Substrate heating device

Abstract

The invention provides a technology for reducing thermal warping of a cover part while maintaining high heat insulation property of the cover part in a substrate heating device. The substrate heating apparatus includes a heat plate, a frame portion, and a cover portion. The heat plate heats the substrate. The frame portion has an opening in an upper portion. The frame part can accommodate the heat plate on the inner side. The cover portion closes an opening in the upper portion of the housing portion. The cover portion has a top panel and a reinforcing panel. The top panel includes a heat insulating material. The reinforcing panel has a first rib and a second rib connected to the lower surface of the top panel. The first rib part and the second rib part protrude downwards from the lower surface of the top plate panel. The first rib and the second rib extend parallel to the lower surface of the top panel.

Description

Technical Field

[0001] The subject matter disclosed in this specification relates to a substrate heating device. Background Art

[0002] For example, in the processing steps of various substrates such as glass substrates for display devices, the following process is widely performed: a coating liquid is applied to the substrate, and then the substrate is heated to volatilize the components contained in the coating liquid. The substrate heating device that performs such a heating process is generally configured to perform the following process: the substrate is accommodated in a processing chamber and the substrate is heated in the processing chamber.

[0003] Patent Document 1 describes a structure in which a heat insulating material is molded using a fiber-reinforced resin on the wall surface of a processing chamber that accommodates a hot plate. According to this structure, the high temperature inside the processing chamber can be insulated and the temperature of the inner wall surface can be kept high, thereby suppressing the adhesion and solidification of sublimates generated when heating a photoresist in the wall constituting the processing chamber.

[0004] [Prior art literature]

[0005] [Patent Document]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2022-052854 Summary of the invention

[0007] [Problems to be solved by the invention]

[0008] In addition, when constructing a processing chamber, a structure is sometimes adopted in which an opening is provided on the upper part of a frame body that accommodates a hot plate and the opening is blocked by a cover. In a processing chamber of such a structure, if the heat insulation is improved, the temperature difference between the lower surface of the cover and the upper surface of the cover becomes larger, and as a result, the cover may be thermally warped. In particular, the larger the size of the device, the more likely it is to cause thermal warping. Such thermal warping of the cover may cause adverse conditions such as reduced airtightness of the processing chamber or poor opening and closing of the cover.

[0009] An object of the present invention is to provide a technology capable of reducing thermal warpage of a cover while maintaining high thermal insulation of the cover in a substrate heating device.

[0010] [Technical means to solve the problem]

[0011] To solve the above-mentioned problem, the first embodiment is a substrate heating device, comprising: a hot plate for heating a substrate; a frame portion having an opening at the top and capable of accommodating the hot plate on the inside; and a cover portion for closing the opening at the top of the frame portion, wherein the cover portion comprises: a top plate comprising a heat insulating material; and a reinforcing member having a rib connected to the lower surface of the top plate, the rib protruding downward from the lower surface of the top plate and extending parallel to the lower surface of the top plate.

[0012] A second embodiment is the substrate heating device according to the first embodiment, wherein the rib contains a fiber reinforced resin.

[0013] A third embodiment is the substrate heating device according to the first embodiment or the second embodiment, wherein the rib includes: a first rib extending in a first direction; and a second rib extending in a second direction crossing the first direction.

[0014] A fourth embodiment is the substrate heating device according to the first embodiment or the second embodiment, wherein the reinforcing member further includes a bottom plate portion connected to a lower portion of the rib portion and facing the top plate with a gap therebetween.

[0015] A fifth embodiment is the substrate heating device according to the fourth embodiment, wherein the lower surface of the bottom plate portion is a flat surface.

[0016] A sixth embodiment is the substrate heating device according to the fourth embodiment, wherein the rib portion is formed integrally with the bottom plate portion.

[0017] A seventh embodiment is the substrate heating device according to the fourth embodiment, wherein the reinforcing member has a low expansion portion which is located below the bottom plate portion and has a lower linear expansion coefficient than the reinforcing member.

