Single crystal silicon wafer slicing equipment

Abstract

The present invention belongs to the field of semiconductor technology, specifically a single crystal silicon wafer slicing device, including a base frame, an auxiliary structure is provided at the upper end of the base frame, a slicing structure is provided at one end of the upper end of the base frame close to the auxiliary structure, and the slicing structure is used to cut silicon rods; the slicing structure includes: a slicing frame, and the slicing frame is provided at the upper end of the base frame. By setting the diamond wire to be movable, after slicing one of the silicon rods, the drive motor will move to the other end of the electronic track to slice the other silicon rod, and after the first silicon rod has been partially sliced, the telescopic cylinder will drive the first silicon rod to move a distance toward the diamond wire, so that the diamond wire can slice the first silicon rod again. This reciprocating motion can not only allow the diamond wire to clean the burrs on the cut surface again through the reset action after slicing, but also can slice another silicon rod, thereby improving slicing efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductors, and in particular relates to a single crystal silicon wafer slicing device. Background Art

[0002] As an important semiconductor material, single crystal silicon has good electrical properties and thermal stability. Since it was discovered and used by people, it has quickly replaced other semiconductor materials. The preparation of some semiconductor devices requires the use of silicon wafers. Silicon rods are cut into silicon wafers, and then go through subsequent process steps such as grinding and polishing to make the silicon wafers meet the use requirements.

[0003] A patent application with publication number CN111571833B discloses a single crystal silicon rod slicing device, including a distribution box, a cutting head, an introduction device, a processing table, a fixed seat and a base, wherein the fixed seat is installed on the base, the processing table is arranged at the upper end of the fixed seat, and the cutting head cooperates with the introduction device. The device utilizes the principle that the two magnetic blocks on the clamping layer on the clamping head have different magnetic properties when they contact the single crystal silicon rod, and attract each other to strengthen the clamping force of the clamping head, and the two movable grooves can be ejected and replaced according to the diameter of the single crystal silicon rod and adapt to the size of the single crystal silicon rod. When the two movable grooves and the two fixed grooves are on the same arc line, they will stop moving outward and at the same time apply a fixed force to the single crystal silicon rod, thereby preventing the single crystal silicon rod from being displaced under the impact force of the wire saw, ensuring the relative fixation of the position of the single crystal silicon rod during processing, and further ensuring the slicing quality of the single crystal silicon rod.

[0004] The above scheme still has some problems in actual application. Since the slicing of silicon rods is part of the silicon wafer production line, the number of silicon rods required to be sliced ​​each time is extremely large. When using the above device to slice silicon rods, the silicon rods can only be placed into the required cutting position by clamping, and after the slicing is completed, the resetting action of the cutting knife cannot be effectively utilized, which affects the working cycle. In addition, when slicing silicon rods, only one silicon rod can be cut at a time, and high-efficiency work cannot be performed.

[0005] To this end, the present invention provides a single crystal silicon wafer slicing device. Summary of the Invention

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the present invention to solve its technical problem is as follows: a single crystal silicon wafer slicing device according to the present invention includes a base frame, an auxiliary structure is provided at the upper end of the base frame, a slicing structure is provided at one end of the upper end of the base frame close to the auxiliary structure, and the slicing structure is used to cut silicon rods; the slicing structure includes: a slicing frame, the slicing frame is arranged at the upper end of the base frame; a fixed turntable, the fixed turntable is arranged on the surface of the slicing frame; a movable turntable, the movable turntable is arranged on the surface of the slicing frame close to the fixed turntable; a diamond wire, one end of the diamond wire is sleeved on the arc surface of the fixed turntable, and the other end of the diamond wire is sleeved on the arc surface of the movable turntable; an electron track, the electron track is arranged on the surface of the slicing frame, and the movable turntable slides on the surface of the electron track; the auxiliary structure includes: a conveying trough, the conveying trough is opened on the upper surface of the base frame, and silicon rods are placed on the inner wall of the conveying trough; an abutment bar, the abutment bar is slidably connected to the inside of the conveying trough, and the abutment bar abuts against the silicon rods.

