Display chip packaging method and mold

Abstract

The invention relates to a packaging method of a display chip and a mold. The packaging method of the display chip comprises the following steps that a substrate is provided, the surface of one side of the substrate is provided with a plurality of display chip modules extending in the first direction, and a cutting channel extending in the first direction is formed between every two adjacent display chip modules; a mold is arranged on the face, provided with the display chip module, of the substrate, the mold comprises a plurality of strip-shaped structures extending in the first direction, and orthographic projections of the strip-shaped structures on the substrate are located in the cutting channels; forming a packaging layer on the surface, provided with the display chip module, of the substrate, wherein the packaging layer covers the display chip module, the side wall of the strip-shaped structure and the exposed surface of the substrate; and removing the mold. According to the packaging method of the display chip, the chip packaging technology is not limited by the shape and the size of the substrate, so that the packaging cost of the Micro LED is reduced.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a packaging method and a mold for a display chip. Background Art

[0002] As people's lives become smarter, display screens are increasingly used in all aspects of life. MicroLED has attracted widespread attention in the display industry due to its excellent contrast and brightness.

[0003] Micro LED in Package (MIP) technology is to transfer Micro LED to a substrate, and then transfer and manufacture the display screen in units of larger size after cutting, thereby reducing the display screen process requirements and facilitating screen repair. However, due to the thickness requirements of MIP, the thickness of the encapsulation glue is generally required to be less than 100μm, so MIP is limited by the shape and size of the substrate. Currently, expensive sapphire substrates are mostly used, which have poor matching with low-cost glass substrates.

[0004] Therefore, how to make chip packaging technology not limited by the shape and size of the substrate and thus reduce the MIP cost is an urgent problem to be solved. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of this application is to provide a packaging method and mold for a display chip, aiming to make the chip packaging technology not limited by the shape and size of the substrate, thereby reducing the problem of Micro LED packaging costs.

[0006] The present application provides a method for packaging a display chip, comprising the following steps:

[0007] A substrate is provided, wherein a surface of one side of the substrate has a plurality of display chip modules extending along a first direction, and a cutting path extending along the first direction is provided between adjacent display chip modules;

[0008] A mold is arranged on a side of the substrate having the display chip module, wherein the mold includes a plurality of strip structures extending along a first direction, and the orthographic projection of the strip structures on the substrate is located within the cutting path;

[0009] Forming a packaging layer on the side of the substrate having the display chip module, the packaging layer covers the display chip module, the side wall of the strip structure and the exposed surface of the substrate;

[0010] Remove the mold.

[0011] In the embodiment of the present application, a plurality of strip structures extending along a first direction are formed on a side of the substrate having a display chip module, and the orthographic projection of the strip structure on the substrate is located within the cutting path, so that the display chip module is separated by the strip structure. In this way, when a packaging layer covering the display chip module is formed on the substrate based on the strip structure, the thickness of the packaging layer can be controlled to be consistent with the height of the strip structure, so that the surface of the packaging layer facing away from the substrate and the surface of the strip structure facing away from the substrate are located in the same plane. In this way, it is helpful to control the thickness of the packaging layer and ensure the flatness of the packaging layer, so that the formation of the packaging layer is not limited by the shape and size of the substrate, thereby reducing the cost of Micro LED packaging (Micro LED in Package, referred to as MIP).

[0012] Optionally, after removing the mold, the method further includes: curing the encapsulation layer.

[0013] Optionally, each display chip module includes a plurality of display chips, and the plurality of display chips are spaced apart along the first direction; a short side of each display chip is parallel to the first direction; and a long side of each display chip is parallel to the second direction.

[0014] Optionally, forming a packaging layer on a side of the substrate having the display chip module includes:

[0015] A scraper is used to apply packaging glue on the side of the substrate with the display chip module to form a packaging layer.

[0016] In the embodiment of the present application, a scraper is used to apply the encapsulation glue to the side of the substrate having the display chip module, so as to better control the thickness of the encapsulation layer and ensure the flatness of the encapsulation layer.

[0017] Optionally, applying packaging glue on the side of the substrate having the display chip module using a scraper includes: applying packaging glue on the side of the substrate having the display chip module along a third direction using a scraper; the third direction intersects both the first direction and the second direction.