[0018] The eighth embodiment is a substrate heating device according to the fourth embodiment, wherein the cover portion further comprises: a fixing portion for fixing the top plate to the reinforcing member, the fixing portion comprising: a spacer located between the top plate and the bottom plate portion; and a spacing screw engaged with a threaded hole provided on the upper portion of the spacer and connecting the top plate to the spacer.

[0019] A ninth embodiment is the substrate heating device according to the eighth embodiment, wherein the top plate includes: a heat insulating plate including a heat insulating material; and a back plate located below the heat insulating plate and having higher wear resistance than the heat insulating plate.

[0020] The tenth embodiment is a substrate heating device according to the ninth embodiment, wherein the fixing portion further comprises: an annular first shaft ring fixed between the head of the spacing screw and the spacer and for the threaded portion of the spacing screw to be inserted, the thickness of the first shaft ring being greater than the thickness of the back panel, and forming a gap between the head of the spacing screw and the back panel.

[0021] An eleventh embodiment is the substrate heating device according to the tenth embodiment, wherein the top plate further includes a decorative plate that is located on an upper side of the heat insulation plate and has higher wear resistance than the heat insulation plate.

[0022] The twelfth embodiment is a substrate heating device according to the eleventh embodiment, wherein the fixing portion further comprises: a screw engaged with a threaded hole provided on the upper portion of the spacing screw; and an annular second shaft ring fixed between the head of the screw and the head of the spacing screw and for the threaded portion of the screw to be inserted, the thickness of the second shaft ring being greater than the thickness of the decorative plate, forming a gap between the head of the screw and the decorative plate.

[0023] [Effects of the Invention]

[0024] According to the substrate heating apparatus of the first to tenth embodiments, the rigidity of the top plate can be increased by the ribs, so that the thermal warping of the cover can be reduced while maintaining the heat insulation of the cover at a high level.

[0025] According to the substrate heating device of the second embodiment, the thermal warping of the cover portion can be reduced while avoiding an increase in the weight of the cover portion.

[0026] According to the substrate heating device of the third embodiment, since the ribs intersect, the rigidity of the top plate can be improved compared to the case where the ribs do not intersect.

[0027] According to the substrate heating device of the fourth embodiment, a space can be formed between the top plate and the reinforcing member by the ribs, thereby achieving an air heat insulation effect.

[0028] According to the substrate heating device of the fifth embodiment, even if sublimates of the coating liquid from the substrate adhere to the lower surface of the bottom plate, they can be easily removed by cleaning such as wiping.

[0029] According to the substrate heating device of the sixth embodiment, by removing the joints between the parts, the assembly work of the reinforcing member can be facilitated. In addition, by removing the joints between the parts, the cover can be made lighter and the durability can be improved.

[0030] According to the substrate heating device of the seventh embodiment, the thermal warping of the bottom plate portion can be further reduced, and therefore, the thermal warping of the cover portion can be reduced.

[0031] According to the substrate heating apparatus of the eighth embodiment, the position of the top panel relative to the bottom plate portion can be appropriately adjusted while ensuring the interval between the top panel and the bottom plate portion of the reinforcing member by the spacer screws.

[0032] According to the substrate heating device of the ninth embodiment, generation of dust and the like from the heat shielding plate can be reduced.

[0033] According to the substrate heating device of the tenth embodiment, since the back panel is not fixed by the spacing screws, even if the back panel undergoes thermal expansion, the deformation of the back panel will not be suppressed by the spacing screws, thereby reducing the stress inside the back panel. Therefore, deformation such as thermal warping or damage such as cracking in the back panel can be reduced.

[0034] According to the substrate heating device of the eleventh embodiment, generation of dust and the like from the heat shielding plate can be reduced.

[0035] According to the substrate heating device of the twelfth embodiment, since the decorative plate is not fixed by screws, even if the decorative plate undergoes thermal expansion, deformation of the decorative plate is not suppressed by the screws, thereby reducing stress inside the decorative plate. Therefore, deformation such as thermal warping or damage such as cracking in the decorative plate can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a perspective view showing the substrate heating device according to the first embodiment.

