Sensor monocrystalline silicon etching device based on positioning processing
By setting a rotating disc and clamping block in a single crystal silicon etching device and adjusting the clamping force with a telescopic spring, the problem of inability to flexibly adjust the clamping force in the prior art is solved, and the adaptability and processing accuracy of the device are improved.
Patent Information
- Application Number
- CN202411691511.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-02-21
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Existing single-crystal silicon etching devices cannot flexibly adjust the clamping force according to the materials and sizes of different single-crystal silicon, which may lead to excessive or too small clamping, resulting in the problem of chip damage or falling off.
By setting structures such as rotating discs and clamping blocks in the etching device, the clamping force of the clamping block is adjusted by using a telescopic spring to ensure that the clamping force is adjusted according to the specific needs of the single crystal silicon wafer.
It effectively avoids chip shedding or damage caused by inappropriate clamping force, and improves the device's adaptability to different chips.
Smart Images
Figure CN119495609A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of sensor processing, and in particular is a sensor single crystal silicon etching device based on positioning processing. Background Art
[0002] The sensor single crystal silicon etching device based on positioning processing is a device used for high-precision etching of single crystal silicon. It can determine the processing position of single crystal silicon through a positioning system, and plays a key role in related fields such as sensor manufacturing. It uses specific etching technology to etch single crystal silicon according to a pre-set pattern or shape, thereby meeting the requirements of sensor elements and other requirements for fine processing of single crystal silicon microstructures.
[0003] Some existing etching devices use a three-jaw self-centering chuck to clamp single crystal silicon at multiple points, which can ensure that the single crystal silicon will not be offset due to vibration or other influences during the etching process. However, it is mainly to meet general processing needs. The clamping force of the multi-point clamping is determined by the mechanical structure and power source of the chuck itself. It does not have the function of adjusting the clamping force and cannot be flexibly adjusted according to the material and size specifications of different single crystal silicon. During the clamping process, the single crystal silicon may be damaged or fall off due to excessive or insufficient clamping force. Therefore, a sensor single crystal silicon etching device based on positioning processing is proposed to address the above problems. Summary of the invention
[0004] In order to solve the problems raised in the above background technology, the present invention provides a sensor single crystal silicon etching device based on positioning processing, which solves the problem that the prior art cannot adjust the clamping force according to the specific needs of single crystal silicon.
[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a sensor single crystal silicon etching device based on positioning processing, comprising a base, the top outer wall of the base is fixedly connected to a processing box, the outer wall of the processing box is provided with a connecting pipe through a connecting mechanism, the top outer wall of the base is fixedly connected to a gas source device, the outer wall of the base is provided with a collecting mechanism, and the inner wall of the processing box is provided with a fixing mechanism;
[0006] The fixing mechanism includes a fixing seat, a card slot is provided on the outer wall of the fixing seat, a fixing block is fixedly connected to the outer wall of the fixing seat, a rotating disk is rotatably connected to the inner wall of the fixing block, an inclined groove is provided on the outer wall of the rotating disk, a sliding rod is slidably connected to the inner wall of the inclined groove, a clamping block is slidably connected to the outer wall of the fixing block, a moving block is elastically connected to the outer wall of the clamping block via a telescopic spring, an insert block is elastically connected to the inner wall of the rotating disk via a connecting spring, and the outer wall of the fixing block contacts the single crystal silicon wafer.
[0007] Preferably, the fixing seat is fixedly connected to the top outer wall of the base, the sliding rod is in contact with the inner wall of the inclined groove, and the sliding rod is fixedly connected to the moving block.
[0008] Preferably, one end of the telescopic spring is fixedly connected to the outer wall of the moving block, the other end of the telescopic spring is fixedly connected to the outer wall of the clamping block, and the moving block is slidably connected to the inner wall of the fixed block.
[0009] Preferably, one end of the connecting spring is fixedly connected to the outer wall of the insert block, the other end of the connecting spring is fixedly connected to the inner wall of the rotating disk, the insert block is slidably connected to the inner wall of the rotating disk, and the insert block is engaged with the slot.
