the support after printing. This not only greatly saves the time and labor cost of post-processing, but also improves the effect of laser curing and the quality of the printed part by instantly cooling and solidifying the printing material through the first scraper.

[0044] According to an embodiment of the present invention, an embodiment of a support-free light-curing 3D printing system is provided, and the system includes:

[0045] A laser module, including a laser, for generating a scanning laser beam to solidify a printing material, wherein the printing material is in a solid state at room temperature and is in a liquid state when heated to a preset temperature;

[0046] Printing module, including raw material bin, double scraper unit and forming bin;

[0047] The raw material bin is used to accommodate the printing raw materials, and a first lifting platform is provided in the raw material bin to push the printing raw materials upwards;

[0048] The double scraper unit comprises a first scraper and a second scraper, wherein the second scraper is used to heat the surface of the printing material in the material bin to a liquid state and then scrape it onto a molding platform in the molding bin; the molding platform is located on the surface of the molding bin;

[0049] The first scraper is used to cool the printing material on the surface of the forming platform to a temperature below the solidification point, so that the printing material on the surface of the forming platform solidifies;

[0050] The molding bin includes a second lifting platform, and the second lifting platform is used to accommodate the printing material downward.

[0051] Please refer to Figure 1 The printing material is contained in the raw material bin 1 and is in a solid state at room temperature. The raw material bin 1 includes a first lifting platform 2, which is used to push the printing material upward. The raw material bin 1 and the molding bin 5 are arranged in parallel. The first scraper 3 and the second scraper 4 can both move freely on the surface of the raw material bin and the molding bin 5. After the second scraper 4 is heated to a preset temperature, the second scraper 4 is moved to liquefy the solid printing material in the raw material bin 1 into a flowing liquid, and the flowing printing material is scraped onto the molding platform 6 in the molding bin 5 to form a thin and uniform coating layer. Subsequently, the first scraper 3 is cooled to a preset temperature and then the second scraper 4 is used to cool the uniform liquid printing material coated on the molding platform 6 to solidify, and the remaining printing material is recovered in a preset manner. The molding bin 5 also includes a second lifting platform 7, which is used to downwardly accommodate the printing material scraped from the raw material bin 1 to the molding bin 5 by the second scraper 4. At this time, the laser 8 generates a scanning beam through the control of the scanning system to solidify the printing material on the molding platform 6 according to a preset shape until printing is completed to form a print.

[0052] Optionally, the raw material bin 1 and the forming bin 5 are both made of stainless steel.

[0053] Optionally, a residual material collection box is provided on the molding bin 5. When the second scraper 4 is moved, the printing material that has been liquefied at high temperature and flows is scraped onto the molding platform 6 in the molding bin 5 to form a thin and uniform coating layer, and then the excess printing material is scraped into a recycling box for recycling.

[0054] Optionally, the temperature of the second scraper 4 is above 80 degrees Celsius, the temperature of the first scraper 3 is below the freezing point, and the heating method of the second scraper is resistance heating.

[0055] In some optional embodiments, the printing material is a thermosensitive resin-metal mixed slurry.

[0056] The metal is suspended in a slurry in the photosensitive resin to prepare a thermosensitive resin-metal mixed slurry, so that the printing material is solid at room temperature and becomes liquid after being heated to a preset temperature. This solves the problem of the need for raw material support in photocuring printing and the easy sedimentation of metal in the mixed slurry.

[0057] In some optional embodiments, the printing material includes a binder and metal powder, and the mass ratio of the binder to the metal powder is 1-2:5-10;

[0058] The particle size of the metal powder is in the range of 1-50 μm;

[0059] The adhesive comprises: a thermosensitive polymer, a photocurable resin monomer, a photoinitiator and a dispersant;

[0060] The thermosensitive polymer includes polyvinyl alcohol, polylactic acid or polyester, which remains solid at room temperature and accounts for 30%-60% of the total adhesive formulation.

[0061] The photocurable resin monomers include acrylates, such as diethylene glycol diacrylate, etc., which account for 20%-50% of the total formulation of the adhesive.

[0062] The photoinitiator includes benzophenone or similar compounds, which can generate free radicals to initiate polymerization under ultraviolet light irradiation, and usually accounts for 1%-5%.

[0063] The dispersant accounts for 5%-15% of the total adhesive formulation

[0064] In some optional embodiments, the molding chamber 5 is provided with a first cooling device, which is used to maintain the uncured printing material in a solid state to support the cured print part.