[0018] In the embodiment of the present application, compared with coating the encapsulation glue along the first direction or along the second direction, a scraper is used to coat the encapsulation glue along a third direction on the side of the substrate having the display chip module. This can effectively avoid the wear of the scraper on the mold and avoid the color deviation and poor visual effect caused by the uneven position of the encapsulation layer at the mold.

[0019] Optionally, a size of the strip structure along the second direction is equal to a size of the cutting street along the second direction.

[0020] Optionally, the strip structure is perpendicular to the long side of the display chip and parallel to the short side of the display chip;

[0021] The mold also includes a frame, which is fixedly connected to the strip structure.

[0022] Optionally, the size of the mold along the first direction is greater than the size of the substrate along the first direction; the difference between the size of the mold along the first direction and the size of the substrate along the first direction is not less than one quarter of the size of the strip structure along the first direction;

[0023] The height of the stripe structure is no greater than 100 μm.

[0024] In the embodiment of the present application, the size of the mold along the first direction is larger than the size of the substrate along the first direction, that is, the mold is widened. This is conducive to further avoiding the wear of the scraper on the mold and avoiding the color deviation and poor visual effect caused by the unevenness of the encapsulation layer at the mold position.

[0025] Based on the same inventive concept, the embodiment of the present application also provides a mold for packaging a display chip, comprising: a frame, and a plurality of strip structures disposed in the frame and fixedly connected to the frame. The strip structures extend along a first direction, and there are intervals between adjacent strip structures. The intervals are used to accommodate the corresponding display chip module on the substrate to form a packaging layer covering the display chip module, the side walls of the strip structures, and the exposed surface of the substrate; the first direction is the extension direction of the chip display module.

[0026] In the embodiment of the present application, by using a mold having a plurality of strip structures extending along a first direction, the display chip module can be separated by the strip structure. In this way, when a packaging layer covering the display chip module is formed on a substrate based on the strip structure, the thickness of the packaging layer can be controlled to be consistent with the height of the strip structure, so that the surface of the packaging layer facing away from the substrate and the surface of the strip structure facing away from the substrate are located in the same plane. In this way, it is helpful to control the thickness of the packaging layer and ensure the flatness of the packaging layer, so that the formation of the packaging layer is not limited by the shape and size of the substrate, thereby reducing the cost of Micro LED packaging (Micro LED in Package, referred to as MIP).

[0027] Optionally, the size of the mold along the first direction is greater than the size of the substrate along the first direction; the difference between the size of the mold along the first direction and the size of the substrate along the first direction is not less than one quarter of the size of the strip structure along the first direction. The height of the strip structure is not greater than 100 μm. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A flow chart showing a chip packaging method according to an embodiment of the present application;

[0029] Figure 2(a) shows Figure 1 A schematic diagram of a top view of the structure obtained in step S10;

[0030] FIG2( b ) is a schematic cross-sectional view of the structure shown in FIG2( a ) along the aa′ direction;

[0031] Figure 3(a) shows Figure 1 A schematic diagram of a top view of the structure obtained in step S20;

[0032] FIG3( b ) is a schematic cross-sectional view of the structure shown in FIG3( a ) along the aa′ direction;

[0033] FIG4( a ) is a schematic diagram of a top view of a structure obtained when a packaging adhesive is applied by a scraper in a packaging method for a display chip provided in an embodiment;

[0034] FIG4( b ) is a schematic cross-sectional view of the structure shown in FIG4( a ) along the aa′ direction;

[0035] FIG4( c ) is a schematic top view of another structure obtained when a packaging adhesive is coated with a scraper in a packaging method for a display chip provided in an embodiment;

[0036] Figure 5(a) shows Figure 1 A schematic diagram of a top view of the structure obtained in step S30;

[0037] FIG5( b ) is a schematic cross-sectional view of the structure shown in FIG5( a ) along the aa′ direction;

[0038] Figure 6(a) shows Figure 1 A schematic diagram of a top view of the structure obtained in step S40;

[0039] FIG6( b ) is a schematic cross-sectional view of the structure shown in FIG6( a ) along the aa′ direction;

[0040] Figure 7 This is a schematic diagram of the top view of the mold according to an embodiment of the present application;

[0041] Figure 8 for Figure 7 Schematic diagram of the effect of unevenness of the encapsulation layer on light efficiency when the middle strip structure is parallel to the long side of the display chip;

[0042] Fig. 9 for Figure 7 Schematic diagram of the effect of uneven packaging layer on light efficiency when the middle strip structure is parallel to the short side of the display chip;

[0043] Fig.10 A schematic diagram of a top view of another structure obtained when a packaging adhesive is coated with a scraper in a packaging method for a display chip provided by an embodiment;

[0044] Fig.11 This is a schematic diagram of the top view of the mold according to another embodiment of the present application.