[0037] Figure 2 It means along Figure 1 FIG. 1 is a diagram showing a cross section of the substrate heating device at the position of line II-II.

[0038] Figure 3 Yes means Figure 1 An exploded perspective view of the structure of the cover shown.

[0039] Figure 4 This is a partially enlarged view showing a part of the cross section of the cover portion in an enlarged manner.

[0040] Figure 5 It is a diagram showing a cover portion included in the substrate heating device according to the second embodiment.

[0041] [Explanation of Symbols]

[0042] 1: Substrate heating device

[0043] 9: Substrate

[0044] 10: Processing chamber

[0045] 20: Hot Plate

[0046] 40: Frame

[0047] 41: Opening

[0048] 43: Sealing part

[0049] 50, 50a: cover

[0050] 51: Top panel (top panel)

[0051] 53: Strengthening panel (strengthening member)

[0052] 55: Low expansion member (low expansion portion)

[0053] 60: Fixed part

[0054] 61: Spacer

[0055] 63: Spacer screw

[0056] 65: Screw

[0057] 67: First Collar

[0058] 69: Second collar

[0059] 511: Heat insulation board

[0060] 513: Decorative board

[0061] 515: Back panel

[0062] 531: Bottom plate

[0063] 533: First rib

[0064] 535: Second rib DETAILED DESCRIPTION

[0065] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the constituent elements described in the embodiments are merely examples and do not mean that the scope of the present invention is limited to these. In the accompanying drawings, for ease of understanding, the size or number of each part is sometimes exaggerated or simplified as required.

[0066] <1. First embodiment>

[0067] Figure 1 It is a perspective view showing a substrate heating device 1 according to the first embodiment. Figure 2 It means along Figure 1 FIG. 1 is a cross-sectional view of the substrate heating device 1 taken along line II-II. Figure 3 Yes means Figure 1 The structure of the cover 50 is shown in an exploded perspective view.

[0068] In addition, in some drawings, in order to make the positional relationship of the elements easier to understand, arrows representing the XYZ orthogonal coordinate axes are sometimes marked. The XY plane corresponds to the horizontal plane, and the Z axis corresponds to the vertical axis. In addition, the (-Z) direction corresponds to the vertical downward direction. In the following description, the vertical upward direction is sometimes referred to as "upward" or "above", and the vertical downward direction is sometimes referred to as "downward" or "below".

[0069] The substrate heating device 1 heats the substrate 9 with a coating liquid such as a photoresist coated on the surface thereof, thereby volatilizing the solvent component in the coating liquid. The substrate heating device 1 can be used, for example, for the purpose of forming a photoresist film on the surface of the substrate 9. The substrate 9 is, for example, various substrates to be processed for electronic devices, specifically, semiconductor wafers, glass substrates for liquid crystal displays or plasma displays, glass or ceramic substrates for magnetic disks or optical disks, glass substrates for organic electroluminescence (EL), glass or silicon substrates for solar cells, flexible substrates, printed substrates, etc.

[0070] The substrate heating device 1 includes: a processing chamber 10, a hot plate 20 and a substrate lifting mechanism 30. The hot plate 20 is accommodated inside the processing chamber 10. The hot plate 20 has a flat upper surface 20a. A heater such as a heating wire is built into the hot plate 20. By driving the heater, the upper surface 20a is heated to a predetermined temperature.

[0071] The substrate lifting mechanism 30 includes a plurality of lifting pins 31 and a lifting drive unit 33. The plurality of lifting pins 31 extend in the vertical direction and are dispersedly arranged in the horizontal direction. The plurality of lifting pins 31 are inserted into the bottom wall of the frame 40 of the processing chamber 10 and a plurality of through holes provided in the hot plate 20, and penetrate the bottom wall of the frame 40 and the hot plate 20. The lifting drive unit 33 lifts the plurality of lifting pins 31 up and down in an integrated manner. The lifting drive unit 33 is arranged on the outer side and the lower side of the processing chamber 10. The lifting drive unit 33 includes, for example, a rack and pinion mechanism or a ball screw mechanism including a motor.