[0065] The first cooling device is disposed in the molding chamber 5 and can cool the uncured printing material in the molding chamber 5 to a preset temperature to maintain the uncured printing material in the molding chamber 5 in a solid state.

[0066] Optionally, the first cooling device is arranged on the outer wall of the forming chamber 5 .

[0067] Optionally, the first cooling device includes semiconductor refrigeration and external copper tube refrigeration.

[0068] In some optional embodiments, a second cooling device is built into the material bin to maintain the unsolidified printing material in a solid state.

[0069] Optionally, the second cooling device is arranged on the outer wall of the raw material bin 1 .

[0070] Optionally, the second cooling device includes semiconductor refrigeration and external copper tube refrigeration.

[0071] The second cooling device is disposed in the raw material bin 1 and can cool the raw material to a preset temperature to maintain the uncured printing raw material in the raw material bin 1 in a solid state.

[0072] Optionally, the second cooling device is arranged on the inner wall of the raw material bin 1 .

[0073] In this embodiment, a support-free light-curing 3D printing method is provided, which can be used for the above-mentioned mobile terminals, such as mobile phones and tablet computers. Figure 2 is a flow chart of a support-free photocuring 3D printing method according to an embodiment of the present invention. Figure 2 As shown, the method is applied to the above-mentioned support-free light-curing 3D printing system, the system also includes a controller, the method is executed by the controller, and the method includes the following steps:

[0074] Step S101, controlling the second scraper to heat the surface of the printing material in the material bin to a liquid state, and scraping the printing material in the liquid state to the molding bin, and coating it on the surface of the molding platform.

[0075] Specifically, after the second scraper 4 is heated to a preset temperature, the printing material in the raw material bin 1 is changed from a solid state to a liquid state, and the liquid printing material is scraped from the raw material bin 1 to the forming platform 6 in the forming bin 5. Except for the printing material coated on the surface of the forming platform 6, the remaining part is recovered in a preset manner and becomes a solid state after cooling.

[0076] Optionally, a collection box is provided on the molding chamber 5. When the second scraper 4 is moved to scrape the flowing printing material onto the molding platform 6 in the molding chamber 5 to form a thin and uniform coating layer, the excess printing material is scraped into a recycling box for recycling.

[0077] Step S102, controlling the first scraper 3 to cool the printing material coated on the surface of the forming platform to a temperature below the solidification point, so that the printing material on the surface of the forming platform is solidified.

[0078] Specifically, after the first scraper 3 is cooled to a preset temperature, the second scraper 4 follows to cool the liquid printing material scraped to the molding chamber 5 by the second scraper 4 and coated on the molding platform 6 to below the solidification point to solidify it.

[0079] Step S103, controlling the laser to generate a scanning laser beam to the molding platform to solidify the printing material on the surface of the molding platform according to a preset shape until a printed part is generated.

[0080] Specifically, the laser 8 mainly generates ultraviolet light with a wavelength of 355 nm to achieve photocuring of the temperature-sensitive metal polymer printing material.

[0081] Optionally, the laser 8 is connected to a laser galvanometer.

[0082] In summary, the unsupported photocuring 3D printing method provided by the embodiment of the present invention uses a controller to precisely control the dual scraper unit and the laser module to work together, so as to print a 3D object containing a complex geometric structure without building any support structure. Specifically, the method first heats the second scraper 4 to a preset temperature while the first scraper 3 is cooled to below the solidification point temperature of the printing material. The second scraper 4 is first used to heat the surface of the solid printing material in the material bin 1 to a liquid state, and then the liquid printing material is scraped to the molding bin 5, and accurately scraped onto the molding platform 6 of the molding bin 5, and the excess material is recovered to ensure the printing accuracy. Then, the first scraper 3 follows the second scraper 4 to cool the liquid material just coated on the molding platform 6 to below the solidification point, forming a stable solid thin layer to improve the effect of subsequent laser curing. Finally, under the instruction of the controller, the laser emits a precise scanning laser beam to solidify the material on the molding platform 6 layer by layer according to the preset three-dimensional model until the entire print is completely formed. This process not only realizes support-free printing, but also significantly improves printing efficiency and product quality, while avoiding the waste of support parts in traditional printing and the tedious subsequent processing.

[0083] In some optional embodiments, the method further comprises:

[0084] During the printing process, the temperature of the first cooling device in the molding bin and the second cooling device in the raw material bin is controlled not to exceed the target temperature so that the printing raw material remains in a solid state.

[0085] After printing is completed, the first cooling device is controlled to heat up to a preset temperature to separate the printed part.