[0045] Description of reference numerals:

[0046] 1-substrate; 2-display chip module; 21-display chip; 211-red light emitting diode; 212-green light emitting diode; 213-blue light emitting diode; 3-cutting path; 4-mold; 41-strip structure; 42-frame; 5-scraper; 60-packaging glue; 6-packaging layer. DETAILED DESCRIPTION

[0047] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0049] It should be understood that spatial relationship terms such as "under", "below", "below", "under", "above", "above", etc., can be used here to describe the relationship between an element or feature shown in the figures and other elements or features. It should be understood that in addition to the orientations shown in the figures, spatial relationship terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is turned over, the elements or features described as "under other elements" or "under" or "under" will be oriented as "on" other elements or features. Therefore, the exemplary terms "under" and "under" can include both upper and lower orientations. In addition, the device can also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0050] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "consisting of" and / or "comprising" are used in this specification, the presence of the features, integers, steps, operations, elements and / or parts can be determined, but the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups is not excluded. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0051] As used herein, a "deposition" process includes, but is not limited to, physical vapor deposition (PVD), chemical vapor deposition (CVD), or atomic layer deposition (ALD).

[0052] Embodiments of the invention are described herein with reference to cross-sectional views which are schematic diagrams of ideal embodiments (and intermediate structures) of the invention, such that variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances are anticipated. Thus, embodiments of the invention should not be limited to the specific shapes of the regions shown herein, but rather include deviations in shapes due to, for example, manufacturing techniques. For example, an implanted region shown as a rectangle typically has rounded or curved features and / or an implant concentration gradient at its edges rather than a binary change from an implanted region to a non-implanted region. Similarly, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation is performed. Thus, the regions shown in the figures are schematic in nature, their shapes do not represent the actual shape of the region of the device, and do not limit the scope of the invention.

[0053] As people's lives become smarter, display screens are increasingly used in all aspects of life. MicroLED has attracted widespread attention in the display industry due to its excellent contrast and brightness.

[0054] Considering the high requirements of Micro LED display equipment and the difficult repair process, the concept and products of Micro LED packaging (Micro LED in Package, MIP for short) are now highly praised by the market. MIP technology can transfer Micro LED to MIP substrate, and after cutting, transfer and manufacture the display screen in units of larger size, thereby reducing the display screen process requirements and facilitating screen repair. However, limited by the MIP thickness requirements, the thickness of the encapsulation glue is generally required to be less than 100μm, so MIP is limited by the shape and size of the substrate (it must be a circular substrate and the size must be ≤100mm). Currently, expensive sapphire substrates are mostly used, which have poor matching with low-cost glass substrates.

[0055] In addition, since square glass substrates can carry more MIP units than circular glass substrates, their utilization rate is higher. And considering the subsequent marketization of glass substrate production MIP, the substrate size will develop in the direction of larger size. Therefore, if semiconductor packaging technology is limited by the shape and size of the required packaging substrate, it will no longer be applicable.

[0056] Therefore, how to make chip packaging technology not limited by the shape and size of the substrate and thus reduce the MIP cost is an urgent problem to be solved.

[0057] In view of the above-mentioned shortcomings, the present application proposes a packaging method and mold for a display chip, so that the chip packaging technology is not limited by the shape and size of the substrate, thereby reducing the Micro LED packaging cost.

[0058] See also Figure 1 , an embodiment of the present application provides a packaging method for a display chip, comprising the following steps:

[0059] S10: providing a substrate 1, wherein a surface of one side of the substrate 1 has a plurality of display chip modules 2 extending along a first direction, and a cutting path 3 extending along the first direction is provided between adjacent display chip modules 2.