[0008] Preferably, the slicing structure further comprises: an extension platform, which is arranged at one end of the base frame close to the slicing frame; a drive motor, which is arranged at one end of the movable turntable and is used to control the rotation of the movable turntable, and the drive motor slides on the surface of the electronic track; the auxiliary structure further comprises: a telescopic cylinder, which is arranged at one end of the extension platform, and one end of the telescopic cylinder is connected to an abutment bar

[0009] Preferably, the telescopic cylinder is provided with a first rotating shaft at one end close to the abutment bar, and the arc surface of the first rotating shaft is rotatably connected to the abutment bar, the arc surface of the first rotating shaft is sleeved with a return spring, and one end of the return spring is connected to the abutment bar.

[0010] Preferably, a fixing ring is provided at one end of the upper end of the base frame close to the conveying trough, a buckle is provided at one end of the upper end of the base frame close to the fixing ring, a slot is provided at one end of the fixing ring, and the slot is engaged with the buckle, an adjustment plate is slidably connected to the inside of the fixing ring, a rotating arm is provided at one end of the fixing ring, and the fixing ring is rotatably connected to the arc surface of the rotating arm.

[0011] Preferably, the interior of the fixing ring is slidably connected to a limit rod, and the lower end of the limit rod is connected to the adjustment plate, the upper end of the adjustment plate is rotatably connected to a screw, and the screw is threadedly connected to the fixing ring.

[0012] Preferably, a plurality of auxiliary rollers are provided on the lower surface of the fixing ring, and the auxiliary rollers are in contact with the silicon rods.

[0013] Preferably, the slicing frame is provided with a storage frame at one end close to the diamond wire, a liquid storage cavity is provided inside the storage frame, and cutting liquid is placed inside the liquid storage cavity, and the storage frame is provided with a plurality of nozzles at one end close to the diamond wire.

[0014] Preferably, an extrusion plate is slidably connected to the inside of the storage frame, and the extrusion plate is in contact with the inner wall of the liquid storage chamber. One end of the extrusion plate is connected to a connecting arm, and one end of the connecting arm is connected to a connecting plate. A compression spring is provided at one end of the connecting plate close to the storage frame, and the other end of the compression spring is connected to the storage frame.

[0015] Preferably, a connecting block is provided at the upper end of the extrusion plate, and an abutment plate is provided at the lower end of the drive motor, and the abutment plate is in contact with the connecting block.

[0016] Preferably, a collection frame is provided at the upper end of the extension platform, a second rotating shaft is provided at one end of the collection frame, and the collection frame rotates on the arc surface of the second rotating shaft, one end of the collection frame is rotatably connected to a flip cover, a plurality of snap buckles are provided inside the collection frame, and the surface of the snap buckles is a slope, and a pressure spring is provided at one end of the snap buckle.

[0017] The beneficial effects of the present invention are as follows:

[0018] 1. The single crystal silicon wafer slicing device described in the present invention, by setting an electronic track and a telescopic cylinder, can place a silicon rod in each of the two conveying grooves at the upper end of the base frame when slicing silicon rods, and then the driving motor moves on the electronic track, and the driving motor can drive the diamond wire to rotate with the fixed turntable as the axis, so as to slice the silicon rod. After slicing one of the silicon rods, the driving motor will move to the other end of the electronic track to slice the other silicon rod, and after the first silicon rod has been partially sliced, the telescopic cylinder will drive the first silicon rod to move a distance toward the diamond wire, so that the diamond wire can slice the first silicon rod again. This reciprocating motion can not only enable the diamond wire to clean the burrs on the cut surface again through the reset action after slicing, but also can slice another silicon rod, thereby improving slicing efficiency.

