Wafer cutting and cleaning method

Abstract

The invention relates to a wafer cutting and cleaning method, which comprises the following steps of: providing a cutting device, and carrying out a first cutting process on a wafer product arranged in a wafer frame; forming a plurality of spaced crystal grains on the wafer product; inverting the wafer frame and a plurality of crystal grains arranged in the wafer frame; a turntable is provided, the wafer frame and the plurality of crystal grains are arranged on the turntable, the turntable is provided with a bearing surface, and the bearing surface faces the ground; an adsorption device arranged in the turntable provides suction force opposite to the gravity to adsorb the wafer frame; the turntable is driven to rotate; providing a cleaning device, and enabling the cleaning device to face the to-be-cleaned surfaces of the plurality of crystal grains; and spraying at least one cleaning liquid towards the plurality of crystal grains by using a cleaning device so as to clean the plurality of crystal grains and the to-be-cleaned objects among the plurality of crystal grains.

Description

Technical Field

[0001] The present invention relates to a wafer cutting and cleaning method, in particular to a wafer cutting and cleaning method for cleaning a plurality of crystal grains spaced apart from each other after cutting. Background Art

[0002] In semiconductor manufacturing, wafer cleaning is an important process. The reason is that if the contamination caused by processes such as cutting or etching is not cleaned, it will seriously affect the subsequent processes, and ultimately lead to product abnormalities and a decrease in yield.

[0003] In order to ensure that each wafer can be cleaned, a single wafer cleaning device can be used to clean each wafer. Figure 1 As shown, in the conventional technology, a single wafer is usually cleaned by placing the surface of the die 71 of the wafer to be cleaned facing upward, and using a conventional cleaning device 50 to clean the object 60 between the grooves 72 of each die 71 .

[0004] However, the above cleaning methods cannot completely clean today's wafer products (such as wafer products manufactured with a process after 14 nanometers), or it takes a very long time to clean the wafer products. The reason is that with the evolution of semiconductor processes, the structure of the chip has become increasingly complex, the circuits have become increasingly fine, the surface structure has become more three-dimensional, and the aspect ratio has been greatly improved. Therefore, both the width of the groove cut on the wafer surface and the gap generated by the surface structure are very small.

[0005] Under such circumstances, if the wafer is cleaned only by conventional methods or equipment, the contaminants inside the grooves will not be easily removed. Furthermore, the cleaning liquid, such as deionized water, falling from above will easily cause the contaminants to splash due to the uneven surface of the wafer, thereby causing cross contamination. Therefore, a wafer cleaning device is needed to solve the above conventional problems. Summary of the invention

[0006] Based on the above purpose, the present invention provides a wafer cleaning method, which is used to clean the multiple grains spaced apart from each other after cutting. The wafer cleaning method includes: inverting the wafer frame and the multiple grains arranged in the wafer frame, so that the surfaces to be cleaned of the multiple grains face the ground; providing a turntable, setting the wafer frame and the multiple grains on the turntable, the turntable having a bearing surface, the bearing surface facing the ground; using an adsorption device arranged in the turntable to provide suction in the opposite direction of gravity to adsorb the wafer frame; driving the turntable to rotate; providing a cleaning device, and making the cleaning device face the surfaces to be cleaned of the multiple grains; and spraying at least one cleaning liquid toward the multiple grains with the cleaning device.

[0007] Preferably, the wafer cleaning method of the present invention further comprises providing a plurality of fixing devices, wherein the plurality of fixing devices are disposed on the turntable and are used to fix the wafer frame at a fixed position or release the wafer frame at a release position.

[0008] Preferably, the plurality of fixing devices can fix the wafer frame at a fixed position after the adsorption device adsorbs the wafer frame.

[0009] Preferably, the wafer cleaning method of the present invention further comprises providing a release mechanism, and after the turntable stops rotating, the adsorption device continues to provide suction, and the release mechanism moves the plurality of fixing devices from the fixed position to the release position.

[0010] Preferably, the wafer cleaning method of the present invention further comprises using a transfer device to provide adsorption force to the wafer frame, and placing the inverted wafer frame on a turntable.

