Large-breadth cutting device and method for high-porosity light materials

Abstract

The invention discloses a large-breadth cutting device and method for a high-porosity light material. The cutting device comprises a machining platform used for fixing the material, and a visual positioning mechanism used for detecting and positioning the position of the material on the machining platform is arranged on the machining platform. The laser cutting mechanism is used for carrying out material processing according to a set shape; the airflow auxiliary mechanism is used for forming forward air pressure in a processing area during material cutting so that a material is attached to the surface of the processing platform; the annular gas impulse formed by the gas flow auxiliary mechanism is used for fixing the material, so that the machining precision of the material is ensured, and the method is simple and easy to implement; inert gas can be adopted as gas flow, a gas protection layer can be formed on the surface of the material in the machining process, and the edge oxidation discoloration situation caused by the heat influence of the material can be effectively reduced.

Description

Technical Field

[0001] The invention relates to the technical field of light material processing, and in particular to a large-format cutting device and a cutting method for high-porosity light material. Background Art

[0002] High-porosity lightweight materials such as felt are widely used in many fields such as aerospace, automobiles, etc. With the increase in demand, the precision of their processing is also increasing, and traditional tool cutting can no longer meet the requirements; on the one hand, the tool processing edge burrs are large, and on the other hand, because the tool is a contact processing, it is difficult to achieve small-sized and special-shaped graphics processing. At the same time, the fixation problem of high-porosity material processing can be solved by coating, but the operation is cumbersome, the process control is complex, and the appropriate film needs to be selected, so the retention problem in the material processing process is also a problem that needs to be solved urgently. Summary of the invention

[0003] Technical purpose: In view of the shortcomings of existing light material processing, the present invention discloses a large-format cutting device and cutting method for high-porosity light materials.

[0004] Technical solution: To achieve the above technical objectives, the present invention adopts the following technical solution: A large-format cutting device for high-porosity lightweight materials includes a processing platform for fixing materials, a visual positioning mechanism arranged on the processing platform for detecting and positioning the position of the material on the processing platform, a laser cutting mechanism for processing the material according to a set shape, and an airflow auxiliary mechanism for forming positive air pressure in the processing area when cutting the material to make the material fit onto the surface of the processing platform.

[0005] Preferably, the airflow assist mechanism of the present invention includes an adsorption hole provided on the processing platform and a jet ring provided above the processing platform, the jet ring is provided with a nozzle facing the material processing area, the angle of the nozzle is adjustable on the jet ring, and the positive air pressure range formed by the airflow ejected from the nozzle is adjusted by rotating the nozzle.

[0006] Preferably, the number of the jet rings of the present invention is several groups, and the angle between the air outlet direction of the nozzles on the jet rings and the horizontal direction gradually increases from bottom to bottom, so that the material is positioned and fixed from the center of the processing area to the periphery; the nozzle of the lowest jet ring is perpendicular to the surface of the material, and the airflow through the nozzle of the lowest jet ring limits the outer boundary of the positive air pressure.

[0007] Preferably, the number of air jet rings of the present invention is determined according to the processing range of the laser cutting mechanism and the air jet width range of the nozzle. The processing range is W*W, the nozzle width is w, and the number of air jet rings N=round(W / (2w))+1.

[0008] Preferably, the laser cutting mechanism of the present invention comprises a laser light source, and a laser shaping and beam expanding lens group, a scanning galvanometer and a focusing lens group which are sequentially arranged along the optical path direction of the laser light source.

[0009] Preferably, a planar moving mechanism is provided below the processing platform of the present invention for driving the processing platform to move in a horizontal plane to adjust the cutting position.

[0010] The present invention also discloses a large-format cutting method for high-porosity lightweight materials, using the above-mentioned cutting device, comprising the steps of: S01. Fix the material to be cut on the processing platform; S02, obtaining the outline of the material and its position on the processing platform through a visual positioning mechanism, and locating the position of the material; S03, layout the cutting process of the material according to the graphics to be cut, and determine the cutting process order; S04. When performing cutting processing, an airflow assist mechanism is used to apply pressure on the material surface in the graphic cutting processing area to keep the material attached and fixed on the surface of the processing platform.

[0011] Preferably, in step S02 of the present invention, the process of positioning the material by the visual positioning mechanism includes: S021. Process the acquired image to obtain edge information of the material and edge contour of the processing platform through the image; S022. Confirm the difference between the center position of the material and the center position of the machining platform contour, and confirm the position of the material on the machining platform.

