Test jig for semiconductor packaging test

Abstract

The invention relates to the field of semiconductor testing, and discloses a testing frame for semiconductor packaging testing, which comprises a testing box mechanism, a hydraulic mechanism, a testing frame mechanism, a temperature adjusting mechanism, a ventilation mechanism and a temperature detection sensor, and is characterized in that the testing box mechanism is hollow, and the hydraulic mechanism is fixedly connected in the testing box mechanism; the test frame mechanism is fixedly connected to the inner shell of the test box mechanism, the temperature adjusting mechanisms are fixedly connected to the two sides of the inner shell of the test box mechanism, the ventilation mechanism is fixedly connected to the inner shell and the outer shell of the test box mechanism, and the temperature detection sensor is fixedly connected to the inner shell of the test box mechanism. According to the invention, the temperature change is adjusted through the temperature adjusting mechanism, the falling and deformation conditions of the element at different temperatures are measured, and the springback test is carried out at different temperatures, so that the precision problem caused by manual intervention factors is reduced, and the reliability and safety of the product are improved while the test efficiency is improved.

Description

Technical Field

[0001] The invention relates to the field of semiconductor testing, in particular to a test rack for semiconductor packaging testing. Background Art

[0002] The semiconductor packaging test rack is a device used to fix and connect integrated circuit chips during the semiconductor packaging test process. Its basic functions include ensuring a stable electrical connection between the test rack and the chip to be tested for functional, performance and reliability testing. The working principle is based on its designed mechanical structure and electrical connection method. It connects to the pins or pads of the chip through the contactor, transmits test signals and power, and receives the chip's response signals, which are then analyzed by the test equipment to evaluate the performance of the chip.

[0003] Existing semiconductor packaging testing technology only performs simple bending and tensile tests at room temperature, and traditional testing methods mainly rely on manual operation and visual inspection. The testing efficiency is low and prone to errors. The test accuracy is low due to human factors and it is difficult to meet high-precision testing needs. Summary of the invention

[0004] 1. Technical issues to be resolved In view of the deficiencies in the prior art, the present invention provides a test stand for semiconductor packaging testing, which has the advantages of accurate simulation of different temperatures, automated test process and high test precision, and solves the problems in the above-mentioned background technology.

[0005] (II) Technical solution To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a test rack for semiconductor packaging testing, comprising a test box mechanism, a hydraulic mechanism, a test rack mechanism, a temperature adjustment mechanism, a ventilation mechanism and a temperature detection sensor, wherein the test box mechanism is hollow, the hydraulic mechanism is fixedly connected to the inside of the test box mechanism, the test rack mechanism is fixedly connected to an inner shell of the test box, the temperature adjustment mechanism is fixedly connected to both sides of the inner shell of the test box, the ventilation mechanism is fixedly connected to the inner shell and the outer shell of the test box, and the temperature detection sensor is fixedly connected to the inner shell of the test box.

[0006] Preferably, the test box mechanism comprises an outer shell and an inner shell, and the test box mechanism is hollow and is used to seal and protect the test environment, thereby ensuring the accuracy of the test.

[0007] Preferably, the hydraulic mechanism includes a first fixed platform, a first hydraulic pump is fixedly connected above the first fixed platform, a support column and a first hydraulic cylinder are fixedly connected below the first fixed platform, and a pressure measuring plate is fixedly connected below the first hydraulic cylinder. The support column serves to support the hydraulic mechanism, and the pressure measuring plate serves to measure the force applied by the first hydraulic cylinder to the test frame mechanism.

[0008] Preferably, the test stand mechanism includes a base, which is fixedly connected to the inner shell of the test box, a second hydraulic pump is fixedly connected inside the base, a second hydraulic cylinder is fixedly connected above the second hydraulic pump, a second fixed platform is fixedly connected above the second hydraulic cylinder, a fixed block is fixedly connected below the second fixed platform, a needle plate is fixedly connected below the fixed block, a protective plate is fixedly connected to the outside of the needle plate, a plurality of lead pins are fixedly connected to the needle plate, a clamping disk is fixedly connected to the base, a magnetic block is fixedly connected to the clamping disk, a chip is fixedly connected to the magnetic block, and a pin is fixedly connected to the chip.

