Heat dissipation testing device

Abstract

The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a heat dissipation testing device. The heat dissipation testing device comprises a control module and at least one heating module. The heating module comprises a shell, a first temperature sensor, at least two heating units and a second temperature sensor, at least part of the shell is a heat conduction shell, and the first temperature sensor is arranged in a target area of the heat conduction shell; the at least two heating units and the second temperature sensors are arranged in the shell, and the second temperature sensors are in one-to-one correspondence with the heating units and are arranged at target parts of the corresponding heating units; the first temperature sensor, the second temperature sensor and the heating unit are electrically connected with the control module, and the control module is used for regulating and controlling the heating power of the heating unit. The heat dissipation test device can flexibly regulate and control the actual temperatures of different areas of the heating module, and can flexibly regulate and control the heating power of each heating unit through the control module, thereby being capable of accurately simulating the heating conditions of various electronic devices.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic equipment, and in particular to a heat dissipation testing device. Background Art

[0002] With the rapid growth of data volume, electronic devices need to process a large amount of data throughput and calculations when working, which leads to the continuous increase of energy consumption and heat generation rate of electronic devices. Therefore, the performance of heat dissipation devices of electronic devices also needs to be gradually improved. Before a new heat dissipation device is officially put into production, it is usually tested for heat dissipation performance using real electronic devices. Electronic products used for testing often cannot be sold anymore, and the electronic devices may be damaged, resulting in high testing costs.

[0003] In order to reduce the cost of testing, heat source simulation devices have emerged. However, the existing heat source simulation devices have a low level of intelligence and cannot accurately simulate the heating conditions of electronic devices. Taking the central processing unit (CPU) as an example, the heating power of different areas of the CPU is different. The existing heat source simulation device has a single adjustment of the heating power and cannot allocate the heat distribution of different areas, and cannot simulate the core temperature of the CPU, resulting in low test accuracy. Summary of the invention

[0004] The present application discloses a heat dissipation testing device to improve the accuracy and efficiency of heat dissipation testing of electronic devices.

[0005] In order to achieve the above objectives, this application provides the following technical solutions:

[0006] In a first aspect, the present application provides a heat dissipation testing device, which includes a control module and at least one heating module; the heating module includes a shell, a first temperature sensor, at least two heating units and a second temperature sensor, wherein at least part of the shell is a heat-conductive shell, and the first temperature sensor is arranged in a target area of ​​the heat-conductive shell; at least two heating units and the second temperature sensor are arranged in the shell, the second temperature sensor corresponds to the heating unit one by one, and is arranged at the target position of the corresponding heating unit; the first temperature sensor, the second temperature sensor and the heating unit are electrically connected to the control module respectively, and the control module is used to adjust the heating power of the heating unit.

[0007] In the heat dissipation test device of the present application, at least two heat generating units and a second temperature sensor are provided in the shell of the heat generating module. The second temperature sensor monitors the temperature of the corresponding heat generating unit and transmits the temperature data to the control module. The control module regulates the heat generating power of the above heat generating unit according to the temperature data so that different heat generating units can have different temperatures, thereby realizing flexible regulation of the actual temperature of different areas of the heat generating module. Moreover, the first temperature sensor can monitor the temperature of the target area of ​​the heat-conducting shell of the heat generating module, wherein the target area can be set according to actual needs. For example, when the electronic device is a CPU, the target area is the center of the shell, and the first temperature sensor can obtain the core temperature of the CPU. Therefore, when it is necessary to perform a heat dissipation test on the heat dissipation device, the heat dissipation device can be thermally contacted with the heat-conducting shell of the heat dissipation test device in the present application. The temperature data obtained by the first temperature sensor can reflect the heat dissipation efficiency of the heat dissipation device, and the temperature data obtained by the second temperature sensor can reflect the heat dissipation conditions of different areas of the heat dissipation device. In addition, the heat generating power of each heat generating unit can be flexibly regulated by the control module, so that the heat generation conditions of various electronic devices can be accurately simulated.

[0008] Furthermore, the heat dissipation testing device includes a circuit board, the heating unit and the control module are both arranged on the surface of the circuit board, and the circuit board covers the opening of the shell to form a receiving cavity.

[0009] Furthermore, the first temperature sensor includes a first temperature probe, which is arranged in the target area; the second temperature sensor includes a second temperature probe, which is arranged in the target part; the first temperature probe and the second temperature probe are both electrically connected to the circuit board.

[0010] Furthermore, the heating unit includes a heat source and a heat-conducting layer. The heat source is arranged on the surface of the circuit board, and the heat-conducting layer is arranged between the heat source and the heat-conducting shell.

[0011] Furthermore, the heating unit also includes a power supply pin, one end of which is electrically connected to the heating source, and the other end of which is electrically connected to the circuit board; and / or, the second temperature probe is arranged on the surface of the heating source.

