Glass cover plate, processing method, flexible display screen assembly and foldable electronic equipment

Abstract

The invention provides a glass cover plate, a processing method, a flexible display screen assembly and foldable electronic equipment. The processing method of the glass cover plate provided by the embodiment of the invention comprises the following steps: providing a glass substrate, wherein the glass substrate is provided with a to-be-treated edge part; carrying out numerical control processing on the to-be-processed edge part of the glass substrate; and carrying out numerical control polishing on the to-be-processed edge part of the glass substrate subjected to numerical control processing. According to the processing method of the glass cover plate, provided by the embodiment of the invention, the edge part of the glass cover plate has relatively low roughness and relatively good mechanical strength.

Description

Technical Field

[0001] The present application relates to the field of electronics, and in particular to a glass cover plate and a processing method thereof, a flexible display screen assembly and a foldable electronic device. Background Art

[0002] The edges of existing glass cover plates are usually processed by numerical control machining (also known as computer digital controlled precision machining, abbreviated as CNC machining) to form chamfers (also known as C angles). CNC machining is prone to edge collapse, which greatly reduces the mechanical strength of the glass cover plate. Summary of the invention

[0003] The embodiment of the present application provides a method for processing a glass cover plate, wherein the edge of the glass cover plate produced by the method has lower roughness and better mechanical strength.

[0004] A first aspect of the present application provides a method for processing a glass cover plate, which includes:

[0005] Providing a glass substrate having an edge portion to be processed;

[0006] Performing CNC machining on the edge portion to be processed of the glass substrate; and

[0007] The edge portion to be processed of the glass substrate processed by the numerical control is subjected to numerical control grinding.

[0008] A second aspect of the present application provides a glass cover plate, wherein the glass cover plate has an edge portion, and the edge portion is obtained by the processing method described in the first aspect of the present application.

[0009] A third aspect of the present application provides a flexible display screen assembly, which includes:

[0010] A flexible display screen having a display surface; and

[0011] The glass cover plate described in the second aspect is stacked on the display surface of the flexible display screen to protect the flexible display screen.

[0012] A fourth aspect of the present application provides a foldable electronic device, characterized in that it includes:

[0013] The flexible display screen assembly according to the third aspect of the present application;

[0014] A foldable mechanism, which is disposed on a side of the flexible display assembly facing away from the glass cover plate, and is used to carry the flexible display assembly and drive the flexible display assembly to be folded or flattened; and

[0015] A processor is electrically connected to the flexible display screen assembly and is used to control the flexible display screen assembly to display.

[0016] The processing method of the glass cover plate in the embodiment of the present application first performs CNC processing on the edge portion to be processed of the glass substrate, and then performs CNC grinding on the edge portion to be processed. During the CNC grinding, surface pits or defects caused by edge collapse during CNC processing of the edge portion to be processed can be removed, and the surface roughness of the edge portion to be processed can be reduced, thereby making the glass cover plate have better mechanical strength and reducing the risk of the glass cover plate breaking when it falls. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 It is a schematic flow chart of a method for processing a glass cover plate according to an embodiment of the present application.

[0019] Figure 2 It is a structural schematic diagram of the processing flow of the glass cover plate according to an embodiment of the present application.

[0020] Figure 3 FIG. 4 is a side view of a glass substrate according to an embodiment of the present application.

[0021] Figure 4 It is a schematic diagram of the laminated structure of laminated glass according to an embodiment of the present application.

[0022] Figure 5 It is a schematic diagram of the numerical control processing flow in the processing method of the glass cover plate in one embodiment of the present application.

[0023] Figure 6 It is a schematic flow chart of a method for processing a glass cover plate according to another embodiment of the present application.

[0024] Figure 7 It is a schematic flow chart of a method for processing a glass cover plate according to another embodiment of the present application.

[0025] Figure 8 It is a schematic flow chart of a method for processing a glass cover plate according to another embodiment of the present application.

[0026] Fig. 9 Schematic diagram of the test structure of the glass cover according to an embodiment of the present application.

[0027] Fig.10It is a structural schematic diagram of a flexible display screen assembly according to an embodiment of the present application.

[0028] Fig.11 The flexible display screen component of one embodiment of the present application is Fig.10 Schematic diagram of the cross-sectional structure in the BB direction.

[0029] Fig.12 It is a schematic structural diagram of a foldable electronic device in a flattened state according to an embodiment of the present application.

[0030] Fig.13 It is a schematic structural diagram of a foldable electronic device in a folded state according to an embodiment of the present application.

[0031] Fig.14 It is a circuit block diagram of an electronic device according to an embodiment of the present application.

[0032] Description of reference numerals:

[0033] 100-glass cover, 10-edge part,

[0034] 100a-glass substrate, 10a-edge portion to be processed, 20a-first plane portion, 30a-bendable portion, 40a-second plane portion, 200-flexible display assembly, 210-flexible display, 211-display surface, 300-foldable electronic device, 310-foldable mechanism, 311-first carrier, 313-connecting axis, 315-second carrier, 330-processor, 350-memory, 370-camera module. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0036] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0037] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0038] It should be noted that, for the convenience of explanation, in the embodiments of the present application, the same figure marks represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0039] The edges of the glass cover plate are usually processed by CNC machining (also known as computer digital controlled precision machining, abbreviated as CNC machining) to form chamfers (also known as C angles). CNC machining is prone to edge collapse, which makes the surface of the glass cover plate have more defects, which is easy to cause stress concentration when subjected to external force, greatly reducing the mechanical strength of the glass cover plate.

[0040] See also Figure 1 and Figure 2 The present invention provides a method for processing a glass cover plate 100, which includes:

[0041] S101, providing a glass substrate 100a, wherein the glass substrate 100a has an edge portion 10a to be processed;

[0042] S102, performing numerical control machining (referred to as CNC machining) on ​​the edge portion 10a to be processed of the glass substrate 100a; and

[0043] S103, performing CNC grinding (abbreviated as CNC grinding) on ​​the edge portion 10a to be processed of the CNC-processed glass substrate 100a.

[0044] It can be understood that the edge portion 10 a to be processed of the glass substrate 100 a processed by the numerical control is subjected to numerical control grinding to form the edge portion 10 , so as to obtain the glass cover plate 100 .

[0045] In the processing method of the glass cover plate 100 of the embodiment of the present application, CNC processing is first performed on the edge portion 10a to be processed of the glass substrate 100a, and then CNC grinding is performed on the edge portion 10a to be processed of the glass substrate 100a. During the CNC grinding, surface pits or defects caused by edge collapse during CNC processing of the edge portion 10a to be processed can be removed, and the surface roughness of the edge portion 10a to be processed can be reduced, so that the glass cover plate 100 has better mechanical strength and the risk of breakage of the glass cover plate 100 when it falls is reduced.