[0011] Preferably, after the transfer device places the wafer frame on the turntable, the adsorption device adsorbs the wafer frame, and the transfer device releases the adsorption force.

[0012] Based on the above-mentioned purpose, the present invention further provides a wafer cutting and cleaning method, which includes the following steps: providing a cutting device to perform a first cutting process on a wafer product arranged in a wafer frame; forming the wafer product into a plurality of grains spaced apart from each other; inverting the wafer frame and the plurality of grains arranged in the wafer frame; providing a turntable to arrange the wafer frame and the plurality of grains on the turntable, the turntable having a carrying surface, the carrying surface facing the ground; using an adsorption device arranged in the turntable to provide suction in the opposite direction to gravity to adsorb the wafer frame; driving the turntable to rotate; providing a cleaning device, and making the cleaning device face the surfaces to be cleaned of the plurality of grains; and using the cleaning device to spray at least one cleaning liquid toward the plurality of grains.

[0013] Preferably, the wafer cutting and cleaning method of the present invention also includes providing a grinding device. After the first cutting process of the wafer product, the wafer product is attached to a protective film, and the bottom surface of the wafer product is ground by the grinding device to form a plurality of grains spaced apart from each other and objects to be cleaned between the plurality of grains.

[0014] Preferably, the wafer cutting and cleaning method of the present invention further includes placing the wafer product in a wafer frame before the wafer product is cut by a cutting device, and attaching the wafer product and the wafer frame to a protective film before performing a first cutting process.

[0015] Preferably, after the wafer product is subjected to the first cutting process, the wafer product is subjected to the second cutting process to form a plurality of spaced-apart grains.

[0016] Preferably, the wafer cutting and cleaning method of the present invention further comprises providing a plurality of fixing devices, wherein the plurality of fixing devices are arranged on the turntable to fix the wafer frame at a fixed position or release the wafer frame at a release position.

[0017] Preferably, the plurality of fixing devices fix the wafer frame at a fixed position after the adsorption device adsorbs the wafer frame.

[0018] Preferably, the wafer cutting and cleaning method of the present invention further comprises providing a release mechanism, and after the turntable stops rotating, the adsorption device continues to provide suction, and the release mechanism moves the plurality of fixing devices from the fixed position to the release position.

[0019] The present invention provides a wafer cutting and cleaning method. In the present invention, a single wafer is arranged in a wafer frame to form a frame wafer (Frame Wafer), so as to facilitate subsequent processes and avoid wafer damage. Further explanation, the single frame wafer is adsorbed by a spin chuck, so that the cleaned surface of the frame wafer faces downward, and the frame wafer is rotated and cleaned in a manner that the spin chuck faces the ground (Spin Chuck Face Down). In addition, since the frame wafer is fixed below the turntable, a fixing device can be further used to fix the frame wafer on the turntable to prevent the frame wafer from sliding. The cleaning nozzle is located at the bottom of the device, and a cleaning liquid, such as deionized water or other liquid medicine, is applied to the upper frame wafer. Therefore, during cleaning, contaminants can flow downward from the grooves between the grains in the frame wafer by gravity. This can prevent the use of the conventional technology of using the turntable to rotate upward to clean the single wafer, which causes the liquid medicine at the groove to splash and cause cross contamination. Therefore, the present invention can overcome the problem of difficult cleaning at the groove of the frame wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Non-limiting examples of the embodiments disclosed herein are described below with reference to the drawings listed after this paragraph.Description The drawings and the description are intended to illustrate and clarify the embodiments disclosed herein and should not be considered limiting in any way.

[0021] Figure 1 Schematic diagram of cleaning a single wafer in conventional technology.

[0022] Figure 2 FIG. 4 is a flow chart of a wafer cutting and cleaning method according to an embodiment of the present invention.

[0023] Figure 3A FIG. 1 is a first schematic diagram of wafer cutting according to an embodiment of the present invention.

[0024] Figure 3B FIG. 4 is a second schematic diagram of wafer cutting according to an embodiment of the present invention.

[0025] Figure 4A FIG. 1 is a first schematic diagram of a wafer cleaning device according to an embodiment of the present invention.

