Testing device for integrated optical path

Abstract

The invention discloses a testing device for an integrated optical path. The testing device comprises a circuit board, a base, a first optical transmission assembly and a second optical transmission assembly. The base is arranged on the circuit board and comprises a carrier plate and a frame body. The integrated optical path is arranged on the bearing surface of the carrier plate. The first optical transmission assembly is arranged on one side of the frame body and comprises a first transmission part, and the first transmission part is located at a first vertical level of the bearing surface. The second optical transmission assembly is arranged on the other side of the frame body and comprises a second transmission part, the second transmission part is located on a second vertical layer of the bearing surface, and the height of the second vertical layer is different from that of the first vertical layer.

Description

Technical Field

[0001] The present application relates to the field of electrical testing technology, and in particular to a testing device for integrated optical circuits. Background Art

[0002] Using photons to replace electrons in integrated circuits for calculations, using light as data transmission, and reducing the size to the chip level is an inevitable trend in the future. Integrated optical circuits, also known as optoelectronic integrated circuits (OEICs), are suitable for high-performance data exchange, long-distance interconnection, 5G facilities and computing equipment. Integrated optical circuits are the same as integrated circuits. They must be tested before or after packaging to screen good products and obtain various electrical characteristic parameters. However, there is currently a lack of testing equipment for integrated optical circuits or photonic chips that can meet customized designs. In view of this, how to provide a test device to match the design of integrated optical circuits for testing is an issue that needs to be solved urgently. Summary of the invention

[0003] The purpose of the present application is to provide a testing device that can provide diversified testing types according to different designs of the integrated optical circuit to be tested.

[0004] In order to achieve the above objectives, the technical solutions provided by this application are as follows:

[0005] According to one aspect of the present application, the present application provides a test device, the test device is electrically connected to a test machine, and the integrated optical circuit includes at least one light detection component and a light source module. The test device includes: a circuit board, electrically connected to the test machine; a base, arranged on the circuit board, and including a carrier and a frame, and the carrier includes a bearing surface, the frame is arranged around the bearing surface, and the integrated optical circuit is arranged on the bearing surface; a first optical transmission component, arranged on one side of the frame, and including a first transmission part, and the first transmission part is located at a first vertical level of the bearing surface; and a second optical transmission component, arranged on the other side of the frame, and including a second transmission part, and the second transmission part is located at a second vertical level of the bearing surface, and the height of the second vertical level is different from the height of the first vertical level.

[0006] Preferably, the frame body comprises a frame wall and a cover plate, the cover plate is arranged on the frame wall, and the frame wall is located between the carrier plate and the cover plate. The first optical transmission component is arranged on the frame wall, and the second optical transmission component is arranged on the cover plate.

[0007] Preferably, the first optical transmission component further comprises a first optical fiber, a first joint and a first connector, and the first connector is arranged on the frame wall, the first joint is fixed to one end of the first optical fiber, and is pluggably connected to the first connector. The first optical fiber comprises the first transmission part, the integrated optical circuit comprises a first optical waveguide, and the first optical fiber is parallel to and faces the first optical waveguide.

[0008] Preferably, the first transmission part is used to transmit a test optical signal, and the test optical signal is directly emitted from the first transmission part to the first optical waveguide and detected by the optical detection component, or the first transmission part is used to transmit the output optical signal generated by the light source module.

[0009] Preferably, the second optical transmission component includes a second optical fiber, a second connector and a second connector, the second connector is arranged between the cover plate and the frame wall, the second connector is fixed to one end of the second optical fiber and is pluggably connected to the second connector, and the second optical fiber includes the second transmission part, the second connector includes an optical channel, and the integrated optical circuit includes a second optical waveguide. The second transmission part is used to transmit a test optical signal, and the test optical signal is emitted from the top of the integrated optical circuit through the optical channel to the second optical waveguide and detected by the optical detection component, or the second transmission part is used to transmit the output light signal generated by the light source module.

[0010] Preferably, the second connector of the second optical transmission component includes a reflection wall, the reflection wall forms an acute angle with respect to the second optical fiber and the bearing surface, and the reflection wall includes a reflection material with a reflection coefficient greater than that of air, and the test light signal transmitted by the second transmission part is reflected to the second optical waveguide via the reflection wall, or the outgoing light signal is reflected to the second transmission part via the reflection wall.