[0010] Preferably, the connecting mechanism includes a connecting block, the inner wall of the connecting block is elastically connected to a wedge block through a return spring, the inner wall of the connecting block is slidably connected to a trapezoidal block, the inner wall of the connecting block is slidably connected to a connecting rod, the outer wall of the connecting tube is fixedly connected to a mounting block, and the outer wall of the mounting block is provided with a groove.
[0011] Preferably, the connecting block is fixedly connected to the top outer wall of the processing box, the connecting block contacts the mounting block, one end of the connecting rod is fixedly connected to the outer wall of the wedge block, and the other end of the connecting rod is slidably connected to the outer wall of the trapezoidal block.
[0012] Preferably, one end of the return spring is fixedly connected to the outer wall of the wedge block, the other end of the return spring is fixedly connected to the inner wall of the connecting block, the wedge block is slidably connected to the inner wall of the connecting block, and the wedge block is clamped in the groove.
[0013] Preferably, the collecting mechanism comprises an impurity box, a handle is slidably connected to the top outer wall of the impurity box, an extrusion plate is hinged to the outer wall of the handle via a hinge rod, a compression spring is fixedly connected to the outer wall of the extrusion plate, and a door panel is provided on the outer wall of the impurity box.
[0014] Preferably, the impurity box is fixedly connected to the outer wall of the base, one end of the hinged rod is hinged to the outer wall of the handle, and the other end of the hinged rod is hinged to the outer wall of the extrusion plate.
[0015] Preferably, the compression spring is fixedly connected to the inner wall of the impurity box, and the extrusion plate is slidably connected to the inner wall of the impurity box.
[0016] Compared with the prior art, the present invention has the following beneficial effects:
[0017] The present invention provides a rotating disk and a clamping block, etc., so that the single crystal silicon wafer can be clamped and positioned by the clamping block to prevent the single crystal silicon wafer from being offset and affecting the etching process. In addition, the initial compression amount of the telescopic spring can be changed by rotating the rotating disk according to the single crystal silicon wafer of different materials or sizes, so as to adjust the clamping force of the clamping block, thereby avoiding the problem of wafer falling off due to insufficient clamping force or wafer damage due to excessive clamping force, thereby improving the adaptability of the device to different wafers.
[0018] The present invention provides the cooperation of structures such as wedge blocks and mounting blocks. When installing the connecting pipe, it is only necessary to insert the mounting block into the connecting block and snap the wedge block into the groove to complete the fixation. When disassembling, the connecting pipe can be removed by moving the trapezoidal block to make the wedge block disengage from the groove. There is no need to use complex tools or turn the bolts multiple times, thereby reducing the time for installing and disassembling the connecting pipe and improving the efficiency of equipment maintenance and cleaning.
[0019] The present invention cooperates with structures such as an extrusion plate and a handle, and by pulling the handle to move the extrusion plate downward, the impurities generated by etching can be compressed, the volume of the impurities is reduced, and the space utilization rate of the impurity box is improved, so that the impurity box can accommodate more impurities, thereby reducing the frequency of cleaning impurities, reducing the labor intensity of operators, and also facilitating the subsequent centralized processing and transportation of impurities. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 It is a schematic diagram of the main structure of the present invention;
[0021] Figure 2 It is a schematic diagram of the fixing mechanism structure of the present invention;
[0022] Figure 3 It is a schematic diagram of the cross-sectional structure of the fixing block of the present invention;
[0023] Figure 4 This is a schematic diagram of the structure of the rotating disk and the clamping block after being decomposed;
[0024] Figure 5 This is a schematic diagram of the exploded structure of the connecting block and the mounting block of the present invention;
[0025] Figure 6 It is a cross section of the connection block and a schematic diagram of the exploded structure of the installation block of the present invention;
[0026] Figure 7 This is a schematic diagram of the cross-sectional structure of the processing box of the present invention;
[0027] Figure 8 It is a schematic diagram of the cross-sectional structure of the impurity box of the present invention.
