Electrochemical mechanical polishing device and method for semiconductor silicon wafer

Abstract

The invention discloses an electrochemical mechanical polishing device and method for a semiconductor silicon wafer, and relates to the technical field of silicon wafer polishing. The electrochemical mechanical polishing device comprises a polishing mechanism, the polishing mechanism comprises a bottom plate, a polishing table is installed on the upper surface of the bottom plate, and a polishing pad is fixedly connected to the upper surface of the polishing table; a liquid storage tank is fixedly connected to the upper surface of the bottom plate, a dripping frame is fixedly connected to the upper surface of the liquid storage tank, a grinding head is arranged above the grinding table, an electric push rod is fixedly connected to the upper surface of the bottom plate, and the telescopic end of the electric push rod is fixedly connected with the bottom face of the grinding head. According to the electrochemical mechanical polishing device and method for the semiconductor silicon wafer, the polishing pad can be rapidly cleaned, rubber particles and other impurities on the polishing pad can be removed, meanwhile, the polishing pad cannot be damaged or scratched, meanwhile, the protective cover is matched with the shielding cover, splashing of clean water can be effectively shielded, and the polishing effect is improved. And the cleaning effect on the polishing pad is effectively improved.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer polishing, in particular to an electrochemical mechanical polishing device and a polishing method for a semiconductor silicon wafer. Background Art

[0002] In order to increase the surface accuracy of semiconductor silicon wafers and reduce the thickness of semiconductor silicon wafers, mechanical polishing devices are usually used to grind and polish semiconductor silicon wafers. Mechanical polishing devices are usually composed of structures such as polishing disks, polishing pads and polishing heads. During the polishing process of semiconductor silicon wafers, the semiconductor silicon wafer needs to be fixed in the polishing head through a vacuum suction cup, and the pressure provided by the polishing head is used to make it contact with the polishing pad, and then the silicon wafer is polished and ground by the rotation of the polishing disk and the polishing pad. In order to further increase the polishing accuracy of semiconductor silicon wafers, the polishing head will also rotate, and polishing liquid will be dripped on the polishing pad at the same time. The centrifugal force generated by the rotation of the polishing disk is used to evenly distribute the polishing liquid on the polishing pad, and the chemical properties of the polishing liquid are used to further improve the polishing quality of semiconductor silicon wafers.

[0003] When the existing electrochemical mechanical polishing device for semiconductor silicon wafers polishes the semiconductor silicon wafers, in order to prevent other impurities such as rubber remaining on the polishing pad from affecting the polishing quality of the semiconductor silicon wafers, a cleaning mechanism is usually used to clean the polishing pad. However, the polishing pad cleaning mechanism on the electrochemical mechanical polishing device for semiconductor silicon wafers currently mainly uses a cleaning brush and a rinse solution to clean it. However, the scratching of the polishing pad by the cleaning brush will not only form scratches on the polishing pad, affecting the polishing accuracy of the polishing pad on the silicon wafer, but also fail to clean the semiconductor silicon wafer. At the same time, the friction between the cleaning brush and the polishing pad will also produce residue on the polishing pad, which has a poor cleaning effect on the polishing pad and is still easy to scratch the silicon wafer. Cleaning with pure water rinse solution will produce water splashes, resulting in excessive water droplets remaining on the semiconductor silicon wafer, which requires secondary cleaning, affecting the polishing efficiency of the semiconductor silicon wafer electrochemical mechanical polishing device for the semiconductor silicon wafer.

[0004] Combining the above problems, we will find that it is difficult to avoid the above problems at the same time when using the existing electrochemical mechanical polishing device and polishing method for semiconductor silicon wafers, and even if they can be solved, they need to be solved with the cooperation of external tools, thus failing to achieve the desired effect. Therefore, we propose an electrochemical mechanical polishing device and polishing method for semiconductor silicon wafers. Summary of the invention

[0005] The object of the present invention is to provide a semiconductor silicon wafer electrochemical mechanical polishing device and a polishing method to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor silicon wafer electrochemical mechanical polishing device and polishing method, comprising a polishing mechanism, the polishing mechanism comprising a bottom plate, a grinding table is installed on the upper surface of the bottom plate, a polishing pad is fixedly connected to the upper surface of the grinding table, a liquid storage tank is fixedly connected to the upper surface of the liquid storage tank, a drip rack is fixedly connected to the upper surface of the liquid storage tank, a grinding head is arranged above the grinding table, an electric push rod is fixedly connected to the upper surface of the bottom plate, the telescopic end of the electric push rod is fixedly connected to the bottom surface of the grinding head, and a flushing mechanism is arranged above the bottom plate;

[0007] The flushing mechanism comprises a quick flushing unit, which is arranged on the top of the bottom plate and is used to flush impurities such as rubber particles on the polishing pad;

[0008] The flushing mechanism further comprises a spray cleaning unit, which is arranged on the top of the fast flushing unit and is used for cleaning the semiconductor silicon wafer in the polishing head;

[0009] An auxiliary mechanism is arranged on the left side of the quick flushing unit. The auxiliary mechanism is used in conjunction with the flushing mechanism. The auxiliary mechanism is used to assist the quick flushing unit and the spray cleaning unit to perform better cleaning work.

[0010] Preferably, the quick flushing unit comprises a moving frame, the bottom surface of the moving frame contacts with the upper surface of the bottom plate, the bottom plate is rotatably connected with a screw, the outer surface of the screw is threadedly connected with a sliding block, the sliding block is slidably connected to the inside of the bottom plate, the upper surface of the sliding block is fixedly connected to the bottom surface of the moving frame, the left side of the bottom plate is fixedly connected with a servo motor, the output end of the servo motor is fixedly connected to the left end of the screw, the inner bottom wall of the moving frame is fixedly connected with a water tank, the right side of the moving frame is fixedly connected with a protective cover, the interior of the protective cover is slidably connected with a shielding cover, the inner wall of the shielding cover is fixedly connected with a plurality of compression springs, the top ends of the plurality of compression springs are fixedly connected to the bottom surface of the protective cover, the inner wall of the shielding cover is fixedly connected with a first rubber airbag, the first rubber The outer surface of the rubber airbag is fixedly connected with six pressure valves, the water outlet end of each pressure valve is fixedly connected with a telescopic hose, the top of each telescopic hose is fixedly connected with a first nozzle, each of the first nozzles is downward at a certain angle, a water supply pump is fixedly connected to the left side of the water tank, the water inlet end of the water supply pump penetrates into the interior of the water tank, the water outlet end of the water supply pump is fixedly connected with a connecting hose, the other end of the connecting hose is fixedly connected with a solenoid valve, the water outlet end of the solenoid valve penetrates the shielding cover and is fixedly connected with the first rubber airbag, the outer surface of the shielding cover is fixedly connected with two symmetrical sliding columns, the upper surface of the bottom plate is fixedly connected with two guide frames, the side surfaces of the two guide frames close to each other are provided with trapezoidal guide grooves, and the two sliding columns are slidably connected inside the trapezoidal guide grooves.

[0011] Preferably, two auxiliary blocks are fixedly connected to the bottom surface of the movable frame, and two auxiliary grooves are provided on the upper surface of the bottom plate, and each of the auxiliary blocks is slidably connected inside the auxiliary groove.