[0012] Furthermore, the control module includes a monitoring unit and at least two heat source management units. The heat source management units correspond to the heating units one by one and regulate the heating power of the heating units. The heat source management units are signal-connected to the monitoring units, and the first temperature sensor and the second temperature sensor are signal-connected to the monitoring units respectively.

[0013] Furthermore, the heat source management unit includes a collection subcircuit, a processing subcircuit and a heating subcircuit, the collection subcircuit is electrically connected to at least two collection points connected to different positions of the heating unit; the collection subcircuit is used to collect voltage values ​​of at least two collection points and provide the voltage values ​​to the processing subcircuit; the processing subcircuit is used to generate a heating control signal according to each voltage value; the heating subcircuit is used to respond to a valid signal of the heating control signal to connect the heating power supply end with the heating unit and provide a heating voltage to the heating subcircuit; or, respond to an invalid signal of the heating control signal to disconnect the connection between the heating power supply end and the heating unit and stop providing a heating voltage to the heating subcircuit.

[0014] Furthermore, the heating subcircuit includes a connected unidirectional element and a switch control unit; the positive pole of the unidirectional element is electrically connected to the heating power supply end, and the negative pole of the unidirectional element is electrically connected to the first end of the switch control unit; the second end of the switch control unit is electrically connected to the heating unit; and the control end of the switch control unit is electrically connected to the processing subcircuit.

[0015] Further, at least two collection points include a first collection point and a second collection point, and the collection subcircuit includes a first collection unit and a second collection unit; the first collection unit includes a first operational amplifier and a first regulator, wherein the input end of the first operational amplifier is electrically connected to the first collection point, and the first operational amplifier is used to process the first signal collected by the first collection point to obtain a first voltage signal; the output end of the first operational amplifier is electrically connected to the first regulator and the processing subcircuit, and the first regulator is used to stabilize the first voltage signal; the second collection unit includes a second operational amplifier and a second regulator, wherein the input end of the second operational amplifier is electrically connected to the second collection point, and the second operational amplifier is used to process the second signal collected by the second collection point to obtain a second voltage signal; the output end of the second operational amplifier is electrically connected to the second regulator and the processing subcircuit, and the second regulator is used to stabilize the second voltage signal.

[0016] Furthermore, the processing subcircuit includes: a central processing unit, a waveform generator and an isolator connected to each other; wherein the central processing unit is used to generate a control signal according to the first voltage signal and the second voltage signal, and provide the control signal to the waveform generator. The waveform generator is used to convert the control signal into a heating control signal, wherein the heating control signal includes a valid signal and an invalid signal. The isolator is electrically connected to the output end of the waveform generator, and is used to filter out clutter in the heating control signal.

[0017] Furthermore, the at least two collection points include a third collection point, which is electrically connected to the second temperature sensor; the central processing unit is used to generate a disconnect signal upon receiving a temperature signal provided by the third collection point to disconnect the connection between the heating power supply end and the heating unit, wherein the temperature signal is collected by the second temperature sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of a heat dissipation testing device according to an embodiment of the present application;

[0019] Figure 2 An exploded diagram of a heat dissipation testing device according to an embodiment of the present application;

[0020] Figure 3 An exploded view of a heat dissipation testing device according to another embodiment of the present application;

[0021] Figure 4 This is a structural schematic diagram of a heat dissipation testing device according to another embodiment of the present application;

[0022] Figure 5 An exploded diagram of a heating unit according to an embodiment of the present application;

[0023] Figure 6 This is a schematic diagram of the structure of a heating unit according to an embodiment of the present application;

[0024] Figure 7 A schematic diagram of the architecture of a control circuit of a heat dissipation testing device according to an embodiment of the present application;

[0025] Figure 8 A schematic diagram of a control structure of a heating unit according to an embodiment of the present application;

[0026] Fig. 9 A schematic diagram of a constant power control mode of a central processing unit according to an embodiment of the present application;

[0027] Fig.10 A schematic diagram of a constant temperature control mode of a central processing unit according to an embodiment of the present application;

[0028] Fig.11 A top view of a heat dissipation testing device according to an embodiment of the present application;

[0029] Fig.12 A top view of a heat sink according to another embodiment of the present application;

[0030] Fig.13 A top view of a heat dissipation testing device and a heat sink assembly according to another embodiment of the present application.