[0009] Preferably, the temperature regulating mechanism includes a refrigerator and a heating element, the refrigerator is fixedly connected to the inner shell of the test box, and the heating element is fixedly connected to the inner shell of the test box, which plays a role of heating and cooling during the semiconductor packaging test process.

[0010] Preferably, the ventilation mechanism includes a third fixed platform, the third fixed platform is fixedly connected to the outer shell of the test box, an exhaust pump is fixedly connected to the third fixed platform, an exhaust pipe is fixedly connected to the exhaust pump, and an exhaust solenoid valve is fixedly connected to the exhaust pipe to draw in and out the gas in the test box mechanism during the semiconductor packaging test to accelerate the switching of the test temperature.

[0011] Preferably, the temperature detection sensor is fixedly connected to the inner shell of the test box, and is used to detect the temperature inside the test box mechanism in real time, and control the temperature of the test box mechanism by controlling the temperature regulating mechanism through the control system.

[0012] Preferably, the hydraulic mechanism, the test frame mechanism, the temperature adjustment mechanism and the ventilation mechanism are all connected to the control system and controlled by the control system.

[0013] Preferably, the method comprises the following specific steps: The temperature range is W1, W2, and W3, where W1 represents the low temperature detection range; W2 represents the normal temperature; and W3 represents the high temperature. The rebound range detected by the displacement sensor is H1, H2, and H3, where H1 represents a small rebound; H2 represents a normal rebound; and H3 represents a large rebound. The rebound time range detected by the displacement sensor is S1, S2, and S3, where S1 represents a slow rebound time; S2 represents a normal rebound time; and S3 represents a fast rebound time. The force applied by the first hydraulic cylinder at normal temperature that can cause the component to deform slightly is Y, which is the stable force applied in this test; The control system controls the heating element to heat, and the temperature detection sensor detects the temperature in the test box. When the temperature is heated to W3, the deformation and shedding of the components of the semiconductor packaging test frame under high temperature conditions and the elastic rebound of the test frame under high temperature are detected; The control system controls the refrigerator to cool down the temperature, and the temperature detection sensor detects the temperature in the test box. When the temperature drops to W1, the deformation and shedding of components of the semiconductor packaging test frame under low temperature conditions and the elastic rebound of the test frame under low temperature are detected.

[0014] Preferably, the temperature adjustment includes increasing the temperature during the rebound test and lowering the temperature during the experiment, specifically: The control system controls the heating element to heat, and the temperature detection sensor detects the temperature in the test box. When the temperature is heated to W3, the deformation and shedding of the components of the semiconductor packaging test frame under high temperature conditions and the elastic rebound of the test frame under high temperature are tested. Specifically: When the displacement sensor detects that the components of the semiconductor packaging test frame are slightly deformed or fall off, the control system controls the test frame mechanism and the hydraulic mechanism to stop working, the test ends, and the test fails; When the displacement sensor does not detect slight deformation or falling off of the components of the semiconductor packaging test frame, the control system controls the second hydraulic pump to retract the second hydraulic cylinder in the direction of the second hydraulic pump, the movement of the second hydraulic cylinder drives the second fixed platform to move, the second fixed platform drives the fixed block to move, the fixed block drives the needle plate close to the chip, when the lead pins on the needle plate contact the pins on the chip, the control system controls the second hydraulic pump to stop working, and controls the first hydraulic pump to drive the first hydraulic cylinder to move downward, the movement of the first hydraulic cylinder drives the pressure measuring plate to move, until the pressure measuring plate contacts the second fixed platform, the control system controls the first hydraulic pump to stop working, and controls the first hydraulic pump to drive the first hydraulic cylinder to move downward, the movement of the first hydraulic cylinder drives the pressure measuring plate to move, until the pressure measuring plate contacts the second fixed platform, the control system controls the first hydraulic The pressure cylinder applies pressure downward. When the pressure plate detects that the pressure applied downward is Y, the control system controls the first hydraulic pump to retract toward the first fixed platform. At this time, the displacement sensor starts to record the rebound time and rebound amount of the lead pin and the pin. When the lead pin and the pin return to the state before the test, the displacement sensor records the displacement time as S3. At high temperature, the atomic vibration is enhanced, the molecular movement is accelerated, and the viscosity of the material is reduced. The component can return to the equilibrium position faster after unloading, and the rebound amount is H3. At high temperature, the thermal movement inside the component is more intense, the lattice distortion and dislocation movement are more significant, and the rebound amount is larger. The control system controls the refrigerator to cool down and the temperature detection sensor detects the temperature in the test box. When the temperature drops to W1, the deformation and shedding of components of the semiconductor packaging test frame under low temperature conditions and the elastic rebound of the test frame under low temperature are tested. Specifically: When the displacement sensor detects that the components of the semiconductor packaging test frame are slightly deformed or fall off, the control system controls the test frame mechanism and the hydraulic mechanism to stop working, the test ends, and the test fails; When the displacement sensor does not detect slight deformation or falling off of the components of the semiconductor packaging test frame, the control system controls the second hydraulic pump to retract the second hydraulic cylinder in the direction of the second hydraulic pump, the movement of the second hydraulic cylinder drives the second fixed platform to move, the second fixed platform drives the fixed block to move, the fixed block drives the needle plate close to the chip, when the lead pins on the needle plate contact the pins on the chip, the control system controls the second hydraulic pump to stop working, and controls the first hydraulic pump to drive the first hydraulic cylinder to move downward, the movement of the first hydraulic cylinder drives the pressure measuring plate to move, until the pressure measuring plate contacts the second fixed platform, the control system controls The first hydraulic cylinder is controlled to apply downward pressure. When the pressure plate detects that the magnitude of the downward pressure applied is Y, the control system controls the first hydraulic pump to retract toward the first fixed platform. At this time, the displacement sensor begins to record the rebound time and rebound amount of the lead pin and the pin. When the lead pin and the pin are restored to the state before the test begins, the displacement sensor records the displacement time as S1. Under low temperature conditions, the movement of atoms and molecules of the component slows down, and the viscosity increases, resulting in a slower speed for the original component to return to its original state after unloading, and the rebound amount is H1. At low temperatures, the thermal movement inside the component is small, the shrinkage degree of the component is small, and the rebound amount is small.