[0026] Figure 4B FIG. 4 is a second schematic diagram of a wafer cleaning device according to an embodiment of the present invention.

[0027] Figure 4C Schematic diagram of a transfer device according to an embodiment of the present invention.

[0028] Figure 5A FIG. 1 is a first schematic diagram of an adsorption unit according to an embodiment of the present invention.

[0029] Figure 5B FIG. 4 is a second schematic diagram of an adsorption unit according to an embodiment of the present invention.

[0030] Fig. 6A FIG. 3 is a third schematic diagram of a wafer cleaning device according to an embodiment of the present invention.

[0031] Figure 6B FIG. 4 is a fourth schematic diagram of a wafer cleaning device according to an embodiment of the present invention.

[0032] Figure 7 It is a bottom view of the fixing device according to an embodiment of the present invention.

[0033] Fig. 8A FIG. 5 is a fifth schematic diagram of a wafer cleaning device according to an embodiment of the present invention.

[0034] Figure 8B FIG. 6 is a sixth schematic diagram of a wafer cleaning device according to an embodiment of the present invention.

[0035] Fig. 9A FIG. 7 is a seventh schematic diagram of a wafer cleaning apparatus according to an embodiment of the present invention.

[0036] Fig. 9B FIG. 8 is an eighth schematic diagram of a wafer cleaning apparatus according to an embodiment of the present invention.

[0037] Fig. 10A It is a ninth schematic diagram of a wafer cleaning equipment according to an embodiment of the present invention.

[0038] Fig. 10B FIG. 10 is a tenth schematic diagram of a wafer cleaning device according to an embodiment of the present invention.

[0039] Fig.11 Schematic diagram of a fixing device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0040] In order to help the examiner understand the technical features, contents and advantages of the present disclosure and the effects that can be achieved, the present disclosure is hereby described in detail in the form of embodiments in conjunction with the accompanying drawings. The drawings used therein are only for illustration and auxiliary explanation purposes and may not be the actual proportions and precise configurations after the implementation of the present disclosure. Therefore, the proportions and configurations of the attached drawings should not be interpreted to limit the scope of rights of the present disclosure in actual implementation. This should be stated in advance.

[0041] The following will describe embodiments of the present invention with reference to the relevant drawings. To facilitate understanding, the same elements in the following embodiments are labeled with the same symbols.

[0042] There are multiple cleaning processes in the process of semiconductor to prevent the wafer from being contaminated, so as to facilitate the smooth progress of subsequent processes such as lithography, etching, and packaging. In these processes, the wafer product 20 after cutting is very difficult to clean.

[0043] In order to solve the above problems, Figures 2 to 3B As shown, the present invention provides a wafer cutting and cleaning method, comprising the following method steps:

[0044] S101 : providing a cutting device 106 to perform a first cutting process on the wafer product 20 disposed in the wafer frame 30 .

[0045] S102: Form the wafer product 20 into a plurality of spaced-apart crystal grains 201 .

[0046] S103: Invert the wafer frame 30 and the plurality of dies 201 in the wafer frame 30 so that the surfaces of the plurality of dies 201 to be cleaned face toward the ground.

[0047] S104: Provide a turntable 102, and place the wafer frame 30 and the plurality of dies 201 on the turntable 102. To further explain, the turntable 102 has a bearing surface, and the bearing surface faces the ground.

[0048] S105: The adsorption device 103 disposed in the turntable 102 provides a suction force in the opposite direction to the gravity to adsorb the wafer frame 30 .

[0049] S106: driving the turntable 102 to rotate.

[0050] S107: Provide a cleaning device 104 and direct the cleaning device 104 toward the surfaces of the plurality of dies 201 to be cleaned.

[0051] S108 : Spray at least one cleaning liquid toward the plurality of dies 201 using the cleaning device 104 .

[0052] To further explain, the above steps S101 to S102 are a wafer cutting method, and steps S103 to S108 are a wafer cleaning method for cleaning the plurality of dies 201 spaced apart from each other after cutting.