[0046] In S101, optionally, the glass substrate 100a is a flexible glass substrate 100a, and the glass substrate 100a may be a glass substrate 100a of uniform thickness or a glass substrate 100a of unequal thickness.

[0047] Optionally, the thickness of the glass substrate 100a may be, but is not limited to, 20 μm to 220 μm. Specifically, the thickness of the glass substrate 100a may be, but is not limited to, 20 μm, 30 μm, 50 μm, 70 μm, 100 μm, 120 μm, 150 μm, 180 μm, 200 μm, 220 μm, etc. The thickness of the glass substrate 100a may be determined according to actual needs, and is not specifically limited in this application.

[0048] In the embodiments of the present application, when a numerical value range from a to b is involved, unless otherwise specified, it means that the numerical value can be any numerical value between a and b, including the endpoint numerical value a and the endpoint numerical value b.

[0049] See also Figure 3 In some embodiments, when the glass substrate 100a is glass of unequal thickness, the glass substrate 100a includes a first planar portion 20a, a bendable portion 30a, and a second planar portion 40a connected in sequence, the bendable portion 30a has a thickness less than the first planar portion 20a, and the bendable portion 30a has a thickness less than the second planar portion 40a. The thickness of the first planar portion 20a ranges from 70 μm to 220 μm, the thickness of the bendable portion 30a ranges from 20 μm to 50 μm, and the thickness of the second planar portion 40a ranges from 70 μm to 220 μm.

[0050] Optionally, when the glass substrate 100a is a flexible glass substrate 100a, see Figure 4 , the multi-layer glass substrate 100a can be stacked and sandwiched between two layers of rigid glass 200a to form a laminated glass 300a, and then the laminated glass 300a is edge processed. For example, 10 to 30 layers of glass substrates 100a (e.g., 10 layers, 20 layers, 30 layers) are stacked and sandwiched between two layers of rigid glass 200a. After the multi-layer glass substrate 100a is stacked, the edge portion 10a to be processed is processed, which can improve the processing efficiency of the glass cover 100. The glass substrate 100a is sandwiched between two layers of rigid glass 200a, which can prevent the flexible glass substrate 100a from being deformed during the processing process, which affects the accuracy of the edge processing.

[0051] Optionally, the thickness of the rigid glass 200a is greater than the thickness of the glass substrate 100a, and the ratio of the thickness d1 of the rigid glass 200a to the thickness d2 of the glass substrate 100a is in the range of 20≤d1 / d2≤50. Specifically, the ratio of the thickness d1 of the rigid glass 200a to the thickness d2 of the glass substrate 100a may be, but is not limited to, 20, 25, 30, 35, 40, 45, 50, etc. If the ratio of the thickness d1 of the rigid glass 200a to the thickness d2 of the glass substrate 100a is too small, the rigidity of the rigid glass 200a is insufficient and cannot well support the flexible glass substrate 100a. If the ratio of the thickness d1 of the rigid glass 200a to the thickness d2 of the glass substrate 100a is too large, the supporting effect on the flexible glass substrate 100a will not be further improved, but the laminated glass 300a is too thick as a whole, and it is not convenient to process the glass substrate 100a.

[0052] Optionally, when multiple layers of glass substrates 100a are stacked to form laminated glass 300a, a protective layer is provided between any two adjacent glass substrates 100a, and the protective layer is used to protect the glass substrates 100a to prevent the surfaces of the glass substrates 100a from being corroded by etching liquid during subsequent etching processes.

[0053] Optionally, the protective layer may be, but is not limited to, a glue layer, an ink layer, etc.

[0054] Optionally, the CNC machining is segmented CNC machining, which includes first CNC machining (also known as CNC rough machining), second CNC machining (also known as CNC semi-finishing machining) and third CNC machining (also known as CNC finishing machining); the precision of the first CNC machining is less than that of the second CNC machining, and the precision of the second CNC machining is less than that of the third CNC machining. By adopting segmented CNC machining and performing CNC machining in a manner of gradually improving machining precision, the probability of edge collapse during CNC machining can be reduced, and the size of the pits caused by edge collapse can be reduced, so that the machining efficiency can be improved while improving the machining quality.

[0055] See also Figure 5 Optionally, in S102, the CNC machining of the edge portion 10a to be processed of the glass substrate 100a includes:

[0056] S1021, using a first grinding wheel (not shown) to perform a first CNC machining on the edge portion 10a to be processed of the glass substrate 100a, wherein the first grinding wheel has first sand grains (not shown);

[0057] Optionally, the first numerical control machining is rough machining, in other words, the edge portion 10a to be processed of the glass substrate 100a is rough machined by using a first grinding wheel.

[0058] Optionally, the first grinding wheel is a diamond grinding wheel, and the first sand grains are diamond grains.

[0059] Optionally, the mesh number M1 of the first sand particles is in the range of 250 mesh ≤ M1 ≤ 500 mesh. Specifically, the mesh number M1 of the first sand particles may be, but is not limited to, 250 mesh, 280 mesh, 300 mesh, 330 mesh, 350 mesh, 380 mesh, 400 mesh, 420 mesh, 450 mesh, 480 mesh, 500 mesh, etc. If the mesh number of the first sand particles is too small, the particle size of the first sand particles is too large, which may improve the processing efficiency but reduce the processing accuracy and processing quality of the edge portion 10a to be processed; if the mesh number of the first sand particles is too large, the particle size of the first sand particles is too small, which may improve the processing accuracy and processing quality but reduce the processing efficiency. When the mesh number of the first sand particles is 250 mesh to 500 mesh, the processing efficiency of the edge portion 10a to be processed of the glass substrate 100a may be improved while the processing quality is improved.

[0060] S1022, using a second grinding wheel (not shown) to perform second CNC machining on the edge portion 10a to be processed of the glass substrate 100a, wherein the second grinding wheel has second sand grains (not shown), and the mesh number of the first sand grains is smaller than the mesh number of the second sand grains; and

[0061] It can be understood that the particle size of the first sand particles is larger than that of the second sand particles. The second sand particles with a mesh number larger than that of the first sand particles are used for the second CNC machining, which can not only reduce the size of the pits caused by the edge collapse during the second CNC machining, but also reduce the depth of the pits caused by the edge collapse during the first CNC machining, thereby further reducing the depth of the pits at the edge portion 10a to be processed of the glass substrate 100a, and reducing the defect size of the surface of the edge portion 10a to be processed of the glass substrate 100a.

[0062] Optionally, the second grinding wheel is a diamond grinding wheel, and the second sand grains are diamond grains.