[0072] The substrate 9 is supported by the upper ends of the plurality of lift pins 31. The lift drive unit 33 moves the plurality of lift pins 31 between a close position where the substrate 9 is close to the upper surface 20a of the hot plate 20 and an upper position above the close position. The operation of the lift drive unit 33 is controlled by a control unit including, for example, a computer.

[0073] The processing chamber 10 is in a substantially rectangular parallelepiped shape and includes a frame 40 and a cover 50. The frame 40 has an opening 41 at the top. The frame 40 accommodates the hot plate 20 therein.

[0074] The cover 50 has a substantially plate shape that closes the opening 41 at the upper portion of the frame 40. The cover 50 is detachable from the upper portion of the frame 40. The cover 50 is placed on the upper portion of the frame 40 via the seal 43. The seal 43 is a member that closes the gap between the frame 40 and the cover 50.

[0075] When the cover 50 is removed from the frame 40, the inner surface of the frame 40 is exposed to the outside through the opening 41 of the frame 40. In this state, various maintenance operations such as replacement of parts and cleaning of the frame 40 are performed through the opening 41 of the frame 40.

[0076] The frame 40 has a carrying port 45 on the (-Y) side. In addition, the frame 40 has an opening and closing member 47. The opening and closing member 47 is moved between a closed position for locking the carrying port 45 and an open position for opening the carrying port 45 by an opening and closing driving unit (not shown) including a motor or the like. The operation of such an opening and closing mechanism is controlled by a control unit.

[0077] like Figure 2 As shown in FIG. 1 , the cover 50 has a hollow plate-like structure having a cavity inside. The cover 50 has a top panel 51. The top panel 51 is a plate-like member having a quadrilateral shape when viewed from above. The top panel 51 has a heat insulating plate 511 formed of a heat insulating material (see FIG. 1 ). Figure 3 ). As the thermal insulation material, for example, fiber-based thermal insulation materials, foam-based thermal insulation materials, aerogels, fumed silica, vacuum thermal insulation materials, or materials formed by combining several of these materials can be used. Fiber-based thermal insulation materials include, for example, glass wool, asbestos, cellulose fiber, carbonized cork, wool thermal insulation materials, or wood fiber. Foam-based thermal insulation materials include, for example, urethane foam, phenolic foam, polystyrene foam, bead-based polystyrene (expandable polystyrene (EPS)), foam rubber (flexible elastomeric foam (FEF)) or extruded polystyrene (extruded polystyrene (XPS)). Aerogels include, for example, silica aerogels (silica aerogel), carbon aerogels, or alumina aerogels.

[0078] At least a portion of the outer surface of the insulation board 511 may be covered with a fiber-reinforced resin. Fiber-reinforced resin is a composite material formed by combining resin and fiber. As the fiber-reinforced resin, glass fiber reinforced plastic (GFRP), carbon fiber reinforced plastic (CFRP), aramid fiber reinforced plastic (AFRP), natural fiber reinforced plastic or a combination thereof may be used. In addition, multiple fiber-reinforced resins of the same or different types may be stacked on the outer surface of the insulation board 511. By covering the insulation board 511 with a fiber-reinforced resin, the wear resistance of the insulation board 511 may be improved. As a result, the scattering of dust and the like of the insulation material may be reduced.

[0079] like Figure 3 As shown, the top panel 51 includes: a heat insulation board 511, a decorative board 513 overlapping the upper side of the heat insulation board 511, and a back panel 515 overlapping the lower side of the heat insulation board 511. The decorative board 513 and the back panel 515 are preferably formed of a material having a higher wear resistance than the heat insulation board 511, specifically, a carbon board, etc. In addition, the decorative board 513 and the back panel 515 may not exist.