[0031] Reference numerals: 100-control module; 110-monitoring unit; 120-heat source management unit; 120a-first heat source management unit; 120b-second heat source management unit; 120c-Nth heat source management unit; 121-collection subcircuit; 122-processing subcircuit; 122a-central processing unit; 122b-waveform generator; 122c-isolator; 122d-voltage stabilizing device; 123-heating subcircuit; 123a-unidirectional element; 123b-switch control unit; 124-heating power supply terminal; 125-first collection point; 126-second collection point; 127-first collection unit; 127a-first operational amplifier; 127b-first voltage stabilizer; 128-second collection unit; 128a-second operational amplifier; 128b-second voltage regulator; 129-third collection point; 130-common ground wire; 140-data line; 200-heating module; 210-housing; 211-heat-conducting shell; 220-first temperature sensor; 221-first temperature probe; 222-first sensor lead; 230-heating unit; 230a-first heating unit; 230b-second heating unit; 230c-Nth heating unit; 231-heating source; 232-heat-conducting layer; 233-power supply pin; 240-second temperature sensor; 241-second temperature probe; 242-second sensor lead; 300-circuit board; 400-substrate; 500-insulating board; 600-connector;

[0032] 01-power supply interface; 02-data interface;

[0033] 10- radiator; 11- microchannel. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0035] The existing heat source simulation device has a low level of intelligence and cannot accurately simulate the heating conditions of electronic devices. The heating power of different areas of some electronic devices is different. The existing heat source simulation device has a single way of adjusting the heating power, which makes it difficult to flexibly adjust the heat distribution of different areas and cannot accurately simulate the actual heating conditions of electronic devices, resulting in low test accuracy.

[0036] In view of this, an embodiment of the present application provides a heat dissipation testing device. Figure 1 This is a schematic diagram of the structure of a heat dissipation testing device according to an embodiment of the present application. Figure 2This is an exploded view of a heat dissipation testing device according to an embodiment of the present application. Figure 1 and Figure 2 The heat dissipation testing device includes a control module 100 and at least one heating module 200. The heating module 200 includes a housing 210, a first temperature sensor 220, at least two heating units 230 and a second temperature sensor 240, wherein at least part of the housing 210 is a heat-conducting shell 211, and the first temperature sensor 220 is disposed in a target area of ​​the heat-conducting shell 211. At least two heating units 230 and a second temperature sensor 240 are disposed in the housing 210, and the second temperature sensor 240 corresponds to the heating unit 230 one by one, and is disposed at a target position of the corresponding heating unit 230. The first temperature sensor 220, the second temperature sensor 240 and the heating unit 230 are electrically connected to the control module 100 respectively, and the control module 100 is used to adjust the heating power of each heating unit 230.

[0037] Among them, the heat dissipation test device in the present application can be used to simulate, including but not limited to, CPU (Central Processing Unit, CPU) heating, GPU (Graphics Processing Unit, GPU) heating, Metal-Oxide-Semiconductor Field-Effect Transistor (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET) heating, Insulated Gate Bipolar Transistor (Insulated Gate Bipolar Transistor, IGBT) heating. The heat dissipation test device can be used to study and test the radiator of the air-cooled server, the radiator of the immersion server, the radiator of the cold plate server, etc.

[0038] It is understandable that the number and position of the heating units 230 in the present application are set according to the structure of the electronic device to be simulated or the heat sink to be tested. For example, when the heat dissipation performance of different cold plate areas of the heat sink needs to be tested, the number of heating units 230 needs to be the same as the number of cold plate areas, and the heating units 230 correspond to the cold plate areas one by one and are in thermal contact with the corresponding cold plate areas to test the heat dissipation performance of different cold plate areas.

[0039] At least part of the housing 210 is a heat-conducting housing 211, and the heat-conducting housing 211 is used for thermal contact with the heat dissipation device, so that there is good heat transfer between the heat dissipation test device and the heat dissipation device. Figure 1 and Figure 2 As shown, the upper surface of the housing 210 may be a heat-conducting shell 211. Optionally, the heat-conducting shell 211 and the heating unit 230 may be fixedly connected by brazing to achieve rapid heat transfer between the heating unit 230 and the heat-conducting shell 211.

[0040] Reference Figure 1 and Figure 2 The heat dissipation test device includes a circuit board 300, a heating unit 230 and a control module 100 are both arranged on the surface of the circuit board 300, and the circuit board 300 covers the opening of the housing 210 to form an accommodating cavity, and at least two heating units 230 are arranged in the accommodating cavity. Each heating unit 230 and the control module 100 are electrically connected through the circuit board 300.

[0041] Continue to refer to Figure 1 and Figure 2 The heat dissipation testing device further includes a power supply interface 01 disposed on the circuit board 300 , and the power supply interface 01 can be connected to an external power source to provide power to the heat dissipation testing device.

[0042] You can continue to refer to Figure 1 and Figure 2 The heat dissipation testing device also includes a data interface 02 disposed on the circuit board 300. The data interface 02 can be connected to an external device to transmit relevant data to the external device.