[0063] Optionally, the mesh number M2 of the second sand particles is in the range of 1000 mesh ≤ M2 ≤ 1500 mesh; specifically, the mesh number M2 of the second sand particles may be, but is not limited to, 1000 mesh, 1050 mesh, 1100 mesh, 1150 mesh, 1200 mesh, 1250 mesh, 1300 mesh, 1350 mesh, 1400 mesh, 1450 mesh, 1500 mesh, etc. If the mesh number of the second sand particles is too small, the particle size of the second sand particles is too large, which may improve the processing efficiency but reduce the processing accuracy and processing quality of the edge portion 10a to be processed; if the mesh number of the second sand particles is too large, the particle size of the second sand particles is too small, which may improve the processing accuracy and processing quality but reduce the processing efficiency. When the mesh number of the second sand particles is 1000 mesh to 1500 mesh, the processing efficiency of the edge portion 10a to be processed of the glass substrate 100a may be improved while the processing quality is improved.

[0064] S1023, using a third grinding wheel (not shown) to perform third CNC machining on the edge portion 10a to be processed of the glass substrate 100a, wherein the third grinding wheel has third sand grains (not shown), and the mesh number of the second sand grains is smaller than the mesh number of the third sand grains.

[0065] It can be understood that the particle size of the second sand particles is larger than that of the third sand particles. The third sand particles with a mesh number larger than that of the second sand particles are used for the third NC machining, which can not only reduce the size of the pits generated by the edge collapse during the third NC machining, but also reduce the depth of the pits generated by the edge collapse during the second NC machining, thereby further reducing the depth of the pits of the edge portion 10a to be processed of the glass substrate 100a, and reducing the defect size of the surface of the edge portion 10a to be processed of the glass substrate 100a.

[0066] Optionally, the third grinding wheel is a diamond grinding wheel, and the third grits are diamond particles.

[0067] Optionally, the mesh number M3 of the third sand particles is in the range of 2500 mesh ≤ M3 ≤ 3500 mesh. Specifically, the mesh number M3 of the third sand particles may be, but is not limited to, 2500 mesh, 2600 mesh, 2700 mesh, 2800 mesh, 2900 mesh, 3000 mesh, 3100 mesh, 3200 mesh, 3300 mesh, 3400 mesh, 3500 mesh, etc. If the mesh number of the third sand particles is too small, the particle size of the third sand particles is too large, which may improve the processing efficiency but reduce the processing accuracy and processing quality of the edge portion 10a to be processed; if the mesh number of the third sand particles is too large, the particle size of the third sand particles is too small, which may improve the processing accuracy and processing quality but reduce the processing efficiency. When the mesh number of the third sand particles is 2500 mesh to 3500 mesh, the processing efficiency of the edge portion 10a to be processed of the glass substrate 100a may be improved while the processing quality is improved.

[0068] Optionally, in S103, the CNC grinding of the edge portion 10a to be processed of the CNC-processed glass substrate 100a includes: using sandpaper to CNC-grind the edge portion 10a to be processed of the CNC-processed glass substrate 100a, wherein the sandpaper includes fourth sand grains (not shown), and the mesh number of the fourth sand grains is greater than the mesh number of the third sand grains.

[0069] Optionally, diamond sandpaper is used as a rotating shaft (or roller) to quickly grind the edge portion 10a of the glass substrate 100a processed by the CNC until the edge portion 10a has no obvious sawtooth. It can be understood that the accuracy of CNC grinding is greater than that of CNC processing.

[0070] It can be understood that the particle size of the third sand grains is greater than the particle size of the fourth sand grains. The sandpaper is diamond sandpaper, and the third sand grains are diamond particles.

[0071] In this embodiment, a fourth sand grain with a larger grit size is used to perform CNC grinding on the edge portion 10a to be processed of the CNC-processed glass substrate 100a, so that pits or defects caused by edge collapse during CNC processing can be further removed, and surface defects of the edge portion 10 of the obtained glass cover plate 100 can be further reduced, thereby improving the processing quality.

[0072] Optionally, the mesh number M4 of the fourth sand grains is in the range of 8000 mesh ≤ M4 ≤ 10000 mesh. Specifically, the mesh number M4 of the fourth sand grains may be, but is not limited to, 8000 mesh, 8200 mesh, 8400 mesh, 8600 mesh, 8800 mesh, 9000 mesh, 9200 mesh, 9400 mesh, 9600 mesh, 9800 mesh, 10000 mesh, etc. If the mesh number of the fourth sand grains is too small, the particle size of the fourth sand grains is too large, and the surface pits or defects generated by CNC machining cannot be eliminated well; if the mesh number of the fourth sand grains is too large, the particle size of the fourth sand grains is too small, and although the machining accuracy and machining quality can be improved, the machining efficiency is reduced. When the mesh number of the fourth sand grains is 8000 mesh to 10000 mesh, the machining efficiency of the glass cover plate 100 can be improved while the pits or defects generated by the collapse of the edge during CNC machining can be well removed.

[0073] See also Figure 6 Another embodiment of the present application provides a method for processing a glass cover plate 100, which includes:

[0074] S201, providing a glass substrate 100a, wherein the glass substrate 100a has an edge portion 10a to be processed;

[0075] S202, performing CNC machining on the edge portion 10a to be processed of the glass substrate 100a;

[0076] S203, performing CNC grinding on the edge portion 10a to be processed of the CNC-processed glass substrate 100a; and

[0077] For a detailed description of S201 to S203 , please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0078] S204, performing a first etching on the edge portion 10a to be processed of the glass substrate 100a that has been numerically polished to passivate the edge portion 10a to be processed; wherein the ratio of the vertical etching rate V11 of the first etching to the side etching rate V12 of the first etching is in the range of: 4≤V11 / V12≤10.

[0079] Optionally, the glass substrate 100a that has been CNC-polished is subjected to a first etching in a first etching solution to passivate the edge portion 10a to be processed, and the sharp corners of the edge portion 10a to be processed after CNC grinding are smoothed to make the surface of the edge portion 10a to be processed rounded without sharp corners or sharp corners.

[0080] Optionally, the first etching solution may be, but is not limited to, a hydrofluoric acid aqueous solution, and the mass concentration of the hydrofluoric acid aqueous solution is 2% to 5%; specifically, the mass concentration of the hydrofluoric acid aqueous solution may be, but is not limited to, 2%, 3%, 4%, 5%, etc. If the concentration of the hydrofluoric acid aqueous solution is too high, the vertical etching rate of the first etching is too high, and it is not easy to control the removal amount of the edge portion 10a to be processed, which affects the accuracy of the edge portion 10 of the glass cover plate 100; if the concentration of the hydrofluoric acid aqueous solution is too low, the vertical etching rate of the first etching is low, and the sharp corners of the edge portion 10a to be processed cannot be removed well or the sharp corners are not removed cleanly, which affects the roundness of the surface of the edge portion 10 of the manufactured glass cover plate 100.

[0081] Optionally, a vertical etching rate V11 of the first etching is greater than a lateral etching rate V12 of the first etching.

