Circuit board testing method and device based on flying probe tester

Abstract

The invention provides a circuit board test method and device based on a flying probe tester. According to the method, a test point set is determined by obtaining a design file of a circuit board, establishing an electrical connection model and identifying components and pins on the circuit board. And generating test combination set data by analyzing the conduction relationship between the test points, and further generating test scheme data. And based on the test scheme data, a test path is generated by using a path optimization algorithm, finally, the flying probe tester is used for testing, and a test report is generated according to a test result. The flying probe tester adopts the combination of an annular probe and a sharp needle probe, the annular probe is used for a pin connector to ensure accurate contact, and the sharp needle probe is used for other types of components to improve the test precision and adaptability. Compared with a traditional test method, the test scheme can be generated more efficiently, the test path can be optimized more efficiently, the test time is remarkably shortened, and the reliability and accuracy of circuit board testing are improved.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board testing, and in particular relates to a circuit board testing method and device based on a flying probe tester. Background Art

[0002] With the increasing complexity and miniaturization of electronic products, the production and testing process of circuit boards are facing higher and higher requirements. In the production process of electronic products, the reliability and stability of circuit boards directly affect the quality of the final product. Therefore, the testing of circuit boards has become one of the key links in the production process. Traditional circuit board testing methods mainly rely on contact testing technology, such as traditional ICT (In-Circuit Test) testing. These methods require the installation of complex test fixtures on the circuit board, and the testing process usually takes a long time, with a high risk of manual operation.

[0003] In recent years, with the miniaturization, complexity and increasing demand for automated production of electronic equipment, Flying Probe Test technology, as a fixture-free, fast and efficient testing method, has gradually been widely used. Flying probe testers move test probes on the surface of circuit boards to detect electrical connections on circuit boards. There is no need to configure fixtures for each test point, so they have great flexibility and are especially suitable for small batch, sample and high-precision circuit board testing.

[0004] However, flying probe test technology still faces some challenges, especially in how to efficiently and accurately generate test paths and test plans. Current flying probe test methods often rely on manual experience or traditional path planning algorithms when generating test paths, resulting in problems such as repeated testing, low test efficiency, and long test time in the generated test paths. In addition, when faced with complex circuit board designs, traditional test methods also need to select appropriate test points and probe types based on manual experience, which increases the workload of testers and is prone to human errors.

[0005] Therefore, how to use advanced automation technology, combined with the design files and electrical connection models of the circuit board, to automatically generate reasonable test paths and test plans and improve the efficiency and accuracy of flying probe testing has become an important topic in the current technological development. Summary of the invention

[0006] The purpose of the present invention is to overcome the defects of the prior art and provide a method and device for installing a low voltage commutation device.

[0007] The purpose of the present invention can be achieved by the following technical solutions:

[0008] The present invention provides a circuit board testing method based on a flying probe tester, comprising the following steps:

[0009] Step S1: Obtain the design file of the circuit board to be tested;

[0010] Step S2: establishing an electrical connection model of the circuit board to be tested according to the design file of the circuit board to be tested;

[0011] Step S3: Identify all components and their pins on the circuit board to be tested according to the electrical connection model, determine the electrical connection relationship between each component pin, identify and mark all component pins, pads and electrical connection points that can be used as test points, and obtain test point set data;

[0012] Step S4: analyzing the conduction relationship between each test point according to the test point set data and the electrical connection model, and generating test combination set data according to the conduction relationship between each test point;

[0013] Step S5: generating test solution data according to the test combination set data, the distances between the test points and the component types corresponding to the test points;

[0014] Step S6: Generate a test path through a path optimization algorithm according to the test plan data;

[0015] Step S7: testing the circuit board to be tested by a flying probe tester according to the generated test scheme data and test path, obtaining the test results, and generating a test report according to the test results.

[0016] Furthermore, the test point set data includes test point data of all test points, and the test point data includes a test point mark number, a two-dimensional coordinate of the test point, and a component type corresponding to the test point.

[0017] Furthermore, the component types include diodes, transistors, resistors, capacitors, and pin connectors, the pin connectors include multiple pins, and the test points include pin connector pins.