[0060] S20 : ​​a mold 4 is disposed on a side of the substrate 1 having the display chip module 2 . The mold 4 includes a plurality of strip structures 41 extending along a first direction. The orthographic projections of the strip structures 41 on the substrate 1 are located within the cutting paths 3 .

[0061] S30 : forming a packaging layer 6 on the side of the substrate 1 having the display chip module 2 , the packaging layer 6 covers the display chip module 2 , the sidewalls of the strip structure 41 and the exposed surface of the substrate 1 .

[0062] S40: removing the mold 4.

[0063] In the embodiment of the present application, a plurality of strip structures 41 extending along the first direction are formed on one side of the substrate 1 having the display chip module 2, and the orthographic projection of the strip structure 41 on the substrate 1 is located within the cutting path 3, so that the display chip module 2 is separated by the strip structure 41. In this way, when the encapsulation layer 6 covering the display chip module 2 is formed on the substrate 1 based on the strip structure 41, the thickness of the encapsulation layer 6 can be controlled to be consistent with the height of the strip structure 41, so that the surface of the encapsulation layer 6 facing away from the substrate 1 and the surface of the strip structure 41 facing away from the substrate 1 are located in the same plane. In this way, it is helpful to control the thickness of the encapsulation layer 6 and ensure the flatness of the encapsulation layer 6, so that the formation of the encapsulation layer 6 is not limited by the shape and size of the substrate 1, thereby reducing the cost of Micro LED packaging (MicroLED in Package, referred to as MIP).

[0064] In some examples, after removing the mold 4 in step S40 , the step further includes: curing the encapsulation layer 6 .

[0065] In some examples, step S30 of forming the encapsulation layer 6 on the side of the substrate 1 having the display chip module 2 includes: using a scraper 5 to apply encapsulation glue 60 on the side of the substrate 1 having the display chip module 2 to form the encapsulation layer 6 .

[0066] In some examples, each display chip module 2 includes a plurality of display chips 21 , and the plurality of display chips 21 are spaced apart along a first direction; a short side of each display chip 21 is parallel to the first direction; and a long side of each display chip 21 is parallel to the second direction.

[0067] In some examples, step S30 of applying packaging glue 60 on the side of substrate 1 having display chip module 2 using scraper 5 includes: applying packaging glue 60 on the side of substrate 1 having display chip module 2 using scraper 5 along a third direction. The third direction intersects both the first direction and the second direction.

[0068] In order to more clearly illustrate the packaging method of the display chip provided by the above embodiment, Figure 2(a) to Figure 10 The packaging method of the display chip is described in detail.

[0069] In step S10, referring to FIG. 2(a) and FIG. 2(b), a substrate 1 is provided, wherein a surface of one side of the substrate 1 has a plurality of display chip modules 2 extending along a first direction (e.g., X direction), and cutting paths 3 extending along the first direction (e.g., X direction) are provided between adjacent display chip modules 2.

[0070] In some examples, the substrate 1 includes but is not limited to a glass substrate. In other embodiments, the substrate 1 may also be a sapphire substrate, a semiconductor substrate, a transparent plastic substrate or other types of substrates, which are not limited here and are selected according to actual conditions.

[0071] In some examples, each display chip module 2 includes multiple display chips 21, and the multiple display chips 21 are spaced apart along a first direction (e.g., X direction); the short side of each display chip 21 is parallel to the first direction (e.g., X direction); and the long side of each display chip 21 is parallel to the second direction (e.g., Y direction).

[0072] Here, the display chips 21 in each display chip module 2 correspond one-to-one to the display chips 21 in the adjacent display chip module 2 .

[0073] For example, the display chip 21 includes a red LED 211, a green LED 212, and a blue LED 213 arranged at equal intervals in sequence. In other embodiments, a display chip 21 includes a red LED 211, a green LED 212, and a blue LED 213 arranged at equal intervals in sequence, and the adjacent display chip 21 includes a green LED 212, a red LED 211, and a blue LED 213 arranged at equal intervals in sequence; or the adjacent display chip 21 includes a green LED 212, a blue LED 213, and a red LED 211 arranged at equal intervals in sequence, that is, the color of the LED in the previous display chip 21 close to the next display chip 21 of the two adjacent display chips 21 is different from the color of the LED in the next display chip 21 close to the previous display chip 21, so that the color deviation can be improved. The specific embodiment is not limited to this.