[0012] Preferably, the upper surface of the water tank is fixedly connected to a liquid adding pipe, and a dust plug is clamped on the top end of the liquid adding pipe.

[0013] Preferably, a rubber sealing ring is fixedly connected to the upper surface of the shielding cover, and the outer surface of the rubber sealing ring is in contact with the inner wall of the protective cover.

[0014] Preferably, a reinforcement block is fixedly connected to the outer surface of each of the first nozzles, and an upper surface of each of the reinforcement blocks is fixedly connected to the inner top wall of the protective cover.

[0015] Preferably, the spray cleaning unit includes a cleaning hood, the bottom surface of the cleaning hood is fixedly connected to the upper surface of the protective hood, the inner wall of the cleaning hood is fixedly connected to a second rubber airbag, the lower part of the outer surface of the second rubber airbag is fixedly connected to six second nozzles, each of the second nozzles is angled upward, a water guide groove is provided on the inner bottom wall of the cleaning hood, the water outlet end of the solenoid valve is fixedly connected to a liquid delivery hose, the other end of the liquid delivery hose passes through the cleaning hood and is fixedly connected to the second rubber airbag.

[0016] Preferably, the outer surface of each of the second nozzles is fixedly connected to a stabilizing seat, and the outer surface of each of the stabilizing seats is fixedly connected to the inner wall of the cleaning cover.

[0017] Preferably, the auxiliary mechanism includes a collecting box, the right side surface of the collecting box is fixedly connected to the left side surface of the movable frame, the inside of the collecting box is respectively clamped with an activated carbon filter plate and a filter cotton plate, the left sides of the activated carbon filter plate and the filter cotton plate are commonly fixedly connected with a pulling frame, the right side surface of the pulling frame is in contact with the left side of the collecting box, the upper surface of the water tank is fixedly connected with two return pipes, the other ends of the two return pipes both pass through the collecting box and extend to the bottom of the filter cotton plate, the upper surface of the collecting box is fixedly connected with two exhaust pipes, the upper surface of the collecting box is fixedly connected with two water suction pumps, the water outlet ends of the two water suction pumps both pass through the collecting box and extend to the top of the activated carbon filter plate, the water inlet ends of the two water suction pumps are fixedly connected with water suction hoses, the other ends of the two water suction hoses both pass through the shielding cover And it extends to the top of the first rubber airbag, the outer surfaces of the two water suction hoses are fixedly connected with connecting pipes, the other ends of the two connecting pipes pass through the cleaning cover and are fixedly connected with the water guide groove, the upper surface of the collecting box is fixedly connected with an air intake box, the inner bottom wall of the air intake box is fixedly connected with two heating wires, the right side of the air intake box is fixedly connected with an air supply pump, the air intake end of the air supply pump passes through the interior of the air intake box, the air outlet end of the air supply pump is fixedly connected with an air supply hose, the air supply hose is fixedly connected with the water outlet end of the solenoid valve, the air supply hose is located behind the liquid supply hose, the inner wall of the air intake box is fixedly connected with an air intake hood, the interior of the air intake box is clamped with two microporous filter plates, the upper surfaces of the two microporous filter plates are commonly fixedly connected with a sealing frame, and the bottom surface of the sealing frame is in contact with the upper surface of the air intake box.

[0018] A polishing method of a semiconductor silicon wafer electrochemical mechanical polishing device specifically comprises the following steps:

[0019] S1: First, the electric push rod, servo motor, water pump and solenoid valve are connected to the external power supply and controller. When the semiconductor silicon wafer needs to be polished, the semiconductor silicon wafer is first adsorbed on the bottom of the polishing head by the vacuum suction cup inside the polishing head, and then the electric push rod is contracted to make the polishing head drive the semiconductor silicon wafer gradually approach the polishing pad. During this process, the drip rack drips the polishing liquid on the polishing pad, and the polishing table is used to drive the polishing pad to rotate, so that the polishing liquid is evenly distributed on the polishing pad through centrifugal force. Finally, the polishing head drives the semiconductor silicon wafer to rotate and contact the polishing pad to realize the polishing processing of the semiconductor silicon wafer;

[0020] S2: After the semiconductor silicon wafer is polished, the power provided by the servo motor cooperates with the bottom plate to drive the screw to rotate, and then with the assistance of the auxiliary block and the auxiliary groove, the sliding block can be used to drive the moving frame to move to the right. At this time, the sliding column will also slide in the trapezoidal guide groove until the sliding column slides down to the bottom of the trapezoidal guide groove through the right inclined surface of the trapezoidal guide groove. The protective cover is just above the polishing pad. At this time, the elastic force provided by the compression spring will push the shielding cover to move downward to cover the polishing table, so that the polishing pad and the polishing table are both located in the space inside the protective cover and the shielding cover. Then, the suction provided by the water supply pump can remove the pure water inside the water tank. The water cleaning liquid is sent into the first rubber airbag through the connecting hose and the solenoid valve, so that the first rubber airbag expands, thereby closing the gap between the shielding cover and the polishing table. When the internal pressure of the first rubber airbag exceeds the spring pressure inside the pressure valve, the pure water cleaning liquid will be sprayed downward to the polishing pad through the telescopic hose and the first nozzle for cleaning. Since the rubber particles and other impurities on the polishing pad are removed by liquid flushing, the polishing pad will not be damaged or scratched. At the same time, the protective cover, the shielding cover and the expanded first rubber airbag can also effectively block the splash of cleaning water, which effectively increases the cleaning effect of the polishing pad.

[0021] S3: When the polishing pad is being cleaned, the electric push rod drives the grinding head to move downward until the polished semiconductor silicon wafer in the grinding head enters the cleaning cover. At this time, part of the pure water cleaning liquid will enter the second rubber airbag from the liquid delivery hose through the solenoid valve, causing the second rubber airbag to expand. The expansion of the second rubber airbag can be used to close the gap between the cleaning cover and the grinding head. At the same time, the pure water cleaning liquid will pass through the second rubber airbag and spray obliquely upward from the second nozzle to the semiconductor silicon wafer, washing away the polishing debris and polishing liquid remaining on the semiconductor silicon wafer, thereby achieving the purpose of quickly rinsing the semiconductor silicon wafer after polishing. There is no need to use other equipment to clean the polished semiconductor silicon wafer. At the same time, the expansion of the cleaning cover and the second rubber airbag can also effectively prevent the pure water cleaning liquid from splashing and causing unnecessary pollution.

[0022] S4: connect the water suction pump, the heating wire and the air supply pump to the external power supply and the controller. When the semiconductor silicon wafers inside the polishing pad and the grinding head are cleaned, the suction provided by the water suction pump is used in conjunction with the water suction hose and the connecting pipe to pump the waste water generated by the cleaning inside the shielding cover and the cleaning cover into the collection box to prevent the accumulation of waste water from causing secondary pollution to the silicon wafers in the polishing pad and the grinding head. After the waste water enters the collection box and passes through the activated carbon filter plate and the filter cotton plate, it flows back into the water tank from the reflux pipe for secondary utilization, thereby reducing the consumption of pure water cleaning liquid and increasing the utilization rate of pure water cleaning liquid.