[0086] Specifically, during the printing process, the temperature of the first cooling device and the second cooling device is maintained not to exceed the target temperature, so that the printing material remains in a solid state to support the printed part.

[0087] Optionally, the target temperature is 10 degrees Celsius.

[0088] Furthermore, since the printed part solidified by the laser beam and the unsolidified printing material have different melting points, this property can be used to heat the printing material block containing the printed part to a preset temperature to peel off the printed part. Therefore, after printing is completed, the first cooling device is controlled to heat up to a preset temperature to heat the printing material block solidified by active cooling in the molding chamber after printing, so that the entire material block is liquefied, thereby releasing the printed part.

[0089] Optionally, the preset temperature is 50-60 degrees Celsius.

[0090] In some optional embodiments, the method further comprises:

[0091] Degrease the printed parts to remove the organic binder in the printed parts;

[0092] After degreasing, the printed part is sintered to achieve the preset mechanical strength and density. Degreasing of printed parts can be carried out by chemical treatment. Specifically, the printed part is immersed in an organic solvent and the organic binder on the surface is removed by the dissolving effect of the solvent. The choice of solvent depends on the type and nature of the binder. After degreasing, the surface of the printed part is cleaned with clean water or deionized water to remove the residual degreasing agent and impurities. Then, the printed part is dried until there is no water residue. Degreasing can effectively remove the organic binder in the printed part to avoid its influence on subsequent processing and use performance.

[0093] Optionally, heating in an inert atmosphere (such as nitrogen, argon, etc.) can ensure that the printed part will not be oxidized during the heating process. Slowly heating to the gasification decomposition temperature of the adhesive can ensure that the adhesive can be fully and evenly decomposed and gasified, thereby effectively removing the organic adhesive from the inside and surface of the printed part. Compared with other degreasing methods, heating degreasing can remove adhesive residues more thoroughly.

[0094] The aforementioned degreasing treatment is an important step before sintering heat treatment. By thoroughly removing the binder, it can be ensured that the metal powder can be tightly combined and form a dense structure during the sintering process. Specifically, the sintering process requires the print to be placed in a sintering furnace and gradually heated to the preheating temperature so that the print is evenly heated to avoid thermal stress caused by direct high temperature. After preheating, continue to heat up to the sintering temperature and keep it at this temperature for a period of time to allow metallurgical bonding between the metal particles to form a dense microstructure. After sintering is completed, gradually lower the furnace temperature and allow the print to slowly cool to room temperature. The sintering process can increase the density of the print, fill the pores between the particles, form a dense microstructure, and thus increase the density and strength of the material.

[0095] In the description of the present invention, it should be noted that the terms "center", "top", "bottom", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0096] The embodiment of the present invention also provides a computer device, see Figure 3 , Figure 3is a schematic diagram of the structure of a computer device provided by an optional embodiment of the present invention, such as Figure 3 As shown, the computer device includes: one or more processors 10, a memory 20, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. Various components are connected to each other using different buses for communication, and can be installed on a common mainboard or installed in other ways as needed. The processor can process the instructions executed in the computer device, including instructions stored in or on the memory to display the graphical information of the GUI on an external input / output device (such as, a display device coupled to the interface). In some optional embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple computer devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Figure 3 A processor 10 is taken as an example.

[0097] The processor 10 may be a central processing unit, a network processor or a combination thereof. The processor 10 may further include a hardware chip. The hardware chip may be a dedicated integrated circuit, a programmable logic device or a combination thereof. The programmable logic device may be a complex programmable logic device, a field programmable gate array, a general purpose array logic or any combination thereof.

[0098] The memory 20 stores instructions executable by at least one processor 10, so that at least one processor 10 executes the method shown in the above embodiment.

[0099] The memory 20 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the computer device, etc. In addition, the memory 20 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some optional embodiments, the memory 20 may optionally include a memory remotely arranged relative to the processor 10, and these remote memories may be connected to the computer device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0100] The memory 20 may include a volatile memory, such as a random access memory; the memory may also include a non-volatile memory, such as a flash memory, a hard disk or a solid state drive; the memory 20 may also include a combination of the above types of memory.

[0101] The computer device also includes an input device 30 and an output device 40. The processor 10, the memory 20, the input device 30 and the output device 40 may be connected via a bus or other means. Figure 3 The example of connecting through bus is taken in the following.