[0074] In step S20, referring to FIG. 3(a) and FIG. 3(b), a mold 4 is disposed on a side of the substrate 1 having the display chip module 2. The mold 4 includes a plurality of strip structures 41 extending along a first direction (e.g., the X direction). The orthographic projection of the strip structures 41 on the substrate 1 is located within the cutting path 3.

[0075] In some examples, the material of the mold 4 can be steel or other materials that are not easily deformed.

[0076] In some examples, referring to FIG. 3( b ), the height H of the strip structure 41 is not greater than 100 μm.

[0077] In some examples, the size of the strip structure 41 along the second direction (eg, Y direction) is equal to the size of the dicing street 3 along the second direction (eg, Y direction). This is beneficial for subsequently separating the display chip modules 2 from each other.

[0078] Here, the size of the strip structure 41 along the second direction (eg, the Y direction) includes: being substantially equal to the size of the cutting street 3 along the second direction (eg, the Y direction).

[0079] For example, the size of the strip structure 41 along the second direction (eg, Y direction) ranges from 80 μm to 150 μm. For example, the size of the strip structure 41 along the second direction (eg, Y direction) may be 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, or 150 μm, etc.

[0080] Optionally, the strip structure 41 is perpendicular to the long side of the display chip 21 and parallel to the short side of the display chip 21 .

[0081] Here, in the second direction (for example, the Y direction), the red LED 211, the green LED 212, and the blue LED 213 are at the same distance from the strip structure 41, ensuring that the viewing angles of the red LED 211, the green LED 212, and the blue LED 213 are consistent at a wide viewing angle.

[0082] In step S30 , referring to FIG. 4 ( a ) and FIG. 4 ( b ), a packaging adhesive 60 is applied to the side of the substrate 1 having the display chip module 2 using a scraper 5 to form a packaging layer 6 .

[0083] In the embodiment of the present application, a scraper 5 is used to apply the encapsulation glue 60 on the side of the substrate 1 having the display chip module 2 , so as to better control the thickness of the encapsulation layer 6 and ensure the flatness of the encapsulation layer 6 .

[0084] In some examples, referring to FIG. 4( c ), a scraper 5 is used to apply a packaging glue 60 along a third direction (e.g., Z direction) on a side of the substrate 1 having the display chip module 2 to form a packaging layer 6. The third direction (e.g., Z direction) intersects with both the first direction (e.g., X direction) and the second direction (e.g., Y direction).

[0085] In the embodiment of the present application, compared with coating the encapsulation glue 60 along the first direction (for example, the X direction) or along the second direction (for example, the Y direction), the scraper 5 is used to coat the encapsulation glue 60 along the third direction (for example, the Z direction) on the side of the substrate 1 having the display chip module 2. This can effectively avoid the wear of the scraper 5 on the mold 4 and avoid the color deviation and poor visual effect caused by the uneven position of the encapsulation layer 6 on the mold 4.

[0086] For example, the scraper 5 is in physical contact with the mold 4 .

[0087] Here, referring to FIG. 5( a ) and FIG. 5( b ), the use of a scraper 5 to apply the encapsulation adhesive 60 can control the thickness of the encapsulation layer 6 and ensure the flatness of the encapsulation layer 6 .

[0088] For example, the material of the packaging glue 60 can be an elastic material.

[0089] In step S40 , please refer to FIG. 6 ( a ) and FIG. 6 ( b ), the mold 4 is removed.

[0090] For some examples, see Figure 7 If the strip structure 41 is parallel to the long side of the display chip 21, after the mold 4 is removed, the uneven encapsulation layer 6 at the demoulding position will affect the light effect, making the light at some positions cyan and the light at some positions yellow.

[0091] For further examples, see Figure 8In the present application, the strip structure 41 is parallel to the short side of the display chip 21. After the mold 4 is removed, the uneven encapsulation layer 6 at the demolding position will not affect the light effect, and the color of light at different positions is consistent.

[0092] For some examples, see Fig. 9 The mold 4 also includes a frame 42 , and the frame 42 is fixedly connected to the strip structure 41 .

[0093] Here, the frame 42 and the strip structure 41 may be an integral structure.