[0023] S5: When the polishing pad and the semiconductor silicon wafer inside the grinding head are cleaned, the suction provided by the air pump can be used to filter the air inside the air inlet box by the air inlet hood and the microporous filter plate, and the air heated by the heating wire is sucked out. At this time, the solenoid valve is closed, allowing the gas to enter the first rubber airbag through the water outlet of the solenoid valve, and blow to the cleaned polishing pad through the pressure valve, the telescopic hose and the first nozzle, so that the polishing pad can be quickly put into the next semiconductor silicon wafer polishing work. At the same time, part of the gas will also be blown from the liquid supply hose and the second rubber airbag through the second nozzle to the semiconductor silicon wafer in the grinding head to dry the polishing pad and the semiconductor silicon wafer, which can prevent excessive water droplets from remaining on the semiconductor silicon wafer, so that the semiconductor silicon wafer can be processed in the next step without secondary wiping. In addition, the gas inside the shielding hood and the gas inside the cleaning hood will finally enter the collection box through the water suction hose and the connecting pipe and be discharged from the exhaust pipe;

[0024] S6: Finally, the servo motor rotates in the opposite direction, allowing the movable frame to slide back to the left until the sliding column passes through the right bevel of the trapezoidal guide groove and slides upward to the top straight groove position of the trapezoidal guide groove. At this time, the compression spring will shrink, causing the shielding cover to retract upward into the protective cover, and then continue to move to the left until the movable frame returns to the initial position, ready for the next cleaning work.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. The present invention is provided with a quick flushing unit, which can quickly clean the polishing pad and remove impurities such as rubber particles on the polishing pad without causing damage or scratches to the polishing pad. At the same time, the protective cover and the shielding cover can effectively block the splashing of cleaning water, thereby effectively increasing the cleaning effect of the polishing pad.

[0027] 2. The present invention provides a spray cleaning unit, which can clean the polishing pad and rinse the semiconductor silicon wafer after polishing inside the grinding head at the same time, thereby washing away the polishing debris and polishing liquid remaining on the semiconductor silicon wafer, thereby achieving the purpose of quickly rinsing the semiconductor silicon wafer after polishing. There is no need to use other equipment to clean the polished semiconductor silicon wafer, thereby improving the polishing efficiency of the semiconductor silicon wafer.

[0028] 3. The present invention can quickly collect and filter the wastewater generated during the cleaning process of the silicon wafers in the polishing pad and the grinding head for secondary recycling by setting an auxiliary mechanism, thereby preventing the accumulation of wastewater from causing secondary pollution to the silicon wafers in the polishing pad and the grinding head. At the same time, the cleaned polishing pad and the silicon wafers in the grinding head can be quickly air-dried, so that the polishing pad can be quickly put into the next semiconductor silicon wafer polishing work, and it can also prevent excessive water droplets from remaining on the semiconductor silicon wafer, so that the semiconductor silicon wafer can be processed in the next step without secondary wiping. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0030] Figure 2 It is a schematic cross-sectional structural diagram of the bottom plate of the present invention;

[0031] Figure 3 It is a schematic diagram of the structure of the protective cover of the present invention;

[0032] Figure 4 It is a structural schematic diagram of the water tank of the present invention;

[0033] Figure 5 It is a schematic structural diagram of the first rubber airbag of the present invention;

[0034] Figure 6 It is a schematic cross-sectional structural diagram of the cleaning cover of the present invention;

[0035] Figure 7 It is a schematic cross-sectional structural diagram of the collection box of the present invention;

[0036] Figure 8 It is a schematic cross-sectional structural diagram of the air intake box of the present invention;

[0037] In the figure: 1. polishing mechanism; 11. bottom plate; 12. grinding table; 13. polishing pad; 14. liquid storage tank; 15. drip rack; 16. grinding head; 17. electric push rod; 2. flushing mechanism; 21. fast flushing unit; 2101. moving rack; 2102. screw; 2103. sliding block; 2104. servo motor; 2105. water tank; 2106. protective cover; 2107. shielding cover; 2108. compression spring; 2109. first rubber airbag; 2110. pressure valve; 2111. telescopic hose; 2112. first nozzle; 2113. water pump; 2114. connecting hose; 2115. solenoid valve; 2116. sliding column; 2117. guide frame; 2118. trapezoidal guide groove; 2121. auxiliary block; 21 22. Auxiliary groove; 2123. Liquid adding pipe; 2124. Dust plug; 2125. Rubber sealing ring; 2126. Reinforcement block; 22. Spray cleaning unit; 2201. Cleaning cover; 2202. Second rubber airbag; 2203. Second nozzle; 2204. Water guide groove; 2205. Liquid delivery hose; 2206. Steady seat; 3. Auxiliary mechanism; 301. Collecting box; 302. Activated carbon filter plate; 303. Filter cotton plate; 304. Pulling frame; 305. Reflux pipe; 306. Exhaust pipe; 307. Suction pump; 308. Suction hose; 309. Connecting pipe; 310. Air inlet box; 311. Heating wire; 312. Air delivery pump; 313. Air delivery hose; 314. Air inlet cover; 315. Microporous filter plate; 316. Sealing frame. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] Example 1: Please refer to Figure 1-Figure 5 The present invention provides a technical solution: a semiconductor silicon wafer electrochemical mechanical polishing device, comprising a polishing mechanism 1, the polishing mechanism 1 comprising a bottom plate 11, a grinding table 12 is installed on the upper surface of the bottom plate 11, a polishing pad 13 is fixedly connected to the upper surface of the grinding table 12, a liquid storage tank 14 is fixedly connected to the upper surface of the bottom plate 11, a drip rack 15 is fixedly connected to the upper surface of the liquid storage tank 14, a grinding head 16 is arranged above the grinding table 12, an electric push rod 17 is fixedly connected to the upper surface of the bottom plate 11, the telescopic end of the electric push rod 17 is fixedly connected to the bottom surface of the grinding head 16, and a flushing mechanism 2 is arranged above the bottom plate 11;

[0040] The flushing mechanism 2 includes a quick flushing unit 21 . The quick flushing unit 21 is disposed on the top of the bottom plate 11 . The quick flushing unit 21 is used to flush impurities such as rubber particles on the polishing pad 13 .

[0041] As a further limitation of the flushing mechanism 2 of the present invention, the quick flushing unit 21 includes a moving frame 2101, the bottom surface of the moving frame 2101 is in contact with the upper surface of the bottom plate 11, the bottom plate 11 is internally rotatably connected with a screw 2102, the outer surface of the screw 2102 is threadedly connected with a sliding block 2103, the sliding block 2103 is slidably connected to the inside of the bottom plate 11, the upper surface of the sliding block 2103 is fixedly connected to the bottom surface of the moving frame 2101, the left side of the bottom plate 11 is fixedly connected with a servo motor 2104, the output end of the servo motor 2104 is fixedly connected to the left end of the screw 2102, and the moving frame 2101 The inner bottom wall is fixedly connected to a water tank 2105, the right side of the mobile frame 2101 is fixedly connected to a protective cover 2106, the inner sliding connection of the protective cover 2106 is connected to a shielding cover 2107, the inner wall of the shielding cover 2107 is fixedly connected to a plurality of compression springs 2108, the top ends of the plurality of compression springs 2108 are fixedly connected to the bottom surface of the protective cover 2106, the inner wall of the shielding cover 2107 is fixedly connected to a first rubber airbag 2109, the outer surface of the first rubber airbag 2109 is fixedly connected to six pressure valves 2110, and the water outlet end of each pressure valve 2110 is fixedly connected to a telescopic hose 2111. The top of each telescopic hose 2111 is fixedly connected to a first nozzle 2112, and each first nozzle 2112 is angled downward. A water pump 2113 is fixedly connected to the left side of the water tank 2105. The water inlet end of the water pump 2113 penetrates into the interior of the water tank 2105, and the water outlet end of the water pump 2113 is fixedly connected to a connecting hose 2114. The other end of the connecting hose 2114 is fixedly connected to a solenoid valve 2115. The water outlet end of the solenoid valve 2115 penetrates the shielding cover 2107 and is fixedly connected to the first rubber airbag 2109. The outer surface of the shielding cover 2107 is fixedly connected to two symmetrical sliding The movable column 2116 and the upper surface of the bottom plate 11 are fixedly connected with two guide frames 2117. The two guide frames 2117 are provided with trapezoidal guide grooves 2118 on the sides close to each other. The two sliding columns 2116 are slidably connected inside the trapezoidal guide grooves 2118. By setting up the quick flushing unit 21, the polishing pad 13 can be quickly cleaned to remove the rubber particles and other impurities on the polishing pad 13 without causing damage and scratches to the polishing pad 13. At the same time, the protective cover 2106 and the shielding cover 2107 can also effectively shield the splashing of the cleaning water, thereby effectively increasing the cleaning effect of the polishing pad 13.