[0043] In some optional embodiments, the first temperature sensor 220 includes a first temperature probe 221, which is disposed in the target area to monitor the temperature of the target area. The target area is selected according to the test requirements, such as Figure 1 As shown, when the heat dissipation testing device simulates the CPU, the target area may be the central area of ​​the heat-conducting shell 211, and the first temperature probe 221 may be embedded in the central area of ​​the heat-conducting shell 211 to simulate the core temperature of the CPU.

[0044] Optionally, the first temperature sensor 220 further includes a first sensor lead 222 , and the first temperature probe 221 is electrically connected to the circuit board 300 via the first sensor lead 222 .

[0045] In some optional embodiments, the second temperature sensor 240 includes a second temperature probe 241, which is disposed at a target part of the heating unit 230 to monitor the temperature of the target part. The target part is selected according to the test requirements, such as Figure 2 As shown, when the heat dissipation test device simulates a CPU, the target portion may be the central portion of the surface of the heat generating unit 230 that is away from the circuit board 300 .

[0046] Optionally, the second temperature sensor 240 further includes a second sensor lead 242 , and the second temperature probe 241 is electrically connected to the circuit board 300 via the second sensor lead 242 .

[0047] Figure 3 This is an exploded view of a heat dissipation testing device according to another embodiment of the present application. Figure 3, the heat dissipation testing device may include a substrate 400, and the substrate 400 is arranged on the side of the circuit board 300 away from the heating unit 230. Among them, the substrate 400 may be a high-strength support plate to support the circuit board 300 and related components on the circuit board 300. The preparation material of the substrate 400 may be an insulating material or a conductive material. Exemplarily, when the substrate 400 is a metal plate, an insulating plate 500 is arranged between the substrate 400 and the circuit board 300, which can effectively prevent the metal substrate 400 from directly contacting the circuit board 300 and causing a short circuit in the circuit board 300.

[0048] Figure 4 This is a schematic diagram of the structure of a heat dissipation testing device according to another embodiment of the present application. Figure 3 and Figure 4 The heat dissipation test device further includes a connector 600, which can be disposed on the surface of the substrate 400 facing the circuit board 300. When the heat dissipation performance of the heat sink 10 needs to be tested, the connector 600 passes through the insulating plate 500 and the circuit board 300 in sequence and is connected to the heat sink 10, thereby realizing rapid assembly between the heat sink 10 and the heat dissipation test device in the present application. The connector 600 can be a stud or a positioning pin, etc.

[0049] Figure 5 This is an exploded view of a heating unit according to an embodiment of the present application. Figure 6 This is a schematic diagram of the structure of a heating unit according to an embodiment of the present application, referring to Figure 5 and Figure 6 The heating unit 230 may include a heat source 231 and a heat conductive layer 232. The heat source 231 is disposed on the surface of the circuit board 300. The heat conductive layer 232 is disposed in thermal contact between the heat source 231 and the heat conductive shell 211, so that the heat of the heat source 231 can be quickly transferred to the heat conductive shell 211. The heat conductive layer 232 can be a metal layer or other material layer with good thermal conductivity. Among them, the heat source 231 can be a heating tube, a heating sheet, etc., which can be set according to actual needs.

[0050] The heat-conducting layer 232 may be in contact with one surface, two surfaces or multiple surfaces of the heat source 231 , and may be configured according to actual needs, as long as a heat-conducting layer 232 is provided between the heat source 231 and the heat-conducting shell 211 .

[0051] Optionally, the second temperature probe 241 of the second temperature sensor 240 is disposed on the surface of the heat source 231. Specifically, the position of the second temperature probe 241 on the heat source 231 is set according to actual needs, for example, the second temperature probe 241 can be disposed at the center of the surface of the heat source 231 away from the circuit board 300. The second temperature probe 241 can be connected to the heat source 231 by a soldering process, and the soldering process can improve the accuracy of the temperature acquisition of the heat source 231.

[0052] Continue to refer to Figure 5 The heating unit 230 includes a power supply pin 233 , one end of which is electrically connected to the heating source 231 , and the other end of which is electrically connected to the circuit board 300 , so as to supply power to the heating source 231 through the circuit board 300 .

[0053] Figure 7 FIG. 1 is a schematic diagram of a control circuit of a heat dissipation test device according to an embodiment of the present application. Figure 7 The control module 100 includes a monitoring unit 110 and at least two heat source management units 120. The heat source management units 120 correspond to the heating units 230 one by one and adjust the heating power of the heating units 230, so as to realize flexible adjustment of the temperature of each heating unit 230. The at least two heat source management units 120 may include a first heat source management unit 120a, a second heat source management unit 120b...Nth heat source management unit 120c, and the at least two heating units 230 may include a first heating unit 230a, a second heating unit 230b...Nth heating unit 230c. The first heat source management unit 120a controls the first heating unit 230a, the second heat source management unit 120b controls the second heating unit 230b, and the Nth heat source management unit 120c controls the Nth heating unit 230c.