[0080] In addition, in detail, Figure 3 As shown, the top panel 51 has a structure in which four blocks are arranged in two rows and two columns. Moreover, each block has a structure in which a decorative plate 513 and a back panel 515 are overlapped on the heat insulation board 511. By dividing the top panel 51 into a plurality of blocks, even if the top panel 51 expands due to heating and thus deforms, since each block expands independently, local deformation can be prevented. Therefore, the deformation of the top panel 51 as a whole can be reduced. In addition, even if thermal expansion occurs, stress corresponding to the size of each block will act, so the overall stress can be reduced. As a result, deformation such as warping or damage such as cracking of the top panel 51 can be reduced.

[0081] The cover 50 also has a reinforcing panel 53. The reinforcing panel 53 has a bottom plate 531, a plurality of (here, 5) first ribs 533, a plurality of (here, 5) second ribs 535, and an outer frame 537. The bottom plate 531 is a plate-like member having a quadrilateral shape when viewed from above. Each first rib 533, each second rib 535, and the outer frame 537 protrude upward from the upper surface of the bottom plate 531. The lower surface of the bottom plate 531 is preferably a flat surface.

[0082] Each first rib 533 extends along the X direction (first direction), preferably extending in parallel with the X direction. Each second rib 535 extends along the Y direction (second direction), preferably extending in parallel with the Y direction. That is, the second rib 535 intersects with the first rib 533, preferably being orthogonal to the first rib 533. Both ends of each first rib 533 and both ends of each second rib 535 are connected to the outer frame portion 537.

[0083] The outer frame 537 has a square tube shape that rises upward from the four sides of the peripheral edge of the bottom plate 531. The upper portion of the outer frame 537 is located above the upper portion of each first rib 533 and the upper portion of each second rib 535. When the top panel 51 is mounted on the reinforcing panel 53, the top panel 51 is embedded in the inner side of the outer frame 537. In addition, the lower surface of the top panel 51 abuts against the upper portion of each first rib 533 and the upper portion of each second rib 535.

[0084] The reinforcing panel 53 is integrally formed of, for example, a fiber-reinforced resin. That is, the bottom plate portion 531, the first rib portion 533, the second rib portion 535, and the outer frame portion 537 are integrally formed of a fiber-reinforced resin. As the fiber-reinforced resin, a carbon fiber-reinforced resin can be used. As a molding method of the reinforcing panel 53, for example, resin transfer molding (RTM) can be used.

[0085] In addition, the reinforcing panel 53 is not necessarily formed in one piece. That is, some of the bottom plate portion 531, the first rib portion 533, the second rib portion 535, and the outer frame portion 537 may include components different from the remaining portions.

[0086] Figure 4 2 is a partial enlarged view showing a part of the cross section of the cover portion 50. Figure 4 As shown, the cover 50 has a plurality of fixing portions 60 for connecting the top panel 51 and the reinforcing panel 53. Each fixing portion 60 includes a spacer 61, a spacer screw 63, a screw 65, a first collar 67, and a second collar 69.

[0087] The spacer 61 is provided to ensure the spacing between the top panel 51 and the bottom plate 531 of the reinforcing panel 53 in the Z direction and to appropriately adjust the position of the top panel 51 relative to the bottom plate 531. The spacer 61 is fixed to the bottom plate 531 of the reinforcing panel 53 via an adhesive or the like. In addition, the spacer 61 may also be fixed to the first rib 533 or the second rib 535 via an adhesive or the like.

[0088] In the example shown in the figure, one spacer 61 is disposed on the +Y side and the -Y side of the first rib 533. However, the arrangement position of the spacer 61 is not limited thereto. In addition, the spacer 61 is provided as a member different from the reinforcing panel 53, but may be formed integrally with the reinforcing panel 53, for example.

[0089] The spacer 61 is located between the top panel 51 (more specifically, the back panel 515) and the bottom plate 531 of the reinforcing panel 53, and is sandwiched between the top panel 51 and the bottom plate 531. The size of the spacer 61 is substantially the same as the size of the first rib 533 and the second rib 535 in the Z direction.