[0042] Two auxiliary blocks 2121 are fixedly connected to the bottom surface of the mobile frame 2101, and two auxiliary grooves 2122 are provided on the upper surface of the bottom plate 11. Each auxiliary block 2121 is slidably connected to the inside of the auxiliary groove 2122. The auxiliary block 2121 slides inside the auxiliary groove 2122, which can increase the stability of the mobile frame 2101 when it moves left and right, and prevent the mobile frame 2101 from excessively shaking when it moves, thereby ensuring the reliability of the use of the mobile frame 2101.

[0043] The upper surface of the water tank 2105 is fixedly connected with a liquid adding pipe 2123, and a dust plug 2124 is clamped on the top of the liquid adding pipe 2123. The liquid adding pipe 2123 can facilitate the staff to add pure water or other cleaning water to the inside of the water tank 2105. The dust plug 2124 can prevent external dust and impurities from entering the inside of the water tank 2105 through the liquid adding pipe 2123, thereby ensuring the cleanliness of the pure water cleaning liquid inside the water tank 2105.

[0044] A rubber sealing ring 2125 is fixedly connected to the upper surface of the shielding cover 2107. The outer surface of the rubber sealing ring 2125 contacts the inner wall of the protective cover 2106. The rubber sealing ring 2125 can further seal the gap between the shielding cover 2107 and the protective cover 2106 to prevent liquid from leaking through the gap, thereby improving the sealing performance between the shielding cover 2107 and the protective cover 2106.

[0045] The outer surface of each first nozzle 2112 is fixedly connected to a reinforcement block 2126, and the upper surface of each reinforcement block 2126 is fixedly connected to the inner top wall of the protective cover 2106. The reinforcement block 2126 can fix the first nozzle 2112 on the protective cover 2106, thereby increasing the stability of the first nozzle 2112 during use and preventing the first nozzle 2112 from swinging due to excessive internal pressure.

[0046] The specific implementation of this embodiment is as follows: first, the electric push rod 17, the servo motor 2104, the water pump 2113 and the solenoid valve 2115 are connected to the external power supply and the controller. When the semiconductor silicon wafer needs to be polished, the semiconductor silicon wafer is first adsorbed on the bottom of the polishing head 16 by the vacuum suction cup inside the polishing head 16, and then the electric push rod 17 is contracted to make the polishing head 16 drive the semiconductor silicon wafer to gradually approach the polishing pad 13. During this process, the drip rack 15 drips the polishing liquid on the polishing pad 13, and uses the polishing table 12 to drive the polishing pad 13 to rotate, so that the polishing liquid is evenly distributed through the centrifugal force. The polishing pad 13 is evenly distributed on the polishing head 16, and finally the polishing head 16 drives the semiconductor silicon wafer to rotate and contact the polishing pad 13 to realize the semiconductor silicon wafer polishing processing. After the semiconductor silicon wafer is polished, the power provided by the servo motor 2104 cooperates with the base plate 11 to drive the screw 2102 to rotate, and then with the assistance of the auxiliary block 2121 and the auxiliary groove 2122, the sliding block 2103 can be used to drive the moving frame 2101 to move to the right. At this time, the sliding column 2116 will also slide in the trapezoidal guide groove 2118 until the sliding column 2116 slides down to the right side of the trapezoidal guide groove 2118 through the right inclined surface of the trapezoidal guide groove 2118. After the bottom of the trapezoidal guide groove 2118 is reached, the protective cover 2106 is located just above the polishing pad 13. At this time, the elastic force provided by the compression spring 2108 pushes the shielding cover 2107 to move downward to cover the grinding table 12, so that the polishing pad 13 and the grinding table 12 are both located in the space inside the protective cover 2106 and the shielding cover 2107. Then, the suction force provided by the water pump 2113 can deliver the pure water cleaning liquid inside the water tank 2105 into the first rubber airbag 2109 through the connecting hose 2114 and the solenoid valve 2115, so that the first rubber airbag 2109 expands, thereby closing the shielding cover 2107. 107 and the gap between the grinding table 12, when the internal pressure of the first rubber airbag 2109 exceeds the internal spring pressure of the pressure valve 2110, the pure water cleaning liquid will be sprayed downward to the polishing pad 13 through the telescopic hose 2111 and the first nozzle 2112 for cleaning. Since the rubber particles and other impurities on the polishing pad 13 are removed by liquid flushing, the polishing pad 13 will not be damaged or scratched. At the same time, the protective cover 2106, the shielding cover 2107 and the inflated first rubber airbag 2109 can also effectively block the splashing of cleaning water, thereby effectively increasing the cleaning effect of the polishing pad 13.

[0047] Example 2: Please refer to Figure 4-Figure 7 The present invention provides a technical solution: a semiconductor silicon wafer electrochemical mechanical polishing device and a polishing method. The present invention makes corresponding improvements to the technical problems mentioned in the background technology. The flushing mechanism 2 also includes a spray cleaning unit 22, which is arranged on the top of the fast flushing unit 21. The spray cleaning unit 22 is used to clean the semiconductor silicon wafer in the grinding head 16.

[0048] As a further limitation of the flushing mechanism 2 of the present invention, the spray cleaning unit 22 includes a cleaning cover 2201, the bottom surface of the cleaning cover 2201 is fixedly connected to the upper surface of the protective cover 2106, the inner wall of the cleaning cover 2201 is fixedly connected to the second rubber airbag 2202, the lower part of the outer surface of the second rubber airbag 2202 is fixedly connected to six second nozzles 2203, each of the second nozzles 2203 is upward at a certain angle, the inner bottom wall of the cleaning cover 2201 is provided with a water guide groove 2204, and the water outlet end of the solenoid valve 2115 is fixedly connected to the liquid delivery port 2206. The hose 2205, the other end of the liquid delivery hose 2205 passes through the cleaning cover 2201 and is fixedly connected to the second rubber airbag 2202. By setting the spray cleaning unit 22, the semiconductor silicon wafer after polishing inside the grinding head 16 can be rinsed while the polishing pad 13 is being cleaned, and the polishing debris and polishing liquid remaining on the semiconductor silicon wafer can be washed away, so that the purpose of quickly rinsing the semiconductor silicon wafer after polishing is achieved, and there is no need to use other equipment to clean the polished semiconductor silicon wafer, thereby improving the polishing efficiency of the semiconductor silicon wafer;

[0049] The outer surface of each second nozzle 2203 is fixedly connected to a stabilizing seat 2206, and the outer surface of each stabilizing seat 2206 is fixedly connected to the inner wall of the cleaning cover 2201. The stabilizing seat 2206 can increase the stability of the second nozzle 2203 inside the cleaning cover 2201, making it less likely for the second nozzle 2203 to loosen during use, thereby increasing the reliability of the use of the second nozzle 2203.

