Lamp panel heat dissipation device and reaction chamber

Abstract

The invention provides a lamp panel heat dissipation device and a reaction chamber, and relates to the technical field of semiconductor processing. The lamp panel heat dissipation device comprises a lamp panel body used for installing a lamp set; air holes are formed in the lamp panel body and penetrate through the lamp panel body in the thickness direction of the lamp panel body; the first cover plate is connected to the side, away from the lamp set, of the lamp panel body, an air inlet is formed in the first cover plate, and the air inlet communicates with the air hole; the second cover plate is connected to the side, facing the lamp set, of the lamp panel body, a mounting space can be defined by the second cover plate and the lamp panel body, and the lamp set is located in the mounting space; the second cover plate is provided with an air outlet which is communicated with the air hole; cooling gas enters the gas holes through the gas inlet and exchanges heat with the lamp panel body, and the gas subjected to heat exchange is exhausted from the gas outlet.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor processing technology, and in particular to a lamp board heat dissipation device and a reaction chamber. Background Art

[0002] Rapid thermal processing is a process that uses a high-power lamp group to heat the wafer to a preset temperature (e.g., about 1000°C) in a few seconds or less. Since the temperature generated by the lamp group during operation is relatively high, it is necessary to perform heat dissipation treatment on the lamp board used to install the lamp group. Summary of the invention

[0003] The present disclosure provides a lamp board heat dissipation device and a reaction chamber.

[0004] According to one aspect of the present disclosure, a lamp board heat dissipation device is provided, comprising: a lamp board body, the lamp board body being used to install a lamp group; the lamp board body being provided with air holes, the air holes being arranged through the thickness direction of the lamp board body; a first cover plate, the first cover plate being connected to a side of the lamp board body facing away from the lamp group; the first cover plate being provided with an air inlet, the air inlet being connected to the air hole; a second cover plate, the second cover plate being connected to a side of the lamp board body facing the lamp group, the second cover plate and the lamp board body being able to enclose an installation space, the lamp group being located in the installation space; the second cover plate being provided with an air outlet, the air outlet being connected to the air hole; wherein the cooling gas enters the air hole through the air inlet and exchanges heat with the lamp board body, and the gas after the heat exchange can be discharged from the air outlet.

[0005] In some embodiments, the first cover plate includes a first plate body, and the first plate body is provided with the air inlet; a first connecting plate is connected to the surface of the first plate body facing the lamp board body, and the first connecting plate is arranged close to the edge of the first plate body; the first connecting plate is connected to the lamp board body, so that the first plate body, the first connecting plate and the lamp board body can form a first gas flow layer, and the first gas flow layer is respectively connected to the air inlet and the air holes.

[0006] In some embodiments, the first plate body is rectangular; the air inlets include at least four, wherein the four air inlets are respectively disposed near the top corners of the first plate body.

[0007] In some embodiments, the lamp panel body has an installation area for installing the lamp group; the installation area has a first sub-area and a second sub-area, the first sub-area corresponds to the area where the first cover plate is provided with an air inlet, and the second sub-area is connected to the first sub-area; the diameter of the air hole located in the first sub-area is smaller than the diameter of the air hole located in the second sub-area.

[0008] In some embodiments, the second cover plate has a third area and a fourth area, the third area corresponds to the installation area of ​​the lamp panel body for installing the lamp group; the fourth area is connected to the third area; the fourth area is provided with the air outlet, the air outlet is connected to the installation space, and the installation space is connected to the air hole.

[0009] In some embodiments, the lamp group includes a plurality of lamp tubes arranged side by side; at least one of the fourth regions is extended along the length direction of the lamp tube; and at least one of the air outlets is extended along the length direction of the lamp tube.

[0010] In some embodiments, at least some of the air holes are arranged corresponding to the lamp tubes in the lamp group.

[0011] In some embodiments, the lamp panel heat dissipation device further includes: a filter, and the filter is connected to the air inlet through an air inlet duct.

[0012] In some embodiments, the lamp panel heat dissipation device further includes: a blower, and the blower is connected to the air outlet through an air outlet pipe.

[0013] In some embodiments, a cooling liquid channel is also provided in the light panel body.

[0014] In some embodiments, the cooling liquid channel includes a plurality of channels arranged side by side, and the cooling liquid channels extend along the width direction of the lamp board body; the width direction of the lamp board body is perpendicular to the length direction of the lamp tube in the lamp group, and perpendicular to the thickness direction of the lamp board body.

[0015] In some embodiments, a reflective layer is provided on the surface of the lamp board body facing the lamp group, and the reflective layer is used to reflect the heat energy radiated from the lamp group to the lamp board body in a direction toward a workpiece; wherein, the workpiece is located on the side of the second cover plate away from the lamp board body.