[0028] In the figure: 1. base; 2. fixing mechanism; 201. fixing seat; 202. slot; 203. fixing block; 204. clamping block; 205. telescopic spring; 206. moving block; 207. inserting block; 208. connecting spring; 209. rotating disk; 210. inclined slot; 211. sliding rod; 3. processing box; 4. connecting mechanism; 401. connecting block; 402. mounting block; 403. groove; 404. reset spring; 405. wedge block; 406. connecting rod; 407. trapezoidal block; 5. collecting mechanism; 501. impurity box; 502. handle; 503. hinged rod; 504. extrusion plate; 505. compression spring; 506. door panel; 6. connecting pipe; 7. gas source equipment; 8. single crystal silicon wafer. DETAILED DESCRIPTION
[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0030] like Figures 1 to 4 As shown, the present invention provides a sensor single crystal silicon etching device based on positioning processing, including a base 1, the top outer wall of the base 1 is fixedly connected to a processing box 3, the outer wall of the processing box 3 is provided with a connecting pipe 6 through a connecting mechanism 4, the top outer wall of the base 1 is fixedly connected to a gas source device 7, the outer wall of the base 1 is provided with a collecting mechanism 5, and the inner wall of the processing box 3 is provided with a fixing mechanism 2; the fixing mechanism 2 includes a fixing seat 201, the outer wall of the fixing seat 201 is provided with a card slot 202, and the outer wall of the fixing seat 201 is fixed A fixed block 203 is connected, the inner wall of the fixed block 203 is rotatably connected to a rotating disk 209, the outer wall of the rotating disk 209 is provided with an inclined groove 210, the inner wall of the inclined groove 210 is slidably connected to a sliding rod 211, the outer wall of the fixed block 203 is slidably connected to a clamping block 204, the outer wall of the clamping block 204 is elastically connected to a moving block 206 via a telescopic spring 205, the inner wall of the rotating disk 209 is elastically connected to an insert block 207 via a connecting spring 208, and the outer wall of the fixed block 203 contacts a single crystal silicon wafer 8.
[0031] The above scheme is adopted: the base 1 can be placed on the ground or a work platform, the fixing seat 201 is the basic supporting component of the entire fixing mechanism 2, and its fixed connection with the outer wall of the top of the base 1 ensures that during the etching process, the fixing mechanism 2 positions the single crystal silicon wafer 8 so that it will not be displaced, laying a foundation for its stability; the card slot 202 is provided with multiple groups, and the plug block 207 is plugged with it to play the role of fixing the position of the rotating disk 209; when the plug block 207 is inserted into the card slot 202 under the action of the connecting spring 208, the angle of the rotating disk 209 is fixed, thereby indirectly determining the clamping The clamping force and position state of the block 204 on the single crystal silicon wafer; the clamping block 204 and the moving block 206 are each provided with three groups, and the fixed block 203 can provide sliding guides for the clamping block 204 and the moving block 206, so that the two can only move to the middle or the outside at the same time, ensuring that the clamping action of the single crystal silicon wafer 8 is stable and accurate; through the inclined groove 210, it contacts the sliding rod 211. When the rotating disk 209 rotates, the inclined groove 210 squeezes the sliding rod 211, so that it drives the moving block 206 to move. Under the guiding action of the fixed block 203, the moving block 206 can move to the middle or the outside at the same time.
[0032] like Figures 1 to 4 As shown, the telescopic spring 205 provides an initial elastic preload for the clamp 204, ensuring that the clamp 204 is in an appropriate open position when the device is in the initial state or the rotating disk 209 is not rotating, which is convenient for the placement of the single crystal silicon wafer; when the rotating disk 209 is rotated after the single crystal silicon wafer 8 is positioned, the moving block 206 will compress or stretch the telescopic spring 205 under the push of the sliding rod 211, thereby changing the initial compression amount of the telescopic spring 205. When the moving block 206 moves outward and away from the clamp 204, the initial compression amount of the telescopic spring 205 is reduced, reducing the clamping force of the clamp 204, and vice versa, it will increase the clamping force of the clamp 204, so that the clamping force of the clamp 204 can be adjusted according to the specific needs of the single crystal silicon wafer 8 of different materials or different sizes, further avoiding the problem of the single crystal silicon wafer 8 falling off or being damaged due to the fact that it may not adapt to the clamping force of the clamp 204.