[0050] The specific implementation of this embodiment is as follows: when the polishing pad 13 is being cleaned, the electric push rod 17 drives the grinding head 16 to move downward until the polished semiconductor silicon wafer in the grinding head 16 enters the interior of the cleaning cover 2201. At this time, part of the pure water cleaning liquid will enter the second rubber airbag 2202 from the liquid feeding hose 2205 through the solenoid valve 2115, causing the second rubber airbag 2202 to expand. The expansion of the second rubber airbag 2202 can close the gap between the cleaning cover 2201 and the grinding head 16. At the same time, the pure water cleaning liquid will pass through the second rubber airbag 2202 and be sprayed obliquely upward from the second nozzle 2203 toward the semiconductor silicon wafer, washing away the polishing debris and polishing liquid remaining on the semiconductor silicon wafer, thereby achieving the purpose of quickly rinsing the semiconductor silicon wafer after polishing, without the need to use other equipment to clean the polished semiconductor silicon wafer. At the same time, the expansion of the cleaning cover 2201 and the second rubber airbag 2202 can also effectively prevent the pure water cleaning liquid from splashing and causing unnecessary pollution.

[0051] Example 3: Please refer to Figure 3-Figure 8The present invention provides a technical solution: a semiconductor silicon wafer electrochemical mechanical polishing device and a polishing method. The present invention makes corresponding improvements to the technical problems mentioned in the background technology. An auxiliary mechanism 3 is arranged on the left side of the quick flushing unit 21. The auxiliary mechanism 3 is used in conjunction with the flushing mechanism 2. The auxiliary mechanism 3 is used to assist the quick flushing unit 21 and the spray cleaning unit 22 to perform better cleaning work.

[0052] As a further limitation of the auxiliary mechanism 3 of the present invention, the auxiliary mechanism 3 includes a collecting box 301, the right side of the collecting box 301 is fixedly connected to the left side of the movable frame 2101, the inside of the collecting box 301 is respectively clamped with an activated carbon filter plate 302 and a filter cotton plate 303, the left sides of the activated carbon filter plate 302 and the filter cotton plate 303 are jointly fixedly connected with a pulling frame 304, the right side of the pulling frame 304 is in contact with the left side of the collecting box 301, the upper surface of the water tank 2105 is fixedly connected to two return pipes 305, the other ends of the two return pipes 305 both pass through the collecting box 301 and extend to the bottom of the filter cotton plate 303, the collecting box 301 The upper surface of the collecting box 301 is fixedly connected with two exhaust pipes 306, the upper surface of the collecting box 301 is fixedly connected with two water suction pumps 307, the water outlet ends of the two water suction pumps 307 penetrate the collecting box 301 and extend to the top of the activated carbon filter plate 302, the water inlet ends of the two water suction pumps 307 are fixedly connected with water suction hoses 308, the other ends of the two water suction hoses 308 penetrate the shielding cover 2107 and extend to the top of the first rubber airbag 2109, the outer surfaces of the two water suction hoses 308 are fixedly connected with connecting pipes 309, the other ends of the two connecting pipes 309 penetrate the cleaning cover 2201 and are fixedly connected with the water guide groove 2204, the collecting box 301 An air intake box 310 is fixedly connected to the upper surface, and two heating wires 311 are fixedly connected to the inner bottom wall of the air intake box 310. An air pump 312 is fixedly connected to the right side of the air intake box 310. The air intake end of the air pump 312 penetrates into the interior of the air intake box 310, and the air outlet end of the air pump 312 is fixedly connected to an air hose 313. The air hose 313 is fixedly connected to the water outlet end of the solenoid valve 2115. The air hose 313 is located behind the liquid delivery hose 2205. An air intake cover 314 is fixedly connected to the inner wall of the air intake box 310. Two microporous filter plates 315 are clamped inside the air intake box 310, and the upper surfaces of the two microporous filter plates 315 are fixedly connected together. There is a sealing frame 316, the bottom surface of the sealing frame 316 is in contact with the upper surface of the air intake box 310. By setting up the auxiliary mechanism 3, the waste water generated in the process of cleaning the silicon wafers in the polishing pad 13 and the grinding head 16 can be quickly collected and filtered for secondary recycling, so as to prevent the accumulation of waste water from causing secondary pollution to the silicon wafers in the polishing pad 13 and the grinding head 16. At the same time, the cleaned polishing pad 13 and the silicon wafers in the grinding head 16 can be quickly air-dried, so that the polishing pad 13 can be quickly put into the next semiconductor silicon wafer polishing work, and it can also prevent too many water droplets from remaining on the semiconductor silicon wafer, so that the semiconductor silicon wafer can be processed in the next step without secondary wiping.

[0053] The specific implementation method of this embodiment is as follows: the water suction pump 307, the heating wire 311 and the air pump 312 are connected to the external power supply and the controller. When the semiconductor silicon wafers inside the polishing pad 13 and the grinding head 16 are cleaned, the suction provided by the water suction pump 307 is used in conjunction with the water suction hose 308 and the connecting pipe 309 to pump the waste water generated by the cleaning inside the shielding cover 2107 and the cleaning cover 2201 into the collecting box 301 to prevent the accumulation of waste water from causing secondary pollution to the silicon wafers in the polishing pad 13 and the grinding head 16. After entering the collecting box 301, the waste water passes through the activated carbon filter plate 302 and the filter cotton plate 303, and then flows back into the water tank 2105 from the reflux pipe 305 for secondary utilization, thereby reducing the consumption of pure water cleaning liquid and increasing the utilization rate of pure water cleaning liquid. When the semiconductor silicon wafers inside the polishing pad 13 and the grinding head 16 are cleaned, the suction provided by the air pump 312 can be used to clean the inside of the air inlet box 310 that is filtered by the air inlet cover 314 and the microporous filter plate 315 is filtered, and the air heated by the heating wire 311 is sucked out. At this time, the solenoid valve 2115 is closed, allowing the gas to enter the first rubber airbag 2109 through the water outlet end of the solenoid valve 2115, and blow to the cleaned polishing pad 13 through the pressure valve 2110, the telescopic hose 2111 and the first nozzle 2112, so that the polishing pad 13 can be quickly put into the next semiconductor silicon wafer polishing work. At the same time, part of the gas will also be blown from the liquid feeding hose 2205 and the second rubber airbag 2202 through the second nozzle 2203 to the semiconductor silicon wafer in the grinding head 16, and the polishing pad 13 and the semiconductor silicon wafer will be dried, which can prevent excessive water droplets from remaining on the semiconductor silicon wafer, so that the semiconductor silicon wafer can be processed in the next process without secondary wiping. In addition, the internal gas of the shielding cover 2107 and the internal gas of the cleaning cover 2201 will finally enter the collection box 301 through the water suction hose 308 and the connecting pipe 309 and be discharged from the exhaust pipe 306.