[0090] The spacing screw 63 has a head 631 and a threaded portion 633. In the Z direction, the head 631 of the spacing screw 63 is located between the decorative plate 513 and the back panel 515. In the Z direction, the size of the head 631 of the spacing screw 63 is substantially the same as the size of the heat insulation board 511. A threaded hole engaged with the threaded portion 633 of the spacing screw 63 is provided on the upper portion of the spacer 61. The threaded portion 633 of the spacing screw 63 passes through the back panel 515 and is fixed to the threaded hole of the spacer 61. The head 631 is inserted into the through hole provided on the heat insulation board 511. The spacing screw 63 ensures the interval between the decorative plate 513 and the back panel 515 in the Z direction. Thus, the position of the decorative plate 513 relative to the back panel 515 is appropriately adjusted. In addition, in the Z direction, the position of the back panel 515 is limited by the head 631 of the spacing screw 63 and the spacer 61.

[0091] The screw 65 has a head 651 and a threaded portion 653. A threaded hole engaged with the threaded portion 653 of the screw 65 is provided at the upper portion of the spacing screw 63. The threaded portion 653 of the screw 65 passes through the decorative plate 513 and is fixed to the threaded hole of the spacing screw 63. The decorative plate 513 is arranged between the head 651 of the screw 65 and the head 631 of the spacing screw 63.

[0092] The first collar 67 is a member having a circular ring shape when viewed from above. The first collar 67 is clamped and fixed between the head 631 of the spacing screw 63 and the spacing member 61 in the Z direction. In the Z direction, the thickness of the first collar 67 is slightly greater than the thickness of the back panel 515. Therefore, in a state where the spacing screw 63 is fixed to the spacing member 61, a slight gap is formed between the head 631 and the back panel 515 in the Z direction.

[0093] The second collar 69 is a member having a circular ring shape when viewed from above. The second collar 69 is clamped and fixed between the head 651 of the screw 65 and the head 631 of the spacing screw 63 in the Z direction. The thickness of the second collar 69 is slightly greater than the thickness of the decorative plate 513 in the Z direction. Therefore, in a state where the screw 65 is fixed to the spacing screw 63, a slight gap is formed between the head 651 and the decorative plate 513 in the Z direction.

[0094] As described above, the substrate heating device 1 of the present embodiment includes a hot plate 20, a frame portion 40 and a cover portion 50. The hot plate 20 heats the substrate 9. The frame portion 40 has an opening 41 at the top. The frame portion 40 can accommodate the hot plate 20 on the inside. The cover portion 50 closes the opening 41 at the top of the frame portion 40. The frame portion 40 has a top plate panel 51 as a top plate and a reinforcing panel 53 as a reinforcing member. The top plate panel 51 includes a heat insulating material. The reinforcing panel 53 has a first rib 533 and a second rib 535 as ribs connected to the lower surface of the top plate panel 51. The first rib 533 and the second rib 535 protrude downward from the lower surface of the top plate panel 51 and extend parallel to the lower surface of the top plate panel 51. According to the structure, the rigidity of the top plate panel 51 can be improved by the first rib 533 and the second rib 535. Therefore, the thermal warping of the cover portion 50 can be reduced while maintaining the heat insulation property of the cover portion 50 at a high level.

[0095] The first rib 533 and the second rib 535 include fiber reinforced resin. According to the above structure, the heat warping of the cover 50 can be reduced while avoiding the increase in weight of the cover 50.

[0096] The ribs include: a first rib 533 extending in a first direction (X direction) and a second rib 535 extending in a second direction (here, Y direction orthogonal to X direction) intersecting the first direction. According to the structure, the bottom plate 531 and the second rib 535 intersect, and the rigidity of the top plate panel 51 can be further improved compared to the case where they do not intersect.

[0097] The reinforcing panel 53 has a bottom plate portion 531. The bottom plate portion 531 is connected to the lower portions of the first rib portion 533 and the second rib portion 535. The bottom plate portion 531 faces the top panel 51 at a distance in the Z direction. According to the above structure, a space can be formed between the top panel 51 and the reinforcing panel 53 by the first rib portion 533 and the second rib portion 535. Thus, an air heat insulation effect can be obtained.