[0053] Further explanation, such as Figure 3A As shown, in the wafer cutting method of the present invention, the wafer product 20 is cut multiple times by the cutting device 106 to form a plurality of crystal grains 201 , and grooves 203 are formed between the plurality of crystal grains 201 spaced apart from each other.

[0054] In detail, in one embodiment, the wafer cutting method of the present invention may further include placing the wafer product 20 in the wafer frame 30 before the wafer product 20 is cut by the cutting device 106, and attaching the wafer product 20 and the wafer frame 30 to the protective film 202 before performing a first cutting process. After the first cutting process is performed on the wafer product 20, the second cutting process is performed on the wafer product 20 to form a plurality of spaced-apart crystal grains 201. In other words, the contaminants after cutting will not only be formed on the plurality of crystal grains 201, but also in the grooves 203.

[0055] like Figure 3A and Figure 3B As shown, in other embodiments, it is also possible to first Figure 3A The wafer product 20 is subjected to the first cutting process by the cutting device 106, and then the wafer product 20 is turned over, and the back of the wafer product 20 is removed by the grinding device 107, and finally a plurality of spaced-apart crystal grains 201 are formed. In other words, in this embodiment, the wafer cutting method of the present invention may further include providing a grinding device 107, and after the first cutting process of the wafer product 20, the wafer product 20 is attached to the protective film 202, and the bottom surface of the wafer product 20 is ground by the grinding device 107, so as to form a plurality of crystal grains 201 spaced-apart from each other and the objects to be cleaned 40 between the plurality of crystal grains 201. In other words, the contaminants after grinding will not only be formed on the plurality of crystal grains 201, but also in the grooves 203.

[0056] Regardless of the process used to form the crystal grains 201, contaminants will be generated, so a wafer cleaning method is needed to clean the contaminants. The present invention provides a wafer cleaning method for cleaning a plurality of crystal grains 201 spaced apart from each other after dicing and a space between the plurality of crystal grains 201 to be cleaned 40.

[0057] Further explanation, such as Figures 4B to 4CAs shown, when performing step S103, the wafer cleaning method of the present invention may further include using the transfer device 108 to provide an adsorption force to the wafer frame 30, and placing the inverted wafer frame 30 on the turntable 102. After the transfer device 108 places the wafer frame 30 on the turntable 102, the adsorption device 103 adsorbs the wafer frame 30, and the transfer device 108 releases the adsorption force to ensure that the wafer frame 30 has been successfully adsorbed by the turntable 102.

[0058] In addition, in order to prevent the wafer frame 30 and the plurality of dies 201 adsorbed on the turntable 102 from falling off, Figure 4B As shown, the wafer cleaning method of the present invention may further include providing a plurality of fixing devices 105. The plurality of fixing devices 105 may be disposed on the turntable 102 to fix the wafer frame 30 at a fixed position or release the wafer frame 30 at a release position. Further explanation, in one embodiment, the plurality of fixing devices 105 fix the wafer frame 30 at a fixed position after the adsorption device 103 adsorbs the wafer frame 30 and the plurality of dies 201.

[0059] In another embodiment, if Figures 6A to 6B As shown, when the turntable 102 stops, the wafer cleaning method of the present invention may also include providing a release mechanism 1055. After the turntable 102 stops rotating, the adsorption device 103 continues to provide suction, and the release mechanism 1055 moves the multiple fixing devices 105 from the fixed position to the release position. At this time, the wafer frame 30 can be ready for the next process.

[0060] To further illustrate, the wafer cleaning device for cleaning the plurality of dies 201 separated from each other after dicing and the object to be cleaned 40 between the plurality of dies 201 may include a driving device 101, a turntable 102, an adsorption device 103, a cleaning device 104, and a transfer device 108. Figure 4A and 4B As shown, since the turntable 102 is facing the ground (Spin Chuck Face Down), after the die 201 is rotated and cleaned, the object 40 to be cleaned, such as particles, chemicals and other pollutants, can flow downward by gravity, thereby increasing the cleaning efficiency.