[0054] A polishing method of a semiconductor silicon wafer electrochemical mechanical polishing device specifically comprises the following steps:

[0055] S1: First, the electric push rod 17, the servo motor 2104, the water pump 2113 and the solenoid valve 2115 are connected to the external power supply and the controller. When the semiconductor silicon wafer needs to be polished, the semiconductor silicon wafer is first adsorbed on the bottom of the polishing head 16 by the vacuum suction cup inside the polishing head 16, and then the electric push rod 17 is contracted to make the polishing head 16 drive the semiconductor silicon wafer to gradually approach the polishing pad 13. During this process, the drip rack 15 drips the polishing liquid on the polishing pad 13, and uses the polishing table 12 to drive the polishing pad 13 to rotate, so that the polishing liquid is evenly distributed on the polishing pad 13 through centrifugal force. Finally, the polishing head 16 drives the semiconductor silicon wafer to rotate and contact the polishing pad 13 to achieve the semiconductor silicon wafer polishing process;

[0056] S2: After the semiconductor silicon wafer is polished, the power provided by the servo motor 2104 cooperates with the base plate 11 to drive the screw 2102 to rotate, and then with the assistance of the auxiliary block 2121 and the auxiliary groove 2122, the sliding block 2103 can be used to drive the movable frame 2101 to move to the right. At this time, the sliding column 2116 will also slide in the trapezoidal guide groove 2118 until the sliding column 2116 slides through the right inclined surface of the trapezoidal guide groove 2118 to the bottom of the trapezoidal guide groove 2118, and the protective cover 2106 is just above the polishing pad 13. At this time, the elastic force provided by the compression spring 2108 will push the shielding cover 2107 to move downward to cover the polishing table 12, so that the polishing pad 13 and the polishing table 12 are both located in the space inside the protective cover 2106 and the shielding cover 2107. Then, the suction provided by the water pump 2113 The pure water cleaning liquid in the water tank 2105 can be sent into the first rubber airbag 2109 through the connecting hose 2114 and the solenoid valve 2115, so that the first rubber airbag 2109 expands, thereby closing the gap between the shielding cover 2107 and the grinding table 12. When the internal pressure of the first rubber airbag 2109 exceeds the spring pressure inside the pressure valve 2110, the pure water cleaning liquid will be sprayed downward to the polishing pad 13 through the telescopic hose 2111 and the first nozzle 2112 for cleaning. Since the rubber particles and other impurities on the polishing pad 13 are removed by liquid flushing, the polishing pad 13 will not be damaged or scratched. At the same time, the protective cover 2106, the shielding cover 2107 and the expanded first rubber airbag 2109 can also effectively block the splashing of cleaning water, thereby effectively increasing the cleaning effect of the polishing pad 13.

[0057] S3: When the polishing pad 13 is being cleaned, the electric push rod 17 drives the grinding head 16 to move downward until the polished semiconductor silicon wafer in the grinding head 16 enters the cleaning cover 2201. At this time, part of the pure water cleaning liquid will enter the second rubber airbag 2202 from the liquid delivery hose 2205 through the solenoid valve 2115, so that the second rubber airbag 2202 expands. The expansion of the second rubber airbag 2202 can close the gap between the cleaning cover 2201 and the grinding head 16. At the same time, the pure water cleaning liquid will pass through the second rubber airbag 2202 and spray obliquely upward from the second nozzle 2203 toward the semiconductor silicon wafer, washing away the polishing debris and polishing liquid remaining on the semiconductor silicon wafer, thereby achieving the purpose of quickly rinsing the semiconductor silicon wafer after polishing, without the need to use other equipment to clean the polished semiconductor silicon wafer. At the same time, the expansion of the cleaning cover 2201 and the second rubber airbag 2202 can also effectively prevent the pure water cleaning liquid from splashing and causing unnecessary pollution.

[0058] S4: The water suction pump 307, the heating wire 311 and the air supply pump 312 are connected to the external power supply and the controller. When the semiconductor silicon wafers inside the polishing pad 13 and the grinding head 16 are cleaned, the suction force provided by the water suction pump 307 is used in conjunction with the water suction hose 308 and the connecting pipe 309 to pump the waste water generated by the cleaning inside the shielding cover 2107 and the cleaning cover 2201 into the collecting box 301 to prevent the waste water from accumulating and causing secondary pollution to the silicon wafers in the polishing pad 13 and the grinding head 16. After the waste water enters the collecting box 301 and passes through the activated carbon filter plate 302 and the filter cotton plate 303, it flows back into the water tank 2105 from the reflux pipe 305 for secondary utilization, thereby reducing the consumption of the pure water cleaning liquid and increasing the utilization rate of the pure water cleaning liquid.

[0059] S5: After the semiconductor silicon wafer inside the polishing pad 13 and the grinding head 16 is cleaned, the suction force provided by the air pump 312 can filter the air inside the air inlet box 310 by the air inlet cover 314 and the microporous filter plate 315, and the air heated by the heating wire 311 is sucked out. At this time, the solenoid valve 2115 is closed, allowing the gas to enter the first rubber airbag 2109 through the water outlet of the solenoid valve 2115, and then blown to the cleaned polishing pad 13 through the pressure valve 2110, the telescopic hose 2111 and the first nozzle 2112, so that the polishing pad 13 can be quickly put into the next At the same time, part of the gas will be blown from the liquid delivery hose 2205 and the second rubber airbag 2202 to the semiconductor silicon wafer in the grinding head 16 through the second nozzle 2203 to dry the polishing pad 13 and the semiconductor silicon wafer, which can prevent excessive water droplets from remaining on the semiconductor silicon wafer, so that the semiconductor silicon wafer can be processed in the next step without secondary wiping. In addition, the internal gas of the shielding cover 2107 and the internal gas of the cleaning cover 2201 will finally enter the collection box 301 through the water suction hose 308 and the connecting pipe 309 and then be discharged from the exhaust pipe 306;

[0060] S6: Finally, the servo motor 2104 rotates in the opposite direction, allowing the movable frame 2101 to slide back to the left until the sliding column 2116 slides upward again to the top straight groove position of the trapezoidal guide groove 2118 through the guide of the right bevel of the trapezoidal guide groove 2118. At this time, the compression spring 2108 will shrink, causing the shielding cover 2107 to retract upward into the protective cover 2106, and then continue to move to the left until the movable frame 2101 returns to the initial position, ready for the next cleaning work.

