A wafer quick-displacement slot with magnetic self-adjustment function

Abstract

The present invention discloses a wafer quick discharge trough with a magnetic self-adjusting function, which relates to the field of wafer cleaning technology. It comprises a wafer quick discharge trough with a nitrogen aeration pipe installed at the bottom of the inner cavity, a spray pipe and a detection unit for detecting the resistivity of the deionized water in the trough provided on the wafer quick discharge trough, a magnet provided on the outer wall of the wafer quick discharge trough close to the detection unit, and the magnet is configured as an electromagnet. It also comprises an automatic magnetic adjustment unit installed on the wafer quick discharge trough, which automatically adjusts the magnetic size of the magnet according to the temperature change of the deionized water in the wafer quick discharge trough to meet the requirement of using the magnetic field to drive away nitrogen bubbles. The automatic magnetic adjustment unit provided automatically adjusts the magnetic size of the magnet according to the temperature change of the deionized water in the wafer quick discharge trough to meet the requirement of using the magnetic field to drive away nitrogen bubbles.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, and in particular to a wafer quick-discharging slot with a magnetic self-adjusting function. Background Art

[0002] With increasing IC integration, wafer surface cleanliness is crucial for achieving high performance and high yield, making wafer cleaning particularly important. Cleaning is performed to reduce contamination, which can affect device performance, lead to reliability issues, and reduce yield. This requires thorough cleaning of each layer before the next process step. Typically, in tank-type wet cleaning equipment, each chemical rinse is followed by a rapid drain rinse to remove material particles and chemical residues adhering to the wafer from the previous process. Currently, rapid drain rinsing using a rapid drain tank is a common wafer cleaning method. This method involves completely immersing the wafer in deionized water in the rapid drain tank, then rapidly draining the water from the tank. Simultaneously, deionized water is sprayed onto the wafer using a nozzle to clean the wafer.

[0003] In existing wet cleaning equipment, the fast-discharge tank is an essential part of the cleaning process. It is primarily used to remove particulate impurities and residual chemical liquid from the wafer surface, leaving the wafer surface clean. Its structure can be found in Chinese patent publication number CN 115945434B.

[0004] A magnet is arranged on the inner wall of the trough body in the above-mentioned patent, and a magnetic field is generated by the magnet on the nitrogen bubbles that are moving upward in the deionized water. Since nitrogen has a reverse magnetic shape, the magnetic field can make the nitrogen bubbles move away from the resistivity detection probe, thereby improving the detection accuracy; in actual applications, for the cleaning of different particulate impurities and residual chemical solutions, the temperature of the deionized water needs to be changed accordingly, and the temperature of the deionized water affects the rising speed of the nitrogen bubbles (the higher the temperature, the faster the nitrogen bubbles rise). At this time, it is necessary to replace and install magnets with different magnetic field strengths according to different temperatures to meet the need of driving the steam drum away from the resistivity detection probe to avoid affecting the detection accuracy. Frequent replacement is troublesome. Therefore, the present application provides a wafer quick discharge trough with magnetic self-adjustment function to meet the needs. Summary of the Invention

[0005] The purpose of this application is to provide a wafer quick-displacement slot with a magnetic self-adjustment function, which is used to solve the technical problem in the prior art that magnets with different magnetic field strengths need to be manually replaced and installed according to the different temperatures of deionized water.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical solution: a wafer quick discharge trough with a magnetic self-adjusting function, comprising a wafer quick discharge trough with a nitrogen aeration tube installed at the bottom of the inner cavity, the wafer quick discharge trough being provided with a spray pipe and a detection unit for detecting the resistivity of the deionized water in the trough, a magnet being provided on the outer wall of the wafer quick discharge trough close to the detection unit, the magnet being configured as an electromagnet, and also comprising an automatic magnetic adjustment unit installed on the wafer quick discharge trough, which automatically adjusts the magnetic size of the magnet according to the temperature change of the deionized water in the wafer quick discharge trough to meet the requirement of using the magnetic field to drive away nitrogen bubbles.