[0012] Preferably, the process of cutting and processing the material according to the graphics to be cut in the present invention comprises: S031, calculating the maximum inscribed rectangle of the edge contour of the material and the minimum circumscribed rectangle of the cutting pattern; calculating the number of cutting patterns that can be typeset on the material according to the obtained minimum circumscribed rectangle and maximum inscribed rectangle sizes; S032. Segment the layout material according to the processing width of the laser cutting mechanism, and perform cutting processing on the material graphics for each segmented portion.

[0013] Preferably, when the present invention uses an airflow assist mechanism to fix the material, the airflow ejected by the lowest jet ring limits the fixing range of the material, and a number of jet rings form a number of concentric annular gas impulses on the surface of the material to apply pressure to the surface of the material. At the same time, the adsorption holes on the processing platform adsorb the material, and the suction force generated releases the airflow field between the lower surface of the material and the surface of the processing platform, and the jet ring is used to fix the material.

[0014] Beneficial effects: The present invention discloses a high-porosity, lightweight material large-format cutting device and cutting method, which utilizes the annular gas impulse formed by the airflow assist mechanism to fix the material. Compared with the coating retention method, this method is simple and easy to implement while ensuring the processing accuracy of the material. The airflow can be an inert gas, which can form a gas protection layer on the surface of the material during the processing, and can effectively reduce the edge oxidation and discoloration caused by the thermal influence of the material. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0016] Figure 1 This is the overall structural diagram of the cutting device of the present invention; Figure 2 This is a schematic diagram of the jet ring structure of the present invention; Figure 3 This is a structural diagram of the laser cutting mechanism of the present invention; Among them, 1-processing platform, 2-visual positioning mechanism, 3-airflow auxiliary mechanism, 4-jet ring, 5-laser light source, 6-laser shaping and beam expanding lens group, 7-scanning galvanometer, 8-focusing lens group, 9-plane moving mechanism, 10-movement X-axis, 11-movement Y-axis, 12-movement Z-axis. DETAILED DESCRIPTION

[0017] Reference will now be made in detail to embodiments of the present disclosure, one or more examples of which are set forth herein below. Each embodiment and example is provided by way of explanation of the apparatus, composition and materials of the present disclosure, rather than limitation. On the contrary, the following description provides a convenient illustration of an exemplary embodiment for implementing the present disclosure. In fact, it will be clear to those skilled in the art that various modifications and variations may be made in the teachings of the present disclosure without departing from the scope or spirit of the present disclosure.

[0018] like Figure 1-Figure 3 As shown, the present invention is a high-porosity light-weight material large-format cutting device, including a processing platform 1 for fixing the material, a visual positioning mechanism 2 for detecting and positioning the position of the material on the processing platform 1 is arranged on the processing platform 1, a laser cutting mechanism for processing the material according to a set shape, and an airflow auxiliary mechanism 3 for forming positive air pressure in the processing area when cutting the material to make the material fit onto the surface of the processing platform.

[0019] Since the material processed by the present invention is a high-porosity material, it is impossible to directly use the commonly used negative pressure adsorption method to fix the material directly. Figure 2As shown, the airflow assist mechanism 3 of the present invention includes an adsorption hole set on the processing platform 1 and a jet ring 4 set above the processing platform 1, and the jet ring 4 is provided with a nozzle facing the material processing area. The angle of the nozzle is adjustable on the jet ring 4, and the positive air pressure range formed by the airflow ejected from the nozzle is adjusted by rotating the nozzle.

[0020] The gas impulse generated by the airflow ejected from the nozzle can press the material against the processing platform 1. The adsorption holes provided on the processing platform 1 of the present invention are not used to adsorb and fix the material, but to release the gas from the nozzle airflow through the material to the lower surface of the material and the surface of the processing platform 1 by suction, so as to avoid the airflow causing the material to bulge and affect the cutting process.

[0021] In order to improve the fixing effect of the material, as a preference, the number of the air jet rings 4 of the present invention is several groups, and the angle between the nozzle outlet direction and the horizontal direction on the air jet ring gradually increases from bottom to bottom, so that the material is positioned and fixed from the center of the processing area to the periphery; the nozzle of the lowest air jet ring 4 is perpendicular to the surface of the material, and the outer boundary of the positive air pressure is limited by the nozzle airflow of the lowest air jet ring 4. While fixing the material, the airflow in the processing area can also be isolated to avoid affecting other non-processing areas; in the embodiment of the present invention, the number of air jet rings 4 is determined according to the processing range of the laser cutting mechanism and the jet width range of the nozzle, the processing range is W*W, the nozzle width is w, the number of air jet rings N=round(W / (2w))+1, and the additional one is the air jet ring in which the nozzle is perpendicular to the material surface, which is located below the other air jet rings. The air jet ring of the present invention can be fixed on the top of the processing platform by a bracket, and kept corresponding to the laser cutting mechanism, so that the laser can be irradiated from the annular space of the air jet ring to the surface of the material to avoid interference with each other.