[0015] (III) Beneficial effects The test stand for semiconductor packaging testing provided by the present invention adjusts the temperature through a temperature regulating mechanism so that the test stand can simulate different temperatures, and perform deformation and detachment detection of components at different temperatures and automatic elastic rebound detection at different temperatures, which helps to more deeply evaluate the reliability of semiconductor packaging, gets rid of the traditional testing method that mainly relies on manual operation and visual inspection, improves testing efficiency, solves the problem of manual error, and improves the testing precision and the accuracy, safety and reliability of the experiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the structure of the hydraulic mechanism of the present invention; Figure 3 This is a schematic diagram of the test stand structure of the present invention; Figure 4 It is a schematic diagram of the structure of the clamping disk of the present invention; Figure 5 This is a schematic diagram of the chip and pin structure of the test stand mechanism of the present invention; Figure 6 This is a schematic diagram of the needle plate structure of the test stand mechanism of the present invention; Figure 7 It is a schematic diagram of the structure of the temperature regulating mechanism of the present invention; Figure 8 It is a schematic diagram of the structure of the ventilation mechanism of the present invention; Fig. 9It is a schematic diagram of the test process structure of the present invention.

[0017] In the figure: 1. Test box mechanism; 101. outer shell; 102. inner shell; 2. Hydraulic mechanism; 201. First fixed platform; 202. Support column; 203. First hydraulic pump; 204. First hydraulic cylinder; 205. Pressure plate; 3. Test stand mechanism; 301. Base; 302. Clamping plate; 303. Second hydraulic pump; 304. Second hydraulic cylinder; 305. Second fixed platform; 306. Fixed block; 307. Needle plate; 308. Lead needle; 309. Displacement sensor; 310. Magnetic block; 311. Chip; 312. Pin; 313. Protection plate; 4. Temperature regulating mechanism; 401. Refrigerator; 402. Heating element; 5. Ventilation mechanism; 501. third fixed platform; 502. air pump; 503. air extraction pipe; 504. air extraction solenoid valve; 6. Temperature detection sensor. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] Embodiment 1, the preferred embodiment of the semiconductor packaging test stand provided by the present invention is as follows Figures 1 to 5 As shown: a test stand for semiconductor packaging testing, including a test box mechanism 1, a hydraulic mechanism 2, a test stand mechanism 3, a temperature adjustment mechanism 4, a ventilation mechanism 5 and a temperature detection sensor 6.