[0054] The heat source management unit 120 is connected to the monitoring unit 110 by signal, and the first temperature sensor 220 and the second temperature sensor 240 are respectively connected to the monitoring unit 110 by signal. The monitoring unit 110 obtains the temperature data collected by the first temperature sensor 220 and the second temperature sensor 240, and sends the above temperature data to each heat source management unit 120. Among them, the monitoring unit 110 may include a display screen (not shown in the figure), and the display screen is used to display the above temperature data. In addition, the monitoring unit 110 can also collect the voltage value, current value, and power value of each heating unit 230, and display them on the display screen. The display screen can be a touch screen, so that the operator can control each heat source management unit 120 through the touch screen.

[0055] In some optional embodiments, each heat source management unit 120 exchanges data with the monitoring unit 110 via the data line 140. The data interface 02 on the circuit board 300 includes an external data interface 02, through which the voltage value, current value, and power value of each heating unit 230 can be transmitted to the touch screen, and the touch screen command can also be received, and the power and temperature of each heat source management unit 120 can be set through the touch screen.

[0056] Figure 8 This is a schematic diagram of the control architecture of a heating unit according to an embodiment of the present application, referring to Figure 8The heat source management unit 120 includes a collection subcircuit 121, a processing subcircuit 122 and a heating subcircuit 123. The collection subcircuit 121 is electrically connected to at least two collection points connected to different positions of the heating unit 230. The collection subcircuit 121 is used to collect voltage values ​​of at least two collection points and provide the voltage values ​​to the processing subcircuit 122. The processing subcircuit 122 is used to generate a heating control signal according to each voltage value. The heating subcircuit 123 is used to respond to the effective signal of the heating control signal to connect the heating power supply terminal 124 with the heating unit 230 and provide a heating voltage to the heating subcircuit 123; or, respond to the invalid signal of the heating control signal to disconnect the connection between the heating power supply terminal 124 and the heating unit 230 and stop providing a heating voltage to the heating subcircuit 123.

[0057] In some optional embodiments, the heating subcircuit 123 includes a unidirectional element 123a and a switch control unit 123b connected to each other; the positive pole of the unidirectional element 123a is electrically connected to the heating power supply terminal 124, and the negative pole of the unidirectional element 123a is electrically connected to the first end of the switch control unit 123b; the second end of the switch control unit 123b is electrically connected to the heating unit 230; and the control end of the switch control unit 123b is electrically connected to the processing subcircuit 122.

[0058] The unidirectional element 123a allows current to flow from the heating power supply terminal 124 to the switch control unit 123b, and can block the circuit power supply if the external power supply is reversed or connected incorrectly, thereby protecting the circuit from being burned. The unidirectional element 123a can be a diode.

[0059] In some optional embodiments, the heat source management unit 120 includes a common ground line 130, and the output end of the heating unit 230 is connected to the common ground line 130. Figure 8 As shown, the current is supplied from the heating power supply terminal 124 through the unidirectional element 123a and the switch control unit 123b to the heating unit 230, and then the heating unit 230 outputs the current to the common ground line 130.

[0060] Among them, the switch control unit 123b is used to control the power on and off of the heating unit 230. The proportion of the on and off time of the switch control unit 123b is positively correlated with the heating power of the heating unit 230. For example, the maximum heating power of the heating unit 230 is Pmax, the on time of the switch control unit 123b in the period T is 1T / 3, and the off time is 2T / 3, then the heating power of the heating unit 230 in the period T is P=Pmax*(1T / 3) / T=1 / 3Pmax. Since Pmax is known in product design, the heating power of the heating unit 230 can be adjusted by adjusting the proportion of the on time of the switch control unit 123b in a period to the period.

[0061] In some optional embodiments, the processing subcircuit 122 includes: a central processor 122a, a waveform generator 122b and an isolator 122c connected to each other. The central processor 122a is used to generate a control signal according to the first voltage signal and the second voltage signal, and provide the control signal to the waveform generator 122b. The waveform generator 122b is used to convert the control signal into a heating control signal, wherein the heating control signal includes a valid signal and an invalid signal. The isolator 122c is electrically connected to the output end of the waveform generator 122b, and is used to filter out clutter in the heating control signal.

[0062] In some optional embodiments, the waveform generator 122b may be a pulse width modulation (PWM) trigger, which can generate a PWM signal. When the PWM signal is at a high level, the trigger is turned on, and the switch control unit 123b is turned on; when the PWM signal is at a low level, the trigger is turned off, and the switch control unit 123b is turned off. The frequency of the PWM signal is 20k-200kHz.