[0019] 2. The single crystal silicon wafer slicing device described in the present invention is equipped with a storage frame. Before the slicing of the silicon rods begins, diamond wire cutting liquid is placed in the liquid storage chamber inside the storage frame. When the drive motor moves to cut the two silicon rods, the abutment plate located below the drive motor will contact the curved surface of the connecting block, thereby driving the extrusion plate to move and squeeze the diamond wire cutting liquid, so that the diamond wire cutting liquid is ejected from the nozzle and sprayed on the diamond wire, thereby reducing the friction between the diamond wire and the silicon rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below with reference to the accompanying drawings.

[0021] Figure 1 is a perspective view of embodiment 1 of the present invention;

[0022] Figure 2 This is a front view of the first embodiment of the present invention;

[0023] Figure 3 This is the position diagram of the base frame and silicon rods of the present invention

[0024] Figure 4 is a diagram showing the positions of the abutment plate and the storage frame of the present invention;

[0025] Figure 5 is an internal view of the storage frame of the present invention;

[0026] Figure 6 It is a position diagram of the conveying trough and the fixing ring of the present invention;

[0027] Figure 7 is a perspective view of the fixing ring of the present invention;

[0028] Figure 8 It is a position diagram of the collection frame and extension platform of the present invention;

[0029] Figure 9 This is a diagram showing the positions of the snap-fit ​​buckle and the silicon wafer of the present invention;

[0030] Figure: 1, base frame; 2, silicon rod; 3, slicing structure; 31, slicing frame; 32, electronic track; 33, diamond wire; 34, extension table; 35, movable turntable; 36, fixed turntable; 37, drive motor; 4, auxiliary structure; 401, telescopic cylinder; 402, fixed ring; 403, conveying trough; 404, collection frame; 405, storage frame; 406, abutment bar; 409, abutment plate; 41 0. Connecting block; 411. Compression spring; 412. Connecting plate; 413. Liquid storage chamber; 414. Connecting arm; 415. Extrusion plate; 416. Nozzle; 417. Buckle; 418. Rotating arm; 419. Auxiliary roller; 420. Slot; 421. Adjusting plate; 422. Screw; 423. Limiting rod; 424. Flip cover; 425. Second rotating shaft; 426. Snap buckle; 427. Press spring. DETAILED DESCRIPTION

[0031] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods. Example

[0032] like Figures 1 to 9As shown, a single crystal silicon wafer slicing device according to an embodiment of the present invention includes a base frame 1, an auxiliary structure 4 is provided at the upper end of the base frame 1, a slicing structure 3 is provided at one end of the upper end of the base frame 1 close to the auxiliary structure 4, and the slicing structure 3 is used to cut the silicon rod 2; the slicing structure 3 includes: a slicing frame 31, which is provided at the upper end of the base frame 1; a fixed turntable 36, which is provided on the surface of the slicing frame 31; a movable turntable 35, which is provided on the surface of the slicing frame 31 close to the fixed turntable 36; a diamond wire 33 One end of the diamond wire 33 is sleeved on the arc surface of the fixed turntable 36, and the other end of the diamond wire 33 is sleeved on the arc surface of the movable turntable 35; the electronic track 32, the electronic track 32 is provided on the surface of the slicing frame 31, and the movable turntable 35 slides on the surface of the electronic track 32; the auxiliary structure 4 includes: a conveying trough 403, the conveying trough 403 is opened on the upper surface of the base frame 1, and the silicon rod 2 is placed on the inner wall of the conveying trough 403; the abutment bar 406, the abutment bar 406 is slidably connected to the inside of the conveying trough 403, and the abutment bar 406 abuts against the silicon rod 2.