[0011] Preferably, the cover plate includes an embedding groove, the embedding groove includes an inclined portion, the inclined portion forms an acute angle with respect to the second optical fiber and the bearing surface, and the inclined portion includes a reflective material with a reflection coefficient greater than that of air. A portion of the second connector is embedded in the embedding groove, and the optical channel contacts the inclined portion, and the test optical signal transmitted by the second transmission portion is reflected to the second optical waveguide via the inclined portion, or the outgoing optical signal is reflected to the second transmission portion via the inclined portion.

[0012] Preferably, the testing device further comprises a third light transmission component, which is disposed on the cover plate, and the third light transmission component comprises a third transmission part. The third transmission part is located at a third vertical level of the bearing surface, and the height of the third vertical level is different from the height of the first vertical level or the second vertical level.

[0013] Preferably, the third optical transmission component includes a third optical fiber, a third joint and a third connector, and the third connector is arranged on the cover plate, the third joint is fixed to one end of the third optical fiber and is pluggably connected to the third connector, and the third optical fiber includes the third transmission part, and the integrated optical circuit includes a third optical waveguide. The third transmission part is inclined to the bearing surface and is used to transmit a test optical signal, and the test optical signal is directly emitted from the top of the integrated optical circuit to the third optical waveguide and detected by the optical detection component, or the third transmission part is used to transmit the output light signal generated by the light source module.

[0014] Preferably, the third connector comprises a grating structure.

[0015] Preferably, the test device further comprises a fourth optical transmission component, which is arranged on the base, and the fourth optical transmission component comprises a fourth optical fiber, a fourth joint, a fourth connector and an internal optical fiber. The fourth joint is fixed to one end of the fourth optical fiber and pluggably connected to the fourth connector, one end of the internal optical fiber is connected to the fourth connector, and the other end is connected to the integrated optical circuit.

[0016] Preferably, the fourth connector is arranged on the carrier board, the other end of the internal optical fiber is pluggably connected to the integrated optical circuit, and the fourth optical fiber transmits the test optical signal to the integrated optical circuit through the internal optical fiber, or receives the output light signal generated by the light source module through the internal optical fiber.

[0017] The beneficial effects of the present application are as follows: in the test device provided in the present application, the first optical component, the second optical component, the third optical component and / or the fourth optical component are used in conjunction with each other, and the multiple optical components are arranged at different vertical levels on the supporting surface of the base to form a plurality of optical coupling patterns in different directions, thereby realizing the electrical testing requirements for various integrated optical circuit designs, and solving the problem that the existing single test equipment cannot test different integrated optical circuit designs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 Schematic diagram of the structure of a testing device for an integrated optical circuit according to an embodiment of the present application.

[0020] Figure 2This is a partial structural schematic diagram of the test device of this application.

[0021] Figure 3 This is a partial structural schematic diagram of the test device of this application.

[0022] Figure 4 This is a partial structural schematic diagram of the test device of this application.

[0023] Figure 5 This is a partial structural schematic diagram of the test device of this application.

[0024] Figure 6 It is a schematic diagram of the grating structure of the third light transmission component of the present application.

[0025] Figure 7 This is a partial structural schematic diagram of the test device of this application.

[0026] Figure 8 Schematic diagram of the structure of the testing device according to the embodiment of the present application.

[0027] Fig. 9 It is a structural schematic diagram of a testing device according to another embodiment of the present application.

[0028] Fig.10 It is a structural schematic diagram of a testing device according to another embodiment of the present application. DETAILED DESCRIPTION

[0029] The following is a detailed description of the embodiments in conjunction with the accompanying drawings, but the specific embodiments described are only used to explain the present invention and are not used to limit the present invention. The description of the structural operation is not used to limit the order of its execution. Any structure recombined by the components to produce a device with equal functions is within the scope of the disclosure of the present invention.

[0030] It should be noted that in the corresponding drawings of the embodiments, lines are used to represent signals. Some lines may be thicker to indicate signal paths of more components, and / or some lines may have arrows at one or more ends to indicate the main information flow direction. The indication is not intended to be restrictive. On the contrary, lines are used in conjunction with one or more exemplary embodiments to facilitate easier understanding of circuits or logic units. Any represented signal as specified by design requirements or preferences may actually include one or more signals that can travel in either direction, and may be implemented using any suitable type of signal scheme.

[0031] In the following text and in the claims, the term "coupled" and its derivatives may be used. The term "coupled" as used herein refers to two or more components that are in direct contact (physically, electrically, magnetically, optically, etc.). The term "coupled" as used herein may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other.