[0061] Further, in one embodiment, the driving device 101 may include a motor 1013, and the motor 1013 may be controlled to output rotational power to drive the turntable 102 to rotate. The turntable 102 may be connected to the driving device 101 and driven to rotate by the driving device 101. In a preferred embodiment, the turntable 102 may be connected to a driving shaft 1011 of the driving device 101, and the driving shaft 1011 transmits the power of the motor 1013.

[0062] like Figures 4A to 5BAs shown, the adsorption device 103 is disposed in the turntable 102 and may include a plurality of adsorption units 1031. In one embodiment, the adsorption unit 1031 may be one or more of a magnetic adsorption element, a negative pressure adsorption element, and a vacuum adsorption element to adsorb at least one of the wafer frame 30 or the plurality of dies 201. In a preferred embodiment, the adsorption unit 1031 may be a vacuum adsorption element, and an air extraction port of the adsorption unit 1031 is disposed on the surface of the turntable 102 facing the ground.

[0063] Further explanation, in the present invention, the cleaning device 104 is disposed toward the turntable 102, the plurality of crystal grains 201 can be fixed on the wafer frame 30, and the adsorption device 103 adsorbs at least one of the wafer frame 30 or the plurality of crystal grains 201 in the direction opposite to gravity, and the cleaning device 104 can spray at least one cleaning liquid, such as deionized water, cleaning agent, etc., toward the plurality of crystal grains 201. When the cleaning device 104 finishes cleaning the crystal grains 201, the transfer device 108 can be used to transfer the wafer frame 30 to the shipping area of ​​the wafer cleaning equipment.

[0064] To further illustrate, the cleaning device 104 may include a nozzle cantilever 1041 and a nozzle 1042, the nozzle 1042 may be disposed on the nozzle cantilever 1041, and the nozzle 1042 is driven by the nozzle cantilever 1041 to move within the cleaning range. However, the present invention is not limited thereto. For example, in one embodiment, in order to prevent different cleaning liquids from being sprayed from the same nozzle 1042 and causing cross contamination, the cleaning device 104 may also include a plurality of nozzle cantilever 1041 and a plurality of nozzles 1042, or may also include a nozzle cantilever 1041 and a plurality of nozzles 1042, and different cleaning liquids, such as deionized water, etching solution, isopropyl ketone solution, etc., may be sprayed from different nozzles 1042.

[0065] In addition, in other embodiments, the nozzle 1042 can provide one or more cleaning liquids in a fan shape, a cone shape, or a needle shape when spraying, and the cleaning liquid sprayed by the nozzle 1042 can be a high-temperature, high-pressure cleaning liquid to facilitate the cleaning of the grains and the objects to be cleaned.

[0066] To further explain, the transfer device 108 may be a robot arm, and may include a telescopic arm 1081 and a carrying portion 1082. The carrying portion 1082 is disposed on the telescopic arm 1081, and the telescopic arm 1081 is controlled to move the carrying portion 1082. The carrying portion 1082 has a component that can attract the wafer frame 30, such as a suction cup, an air extraction hole, etc., to attract the surface of the wafer frame 30. Therefore, in one embodiment, the transfer device 108 can take the wafer frame 30 in a horizontal state to perform a cleaning operation.

[0067] In a preferred embodiment, the transfer device 108 may include two robotic arms, or may be Figure 4CThe figure shows a dual-finger type robot arm. In other words, the transfer device 108 may include two telescopic arms 1081 and two carriers 1082. Therefore, different telescopic arms 1081 and different carriers 1082 may be used to avoid cross contamination of the wafer frame 30 and the die 201 before and after cleaning.

[0068] like Figure 5A and Figure 5B As shown, the die 201 and the wafer frame 30 are adhered to the protective film 202, and the adsorption device 103 adsorbs the protective film 202, so the adsorption device 103 can adsorb the wafer frame 30 or at least one of the multiple die 201 adhered to the protective film 202. In a preferred embodiment, the protective film 202 can be an ultraviolet hardening tape (Ultraviolet Tape), which is a pressure-sensitive tape. Through the adhesive on the protective film 202, the protective film 202 can be firmly bonded to the die 201 and the wafer frame 30.