[0033] Specifically, a single crystal silicon wafer slicing device of this scheme will first prepare the raw silicon rod 2 before slicing. After the silicon rod 2 is fixed, the turntables at both ends of the diamond wire 33 are started. The turntables will drive the diamond wire 33 to rotate at high speed. Then, according to the size of the silicon wafer to be cut, the diamond wire 33 is pressed against the surface of the silicon rod 2. The diamond particles on the surface of the diamond wire 33 move at high speed under the drive of the steel wire, producing a grinding effect, thereby grinding away the raw material of the silicon rod 2 and finally completing the slicing. However, since the slicing of the silicon rod 2 is part of the silicon wafer production line, the number of silicon rods 2 required to be sliced ​​each time is extremely large. For this reason, a conveyor belt for conveying the silicon rod 2 is set at one end of the diamond wire 33 to facilitate the conveying of the silicon rod 2. Automatic continuous conveying, but because the diamond wire 33 will first reset after cutting a silicon wafer, after the reset is completed, the silicon rod 2 must be pushed to the cutting position again before cutting can continue. This method not only affects the working cycle, but also cannot perform any operations during the vacuum period when the diamond wire 33 is reset. For this reason, a movable turntable 35 and a fixed turntable 36 are set. When the silicon rod 2 needs to be sliced, the silicon rod 2 is first conveyed to the inside of the conveying trough 403, and there are two conveying troughs 403 at the upper end of the base frame 1, which can convey two silicon rods 2 at the same time, and then the abutment bar 406 is started, and the abutment bar 406 will move toward the direction of the silicon rod 2 and drive the silicon rod 2 to move to the slice The lower end of the frame 31 is then started to rotate the movable turntable 35, which will drive the diamond wire 33 on the surface to rotate together, and the fixed turntable 36 at the other end of the diamond wire 33 will also be driven, so that the diamond wire 33 has the ability to cut, and then the electronic track 32 is started. The electronic track 32 is arc-shaped and concentric with the fixed turntable 36. The electronic track 32 will drive the movable turntable 35 to move back and forth along the track, and in the process of moving, the diamond wire 33 will contact and slice one of the silicon rods 2, and when slicing, use an object to press the end of the silicon rod 2 away from the abutment bar 406. Finally, after the slicing is completed, the movable turntable 35 will The movable diamond wire 33 moves along the track of the electronic track 32 and moves toward another silicon rod 2. When the diamond wire 33 is no longer in contact with the first silicon rod 2, the abutment bar 406 at one end of the first silicon rod 2 is activated to push the first silicon rod 2 to the desired slicing position, thereby realizing automatic and continuous slicing. This movable diamond wire 33 can not only polish the cut surface of the silicon wafer by resetting the diamond wire 33 when the slicing is completed, thereby reducing the slit left after the first cutting, but also can cut the second silicon rod 2 when the first silicon rod 2 is pushed to the cutting position after the diamond wire 33 is reset, thereby avoiding a vacuum period in the slicing work.

[0034] like Figures 1 to 4As shown, the slicing structure 3 also includes: an extension platform 34, which is arranged at one end of the base frame 1 close to the slicing frame 31; a drive motor 37, which is arranged at one end of the movable turntable 35, and the drive motor 37 is used to control the rotation of the movable turntable 35, and the drive motor 37 slides on the surface of the electronic track 32; the auxiliary structure 4 also includes: a telescopic cylinder 401, which is arranged at one end of the extension platform 34, and one end of the telescopic cylinder 401 is connected to abutment bar 406.

[0035] Specifically, when the silicon rod 2 is placed inside the conveying trough 403, the telescopic cylinder 401 is started, the telescopic cylinder 401 will drive the abutment bar 406 to move, and drive the silicon rod 2 to the lower end of the slicing frame 31, and then the drive motor 37 is started, the drive motor 37 will drive the movable turntable 35 to rotate, and the drive motor 37 will move on the surface of the electronic track 32 to achieve automatic and continuous slicing.

[0036] like Figures 1 to 4 As shown, the telescopic cylinder 401 is provided with a first rotating shaft at one end close to the abutment bar 406, and the arc surface of the first rotating shaft is rotatably connected to the abutment bar 406. The arc surface of the first rotating shaft is sleeved with a return spring, and one end of the return spring is connected to the abutment bar 406.

