Intelligent transistor die bonder

Abstract

The invention discloses an intelligent transistor die bonder, and relates to the field of transistor die bonders, the intelligent transistor die bonder comprises a shell, the shell is rotatably connected with at least one turntable, the outer wall of the turntable is circumferentially connected with fixed cylinders at intervals, the fixed cylinders are internally and fixedly connected with inner cylinders, and the fixed cylinders are slidably connected with reversing cylinders; the outer wall of the cross section of the reversing cylinder is polygonal, the inner wall of the cross section of the reversing cylinder is circular, the top end of the reversing cylinder is connected with a plurality of inserting columns, the inner wall of the fixing cylinder is provided with a plurality of inserting holes matched with the inserting columns, a sliding table is arranged between the inserting holes in the circumferential direction, the center of the sliding table is higher than the two sides of the sliding table, and the side wall of the shell is fixedly connected with a blocking box. And a stop block is slidably connected in the stop box. The angle of the transistor is adjusted while the rotating disc rotates to adjust the angle, angle adjustment of the transistor after adsorption is conveniently achieved, the number of raw material conveying belts is effectively reduced, the moving path of the moving platform is shortened, and then the transistor bonding efficiency is greatly improved.

Description

Technical Field

[0001] The invention relates to the field of transistor die bonding machines, in particular to an intelligent transistor die bonding machine. Background Art

[0002] The die bonder is a highly complex and precision machine that uses advanced vision systems, such as optical sensors and high-resolution cameras, to detect and locate tiny electronic components. This vision system is able to operate at nanometer-level accuracy, ensuring precise positioning of components.

[0003] Existing transistor die bonding machines generally include a horizontal fast moving platform, on which a plurality of vertically downward negative pressure holding components are arranged. The moving platform moves to the feeding belt of the die bonding machine. After the holding components use negative pressure to hold the transistor, the moving platform passes through a visual inspection camera. After the camera takes a picture of the transistor for inspection, the moving platform moves to the position on the PCB board where the transistor needs to be bonded, and then the transistor is bonded to the specified position on the PCB board.

[0004] With respect to the above-mentioned related technologies, when the existing transistor bonding machine is performing the bonding work of the transistor, its holding structure generally cannot rotate and adjust the angle of the transistor after holding the transistor. In view of the different installation orientation requirements of the same transistor on the PCB board, it is often necessary to provide multiple feeding conveyor belts for the same transistor device, and transistors with different orientations are placed in advance in the multiple feeding conveyor belts. When the PCB board requires bonding of multiple transistors in different orientations, the number of conveyor belts needs to be increased accordingly, resulting in an increase in the required moving distance of the mobile platform when working. In summary, the existing intelligent transistor bonding machine has the problem of being difficult to adjust the angle of the transistor as needed, resulting in an increase in the moving path of the mobile platform and a reduction in the bonding efficiency. Summary of the invention

[0005] Based on this, the purpose of the present invention is to provide an intelligent transistor bonding machine to solve the technical problem that the existing intelligent transistor bonding machine is difficult to adjust the angle of the transistor as needed, resulting in an increase in the moving path of the mobile platform and a reduction in the bonding efficiency.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an intelligent transistor die bonding machine, comprising a shell, wherein the shell is rotatably connected to at least one turntable, the outer wall of the turntable is connected to a fixed cylinder at intervals along the circumferential direction, an inner cylinder is fixedly connected to the fixed cylinder, and a reversing cylinder is slidably connected, a piston is provided at the bottom end of the inner cylinder, and is slidably connected to the reversing cylinder, the top end of the inner cylinder is connected to a negative pressure gas source, the outer wall of the cross section of the reversing cylinder is polygonal and the inner wall is circular, the top end of the reversing cylinder is annular, and a plurality of plugs are fixedly connected to the edge of the top end, the fixed cylinder The inner wall is provided with a plurality of sockets for matching with the plug posts, and a slide is arranged circumferentially between the sockets, and the center of the slide is higher than the two sides, and a first spring is arranged between the top of the reversing cylinder and the inner wall of the fixed cylinder, and a blocking box is fixedly connected to the side wall of the shell, and a blocking block is slidably connected in the blocking box, and a fourth spring and a second electromagnet are arranged between the blocking block and the inner wall of the blocking box, and a side of the blocking block contacting the reversing cylinder is parallel to the side surface of the reversing cylinder, and a plurality of blocking blocks are arranged in the circumferential direction to maintain the same spacing angle as the fixed cylinder, and the sliding direction is parallel to the axis of the turntable.