[0094] For some examples, see Fig.10 , the size of the mold 4 along the first direction (e.g., X direction) is greater than the size of the substrate 1 along the first direction (e.g., X direction). For example, the difference between the size of the mold 4 along the first direction (e.g., X direction) and the size of the substrate 1 along the first direction (e.g., X direction) is not less than one-fourth of the size of the strip structure 41 along the first direction (e.g., X direction). In some examples, the width of the frame 42 is ≥ one-fourth of the size of the mold 4 along the first direction (e.g., X direction) or the size of the second direction (e.g., Y direction), which is conducive to carrying the scraper 5 and extending its life.

[0095] In the embodiment of the present application, the size of the mold 4 along the first direction (for example, the X direction) is larger than the size of the substrate 1 along the first direction (for example, the X direction), that is, the mold 4 is widened. In this way, it is helpful to further avoid the wear of the scraper 5 on the mold 4, and avoid the color deviation and poor visual effect caused by the uneven position of the encapsulation layer 6 at the mold 4, and at the same time extend the service life of the mold 4.

[0096] After the mold 4 is removed in step S40 , the process further includes: curing the encapsulation layer 6 .

[0097] In some examples, after the encapsulation layer 6 is cured, it can be subsequently cut using a laser or a cutter wheel to separate different display chip modules 2 from each other.

[0098] By way of further example, after different display chip modules 2 are separated from each other, it is necessary to continue cutting the display chip module 2 using a laser or a cutter wheel to separate different display chips 21 from each other.

[0099] Here, since the material of the packaging glue 6 itself is elastic, it will return to being flat after being cut together with the substrate 1 by a laser or a knife wheel.

[0100] Based on the same inventive concept, please refer to Fig.11The embodiment of the present application further provides a mold 4 for packaging a display chip 21, comprising: a frame 42, and a plurality of strip structures 41 disposed in the frame 42 and fixedly connected to the frame 42. The strip structures 41 extend along a first direction (e.g., the X direction), and there are intervals between adjacent strip structures 41. The intervals are used to accommodate the corresponding display chip module 2 on the substrate 1 to form a packaging layer 6 covering the display chip module 2, the side walls of the strip structures 41, and the exposed surface of the substrate 1; the first direction (e.g., the X direction) is the extension direction of the chip display module 2.

[0101] In the embodiment of the present application, the shape of the frame 42 is square, rectangular, circular or other shapes, which are not limited here and are selected according to actual needs.

[0102] In the embodiment of the present application, by using a mold 4 having a plurality of strip structures 41 extending along a first direction (e.g., X direction), the display chip module 2 can be separated by the strip structures 41. In this way, when the encapsulation layer 6 covering the display chip module 2 is formed on the substrate 1 based on the strip structures 41, the thickness of the encapsulation layer 6 can be controlled to be consistent with the height of the strip structures 41, so that the surface of the encapsulation layer 6 facing away from the substrate 1 and the surface of the strip structures 41 facing away from the substrate 1 are located in the same plane. In this way, it is helpful to control the thickness of the encapsulation layer 6 and ensure the flatness of the encapsulation layer 6, so that the formation of the encapsulation layer 6 is not limited by the shape and size of the substrate 1, thereby reducing the cost of Micro LED packaging (Micro LED in Package, referred to as MIP).

[0103] Here, the frame 42 and the strip structure 41 may be an integral structure.

[0104] In some examples, the mold 4 is disposed on a surface of a substrate 1 having a plurality of display chip modules 2 extending along a first direction (eg, X direction), and a cutting path 3 extending along the first direction (eg, X direction) is provided between adjacent display chip modules 2 .

[0105] In some examples, the substrate 1 includes but is not limited to a glass substrate. In other embodiments, the substrate 1 may also be a sapphire substrate, a semiconductor substrate, a transparent plastic substrate or other types of substrates, which are not limited here and are selected according to actual conditions.

[0106] For some examples, see Fig. 9 Each display chip module 2 includes a plurality of display chips 21, and the plurality of display chips 21 are spaced apart along a first direction (e.g., X direction); a short side of each display chip 21 is parallel to the first direction (e.g., X direction); and a long side of each display chip 21 is parallel to a second direction (e.g., Y direction).