[0037] Specifically, since the device is used in conjunction with a conveyor belt for transporting silicon rods 2, in order to facilitate the direct transportation of the silicon rods 2 to the interior of the conveying trough 403, the abutment bar 406 is set to be movably connected to one end of the telescopic cylinder 401. When the silicon rod 2 contacts the side of the abutment bar 406 away from the slicing frame 31, the abutment bar 406 will rotate around the first rotation axis until the entire silicon rod 2 passes through the abutment bar 406. The reset spring will release the elastic force to reset the abutment bar 406. Subsequently, when the side of the abutment bar 406 close to the slicing frame 31 contacts the silicon rod 2, since the telescopic cylinder 401 is provided with a limit plate close to the end of the first rotation axis, the abutment bar 406 will not rotate, and the silicon rod 2 can be pushed to move.

[0038] like Figures 1 to 7 As shown, a fixing ring 402 is provided at one end of the upper end of the base frame 1 close to the conveying groove 403, and a buckle 417 is provided at one end of the upper end of the base frame 1 close to the fixing ring 402. A clamping groove 420 is provided at one end of the fixing ring 402, and the clamping groove 420 is clamped with the buckle 417. An adjustment plate 421 is slidably connected to the inside of the fixing ring 402, and a rotating arm 418 is provided at one end of the fixing ring 402, and the fixing ring 402 is rotatably connected to the arc surface of the rotating arm 418.

[0039] Specifically, by setting a fixed ring 402, when the silicon rod 2 moves to the inside of the conveying trough 403, the fixed ring 402 is rotated, and the fixed ring 402 will rotate with the rotating arm 418 as the axis, and finally the slot 420 at one end of the fixed ring 402 will be engaged with the buckle 417 to fix the fixed ring 402. At this time, the adjustment plate 421 is started again, and the adjustment plate 421 will move downward and finally contact the silicon rod 2. Since the contact surface between the adjustment plate 421 and the silicon rod 2 is an arc surface, the adjustment plate 421 can not only fix the silicon rod 2 to prevent displacement during slicing, but also adjust the moving distance of the adjustment plate 421, so that silicon rods 2 of different thicknesses can be fixed and limited.

[0040] like Figure 7 As shown, the interior of the fixing ring 402 is slidably connected to a limit rod 423 , and the lower end of the limit rod 423 is connected to an adjustment plate 421 , the upper end of the adjustment plate 421 is rotatably connected to a screw rod 422 , and the screw rod 422 is threadedly connected to the fixing ring 402 .

[0041] Specifically, when the adjustment plate 421 needs to be moved, it is only necessary to rotate the screw 422. Since the screw 422 is threadedly connected to the fixing ring 402, the screw 422 will move downward, and since a limit rod 423 is provided at the upper end of the adjustment plate 421 and slides inside the fixing ring 402, the adjustment plate 421 will move vertically downward and eventually contact the silicon rod 2.

[0042] like Figure 7 As shown, a plurality of auxiliary rollers 419 are provided on the lower surface of the fixing ring 402 , and the auxiliary rollers 419 are in contact with the silicon rods 2 .

[0043] Specifically, by providing auxiliary rollers 419 on the lower surface of the fixing ring 402 , when the fixing ring 402 and the adjustment plate 421 fix the silicon rod 2 , the auxiliary rollers 419 will contact the silicon rod 2 , thereby reducing the friction force of the silicon rod 2 during subsequent movement. Example

[0044] like Figures 1 to 5 As shown, in contrast to Example 1, another embodiment of the present invention is that a storage frame 405 is provided at one end of the slicing frame 31 close to the diamond wire 33, a liquid storage chamber 413 is provided inside the storage frame 405, and cutting liquid is placed inside the liquid storage chamber 413, and a plurality of nozzles 416 are provided at one end of the storage frame 405 close to the diamond wire 33.