[0016] In some embodiments, a heat insulation layer is provided on a surface of the lamp board body facing the lamp group, and the heat insulation layer is used to block heat transfer between the lamp board body and the lamp group.

[0017] In some embodiments, the lamp board heat dissipation device further includes: a temperature sensor, wherein the temperature sensor is used to detect the temperature of the lamp board body; the temperature sensor is used to communicate with the control device, so that the control device can control the light board heat dissipation device according to the temperature detected by the temperature sensor.

[0018] According to another aspect of the present disclosure, a reaction chamber is provided, comprising: a chamber and a lamp board heat dissipation device as described in any one of the above items.

[0019] The lamp board heat dissipation device provided in the embodiment of the present disclosure can achieve heat dissipation for the lamp board body.

[0020] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are used to better understand the present solution and do not constitute a limitation of the present disclosure.

[0022] Figure 1 is a schematic structural diagram of a lamp board heat dissipation device provided according to an embodiment of the present disclosure;

[0023] Figure 2 is a schematic diagram of the structure of a light board provided according to an embodiment of the present disclosure;

[0024] Figure 3 is a schematic structural diagram of a first cover plate provided according to an embodiment of the present disclosure;

[0025] Figure 4 is a schematic structural diagram of a second cover plate provided according to an embodiment of the present disclosure;

[0026] Figure 5 is a cross-sectional schematic diagram of a lamp board heat dissipation device provided according to an embodiment of the present disclosure;

[0027] Figure 6 is a cross-sectional schematic diagram of a lamp board heat dissipation device provided according to an embodiment of the present disclosure;

[0028] Figure 7 is a schematic diagram of pore distribution according to an embodiment of the present disclosure;

[0029] Figure 8 is a cross-sectional schematic diagram of a lamp board heat dissipation device provided according to an embodiment of the present disclosure;

[0030] Fig. 9 It is a cross-sectional schematic diagram of a lamp board heat dissipation device provided according to an embodiment of the present disclosure.

[0031] Explanation of the reference numerals: 100 - lamp board body; 100a - first sub-area; 100b - second sub-area; 101 - air hole; 102 - cooling liquid channel; 103 - installation space; 104 - reflecting layer; 200 - first cover plate; 201 - air inlet; 202 - first board body; 203 - first connecting plate; 204 - first gas flow layer; 300 - second cover plate; 300a - third area; 300b - fourth area; 301 - air outlet; 401 - air inlet duct; 402 - filter; 403 - temperature sensor; 500 - lamp tube. DETAILED DESCRIPTION

[0032] The following is a description of exemplary embodiments of the present disclosure in conjunction with the accompanying drawings, including various details of the embodiments of the present disclosure to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0033] Figure 1 is a schematic diagram of the three-dimensional structure of a lamp board heat dissipation device provided according to an embodiment of the present disclosure; Figure 2 is a schematic diagram of a three-dimensional structure of a light board provided according to an embodiment of the present disclosure; Figure 3 is a schematic diagram of a three-dimensional structure of a first cover plate provided according to an embodiment of the present disclosure; Figure 4 It is a schematic diagram of the three-dimensional structure of the second cover plate provided according to an embodiment of the present disclosure.

[0034] Please refer to Figures 1 to 4 , this embodiment provides a light board heat dissipation device, including: a light board body 100, a first cover plate 200, and a second cover plate 300. The light board body 100 is used to install a light group; the light group includes a plurality of strip-shaped lamp tubes, and the plurality of lamp tubes are arranged side by side. For the convenience of description, the thickness direction of the light board body 100 is taken as the vertical direction of the light board heat dissipation device, and the direction of the light board body 100 toward the light group is taken as the bottom; the length direction of the lamp tube 500 in the light group is taken as the length direction of the light board heat dissipation device (or called the longitudinal direction); the direction perpendicular to the vertical and length directions is taken as the width direction of the light board heat dissipation device (or called the transverse direction), and the direction toward the vertical center line of the light board heat dissipation device is taken as the inside for explanation. Along the vertical direction, the first cover plate 200, the light board body 100, and the second cover plate 300 are arranged in sequence.

[0035] The light board body 100 may be a polygonal or circular plate. For ease of description, the following description is made by taking the light board body 100 as a rectangular plate. The light board body 100 has an installation area for installing the light group. For example, the installation area is formed by the orthographic projection of the light group on the lower surface of the light board body 100. The installation area may be rectangular or circular, etc., and may be set according to actual needs. Among them, the matching structure of the light board body 100 and the light group may be set according to actual needs, and this embodiment is not limited here.