[0082] Specifically, the ratio V11 / V12 of the vertical etching rate V11 of the first etching to the side etching rate V12 of the first etching may be, but is not limited to, 4, 5, 6, 7, 8, 9, 10, etc. If the ratio V11 / V12 of the vertical etching rate V11 of the first etching to the side etching rate V12 of the first etching is too low, the vertical etching rate of the first etching is too small, the test rate of the first etching is too large, the sharp corners of the edge portion 10a to be processed cannot be removed well or the sharp corners are not removed cleanly, affecting the roundness of the surface of the edge portion 10 of the manufactured glass cover 100; if the ratio V11 / V12 of the vertical etching rate V11 of the first etching to the side etching rate V12 of the first etching is too high, the vertical etching is too fast, it is not easy to control the removal amount of the edge portion 10a to be processed, and the accuracy of the edge portion 10 of the glass cover 100 is affected.

[0083] Optionally, the vertical etching rate V11 of the first etching is in the range of 4μm / min≤V11≤10μm / min. Specifically, the vertical etching rate V11 of the first etching may be, but is not limited to, 4μm / min, 5μm / min, 6μm / min, 7μm / min, 8μm / min, 9μm / min, 10μm / min, etc. If the vertical etching rate of the first etching is too small, the sharp corners of the edge portion 10a to be processed cannot be removed well or the sharp corners are not removed cleanly, which affects the roundness of the surface of the edge portion 10 of the manufactured glass cover plate 100; if the vertical etching rate V11 of the first etching is too large, it is not easy to control the removal amount of the edge portion 10a to be processed, which affects the accuracy of the edge portion 10a to be processed of the glass cover plate 100.

[0084] Optionally, when the first etching is performed, the amount of the edge portion 10a to be processed is removed in a range of 5 μm to 20 μm. Specifically, when the first etching is performed, the amount of the edge portion 10a to be processed can be but is not limited to 5 μm, 6 μm, 8 μm, 10 μm, 12 μm, 16 μm, 18 μm, 20 μm, etc. When the first etching is performed, the amount of the edge portion 10a to be processed is too small, the sharp corners of the edge portion 10a to be processed cannot be removed well or the sharp corners are not removed cleanly, affecting the roundness of the surface of the edge portion 10 of the manufactured glass cover plate 100; when the first etching is performed, the amount of the edge portion 10a to be processed is too large, which increases the processing time and reduces the processing efficiency.

[0085] Optionally, the time of the first etching ranges from 40s to 80s. Specifically, the time of the first etching may be, but is not limited to, 40s, 50s, 60s, 70s, 80s, etc. If the time of the first etching is too long, the removal amount of the edge portion 10a to be processed is not well controlled, which reduces the accuracy of the removal amount. If the time of the first etching is too short, the sharp corners or acute angles of the edge portion 10a to be processed are not cleanly processed, which affects the roundness of the surface of the edge portion 10 of the manufactured glass cover plate 100.

[0086] In this embodiment, after CNC grinding, the first etching treatment is performed on the edge portion 10a to be processed of the CNC-ground glass substrate 100a, so that the surface of the edge portion 10 of the obtained glass cover plate 100 can be more rounded, and the pits or defects on the surface of the edge portion 10 can be further reduced, thereby reducing the surface roughness of the edge portion 10 of the glass cover plate 100.

[0087] See also Figure 7 Another embodiment of the present application provides a method for processing a glass cover plate 100, which includes:

[0088] S301, providing a glass substrate 100a, wherein the glass substrate 100a has an edge portion 10a to be processed;

[0089] S302, performing CNC machining on the edge portion 10a to be processed of the glass substrate 100a;

[0090] S303, performing CNC grinding on the edge portion 10a to be processed of the CNC-processed glass substrate 100a;

[0091] S304, performing a first etching on the edge portion 10a to be processed of the glass substrate 100a that has been numerically controlled polished, so as to passivate the edge portion 10a to be processed; and

[0092] For a detailed description of S301 to S304 , please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0093] S305 , polishing the edge portion 10a to be processed of the glass substrate 100a after the first etching with a polishing liquid, wherein the polishing liquid comprises a polishing medium, and the median particle size D50 of the polishing medium is in the range of 1 μm≤D50≤4 μm.

[0094] Optionally, the median particle size D50 of the polishing medium may be, but is not limited to, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, etc. If the median particle size of the polishing medium is too small, the polishing efficiency is reduced, and if the polishing median particle size is too large, it is easy to leave micro scratches on the surface of the edge portion 10a to be processed, reducing the mechanical strength of the edge portion 10 and reducing the risk of the obtained glass cover plate 100 breaking when it falls.

[0095] Optionally, the polishing medium may be, but is not limited to, at least one of cerium oxide, silicon oxide, and the like.

[0096] Optionally, the material of the polishing wheel (ie, polishing consumables) may be, but is not limited to, carpet or sponge.

[0097] In this embodiment, after the edge portion 10a to be processed is first etched, polishing is performed, so that the pits or curves on the surface of the edge portion 10a to be processed can be better removed, and the surface roughness of the edge portion 10 of the manufactured glass cover plate 100 can be further reduced, so that the manufactured glass cover plate 100 has better mechanical strength and reduces the risk of breakage of the glass cover plate 100 when it falls.

[0098] See also Figure 8 Another embodiment of the present application provides a method for processing a glass cover plate 100, which includes:

[0099] S401, providing a glass substrate 100a, wherein the glass substrate 100a has an edge portion 10a to be processed;

[0100] S402, performing CNC machining on the edge portion 10a to be processed of the glass substrate 100a;

[0101] S403, performing CNC grinding on the edge portion 10a to be processed of the CNC-processed glass substrate 100a;

[0102] S404, performing a first etching on the edge portion 10a to be processed of the glass substrate 100a that has been numerically controlled polished, so as to passivate the edge portion 10a to be processed;

[0103] S405, using a polishing liquid to polish the edge portion 10a to be processed of the glass substrate 100a after the first etching; and

[0104] For a detailed description of S401 to S405 , please refer to the description of the corresponding parts of the above embodiment, which will not be repeated here.

[0105] S406, performing a second etching on the edge portion 10a to be processed of the polished glass substrate 100a to form a chamfer (also known as a C angle) on the edge portion 10a to be processed, wherein the ratio of the vertical etching rate V21 of the second etching to the side etching rate V22 of the second etching is in the range of: 0.1≤V21 / V22≤0.25.

[0106] It can be understood that the edge portion 10a to be processed of the polished glass substrate 100a is subjected to a second etching in a first etching solution, and the vertical etching rate and the side etching rate of the second etching are controlled so that the edge portion 10a to be processed forms a C angle, thereby obtaining a glass cover plate 100.