[0063] Among them, the duty cycle refers to the ratio of the duration of the high level in a signal to the entire signal cycle time. For example, if a PWM signal with a cycle of 1 second has a high level duration of 0.5 seconds, then the duty cycle of this PWM signal is 50%. This means that in the entire cycle, the high level time accounts for half, and the low level time also accounts for half.

[0064] Therefore, the central processor 122a can adjust the proportion of the conduction time of the switch control unit 123b in one cycle by adjusting the duty cycle of the waveform generator 122b, thereby adjusting the heating power of the heating unit 230.

[0065] In some optional embodiments, the isolator 122c can use an optical coupler or a magnetic coupling device to realize signal transmission between the central processing unit 122a and the switch control unit 123b, and can also block the transmission of electrical signals between the two, thereby realizing signal isolation and anti-interference.

[0066] Continue to refer to Figure 8 The processing subcircuit 122 also includes a voltage stabilizer 122d, one end of which is connected to the common ground line 130, and the other end of which is respectively connected to the central processing unit 122a and the waveform generator 122b. The voltage stabilizer 122d can prevent the processing subcircuit 122 from generating high voltage due to interference or partial device failure, thereby ensuring the safety of the input signal of the central processing unit 122a.

[0067] You can continue to refer to Figure 8, at least two collection points include a first collection point 125 and a second collection point 126, and the collection subcircuit 121 includes a first collection unit 127 and a second collection unit 128. Among them, the first collection unit 127 includes a first operational amplifier 127a and a first voltage regulator 127b. The input end of the first operational amplifier 127a is electrically connected to the first collection point 125, and the first operational amplifier 127a is used to process the first signal collected by the first collection point 125 to obtain a first voltage signal U1; the output end of the first operational amplifier 127a is electrically connected to the first voltage regulator 127b and the processing subcircuit 122, and the first voltage regulator 127b is used to stabilize the first voltage signal to prevent the collection subcircuit 121 from being interfered with or the device fails to generate high voltage, thereby ensuring the safety of the input signal of the central processor 122a. The second acquisition unit 128 includes a second operational amplifier 128a and a second voltage regulator 128b. The input end of the second operational amplifier 128a is electrically connected to the second acquisition point 126. The second operational amplifier 128a is used to process the second signal collected by the second acquisition point 126 to obtain a second voltage signal U2. The output end of the second operational amplifier 128a is electrically connected to the second voltage regulator 128b and the processing subcircuit 122. The second voltage regulator 128b is used to stabilize the second voltage signal to prevent the acquisition subcircuit 121 from being interfered with or the device fails to generate high voltage, thereby ensuring the safety of the input signal of the central processor 122a. The first voltage regulator 127b and the second voltage regulator 128b are both connected to the common ground line 130.

[0068] The first operational amplifier 127a is used to proportionally enhance and isolate the first signal to obtain a first voltage signal U1 and transmit it to the central controller. The second operational amplifier 128a is used to proportionally enhance and isolate the second signal to obtain a second voltage signal U2 and transmit it to the central controller.

[0069] Among them, the first collection point 125 and the second collection point 126 are respectively at the two ends of the heating unit 230, so as to obtain the voltage value at the two ends of the heating unit 230. It can be understood that the first collection point 125 is set at the current input end of the heating unit 230, and the second collection point 126 is set at the current output end of the heating unit 230. Preferably, the first collection point 125 is set on the shell surface of the current input end of the heating unit 230, and the second collection point 126 is set on the shell surface of the current output end of the heating unit 230. Because the resistance value R of the heating unit 230 is known, the actual power supply of the heating unit 230 is U=U1-U2, the current is I=U / R, and the power is P=U*I. Therefore, by setting the first collection point 125 and the second collection point 126 at the two ends of the heating unit 230, the central processor 122a can calculate the actual power of the heating unit 230. The acquisition subcircuit 121 in the present application uses the resistance of the heating unit 230 body, and can calculate the actual power, voltage, and current of the heating unit 230 without adding additional sampling resistors. In addition, by using the first operational amplifier 127a and the second operational amplifier 128a to enhance and isolate the acquisition signal, the accuracy and stability of the acquisition signal can be improved, thereby obtaining the accurate actual heating power of the heating unit 230.

[0070] In some optional embodiments, the at least two collection points further include a third collection point 129, and the third collection point 129 is electrically connected to the second temperature sensor 240. The central processor 122a is used to generate a disconnection signal upon receiving the temperature signal provided by the third collection point 129, so as to disconnect the connection between the heating power supply terminal 124 and the heating unit 230, so as to avoid high temperature loss caused by excessive temperature of the heating unit 230. The above temperature signal is collected by the second temperature sensor 240.

[0071] In some optional embodiments, the central processing unit in the present application has a constant power control mode and a constant temperature control mode. The two control modes of the central processing unit are specifically described below in conjunction with the accompanying drawings.