[0036] The portion of the lamp board body 100 located in the installation area is provided with a plurality of air holes 101. According to actual needs, the portion of the lamp board body 100 located in the non-installation area may also be provided with air holes 101. In order to ensure uniform heat dissipation, the plurality of air holes 101 may be distributed in a dot matrix. The air holes 101 are arranged throughout the thickness direction (i.e., vertical direction) of the lamp board body 100. In some examples, the axial direction of the air holes 101 may be parallel to the vertical direction. In other examples, the air holes 101 may also be arranged at an angle, and the angle between the axial direction and the vertical direction of the air holes 101 may be set according to actual needs.

[0037] A first cover plate 200 is provided on the upper side of the light board body 100. The shape of the first cover plate 200 is adapted to the shape of the light board body 100. For example, when the light board body 100 is a rectangular plate, the first cover plate 200 is also roughly a rectangular plate. The first cover plate 200 can be fastened to the light board body 100 by a plurality of fasteners. Optionally, a sealing ring is provided between the first cover plate 200 and the light board body 100 to prevent cooling gas from leaking from the connection between the first cover plate 200 and the light board body 100.

[0038] Among them, the size of the first cover plate 200 is smaller than the size of the light board body 100, so that at least one edge of the first cover plate 200 is located on the inner side of the edge of the light board body 100; or, the size of the first cover plate 200 can be equal to the size of the light board body 100, that is, the edge of the first cover plate 200 can be flush with the edge of the light board body 100; or, the size of the first cover plate 200 is larger than the size of the light board body 100, so that at least one edge of the first cover plate 200 is located on the outside of the outer edge of the light board body 100.

[0039] Optionally, at least two edges of the first cover plate 200 are located inside the outer edge of the light board body 100 to facilitate connection of the light board body 100 with other components.

[0040] The first cover plate 200 is provided with an air inlet 201, which is in communication with the air inlet duct 401, and the air inlet 201 can be in communication with the air hole 101. There can be one or more air inlets 201. When there is one air inlet 201, the air inlet 201 can be arranged near the middle of the first cover plate 200. When there are multiple air inlets 201, at least one of the air inlets 201 can be arranged near the edge of the first cover plate 200, for example, multiple air inlets 201 are arranged near the edge of the first cover plate 200, and the multiple air inlets 201 are evenly distributed.

[0041] like Figure 5As shown, the first cover plate 200 or the lamp panel body 100 may be provided with a first gas flow layer 204, and the first gas flow layer 204 is used to connect the air inlet 201 with the air hole 101, and the first gas flow layer 204 can provide a diffusion space for the gas flowing out of the air inlet 201. The first gas flow layer 204 can be arranged near the lower part of the first cover plate 200, or the first gas flow layer 204 can be arranged near the upper part of the lamp panel body 100, or the first cover plate 200 and the lamp panel body 100 together form the first gas flow layer 204.

[0042] A second cover plate 300 is provided on the lower side of the light board body 100. The shape of the second cover plate 300 is adapted to the shape of the light board body 100; for example, when the light board body 100 is a rectangular plate, the second cover plate 300 is also roughly a rectangular plate. The second cover plate 300 can be fastened to the light board body 100 by a plurality of fasteners. Optionally, a sealing ring is provided between the second cover plate 300 and the light board body 100 to prevent cooling gas from leaking from the connection between the second cover plate 300 and the light board body 100.

[0043] The second cover plate 300 and the light board body 100 can enclose an installation space 103, and the light group is located in the installation space 103. Exemplarily, the lower surface of the light board body 100 can be connected with a light board connecting plate extending downward, the light board connecting plate is arranged close to the edge of the light board body 100, and the light board connecting plate can be connected to the second cover plate 300, so that the light board body 100, the light board connecting plate and the second cover plate 300 enclose the installation space 103; wherein the second cover plate 300 can be in the shape of a flat plate. Alternatively, the second cover plate 300 includes a second plate body and a second connecting plate, the second connecting plate is connected to the upper surface of the second plate body, the second connecting plate is arranged close to the edge of the second plate body, and the second connecting plate can be connected to the light board body 100, so that the light board body 100, the second connecting plate, and the second plate body enclose the installation space 103; wherein the light board body 100 can be roughly in the shape of a flat plate. Alternatively, the light board body 100, the light board connecting plate, the second connecting plate, and the second plate body enclose the installation space 103.

[0044] The second cover plate 300 is provided with an air outlet 301, which can be connected to the air hole 101, and can also be connected to the air outlet pipe. In this way, the cooling gas enters the air hole 101 through the air inlet 201 and exchanges heat with the lamp board body 100. The gas after heat exchange is discharged from the air outlet 301 and the air outlet pipe to the outside of the lamp board heat dissipation device, thereby achieving heat dissipation of the lamp board.