[0007] By adopting the above technical solution, the angle of the transistor can be adjusted while the turntable rotates to adjust the angle, which conveniently realizes the angle adjustment of the transistor after being adsorbed, effectively reduces the number of raw material conveyor belts, shortens the moving path of the mobile platform, and thus greatly improves the efficiency of transistor bonding.

[0008] The present invention is further configured as follows: the bottom end of the reversing cylinder is fixedly connected with a fixed block, the reversing cylinder is also slidably connected with a ventilation cylinder, the outer wall of the ventilation cylinder is fixedly connected with a fixed platform, a first electromagnet and a second spring are arranged between the fixed platform and the fixed block, a frustum is arranged at the bottom end of the ventilation cylinder, and a suction cylinder is slidably connected thereto, a conical structure that fits with the frustum is arranged at the top end of the suction cylinder, the diameter of the opening at the top end of the suction cylinder is larger than the outer diameter of the ventilation cylinder, the diameter of the frustum is smaller than the diameter of the inner wall of the suction cylinder, and a third spring is arranged between the inner wall of the suction cylinder and the bottom end of the frustum.

[0009] By adopting the above technical solution, the holding cylinder is brought close to the transistor on the feed belt, so that the transistor can be held. When the holding cylinder moves to the position above the PCB board where the transistor needs to be adhered, the corresponding first belt electromagnet is energized, and after the transistor contacts the PCB board, the holding cylinder and the ventilation cylinder slide relative to each other, and a gap appears between the bottom end of the ventilation cylinder and the top end of the holding cylinder. At this time, the transistor can be released from the holding, and the first electromagnet is powered off to complete the work of attaching the transistor to that position of the PCB board.

[0010] The present invention is further configured such that a piston is disposed at the top end of the ventilation cylinder, and the portion of the ventilation cylinder where the piston is disposed will not leave the reversing cylinder.

[0011] By adopting the above technical solution, a gap for air leakage is prevented from appearing between the vent cylinder and the reversing cylinder when the vent cylinder slides, thereby effectively ensuring that the transistor is stably held by the holding cylinder.

[0012] The present invention is further configured such that the bottom end of the vent cylinder is fixedly connected with a guide strip along the length direction, and the top end of the suction cylinder is provided with a notch matching the guide strip.

[0013] By adopting the above technical solution, the guide strip cooperates with the notch at the top of the suction cylinder, which effectively prevents the suction cylinder from rotating relative to the reversing cylinder, thereby ensuring the accuracy of the rotation adjustment angle of the reversing cylinder.

[0014] The present invention is further configured such that an air duct is connected to the top of the fixed cylinder, one end of the air duct is connected to the inner cylinder, and the other end extends to the center of the turntable and is connected to each other, and the air ducts on the turntable are connected to each other and then connected to a rotating air joint.

[0015] By adopting the above technical solution, the negative pressure state in the fixed cylinder is continuously maintained through the rotating air joint and the multiple groups of air guide tubes.

[0016] The present invention is further configured such that a rotating shaft is arranged in the shell, the rotating shaft in the shell extends out of the shell to both sides and is fixedly connected to a turntable, and magnetic couplers are respectively arranged at both ends located inside the shell.

[0017] By adopting the above technical solution, the driving motor on the moving platform in the bonding machine body cooperates with the transmission structure to drive the rotating shaft to rotate, so that the turntable can be intermittently rotated at the same angle.

[0018] The present invention is further configured such that a first mounting bracket is fixedly connected to the outer wall of the shell, a camera is fixedly arranged on the first mounting bracket in the direction of the suction cylinder, a second mounting bracket is fixedly connected to the first mounting bracket, a telescopic cylinder is installed on the second mounting bracket, when the telescopic cylinder is opposite to one of the suction cylinders, the camera is opposite to the other suction cylinder at the same time, and the telescopic cylinder is used to remove the transistor held by the suction cylinder.

[0019] By adopting the above technical solution, a camera is used to photograph and inspect the already held transistor when other holding tubes are holding transistors.