[0107] Optionally, the second etching solution may be, but is not limited to, a hydrofluoric acid aqueous solution, and the mass concentration of the hydrofluoric acid aqueous solution is 0.3% to 1%; specifically, the mass concentration of the hydrofluoric acid aqueous solution may be, but is not limited to, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, etc. If the concentration of the hydrofluoric acid aqueous solution is too high, the side etching rate V22 of the second etching is too small, the chamfer of the edge 10 of the manufactured glass cover plate 100 is too small, the bending performance of the glass cover plate 100 is reduced, and the risk of stress cracking of the glass cover plate 100 is increased; if the concentration of the hydrofluoric acid aqueous solution is too low, the test rate V22 of the second etching is too large, the chamfer of the edge 10 of the manufactured glass cover plate 100 is too large, the edge 10 of the glass cover plate 100 is too sharp, and the mechanical strength of the glass cover plate 100 is reduced.

[0108] Optionally, the concentration of the second etching solution is less than the concentration of the first etching solution.

[0109] Optionally, a vertical etching rate V21 of the second etching is less than a lateral etching rate V22 of the second etching.

[0110] Specifically, the ratio V21 / V22 of the vertical etching rate V21 of the second etching to the side etching rate V22 of the second etching may be, but is not limited to, 0.1, 0.13, 0.15, 0.18, 0.2, 0.23, 0.25, etc. If the ratio of the vertical etching rate V21 of the second etching to the side etching rate V22 of the second etching is too small, it means that the side etching rate V22 of the second etching is relatively large, and the chamfer of the edge 10 of the manufactured glass cover plate 100 is too large, so that the edge 10 of the manufactured glass cover plate 100 is too sharp, which reduces the mechanical strength of the glass cover plate 100; if the ratio of the vertical etching rate V21 of the second etching to the side etching rate V22 of the second etching is too large, it means that the side etching rate V22 of the second etching is relatively small, and the chamfer of the edge 10 of the manufactured glass cover plate 100 is too small, which reduces the bending performance of the glass cover plate 100 and increases the risk of stress cracking of the glass cover plate 100.

[0111] Optionally, the vertical etching rate V21 of the second etching is in the range of: 0.5 μm / min≤V21≤2 μm / min. Specifically, the vertical etching rate V21 of the second etching may be, but is not limited to, 0.5 μm / min, 0.6 μm / min, 0.8 μm / min, 1.0 μm / min, 1.2 μm / min, 1.4 μm / min, 1.6 μm / min, 1.8 μm / min, 2 μm / min, etc. The vertical etching rate V21 of the second etching is too large, which increases the ratio of the vertical etching rate to the side etching rate, so that the chamfer of the edge 10 of the glass cover plate 100 is too small, which reduces the bending performance of the glass cover plate 100 and increases the risk of stress cracking of the glass cover plate 100.

[0112] Optionally, when the second etching is performed, the amount of removal of the edge portion 10a to be processed ranges from 1 μm to 5 μm. Specifically, when the second etching is performed, the amount of removal of the edge portion 10a to be processed can be, but is not limited to, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, etc. When the second etching is performed, if the amount of removal of the edge portion 10a to be processed is too small, it means that the etching depth is too shallow, and the chamfer of the edge portion 10 of the glass cover plate 100 is too small, which reduces the bending performance of the glass cover plate 100 and increases the risk of stress cracking of the glass cover plate 100; when the second etching is performed, if the amount of removal of the edge portion 10a to be processed is too large, it means that the etching depth is too deep, and the chamfer of the edge portion 10 of the glass cover plate 100 is too large, so that the edge portion 10 of the glass cover plate 100 is too sharp, which reduces the mechanical strength of the glass cover plate 100.

[0113] Optionally, the second etching time ranges from 5 min to 10 min. Specifically, the second etching time may be, but is not limited to, 5 min, 6 min, 7 min, 8 min, 9 min, 10 min, etc. If the second etching time is too long, the chamfer of the edge portion 10 of the manufactured glass cover plate 100 is too large, so that the edge portion 10 of the manufactured glass cover plate 100 is too sharp, which reduces the mechanical strength of the glass cover plate 100; if the second etching time is too short, the chamfer of the edge portion 10 of the manufactured glass cover plate 100 is too small, which reduces the bending performance of the glass cover plate 100 and increases the risk of stress cracking of the glass cover plate 100.

[0114] Please see again Figure 2 Optionally, the chamfer α of the edge 10 of the glass cover plate 100 manufactured in the present application is in the range of 10°≤α≤30°. Specifically, the chamfer α of the edge 10 of the glass cover plate 100 may be, but is not limited to, 10°, 13°, 15°, 18°, 20°, 23°, 25°, 28°, 30°, etc. If the chamfer of the edge 10 of the glass cover plate 100 is too small, the bending performance of the glass cover plate 100 is reduced, and the risk of the glass cover plate 100 being cracked under stress is increased; if the chamfer of the edge 10 of the glass cover plate 100 is too large, the edge 10 of the manufactured glass cover plate 100 is too sharp, and the mechanical strength of the glass cover plate 100 is reduced.

[0115] The “chamfer angle α” in the present application refers to the angle between the line connecting the two end points of the chamfered arc surface of the edge portion 10 and the right angle of the extended plane of the glass cover plate 100 .

[0116] In this embodiment, after polishing, the edge portion 10a to be processed of the polished glass substrate 100a is subjected to a second etching treatment, so that a chamfer can be formed on the edge portion 10 of the obtained glass cover plate 100, thereby better preventing the glass cover plate 100 from colliding with the folding mechanism when the glass cover plate 100 is assembled in the foldable mechanism of the foldable electronic device, thereby damaging the glass cover plate 100. In addition, the chamfer can also better avoid stress concentration when the glass cover plate 100 is hit, thereby greatly improving the mechanical strength of the glass cover plate 100 and reducing the risk of breakage when the glass cover plate 100 falls.

[0117] See also Fig. 9 The embodiment of the present application further provides a glass cover plate 100, wherein the glass cover plate 100 has an edge portion 10, and the edge portion 10 is obtained by the processing method described in the above embodiment of the present application.

[0118] The glass cover plate 100 of the embodiment of the present application adopts a glass substrate 100a. The edge portion 10a to be processed of the glass substrate 100a is first subjected to CNC machining, and then the edge portion 10a to be processed of the glass substrate 100a is subjected to CNC grinding. During the CNC grinding, surface pits or defects caused by edge collapse during CNC machining of the edge portion 10a to be processed can be removed, and the surface roughness of the edge portion 10a to be processed can be reduced, so that the glass cover plate 100 has better mechanical strength and the risk of breakage of the glass cover plate 100 when it falls is reduced.