[0061] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0062] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor silicon wafer electrochemical mechanical polishing device, comprising a polishing mechanism (1), characterized in that: The polishing mechanism (1) comprises a base plate (11), a grinding table (12) is installed on the upper surface of the base plate (11), a polishing pad (13) is fixedly connected to the upper surface of the grinding table (12), a liquid storage tank (14) is fixedly connected to the upper surface of the base plate (11), a drip rack (15) is fixedly connected to the upper surface of the liquid storage tank (14), a grinding head (16) is arranged above the grinding table (12), an electric push rod (17) is fixedly connected to the upper surface of the base plate (11), the telescopic end of the electric push rod (17) is fixedly connected to the bottom surface of the grinding head (16), and a flushing mechanism (2) is arranged above the base plate (11); The flushing mechanism (2) comprises a quick flushing unit (21), wherein the quick flushing unit (21) is arranged on the top of the bottom plate (11), and the quick flushing unit (21) is used to flush impurities such as rubber particles on the polishing pad (13); The flushing mechanism (2) further comprises a spray cleaning unit (22), wherein the spray cleaning unit (22) is arranged on the top of the fast flushing unit (21), and the spray cleaning unit (22) is used for cleaning the semiconductor silicon wafer in the grinding head (16); An auxiliary mechanism (3) is arranged on the left side of the quick flushing unit (21), and the auxiliary mechanism (3) is used in conjunction with the flushing mechanism (2). The auxiliary mechanism (3) is used to assist the quick flushing unit (21) and the spray cleaning unit (22) to perform better cleaning work.

2. The electrochemical mechanical polishing device for semiconductor silicon wafers according to claim 1, characterized in that: The quick flushing unit (21) comprises a movable frame (2101), the bottom surface of the movable frame (2101) contacts the upper surface of the bottom plate (11), the bottom of the bottom plate (11) is rotatably connected with a screw rod (2102), the outer surface of the screw rod (2102) is threadedly connected with a sliding block (2103), the sliding block (2103) is slidably connected to the inside of the bottom plate (11), the upper surface of the sliding block (2103) is fixedly connected to the bottom surface of the movable frame (2101), the left side of the bottom plate (11) is fixedly connected with a servo motor (2104), the output end of the servo motor (2104) is connected to the bottom of the bottom plate (11), and the output end of the servo motor (2104) is connected to the bottom of the bottom plate (11). The left end of the screw rod (2102) is fixedly connected, the inner bottom wall of the movable frame (2101) is fixedly connected with a water tank (2105), the right side of the movable frame (2101) is fixedly connected with a protective cover (2106), the interior of the protective cover (2106) is slidably connected with a shielding cover (2107), the inner wall of the shielding cover (2107) is fixedly connected with a plurality of compression springs (2108), the top ends of the plurality of compression springs (2108) are fixedly connected with the bottom surface of the protective cover (2106), the inner wall of the shielding cover (2107) is fixedly connected with a first rubber airbag (2109), and the first rubber The outer surface of the rubber airbag (2109) is fixedly connected to six pressure valves (2110), the water outlet end of each pressure valve (2110) is fixedly connected to a telescopic hose (2111), the top end of each telescopic hose (2111) is fixedly connected to a first nozzle (2112), and each first nozzle (2112) is downward at a certain angle. The left side of the water tank (2105) is fixedly connected to a water supply pump (2113), the water inlet end of the water supply pump (2113) penetrates into the interior of the water tank (2105), and the water outlet end of the water supply pump (2113) is fixedly connected to a connecting hose (2114). The other end of the connecting hose (2114) is fixedly connected to a solenoid valve (2115), the water outlet end of the solenoid valve (2115) passes through the shielding cover (2107) and is fixedly connected to the first rubber airbag (2109), the outer surface of the shielding cover (2107) is fixedly connected to two symmetrical sliding columns (2116), the upper surface of the bottom plate (11) is fixedly connected to two guide frames (2117), the side surfaces of the two guide frames (2117) close to each other are both provided with trapezoidal guide grooves (2118), and the two sliding columns (2116) are both slidably connected inside the trapezoidal guide grooves (2118).

3. The electrochemical mechanical polishing device for semiconductor silicon wafers according to claim 2, characterized in that: The bottom surface of the movable frame (2101) is fixedly connected to two auxiliary blocks (2121), and the upper surface of the bottom plate (11) is provided with two auxiliary grooves (2122), and each of the auxiliary blocks (2121) is slidably connected inside the auxiliary groove (2122).

4. The electrochemical mechanical polishing device for semiconductor silicon wafers according to claim 2, characterized in that: The upper surface of the water tank (2105) is fixedly connected to a liquid adding pipe (2123), and a dust plug (2124) is clamped at the top of the liquid adding pipe (2123).

5. The semiconductor silicon wafer electrochemical mechanical polishing device according to claim 2, characterized in that: A rubber sealing ring (2125) is fixedly connected to the upper surface of the shielding cover (2107), and the outer surface of the rubber sealing ring (2125) is in contact with the inner wall of the protective cover (2106).

6. The electrochemical mechanical polishing device for semiconductor silicon wafers according to claim 2, characterized in that: The outer surface of each of the first nozzles (2112) is fixedly connected to a reinforcement block (2126), and the upper surface of each of the reinforcement blocks (2126) is fixedly connected to the inner top wall of the protective cover (2106).

7. The electrochemical mechanical polishing device for semiconductor silicon wafer according to claim 2, characterized in that: The spray cleaning unit (22) comprises a cleaning cover (2201), the bottom surface of the cleaning cover (2201) is fixedly connected to the upper surface of the protective cover (2106), the inner wall of the cleaning cover (2201) is fixedly connected to a second rubber airbag (2202), the lower part of the outer surface of the second rubber airbag (2202) is fixedly connected to six second nozzles (2203), each of the second nozzles (2203) is upward at a certain angle, the inner bottom wall of the cleaning cover (2201) is provided with a water guide groove (2204), the water outlet end of the solenoid valve (2115) is fixedly connected to a liquid delivery hose (2205), and the other end of the liquid delivery hose (2205) passes through the cleaning cover (2201) and is fixedly connected to the second rubber airbag (2202).

8. The electrochemical mechanical polishing device for semiconductor silicon wafers according to claim 7, characterized in that: The outer surface of each of the second nozzles (2203) is fixedly connected to a stabilizing seat (2206), and the outer surface of each of the stabilizing seats (2206) is fixedly connected to the inner wall of the cleaning cover (2201).

9. The semiconductor silicon wafer electrochemical mechanical polishing device according to claim 7, characterized in that: The auxiliary mechanism (3) comprises a collecting box (301), the right side surface of the collecting box (301) is fixedly connected to the left side surface of the movable frame (2101), the inside of the collecting box (301) is respectively clamped with an activated carbon filter plate (302) and a filter cotton plate (303), the left sides of the activated carbon filter plate (302) and the filter cotton plate (303) are jointly fixedly connected with a pulling frame (304), the right side surface of the pulling frame (304) is in contact with the left side surface of the collecting box (301), the upper surface of the water tank (2105) is fixedly connected with two return pipes (305), and the two return pipes (305) are connected to the movable frame (2101). 05) penetrate the collection box (301) and extend to the bottom of the filter cotton plate (303); the upper surface of the collection box (301) is fixedly connected to two exhaust pipes (306); the upper surface of the collection box (301) is fixedly connected to two water suction pumps (307); the water outlet ends of the two water suction pumps (307) penetrate the collection box (301) and extend to the top of the activated carbon filter plate (302); the water inlet ends of the two water suction pumps (307) are fixedly connected to a water suction hose (308); the other ends of the two water suction hoses (308) penetrate the shielding cover (2107) and extend to Above the first rubber airbag (2109), the outer surfaces of the two water suction hoses (308) are fixedly connected with connecting pipes (309), the other ends of the two connecting pipes (309) pass through the cleaning cover (2201) and are fixedly connected with the water guide groove (2204), the upper surface of the collection box (301) is fixedly connected with an air intake box (310), the inner bottom wall of the air intake box (310) is fixedly connected with two heating wires (311), the right side of the air intake box (310) is fixedly connected with an air supply pump (312), the air intake end of the air supply pump (312) passes through the interior of the air intake box (310) The air outlet end of the air pump (312) is fixedly connected to an air hose (313), and the air hose (313) is fixedly connected to the water outlet end of the solenoid valve (2115). The air hose (313) is located behind the liquid hose (2205). The inner wall of the air intake box (310) is fixedly connected to an air intake cover (314). Two microporous filter plates (315) are clamped inside the air intake box (310). The upper surfaces of the two microporous filter plates (315) are fixedly connected to a sealing frame (316), and the bottom surface of the sealing frame (316) is in contact with the upper surface of the air intake box (310).