[0020] The present invention is further configured such that a collection box is fixedly connected between the second mounting frames, the telescopic tube includes a fixed part fixedly connected to the second mounting frame and a telescopic part slidably connected inside the fixed part, the front end of the telescopic part of the telescopic tube is connected to a fixing ring, the bottom end of the fixing ring is rotatably connected to a guide box, and the bottom end of the guide box is always located inside the collection box.

[0021] By adopting the above technical solution, it is possible to effectively prevent unqualified transistors from being scattered everywhere, and it is also possible to prevent unqualified transistors from falling and affecting the camera's shooting work.

[0022] In summary, the present invention mainly has the following beneficial effects:

[0023] 1. The present invention connects a housing structure below the transfer platform, rotatably connects a turntable on both sides of the bottom of the housing, and uses a reversing cylinder slidably connected in a fixed cylinder distributed annularly at intervals on the turntable to cooperate with a blocking block slidably connected inside a blocking box, so that the angle of the transistor is adjusted while the turntable rotates to adjust the angle, thereby conveniently realizing the angle adjustment of the transistor after being adsorbed, effectively reducing the number of raw material conveyor belts, shortening the moving path of the mobile platform, and thereby greatly improving the efficiency of transistor wafer bonding;

[0024] 2. The present invention achieves airtightness by slidingly connecting the vent cylinder in the reversing cylinder and using the conical protrusion at the bottom of the vent cylinder to cooperate with the conical structure at the top of the suction cylinder. When the transistor is attached to the PCB board, the vent cylinder continues to press down, and a gap appears between the bottom of the vent cylinder and the top of the suction cylinder, so that the bottom of the suction cylinder is relieved of the negative pressure state, and the transistor is automatically released after being attached.

[0025] 3. The present invention fixes a camera for visual inspection on the housing, and while the turntable rotates to hold the transistors in the feeding belt one by one, the transistors passing in front of the camera are photographed and inspected in sequence. When an unqualified transistor is detected, as the turntable continues to rotate, the holding cylinder holding the unqualified transistor is aligned with the telescopic cylinder, and the telescopic part of the telescopic cylinder is extended to make the transistor fall, and the detection and holding of the transistor are performed synchronously, thereby further improving the working efficiency of the placement machine;

[0026] 4. The present invention connects a fixed ring to the front end of the telescopic part of the telescopic tube, and rotatably connects a guide box under the fixed ring. After the telescopic tube is extended to make the unqualified transistors fall, a collection box is used to collect the unqualified transistors that have slipped into the guide box, thereby effectively preventing the unqualified transistors from scattering everywhere and also preventing the unqualified transistors from falling and affecting the shooting work of the camera. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A perspective view of the present invention;

[0028] Figure 2 It is a three-dimensional diagram of the suction and holding structure of the present invention;

[0029] Figure 3 A three-dimensional diagram of the suction and holding structure from another perspective of the present invention;

[0030] Figure 4 For the present invention Figure 3 A magnified view of middle;

[0031] Figure 5 It is a front view of the suction and holding mechanism of the present invention;

[0032] Figure 6 It is a three-dimensional internal view of the blocking box and the fixing tube of the present invention;

[0033] Figure 7 A three-dimensional diagram of a suction rod of the suction structure of the present invention;

[0034] Figure 8 A three-dimensional diagram of the internal structure of the suction rod of the suction structure of the present invention;

[0035] Fig. 9 For the present invention Figure 8 Enlarged view of middle B;

[0036] Fig.10 It is an exploded stereogram of the internal structure of the suction rod of the suction structure of the present invention;

[0037] Fig.11 It is a three-dimensional diagram of the fixed cylinder and the reversing cylinder of the present invention;

[0038] Fig.12 For the present invention Fig.11 Enlarged view of C in the middle.

[0039] In the figure: 1. shell; 2. turntable; 3. fixed cylinder; 4. air guide tube; 5. rotary air joint; 6. inner cylinder; 7. reversing cylinder; 8. fixed block; 9. vent cylinder; 10. suction cylinder; 11. first spring; 12. second spring; 13. third spring; 14. socket; 15. slide; 16. plug column; 17. fixed table; 18. first electromagnet; 19. cone; 20. guide strip; 21. blocking box; 22. blocking block; 23. second electromagnet; 24. fourth spring; 25. first mounting bracket; 26. second mounting bracket; 27. camera; 28. collecting box; 29. ​​telescopic cylinder; 30. fixing ring; 31. guide box; 32. bonding machine body; 33. feeding belt. DETAILED DESCRIPTION

[0040] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0041] The following describes an embodiment of the present invention based on its overall structure.