[0032] As used herein, unless otherwise specified, ordinal adjectives "first," "second," and "third," etc. used herein to describe general objects merely indicate different instances of similar objects being referred to and are not intended to imply that the objects so described must be in a given order in time, space, in arrangement, or in any other manner.

[0033] The present application provides a testing device for testing the electrical characteristics of an integrated optical circuit. Specifically, the integrated optical circuit refers to an electronic integrated circuit (EIC) including an electrical operation processor and a photonic integrated circuit (PIC) responsible for electro-optical conversion. Preferably, the integrated optical circuit may be co-packaged optics (CPO) that integrates the electronic integrated circuit and the photonic integrated circuit in a single package. It should be noted that the integrated optical circuit to be tested may include at least one light detection component and a light source module, and a plurality of active components and passive components, such as but not limited to a filter or selector structure, an optical power distribution structure, an optical fiber input and output structure, and an optical modulation structure. Since the features of the present application do not lie in the detailed structure of the optical active and passive components known to those familiar with the art, they are not described in detail here.

[0034] Reference Figure 1 , Figure 1 Schematic diagram of the structure of the testing device for the integrated optical circuit of the present application. The embodiment of the present application provides a testing device 1 for testing the electrical characteristics of the integrated optical circuit 3. In some embodiments, the testing device 1 can perform testing in the final test stage (final test, FT) after the integrated optical circuit 3 is packaged or in the chip probing stage (chip probing, CP) according to the different process stages of the integrated optical circuit 3 to be tested. In the embodiment of the present application, the integrated optical circuit 3 is made of a silicon on insulator (SOI) wafer and includes a substrate 301, an optical module 302 and an electronic module 303 (such as Figure 2 The test device 1 of the present application is electrically connected to a test machine 5 (as shown in FIG. Figure 1As shown), it may be an automatic test equipment (ATE) for detecting chip functional specifications. The test device 1 includes a circuit board 10, a base 20 and a plurality of optical transmission components disposed on the base 20. In some embodiments, the plurality of optical transmission components include a first optical transmission component 11, a second optical transmission component 12, a third optical transmission component 13 and / or a fourth optical transmission component 14. The base 20 is disposed on the circuit board 10 and is designed according to the size of the integrated optical circuit 3 to be tested and the position of the bump array. The circuit board 10 is electrically connected to the test machine 5 and is located between the top of the test machine 5 and the base 20, and is used to transmit electrical signals between the integrated optical circuit 3 and the test machine 5. In some embodiments, the circuit board 10 includes a plurality of probes 101 for contacting the bump array of the integrated optical circuit 3 to transmit the electrical signals of the integrated optical circuit 3 to the test machine 5. It is particularly noted that in Figure 1 In the figure, the positions of the first optical transmission component 11 , the second optical transmission component 12 , the third optical transmission component 13 and the fourth optical transmission component 14 on the base 20 are only for illustration, and the actual arrangement depends on the design of the integrated optical circuit 3 .

[0035] Please refer to Figure 1 In some embodiments, the base 20 has a substantially rectangular cross section and includes a carrier 21 and a frame 22. The frame 22 includes a frame wall 221 and a cover plate 222. Specifically, the frame wall 221 is arranged around the carrier 21 and is located between the carrier 21 and the cover plate 222, and the cover plate 222 can be arranged on the frame wall 221 in a covering manner. The carrier 21 includes a carrying surface 211, and together with the frame wall 221 and the cover plate 222, forms a receiving space 200. The integrated optical circuit 3 is arranged on the carrying surface 211, is located in the receiving space 200, and is surrounded by the frame wall 211 and the cover plate 222.

[0036] The first optical transmission component 11, the second optical transmission component 12, the third optical transmission component 13 and the fourth optical transmission component 14 of the embodiment of the present application use optical fiber as a medium to transmit optical signals. In some embodiments, the optical fiber can be a single-mode optical fiber, a polarization-maintaining optical fiber or a lens optical fiber, but is not limited to the types of the aforementioned optical fibers. The main wavelength of the optical fiber transmission is in the range of 1100 nanometers (nm) to 2000nm. Preferably, the wavelength is infrared light of 1550nm.