[0098] The lower surface of the bottom plate portion 531 is a flat surface. According to the above structure, even if sublimates of the coating liquid from the substrate 9 adhere to the lower surface of the bottom plate portion 531, they can be easily removed by cleaning such as wiping.

[0099] The first rib 533, the second rib 535 and the bottom plate 531 are integrally formed. According to the above structure, by removing the joints between the parts, the reinforcing panel 53 can be easily assembled. In addition, by removing the joints between the parts, the cover 50 can be made lighter and the durability can be improved.

[0100] The cover 50 further includes a fixing portion 60 for fixing the top panel 51 to the reinforcing panel 53. The fixing portion 60 includes a spacer 61 and a spacer screw 63. The spacer 61 is located between the top panel 51 and the bottom panel 531. The spacer screw 63 engages with a threaded hole provided on the upper portion of the spacer 61. The spacer screw 63 connects the top panel 51 to the spacer 61. According to the structure, the position of the top panel 51 relative to the bottom panel 531 can be appropriately adjusted while ensuring the interval between the top panel 51 and the bottom panel 531 of the reinforcing panel 53 by the spacer screw 63.

[0101] The top panel 51 includes a heat insulating plate 511 and a back panel 515. The heat insulating plate 511 includes a heat insulating material. The back panel 515 is located below the heat insulating plate 511. The back panel 515 has higher wear resistance than the heat insulating plate 511. According to the above structure, the generation of dust from the heat insulating plate 511 can be reduced.

[0102] The fixing portion 60 further includes a first collar 67. The first collar 67 is fixed between the head 631 of the spacing screw 63 and the spacing member 61. The thickness of the first collar 67 is greater than the thickness of the back panel 515. The first collar 67 has a ring shape into which the threaded portion 633 of the spacing screw 63 is inserted. A gap is formed between the head 631 of the spacing screw 63 and the back panel 515. According to the structure, since the back panel 515 is not fixed by the spacing screw 63, even if the back panel 515 undergoes thermal expansion, the deformation of the back panel 515 is not suppressed by the spacing screw 63, and therefore, the stress inside the back panel 515 can be reduced. Therefore, deformation such as thermal warping or damage such as cracking of the back panel 515 can be reduced.

[0103] The top panel 51 further includes a decorative plate 513. The decorative plate 513 is located above the heat insulating plate 511 and has higher wear resistance than the heat insulating plate 511. According to the above structure, generation of dust and the like from the heat insulating plate 511 can be reduced.

[0104] The fixing portion 60 includes a screw 65 and a second collar 69. The screw 65 is engaged with a threaded hole provided at the upper portion of the spacing screw 63. The second collar 69 is fixed between the head 651 of the screw 65 and the head 631 of the spacing screw 63. The thickness of the second collar 69 is greater than the thickness of the decorative plate 513. The second collar 69 has a ring shape into which the threaded portion 653 of the screw 65 is inserted. A gap is formed between the head 651 of the screw 65 and the decorative plate 513. According to the structure, since the decorative plate 513 is not fixed by the screw 65, even if the decorative plate 513 expands thermally, the deformation of the decorative plate 513 will not be suppressed by the screw 65, and therefore, the stress inside the decorative plate 513 can be reduced. Therefore, deformation such as thermal warping or damage such as cracking of the decorative plate 513 can be reduced.

[0105] <2. Second Embodiment>

[0106] In the following description, components having the same functions as components already described are denoted by the same reference numerals or reference numerals with alphabetical characters added thereto, and detailed descriptions thereof may be omitted.

[0107] Figure 5 1 is a diagram showing a cover 50a included in the substrate heating device 1 of the second embodiment. The cover 50a includes a top panel 51 and a reinforcing panel 53, similarly to the cover 50. However, the cover 50a further includes a low expansion member 55. The low expansion member 55 is located below the reinforcing panel 53 and is bonded to the lower surface of the bottom plate 531 of the reinforcing panel 53 in this embodiment.