[0018] Further, the step S4 includes the following steps:

[0019] Step S4.1: extract a test point from the test point set data as a first test point, screen a test point set connected to the first test point based on the electrical connection relationship in the electrical connection model, and combine the first test point and each test point in the test point set as a group of test points;

[0020] Step S4.2: Deleting the first test point from the test point set data;

[0021] Step S4.3: Determine whether the test point set data is empty. If it is empty, generate test combination set data according to all test point combinations. If it is not empty, execute step S4.1.

[0022] Furthermore, the test point combination includes first test point data and second test point data that are interconnected.

[0023] Furthermore, the test plan data includes multiple groups of test point combinations and test plans corresponding to the test point combinations, the test plan includes the test probe type and test surface of the first test point in the test point combination, and the test surface includes the front side and the back side of the circuit board.

[0024] Furthermore, the test probe types include an annular probe and a pointed needle probe. The top of the annular probe is a hollowed-out circular ring, and the top of the pointed needle probe is a conical thin needle.

[0025] Furthermore, the step S5 includes the following steps:

[0026] Traverse each test point combination in the test combination set data, and generate a corresponding test plan for each test point combination;

[0027] Generating a corresponding test plan for each test point combination includes the following steps:

[0028] Determine the component types corresponding to the first test point and the second test point in the test point combination; if the component types corresponding to the two test points are both pin connectors, calculate the distance between the two test points according to the two-dimensional coordinates of the first test point and the two-dimensional coordinates of the second test point; if the distance between the two test points is less than the first preset distance, set the test probe type of the first test point to a circular probe, and the test surface to the front of the circuit board; set the test probe type of the second test point to a sharp needle probe, and the test surface to the back of the circuit board;

[0029] If the distance between the two test points is greater than or equal to the first preset distance, the test probe type of the first test point is set to a circular probe, the test surface is set to the front of the circuit board, and the test probe type of the second test point is set to a circular probe, and the test surface is set to the front of the circuit board;

[0030] If the component types corresponding to the two test points are not pin connectors, the distance between the two test points is calculated according to the two-dimensional coordinates of the first test point and the two-dimensional coordinates of the second test point. If the distance between the two test points is less than the second preset distance, the test probe type of the first test point is set to a sharp needle probe, and the test surface is set to the back of the circuit board, and the test probe type of the second test point is set to a sharp needle probe, and the test surface is set to the front of the circuit board;

[0031] If the component type corresponding to one of the two side points is a pin connector, the test probe type of the test point whose component type is a pin connector is set to a ring probe, and the test surface is set to the front side of the circuit board; the test probe type of the test point whose component type is not a pin connector is set to a pointed needle probe, and the test surface is set to the back side of the circuit board.

[0032] Furthermore, the test path includes a test sequence of each test point combination in the test solution data, and the path optimization algorithm includes a shortest path algorithm.

[0033] The present invention also provides a computer storage medium storing executable program code; the executable program code is used to execute any one of the above-mentioned circuit board testing methods based on a flying probe tester.

[0034] Compared with the prior art, the present invention has the following advantages:

[0035] (1) The present invention automatically generates a test plan by automatically analyzing the design files and electrical connection models of the circuit board, combining the test point set data, and generates the optimal test path through a path optimization algorithm. This method greatly improves the efficiency of the test process, avoids the inefficiency and errors in manual path planning, and at the same time improves the accuracy of the test, avoiding the risk of repeated testing and missing test points. This technology is also suitable for the testing requirements of complex circuit boards, and can automatically adapt to circuit boards of different designs and component types.

[0036] (2) The present invention intelligently selects the appropriate test probe type (ring probe or sharp needle probe) and test surface (front or back of the circuit board) by calculating the distance between the test points and the component type. This technology flexibly selects the probe type and test surface according to actual needs, avoiding test failure or low test efficiency caused by improper probe selection. When testing special components such as pin connectors, it can automatically identify and perform special processing to ensure the accuracy of the test.

[0037] (3) The present invention adopts flying probe testing technology, eliminating the need for test fixtures in traditional ICT methods, and performs efficient electrical connection detection by moving the test probe. This technology not only eliminates the need to customize fixtures for each test point, reducing test preparation work and equipment costs, but also adapts to the testing needs of small batches, sample production and high-precision circuit boards, greatly improving production efficiency and reducing production costs.