[0020] like Figure 7 As shown, the test box mechanism 1 includes an outer shell 101 and an inner shell 102. The test box mechanism 1 is hollow and is used to seal and protect the test environment, thereby ensuring the accuracy of the test.

[0021] like Figure 2 As shown, the hydraulic mechanism 2 includes a first fixed platform 201, a first hydraulic pump 203 is fixedly connected above the first fixed platform 201, a support column 202 and a first hydraulic cylinder 204 are fixedly connected below the first fixed platform 201, and a pressure measuring plate 205 is fixedly connected below the first hydraulic cylinder 204. The support column 202 serves to support the hydraulic mechanism 2, and the pressure measuring plate 205 serves to measure the force applied by the first hydraulic cylinder 204 to the test frame mechanism 3.

[0022] like Figure 3-6 As shown, the test frame mechanism 3 includes a base 301, the base 301 is fixedly connected to the inner shell 102 of the test box, a second hydraulic pump 303 is fixedly connected inside the base 301, a second hydraulic cylinder 304 is fixedly connected above the second hydraulic pump 303, a second fixed platform 305 is fixedly connected above the second hydraulic cylinder 304, a fixed block 306 is fixedly connected below the second fixed platform 305, a needle plate 307 is fixedly connected below the fixed block 306, a protective plate 313 is fixedly connected to the outer side of the needle plate 307, a plurality of lead pins 308 are fixedly connected to the needle plate 307, a clamping disk 302 is fixedly connected to the base 301, a magnetic block 310 is fixedly connected to the clamping disk 302, a chip 311 is fixedly connected to the magnetic block 310, and a pin 312 is fixedly connected to the chip 311.

[0023] like Figure 7 As shown, the temperature regulating mechanism 4 includes a refrigerator 401 and a heating element 402. The refrigerator 401 is fixedly connected to the inner shell 102 of the test box, and the heating element 402 is fixedly connected to the inner shell 102 of the test box, which plays the role of heating and cooling during the semiconductor packaging test process.

[0024] like Figure 8 As shown, the ventilation mechanism 5 includes a third fixed platform 501, the third fixed platform 501 is fixedly connected to the test box outer shell 101, the third fixed platform 501 is fixedly connected to an exhaust pump 502, the exhaust pump 502 is fixedly connected to an exhaust pipe 503, and the exhaust pipe 503 is fixedly connected to an exhaust solenoid valve 504, which draws in and out the gas in the test box mechanism 1 during the semiconductor packaging test to accelerate the switching of the test temperature.

[0025] like Figure 7 As shown, the temperature detection sensor 6 is fixedly connected to the inner shell 102 of the test box, and is used to detect the temperature in the test box mechanism 1 in real time, and control the temperature of the test box mechanism 1 by controlling the temperature adjustment mechanism 4 through the control system.

[0026] The hydraulic mechanism 2, the test frame mechanism 3, the temperature adjustment mechanism 4 and the ventilation mechanism 5 are all connected to the control system and controlled by the control system.