[0119] Optionally, the range of the surface roughness Ra of the edge portion 10 is: 20nm≤Ra≤50nm. Specifically, the surface roughness Ra of the edge portion 10 can be, but is not limited to, 20nm, 25nm, 30nm, 35nm, 40nm, 45nm, 50nm. The edge portion 10 of the glass cover plate 100 of the present application has a lower surface roughness, and there are almost no pits or defects on the surface caused by edge collapse during CNC processing, so that the stress concentration of the glass cover plate 100 when subjected to external force can be better avoided, so that the glass cover plate 100 has better mechanical strength, and the risk of breakage of the glass cover plate 100 when it falls is reduced.

[0120] The glass cover plate 100 and the preparation method thereof of the present application are further described below through specific embodiments.

[0121] Example 1

[0122] The glass cover plate 100 of this embodiment is prepared by the following steps:

[0123] 1) providing two sheets of rigid glass 200a and 10 layers of glass substrate 100a, and stacking the 10 layers of glass substrate 100a in sequence and placing them between the two sheets of rigid glass 200a to form a laminated glass 300a;

[0124] 2) performing first CNC machining, second CNC machining and third CNC machining on the edge portion 10a to be processed of the laminated glass 300a, wherein the mesh number of the first sand grain is 400 mesh, the mesh number of the second sand grain is 1200 mesh, and the mesh number of the third sand grain is 3000 mesh;

[0125] 3) performing CNC grinding on the edge portion 10a to be processed of the CNC machined glass substrate 100a, wherein the mesh number of the fourth sand grain is 10000 mesh;

[0126] 4) performing a first etching on the edge portion 10a to be processed of the glass substrate 100a that has been numerically polished to passivate the edge portion 10a to be processed, wherein the vertical etching rate V11 of the first etching is 6 μm / min, and the removal amount of the first etching is 3 μm;

[0127] 5) using a polishing liquid to polish the edge portion 10a to be processed of the glass substrate 100a after the first etching, wherein the polishing medium is cerium oxide, the D50 of the polishing medium is 1 μm, and the polishing consumable is carpet; and

[0128] 6) performing a second etching on the edge portion 10a to be processed of the polished glass substrate 100a to form a chamfer on the edge portion 10a to be processed, the vertical etching rate V21 of the second etching is 1 μm / min, and the removal amount of the second etching is 3 μm.

[0129] Example 2

[0130] The glass cover plate 100 of this embodiment is prepared by the following steps:

[0131] 1) providing two sheets of rigid glass 200a and 10 layers of glass substrate 100a, and stacking the 10 layers of glass substrate 100a in sequence and placing them between the two sheets of rigid glass 200a to form a laminated glass 300a;

[0132] 2) performing first CNC machining, second CNC machining and third CNC machining on the edge portion 10a to be processed of the laminated glass 300a, wherein the mesh number of the first sand grain is 400 mesh, the mesh number of the second sand grain is 1200 mesh, and the mesh number of the third sand grain is 3000 mesh;

[0133] 3) performing CNC grinding on the edge portion 10a to be processed of the CNC machined glass substrate 100a, wherein the mesh number of the fourth sand grain is 10000 meshes; and

[0134] 4) performing a second etching on the edge portion 10a to be processed of the polished glass substrate 100a to form a chamfer on the edge portion 10a to be processed, the vertical etching rate V21 of the second etching is 1 μm / min, and the removal amount of the second etching is 3 μm.

[0135] Example 3

[0136] The glass cover plate 100 of this embodiment is prepared by the following steps:

[0137] 1) providing two sheets of rigid glass 200a and 10 layers of glass substrate 100a, and stacking the 10 layers of glass substrate 100a in sequence and placing them between the two sheets of rigid glass 200a to form a laminated glass 300a;

[0138] 2) performing first CNC machining, second CNC machining and third CNC machining on the edge portion 10a to be processed of the laminated glass 300a, wherein the mesh number of the first sand grain is 400 mesh, the mesh number of the second sand grain is 1200 mesh, and the mesh number of the third sand grain is 3000 mesh;

[0139] 3) performing CNC grinding on the edge portion 10a to be processed of the CNC machined glass substrate 100a, wherein the mesh number of the fourth sand grain is 10000 mesh;

[0140] 4) polishing the edge portion 10a to be processed of the glass substrate 100a after the first etching using a polishing liquid, wherein the polishing medium is cerium oxide, the D50 of the polishing medium is 1 μm, and the polishing consumable is carpet; and

[0141] 5) performing a second etching on the edge portion 10a to be processed of the polished glass substrate 100a to form a chamfer on the edge portion 10a to be processed, the vertical etching rate V21 of the second etching is 1 μm / min, and the removal amount of the second etching is 3 μm.

[0142] Example 4

[0143] The glass cover plate 100 of this embodiment is prepared by the following steps:

[0144] 1) providing two sheets of rigid glass 200a and 10 layers of glass substrate 100a, and stacking the 10 layers of glass substrate 100a in sequence and placing them between the two sheets of rigid glass 200a to form a laminated glass 300a;

[0145] 2) performing first CNC machining, second CNC machining and third CNC machining on the edge portion 10a to be processed of the laminated glass 300a, wherein the mesh number of the first sand grain is 400 mesh, the mesh number of the second sand grain is 1200 mesh, and the mesh number of the third sand grain is 3000 mesh;

[0146] 3) performing CNC grinding on the edge portion 10a to be processed of the CNC machined glass substrate 100a, wherein the mesh number of the fourth sand grain is 10000 mesh;

[0147] 4) performing a first etching on the edge portion 10a to be processed of the glass substrate 100a that has been numerically polished to passivate the edge portion 10a to be processed, wherein the vertical etching rate V11 of the first etching is 6 μm / min, and the removal amount of the first etching is 3 μm; and

[0148] 5) performing a second etching on the edge portion 10a to be processed of the polished glass substrate 100a to form a chamfer on the edge portion 10a to be processed, the vertical etching rate V21 of the second etching is 1 μm / min, and the removal amount of the second etching is 3 μm.

[0149] Comparative Example 1

[0150] The glass cover plate 100 of this comparative example is prepared by the following steps:

[0151] 1) providing two sheets of rigid glass 200a and 10 layers of glass substrate 100a, and stacking the 10 layers of glass substrate 100a in sequence and placing them between the two sheets of rigid glass 200a to form a laminated glass 300a;

[0152] 2) performing first CNC machining, second CNC machining and third CNC machining on the edge portion 10a to be processed of the laminated glass 300a, wherein the mesh number of the first sand grain is 400 mesh, the mesh number of the second sand grain is 1200 mesh, and the mesh number of the third sand grain is 3000 mesh; and

[0153] 3) performing a second etching on the edge portion 10a to be processed of the polished glass substrate 100a to form a chamfer on the edge portion 10a to be processed, the vertical etching rate V21 of the second etching is 1 μm / min, and the removal amount of the second etching is 3 μm.