[0069] The protective film 202 includes a substrate and an adhesive. The substrate may be a plastic film, which may include one or more materials such as polyolefin, polyvinyl chloride, and polyethylene terephthalate. The adhesive is a pressure-sensitive adhesive that can be hardened after being irradiated with ultraviolet rays. The adhesive has high adhesion, but after being irradiated with ultraviolet rays, the polymer chains therein will form a three-dimensional network structure and harden, thereby causing the adhesion to drop sharply, and can be easily and cleanly peeled off to facilitate subsequent processes.

[0070] In the present invention, the position of the adsorption unit 1031 can be set according to the needs. Figure 5B As shown, the adsorption unit 1031 can be arranged corresponding to the position of the die 201 and the wafer frame 30, or can be arranged as shown in FIG. Figure 5A As shown, it is only set corresponding to the position of the wafer frame 30. In addition, other configurations can also be performed according to requirements, for example, the adsorption unit 1031 is only set corresponding to the position of the die 201. In a preferred embodiment, when the adsorption unit 1031 is Figure 5B When the positions of the die 201 and the wafer frame 30 are arranged correspondingly, a preferred adsorption effect of the die 201 and the wafer frame 30 can be provided.

[0071] Further explanation, in order to further ensure that the wafer frame 30 and the die 201 can be firmly fixed, the wafer cleaning equipment used in the method of the present invention may further include a plurality of fixing devices 105. The plurality of fixing devices 105 may be arranged on the turntable 102 and cooperate with the adsorption device 103 to fix the wafer frame 30 at a fixed position or release the wafer frame 30 at a release position.

[0072] In one embodiment, if Fig. 6A and Figure 6BAs shown, each of the plurality of fixing devices 105 includes a pushing unit 1051, a pushing portion 1052, a rotating shaft 1053, a fixing portion 1054, and at least one releasing mechanism 1055. The pushing portion 1052 is connected to the pushing unit 1051, and the rotating shaft 1053 is disposed at the edge of the rotating disk 102, and the rotating shaft 1053 is located between the pushing portion 1052 and the fixing portion 1054. In a preferred embodiment, the pushing portion 1052 and the fixing portion 1054 can constitute an L-shaped rod, so that when the pushing portion 1052 is pushed, due to the rotation of the rotating shaft 1053, the fixing portion 1054 will have an opposite movement direction to the pushing portion 1052.

[0073] In a preferred embodiment, the push unit 1051 may be an elastic member, such as a spring. Therefore, the push unit 1051 may apply a force toward the first direction to the push portion 1052, for example, the push unit 1051 may push the push portion 1052 toward the edge of the rotating disk 102, so that the fixing portion 1054 of each of the plurality of fixing devices 105 may be located at a fixed position.

[0074] Therefore, in one embodiment, when the turntable 102 rotates, at least one of the wafer frame 30 or the die 201 can be adsorbed by the adsorption device 103, and the wafer frame 30 can also be fixed by the fixing device 105, thereby preventing the wafer frame 30 or the die 201 from sliding or falling off when the turntable 102 rotates.

[0075] In another embodiment, when the turntable 102 is not rotating (for example, the wafer frame 30 and the die 201 need to be sent to the wafer cleaning equipment for cleaning, or the die 201 in the wafer frame 30 has been cleaned), the release mechanism 1055 can apply a force toward the second direction to the pushing portion 1052, and the first direction is opposite to the second direction (for example, toward the center of the turntable 102). At this time, the fixing portion 1054 is in the release position to prepare for subsequent processes.

[0076] Further explanation, in the above embodiment, when the wafer frame 30 and the die 201 are sent to the wafer cleaning equipment for cleaning, the wafer frame 30 can be taken and turned over by a robot arm, a turning device, etc., and at least one of the wafer frame 30 or the die 201 is first adsorbed by the adsorption device 103 on the turntable 102, and then the fixing part 1054 of the fixing device 105 is moved to a fixed position so that the fixing part 1054 fixes the wafer frame 30. At this time, when the turntable 102 rotates, the wafer frame 30 or the die 201 can be prevented from sliding or falling off on the turntable 102.