[0108] The linear expansion coefficient of the low expansion member 55 is lower than that of the reinforcing panel 53. As the low expansion member 55, for example, a prepreg (a carbon fiber sheet pre-impregnated with a resin) can be used. In addition, the low expansion member 55 can also be a coating layer formed by applying a coating agent containing a resin or the like. The coating agent is appropriately selected according to the surface raw material of the bottom plate portion 531. For example, in the case where the reinforcing panel 53 is a flame retardant fiber reinforced resin, a coating agent containing brominated bisphenol A type epoxy acrylate resin can be used.

[0109] Thus, the reinforcing panel 53 of the cover 50a includes the low expansion member 55 located below the bottom plate 531 and having a lower linear expansion coefficient than the reinforcing panel 53. With this structure, the thermal warpage of the bottom plate 531 can be actively reduced, and therefore the thermal warpage of the cover 50 can be reduced.

[0110] The present invention has been described in detail, but the description is illustrative in all aspects and the present invention is not limited thereto. It can be interpreted that numerous modifications not illustrated can be envisioned without departing from the scope of the present invention. The structures described in the embodiments and modifications can be appropriately combined or omitted as long as they do not contradict each other.

Claims

1. A substrate heating device, characterized in that: include: A hot plate, for heating the substrate; A frame portion having an opening at the top and capable of accommodating the heat plate inside; as well as A cover portion is provided to close the upper opening of the frame portion, Wherein, the cover has: a roof panel, including insulation; as well as a reinforcing member having a rib connected to the lower surface of the top plate, The rib protrudes downward from the lower surface of the top plate and extends parallel to the lower surface of the top plate.

2. The substrate heating device according to claim 1, characterized in that: The ribs include a fiber reinforced resin.

3. The substrate heating device according to claim 1 or 2, characterized in that: The ribs include: a first rib extending along a first direction; and The second rib extends along a second direction intersecting the first direction.

4. The substrate heating device according to claim 1 or 2, characterized in that: The reinforcing member also has: The bottom plate portion is connected to the lower portion of the rib portion and faces the top plate with a gap therebetween.

5. The substrate heating device according to claim 4, characterized in that: The lower surface of the bottom plate is a flat surface.

6. The substrate heating device according to claim 4, characterized in that: The rib portion is formed integrally with the bottom plate portion.

7. The substrate heating device according to claim 4, characterized in that: The reinforcing member has a low expansion portion, The low expansion portion is located below the bottom plate portion and has a linear expansion coefficient lower than that of the reinforcing member.

8. The substrate heating device according to claim 4, characterized in that: The cover portion further comprises: a fixing portion for fixing the top plate to the reinforcing member, The fixing portion has: a spacer located between the top plate and the bottom plate; and The spacer screw is engaged with the threaded hole provided on the upper portion of the spacer and connects the top plate to the spacer.

9. The substrate heating device according to claim 8, characterized in that: The top plate has: Insulation panels, including insulation materials; and The back plate is located on the lower side of the heat insulation plate and has higher wear resistance than the heat insulation plate.

10. The substrate heating device according to claim 9, characterized in that: The fixing portion further comprises: an annular first collar fixed between the head of the spacing screw and the spacing piece and into which the threaded portion of the spacing screw is inserted; The thickness of the first collar is greater than the thickness of the back panel, A gap is formed between the head of the spacing screw and the back panel.

11. The substrate heating device according to claim 10, characterized in that: The top plate also has: The decorative plate is located on the upper side of the heat insulation plate and has higher wear resistance than the heat insulation plate.

12. The substrate heating device according to claim 11, characterized in that: The fixing portion further comprises: a screw engaged with a threaded hole provided on an upper portion of the spacer screw; and an annular second collar fixed between the head of the screw and the head of the spacer screw and for the threaded portion of the screw to be inserted, The thickness of the second collar is greater than the thickness of the decorative plate, A gap is formed between the head of the screw and the decorative plate.

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