[0037] Reference Figure 2 , Figure 2 This is a partial structural diagram of the test device 1 of the present application, which is intended to illustrate the structural relationship between the first optical transmission component 11, the integrated optical circuit 3 and the base 20. Figure 2As shown, the first optical transmission component 11 is arranged on the frame wall 221, and includes a first optical fiber 111, a first connector 112 and a first connector 113. The first connector 113 is embedded in the frame wall 221 and is connected to the accommodating space 200. The first connector 112 is fixed to one end of the first optical fiber 111 and is pluggable and connected to the first connector 113. In some embodiments, the first connector 112 can be made of metal or ceramic material and have a structure such as a ferrule to provide good protection for the first optical fiber 111 and prevent the transmission of the signal from being affected by external factors. In other embodiments, the first connector 112 can have a V-groove grating structure so that the first optical fiber 111 is arranged in an optical fiber array to reduce the loss of the optical waveguide structure and the optical coupling alignment.

[0038] like Figure 2 As shown, specifically, the first optical fiber 111 includes a first transmission portion 110, which includes a core and a cladding (not shown), and the end of the first transmission portion 110 is located at a first vertical level VL1 of the bearing surface 211. In some embodiments, the integrated optical circuit 3 includes a first optical waveguide 31, which is composed of a material with a refractive index greater than that of air. In some embodiments, the optical waveguide of the integrated optical circuit 3 has a refractive index in the range of about 1.45 to about 3.45, and can be composed of a polymer material such as silicon, silicon oxide, silicon nitride, or silicon oxynitride, but is not limited thereto. The first transmission portion 110 is used to transmit a test optical signal, which is directly emitted from the first transmission portion 110 to the first optical waveguide 31, so that the test optical signal is then transmitted to the optical detection component 34 of the integrated optical circuit 3 through the first optical waveguide 31. It is particularly noted that when the first optical fiber 111 is single-mode, the first transmission portion 110 is parallel to and faces the first optical waveguide 31 at the first vertical level VL1, and is directly adjacent to the edge of the integrated optical circuit 3, so that the optical signal can be transmitted between the first transmission portion 110 and the first optical waveguide 31. In another embodiment, when the first optical fiber 111 is a lens fiber, the end of the lens fiber and the edge of the integrated optical circuit 3 are kept at a distance of about 10 microns to about 20 microns, so as to facilitate the refraction of light through the lens fiber into the first optical waveguide 31.

[0039] Reference Figure 3 , Figure 3 FIG. 2 is another schematic diagram of the structure of the test device 1, which is intended to illustrate the structural relationship between the second optical transmission component 12, the integrated optical circuit 3 and the base 20. Figure 3As shown, the second optical transmission component 12 is disposed on the cover plate 222, and includes a second optical fiber 121, a second connector 122 and a second connector 123, and the second connector 123 is disposed between the cover plate 222 and the frame wall 221, and is connected to the accommodating space 200. The second connector 122 is fixed to one end of the second optical fiber 121, and is pluggably connected to the second connector 123. In some embodiments, the shape of the second connector 122 may be the same as the shape of the first connector 112, which is not described in detail here. The second optical fiber 121 includes a second transmission portion 120, and the end of the second transmission portion 120 is located at the second vertical level VL2 of the bearing surface 211, and the height of the second vertical level VL2 is different from the height of the first vertical level VL1. In this embodiment, the second connector 123 includes an optical channel 124, and the integrated optical circuit 3 includes a second optical waveguide 32. Specifically, the second transmission portion 120 is used to transmit the test optical signal, which is emitted from the top of the integrated optical circuit 3 through the optical channel 124 to the second optical waveguide 32 and detected by the optical detection component 34. In some embodiments, the second optical waveguide 32 has a grating structure.

[0040] Please refer to Figure 3 The second connector 123 of the second optical transmission component 12 includes a reflective wall 125, and the reflective wall 125 forms an acute angle with respect to the second optical fiber 121 and the bearing surface 211. Preferably, the reflective wall 125 includes a reflective material with a reflection coefficient greater than that of air, and the test optical signal transmitted by the second transmission part 120 is reflected to the second optical waveguide 32 via the reflective wall 125 and detected by the optical detection component 34.