[0045] In some examples, the installation space 103 can be used as a second gas flow layer, and the gas outlet 301 can be connected to the air hole 101 through the installation space 103, so that the cooling air can also purge the lamp group located in the installation space 103 to achieve the purpose of cooling and cleaning. The cooling air can use negative pressure gas to ensure that the particles in the flow path of the cooling air can be removed.

[0046] In other examples, the gas outlet 301 may be directly connected to the gas hole 101 ; for example, at least two gas holes 101 are connected near their lower ends to form a confluence channel, and the confluence channel is connected to the gas outlet 301 .

[0047] The lamp board heat dissipation device provided in this embodiment, through the above-mentioned arrangement, the cooling gas can enter the air hole 101 from the air inlet 201 to exchange heat with the lamp board body 100, and the gas after heat exchange can be discharged from the air outlet 301 to the outside of the lamp board heat dissipation device, thereby realizing the heat dissipation of the lamp board body.

[0048] Figure 5 is a cross-sectional schematic diagram of a lamp board heat dissipation device provided according to an embodiment of the present disclosure;

[0049] Figure 6 is a cross-sectional schematic diagram of a lamp board heat dissipation device provided according to an embodiment of the present disclosure; Figure 6 The arrows in the figure are used to indicate the flow direction of the cooling gas.

[0050] Please refer to Figure 3 , and refer to Figure 5 and Figure 6 In some embodiments, the first cover plate 200 includes a first plate body 202, which is a flat plate structure that matches the shape of the lamp board body 100. The first plate body 202 is provided with an air inlet 201, which passes through the first plate body 202 and can be a circular hole or a polygonal hole; optionally, the axial direction of the air inlet 201 is parallel to the vertical direction.

[0051] In some examples, the first plate 202 is polygonal; the air inlet 201 includes multiple air inlets, at least one of which is disposed near a vertex of the first plate 202. Optionally, in order to facilitate the cooling gas to enter each air hole 101 uniformly, the first plate 202 is rectangular; the air inlet 201 includes four air inlets, and the four air inlets 201 are disposed near the four vertexes of the first plate 202; or, the air inlet 201 includes more than four air inlets, four of which are disposed near the four vertexes of the first plate 202, and one of the air inlets 201 can be disposed near the center of the first plate 202.

[0052] In other examples, the first plate body 202 is polygonal, and at least part of the air inlets 201 are arranged near the midpoint of at least part of the side length of the first plate body 202. Alternatively, the first plate body 202 is circular, and at least two air inlets 201 can be evenly distributed along the circumference of the first plate body 202. It is understood that the distribution of the air inlets 201 is not limited to this, and this embodiment is only used as an example.

[0053] The lower surface of the first plate body 202 is connected with a first connecting plate 203, and the first connecting plate 203 is arranged near the edge of the first plate body 202. In this way, the space enclosed by the first plate body 202 and the first connecting plate 203 can provide a space for the cooling gas entering from the air inlet 201 to flow and diffuse. After the first connecting plate 203 is connected to the lamp board body 100, the first plate body 202, the first connecting plate 203 and the lamp board body 100 can enclose a relatively closed first gas flow layer 204, and the first gas flow layer 204 is respectively connected to the air inlet 201 and the air hole 101. Among them, the orthographic projection of the first gas flow layer 204 on the lower surface of the lamp board body 100 can cover the installation area.

[0054] In this example, the cooling gas enters the first gas flow layer 204 from the air inlet 201 to diffuse, which helps the cooling gas to evenly enter each air hole 101 and exchange heat with the lamp board body 100, thereby ensuring uniform heat dissipation of the lamp board body 100.

[0055] Figure 7 It is a schematic diagram of the distribution of pores provided according to an embodiment of the present disclosure.

[0056] Please refer to Figure 7 , and continue to refer to Figures 1 to 6 In some embodiments, the installation area of ​​the lamp panel body 100 has a first sub-area 100a and a second sub-area 100b, the first sub-area 100a corresponds to the area of ​​the first cover plate 200 where the air inlet 201 is provided, and the second sub-area 100b is connected to the first sub-area 100a.

[0057] The first sub-region 100a can at least cover the orthographic projection of the corresponding air inlet 201 on the upper surface of the light board body 100. The shape of the first sub-region 100a can be set according to actual needs. For example, when the air inlet 201 is a circular hole, the shape of the first sub-region 100a can be circular or fan-shaped, or the shape of the first sub-region 100a can be a polygon such as a triangle or a rectangle.