[0033] like Figures 1 to 4 As shown, the fixed seat 201 is fixedly connected to the top outer wall of the base 1, the sliding rod 211 contacts the inner wall of the inclined groove 210, and the sliding rod 211 is fixedly connected to the moving block 206; one end of the telescopic spring 205 is fixedly connected to the outer wall of the moving block 206, and the other end of the telescopic spring 205 is fixedly connected to the outer wall of the clamping block 204, and the moving block 206 is slidably connected to the inner wall of the fixed block 203; one end of the connecting spring 208 is fixedly connected to the outer wall of the plug block 207, and the other end of the connecting spring 208 is fixedly connected to the inner wall of the rotating disk 209, the plug block 207 is slidably connected to the inner wall of the rotating disk 209, and the plug block 207 is engaged with the slot 202.
[0034] The above scheme is adopted: the clamping block 204 can contact the single crystal silicon wafer 8, and its surface is made of rubber material and is set to an arc shape, which can better fit the single crystal silicon wafer 8, and can provide sufficient friction to prevent the wafer from sliding during the etching process, and can also avoid scratches or damage to the wafer surface during the clamping process; the top of the clamping block 204 is an inclined surface. When the single crystal silicon wafer 8 needs to be fixed, the single crystal silicon wafer 8 can be pressed downward along the inclined surface, and its outer wall squeezes the three groups of clamping blocks 204 to move outward, and the telescopic spring 205 is forced to shrink. When the single crystal silicon wafer 8 moves into the internal groove of the clamping block 204, the telescopic spring 205 drives the clamping block 204 to pop out to the middle due to its own elastic force and fits tightly with the single crystal silicon wafer 8, so that it can be fixed and its positioning operation is completed, so that it will not be offset due to vibration and other influences during the etching process.
[0035] like Figures 1 to 4 As shown, the connecting spring 208 makes the plug 207 always have a tendency to be inserted into the slot 202, thereby ensuring the locking reliability of the position of the rotating disk 209. When the rotating disk 209 needs to be rotated, the plug 207 needs to be pulled out to make it disengage from the slot 202 and release the limit of the rotating disk 209 before the rotating disk 209 can be rotated; after adjusting the position of the rotating disk 209, the plug 207 is re-inserted into the slot 202 under the action of the connecting spring 208, so as to achieve precise fixation of the rotating disk 209, thereby adjusting the clamping force of the clamp 204 on the single crystal silicon wafer; and because the slot 202 is provided with multiple groups, the rotating disk 209 can be rotated to multiple positions for fixing, thereby providing more options for adjusting the clamping force of the clamp 204 and having higher adaptability.
[0036] like Figures 5 and 6 As shown, the connecting mechanism 4 includes a connecting block 401, the inner wall of the connecting block 401 is elastically connected to a wedge block 405 through a reset spring 404, the inner wall of the connecting block 401 is slidably connected to a trapezoidal block 407, the inner wall of the connecting block 401 is slidably connected to a connecting rod 406, the outer wall of the connecting pipe 6 is fixedly connected to a mounting block 402, and the outer wall of the mounting block 402 is provided with a groove 403; the connecting block 401 is fixedly connected to the top outer wall of the processing box 3, the connecting block 401 contacts the mounting block 402, one end of the connecting rod 406 is fixedly connected to the outer wall of the wedge block 405, and the other end of the connecting rod 406 is slidably connected to the outer wall of the trapezoidal block 407; one end of the reset spring 404 is fixedly connected to the outer wall of the wedge block 405, and the other end of the reset spring 404 is fixedly connected to the inner wall of the connecting block 401, the wedge block 405 is slidably connected to the inner wall of the connecting block 401, and the wedge block 405 is clamped in the groove 403.