[0042] Embodiment 1

[0043] An intelligent transistor die bonding machine, such as Figure 1-12As shown, it includes a shell 1, which is fixedly connected to the bottom of the moving platform of the bonding machine body 32. The shell 1 is rotatably connected to at least one turntable 2. The outer wall of the turntable 2 is connected to a fixed cylinder 3 at an annular interval. The fixed cylinder 3 is fixedly connected to an inner cylinder 6 and is slidably connected to a reversing cylinder 7. A piston is provided at the bottom end of the inner cylinder 6 and is slidably connected to the reversing cylinder 7. When the reversing cylinder 7 slides relative to the fixed cylinder 3 along the axial direction of the inner cylinder 6, it plays an effect of continuously maintaining air tightness. The top end of the inner cylinder 6 is connected to a negative pressure gas source. Specifically, the top end of the inner cylinder 6 is connected to an internal negative pressure air guide pipe 4.

[0044] See also Figure 1-12 The outer wall of the cross-section of the reversing cylinder 7 is polygonal and the inner wall is circular. The top of the reversing cylinder 7 is annular, and a plurality of plug posts 16 are fixedly connected to the edge of the top. The inner wall of the fixed cylinder 3 is provided with a plurality of sockets 14 that cooperate with the plug posts 16. Specifically, the sockets 14 are spaced at the same angle in the annular direction, and the number is the same as the number of sides of the cross-section of the outer wall of the reversing cylinder 7. There are four sockets 14 spaced ninety degrees in the annular direction, and the outer wall of the reversing cylinder 7 is specifically an equilateral quadrilateral. A slide 15 is arranged annularly between the sockets 14, and the center of the slide 15 is higher than the two sides. A first spring 11 is arranged between the top of the reversing cylinder 7 and the inner wall of the fixed cylinder 3. Specifically, the first spring 11 accumulates elastic potential energy before the reversing cylinder 7 rotates and the plug post 16 does not reach the highest point of the slide 15, and releases the elastic potential energy after the plug post 16 slides beyond the highest point of the slide 15.

[0045] See also Figure 1-12 A blocking box 21 is fixedly connected to the side wall of the shell 1. Specifically, the number of blocking boxes 21 is one less than the number of plug posts 16, and the angle of mutual spacing in the annular direction is the same as that of the fixed cylinder 3. A blocking block 22 is slidably connected in the blocking box 21. A fourth spring 24 and a second electromagnet 23 are arranged between the blocking block 22 and the inner wall of the blocking box 21. Specifically, the second electromagnet 23 is normally energized to keep the blocking block 22 in a position where it will not contact the reversing cylinder 7. The side of the blocking block 22 that contacts the reversing cylinder 7 is parallel to the side surface of the reversing cylinder 7 when it is not rotated. A plurality of blocking blocks 22 are arranged in the annular direction to maintain the same spacing angle as the fixed cylinder 3, and the sliding direction is parallel to the axis of the turntable 2.

[0046] See also Figure 1-6 The top of the fixed cylinder 3 is connected with an air guide tube 4, one end of the air guide tube 4 is connected with the inner cylinder 6, and the other end extends to the center of the turntable 2 and is connected to each other. The air guide tubes 4 on the turntable 2 are connected to each other and then connected to a rotating air joint 5. The rotating air joint 5 is connected to the negative pressure pipeline on the bonding machine body 32. The negative pressure state in the fixed cylinder 3 is continuously maintained through the rotating air joint 5 and the multiple groups of air guide tubes 4.