[0045] Specifically, by setting up a storage frame 405, when the diamond wire 33 is sliced, the liquid storage chamber 413 inside the storage frame 405 is pressurized, and the cutting liquid inside the liquid storage chamber 413 will be sprayed out from the nozzle 416 and adhere to the surface of the diamond wire 33. This cutting liquid can effectively lubricate the contact surface between the diamond wire 33 and the silicon rod 2, significantly reduce the friction resistance during the cutting process and extend the service life of the diamond wire 33.

[0046] like Figures 1 to 5 As shown, an extrusion plate 415 is slidably connected to the inside of the storage frame 405, and the extrusion plate 415 is in contact with the inner wall of the liquid storage chamber 413. One end of the extrusion plate 415 is connected to a connecting arm 414, and one end of the connecting arm 414 is connected to a connecting plate 412. A compression spring 411 is provided at one end of the connecting plate 412 close to the storage frame 405, and the other end of the compression spring 411 is connected to the storage frame 405.

[0047] Specifically, when it is necessary to spray the cutting fluid, the extrusion plate 415 is started, and the extrusion plate 415 will move toward the direction of the nozzle 416. Since the extrusion plate 415 is in contact with the inner wall of the liquid storage chamber 413, the cutting fluid will be sprayed out from the nozzle 416 at this time. Then, when the diamond wire 33 is away from the nozzle 416, the extrusion plate 415 is started again. At this time, the compression spring 411 will release the elastic force and finally bring the extrusion plate 415 back to its original position for the next spraying.

[0048] like Figures 1 to 5 As shown, a connecting block 410 is provided at the upper end of the extrusion plate 415 , and an abutting plate 409 is provided at the lower end of the driving motor 37 , and the abutting plate 409 is in contact with the connecting block 410 .

[0049] Specifically, by setting an abutment plate 409 at the lower end of the driving motor 37, when the driving motor 37 drives the diamond wire 33 to move to the vicinity of the nozzle 416, the abutment plate 409 just contacts the arc surface of the connecting block 410, and the connecting block 410 will be squeezed toward the direction of the nozzle 416, so that the squeezing plate 415 can automatically squeeze the cutting fluid.

[0050] like Figures 8 and 9 As shown, a collection frame 404 is provided at the upper end of the extension platform 34, a second rotating shaft 425 is provided at one end of the collection frame 404, and the collection frame 404 rotates on the arc surface of the second rotating shaft 425, and one end of the collection frame 404 is rotatably connected to a flip cover 424, and a plurality of snap buckles 426 are provided inside the collection frame 404, and the surface of the snap buckle 426 is an inclined surface, and a pressing spring 427 is provided at one end of the snap buckle 426.

[0051] Specifically, by setting up the collection frame 404, after the silicon rod 2 is sliced, the abutment bar 406 will push the silicon rod 2 toward the slicing frame 31. At this time, the cut silicon wafer will be pushed to the inside of the collection frame 404, and the silicon wafer will contact the inclined surface of the snap buckle 426. At this time, the snap buckle 426 will be squeezed in the direction of the pressing spring 427, so that the silicon wafer can pass through. Then, when the silicon wafer passes through the snap buckle 426, the pressing spring 427 at one end of the snap buckle 426 will release the elastic force, and finally drive the snap buckle 426 to reset. The snap buckle 426 will clamp the silicon wafer at this time, and then when the silicon rod 2 continues to be cut into silicon wafers, the silicon rod 2 will continue to press the silicon wafer, so that the silicon wafer that enters the collection frame 404 for the first time will move a distance toward the flip cover 424 again until the internal collection of the collection frame 404 is completed.