[0058] For example, when there are four air inlets 201, and the four air inlets 201 are respectively arranged near the four corners of the first plate 202, there are four first sub-areas 100a, and the four first sub-areas 100a can be arranged near the corners of the installation area. The space between the four first sub-areas 100a is at least part of the second sub-area 100b; for example, Figure 7 The space enclosed by the line segments in may be the second sub-region 100b.

[0059] The diameter of the air hole 101 located in the first sub-region 100a is smaller than the diameter of the air hole 101 located in the second sub-region 100b, so that the cooling gas can enter the air hole 101 more evenly and be conducted to the installation space 103, so that the lamp board body 100 and the lamp group can be evenly cooled. Among them, the ratio between the diameter of the air hole 101 located in the first sub-region 100a and the diameter of the air hole 101 located in the second sub-region 100b can be set according to actual needs, for example, the ratio between the two can be determined by data simulation analysis.

[0060] Please refer to Figure 4 and Figure 6 In some embodiments, the second cover plate 300 has a third area 300a and a fourth area 300b, the third area 300a corresponds to the installation area of ​​the light board body; the fourth area 300b is connected to the third area 300a.

[0061] Exemplarily, the orthographic projection of the installation area of ​​the light board body 100 on the upper surface of the second cover plate 300 is located in the third area 300a; or, in other words, the third area 300a at least covers the orthographic projection of the installation area of ​​the light board body 100 on the upper surface of the second cover plate 300. Optionally, the third area 300a coincides with the orthographic projection of the installation area of ​​the light board body 100 on the upper surface of the second cover plate 300.

[0062] The fourth region 300b is located outside the third region 300a; there are at least two fourth regions 300b, wherein the two fourth regions 300b extend along the length direction of the light board heat dissipation device and are respectively located on opposite sides of the third region 300a. For example, there are two fourth regions 300b, wherein the two fourth regions 300b extend along the length direction of the light board heat dissipation device and are respectively located on opposite sides of the third region 300a; or, there are three or four fourth regions 300b, wherein the two fourth regions 300b extend along the length direction of the light board heat dissipation device and are respectively located on opposite sides of the third region 300a.

[0063] At least one of the fourth regions 300b is provided with an air outlet 301. The air outlet 301 can penetrate the second cover plate 300, so that the air outlet 301 can be connected with the installation space 103; in addition, the installation space 103 is connected with the air hole 101, so that the installation space 103 can be used as a second gas flow layer to provide sufficient flow space for cooling gas, which can effectively cool the lamp group located in the installation space 103, and at the same time reduce the heat transfer of the lamp group to surrounding components such as the lamp board body 100. Optionally, at least one air outlet 301 is extended along the length direction of the lamp board heat dissipation device; the axial direction of the air outlet 301 is parallel to the vertical direction.

[0064] Exemplarily, two fourth regions 300b extending along the length direction of the heat dissipation device of the lamp board are respectively provided with air outlets 301, that is, two fourth regions 300b close to the long edge of the second cover plate 300 are respectively provided with air outlets 301, and the air outlets 301 extend along the width direction of the heat dissipation device of the lamp board. In this way, it is beneficial to improve the sealing performance of the installation space 103, facilitate the collection and convergence of the gas discharged from the air outlet 301, and can more fully utilize the cooling gas to purge and cool the lamp tube 500.

[0065] In the fourth area 300b close to the long edge of the second cover plate 300, a plurality of air outlets 301 may be provided, and the plurality of air outlets 301 are spaced apart along the length direction of the lamp tube 500. Optionally, the air outlets 301 closer to the wide edge of the second cover plate 300 have a first length, and the air outlets 301 farther from the wide edge of the second cover plate 300 have a second length, and the first length is less than the second length. In other examples, the first length may also be equal to the second length.

[0066] In other examples, the fourth area 300b extending along the width direction of the light board heat dissipation device (i.e., the fourth area 300b close to the wide edge of the second cover plate 300) may also be provided with an air outlet 301, and the air outlet 301 may extend along the width direction of the light board heat dissipation device. Alternatively, the third area 300a may also be provided with an air outlet 301.

[0067] In some examples, at least some of the air holes 101 are arranged corresponding to the lamp tubes 500 in the lamp group. For example, the air holes 101 are respectively located above the corresponding lamp tubes 500. For another example, some of the air holes 101 are located above the corresponding lamp tubes 500, and some of the air holes 101 are located between two adjacent lamp tubes 500. This allows the cooling gas entering the installation space 103 from the air holes 101 to be blown from the top of the lamp tube 500, which is beneficial for cooling the lamp tube 500 and can take away particulate matter in and around the lamp tube 500, effectively purifying the lamp board body 100 and the lamp tube 500, and reducing the risk of particulate matter contaminating the workpiece.