[0038] (4) The present invention performs automated testing through a flying probe tester, and can automatically generate test results and test reports after the test is completed, reducing the need for manual intervention. The automated process of test report generation reduces errors in manual operations, making the test report more accurate and comprehensive, and can provide timely feedback on test results, effectively improving test feedback efficiency.

[0039] (5) The present invention automatically identifies and marks component pins, pads, and electrical connection points that can be used as test points by analyzing the electrical connection model and component type, thereby ensuring adaptability to different circuit board designs and components. This method can not only efficiently identify different types of components, but also has a high degree of flexibility and applicability, and is suitable for testing various complex circuit boards. No matter how the specifications or designs of the circuit boards change, efficient and accurate testing can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 is a flow chart of the method of the present invention;

[0041] Figure 2 It is a structural diagram of the annular probe of the present invention;

[0042] Figure 3 This is a structural diagram of the sharp needle probe of the present invention. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0044] Embodiment 1:

[0045] This embodiment provides a circuit board testing method based on a flying probe tester, such as Figure 1 As shown, the following steps are included:

[0046] Step S1: Obtain the design file of the circuit board to be tested;

[0047] Step S2: establishing an electrical connection model of the circuit board to be tested according to the design file of the circuit board to be tested;

[0048] Step S3: Identify all components and their pins on the circuit board to be tested according to the electrical connection model, determine the electrical connection relationship between each component pin, identify and mark all component pins, pads and electrical connection points that can be used as test points, and obtain test point set data;

[0049] Step S4: analyzing the conduction relationship between each test point according to the test point set data and the electrical connection model, and generating test combination set data according to the conduction relationship between each test point;

[0050] Step S5: generating test solution data according to the test combination set data, the distance between the test points and the component types corresponding to the test points;

[0051] Step S6: Generate a test path through a path optimization algorithm according to the test plan data;

[0052] Step S7: testing the circuit board to be tested by a flying probe tester according to the generated test scheme data and test path, obtaining the test results, and generating a test report according to the test results.

[0053] The test point set data includes the test point data of all test points, and the test point data includes the test point mark number, the two-dimensional coordinates of the test point, and the component type corresponding to the test point.

[0054] Among them, the component types include diodes, transistors, resistors, capacitors, and pin connectors. The pin connectors include multiple pins, and the test points include pin connector pins.

[0055] Wherein, step S4 comprises the following steps:

[0056] Step S4.1: extract a test point from the test point set data as a first test point, screen a test point set connected to the first test point based on the electrical connection relationship in the electrical connection model, and combine the first test point and each test point in the test point set as a group of test points;

[0057] Step S4.2: Deleting the first test point from the test point set data;

[0058] Step S4.3: Determine whether the test point set data is empty. If it is empty, generate test combination set data according to all test point combinations. If it is not empty, execute step S4.1.

[0059] The test point combination includes first test point data and second test point data that are interconnected.

[0060] The test plan data includes multiple groups of test point combinations and test plans corresponding to the test point combinations. The test plan includes the test probe type and test surface of the first test point in the test point combination. The test surface includes the front side and the back side of the circuit board.

[0061] Among them, the test probe types include ring probes and pointed needle probes. The top of the ring probe is a circular ring with a hollow middle, and the top of the pointed needle probe is a conical thin needle.

[0062] Wherein, step S5 comprises the following steps:

[0063] Traverse each test point combination in the test combination set data, and generate a corresponding test plan for each test point combination;

[0064] Generating a corresponding test plan for each test point combination includes the following steps:

[0065] Determine the component types corresponding to the first test point and the second test point in the test point combination; if the component types corresponding to the two test points are both pin connectors, calculate the distance between the two test points according to the two-dimensional coordinates of the first test point and the two-dimensional coordinates of the second test point; if the distance between the two test points is less than the first preset distance, set the test probe type of the first test point to a circular probe, and the test surface to the front of the circuit board; set the test probe type of the second test point to a sharp needle probe, and the test surface to the back of the circuit board;