[0041] Reference Figure 4 , Figure 4 2 is another partial structural diagram of the test device 1, which is intended to illustrate the structural relationship between the second optical transmission component 12, the integrated optical circuit 3 and the base 20. In this embodiment, the cover plate 222 includes a groove 223, which is formed by the inner concave of the frame wall 221, and includes an inclined portion 224. Specifically, the inclined portion 224 forms an acute angle with respect to the second optical fiber 121 and the bearing surface 211, and the inclined portion 224 includes a reflective material with a reflection coefficient greater than that of air. Figure 4 As shown, part of the second connector 123 is embedded in the embedding groove 223 , and the optical channel 124 contacts the inclined portion 224 . With the above structure, the test optical signal transmitted by the second transmission portion 120 is reflected to the second optical waveguide 32 via the inclined portion 224 .

[0042] Reference Figure 5 , Figure 5 FIG. 2 is another schematic diagram of the structure of the test device 1, which is intended to illustrate the structural relationship between the third optical transmission component 13, the integrated optical circuit 3 and the base 20. Figure 5As shown, the third optical transmission component 13 is disposed on the cover plate 222, and includes a third optical fiber 131, a third connector 132 and a third connector 133. In this embodiment, the third connector 133 is obliquely embedded in the cover plate 222 and communicates with the accommodating space 200. In another embodiment, the third connector 133 can also be embedded in the cover plate 222 in a direction substantially perpendicular to the integrated optical circuit 3. It should be noted that the angle of the third connector 133 relative to the integrated optical circuit 3 depends on the design of the integrated optical circuit 3. The third connector 132 is fixed to one end of the third optical fiber 131 and is pluggably connected to the third connector 133, and the shape of the third connector 132 can be the same as the shape of the first connector 112, which will not be described in detail here. In this embodiment, the third optical fiber 131 includes a third transmission part 130, and the light-emitting end of the third transmission part 130 is located at the third vertical level VL3 of the bearing surface 211. In this embodiment, the height of the third vertical level VL3 is different from the height of the first vertical level VL1 or the second vertical level VL2. In addition, the integrated optical circuit 3 includes a third optical waveguide 33, which may have a grating structure. The third transmission portion 130 is used to transmit a test optical signal, and the test optical signal is directly emitted from the top of the integrated optical circuit 3 to the third optical waveguide 33 and detected by the optical detection component 34.

[0043] Reference Figure 6 In another embodiment, the third connector 132 of the third optical transmission component 13 may include a grating structure 134. Figure 6 As shown, the grating structure 134 includes a plurality of V-grooves 135 arranged in parallel, and the V-grooves 135 are used to set the exposed optical fiber portion. The third optical transmission component 13 can use the grating structure 134 to achieve optical coupling. In some embodiments, corresponding to the design of the third connector 132 having the grating structure 134, a tapered waveguide array can be formed on the integrated optical circuit 3 to effectively transmit the optical signal from the third optical transmission component 13.

[0044] Reference Figure 7 , Figure 7 This is another partial structural diagram of the test device 1, which is intended to illustrate the structural relationship between the fourth optical transmission component 14, the integrated optical circuit 3 and the base 20. In addition to using the optical coupling components of the first optical transmission component 11, the second optical transmission component 12 or the third optical transmission component 13 for optical coupling, the test device 1 of the present application can also transmit optical signals by pre-integrating optical fibers in the integrated optical circuit 3. Figure 7As shown, the fourth optical transmission component 14 includes a fourth optical fiber 141, a fourth connector 142, a fourth connector 143 and an internal optical fiber 144. In some embodiments, the fourth connector 143 is embedded in the carrier 21 and communicates with the accommodating space 200, and the fourth connector 143 may have a C-shaped kit for docking. The fourth connector 142 is fixed to one end of the fourth optical fiber 141 and is pluggably connected to the fourth connector 143, and the shape of the fourth connector 142 may be the same as the shape of the first connector 112, which will not be described in detail here. In some embodiments, the internal optical fiber 144 is located in the accommodating space 200, and one end of the internal optical fiber 144 is connected to the fourth connector 143, and the other end is pluggably connected to the integrated optical circuit 3. Through the above structure, the fourth optical fiber 141 transmits a test optical signal to the integrated optical circuit 3 through the internal optical fiber 144.