[0027] Embodiment 2, based on embodiment 1, the preferred embodiment of the semiconductor packaging test stand provided by the present invention is as follows: Figures 1 to 5As shown: a test rack for semiconductor packaging test, the control system adjusts the temperature inside the test box mechanism 1 by controlling the temperature adjustment mechanism 4. When performing a high temperature test, the control system controls the heating element 402 to heat until the temperature inside the test box mechanism 1 reaches the high temperature test standard, and the displacement sensor 309 observes the deformation and shedding of the semiconductor element under the high temperature state, and performs a rebound test of the semiconductor packaging test rack based on the high temperature; when performing a low temperature test, the control system controls the refrigerator 401 to cool until the temperature inside the test box mechanism 1 drops to the low temperature test standard, and the displacement sensor 309 observes the deformation and shedding of the semiconductor element under the low temperature state, and performs a rebound test of the semiconductor packaging test rack based on the low temperature; The temperature range is W1, W2, and W3, where W1 represents the low temperature detection range; W2 represents the normal temperature; and W3 represents the high temperature. The rebound amount detected by the displacement sensor 309 ranges from H1, H2, and H3, where H1 represents a small rebound amount; H2 represents a normal rebound amount; and H3 represents a large rebound amount. The rebound time range detected by the displacement sensor 309 is S1, S2, and S3, where S1 represents a slow rebound time; S2 represents a normal rebound time; and S3 represents a fast rebound time; The force applied by the first hydraulic cylinder 204 at normal temperature that can cause the component to deform slightly is Y, which is the stable force applied in this test; During semiconductor packaging test, the test frame mechanism 3 is fixed inside the test box mechanism 1, and the semiconductor packaging test is started; Conduct a rebound test of the test frame for semiconductor packaging testing at room temperature in the test chamber, specifically: When the temperature detection sensor 6 detects that the temperature in the test box is W2, the control system controls the second hydraulic pump 303 to retract the second hydraulic cylinder 304 in the direction of the second hydraulic pump 303, and the movement of the second hydraulic cylinder 304 drives the second fixed platform 305 to move, and the second fixed platform 305 drives the fixed block 306 to move, and the fixed block 306 drives the needle plate 307 to approach the chip 311. When the lead pin 308 on the needle plate 307 contacts the pin 312 on the chip 311, the control system controls the second hydraulic pump 303 to stop working, and controls the first hydraulic pump 203 to drive the first hydraulic cylinder 204 to move downward, and the movement of the first hydraulic cylinder 204 drives the pressure plate 205 to move until the pressure plate 205 contacts the second fixed platform 305. At this time, the pressure plate 205 starts to detect the force applied by the first hydraulic pump 203 to the second fixed platform 305. The displacement sensor 309 under the needle plate 307 detects the position distance between the lead pin 308 and the pin 312 in real time. When the displacement sensor 309 detects that the lead pin 308 and the pin 312 are in contact, the first hydraulic cylinder 204 continues to apply pressure downward until the displacement sensor 309 detects that the lead pin 308 and the pin 312 are slightly deformed. The control system controls the first hydraulic pump 203 to stop working, and the pressure plate 205 records the pressure at this time as Y. The control system controls the first hydraulic pump 203 to retract toward the first fixed platform 201. At this time, the displacement sensor 309 starts to record the rebound time and rebound amount of the lead pin 308 and the pin 312. When the lead pin 308 and the pin 312 return to the state before the test starts, the displacement sensor 309 records the displacement time as S2, the rebound time is normal, the rebound amount is H2, and the rebound amount is normal. The control system controls the heating element 402 to heat, and the temperature detection sensor 6 detects the temperature in the test box. When the temperature is heated to W3, the deformation and shedding of the components of the semiconductor packaging test frame under high temperature conditions and the elastic rebound of the test frame under high temperature are detected. Specifically: When the displacement sensor 309 detects that the components of the semiconductor packaging test frame are slightly deformed or fall off, the control system controls the test frame mechanism 3 and the hydraulic mechanism 2 to stop working, the test ends, and the test fails; When the displacement sensor 309 does not detect that the components of the semiconductor packaging test frame are slightly deformed or detached, the control system controls the second hydraulic pump 303 to retract the second hydraulic cylinder 304 in the direction of the second hydraulic pump 303, and the movement of the second hydraulic cylinder 304 drives the second fixed platform 305 to move, and the second fixed platform 305 drives the fixed block 306 to move, and the fixed block 306 drives the needle plate 307 to approach the chip 311. When the lead pin 308 on the needle plate 307 contacts the pin 312 on the chip 311, the control system controls the second hydraulic pump 303 to stop working, and controls the first hydraulic pump 203 to drive the first hydraulic cylinder 204 to move downward, and the movement of the first hydraulic cylinder 204 drives the pressure measuring plate 205 to move until the pressure measuring plate 205 contacts the second When the platform 305 is fixed, the control system controls the first hydraulic cylinder 204 to apply pressure downward. When the pressure plate 205 detects that the pressure applied downward is Y, the control system controls the first hydraulic pump 203 to retract toward the first fixed platform 201. At this time, the displacement sensor 309 starts to record the rebound time and rebound amount of the lead pin 308 and the pin 312. When the lead pin 308 and the pin 312 are restored to the state before the test, the displacement sensor 309 records the displacement time as S3. Under high temperature conditions, atomic vibration is enhanced, molecular motion is accelerated, and the viscosity of the material is reduced. The component can return to the equilibrium position faster after unloading, and the rebound amount is H3. At high temperatures, the thermal motion inside the component is more intense, the lattice distortion and dislocation movement are more significant, and the rebound amount is larger. After the high temperature test is finished, the control system controls the two air pumps 502 on the third fixed platform 501 to open the air pumping solenoid valve 504 on the air pumping pipe 503. The two air pumps 502 work to pump air inwardly and outwardly respectively, accelerating the cooling rate of the temperature in the test box. The temperature detection sensor 6 detects the temperature change in the test box in real time. When the temperature detection sensor 6 detects that the temperature drops to W2, the air pumping solenoid valve 504 and the air pump 502 are closed. The control system controls the refrigerator 401 to cool down and the temperature detection sensor 6 detects the temperature in the test box. When the temperature drops to W1, the deformation and shedding of components of the semiconductor packaging test frame under low temperature conditions and the elastic rebound of the test frame under low temperature are detected. Specifically: When the displacement sensor 309 detects that the components of the semiconductor packaging test frame are slightly deformed or fall off, the control system controls the test frame mechanism 3 and the hydraulic mechanism 2 to stop working, the test ends, and the test fails; When the displacement sensor 309 does not detect slight deformation or falling off of the components of the semiconductor packaging test frame, the control system controls the second hydraulic pump 303 to retract the second hydraulic cylinder 304 in the direction of the second hydraulic pump 303, and the movement of the second hydraulic cylinder 304 drives the second fixed platform 305 to move, and the second fixed platform 305 drives the fixed block 306 to move, and the fixed block 306 drives the needle plate 307 to approach the chip 311. When the lead pin 308 on the needle plate 307 contacts the pin 312 on the chip 311, the control system controls the second hydraulic pump 303 to stop working, and controls the first hydraulic pump 203 to drive the first hydraulic cylinder 204 to move downward, and the movement of the first hydraulic cylinder 204 drives the pressure measuring plate 205 to move until the pressure measuring plate 205 contacts the chip 311. When touching the second fixed platform 305, the control system controls the first hydraulic cylinder 204 to apply pressure downward. When the pressure plate 205 detects that the downward pressure is Y, the control system controls the first hydraulic pump 203 to retract toward the first fixed platform 201. At this time, the displacement sensor 309 begins to record the rebound time and rebound amount of the lead pin 308 and the pin 312. When the lead pin 308 and the pin 312 are restored to the state before the test begins, the displacement sensor 309 records the displacement time as S1. Under low temperature conditions, the movement of atoms and molecules of the component slows down and the viscosity increases, resulting in a slower speed for the original component to return to its original state after unloading, and the rebound amount is H1. At low temperatures, the thermal movement inside the component is small, the shrinkage degree of the component is small, and the rebound amount is small.