[0068] The air hole 101 is located above the corresponding lamp tube 500, which can be understood as the orthographic projection of the air hole 101 on the lower surface of the lamp board body 100 is located in the orthographic projection of the lamp tube 500 on the lower surface of the lamp board body 100. Optionally, the orthographic projection of the air hole 101 on the lower surface of the lamp board body 100 is close to the longitudinal center line of the orthographic projection of the lamp tube 500 on the lower surface of the lamp board body 100.

[0069] Please refer to Figure 1 In some embodiments, the light board heat dissipation device further includes: a filter 402, which is connected to the air inlet 201 through the air inlet pipe 401. The filter 402 is used to filter the cooling gas entering the light board heat dissipation device to ensure the cleanliness of the cooling gas entering the light board heat dissipation device; wherein the type and parameters of the filter element in the filter can be selected according to actual needs. Moreover, the filter 402 can be configured with a valve, which can be used to control the flow rate of the cooling gas flowing out of the filter 402.

[0070] Exemplarily, the number of filters 402 is the same as the number of air inlets 201, and each air inlet 201 is connected to a filter 402. Alternatively, the filter 402 is connected to a multi-way connector, which is connected to the corresponding air inlets 201 through multiple air inlet pipes 401.

[0071] In some embodiments, the light panel heat dissipation device further includes: a blower, which is connected to the air outlet 301 through an air outlet pipe. Exemplarily, the blower can be connected to the control device in communication, so that the control device can control the power of the blower according to actual needs. For example, the power of the blower is proportional to the power of the light group.

[0072] The air outlets located in the same fourth area 300b may correspond to the same gas collection structure, and the gas collection structures corresponding to the multiple fourth areas 300b are connected to the convergence structure, and the convergence structure may be connected to the blower. Alternatively, each air outlet corresponds to a gas collection structure, and each gas collection structure is connected to the convergence structure. The gas collection structure and the convergence structure may be arranged according to actual needs, for example, the gas collection structure may be a duct component, and the convergence structure may be a multi-way joint.

[0073] Figure 8 is a cross-sectional schematic diagram of a lamp board heat dissipation device provided according to an embodiment of the present disclosure;

[0074] Fig. 9 It is a cross-sectional schematic diagram of a lamp board heat dissipation device provided according to an embodiment of the present disclosure.

[0075] Please refer to Figure 8 and Fig. 9 , and continue to refer to Figures 1 to 7In some embodiments, a cooling liquid channel 102 is further provided in the light board body 100. The coverage area of ​​the cooling liquid channel 102 corresponds to the installation area of ​​the light board body 100, thereby facilitating the effective reduction of the temperature of the light board body 100 and the lamp tube 500. Exemplarily, the orthographic projection of the cooling liquid channel 102 on the lower surface of the light board body 100 can cover the installation area.

[0076] In some examples, the cooling liquid channel 102 includes a plurality of channels arranged side by side. To avoid interfering with the arrangement of the lamp tube 500, the cooling liquid channel 102 is arranged to extend along the width direction of the lamp board body 100. The cooling liquid channel 102 is arranged to be staggered with the air hole 101. The cooling liquid channel 102 can be arranged to penetrate along the width direction of the lamp board body 100.

[0077] The lamp board heat dissipation device may also include a water diverter, which is connected to the lamp board body 100, and the water diverter can correspond to the coolant channel 102. The water diverter can be arranged at both ends of the coolant channel 102, and the water diverter can connect at least two cooling channels 102 to facilitate diversion or convergence. One of the water diverters can be provided with a liquid inlet joint and a liquid outlet joint, and the liquid inlet joint and the liquid outlet joint are arranged at intervals, and the liquid inlet joint and the liquid outlet joint are respectively connected to the liquid inlet pipeline and the liquid outlet pipeline; the coolant enters the water diverter through the liquid inlet joint, and the water diverter diverts the coolant to a part of the coolant channel 102; the coolant flows along the coolant channel 102 to another water diverter, and the water diverter guides the coolant to another part of the coolant channel 102, and the coolant is finally discharged from the liquid outlet joint. Alternatively, one of the water dividers is provided with a liquid inlet joint, and the other water divider is provided with a liquid outlet joint; the coolant enters the water divider through the liquid inlet joint, and the water divider divides the coolant into each coolant channel 102, and the coolant flows along the coolant channel 102 to the other water divider and is discharged from the liquid outlet joint. The specific structure and shape of the water divider can be set according to actual needs, as long as it can achieve its corresponding function.