[0066] If the distance between the two test points is greater than or equal to the first preset distance, the test probe type of the first test point is set to a circular probe, the test surface is set to the front of the circuit board, and the test probe type of the second test point is set to a circular probe, and the test surface is set to the front of the circuit board;

[0067] If the component types corresponding to the two test points are not pin connectors, the distance between the two test points is calculated according to the two-dimensional coordinates of the first test point and the two-dimensional coordinates of the second test point. If the distance between the two test points is less than the second preset distance, the test probe type of the first test point is set to a sharp needle probe, and the test surface is set to the back of the circuit board, and the test probe type of the second test point is set to a sharp needle probe, and the test surface is set to the front of the circuit board;

[0068] If the component type corresponding to one of the two side points is a pin connector, the test probe type of the test point whose component type is a pin connector is set to a ring probe, and the test surface is set to the front side of the circuit board; the test probe type of the test point whose component type is not a pin connector is set to a pointed needle probe, and the test surface is set to the back side of the circuit board.

[0069] The test path includes the test sequence of each test point combination in the test solution data, and the path optimization algorithm includes the shortest path algorithm.

[0070] Embodiment 2:

[0071] This embodiment describes in detail the actual operation process of the circuit board testing method based on the flying probe tester. First, the design files of the circuit board to be tested are obtained, including circuit schematics and PCB (Printed Circuit Board) wiring diagrams. These design files contain key information such as the structural information, component positions, and electrical connection methods of the circuit board. After obtaining these files, professional circuit design and simulation software are used to model the circuit board to be tested, and an electrical connection model is automatically generated. This model can clearly show the electrical connection relationship of each component and its pins on the circuit board, forming the basis for performing a flying probe test.

[0072] On the basis of the electrical connection model, automated tools are further used to identify all components and their pins on the circuit board. The system analyzes the electrical connection relationship between each component pin and generates a test point set based on these relationships. The test point set includes all points that can be used for testing, such as component pins, pads, and electrical connection points. Each test point contains the marking number, two-dimensional coordinates, and the component type corresponding to the test point (such as resistors, capacitors, diodes, pin connectors, etc.). In this way, through the combination of design files and electrical connection models, the system can comprehensively and accurately determine all test points on the circuit board to be tested, providing complete basic data for subsequent flying probe testing.

[0073] After obtaining the test point set data, the system further analyzes the connection status between each test point based on the conduction relationship in the electrical connection model. The system will identify which test points are electrically connected and generate a test combination set accordingly. Each test point combination represents a group of test points with an electrical connection relationship. Such a combination ensures that each electrical connection on the circuit board can be fully covered during the test process, ensuring the integrity of the test.

[0074] After generating the test point combination set, the system enters the test plan generation stage. The test plan generation will comprehensively consider factors such as the physical distance between the test points, the type of corresponding components, and the test method. Specifically, the system will traverse all test point combinations and generate a corresponding test plan for each test point combination based on the following criteria:

[0075] Determination of test point distance and component type:

[0076] When both test points in the test point combination correspond to pin connectors, the system will first calculate the physical distance between the two test points. If the distance is short (less than the preset first distance), the test probe type of the first test point is set to a circular probe, the test surface is set to the front of the circuit board, and the probe type of the second test point is set to a sharp needle probe, and the test surface is set to the back of the circuit board; if the distance between the test points is far (greater than or equal to the preset first distance), both points use circular probes and are tested on the front of the circuit board.

[0077] If the component types of the two test points are not pin connectors, the distance is calculated based on their physical positions. If the distance is small (smaller than the preset second distance), a sharp needle probe is used to test on the back and front of the circuit board respectively; if one of the test points is a pin connector and the other is not, a circular probe is used for the point corresponding to the pin connector, and the test surface is the front of the circuit board, while a sharp needle probe is used for the other test point, and the test surface is the back of the circuit board.

[0078] In this way, the test plan data generated by the system fully considers the distance between each test point combination, the type of components, the choice of probe type and the position of the test surface, thereby ensuring the accuracy and efficiency of the test process.