[0072] Fig. 9 This is a schematic diagram of a constant power control mode of a central processing unit according to an embodiment of the present application, referring to Fig. 9 When the central processor adopts constant power control, the central controller first collects the actual power p of the heating unit or heating module, and compares the actual power p with the preset power P, where

[0073] When P=p, the duty cycle is not adjusted;

[0074] When P>p, if the temperature is normal, the duty cycle is gradually increased to increase the heating power; if the temperature is too high, the duty cycle is set to 0 to quickly cool the heating unit;

[0075] When P<p, reduce the duty cycle to reduce the heating power.

[0076] Fig.10 This is a schematic diagram of a constant temperature control mode of a central processing unit according to an embodiment of the present application, referring to Fig.10 When the central processor adopts constant temperature control, the central controller first collects the actual temperature t of the heating unit or heating module, and compares the actual temperature t with the preset temperature T, where

[0077] When T = t, the duty cycle is not adjusted;

[0078] When T>t, if the temperature is normal, the duty cycle is gradually increased to increase the heating power; if the temperature is too high, the duty cycle is set to 0 to quickly cool the heating unit;

[0079] When T<t, reduce the duty cycle to reduce the heating power.

[0080] The heat dissipation testing device in the present application is described below in conjunction with the embodiments.

[0081] Example 1

[0082] The heat dissipation testing device in Example 1 is used to simulate the heat generation of a GPU, and the GPU has 10 heat generation areas, and the heat generation power of each heat generation area is different. Fig.11 This is a top view of a heat dissipation testing device according to an embodiment of the present application, Figure 2 and Fig.11 The heat dissipation test device in Example 1 includes a control module 100 and a heating module 200. The heating module 200 includes a housing 210, a first temperature sensor 220, 10 heating units 230 and a second temperature sensor 240. Among them, the top surface of the housing 210 is a heat-conducting shell 211, and the first temperature sensor 220 is mounted in the center of the heat-conducting shell 211 to simulate the outer shell temperature of the GPU. The 10 heating units 230 and the second temperature sensor 240 are arranged in the housing 210, and the second temperature sensor 240 corresponds to the heating unit 230 one by one, and is arranged in the center of the top surface of the corresponding heating unit 230, for simulating the actual temperature of each heating area of ​​the GPU. The first temperature sensor 220, the second temperature sensor 240 and the heating unit 230 are electrically connected to the control module 100 respectively, and the control module 100 can monitor and adjust the heating power of the 10 heating units 230 respectively.

[0083] When the performance of the radiator needs to be tested, the radiator to be tested only needs to be mounted on the surface of the heat-conducting shell 211 , and the performance of the radiator can be tested by the heat dissipation testing device.

[0084] Example 2

[0085] The heat dissipation testing device in Example 2 is used to detect the heat dissipation performance of different areas of a cold plate radiator. Fig.12 This is a top view of a heat sink according to another embodiment of the present application. Fig.12 The cold plate heat sink 10 includes a plurality of microchannels 11. Figure 2 The heat dissipation test device in Example 2 includes a control module 100 and a heating module 200. The heating module 200 includes a shell 210, a first temperature sensor 220, 10 heating units 230 and a second temperature sensor 240. Among them, the top surface of the shell 210 is a heat-conducting shell 211, and the first temperature sensor 220 is mounted in the center of the heat-conducting shell 211. The 10 heating units 230 and the second temperature sensor 240 are arranged in the shell 210, and the second temperature sensor 240 corresponds to the heating unit 230 one by one, and is arranged in the center of the top surface of the corresponding heating unit 230. The first temperature sensor 220, the second temperature sensor 240 and the heating unit 230 are electrically connected to the control module 100 respectively, and the control module 100 can monitor and adjust the heating power of the 10 heating units 230 respectively.

[0086] Fig.13 This is a top view of a heat dissipation test device and a heat sink assembly according to another embodiment of the present application, referring to Fig.13 , the cold plate radiator 10 is mounted on the surface of the heat-conducting shell 211 of the heat dissipation test device, and the monitoring unit 110 sends the same power value to all the thermal management units, and the heating power of all the heating units 230 is consistent. By monitoring the temperature of the 10 heating units 230, the heat dissipation of each area of ​​the cold plate radiator 10 can be tested. The higher the temperature of the heating unit 230, the worse the heat dissipation performance of the cold plate area corresponding to the heating unit 230.

[0087] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A heat dissipation testing device, characterized in that: comprising a control module and at least one heating module; The heating module comprises a shell, a first temperature sensor, at least two heating units and a second temperature sensor, wherein at least a portion of the shell is a heat-conducting shell, and the first temperature sensor is disposed in a target area of ​​the heat-conducting shell; The at least two heating units and the second temperature sensor are arranged in the housing, the second temperature sensor corresponds to the heating unit one by one, and is arranged at a target position corresponding to the heating unit; The first temperature sensor, the second temperature sensor and the heating unit are electrically connected to the control module respectively, and the control module is used to adjust the heating power of the heating unit.