[0047] See also Figure 5-12The bottom end of the reversing cylinder 7 is fixedly connected with a fixed block 8, and a ventilating cylinder 9 is also slidably connected inside the reversing cylinder 7. The outer wall of the ventilating cylinder 9 is fixedly connected with a fixed platform 17. Specifically, the fixed platform 17 is slidably connected inside the fixed block 8. A first electromagnet 18 and a second spring 12 are arranged between the fixed platform 17 and the fixed block 8. A frustum 19 is arranged at the bottom end of the ventilating cylinder 9, and a suction cylinder 10 is slidably connected thereto. A conical structure that fits the frustum 19 is arranged at the top end of the suction cylinder 10. The diameter of the opening at the top end of the suction cylinder 10 is larger than the outer diameter of the ventilating cylinder 9, and the diameter of the frustum 19 is smaller than the diameter of the inner wall of the suction cylinder 10. A third spring 13 is arranged between the inner wall of the suction cylinder 10 and the bottom end of the frustum 19. Specifically, The third spring 13 is used to reset the suction cylinder 10. When the suction cylinder 10 is above the feeding belt 33, the corresponding first electromagnet 18 is energized and the air cylinder 9 moves downward, so that the suction cylinder 10 is close to the transistor on the feeding belt 33, and the transistor can be sucked. When the suction cylinder 10 moves to the position above the PCB board where the transistor needs to be adhered, the corresponding first electromagnet 18 is energized. After the transistor contacts the PCB board, the suction cylinder 10 and the air cylinder 9 slide relative to each other, and a gap appears between the bottom end of the air cylinder 9 and the top end of the suction cylinder 10. At this time, the suction of the transistor can be released, and the first electromagnet 18 is powered off to complete the transistor attachment work at this position of the PCB board.

[0048] See also Figure 6-10 A piston is provided at the top of the vent cylinder 9, and the part of the vent cylinder 9 where the piston is provided will not leave the reversing cylinder 7, preventing a gap for air leakage from appearing between the vent cylinder 9 and the reversing cylinder 7 when sliding, effectively ensuring the stable holding of the transistor by the suction cylinder 10, and a guide strip 20 is fixedly connected to the bottom end of the vent cylinder 9 along the length direction, and a notch is provided at the top of the suction cylinder 10 to match the guide strip 20, and the guide strip 20 cooperates with the notch at the top of the suction cylinder 10, effectively preventing the suction cylinder 10 from rotating relative to the reversing cylinder 7, thereby ensuring the accuracy of the rotation adjustment angle of the reversing cylinder 7.

[0049] See also Figure 1-6 A rotating shaft is arranged in the shell 1, and the rotating shaft in the shell 1 is fixedly connected with a turntable 2 after extending out of the shell 1 to both sides, and magnetic couplers are respectively arranged at both ends located inside the shell 1. When one of the turntables 2 needs to rotate and the other turntable 2 does not rotate, the connection of one of the magnetic couplers can be cut off, and the rotating shaft between the two magnetic couplers is connected with a transmission chain, and the other end of the transmission chain is connected to a servo motor arranged in the moving platform to achieve precise control of the intermittent rotation angle of the turntable 2, so that the suction holding cylinder 10 connected to the turntable 2 always maintains a vertical downward state. The driving motor on the moving platform in the bonding machine body 32 cooperates with the transmission structure to drive the rotating shaft to rotate, so that the turntable 2 can maintain the same angle of intermittent rotation.

[0050] See also Figure 1-9 The feed belts 33 are arranged evenly at intervals on the bonding machine body 32, and the distance between the corresponding suction cylinders 10 on the turntable 2 connected to the two sides of the shell 1 is the same as the spacing between the feed belts 33. Therefore, after the turntable 2 rotates once, the two suction cylinders 10 on both sides of the shell 1 can be synchronously lowered to hold the transistor when the corresponding first electromagnets 18 are energized. The rotation of the turntable 2 enables multiple suction cylinders 10 to hold the transistor in the feed belt 33, which greatly reduces the number of times the moving platform of the bonding machine body 32 moves between the PCB board and the feed belt 33, and further improves the work efficiency of transistor pasting.

[0051] Embodiment 2

[0052] An intelligent transistor die bonding machine, such as Figure 1-12 As shown, on the basis of Example 1, the difference from Example 1 lies in that a first mounting frame 25 is fixedly connected to the outer wall of the shell 1, and a camera 27 is fixedly provided on the first mounting frame 25 in the direction of the suction cylinder 10. Specifically, when one of the suction cylinders 10 on the turntable 2 is vertically facing downward, the other suction cylinder 10 on the turntable 2 is aligned with the camera 27, and the camera 27 is used to photograph and inspect the sucked transistors when the other suction cylinders 10 suck the transistors, to ensure that the transistors are qualified and the orientation is the same as the required orientation. Specifically, when the turntable 2 rotates one circle and the bonding machine body 32 moves to the top of the PCB board for bonding, the turntable 2 continues to rotate along the previous rotation direction, and the camera 27 can also photograph and inspect the subsequent transistors.