[0079] Next, use the path optimization algorithm to optimize the test point combination in the test plan data. The purpose of path optimization is to determine the best movement order and path of the test probe during the test process, reduce the idle movement time and unnecessary repeated tests during the test process, and thus improve the test efficiency. Common path optimization algorithms include the shortest path algorithm, which can calculate an optimal test path so that the flying probe tester can visit all test points in sequence in the shortest path during the test process. This step ensures that the flying probe tester can complete various test tasks quickly and efficiently during the test process.

[0080] Once the test path is generated, the flying probe tester can start the test task. The tester performs contact testing on each test point of the circuit board to be tested in turn according to the optimized path. The test of each test point will be made through the flying probe contacting the circuit board, and the tester will automatically determine whether the electrical connection is normal or whether the components are working properly. The flying probe tester determines the status of the test point based on the feedback test signal. If the test results are not as expected (such as electrical non-conduction or components do not meet the specifications), the tester will automatically generate a corresponding test report, which lists the test results of each test point in detail, including the pass and fail test status and related fault information.

[0081] Finally, the flying probe tester will generate a test report based on the test results of all test points. The report includes the test point's mark number, the corresponding component type, the test result (pass or fail), the location of the fault point, and possible fault analysis. The report provides engineers with detailed test data to help them further analyze the quality and reliability of the circuit board and promptly discover and solve problems in production.

[0082] Through the above steps, this embodiment shows how to use a flying probe tester and automated software to perform efficient and accurate circuit board testing. This method greatly improves the efficiency and accuracy of testing by automatically generating test plans, optimizing test paths, and achieving rapid testing, reducing manual intervention and ensuring the quality and reliability of circuit board products.

[0083] Among them, during the circuit board testing process, the pin connector usually has multiple metal ejector pins, and these ejector pins are arranged relatively compactly and present a specific contact method on the board. Due to the structural characteristics of the pin connector, their ejector pins are usually long and thin, and it is difficult for traditional sharp needle probes to accurately contact multiple ejector pins in a limited space, especially in high-density areas. The sharp needle probe may not cover all the ejector pins that need to be tested or cause unstable contact between the probe and the ejector pin, thus affecting the accuracy and reliability of the test results.

[0084] The design of the ring probe can effectively solve this problem. Figure 2 The top of the ring probe shown is a circular ring with a hollow middle. This structural design enables it to completely cover the ejector pin of the pin connector when it contacts the ejector pin of the pin connector. The contact method of the ring probe can ensure a larger contact area with the ejector pin during testing, reducing the risk of poor contact, and because of its ring-shaped contact surface, it can cover a larger range of ejector pins. Especially when the ejector pins are arranged compactly or densely, the ring probe is more suitable for accurate and efficient testing than the pointed needle probe. The stability and efficiency of the test are ensured. Therefore, in the test of pin connectors, the ring probe provides a more ideal contact method and test effect, which can effectively improve the reliability and accuracy of the flying probe tester when performing complex connector tests.

[0085] For other types of components, such as resistors, capacitors, diodes, transistors, etc., their pins are usually thinner and shorter than those of pin connectors, and their layout on the circuit board is more scattered. Since the pin spacing of these components is large and the layout is relatively simple, the design of the sharp needle probe can well adapt to this type of component testing.

[0086] like Figure 3 As shown in the figure, the top of the sharp needle probe is a conical needle with a small contact surface and strong penetration ability, which can accurately touch the individual pins of these components. Especially when testing smaller pads or compact pins, the sharp needle probe can provide more precise contact and avoid interference with other component pins. The structure and precision of the sharp needle make it more advantageous than the ring probe when testing small-sized and fine-pitch components.

[0087] In addition, compared with the circular probe, the sharp needle probe has a smaller contact area, which can accurately locate when testing relatively scattered components, reduce unnecessary contact areas, and ensure the efficiency of the test. Especially when relatively scattered components are arranged on the circuit board, the sharp needle probe can test the conduction of each pin through precise contact, avoiding test errors caused by poor contact or excessive contact area.

[0088] Therefore, for non-pin connector type components, the pointed needle probe provides a more suitable contact method and accuracy, which can effectively ensure the reliability and accuracy of the flying probe tester when performing various conventional component tests.

[0089] If the above functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, etc., which can store program code.