[0037] The above scheme is adopted: the gas source device 7 is connected with the processing box 3 through the connecting pipe 6, and the plasma gas can be transported to the processing box 3 through the gas source device 7 to perform etching operations on the single crystal silicon wafer 8; the connecting mechanism 4 can fix the connecting pipe 6 and the processing box 3, and can also facilitate the disassembly and installation of the connecting pipe 6, and can maintain the stability and sealing of the gas transportation; the elastic force of the reset spring 404 itself makes the wedge block 405 maintain the clamping state with the groove 403 under normal conditions, so that the connecting pipe 6 and the processing box 3 are kept fixed; when the connecting pipe 6 needs to be removed, the wedge block 405 can be disengaged from the groove 403 by toggling the trapezoidal block 407, and the limit of the installation block 402 is released to remove the connecting pipe 6; the cooperation between the trapezoidal block 407 and the connecting rod 406 is used to control the movement of the wedge block 405. When not affected by external forces, the connecting rod 406 contacts the short side slope of the trapezoidal block 407. When the trapezoidal block 407 slides along the inner wall of the connecting block 401 under the action of external force, the connecting rod 406 is squeezed to move along the side wall to the long side slope, driving the wedge block 405 to move to both sides, thereby achieving the separation of the wedge block 405 from the groove 403; the arc surface of the wedge block 405 is always facing upwards. During the installation of the connecting pipe 6, when the installation block 402 is inserted into the connecting block 401, the arc surface of the wedge block 405 is forced to move to the inner wall of the connecting block 401, and can automatically pop out and fit into the groove 403 under the action of the reset spring 404, thereby completing the rapid installation of the connecting pipe 6, thereby eliminating the need to disassemble and install the connecting pipe 6 by turning the bolts multiple times, thereby improving the efficiency of maintenance and cleaning, and being more convenient and quick.
[0038] like Figures 7 and 8 As shown, the collecting mechanism 5 includes an impurity box 501, the top outer wall of the impurity box 501 is slidably connected to a handle 502, the outer wall of the handle 502 is hinged to an extrusion plate 504 through a hinge rod 503, the outer wall of the extrusion plate 504 is fixedly connected to a compression spring 505, and the outer wall of the impurity box 501 is provided with a door panel 506; the impurity box 501 is fixedly connected to the outer wall of the base 1, one end of the hinge rod 503 is hinged to the outer wall of the handle 502, and the other end of the hinge rod 503 is hinged to the outer wall of the extrusion plate 504; the compression spring 505 is fixedly connected to the inner wall of the impurity box 501, and the extrusion plate 504 is slidably connected to the inner wall of the impurity box 501.
[0039] The above scheme is adopted: the impurity box 501 is a container for collecting impurities generated during the etching process, which is convenient for the subsequent cleaning of impurities. The door panel 506 is a closing component of the impurity box 501. Its connection with the outer wall of the impurity box 501 can ensure sealing and prevent impurities from leaking; a dust suction pipe and an air pump are arranged on the outer wall of one side of the impurity box 501, and the two pass through the outer wall of one side of the processing box 3. When the air pump is started, the impurities in the processing box 3 can be sucked into the impurity box 501 through the dust suction pipe; the door panel 506 is opened in a hinged manner, which is convenient for the operator to open it for impurity cleaning; the handle 502, the hinged rod 503, the extrusion plate 504 and the compression spring 505 cooperate to compact the collected impurities. When the impurities fall into the impurity box 501, the handle is pulled 502, drives one end of the hinged rod 503 to move, and the other end pushes the extrusion plate 504 to move. The extrusion plate 504 can only move vertically under the guidance of the inner wall of the impurity box 501, so that it moves downward under the pressure of the hinged rod 503 and stretches the compression spring 505, so as to compact the impurities, reduce the volume of impurities, and improve the space utilization rate of the impurity box 501, and also facilitate the subsequent processing and transportation of impurities; the compression spring 505 provides elastic restoring force for the extrusion plate 504, so that the extrusion plate 504 remains in the initial position when there is no external force, avoiding obstruction to the normal falling of impurities, and can also drive the extrusion plate 504 to move upward and automatically reset when the handle 502 is released after a compaction operation, preparing for the next compaction operation.