[0154] Comparative Example 2

[0155] The glass cover plate 100 of this comparative example is prepared by the following steps:

[0156] 1) providing two sheets of rigid glass 200a and 10 layers of glass substrate 100a, and stacking the 10 layers of glass substrate 100a in sequence and placing them between the two sheets of rigid glass 200a to form a laminated glass 300a;

[0157] 2) performing first CNC machining, second CNC machining and third CNC machining on the edge portion 10a to be processed of the laminated glass 300a, wherein the mesh number of the first sand grain is 400 mesh, the mesh number of the second sand grain is 400 mesh, and the mesh number of the third sand grain is 1200 mesh;

[0158] 3) performing a first etching on the edge portion 10a to be processed of the glass substrate 100a that has been numerically polished to passivate the edge portion 10a to be processed, wherein the vertical etching rate V11 of the first etching is 6 μm / min, and the removal amount of the first etching is 3 μm;

[0159] 4) performing a second etching on the edge portion 10a to be processed of the polished glass substrate 100a to form a chamfer on the edge portion 10a to be processed, the vertical etching rate V21 of the second etching is 1 μm / min, and the removal amount of the second etching is 3 μm.

[0160] Comparative Example 3

[0161] The glass cover plate 100 of this comparative example is prepared by the following steps:

[0162] 1) providing two sheets of rigid glass 200a and 10 layers of glass substrate 100a, and stacking the 10 layers of glass substrate 100a in sequence and placing them between the two sheets of rigid glass 200a to form a laminated glass 300a;

[0163] 2) performing first CNC machining, second CNC machining and third CNC machining on the edge portion 10a to be processed of the laminated glass 300a, wherein the mesh number of the first sand grain is 400 mesh, the mesh number of the second sand grain is 400 mesh, and the mesh number of the third sand grain is 400 mesh;

[0164] 3) polishing the edge portion 10a to be processed of the glass substrate 100a after the first etching using a polishing liquid, wherein the polishing medium is cerium oxide, the D50 of the polishing medium is 1 μm, and the polishing consumable is carpet; and

[0165] 4) performing a second etching on the edge portion 10a to be processed of the polished glass substrate 100a to form a chamfer on the edge portion 10a to be processed, the vertical etching rate V21 of the second etching is 1 μm / min, and the removal amount of the second etching is 3 μm.

[0166] The depth of the surface pits or defects of the glass cover plate 100 prepared in the above-mentioned embodiments and comparative examples was observed using an optical microscope; and the surface roughness of the edge portion 10 was measured using a white light interferometer. The specific measurement results are shown in Table 1 below.

[0167] Table 1 Process parameters of each step in each embodiment and comparative example and performance parameters of the glass cover plate 100

[0168]

[0169] From the test results of Example 1 and Comparative Example 1 in Table 1 above, it can be seen that compared with the solution of directly performing the second etching to form the C angle after CNC machining in Comparative Example 1, after CNC machining, CNC grinding is performed and then the second etching is performed to form the C angle, the roughness of the edge portion 10 of the obtained glass cover plate 100 is lower, the depth of the depression of the edge portion 10 is shallower, and it has better bending performance and a smaller bending radius.

[0170] It can be seen from the test results of Example 2 and Example 3 that after CNC machining and CNC grinding, the edge portion 10a to be processed of the glass substrate 100a is polished, and then the second etching is performed, which can better reduce the surface roughness of the edge portion 10 of the obtained glass cover plate 100, reduce the depth of the recess of the edge portion 10, improve the bending performance of the glass cover plate 100, and reduce the bending radius of the glass cover plate 100.

[0171] It can be seen from the test results of Example 2 and Example 4 that after CNC machining and CNC grinding, the edge portion 10a to be processed of the glass substrate 100a is first etched and then etched again, which can better reduce the surface roughness of the edge portion 10 of the obtained glass cover plate 100, reduce the depth of the depression of the edge portion 10, improve the bending performance of the glass cover plate 100, and reduce the bending radius of the glass cover plate 100.

[0172] It can be seen from the test results of Example 4 and Comparative Example 2 that, compared with the two-stage segmented CNC machining and then the first etching and the second etching in Comparative Example 2, the three-stage segmented CNC machining is performed in Example 4, followed by CNC grinding, and then the first etching and the second etching. The surface roughness of the edge portion 10 of the glass cover plate 100 is obtained, the depth of the depression of the edge portion 10 is reduced, the bending performance of the glass cover plate 100 is improved, and the bending radius of the glass cover plate 100 is reduced.

[0173] It can be seen from the test results of Example 3 and Comparative Example 3 that, compared with the one-stage CNC machining followed by polishing and then the second etching in Comparative Example 3, the three-stage CNC machining followed by CNC grinding, polishing and the second etching in Example 3 can improve the surface roughness of the edge portion 10 of the glass cover plate 100, reduce the depth of the depression of the edge portion 10, improve the bending performance of the glass cover plate 100, and reduce the bending radius of the glass cover plate 100.

[0174] See also Fig.10 and Fig.11 The embodiment of the present application also provides a flexible display assembly 200, which includes: a flexible display 210 and a glass cover plate 100 of the embodiment of the present application, the flexible display 210 has a display surface 211, and the glass cover plate 100 is stacked on the display surface 211 of the flexible display 210 to protect the flexible display 210.

[0175] Optionally, the flexible display screen 210 may be, but is not limited to, an organic flexible display screen 210 , such as an active matrix organic light emitting diode (AMOLED).

[0176] Optionally, the flexible display screen 210 may be bonded to the glass cover plate 100 by using an adhesive having high light transmittance such as optical adhesive.

[0177] For a detailed description of the glass cover 100 , please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0178] It can be understood that the flexible display assembly 200 in this embodiment is only one form of the flexible display assembly 200 applied to the glass cover 100, and should not be understood as a limitation on the flexible display assembly 200 provided in this application, nor should it be understood as a limitation on the glass cover 100 provided in each embodiment of this application. For a detailed description of the glass cover 100, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0179] See also Figure 12 to Figure 14 The embodiment of the present application further provides a foldable electronic device 300, which includes: the flexible display assembly 200 of the embodiment of the present application, a foldable mechanism 310 and a processor 330, wherein the foldable mechanism 310 is used to carry the flexible display assembly 200 and to drive the flexible display assembly 200 to fold (such as Fig.13 as shown) or flattened (as Fig.12 As shown), wherein the glass cover plate 100 of the flexible display screen assembly 200 is farther away from the foldable mechanism 310 than the flexible display screen 210 of the flexible display screen assembly 200; the processor 330 is electrically connected to the flexible display screen assembly 200 for controlling the flexible display screen assembly 200 for display.