[0102] The input device 30 can receive input digital or character information, and generate key signal input related to the user settings and function control of the computer device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator bar, one or more mouse buttons, a trackball, a joystick, etc. The output device 40 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The above-mentioned display device includes but is not limited to a liquid crystal display, a light emitting diode, a display and a plasma display. In some optional embodiments, the display device can be a touch screen.

[0103] The embodiment of the present invention also provides a computer-readable storage medium. The method according to the embodiment of the present invention can be implemented in hardware, firmware, or can be implemented as a computer code that can be recorded in a storage medium, or can be implemented as a computer code that is originally stored in a remote storage medium or a non-temporary machine-readable storage medium and will be stored in a local storage medium through a network download, so that the method described herein can be stored in such software processing on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. Among them, the storage medium can be a magnetic disk, an optical disk, a read-only storage memory, a random access memory, a flash memory, a hard disk or a solid-state hard disk, etc.; further, the storage medium can also include a combination of the above types of memories. It can be understood that a computer, a processor, a microprocessor controller, or programmable hardware includes a storage component that can store or receive software or computer code. When the software or computer code is accessed and executed by a computer, a processor, or hardware, the method shown in the above embodiment is implemented.

[0104] A part of the present invention may be applied as a computer program product, such as a computer program instruction, which, when executed by a computer, can call or provide the method and / or technical solution according to the present invention through the operation of the computer. Those skilled in the art should understand that the existence of the computer program instruction in a computer-readable medium includes, but is not limited to, a source file, an executable file, an installation package file, etc., and accordingly, the way in which the computer program instruction is executed by the computer includes, but is not limited to: the computer directly executes the instruction, or the computer compiles the instruction and then executes the corresponding compiled program, or the computer reads and executes the instruction, or the computer reads and installs the instruction and then executes the corresponding installed program. Here, the computer-readable medium may be any available computer-readable storage medium or communication medium accessible to the computer.

[0105] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A support-free light-curing 3D printing system, characterized in that: The system comprises: A laser module, including a laser, for generating a scanning laser beam to solidify a printing material, wherein the printing material is in a solid state at room temperature and is in a liquid state when heated to a preset temperature; Printing module, including raw material bin, double scraper unit and forming bin; The raw material bin is used to accommodate the printing raw materials, and a first lifting platform is provided in the raw material bin to push the printing raw materials upwards; The double scraper unit comprises a first scraper and a second scraper, wherein the second scraper is used to heat the surface of the printing material in the material bin to a liquid state and then scrape it onto a molding platform in the molding bin; the molding platform is located on the surface of the molding bin; The first scraper is used to cool the printing material on the surface of the forming platform to a temperature below the solidification point, so that the printing material on the surface of the forming platform solidifies; The molding bin includes a second lifting platform, and the second lifting platform is used to accommodate the printing material downward.

2. The system according to claim 1, characterized in that The printing material is a thermosensitive resin-metal mixed slurry.

3. The system according to claim 2, characterized in that The molding chamber is provided with a first cooling device, which is used to maintain the uncured printing material in a solid state to support the cured print part.

4. The system according to claim 3, characterized in that The material bin has a built-in second cooling device to maintain the uncured printing material in a solid state.

5. A support-free light-curing 3D printing method, characterized in that: The support-free photocuring 3D printing system applied to any one of claims 1 to 4, wherein the photocuring 3D printing system further comprises a controller, and the method is executed by the controller, and the method comprises: Controlling the second scraper to heat the surface of the printing material in the material bin to a liquid state, and scraping the printing material in the liquid state to the molding bin to coat it on the surface of the molding platform; Controlling the first scraper to cool the printing material coated on the surface of the forming platform to a temperature below the solidification point, so that the printing material on the surface of the forming platform solidifies; The laser is controlled to generate a scanning laser beam to the molding platform to solidify the printing material on the surface of the molding platform according to a preset shape until a printed part is generated.

6. The method according to claim 5, characterized in that The method further comprises: During the printing process, the temperature of the first cooling device in the molding bin and the second cooling device in the raw material bin is controlled not to exceed the target temperature, so that the printing raw material remains in a solid state; After printing is completed, the first cooling device is controlled to heat up to a preset temperature to separate the printed part.

7. The method according to claim 6, characterized in that The method further comprises: Degreasing the printed part to remove the organic binder in the printed part; The degreased printed parts are sintered to achieve the preset mechanical strength and density.

8. A computer device, characterized in that: include: A memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the method according to claims 5 to 7 by executing the computer instructions.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a computer to execute the method of claims 5 to 7.

10. A computer program product, characterized in that The method comprises computer instructions for causing a computer to execute the method of claims 5 to 7.

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