[0052] Working principle: Before slicing, the silicon rod 2 is first conveyed to the inside of the conveying trough 403, and there are two conveying troughs 403 on the upper end of the base frame 1, which can convey two silicon rods 2 at the same time. When the conveyor belt conveys the silicon rod 2 to the inner wall of the conveying trough 403, the silicon rod 2 will first contact the side of the abutment bar 406 away from the slicing frame 31. At this time, the abutment bar 406 will rotate with the first rotation axis as the axis until the entire silicon rod 2 passes through the abutment bar 406. The reset spring will release the elastic force to reset the abutment bar 406, and start the telescopic cylinder 401. The telescopic cylinder 401 The contact bar 406 will be driven to contact the silicon rod 2 near the side of the slicing frame 31. Since the telescopic cylinder 401 is provided with a limit plate near one end of the first rotating shaft, the contact bar 406 will not rotate, and the silicon rod 2 can be pushed to move. When the silicon rod 2 moves to the lower end of the slicing frame 31, the drive motor 37 is started, and the drive motor 37 will drive the movable turntable 35 to rotate. The movable turntable 35 will drive the diamond wire 33 on the surface to rotate, and the fixed turntable 36 at the other end of the diamond wire 33 will also be driven, and then the electronic track 32 will be started, and the electronic track 32 will drive the movable turntable 35 to rotate. The movable turntable 35 moves back and forth along the track, and during the movement, the diamond wire 33 will contact and slice one of the silicon rods 2. During slicing, an object is used to press against the end of the silicon rod 2 away from the abutment bar 406. Finally, after the slicing is completed, the movable turntable 35 will drive the diamond wire 33 to move along the track of the electronic track 32 and move toward the other silicon rod 2. When the diamond wire 33 no longer contacts the first silicon rod 2, the telescopic cylinder 401 at one end of the first silicon rod 2 is started, and the first silicon rod 2 can be pushed to the desired slicing position to achieve automatic and continuous slicing. When the driving motor 37 drives the diamond wire 33 to move to the vicinity of the nozzle 416, the abutment plate 409 is in contact with the arc surface of the connecting block 410, and the connecting block 410 will be squeezed toward the direction of the nozzle 416. The squeezing plate 415 will move toward the direction of the nozzle 416, and because the squeezing plate 415 fits the inner wall of the liquid storage chamber 413, the cutting fluid will be sprayed out from the nozzle 416 at this time. This cutting fluid can effectively lubricate the contact surface between the diamond wire 33 and the silicon rod 2, significantly reduce the friction resistance during the cutting process and extend the service life of the diamond wire 33.

[0053] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the foregoing embodiments. The foregoing embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A single crystal silicon wafer slicing device, characterized by: It comprises a base frame (1), an auxiliary structure (4) is provided at the upper end of the base frame (1), a slicing structure (3) is provided at one end of the upper end of the base frame (1) close to the auxiliary structure (4), and the slicing structure (3) is used to cut the silicon rod (2); The slice structure (3) includes: a slicing frame (31), the slicing frame (31) being arranged at the upper end of the base frame (1); a fixed turntable (36), the fixed turntable (36) being arranged on the surface of the slicing frame (31); A movable turntable (35), the movable turntable (35) being arranged on one end of the surface of the slicing frame (31) close to the fixed turntable (36); A diamond wire (33), one end of the diamond wire (33) is sleeved on the arc surface of the fixed turntable (36), and the other end of the diamond wire (33) is sleeved on the arc surface of the movable turntable (35); An electron track (32), the electron track (32) being provided on the surface of the slicing frame (31), and the movable turntable (35) sliding on the surface of the electron track (32); The auxiliary structure (4) comprises: A conveying trough (403), the conveying trough (403) is opened on the upper surface of the base frame (1), and silicon rods (2) are placed on the inner wall of the conveying trough (403); An abutment bar (406), wherein the abutment bar (406) is slidably connected to the inside of the conveying trough (403), and the abutment bar (406) abuts against the silicon rod (2).