[0078] In other examples, the cooling liquid channel 102 may also be extended along the length direction of the lamp tube 500 without interfering with the layout of the lamp tube 500; or, the cooling liquid channel 102 is a hollowed space corresponding to the installation area where the lamp group is installed.

[0079] In some embodiments, a reflective layer 104 is provided on the surface of the lamp board body 100 facing the lamp group, and the reflective layer 104 is used to reflect the heat energy radiated from the lamp group to the lamp board body 100 in a direction toward the workpiece; wherein the air hole 101 also penetrates the reflective layer 104; the material used for the reflective layer 104 can be set according to actual needs; the workpiece is located on the side of the second cover plate 300 away from the lamp board body 100.

[0080] In this example, part of the heat energy emitted by the lamp group can be radiated to the workpiece, and part of the heat energy can be radiated to the reflective layer 104 of the lamp board body 100. Under the reflection effect of the reflective layer 104, this part of the heat energy can be radiated in the direction toward the workpiece, thereby improving the utilization rate of the heat energy of the lamp group and reducing the heat energy transferred in the lamp board body 100.

[0081] In some embodiments, a heat insulating layer is disposed on the surface of the light board body 100 facing the light group, and the heat insulating layer is used to block the heat transfer between the light board body 100 and the light group. The heat insulating layer can be made of commonly used heat insulating materials.

[0082] It should be noted that when the lamp board body 100 is provided with a reflective layer 104 and a heat insulating layer, the heat insulating layer is located on the side of the reflective layer 104 away from the workpiece; the heat insulating layer and the reflective layer 104 are also provided in sequence in the downward direction, that is, on the lower surface of the lamp board body 100 .

[0083] Please refer to Figure 1 In some embodiments, the light board heat dissipation device further includes: a temperature sensor 403, the temperature sensor 403 is connected to the light board body 100, and is used to detect the temperature of the light board body 100. The temperature sensor 403 can be set at a suitable position according to actual needs. Among them, the temperature sensor 403 can have one or more. When there are multiple temperature sensors 403, at least two temperature sensors 403 can be installed in different positions to improve the accuracy of temperature detection of the light board body 100.

[0084] Exemplarily, at least one temperature sensor 403 can detect the temperature of the portion of the light board body 100 corresponding to the installation area. For example, when the temperature sensor 403 is disposed on the upper surface of the light board body 100, the detection end of the temperature sensor 403 can contact the area of ​​the upper surface of the light board body 100 corresponding to the installation area. In specific implementation, the temperature sensor 403 can be installed on the portion of the light board body 100 extending out of the first cover plate 200, or on the outer side wall of the first cover plate 200, or on the first gas flow layer 204, or between two adjacent air holes 101.

[0085] In other examples, the temperature sensor 403 may also be installed in the installation space 103 without interfering with the layout of the lamp tube 500 .

[0086] The temperature sensor 403 is used to communicate with the control device so that the control device can control the lamp board heat dissipation device according to the temperature detected by the temperature sensor 403. For example, when it is determined according to the result of the detection of the temperature sensor 403 that the temperature of the lamp board body 100 reaches the first threshold value and is less than the second threshold value, the blower is controlled to work at the first power; the first threshold value is less than the second threshold value. When it is determined according to the result of the detection of the temperature sensor 403 that the temperature of the lamp board body 100 reaches the second threshold value, the blower is controlled to work at the second power, and the second power is greater than the first power. For another example, when it is determined according to the result of the detection of the temperature sensor 403 that the temperature of the lamp board body 100 reaches the first threshold value and is less than the second threshold value, coolant is introduced into the coolant channel 102; when it is determined according to the result of the detection of the temperature sensor 403 that the temperature of the lamp board body 100 reaches the second threshold value, the blower is controlled to work while the coolant is introduced into the coolant channel 102. The specific control process is not limited to this, and this embodiment is not specifically limited here.

[0087] This embodiment further provides a reaction chamber, comprising: a chamber and a light board heat dissipation device as in any of the above embodiments. The specific structure of the chamber can be set according to actual needs, and the light board body 100 in the light board heat dissipation device can be used to connect with the chamber, for example, the light board body 100 can be installed at the upper end of the chamber, and for another example, the upper end and the lower end of the chamber are respectively provided with the light board body 100 in the above embodiments.

[0088] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0089] In the description of the present disclosure, it is necessary to understand that the terms "up", "down", "left", "right", "top", "bottom", "inside", "outside", "axial", "longitudinal", "lateral", "vertical", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0090] In addition, the terms "first", "second", etc. used in the embodiments of the present disclosure are only used for descriptive purposes and should not be understood as indicating or implying relative importance, or implicitly indicating the number of technical features indicated in the embodiments. Therefore, the features defined by the terms "first", "second", etc. in the embodiments of the present disclosure may explicitly or implicitly indicate that at least one of the features is included in the embodiment. In the description of the present disclosure, the word "multiple" means at least two or two or more, such as two, three, four, etc., unless otherwise clearly and specifically defined in the embodiments.

