Semiconductor structure and forming method thereof
By forming a groove structure on the scribe path of the semiconductor structure and designing a test structure embedded in the groove, the problem of peeling off the test structure during the cutting process is solved, and the performance of the semiconductor structure is improved.
CN119495679AActive Publication Date: 2025-02-21ZHEJIANG ICSPROUT SEMICONDUCTOR CO LTD
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Patent Information
- Application Number
- CN202311027556.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-14
- Publication Date
- 2025-02-21
- Estimated Expiration
- 2043-08-14
Smart Images
Figure CN119495679A_ABST
Abstract
The embodiment of the invention provides a semiconductor structure and a forming method thereof, and the semiconductor structure comprises a substrate which comprises a plurality of chip areas and scribing channels used for separating the chip areas, and the scribing channels are provided with groove structures; and the testing structure is suitable for performing electrical performance testing on the chip area, the testing structure comprises a first testing part and a second testing part, the first testing part is embedded in the groove structure, and the second testing part is located above the first testing part. By adopting the scheme, the test structure can be prevented from stripping the scribing channel, and the performance of the semiconductor structure is improved.
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