2. The single crystal silicon wafer slicing device according to claim 1, characterized in that: The slice structure (3) further includes: An extension platform (34), the extension platform (34) being arranged at one end of the base frame (1) close to the slicing frame (31); A drive motor (37), the drive motor (37) being provided at one end of the movable turntable (35), and the drive motor (37) being used to control the rotation of the movable turntable (35), and the drive motor (37) sliding on the surface of the electronic track (32); The auxiliary structure (4) further includes: A telescopic cylinder (401) is provided at one end of the extension platform (34), and one end of the telescopic cylinder (401) is connected to an abutment bar (406).

3. The single crystal silicon wafer slicing device according to claim 2, characterized in that: The telescopic cylinder (401) is provided with a first rotating shaft at one end close to the abutment bar (406), and the arc surface of the first rotating shaft is rotatably connected to the abutment bar (406). The arc surface of the first rotating shaft is sleeved with a return spring, and one end of the return spring is connected to the abutment bar (406).

4. The single crystal silicon wafer slicing device according to claim 2, characterized in that: A fixing ring (402) is provided at one end of the upper end of the base frame (1) close to the conveying trough (403), a buckle (417) is provided at one end of the upper end of the base frame (1) close to the fixing ring (402), a clamping groove (420) is provided at one end of the fixing ring (402), and the clamping groove (420) is clamped with the buckle (417), an adjusting plate (421) is slidably connected inside the fixing ring (402), a rotating arm (418) is provided at one end of the fixing ring (402), and the fixing ring (402) is rotatably connected to the arc surface of the rotating arm (418).

5. The single crystal silicon wafer slicing device according to claim 4, characterized in that: The interior of the fixing ring (402) is slidably connected to a limiting rod (423), and the lower end of the limiting rod (423) is connected to the adjustment plate (421). The upper end of the adjustment plate (421) is rotatably connected to a screw rod (422), and the screw rod (422) is threadedly connected to the fixing ring (402).

6. The single crystal silicon wafer slicing device according to claim 5, characterized in that: A plurality of auxiliary rollers (419) are provided on the lower surface of the fixing ring (402), and the auxiliary rollers (419) are in contact with the silicon rods (2).

7. The single crystal silicon wafer slicing device according to claim 2, characterized in that: A storage frame (405) is provided at one end of the slicing frame (31) close to the diamond wire (33), a liquid storage cavity (413) is provided inside the storage frame (405), and cutting liquid is placed inside the liquid storage cavity (413), and a plurality of nozzles (416) are provided at one end of the storage frame (405) close to the diamond wire (33).

8. The single crystal silicon wafer slicing device according to claim 7, characterized in that: An extrusion plate (415) is slidably connected to the interior of the storage frame (405), and the extrusion plate (415) is in contact with the inner wall of the liquid storage chamber (413). One end of the extrusion plate (415) is connected to a connecting arm (414), and one end of the connecting arm (414) is connected to a connecting plate (412). A compression spring (411) is provided at one end of the connecting plate (412) close to the storage frame (405), and the other end of the compression spring (411) is connected to the storage frame (405).

9. The single crystal silicon wafer slicing device according to claim 8, characterized in that: A connecting block (410) is provided at the upper end of the extrusion plate (415), and an abutment plate (409) is provided at the lower end of the drive motor (37), and the abutment plate (409) is in contact with the connecting block (410).

10. The single crystal silicon wafer slicing device according to claim 2, characterized in that: A collecting frame (404) is provided at the upper end of the extension platform (34), a second rotating shaft (425) is provided at one end of the collecting frame (404), and the collecting frame (404) rotates on the arc surface of the second rotating shaft (425), and one end of the collecting frame (404) is rotatably connected to a flip cover (424), a plurality of snap-fit ​​buckles (426) are provided inside the collecting frame (404), and the surface of the snap-fit ​​buckle (426) is an inclined surface, and a pressing spring (427) is provided at one end of the snap-fit ​​buckle (426).

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