[0077] After the wafer frame 30 and the die 201 are cleaned in the wafer cleaning equipment, the release mechanism 1055 can first move the fixing portion 1054 of the fixing device 105 to the release position, so that the fixing portion 1054 is separated from the wafer frame 30. When the wafer frame 30 is ready to be taken (for example, when the transfer device 108 is ready to transfer the wafer frame 30), the adsorption device 103 releases the adsorption force to facilitate the subsequent process.

[0078] In one embodiment, the release mechanism 1055 can rotate synchronously with the turntable 102, or can be a mechanism independent of the turntable 102 and not rotating with the turntable 102. In a preferred embodiment, FIG. 8A to FIG. 8B As shown, the release mechanism 1055 may be a ring mechanism, and the push unit 1051 may include an elastic member, such as a spring. Fig. 8A As shown, when the release mechanism 1055 is raised, the pushing unit 1051 will push the pushing portion 1052, and the fixing portion 1054 can be located at a fixed position to fix the wafer frame 30. Figure 8B As shown, when the release mechanism 1055 is lowered, the annular release mechanism 1055 will push the abutting portion 1052 toward the center of the turntable 102 . At this time, the fixing portion 1054 will be located at the release position, ready to release the wafer frame 30 .

[0079] In addition, in one embodiment, if Figure 7 As shown, in order to avoid interference between the fixing device 105 and other mechanisms (such as a transfer device 108 for taking wafers), the fixing device 105 can be disposed on opposite sides of the turntable 102 .

[0080] In other embodiments, the pushing unit 1051 may also include one or more of a pneumatic cylinder, a hydraulic lever, a motor, and a screw. FIG. 9A to FIG. 9B As shown, when the pushing unit 1051 itself is controlled to push or pull the pushing portion 1052, the above-mentioned release mechanism 1055 is no longer needed to make the fixing portion 1054 be located at the fixing position or the releasing position.

[0081] In one embodiment, it is also possible to FIG. 10A to FIG. 11As shown, other forms of fixing device 105 are provided. Fixing device 105 may include a first end 1056, a rotating shaft 1053 and a second end 1057. The first end 1056, the rotating shaft 1053 and the second end 1057 form a lever mechanism. The rotating shaft 1053 is located between the first end 1056 and the second end 1057, the first end 1056 is closer to the center of the turntable 102 than the second end 1057, and the weight of the first end 1056 is greater than the weight of the second end 1057. In a preferred embodiment, fixing device 105 may further include a housing 1058, the housing 1058 may be provided on the turntable 102, and the first end 1056, the rotating shaft 1053 and the second end 1057 may be provided in the housing 1058.

[0082] Therefore, when the turntable 102 rotates, the first end 1056 will move toward the edge of the turntable 102 due to the centrifugal force, and at this time, the second end 1057 will be located at a fixed position. When the turntable 102 stops rotating, since the weight of the first end 1056 is greater than the weight of the second end 1057, the first end 1056 will return to the initial position due to the influence of gravity, and at this time, the second end 1057 will be located at the release position, ready to release the wafer frame 30. In this case, it is not necessary to set up other power mechanisms to control the fixing device 105.

[0083] In summary, in the present invention, the cut die 201 is set in the wafer frame 30, and the wafer frame 30 can be adsorbed by the adsorption device 103 in the turntable 102, so that the cleaned surface of the die 201 faces downward, and the die 201 is rotated and cleaned in a manner that the turntable 102 faces the ground. In addition, since the die 201 is fixed below the turntable, the wafer frame 30 can be further fixed on the turntable 102 using a fixing device 105 to prevent the wafer frame 30 from sliding. The nozzle 1042 is located at the bottom of the device and applies a cleaning liquid, such as deionized water or other liquid medicine, to the upper die 201. Therefore, during cleaning, contaminants can flow downward from the grooves 203 between the die 201 by gravity. This can prevent the use of conventional technology to clean a single wafer by using a turntable rotating upward, which causes the liquid medicine at the groove to splash and cause cross contamination. Therefore, the present invention can overcome the problem of difficult cleaning of the grooves of the frame wafer.