[0007] As a preferred implementation manner in this embodiment, the automatic magnetic adjustment unit includes a heat pipe with its lower end mounted on the inner wall of the wafer quick discharge slot, a movable vertical rod is provided above the heat pipe, and the lower end of the movable vertical rod is located in the inner cavity of the heat pipe, an elastic sealing head is fixed to the lower end of the movable vertical rod, and the outer wall of the elastic sealing head is in sliding contact with the inner wall of the heat pipe, a tooth plate is installed at the upper end of the movable vertical rod, and the tooth plate is gear-engaged with the adjustment knob of the current controller, and the current controller is provided above the wafer quick discharge slot;

[0008] The expansion cavity formed between the lower end of the movable upright and the inner wall of the heat conducting tube is filled with helium;

[0009] The current controller is electrically connected to the magnet.

[0010] As a preferred implementation in this embodiment, it also includes a segmented lifting unit for controlling the segmented upward movement of the tooth plate.

[0011] As a preferred implementation scheme in this embodiment, the segmented rising unit includes a hollow tube, which is sleeved on the outer periphery of the upper end of the heat-conducting tube and fixedly connected to the movable vertical rod. The lower end of the hollow tube is located at the upper end of the wafer quick-displacement slot. A contact head is provided on the inner wall of the hollow tube, and the upper and lower surfaces of the contact head are both provided with inclined surfaces. Hollow columns are arranged in sequence from bottom to top on the outer wall of the heat-conducting tube near the contact head, and the inner cavity of the hollow column is connected to a telescopic head through a spring, and the upper and lower ends of the telescopic head are both provided with inclined surfaces.

[0012] As a preferred implementation manner in this embodiment, it further includes a contactless driving unit, so that the moving contact head can drive the corresponding telescopic head to move in and out of the inner cavity of the hollow column without contact.

[0013] As a preferred implementation manner in this embodiment, the contactless drive unit includes permanent magnets arranged on the contact head and two inclined surfaces of the telescopic head, wherein the upper magnetic pole of the permanent magnet arranged above the contact head is the same as the lower magnetic pole of the permanent magnet arranged below the telescopic head;

[0014] The lower magnetic pole of the permanent magnet disposed below the contact head is the same as the upper magnetic pole of the permanent magnet disposed above the telescopic head.

[0015] As a preferred implementation manner in this embodiment, the distance between two adjacent hollow columns becomes smaller when counting from bottom to top among the plurality of hollow columns, and correspondingly, the elastic coefficient of the spring becomes larger when counting from bottom to top.

[0016] As a preferred implementation in this embodiment, the contact heads are relatively arranged in two groups, and the corresponding hollow columns, the springs and the telescopic heads are arranged in two rows.

[0017] In summary, the technical effects and advantages of the present invention are as follows:

[0018] The present invention has a reasonable structure. Through the automatic magnetic adjustment unit, the magnetic strength of the magnet is automatically adjusted according to the temperature change of the deionized water in the wafer quick discharge tank to meet the requirement of using the magnetic field to drive away nitrogen bubbles.

[0019] In the present invention, a segmented rising unit is further provided for controlling the segmented upward movement of the tooth plate. This segmented rising method realizes a precise response to the temperature, thereby realizing precise control of the magnetic field strength. At the same time, since each rise is limited, even in the case of a sudden increase in water temperature, the tooth plate will not rise to the extreme position all at once, thereby avoiding system imbalance caused by excessive adjustment and further improving the stability and reliability of the system.

[0020] In the present invention, the distance between two adjacent hollow columns becomes smaller from bottom to top, and the elastic coefficient of the spring becomes larger and larger from bottom to top. This setting enables a more delicate response to temperature changes as the water temperature gradually increases, thereby achieving more detailed control of water temperature changes. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1Schematic diagram of the cross-sectional structure of the wafer quick-displacement slot of the present invention;

[0023] Figure 2 for Figure 1 Schematic diagram of the partial cross-section structure of the automatic magnetic adjustment unit;

[0024] Figure 3 for Figure 2 A in the middle is an enlarged structural diagram;

[0025] Figure 4 This is a schematic diagram of the permanent magnet installation position structure;

[0026] Figure 5 for Figure 4 Enlarged structural diagram at point B in the middle.