[0028] The test stand for semiconductor packaging testing provided by the present invention adjusts the temperature through the temperature adjustment mechanism 4 so that the test stand can simulate deformation and detachment detection of components at different temperatures and automatic elastic rebound detection at different temperatures, thus breaking away from the traditional test method that mainly relies on manual operation and visual inspection, improving the test efficiency, solving the problem of manual error, and improving the test precision and the accuracy, safety and reliability of the test.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A test stand for semiconductor packaging testing, comprising a test box mechanism (1), a hydraulic mechanism (2), a test stand mechanism (3), a temperature adjustment mechanism (4), a ventilation mechanism (5) and a temperature detection sensor (6), characterized in that: The test box mechanism (1) is hollow, the hydraulic mechanism (2) is fixedly connected inside the test box mechanism (1), the test frame mechanism (3) is fixedly connected to the inner shell (102) of the test box, the temperature adjustment mechanism (4) is fixedly connected to both sides of the inner shell (102) of the test box, the ventilation mechanism (5) is fixedly connected to the inner shell (102) and the outer shell (101) of the test box, and the temperature detection sensor (6) is fixedly connected to the inner shell (102) of the test box.

2. The semiconductor packaging test stand according to claim 1, wherein: The test box mechanism (1) comprises an outer shell (101) and an inner shell (102); the test box mechanism (1) is hollow and is used to seal and protect the test environment, thereby ensuring the accuracy of the test.