10. The polishing method of a semiconductor silicon wafer electrochemical mechanical polishing device according to claim 9, characterized in that: Specifically include the following steps: S1: First, the electric push rod (17), the servo motor (2104), the water pump (2113) and the solenoid valve (2115) are connected to an external power supply and a controller. When the semiconductor silicon wafer needs to be polished, the semiconductor silicon wafer is first adsorbed on the bottom of the polishing head (16) by the vacuum suction cup inside the polishing head (16). Then, the electric push rod (17) is contracted to make the polishing head (16) drive the semiconductor silicon wafer to gradually approach the polishing pad (13). During this process, the drip rack (15) drips the polishing liquid on the polishing pad (13), and the polishing table (12) is used to drive the polishing pad (13) to rotate, so that the polishing liquid is evenly distributed on the polishing pad (13) through centrifugal force. Finally, the polishing head (16) drives the semiconductor silicon wafer to rotate and contact with the polishing pad (13) to achieve the semiconductor silicon wafer polishing process. S2: After the semiconductor silicon wafer is polished, the power provided by the servo motor (2104) cooperates with the base plate (11) to drive the screw (2102) to rotate, and then with the assistance of the auxiliary block (2121) and the auxiliary groove (2122), the sliding block (2103) can be used to drive the moving frame (2101) to move to the right. At this time, the sliding column (2116) will also slide in the trapezoidal guide groove (2118) until the sliding column (2116) passes through the trapezoidal guide groove (2118). After the right inclined surface of the groove (2118) slides down to the bottom of the trapezoidal guide groove (2118), the protective cover (2106) is located just above the polishing pad (13). At this time, the elastic force provided by the compression spring (2108) pushes the shielding cover (2107) to move downward to cover the grinding table (12), so that the polishing pad (13) and the grinding table (12) are both located in the space inside the protective cover (2106) and the shielding cover (2107). Then, the water supply pump (2113) is lifted. The suction force provided can deliver the pure water cleaning liquid in the water tank (2105) into the first rubber airbag (2109) through the connecting hose (2114) and the electromagnetic valve (2115), so that the first rubber airbag (2109) expands, thereby closing the gap between the shielding cover (2107) and the polishing table (12). When the internal pressure of the first rubber airbag (2109) exceeds the internal spring pressure of the pressure valve (2110), the pure water cleaning liquid will be sprayed downward toward the polishing pad (13) through the telescopic hose (2111) and the first nozzle (2112) to perform cleaning work. Since the impurities such as rubber particles on the polishing pad (13) are removed by liquid flushing, not only will the polishing pad (13) not be damaged or scratched, but the protective cover (2106) can also be used in conjunction with the shielding cover (2107) and the expanded first rubber airbag (2109) to effectively block the splashing of cleaning water, thereby effectively increasing the cleaning effect of the polishing pad (13); S3: When the polishing pad (13) is being cleaned, the electric push rod (17) drives the grinding head (16) to move downward until the polished semiconductor silicon wafer in the grinding head (16) enters the cleaning cover (2201). At this time, part of the pure water cleaning liquid will enter the second rubber airbag (2202) from the liquid delivery hose (2205) through the solenoid valve (2115), causing the second rubber airbag (2202) to expand. The expansion of the second rubber airbag (2202) can seal the cleaning cover (2201) and the grinding head. The gap between the heads (16) is formed, and the pure water cleaning liquid passes through the second rubber airbag (2202) and is sprayed obliquely upward from the second nozzle (2203) toward the semiconductor silicon wafer, so as to wash away the polishing debris and polishing liquid remaining on the semiconductor silicon wafer, thereby achieving the purpose of quickly rinsing the semiconductor silicon wafer after polishing, without the need to use other equipment to clean the polished semiconductor silicon wafer. At the same time, the expansion of the cleaning cover (2201) and the second rubber airbag (2202) can also effectively prevent the pure water cleaning liquid from splashing and causing unnecessary pollution; S4: The water suction pump (307), the heating wire (311) and the air supply pump (312) are connected to an external power supply and a controller. When the semiconductor silicon wafers inside the polishing pad (13) and the grinding head (16) are cleaned, the suction force provided by the water suction pump (307) is used in conjunction with the water suction hose (308) and the connecting pipe (309) to pump the waste water generated by the cleaning inside the shielding cover (2107) and the cleaning cover (2201) into the collecting box (301), thereby preventing the waste water from accumulating and causing secondary pollution to the silicon wafers in the polishing pad (13) and the grinding head (16). After the waste water enters the collecting box (301), it passes through the activated carbon filter plate (302) and the filter cotton plate (303), and then flows back into the water tank (2105) from the reflux pipe (305) for secondary utilization, thereby reducing the consumption of the pure water cleaning liquid and increasing the utilization rate of the pure water cleaning liquid; S5: After the semiconductor silicon wafer inside the polishing pad (13) and the grinding head (16) is cleaned, the suction force provided by the air pump (312) can be used to filter the air inside the air inlet box (310) by the air inlet cover (314) and the microporous filter plate (315), and the air heated by the heating wire (311) is sucked out. At this time, the solenoid valve (2115) is closed, allowing the gas to enter the first rubber airbag (2109) through the water outlet of the solenoid valve (2115), and then blown to the cleaned polishing pad (13) through the pressure valve (2110), the telescopic hose (2111) and the first nozzle (2112), so that the polishing pad (13) can be quickly sprayed. During the next semiconductor silicon wafer polishing operation, part of the gas will be blown from the liquid delivery hose (2205) and the second rubber airbag (2202) through the second nozzle (2203) to the semiconductor silicon wafer in the grinding head (16), so as to dry the polishing pad (13) and the semiconductor silicon wafer, thereby preventing excessive water droplets from remaining on the semiconductor silicon wafer, so that the semiconductor silicon wafer can be processed in the next process without the need for secondary wiping. In addition, the gas inside the shielding cover (2107) and the gas inside the cleaning cover (2201) will finally enter the collection box (301) through the water suction hose (308) and the connecting pipe (309) and then be discharged from the exhaust pipe (306); S6: Finally, the servo motor (2104) rotates in the opposite direction, allowing the movable frame (2101) to slide back to the left until the sliding post (2116) slides upward again to the top straight groove position of the trapezoidal guide groove (2118) through the guidance of the right bevel of the trapezoidal guide groove (2118). At this time, the compression spring (2108) will shrink, causing the shielding cover (2107) to retract upward into the protective cover (2106), and then continue to move to the left until the movable frame (2101) returns to the initial position, ready for the next cleaning operation.

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