[0045] Reference Figure 8 , Figure 8 Schematic diagram of the structure of the test device 1 of one embodiment of the present application. The integrated optical circuit 3 (i.e., the photonic chip) generally includes a light detection component 34 and a light source module 35. The light detection component 34 is used to convert the optical signal into an electrical signal, and the light source module 35 is used to convert the electrical signal into an optical signal. In order to meet the different designs of the integrated optical circuit 3 to be tested, the base 20 of the test device 1 of the present application is provided with a plurality of optical transmission components. Figure 8 The test device 1 shown is provided with a first optical transmission component 11 on one side of the frame wall 221, which emits a test optical signal for the optical detection component 34 to receive and convert into an electrical signal. The test device 1 is provided with another first optical transmission component 11 on the opposite side of the frame wall 221, which is used to transmit the optical output signal converted from the electrical signal by the light source module 35. That is, in this embodiment, the test optical signal and the optical output signal are transmitted in the same direction. It should be noted that the positions of the test optical signal and the optical output signal mainly depend on the optical detection component 34 and the light source module 35 of the integrated optical circuit 3. In another embodiment, according to another design of the integrated optical circuit 3, the test device 1 may be provided with a first optical transmission component 11 on one side of the frame wall 221, and a second optical transmission component 12 on the opposite side of the frame wall 221, so as to realize different test types.

[0046] Reference Fig. 9 , Fig. 9 It is a schematic structural diagram of a testing device 1 according to another embodiment of the present application. Fig. 9The test device 1 shown is provided with a first optical transmission component 11 for emitting a test optical signal on one side of the frame wall 221, and a third optical transmission component 13 is provided on the cover plate 222 to transmit an outgoing optical signal converted from an electrical signal by the light source module 35. In this embodiment, the test optical signal is transmitted in a horizontal direction relative to the integrated optical circuit 3, and the outgoing optical signal is transmitted toward the third optical transmission component 13 above the integrated optical circuit 3 to achieve another test type. In some embodiments, the test optical signal can be transmitted by the first optical transmission component 11 or the second optical transmission component 12, and the outgoing optical signal can be transmitted by the fourth optical transmission component 14 (such as Figure 1 The positions of the test light signal and the output light signal are mainly determined by the light detection component 34 and the light source module 35 of the integrated optical circuit 3.

[0047] Reference Fig.10 , Fig.10 This is a schematic diagram of the structure of another embodiment of the test device 1 of the present application. According to the design of the integrated optical circuit 3, each side of the base 20 of the test device 1 can be provided with a plurality of first optical transmission components 11, or optical transmission components of other embodiments described above, to enhance signal transmission efficiency.

[0048] In the test device provided in the present application, the cooperation of the first optical component, the second optical component, the third optical component and / or the fourth optical component, and the multiple optical components are arranged at different vertical levels on the supporting surface of the base, to form a plurality of light coupling patterns in different directions, thereby realizing the electrical testing requirements for various integrated optical circuit designs, thereby solving the problem that the existing single test equipment cannot test different integrated optical circuit designs.

[0049] References to "an embodiment", "one embodiment", "some embodiments" or "other embodiments" in the specification mean that a particular feature, structure, or characteristic described in conjunction with the embodiment is included in at least some embodiments, but not necessarily in all embodiments. The various appearances of "an embodiment", "one embodiment" or "some embodiments" do not necessarily all refer to the same embodiment. If the specification states that a component, feature, structure, or characteristic "may", "might" or "can" be included, the specific component, feature, structure, or characteristic does not need to be included. If the specification or claims mention "one" or "an" component, it does not mean that there is only one of the component. If the specification or claims mention "an additional" component, it does not exclude the presence of more than one additional component.

[0050] Although the embodiments of the present application have been disclosed above, they are not intended to limit the present application. Anyone skilled in the art may make some changes and modifications without departing from the scope of the present application. Therefore, the scope of protection of the present application shall be defined by the scope of the patent application attached hereto.

Claims

1. A testing device for an integrated optical circuit, the testing device being electrically connected to a testing machine, the integrated optical circuit comprising at least one light detection component and a light source module, characterized in that: The testing device comprises: A circuit board, electrically connected to the test machine; A base, arranged on the circuit board, and comprising a carrier and a frame, wherein the carrier comprises a carrying surface, the frame is arranged around the carrying surface, and the integrated optical path is arranged on the carrying surface; A first light transmission component is disposed on one side of the frame and includes a first transmission portion, and the first transmission portion is located at a first vertical level of the bearing surface; and The second optical transmission component is disposed on the other side of the frame and includes a second transmission portion, and the second transmission portion is located at a second vertical level of the bearing surface, and the height of the second vertical level is different from the height of the first vertical level.

2. The testing device for the integrated optical circuit according to claim 1, characterized in that: The frame body includes a frame wall and a cover plate, wherein the cover plate is arranged on the frame wall, and the frame wall is located between the carrier plate and the cover plate, wherein the first optical transmission component is arranged on the frame wall, and the second optical transmission component is arranged on the cover plate.