[0091] In the present disclosure, unless otherwise clearly specified or limited in the embodiments, the terms "installed", "connected", "connected" and "fixed" etc. appearing in the embodiments should be understood in a broad sense. For example, the connection can be a fixed connection, a detachable connection, or an integrated connection. It can be understood that it can also be a mechanical connection, an electrical connection, etc.; of course, it can also be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements, or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to the specific implementation situation.

[0092] In the present disclosure, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0093] Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present disclosure. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present disclosure.

Claims

1. A light board heat dissipation device, comprising: A lamp board body, the lamp board body is used to install the lamp group; the lamp board body is provided with air holes, and the air holes are arranged through the thickness direction of the lamp board body; A first cover plate, the first cover plate is connected to a side of the lamp board body away from the lamp group; the first cover plate is provided with an air inlet, the air inlet is connected to the air hole; a second cover plate, the second cover plate being connected to a side of the light board body facing the light group, the second cover plate and the light board body being able to enclose an installation space, the light group being located in the installation space; the second cover plate being provided with an air outlet, the air outlet being communicated with the air hole; The cooling gas enters the air hole through the air inlet and exchanges heat with the lamp board body, and the gas after heat exchange can be discharged from the air outlet.

2. The lamp board heat dissipation device according to claim 1, wherein: The first cover plate includes a first plate body, and the first plate body is provided with the air inlet; a first connecting plate is connected to the surface of the first plate body facing the lamp board body, and the first connecting plate is arranged close to the edge of the first plate body; the first connecting plate is connected to the lamp board body, so that the first plate body, the first connecting plate and the lamp board body can form a first gas flow layer, and the first gas flow layer is respectively connected to the air inlet and the air holes.

3. The lamp board heat dissipation device according to claim 2, wherein: The first plate body is rectangular; the air inlets include at least four, wherein the four air inlets are respectively arranged close to the top corners of the first plate body.

4. The lamp board heat dissipation device according to claim 1, wherein: The lamp panel body has an installation area for installing the lamp group; the installation area has a first sub-area and a second sub-area, the first sub-area corresponds to the area where the air inlet is provided on the first cover plate, and the second sub-area is connected to the first sub-area; The diameter of the pores located in the first sub-region is smaller than the diameter of the pores located in the second sub-region.

5. The lamp board heat dissipation device according to claim 1, wherein: The second cover plate has a third area and a fourth area, the third area corresponds to the installation area of ​​the lamp board body for installing the lamp group; the fourth area is connected to the third area; The fourth area is provided with the air outlet, the air outlet is communicated with the installation space, and the installation space is communicated with the air hole.

6. The lamp board heat dissipation device according to claim 5, wherein: The lamp group includes a plurality of lamp tubes arranged side by side; at least one of the fourth regions is extended along the length direction of the lamp tube; and at least one of the air outlets is extended along the length direction of the lamp tube.

7. The lamp board heat dissipation device according to claim 5, wherein: At least part of the air holes are arranged corresponding to the lamp tubes in the lamp group.

8. The lamp board heat dissipation device according to claim 1, further comprising: A filter is connected to the air inlet through an air inlet duct.

9. The lamp board heat dissipation device according to claim 1, further comprising: A blower is connected to the air outlet through an air outlet pipe.

10. The lamp board heat dissipation device according to claim 1, wherein: A cooling liquid channel is also provided in the lamp panel body.

11. The lamp board heat dissipation device according to claim 10, wherein: The cooling liquid channels include a plurality of channels arranged side by side, and the cooling liquid channels extend along the width direction of the lamp board body; the width direction of the lamp board body is perpendicular to the length direction of the lamp tubes in the lamp group, and perpendicular to the thickness direction of the lamp board body.

12. The lamp board heat dissipation device according to claim 1, wherein: A reflective layer is provided on the surface of the lamp board body facing the lamp group, and the reflective layer is used to reflect the heat energy radiated from the lamp group to the lamp board body in a direction toward a workpiece; wherein the workpiece is located on a side of the second cover plate away from the lamp board body.

13. The lamp board heat dissipation device according to claim 1, further comprising: A temperature sensor is used to detect the temperature of the lamp board body; the temperature sensor is used to communicate with the control device so that the control device can control the lamp board heat dissipation device according to the temperature detected by the temperature sensor.

14. A reaction chamber comprising: A chamber and a lamp panel heat dissipation device as described in any one of claims 1 to 13.

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