[0022] The laser cutting mechanism of the present invention comprises a moving Z axis 12, a laser light source 5 arranged on the moving Z axis, and a laser shaping and expanding mirror group 6, a scanning galvanometer 7, and a focusing mirror group 8 arranged in sequence along the optical path direction of the laser light source 5. The height adjustment of the laser light source and the mirror group and other components is achieved through the moving Z axis; the laser shaping and expanding mirror group 12 is installed at the output port of the laser light source 11, the scanning galvanometer 13 is installed at the outlet end of the shaping and expanding mirror group 12, and the focusing mirror group 14 is installed at the outlet end of the laser scanning galvanometer 13. The scanning galvanometer 13 is used to adjust the laser processing position. The scanning range of the scanning galvanometer 13 is used as the processing width of the laser cutting mechanism. When the material position remains unchanged, the material can be cut at any position within the processing width. The laser light source 5 of the present invention is a pulsed laser, and the laser power is not less than 30W. The laser shaping and expanding lens group 62 includes an aspheric lens, a beam expanding lens and a collimating lens. After shaping, a parallel beam with uniform laser energy distribution is obtained, which can ensure uniform energy distribution of the laser processing spot. Compared with the original Gaussian spot form, the edge quality of the material processed by this spot is smooth, and the thermal ablation is significantly reduced. The scanning galvanometer 7 is a dual-axis scanning galvanometer, which is used to control the trajectory scanning of the laser beam within the processing format; the focal length F of the focusing lens group 8 is 100~160mm, which focuses the parallel beam into a uniform spot of micron level; the visual positioning mechanism 2 includes a camera and a telecentric lens with a large field of view, which can obtain high-quality images with less distortion, thereby realizing visual positioning more accurately.

[0023] In order to realize the processing of large-format materials and reduce the frequency of loading and unloading, a plane moving mechanism 9 is arranged below the processing platform 1 of the present invention to drive the processing platform to move in the horizontal plane to adjust the cutting position. The plane moving mechanism 9 includes a moving X-axis 10 and a moving Y-axis 11. The moving X-axis 10 and the moving Y-axis 11 are arranged in a cross-shaped manner. The moving Y-axis 11 is arranged on the moving X-axis 10, and the processing platform 1 is arranged on the moving Y-axis 11. The plane moving mechanism 9 can move different areas of the material to the processing width of the laser cutting mechanism.

[0024] The present invention also discloses a large-format cutting method for high-porosity lightweight materials, using the above-mentioned cutting device, comprising the steps of: S01. Fix the material to be cut on the processing platform; When fixing, the material is laid flat on the surface of the processing platform 1, and the edge position of the cut material is fixed by a pressing block.

[0025] S02, obtaining the outline of the material and its position on the processing platform through a visual positioning mechanism, and locating the position of the material; The process of positioning the material by the visual positioning mechanism includes: S021, processing the acquired image, including image smoothing and edge enhancement, which can further enhance the sudden edge points while filtering out image noise, thereby improving the subsequent detection accuracy; then detecting the edge by calculating the second-order derivative of the image to obtain initial edge information; performing edge fitting based on the initial edge information, and optimizing the edge of the image to obtain an accurate contour boundary; Obtain edge profile information of the material and edge profile of the processing platform through images; S022. Confirm the difference between the center position of the material and the center position of the machining platform contour, and confirm the position of the material on the machining platform, so as to adjust the machining area of ​​the material by adjusting the position of the machining platform.

[0026] S03, layout the cutting process of the material according to the graphics to be cut, and determine the cutting process order; The process of cutting and processing the material according to the graphics to be cut includes: S031. Calculate the maximum inscribed rectangle of the material edge contour and the minimum circumscribed rectangle of the cutting figure; calculate the number of cutting figures that can be typeset on the material based on the obtained minimum circumscribed rectangle and maximum inscribed rectangle sizes; when the processing quantity is less than the typesetting quantity, directly arrange the graphics processing positions within the maximum inscribed rectangle of the material; when the processing quantity exceeds the typesetting quantity, process according to the number that can be typeset, and then replace new materials to repeat the positioning and typesetting process to cut the remaining graphics.

[0027] S032. Segment the layout material according to the processing width of the laser cutting mechanism, perform cutting processing on the material pattern for each segmented part, adjust the material processing position by moving the processing platform, and move once after completing the cutting processing within a processing width, and gradually complete the processing of all segmented areas of the material. When the cutting pattern exceeds the processing width of the laser cutting mechanism, the processing platform can also be moved during the cutting process to adjust the material position to achieve processing of large-format materials.