3. The testing device for the integrated optical circuit according to claim 2, characterized in that: The first optical transmission component also includes a first optical fiber, a first joint and a first connector, and the first connector is arranged on the frame wall, the first joint is fixed to one end of the first optical fiber and is pluggably connected to the first connector, wherein the first optical fiber includes the first transmission part, the integrated optical circuit includes a first optical waveguide, and the first optical fiber is parallel to and faces the first optical waveguide.

4. The testing device for the integrated optical circuit according to claim 3, characterized in that: The first transmission part is used to transmit a test optical signal, and the test optical signal is directly emitted from the first transmission part to the first optical waveguide and detected by the optical detection component, or the first transmission part is used to transmit an output optical signal generated by the light source module.

5. The testing device for the integrated optical circuit according to claim 2, characterized in that: The second optical transmission component includes a second optical fiber, a second connector and a second connector, wherein the second connector is arranged between the cover plate and the frame wall, the second connector is fixed to one end of the second optical fiber and is pluggably connected to the second connector, and the second optical fiber includes the second transmission part, the second connector includes an optical channel, and the integrated optical circuit includes a second optical waveguide, wherein the second transmission part is used to transmit a test optical signal, and the test optical signal is emitted from the top of the integrated optical circuit through the optical channel to the second optical waveguide and is detected by the optical detection component, or the second transmission part is used to transmit an output optical signal generated by the light source module.

6. The testing device for the integrated optical circuit according to claim 5, characterized in that: The second connector of the second optical transmission component includes a reflection wall, the reflection wall forms an acute angle with respect to the second optical fiber and the bearing surface, and the reflection wall includes a reflection material with a reflection coefficient greater than that of air. The test light signal transmitted by the second transmission part is reflected to the second optical waveguide via the reflection wall, or the outgoing light signal is reflected to the second transmission part via the reflection wall.

7. The testing device for the integrated optical circuit according to claim 5, characterized in that: The cover plate includes an embedding groove, the embedding groove includes an inclined portion, the inclined portion forms an acute angle with respect to the second optical fiber and the bearing surface, and the inclined portion includes a reflective material with a reflection coefficient greater than that of air, wherein a portion of the second connector is embedded in the embedding groove, and the optical channel contacts the inclined portion, and the test optical signal transmitted by the second transmission portion is reflected to the second optical waveguide via the inclined portion, or the outgoing optical signal is reflected to the second transmission portion via the inclined portion.

8. The testing device for the integrated optical circuit as described in claim 2 further includes a third optical transmission component, which is arranged on the cover plate, and the third optical transmission component includes a third transmission part, wherein the third transmission part is located at a third vertical level of the bearing surface, and the height of the third vertical level is different from the height of the first vertical level or the second vertical level.

9. The testing device for the integrated optical circuit according to claim 8, characterized in that: The third optical transmission component includes a third optical fiber, a third joint and a third connector, and the third connector is arranged on the cover plate, the third joint is fixed to one end of the third optical fiber and is pluggably connected to the third connector, and the third optical fiber includes the third transmission part, and the integrated optical circuit includes a third optical waveguide, wherein the third transmission part is inclined to the bearing surface and is used to transmit a test optical signal, and the test optical signal is directly emitted from the top of the integrated optical circuit to the third optical waveguide and is detected by the optical detection component, or the third transmission part is used to transmit the output light signal generated by the light source module.

10. The testing device for the integrated optical circuit according to claim 8, characterized in that: The third connector comprises a grating structure.

11. The testing device for the integrated optical circuit as described in claim 2 further includes a fourth optical transmission component, which is arranged on the base, and the fourth optical transmission component includes a fourth optical fiber, a fourth joint, a fourth connector and an internal optical fiber, wherein the fourth joint is fixed to one end of the fourth optical fiber and is pluggably connected to the fourth connector, one end of the internal optical fiber is connected to the fourth connector, and the other end is connected to the integrated optical circuit.

12. The testing device for the integrated optical circuit according to claim 11, characterized in that: The fourth connector is arranged on the carrier board, the other end of the internal optical fiber is pluggably connected to the integrated optical circuit, and the fourth optical fiber transmits the test optical signal to the integrated optical circuit through the internal optical fiber, or receives the output light signal generated by the light source module through the internal optical fiber.

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