3. The semiconductor packaging test stand according to claim 2, wherein: The hydraulic mechanism (2) comprises a first fixed platform (201), a first hydraulic pump (203) is fixedly connected above the first fixed platform (201), a support column (202) and a first hydraulic cylinder (204) are fixedly connected below the first fixed platform (201), and a pressure measuring plate (205) is fixedly connected below the first hydraulic cylinder (204), the support column (202) serves to support the hydraulic mechanism (2), and the pressure measuring plate (205) serves to measure the force applied by the first hydraulic cylinder (204) to the test frame mechanism (3).

4. The semiconductor packaging test stand according to claim 3, wherein: The test stand mechanism (3) comprises a base (301), the base (301) is fixedly connected to an inner shell (102) of the test box, a second hydraulic pump (303) is fixedly connected inside the base (301), a second hydraulic cylinder (304) is fixedly connected above the second hydraulic pump (303), a second fixed platform (305) is fixedly connected above the second hydraulic cylinder (304), a fixed block (306) is fixedly connected below the second fixed platform (305), a needle plate (307) is fixedly connected below the fixed block (306), a protective plate (313) is fixedly connected outside the needle plate (307), a plurality of lead pins (308) are fixedly connected to the needle plate (307), a clamping disk (302) is fixedly connected to the base (301), a magnetic block (310) is fixedly connected to the clamping disk (302), a chip (311) is fixedly connected to the magnetic block (310), and a pin (312) is fixedly connected to the chip (311).

5. The semiconductor packaging test stand according to claim 4, wherein: The temperature adjustment mechanism (4) comprises a refrigerator (401) and a heating element (402); the refrigerator (401) is fixedly connected to the inner shell (102) of the test box, and the heating element (402) is fixedly connected to the inner shell (102) of the test box, and plays a role of heating and cooling during the semiconductor packaging test process.

6. The semiconductor packaging test stand according to claim 5, wherein: The ventilation mechanism (5) comprises a third fixed platform (501), the third fixed platform (501) is fixedly connected to the outer shell (101) of the test box, an air pump (502) is fixedly connected to the third fixed platform (501), an air pump (503) is fixedly connected to the air pump (502), an air pump solenoid valve (504) is fixedly connected to the air pump (502), and the air pump solenoid valve (504) is fixedly connected to the air pump solenoid valve (504) to draw in and out gas from the test box mechanism (1) during the semiconductor packaging test process, thereby accelerating the switching of the test temperature.

7. The semiconductor packaging test stand according to claim 6, wherein: The temperature detection sensor (6) is fixedly connected to the inner shell (102) of the test box and is used to detect the temperature inside the test box mechanism (1) in real time and to control the temperature of the test box mechanism (1) by controlling the temperature adjustment mechanism (4) through the control system.

8. The semiconductor packaging test stand according to claim 7, wherein: The hydraulic mechanism (2), the test frame mechanism (3), the temperature adjustment mechanism (4) and the ventilation mechanism (5) are all connected to the control system and are controlled by the control system.

9. The semiconductor packaging test stand according to claim 8, wherein: The specific steps include: The temperature range is W1, W2, and W3, where W1 represents the low temperature detection range; W2 represents the normal temperature; and W3 represents the high temperature. The rebound amount detected by the displacement sensor (309) ranges from H1, H2, and H3, wherein H1 represents a small rebound amount; H2 represents a normal rebound amount; and H3 represents a large rebound amount. The rebound time range detected by the displacement sensor (309) is S1, S2, and S3, wherein S1 represents a slow rebound time; S2 represents a normal rebound time; and S3 represents a fast rebound time; The force applied by the first hydraulic cylinder (204) at normal temperature that can cause the component to deform slightly is Y, which is the stable force applied in this test; The control system controls the heating element (402) to heat, and the temperature detection sensor (6) detects the temperature in the test box. When the temperature is heated to W3, the deformation and shedding of components of the semiconductor packaging test frame under high temperature conditions and the elastic rebound of the test frame under high temperature are detected; The control system controls the refrigerator (401) to cool down the temperature, and the temperature detection sensor (6) detects the temperature in the test box. When the temperature drops to W1, the deformation and shedding of components of the semiconductor packaging test frame under low temperature conditions and the elastic rebound of the test frame under low temperature are detected.