[0180] The foldable electronic device 300 of the embodiment of the present application may be, but is not limited to, a portable foldable electronic device 300 with a variable display screen size, such as a foldable mobile phone, a foldable tablet computer, a foldable e-reader, and a foldable laptop computer. It can be understood that the foldable electronic device 300 in this embodiment is only a form of the foldable electronic device 300 applied by the flexible display screen assembly 200, and should not be understood as a limitation on the foldable electronic device 300 provided in the present application, nor should it be understood as a limitation on the flexible display screen assembly 200 provided in each embodiment of the present application. For a detailed description of the flexible display screen assembly 200, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0181] For a detailed description of the flexible display screen assembly 200 , the glass cover plate 100 , etc., please refer to the description of the corresponding parts of the above embodiments, which will not be repeated here.

[0182] In some embodiments, the foldable mechanism 310 includes a first carrier 311, a connecting shaft 313 and a second carrier 315 that are movably connected in sequence; the first carrier 311, the connecting shaft 313 and the second carrier 315 are used to support the flexible display assembly 200 and drive the flexible display assembly 200 to fold or unfold; the foldable mechanism 310 has a flattened state and a folded state. When the foldable mechanism 310 is in the flattened state, the first carrier 311, the connecting member and the second carrier 315 form a planar structure; when the foldable mechanism 310 is in the folded state, the first carrier 311 overlaps with the second carrier 315 and drives the flexible display assembly 200 to fold.

[0183] It can be understood that the orthographic projection of the surface of the foldable mechanism 310 of the flexible display assembly 200 facing the flexible display assembly 200 falls within the range of the surface of the foldable mechanism 310 facing the flexible display assembly 200 .

[0184] Optionally, the processor 330 includes one or more general-purpose processors, wherein the general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, and an ASIC, etc. The processor 330 is used to execute various types of digital storage instructions, such as software or firmware programs stored in a memory, which enables the computing device to provide a wide variety of services.

[0185] Optionally, the foldable electronic device 300 of the present application further includes a memory 350. The memory 350 is electrically connected to the processor 330 and is used to store program codes required for the processor 330 to run, program codes required for controlling the flexible display assembly 200, display content of the flexible display assembly 200, and the like.

[0186] Optionally, the memory 350 may include a volatile memory, such as a random access memory (RAM); the memory 350 may also include a non-volatile memory (NVM), such as a read-only memory (ROM), a flash memory (FM), a hard disk (DOLDD) or a solid-state drive (SSD). The memory 350 may also include a combination of the above-mentioned types of memory.

[0187] In some embodiments, the foldable electronic device 300 of the embodiment of the present application further includes a camera module 370, which is carried by the foldable mechanism 310. The camera module 370 is electrically connected to the processor 330, and is used to take pictures under the control of the processor 330.

[0188] Optionally, the camera module 370 may be a rear camera module 370 or a front camera module 370. This application does not make any specific limitation.

[0189] Mentioning "embodiment" and "implementation method" in this application means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in the various embodiments of the present application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of the present application, provided that there is no contradiction between them.

[0190] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the above preferred implementation modes, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A method for processing a glass cover plate, characterized in that: include: Providing a glass substrate having an edge portion to be processed; Performing CNC machining on the edge portion to be processed of the glass substrate; as well as The edge portion to be processed of the glass substrate processed by the numerical control is subjected to numerical control grinding.

2. The method for processing a glass cover plate according to claim 1, characterized in that: The method of numerically controlling the edge of the glass substrate to be processed comprises: Using a first grinding wheel to perform first CNC machining on the edge portion to be processed of the glass substrate, wherein the first grinding wheel has first sand grains; Using a second grinding wheel to perform second CNC machining on the edge portion to be processed of the glass substrate, wherein the second grinding wheel has second sand grains, and the mesh number of the first sand grains is smaller than the mesh number of the second sand grains; and A third grinding wheel is used to perform third numerical control machining on the edge portion to be processed of the glass substrate, wherein the third grinding wheel has third sand grains, and the mesh number of the second sand grains is smaller than the mesh number of the third sand grains.

3. The method for processing a glass cover plate according to claim 2, characterized in that: The step of performing CNC grinding on the edge portion to be processed of the CNC-processed glass substrate comprises: The edge portion of the glass substrate to be processed after the CNC processing is CNC-grinded by using sandpaper, wherein the sandpaper comprises fourth sand grains, and the mesh number of the fourth sand grains is greater than the mesh number of the third sand grains.

4. The method for processing a glass cover plate according to claim 2, characterized in that: The mesh number M1 of the first sand particles is in the range of 250 mesh ≤ M1 ≤ 500 mesh; the mesh number M2 of the second sand particles is in the range of 1000 mesh ≤ M2 ≤ 1500 mesh; the mesh number M3 of the third sand particles is in the range of 2500 mesh ≤ M3 ≤ 3500 mesh.

5. The method for processing a glass cover plate according to claim 3, characterized in that: The mesh number M4 of the fourth sand particles is in the range of 8000 mesh ≤ M4 ≤ 10000 mesh.

6. The method for processing a glass cover plate according to claim 1, characterized in that: After the CNC grinding is performed on the edge portion to be processed of the CNC-processed glass substrate, the processing method further comprises: The edge portion to be processed of the glass substrate that has been numerically polished is first etched to passivate the edge portion to be processed; wherein the ratio of the vertical etching rate V11 of the first etching to the side etching rate V12 of the first etching is in the range of: 4≤V11 / V12≤10.

7. The method for processing a glass cover plate according to claim 6, characterized in that: After first etching the edge portion to be processed of the glass substrate that has been numerically polished, the processing method further includes: The edge portion to be processed of the glass substrate after the first etching is polished by using a polishing liquid, wherein the polishing liquid comprises a polishing medium, and the median particle size D50 of the polishing medium is in the range of 1 μm≤D50≤4 μm.

8. The method for processing a glass cover plate according to claim 7, characterized in that: After polishing the edge portion to be processed of the glass substrate after the first etching, the processing method further includes: The polished edge portion of the glass substrate is subjected to a second etching to form a chamfer on the edge portion to be processed, wherein the ratio of the vertical etching rate V21 of the second etching to the side etching rate V22 of the second etching is in the range of 0.1≤V21 / V22≤0.

25.

9. A glass cover plate, characterized in that: The glass cover plate has an edge portion, and the edge portion is obtained by the processing method according to any one of claims 1 to 8.

10. The glass cover plate according to claim 9, characterized in that: The range of the surface roughness Ra of the edge portion is: 20nm≤Ra≤50nm.

11. A flexible display screen assembly, characterized in that: include: A flexible display screen having a display surface; as well as The glass cover plate according to claim 9 or 10 is stacked on the display surface of the flexible display screen to protect the flexible display screen.

12. A foldable electronic device, characterized in that: include: The flexible display screen assembly according to claim 11; A foldable mechanism, which is disposed on a side of the flexible display screen assembly facing away from the glass cover plate, and is used to carry the flexible display screen assembly and drive the flexible display screen assembly to be folded or flattened; as well as A processor is electrically connected to the flexible display screen assembly and is used to control the flexible display screen assembly to display.

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