[0107] Here, the display chips 21 in each display chip module 2 correspond one-to-one to the display chips 21 in the adjacent display chip module 2 .

[0108] For example, the display chip 21 includes a red LED 211, a green LED 212, and a blue LED 213 arranged at equal intervals in sequence. In other embodiments, a display chip 21 includes a red LED 211, a green LED 212, and a blue LED 213 arranged at equal intervals in sequence, and the adjacent display chip 21 includes a green LED 212, a red LED 211, and a blue LED 213 arranged at equal intervals in sequence; or the adjacent display chip 21 includes a green LED 212, a blue LED 213, and a red LED 211 arranged at equal intervals in sequence, that is, the color of the LED in the previous display chip 21 close to the next display chip 21 of the two adjacent display chips 21 is different from the color of the LED in the next display chip 21 close to the previous display chip 21, so that the color deviation can be improved. The specific embodiment is not limited to this.

[0109] In some examples, continue to combine Figure 8 It is understood that the size of the mold 4 along the first direction (e.g., X direction) is greater than the size of the substrate 1 along the first direction (e.g., X direction). For example, the size difference D between the size of the mold 4 along the first direction (e.g., X direction) and the size of the substrate 1 along the first direction (e.g., X direction) is not less than one quarter of the size of the strip structure 41 along the first direction (e.g., X direction).

[0110] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A method for packaging a display chip, characterized in that: The following steps are involved: Providing a substrate, wherein a surface of one side of the substrate has a plurality of display chip modules extending along a first direction, and a cutting path extending along the first direction is provided between adjacent display chip modules; A mold is arranged on a side of the substrate having the display chip module, wherein the mold comprises a plurality of strip structures extending along the first direction, and the orthographic projection of the strip structures on the substrate is located within the cutting path; Forming a packaging layer on a side of the substrate having the display chip module, wherein the packaging layer covers the display chip module, the sidewalls of the strip-shaped structure and the exposed surface of the substrate; The mold is removed.

2. The display chip packaging method according to claim 1, characterized in that: After removing the mold, the method further includes: curing the encapsulation layer.

3. The display chip packaging method according to claim 1, characterized in that: Each of the display chip modules includes a plurality of display chips, and the plurality of display chips are spaced apart along the first direction; a short side of each of the display chips is parallel to the first direction; and a long side of each of the display chips is parallel to the second direction.

4. The display chip packaging method according to claim 3, characterized in that: The step of forming a packaging layer on a side of the substrate having a display chip module comprises: A scraper is used to apply packaging glue on the side of the substrate with the display chip module to form a packaging layer.

5. The display chip packaging method according to claim 4, characterized in that: The step of applying packaging glue to the side of the substrate having the display chip module using a scraper includes: applying packaging glue to the side of the substrate having the display chip module using a scraper along a third direction; the third direction intersects both the first direction and the second direction.

6. The method for packaging a display chip according to claim 3, characterized in that: The size of the strip structure along the second direction is equal to the size of the cutting street along the second direction.

7. The display chip packaging method according to claim 3, characterized in that: The strip structure is perpendicular to the long side of the display chip and parallel to the short side of the display chip; The mold further comprises a frame, and the frame is fixedly connected to the strip structure.

8. The display chip packaging method according to claim 7, characterized in that: The size of the mold along the first direction is larger than the size of the substrate along the first direction; the difference between the size of the mold along the first direction and the size of the substrate along the first direction is not less than one quarter of the size of the strip structure along the first direction; the height of the strip structure is not greater than 100 μm.

9. A mold, characterized in that: Packaging for display chips, including: frame; and a plurality of strip structures disposed in the frame and fixedly connected to the frame; the strip structures extend along a first direction, and there are intervals between adjacent strip structures; The space is used to accommodate the corresponding display chip module on the substrate to form a packaging layer covering the display chip module, the sidewalls of the strip structure and the exposed surface of the substrate; the first direction is the extension direction of the chip display module.

10. The mold according to claim 9, characterized in that: The size of the mold along the first direction is greater than the size of the substrate along the first direction; the difference between the size of the mold along the first direction and the size of the substrate along the first direction is not less than one quarter of the size of the strip structure along the first direction; The height of the strip structure is no more than 100 μm.

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