[0053] See also Figure 1-5 The first mounting frame 25 is fixedly connected to the second mounting frame 26, and the second mounting frame 26 is equipped with a telescopic cylinder 29. Specifically, the telescopic cylinder 29 includes a fixed part fixedly connected to the second mounting frame 26, and a telescopic part slidably connected to the fixed part. When the telescopic cylinder 29 is opposite to one of the holding cylinders 10, the camera 27 is simultaneously opposite to the other holding cylinder 10. The telescopic cylinder 29 is used to remove the transistor held on the holding cylinder 10. When the camera 27 takes a picture of an unqualified transistor, when the unqualified transistor is rotated to the next station and aligned with the telescopic cylinder 29, the telescopic part of the telescopic cylinder 29 is extended to make the unqualified transistor fall down.

[0054] See also Figure 1-5A collection box 28 is fixedly connected between the second mounting frame 26. Specifically, the collection box 28 can also improve the stability of the second mounting frame 26. The telescopic cylinder 29 includes a fixed part fixedly connected to the second mounting frame 26 and a telescopic part slidably connected to the fixed part. The front end of the telescopic part of the telescopic cylinder 29 is connected to a fixing ring 30, and the bottom end of the fixing ring 30 is rotatably connected to a guide box 31. The bottom end of the guide box 31 is always located in the collection box 28. When the telescopic part of the telescopic cylinder 29 is extended to cause unqualified transistors to fall, the guide box 31 guides the fallen transistors so that they slide into the collection box 28 along the guide box 31, which effectively prevents the unqualified transistors from scattering everywhere and also prevents the unqualified transistors from falling and affecting the shooting of the camera 27.

[0055] The working principle of the present invention is as follows: the moving platform of the chip bonding machine body 32 moves to the top of the feeding belt 33, the holding cylinder 10 faces the corresponding transistor on the feeding belt 33, and the first electromagnet 18 corresponding to the holding cylinder 10 is energized, so that the holding cylinder 10 holds the transistor. In this way, the turntable 2 rotates intermittently and the moving platform moves continuously to realize the holding of the transistors one by one. When the angle of the transistor needs to be adjusted, if there are three blocking boxes 21 in total and the cross-section of the outer wall of the reversing cylinder 7 is an equilateral quadrilateral, if the transistor needs to be adjusted to rotate ninety degrees, the second electromagnet 23 in one of the blocking boxes 21 fixedly connected to the housing 1 is de-energized, so that the blocking block 22 inside it slides out. During the rotation of the turntable 2, the side of the reversing cylinder 7 The first spring 11 is compressed to accumulate elastic potential energy, and the plug 16 leaving the socket 14 moves along the slide 15 until it passes the highest point in the middle of the slide 15, and then quickly slides into the next socket 14 under the elastic force of the first spring 11, realizing a precise rotation of ninety degrees, and then the second electromagnet 23 released from the commutation cylinder 7 is energized to restore the suction of the blocking block 22, so as to prevent the blocking block 22 from affecting the subsequent commutation cylinder 7. In this way, if the transistor is to be rotated one hundred and eighty degrees, two blocking blocks 22 need to be extended to make them contact with the same commutation cylinder 7, thereby conveniently realizing the angle adjustment of the transistor.