[0027] In the figure: 1. Wafer quick discharge slot; 2. Nitrogen aeration pipe; 3. Magnet; 4. Spray pipe; 5. Detection unit; 6. Automatic magnetic adjustment unit; 61. Heat transfer pipe; 62. Hollow pipe; 63. Current controller; 64. Adjustment knob; 65. Tooth plate; 66. Movable vertical rod; 67. Elastic sealing head; 68. Hollow column; 69. Spring; 610. Telescopic head; 611. Contact head; 612. Permanent magnet. DETAILED DESCRIPTION

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] Example: Reference Figure 1 The wafer quick discharge trough shown has a magnetic self-adjusting function, including a wafer quick discharge trough 1 with a nitrogen aeration pipe 2 installed at the bottom of the inner cavity, a spray pipe 4 and a detection unit 5 for detecting the resistivity of the deionized water in the trough are provided on the wafer quick discharge trough 1, and a magnet 3 is provided on the outer wall of the wafer quick discharge trough 1 on the side close to the detection unit 5. The characteristics are: the magnet 3 is configured as an electromagnet, and also includes an automatic magnetic adjustment unit 6 installed on the wafer quick discharge trough 1, which automatically adjusts the magnetic size of the magnet 3 according to the temperature change of the deionized water in the wafer quick discharge trough 1 to meet the requirement of using the magnetic field to drive away nitrogen bubbles.

[0030] As a preferred implementation in this embodiment, Figure 1-2As shown, the automatic magnetic adjustment unit 6 includes a heat pipe 61 whose lower end is mounted on the inner wall of the wafer quick discharge slot 1, a movable vertical rod 66 is provided above the heat pipe 61, and the lower end of the movable vertical rod 66 is located in the inner cavity of the heat pipe 61, an elastic sealing head 67 is fixed to the lower end of the movable vertical rod 66, and the outer wall of the elastic sealing head 67 slides against the inner wall of the heat pipe 61, a tooth plate 65 is installed on the upper end of the movable vertical rod 66, and the tooth plate 65 is gear-engaged with the adjustment knob 64 of the current controller 63, and the current controller 63 is provided above the wafer quick discharge slot 1;

[0031] The expansion cavity formed between the lower end of the movable upright 66 and the inner wall of the heat conducting tube 61 is filled with helium;

[0032] The current controller 63 is electrically connected to the magnet 3 .

[0033] When the deionized water in the wafer quick discharge slot 1 submerges the lower end of the heat pipe 61, the internal helium will expand due to heat conduction and drive the tooth plate 65 to move upward through the movable vertical rod 66, thereby rotating the adjustment rotary 64. The current passing through the electromagnet becomes larger, and the magnetism of the electromagnet becomes stronger, so that the magnetism of the electromagnet increases with the increase of temperature and decreases with the decrease of temperature, thereby realizing that the magnetic field strength changes with the change of temperature, that is, automatic adjustment, avoiding manual replacement, installation and adjustment.

[0034] As a preferred implementation in this embodiment, a segmented lifting unit is further included to control the tooth plate 65 to move upward in segments.

[0035] As a preferred implementation in this embodiment, Figure 2-3 As shown, the segmented rising unit includes a hollow tube 62, which is sleeved on the outer periphery of the upper end of the heat-conducting tube 61 and fixedly connected to the movable vertical rod 66. The lower end of the hollow tube 62 is located at the upper end of the wafer quick-displacement slot 1. A contact head 611 is provided on the inner wall of the hollow tube 62, and the upper and lower surfaces of the contact head 611 are both provided with inclined surfaces. Hollow columns 68 are arranged in sequence from bottom to top on the outer wall of the heat-conducting tube 61 near the contact head 611, and the inner cavity of the hollow column 68 is connected to the telescopic head 610 through a spring 69, and the upper and lower ends of the telescopic head 610 are both provided with inclined surfaces.