[0084] The above description is for illustrative purposes only and is not intended to be limiting. Any equivalent modifications or changes made thereto without departing from the spirit and scope of the present disclosure should be included in the claims.

Claims

1. A wafer cleaning method for cleaning a plurality of wafers separated from each other after dicing and objects to be cleaned between the plurality of wafers, characterized in that: The wafer cleaning method comprises: inverting a wafer frame and the plurality of crystal grains arranged in the wafer frame so that the surfaces to be cleaned of the plurality of crystal grains face the ground; Providing a turntable, placing the wafer frame and the plurality of dies on the turntable, wherein the turntable has a bearing surface, and the bearing surface faces the ground; Using a suction device disposed in the turntable to provide suction in a direction opposite to gravity to adsorb the wafer frame; driving the turntable to rotate; Providing a cleaning device and directing the cleaning device toward the to-be-cleaned surfaces of the plurality of dies; and The cleaning device sprays at least a cleaning liquid toward the plurality of dies.

2. The wafer cleaning method according to claim 1, characterized in that: It also includes providing a plurality of fixing devices, which are arranged on the turntable and are used to fix the wafer frame at a fixed position or release the wafer frame at a release position.

3. The wafer cleaning method according to claim 2, characterized in that: The plurality of fixing devices fix the wafer frame at the fixing position after the adsorption device adsorbs the wafer frame.

4. The wafer cleaning method according to claim 2, characterized in that: It also includes providing a release mechanism. After the turntable stops rotating, the adsorption device continues to provide suction, and the release mechanism enables the multiple fixing devices to move from the fixing position to the release position.

5. The wafer cleaning method according to claim 1, wherein: The method also includes using a transfer device to provide adsorption force to the wafer frame and placing the inverted wafer frame on the turntable.

6. The wafer cleaning method according to claim 5, characterized in that: After the transfer device places the wafer frame on the turntable, the adsorption device adsorbs the wafer frame, and the transfer device releases the adsorption force.

7. A wafer cutting and cleaning method, characterized in that: include: Providing a cutting device to perform a first cutting process on a wafer product arranged in a wafer frame; Forming the wafer product into a plurality of spaced-apart dies; Inverting the wafer frame and the plurality of dies disposed in the wafer frame so that the surfaces of the dies to be cleaned face toward the ground; Providing a turntable, placing the wafer frame and the plurality of dies on the turntable, wherein the turntable has a bearing surface, and the bearing surface faces the ground; Using a suction device disposed in the turntable to provide suction in a direction opposite to gravity to adsorb the wafer frame; driving the turntable to rotate; Providing a cleaning device, and directing the cleaning device toward the to-be-cleaned surfaces of the plurality of dies; as well as The cleaning device sprays at least one cleaning liquid toward the plurality of dies.

8. The wafer cutting and cleaning method according to claim 7, characterized in that: It also includes providing a grinding device. After the first cutting process of the wafer product, the wafer product is attached to a protective film, and the bottom surface of the wafer product is ground by the grinding device to form a plurality of grains spaced apart from each other and objects to be cleaned between the plurality of grains.

9. The wafer cutting and cleaning method according to claim 7, characterized in that: It also includes placing the wafer product in the wafer frame before the wafer product is cut by the cutting device, and attaching the wafer product and the wafer frame to a protective film before performing the first cutting process.

10. The wafer cutting and cleaning method according to claim 9, wherein: After the wafer product is subjected to the first cutting process, the wafer product is subjected to the second cutting process to form the plurality of crystal grains spaced apart from each other.

11. The wafer cutting and cleaning method according to claim 7, wherein: It also includes providing a plurality of fixing devices, which are arranged on the turntable and are used to fix the wafer frame at a fixed position or release the wafer frame at a release position.

12. The wafer cutting and cleaning method according to claim 11, wherein: The plurality of fixing devices fix the wafer frame at the fixing position after the adsorption device adsorbs the wafer frame.

13. The wafer cutting and cleaning method according to claim 11, wherein: It also includes providing a release mechanism. After the turntable stops rotating, the adsorption device continues to provide suction, and the release mechanism enables the multiple fixing devices to move from the fixing position to the release position.

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