[0040] The working principle and use process of the present invention:
[0041] The operator can slowly press the single crystal silicon wafer 8 downward along the top inclined surface of the clamp block 204, and the outer wall of the single crystal silicon wafer 8 squeezes the three groups of clamp blocks 204, so that the clamp blocks 204 move outward, and the telescopic spring 205 contracts under force. When the single crystal silicon wafer 8 moves into the inner groove of the clamp block 204, the telescopic spring 205 makes the clamp block 204 fit tightly with the single crystal silicon wafer 8 due to its own elastic force, completing the positioning operation of the single crystal silicon wafer 8, so that it will not be offset due to vibration or other influences during the etching process; then, according to the material or size specifications of the single crystal silicon wafer 8, the clamping force of the clamp block 204 can be adjusted, and the plug block 207 is pulled out to make it disengage from the slot 202 and release the rotating disk 209. The limit is set, the rotating disk 209 is rotated, and the movable block 206 is moved to the middle or outside under the guidance of the fixed block 203 through the action of the inclined slot 210 and the sliding rod 211, thereby stretching or compressing the telescopic spring 205, changing the initial compression amount of the telescopic spring 205, and then adjusting its elastic force on the clamping block 204, changing the clamping force of the clamping block 204, and the single crystal silicon wafer 8 will not fall off due to too small clamping force, nor will the single crystal silicon wafer 8 be damaged due to too large clamping force; after adjusting the position of the rotating disk 209, the insert block 207 is re-clamped into the clamping slot 202 under the action of the connecting spring 208, so that the rotating disk 209 is fixed and the adjustment of the clamping force of the clamping block 204 is completed.
[0042] Then the mounting block 402 of the connecting tube 6 can be aligned with the connecting block 401 on the top outer wall of the processing box 3 and inserted. During the insertion process, the arc surface of the wedge block 405 is forced to move to the inner wall of the connecting block 401. When the mounting block 402 is fully inserted, the wedge block 405 automatically pops out and fits into the groove 403 under the action of the reset spring 404, completing the rapid installation of the connecting tube 6, so that the gas source equipment 7 and the processing box 3 maintain good connectivity and sealing. After the connection is completed, the gas source equipment 7 can be started, and the plasma gas is transported to the processing box 3 through the connecting tube 6 to perform etching operations on the positioned single crystal silicon wafer 8; during the etching process, the dust suction pipe connected to the outer wall of one side of the impurity box 501 sucks the impurities generated by etching in the processing box 3 into the impurity box 501 under the action of the air pump.
[0043] When a certain amount of impurities fall into the impurity box 501, in order to reduce the volume of the impurities, the handle 502 can be pulled to drive the hinged rod 503 to move, thereby pushing the extrusion plate 504 to move downward and stretching the compression spring 505, and the extrusion plate 504 compacts the impurities; after the compression is completed, the handle 502 is released, and the extrusion plate 504 automatically moves upward and resets under the elastic restoring force of the compression spring 505, preparing for the next compaction operation.
[0044] After the etching operation is completed, the three groups of clamping blocks 204 can be moved out of contact with the single crystal silicon wafer 8, and the single crystal silicon wafer 8 can be taken out for subsequent processing or testing; if the inner wall of the connecting tube 6 needs to be maintained and cleaned, the trapezoidal block 407 can be moved through the connecting rod 406 to drive the wedge block 405 out of the groove 403, and the connecting tube 6 can be easily and quickly removed after the limit of the mounting block 402 is released. There is no need to fix or disassemble the connecting tube 6 and the processing box 3 by turning the bolts multiple times, which is more convenient and quick; then open the door panel 506, clean and process the collected impurities, close the door panel 506 after cleaning, and prepare for the next etching operation.
