A thermosetting resin composition, a resin adhesive film and applications thereof
By combining benzocyclobutene resin with inorganic fillers treated with unsaturated group coupling agents, the problems of insufficient dielectric properties and adhesion in printed circuit boards are solved, and high-frequency, high-speed and high-reliability resin films are realized, which are suitable for the preparation of printed circuit boards by semi-addition or addition methods.
CN119490631BActive Publication Date: 2026-05-29GUANGDONG SHENGYI SCI TECH
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- GUANGDONG SHENGYI SCI TECH
- Filing Date
- 2023-08-15
- Publication Date
- 2026-05-29
Smart Images
Figure CN119490631B_ABST
Abstract
The application provides a thermosetting resin composition, a resin adhesive film and application thereof. The thermosetting resin composition comprises the following components in parts by mass: 5-95 parts of a benzocyclobutene resin, 5-95 parts of a component containing a C=C unsaturated bond, 5-300 parts of a modified filler, and 0.1-10 parts of an initiator. The modified filler is an inorganic filler treated on the surface by using an unsaturated group-containing coupling agent, wherein the unsaturated group is selected from any one or a combination of at least two of a styryl group, an acryloxy group, a methacryloxy group and a polybutadiene group. The resin adhesive film prepared from the thermosetting resin composition has excellent dielectric properties, low dielectric loss tangent Df, good dielectric stability, small change range of △Df (10 GHz) after HAST, high chemical copper bonding capacity, and can fully meet the performance requirements of high-frequency high-speed printed circuit boards prepared by a semi-additive method or an additive method.
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