[0028] S04. When performing cutting processing, an airflow assist mechanism is used to apply pressure on the material surface in the graphic cutting processing area to keep the material attached and fixed on the surface of the processing platform.

[0029] When the present invention uses an airflow auxiliary mechanism to fix materials, the airflow ejected by the lowest jet ring limits the fixing range of the material, and a number of jet rings form a number of concentric annular gas impulses on the surface of the material to apply pressure to the surface of the material. At the same time, the adsorption holes on the processing platform adsorb the material, and the generated suction releases the airflow field between the lower surface of the material and the surface of the processing platform, and the jet ring is used to fix the material.

Claims

1. A large-format cutting device for high-porosity lightweight materials, characterized in that: The invention comprises a processing platform (1) for fixing a material, a visual positioning mechanism (2) arranged on the processing platform (1) for detecting and positioning the position of the material on the processing platform (1), a laser cutting mechanism for processing the material according to a set shape, and an airflow auxiliary mechanism (3) for forming positive air pressure in a processing area when cutting the material so that the material is attached to the surface of the processing platform.

2. A high-porosity light-weight material large-format cutting device according to claim 1, characterized in that: The airflow assist mechanism (3) comprises an adsorption hole provided on the processing platform (1) and an air jet ring (4) provided above the processing platform (1); a nozzle facing the material processing area is provided on the air jet ring (4); the nozzle is arranged at an adjustable angle on the air jet ring (4); and the positive air pressure range formed by the airflow ejected from the nozzle is adjusted by rotating the nozzle.

3. A high-porosity light-weight material large-format cutting device according to claim 2, characterized in that: The number of the jet rings (4) is several groups, and the angle between the nozzle outlet direction and the horizontal direction of the jet rings gradually increases from bottom to bottom, so that the material is positioned and fixed from the center of the processing area to the periphery; the nozzle of the bottom jet ring (4) is perpendicular to the surface of the material, and the airflow through the nozzle of the bottom jet ring (4) defines the outer boundary of the positive air pressure.

4. A high-porosity light-weight material large-format cutting device according to claim 3, characterized in that: The number of the air jet rings (4) is determined according to the processing range of the laser cutting mechanism and the air jet width range of the nozzle. The processing range is W*W, the nozzle width is w, and the number of air jet rings N=round(W / (2w))+1.

5. The high-porosity light-weight material large-format cutting device according to claim 1, characterized in that: The laser cutting mechanism comprises a laser light source (5), and a laser shaping and beam expanding lens group (6), a scanning galvanometer (7), and a focusing lens group (8) which are sequentially arranged along the optical path direction of the laser light source (5).

6. A high-porosity light-weight material large-format cutting device according to claim 1, characterized in that: A plane moving mechanism (9) is provided below the processing platform (1) and is used to drive the processing platform to move on a horizontal plane to adjust the cutting position.

7. A method for cutting large-format high-porosity lightweight materials, using the cutting device according to any one of claims 1 to 6, characterized in that: Includes steps: S01. Fix the material to be cut on the processing platform; S02, obtaining the outline of the material and its position on the processing platform through a visual positioning mechanism, and locating the position of the material; S03, layout the cutting process of the material according to the graphics to be cut, and determine the cutting process order; S04. When performing cutting processing, an airflow assist mechanism is used to apply pressure on the material surface in the graphic cutting processing area to keep the material attached and fixed on the surface of the processing platform.

8. A large-format cutting method for high-porosity lightweight materials according to claim 7, characterized in that: In step S02, the process of positioning the material by the visual positioning mechanism includes: S021. Process the acquired image to obtain edge information of the material and edge contour of the processing platform through the image; S022. Confirm the difference between the center position of the material and the center position of the machining platform contour, and confirm the position of the material on the machining platform.

9. A large-format cutting method for high-porosity lightweight materials according to claim 8, characterized in that: The process of cutting and processing the material according to the graphics to be cut includes: S031, calculating the maximum inscribed rectangle of the edge contour of the material and the minimum circumscribed rectangle of the cutting pattern; calculating the number of cutting patterns that can be typeset on the material according to the obtained minimum circumscribed rectangle and maximum inscribed rectangle sizes; S032. Segment the layout material according to the processing width of the laser cutting mechanism, and perform cutting processing on each segmented part.

10. A large-format cutting method for high-porosity lightweight materials according to claim 7, characterized in that: When using the airflow auxiliary mechanism to fix the material, the airflow ejected by the lowest jet ring limits the fixing range of the material. Several jet rings form several concentric annular gas impulses on the surface of the material to exert pressure on the surface of the material. At the same time, the adsorption holes on the processing platform adsorb the material. The suction force generated releases the airflow field between the lower surface of the material and the surface of the processing platform, and the jet ring is used to fix the material.

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