2. The heat dissipation testing device according to claim 1, characterized in that: The heat dissipation testing device comprises a circuit board. The heating unit and the control module are both arranged on the surface of the circuit board. The circuit board covers the opening of the shell to form a receiving cavity.

3. The heat dissipation testing device according to claim 2, characterized in that: The first temperature sensor includes a first temperature probe, and the first temperature probe is arranged in the target area; The second temperature sensor includes a second temperature probe, and the second temperature probe is arranged at the target part; The first temperature probe and the second temperature probe are both electrically connected to the circuit board.

4. The heat dissipation testing device according to claim 3, characterized in that: The heat generating unit comprises a heat source and a heat conducting layer. The heat source is arranged on the surface of the circuit board, and the heat conducting layer is arranged between the heat source and the heat conducting shell.

5. The heat dissipation testing device according to claim 4, characterized in that: The heating unit further comprises a power supply pin, one end of which is electrically connected to the heating source, and the other end of which is electrically connected to the circuit board; And / or, the second temperature probe is arranged on the surface of the heat source.

6. The heat dissipation testing device according to any one of claims 1 to 5, characterized in that: The control module includes a monitoring unit and at least two heat source management units, wherein the heat source management units correspond to the heating units one by one and regulate the heating power of the heating units, the heat source management units are signal-connected to the monitoring unit, and the first temperature sensor and the second temperature sensor are signal-connected to the monitoring unit respectively.

7. The heat dissipation testing device according to claim 6, characterized in that: The heat source management unit comprises a collection subcircuit, a processing subcircuit and a heating subcircuit, wherein the collection subcircuit is electrically connected to at least two collection points connected to different positions of the heating unit; The acquisition subcircuit is used to acquire voltage values ​​of the at least two acquisition points and provide the voltage values ​​to the processing subcircuit; The processing subcircuit is used to generate a heating control signal according to each of the voltage values; The heating subcircuit is used to respond to a valid signal of the heating control signal to connect the heating power supply terminal with the heating unit and provide a heating voltage to the heating subcircuit; or, respond to an invalid signal of the heating control signal to disconnect the heating power supply terminal from the heating unit and stop providing a heating voltage to the heating subcircuit.

8. The heat dissipation testing device according to claim 7, characterized in that: The heating subcircuit comprises a unidirectional element and a switch control unit connected to each other; The positive electrode of the unidirectional element is electrically connected to the heating power supply end, and the negative electrode of the unidirectional element is electrically connected to the first end of the switch control unit; The second end of the switch control unit is electrically connected to the heating unit; The control end of the switch control unit is electrically connected to the processing sub-circuit.

9. The heat dissipation testing device according to claim 7, characterized in that: The at least two acquisition points include a first acquisition point and a second acquisition point, and the acquisition subcircuit includes a first acquisition unit and a second acquisition unit; The first acquisition unit includes a first operational amplifier and a first voltage regulator, wherein the input end of the first operational amplifier is electrically connected to the first acquisition point, and the first operational amplifier is used to process the first signal acquired by the first acquisition point to obtain a first voltage signal; the output end of the first operational amplifier is electrically connected to the first voltage regulator and the processing subcircuit, and the first voltage regulator is used to stabilize the first voltage signal; The second acquisition unit includes a second operational amplifier and a second voltage regulator, wherein the input end of the second operational amplifier is electrically connected to the second acquisition point, and the second operational amplifier is used to process the second signal collected by the second acquisition point to obtain a second voltage signal; the output end of the second operational amplifier is electrically connected to the second voltage regulator and the processing sub-circuit, and the second voltage regulator is used to stabilize the second voltage signal.

10. The heat dissipation testing device according to claim 9, characterized in that: The processing subcircuit includes: a central processing unit, a waveform generator and an isolator connected to each other; Wherein, the central processing unit is used to generate a control signal according to the first voltage signal and the second voltage signal, and provide the control signal to the waveform generator; The waveform generator is used to convert the control signal into the heating control signal, wherein the heating control signal includes a valid signal and an invalid signal; The isolator is electrically connected to the output end of the waveform generator and is used to filter out clutter in the heating control signal.

11. The heat dissipation testing device according to claim 10, characterized in that: The at least two collection points include a third collection point, and the third collection point is electrically connected to the second temperature sensor; The central processor is used to generate a disconnection signal upon receiving a temperature signal provided by the third collection point to disconnect the connection between the heating power supply end and the heating unit, wherein the temperature signal is collected by the second temperature sensor.

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