[0036] When detecting the temperature, the heat conducting tube 61 is heated by deionized water, and the expansion of the internal helium drives the contact head 611 to move upward, and contacts the inclined surface of the lower end of the telescopic head 610 and stays still for a period of time. At this time, the air pressure in the heat conducting tube 61 increases (the temperature increase causes the internal gas to expand and the air pressure to increase). When it increases to a set value, the contact head 611 will cause the telescopic head 610 to move like the compression spring 69 and eventually move upward over the telescopic head 610 and contact the inclined surface of the telescopic head 610 set above. As the air pressure in the heat conducting tube 61 continues to increase, the contact head 611 will pass over this telescopic head 610 and contact the inclined surface above. The inclined surface at the lower end of the telescopic head 610 contacts the tooth plate 65 repeatedly, so that the tooth plate 65 forms a segmented upward movement, thereby realizing segmented regulation of the magnetism of the magnet 3. Every time the temperature rises by a certain level, the magnetism of the magnet 3 is correspondingly enhanced. This segmented rising method actually realizes a precise response to the temperature. Whenever the water temperature rises to a certain level, the tooth plate 65 will rise by a certain level, and the current in the electromagnet is increased by adjusting the knob 64, thereby enhancing the magnetic field strength. This segmented regulation method enables the system to make detailed adjustments according to slight changes in water temperature, thereby realizing precise control of the magnetic field strength.

[0037] If the tooth plate 65 continues to rise as the temperature rises, the current and magnetic field strength in the electromagnet will also continue to increase. However, this trend of continuous increase may cause the system to overreact. That is, when the water temperature fluctuates slightly, the magnetic field strength will change significantly. The staged rise method can avoid this situation because each time the tooth plate 65 stops rising, it provides a "buffer period" for the system, allowing the system to make further adjustments after the water temperature stabilizes.

[0038] Since each rise is limited, even when the water temperature suddenly rises, the tooth plate 65 will not rise to the limit position all at once, thereby avoiding system imbalance caused by excessive adjustment and further improving the stability and reliability of the system.

[0039] As a preferred implementation in this embodiment, a contactless driving unit is further included, so that the moving contact head 611 can drive the corresponding telescopic head 610 to move in and out of the inner cavity of the hollow column 68 without contact.

[0040] As a preferred implementation in this embodiment, Figure 4-5 As shown, the contactless drive unit includes a contact head 611 and permanent magnets 612 on two inclined surfaces of the telescopic head 610. The upper magnetic pole of the permanent magnet 612 arranged above the contact head 611 is the same as the lower magnetic pole of the permanent magnet 612 arranged below the telescopic head 610.

[0041] The lower magnetic pole of the permanent magnet 612 disposed below the contact head 611 is the same as the upper magnetic pole of the permanent magnet 612 disposed above the telescopic head 610 .

[0042] Due to the repulsion between like poles of magnets, when the contact head 611 rises or falls, a force is exerted on the telescopic head 610. This force causes the telescopic head 610 to move to compress the spring 69, thereby causing the contact head 611 to pass over the telescopic head 610, thereby reducing the contact friction between the two and avoiding excessive wear of the components and reducing the adjustment accuracy.

[0043] It should be noted that a universal ball bearing may be provided on the end of the contact head 611 to reduce the friction generated when the contact head 611 contacts the end of the telescopic head 610 .

[0044] As a preferred implementation in this embodiment, Figure 4 As shown, among the plurality of hollow columns 68 , the distance between two adjacent hollow columns 68 becomes smaller as they are counted from bottom to top, and correspondingly, the elastic coefficient of the spring 69 becomes larger as they are counted from bottom to top.

[0045] This arrangement enables a more delicate response to temperature changes as the water temperature gradually rises. Since the distance the contact head 611 rises gradually decreases each time the temperature rises by the same amount, this means that the system can more accurately adjust the current and magnetic field strength in the electromagnet, thereby achieving more detailed control over water temperature changes.

[0046] As the temperature gradually rises, if the distance the contact head 611 rises each time remains constant, then when the water temperature approaches the critical point, the system may react significantly to small temperature fluctuations. However, by gradually decreasing the rise distance, the system's sensitivity in high-temperature areas can be reduced, reducing system instability caused by temperature fluctuations.

[0047] This setting enables the system to better adapt to working requirements in different temperature environments. Whether in low or high temperature environments, the system can maintain stable performance output by adjusting the rising distance of the contact head 611. This adaptability enables the system to operate stably in a wider temperature range, thereby improving the reliability and practicality of the system.

[0048] As a preferred implementation in this embodiment, Figure 2 As shown, the contact heads 611 are arranged in two groups relative to each other, and the corresponding hollow columns 68, springs 69 and telescopic heads 610 are arranged in two rows.

[0049] The structural setting is conducive to uniform stress on the elastic sealing head 67, avoiding the tilt of the movable vertical rod 66, which may cause severe local stress on the elastic sealing head 67 and reduce the sealing effect, and is conducive to the stability of the entire system.