[0056] Although an embodiment of the present invention has been shown and described, this specific embodiment is only an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contribution as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. An intelligent transistor die bonding machine, comprising a housing (1), characterized in that: The housing (1) is rotatably connected to at least one rotating disk (2); the outer wall of the rotating disk (2) is connected to a fixed cylinder (3) at intervals along the annular direction; the inner wall of the fixed cylinder (3) is fixedly connected to an inner cylinder (6) and is slidably connected to a reversing cylinder (7); a piston is provided at the bottom end of the inner cylinder (6) and is slidably connected to the reversing cylinder (7); the top end of the inner cylinder (6) is connected to a negative pressure gas source; the outer wall of the cross section of the reversing cylinder (7) is polygonal and the inner wall is circular; the top end of the reversing cylinder (7) is annular and a plurality of plug posts (16) are fixedly connected to the edge of the top end; the inner wall of the fixed cylinder (3) is provided with a plurality of plug holes (14) matching the plug posts (16); and the plug holes (14) are arranged along the annular direction. A slide table (15) is arranged, the center of the slide table (15) is higher than both sides, a first spring (11) is arranged between the top of the reversing cylinder (7) and the inner wall of the fixed cylinder (3), a blocking box (21) is fixedly connected to the side wall of the housing (1), a blocking block (22) is slidably connected inside the blocking box (21), a fourth spring (24) and a second electromagnet (23) are arranged between the blocking block (22) and the inner wall of the blocking box (21), a side of the blocking block (22) contacting the reversing cylinder (7) is parallel to the side surface of the reversing cylinder (7), a plurality of blocking blocks (22) are arranged in a ring direction at the same interval angle as the fixed cylinder (3), and the sliding direction is parallel to the axis of the rotating disk (2).

2. The intelligent transistor die bonding machine according to claim 1, characterized in that: The bottom end of the reversing cylinder (7) is fixedly connected to a fixed block (8), and a vent cylinder (9) is slidably connected inside the reversing cylinder (7). The outer wall of the vent cylinder (9) is fixedly connected to a fixed platform (17), and a first electromagnet (18) and a second spring (12) are arranged between the fixed platform (17) and the fixed block (8). The bottom end of the vent cylinder (9) is provided with a cone (19), and is slidably connected to a holding cylinder (10). The top end of the holding cylinder (10) is provided with a conical structure that fits with the cone (19), the diameter of the top opening of the holding cylinder (10) is larger than the outer diameter of the vent cylinder (9), the diameter of the cone (19) is smaller than the diameter of the inner wall of the holding cylinder (10), and a third spring (13) is arranged between the inner wall of the holding cylinder (10) and the bottom end of the cone (19).

3. The intelligent transistor die bonding machine according to claim 2, characterized in that: The top end of the vent cylinder (9) is provided with a piston, and the portion of the vent cylinder (9) provided with the piston will not leave the reversing cylinder (7).

4. The intelligent transistor die bonding machine according to claim 2, characterized in that: The bottom end of the vent cylinder (9) is fixedly connected to a guide strip (20) along the length direction, and the top end of the suction cylinder (10) is provided with a notch matching the guide strip (20).

5. The intelligent transistor die bonding machine according to claim 1, characterized in that: The top end of the fixed cylinder (3) is connected to an air guide tube (4), one end of the air guide tube (4) is connected to the inner cylinder (6), and the other end extends to the center of the turntable (2) and is connected to each other. The air guide tubes (4) on the turntable (2) are connected to each other and then connected to a rotating air joint (5).

6. The intelligent transistor die bonding machine according to claim 1, characterized in that: A rotating shaft is arranged in the shell (1), and the rotating shaft in the shell (1) extends out of the shell (1) to both sides and is fixedly connected to a rotating disk (2), and magnetic couplers are also arranged at both ends located inside the shell (1).

7. The intelligent transistor die bonding machine according to claim 1, characterized in that: The outer wall of the shell (1) is fixedly connected to a first mounting frame (25); a camera (27) is fixedly arranged on the first mounting frame (25) in the direction of the suction cylinder (10); a second mounting frame (26) is fixedly connected to the first mounting frame (25); a telescopic cylinder (29) is installed on the second mounting frame (26); when the telescopic cylinder (29) is opposite to one of the suction cylinders (10), the camera (27) is simultaneously opposite to the other suction cylinder (10); the telescopic cylinder (29) is used to remove the transistor sucked by the suction cylinder (10).

8. The intelligent transistor die bonding machine according to claim 7, characterized in that: A collection box (28) is fixedly connected between the second mounting frame (26), and the telescopic tube (29) comprises a fixed part fixedly connected to the second mounting frame (26) and a telescopic part slidably connected inside the fixed part. A fixed ring (30) is connected to the front end of the telescopic part of the telescopic tube (29), and a guide box (31) is rotatably connected to the bottom end of the fixed ring (30), and the bottom end of the guide box (31) is always located inside the collection box (28).

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