10. The semiconductor packaging test stand according to claim 9, wherein: The temperature adjustment includes increasing the temperature during the rebound test and lowering the temperature during the experiment, specifically: The control system controls the heating element (402) to heat, and the temperature detection sensor (6) detects the temperature in the test box. When the temperature is heated to W3, the deformation and shedding of components of the semiconductor packaging test frame under high temperature conditions and the elastic rebound of the test frame under high temperature are detected. Specifically: When the displacement sensor (309) detects that a component of the semiconductor packaging test frame is slightly deformed or falls off, the control system controls the test frame mechanism (3) and the hydraulic mechanism (2) to stop working, and the test ends and the test fails; When the displacement sensor (309) does not detect slight deformation or detachment of the components of the semiconductor packaging test rack, the control system controls the second hydraulic pump (303) to retract the second hydraulic cylinder (304) in the direction of the second hydraulic pump (303), the second hydraulic cylinder (304) drives the second fixed platform (305) to move, the second fixed platform (305) drives the fixed block (306) to move, the fixed block (306) drives the needle plate (307) to approach the chip (311), when the lead pin (308) on the needle plate (307) contacts the pin (312) on the chip (311), the control system controls the second hydraulic pump (303) to stop working, and controls the first hydraulic pump (203) to drive the first hydraulic cylinder (204) to move downward, the movement of the first hydraulic cylinder (204) drives the pressure measuring plate (205) to move until the pressure measuring plate When (205) contacts the second fixed platform (305), the control system controls the first hydraulic cylinder (204) to apply pressure downwards. When the pressure plate (205) detects that the pressure applied downwards is Y, the control system controls the first hydraulic pump (203) to retract in the direction of the first fixed platform (201). At this time, the displacement sensor (309) starts to record the rebound time and rebound amount of the lead pin (308) and the pin (312). When the lead pin (308) and the pin (312) return to the state before the test begins, the displacement sensor (309) records the displacement time as S3. Under high temperature conditions, atomic vibration is enhanced, molecular motion is accelerated, and the viscosity of the material is reduced. The component can return to the equilibrium position more quickly after unloading, and the rebound amount is H3. At high temperatures, the thermal motion inside the component is more intense, the lattice distortion and dislocation movement are more significant, and the rebound amount is larger. The control system controls the refrigerator (401) to cool down the temperature, and the temperature detection sensor (6) detects the temperature in the test box. When the temperature drops to W1, the deformation and shedding of components of the semiconductor packaging test frame under low temperature conditions and the elastic rebound of the test frame under low temperature are detected. Specifically: When the displacement sensor (309) detects that a component of the semiconductor packaging test frame is slightly deformed or falls off, the control system controls the test frame mechanism (3) and the hydraulic mechanism (2) to stop working, and the test ends and the test fails; When the displacement sensor (309) does not detect slight deformation or detachment of the components of the semiconductor packaging test rack, the control system controls the second hydraulic pump (303) to retract the second hydraulic cylinder (304) in the direction of the second hydraulic pump (303), the second hydraulic cylinder (304) drives the second fixed platform (305) to move, the second fixed platform (305) drives the fixed block (306) to move, the fixed block (306) drives the needle plate (307) to approach the chip (311), when the lead pin (308) on the needle plate (307) contacts the pin (312) on the chip (311), the control system controls the second hydraulic pump (303) to stop working, and controls the first hydraulic pump (203) to drive the first hydraulic cylinder (204) to move downward, the movement of the first hydraulic cylinder (204) drives the pressure measuring plate (205) to move, until When the pressure plate (205) contacts the second fixed platform (305), the control system controls the first hydraulic cylinder (204) to apply pressure downward. When the pressure plate (205) detects that the pressure applied downward is Y, the control system controls the first hydraulic pump (203) to retract in the direction of the first fixed platform (201). At this time, the displacement sensor (309) starts to record the rebound time and rebound amount of the guide pin (308) and the pin (312). When the guide pin (308) and the pin (312) return to the state before the test begins, the displacement sensor (309) records the displacement time as S1. Under low temperature conditions, the movement of atoms and molecules of the component slows down and the viscosity increases, resulting in a slower speed at which the original component returns to its original state after unloading, and the rebound amount is H1. At low temperatures, the thermal movement inside the component is small, the shrinkage degree of the component is small, and the rebound amount is small.

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