[0050] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer quick discharge tank with a magnetic self-adjusting function, comprising a wafer quick discharge tank (1) with a nitrogen aeration pipe (2) installed at the bottom of the inner cavity, a spray pipe (4) and a detection unit (5) for detecting the resistivity of deionized water in the tank provided on the wafer quick discharge tank (1), a magnet (3) provided on the outer wall of the wafer quick discharge tank (1) on the side close to the detection unit (5), characterized in that; The magnet (3) is configured as an electromagnet and further comprises an automatic magnetic adjustment unit (6) mounted on the wafer quick discharge slot (1), which automatically adjusts the magnetic magnitude of the magnet (3) according to the temperature change of the deionized water in the wafer quick discharge slot (1) to meet the requirement of using a magnetic field to drive away nitrogen bubbles.

2. The wafer quick discharge slot with magnetic self-adjustment function according to claim 1, characterized in that: The automatic magnetic adjustment unit (6) includes a heat pipe (61) whose lower end is mounted on the inner wall of the wafer quick discharge slot (1); a movable vertical rod (66) is arranged above the heat pipe (61), and the lower end of the movable vertical rod (66) is located in the inner cavity of the heat pipe (61); an elastic sealing head (67) is fixed to the lower end of the movable vertical rod (66), and the outer wall of the elastic sealing head (67) is in sliding contact with the inner wall of the heat pipe (61); a tooth plate (65) is installed at the upper end of the movable vertical rod (66), and the tooth plate (65) is gear-connected with the adjustment knob (64) of the current controller (63); and the current controller (63) is arranged above the wafer quick discharge slot (1); The expansion cavity formed between the lower end of the movable upright rod (66) and the inner wall of the heat conducting tube (61) is filled with helium; The current controller (63) is electrically connected to the magnet (3).

3. The wafer quick discharge slot with magnetic self-adjustment function according to claim 2, characterized in that: It also includes a segmented ascending unit for controlling the segmented upward movement of the tooth plate (65).

4. The wafer quick discharge slot with magnetic self-adjustment function according to claim 3, characterized in that: The segmented rising unit includes a hollow tube (62), which is sleeved on the outer periphery of the upper end of the heat-conducting tube (61) and fixedly connected to the movable vertical rod (66). The lower end of the hollow tube (62) is located at the upper end of the wafer quick-displacement slot (1). A contact head (611) is provided on the inner wall of the hollow tube (62), and the upper and lower surfaces of the contact head (611) are both provided with inclined surfaces. Hollow columns (68) are arranged in sequence from bottom to top on the outer wall of the heat-conducting tube (61) near the contact head (611), and the inner cavity of the hollow column (68) is connected to a telescopic head (610) through a spring (69), and the upper and lower ends of the telescopic head (610) are both provided with inclined surfaces.

5. The wafer quick discharge slot with magnetic self-adjustment function according to claim 4, characterized in that: It also includes a contactless driving unit, so that the moving contact head (611) can drive the corresponding telescopic head (610) to move in and out of the inner cavity of the hollow column (68) without contact.

6. The wafer quick discharge slot with magnetic self-adjustment function according to claim 5, characterized in that: The contactless drive unit comprises permanent magnets (612) arranged on two inclined surfaces of the contact head (611) and the telescopic head (610), wherein the upper magnetic pole of the permanent magnet (612) arranged above the contact head (611) is the same as the lower magnetic pole of the permanent magnet (612) arranged below the telescopic head (610); The lower magnetic pole of the permanent magnet (612) arranged below the contact head (611) is the same as the upper magnetic pole of the permanent magnet (612) arranged above the telescopic head (610).

7. The wafer quick discharge slot with magnetic self-adjustment function according to claim 4, characterized in that: Counting from bottom to top among the plurality of hollow columns (68), the distance between two adjacent hollow columns (68) becomes smaller, and correspondingly, the elastic coefficient of the spring (69) becomes larger.

8. The wafer quick discharge slot with magnetic self-adjustment function according to claim 4, characterized in that: The contact heads (611) are relatively arranged in two groups, and the corresponding hollow columns (68), the springs (69) and the telescopic heads (610) are arranged in two rows.

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