[0045] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0046] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A sensor single crystal silicon etching device based on positioning processing, comprising a base (1), characterized in that: The top outer wall of the base (1) is fixedly connected to a processing box (3), the outer wall of the processing box (3) is provided with a connecting pipe (6) via a connecting mechanism (4), the top outer wall of the base (1) is fixedly connected to a gas source device (7), the outer wall of the base (1) is provided with a collecting mechanism (5), and the inner wall of the processing box (3) is provided with a fixing mechanism (2); The fixing mechanism (2) comprises a fixing seat (201), the outer wall of the fixing seat (201) is provided with a slot (202), the outer wall of the fixing seat (201) is fixedly connected to a fixing block (203), the inner wall of the fixing block (203) is rotatably connected to a rotating disk (209), the outer wall of the rotating disk (209) is provided with an inclined groove (210), the inner wall of the inclined groove (210) is slidably connected to a sliding rod (211), the outer wall of the fixing block (203) is slidably connected to a clamping block (204), the outer wall of the clamping block (204) is elastically connected to a moving block (206) via a telescopic spring (205), the inner wall of the rotating disk (209) is elastically connected to an inserting block (207) via a connecting spring (208), and the outer wall of the fixing block (203) contacts a single crystal silicon wafer (8).
2. The sensor single crystal silicon etching device based on positioning processing according to claim 1 is characterized in that: The fixed seat (201) is fixedly connected to the top outer wall of the base (1), the sliding rod (211) is in contact with the inner wall of the inclined groove (210), and the sliding rod (211) is fixedly connected to the moving block (206).
3. The sensor single crystal silicon etching device based on positioning processing according to claim 1 is characterized in that: One end of the telescopic spring (205) is fixedly connected to the outer wall of the moving block (206), the other end of the telescopic spring (205) is fixedly connected to the outer wall of the clamping block (204), and the moving block (206) is slidably connected to the inner wall of the fixed block (203).
4. The sensor single crystal silicon etching device based on positioning processing according to claim 1 is characterized in that: One end of the connecting spring (208) is fixedly connected to the outer wall of the insert block (207), and the other end of the connecting spring (208) is fixedly connected to the inner wall of the rotating disk (209). The insert block (207) is slidably connected to the inner wall of the rotating disk (209), and the insert block (207) is engaged with the slot (202).
5. The sensor single crystal silicon etching device based on positioning processing according to claim 1 is characterized in that: The connecting mechanism (4) comprises a connecting block (401), the inner wall of the connecting block (401) is elastically connected to a wedge block (405) via a return spring (404), the inner wall of the connecting block (401) is slidably connected to a trapezoidal block (407), the inner wall of the connecting block (401) is slidably connected to a connecting rod (406), the outer wall of the connecting tube (6) is fixedly connected to a mounting block (402), and the outer wall of the mounting block (402) is provided with a groove (403).
6. The sensor single crystal silicon etching device based on positioning processing according to claim 5 is characterized in that: The connecting block (401) is fixedly connected to the top outer wall of the processing box (3), the connecting block (401) is in contact with the mounting block (402), one end of the connecting rod (406) is fixedly connected to the outer wall of the wedge block (405), and the other end of the connecting rod (406) is slidably connected to the outer wall of the trapezoidal block (407).
7. The sensor single crystal silicon etching device based on positioning processing according to claim 5 is characterized in that: One end of the return spring (404) is fixedly connected to the outer wall of the wedge block (405), and the other end of the return spring (404) is fixedly connected to the inner wall of the connecting block (401). The wedge block (405) is slidably connected to the inner wall of the connecting block (401), and the wedge block (405) is snap-fitted to the groove (403).
8. The sensor single crystal silicon etching device based on positioning processing according to claim 1 is characterized in that: The collecting mechanism (5) comprises an impurity box (501), the top outer wall of the impurity box (501) is slidably connected to a handle (502), the outer wall of the handle (502) is hinged to an extrusion plate (504) via a hinge rod (503), the outer wall of the extrusion plate (504) is fixedly connected to a compression spring (505), and the outer wall of the impurity box (501) is provided with a door panel (506).
9. The sensor single crystal silicon etching device based on positioning processing according to claim 8, characterized in that: The impurity box (501) is fixedly connected to the outer wall of the base (1), one end of the hinge rod (503) is hinged to the outer wall of the handle (502), and the other end of the hinge rod (503) is hinged to the outer wall of the extrusion plate (504).
10. The sensor single crystal silicon etching device based on positioning processing according to claim 8, characterized in that: The compression spring (505) is fixedly connected to the inner wall of the impurity box (501), and the extrusion plate (504) is slidably connected to the inner wall of the impurity box (501).