[0090] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A circuit board testing method based on a flying probe tester, characterized in that: The following steps are involved: Step S1: Obtain the design file of the circuit board to be tested; Step S2: establishing an electrical connection model of the circuit board to be tested according to the design file of the circuit board to be tested; Step S3: Identify all components and their pins on the circuit board to be tested according to the electrical connection model, determine the electrical connection relationship between each component pin, identify and mark all component pins, pads and electrical connection points that can be used as test points, and obtain test point set data; Step S4: analyzing the conduction relationship between each test point according to the test point set data and the electrical connection model, and generating test combination set data according to the conduction relationship between each test point; Step S5: generating test solution data according to the test combination set data, the distances between the test points and the component types corresponding to the test points; Step S6: Generate a test path through a path optimization algorithm according to the test plan data; Step S7: testing the circuit board to be tested by a flying probe tester according to the generated test scheme data and test path, obtaining the test results, and generating a test report according to the test results.

2. A circuit board testing method based on a flying probe tester according to claim 1, characterized in that: The test point set data includes test point data of all test points, and the test point data includes a test point mark number, a two-dimensional coordinate of the test point, and a component type corresponding to the test point.

3. A circuit board testing method based on a flying probe tester according to claim 2, characterized in that: The component types include diodes, triodes, resistors, capacitors, and pin connectors. The pin connector includes a plurality of ejector pins, and the test points include ejector pins of the pin connector.

4. A circuit board testing method based on a flying probe tester according to claim 1, characterized in that: The step S4 comprises the following steps: Step S4.1: extract a test point from the test point set data as a first test point, screen a test point set connected to the first test point based on the electrical connection relationship in the electrical connection model, and combine the first test point and each test point in the test point set as a group of test points; Step S4.2: Deleting the first test point from the test point set data; Step S4.3: Determine whether the test point set data is empty. If it is empty, generate test combination set data according to all test point combinations. If it is not empty, execute step S4.

1.

5. A circuit board testing method based on a flying probe tester according to claim 4, characterized in that: The test point combination includes first test point data and second test point data which are interconnected.

6. A circuit board testing method based on a flying probe tester according to claim 1, characterized in that: The test scheme data includes multiple groups of test point combinations and test schemes corresponding to the test point combinations. The test scheme includes a test probe type and a test surface of a first test point in the test point combination. The test surface includes a front side and a back side of a circuit board.

7. A circuit board testing method based on a flying probe tester according to claim 6, characterized in that: The test probe types include an annular probe and a sharp needle probe. The top of the annular probe is a hollowed-out circular ring, and the top of the sharp needle probe is a conical fine needle.

8. A circuit board testing method based on a flying probe tester according to claim 1, characterized in that: The step S5 comprises the following steps: Traverse each test point combination in the test combination set data, and generate a corresponding test plan for each test point combination; Generating a corresponding test plan for each test point combination includes the following steps: Determine the component types corresponding to the first test point and the second test point in the test point combination; if the component types corresponding to the two test points are both pin connectors, calculate the distance between the two test points according to the two-dimensional coordinates of the first test point and the two-dimensional coordinates of the second test point; if the distance between the two test points is less than the first preset distance, set the test probe type of the first test point to a circular probe, and the test surface to the front of the circuit board; set the test probe type of the second test point to a sharp needle probe, and the test surface to the back of the circuit board; If the distance between the two test points is greater than or equal to the first preset distance, the test probe type of the first test point is set to a circular probe, the test surface is set to the front of the circuit board, and the test probe type of the second test point is set to a circular probe, and the test surface is set to the front of the circuit board; If the component types corresponding to the two test points are not pin connectors, the distance between the two test points is calculated according to the two-dimensional coordinates of the first test point and the two-dimensional coordinates of the second test point. If the distance between the two test points is less than the second preset distance, the test probe type of the first test point is set to a sharp needle probe, and the test surface is set to the back of the circuit board, and the test probe type of the second test point is set to a sharp needle probe, and the test surface is set to the front of the circuit board; If the component type corresponding to one of the two side points is a pin connector, the test probe type of the test point whose component type is a pin connector is set to a ring probe, and the test surface is set to the front side of the circuit board; the test probe type of the test point whose component type is not a pin connector is set to a pointed needle probe, and the test surface is set to the back side of the circuit board.

9. A circuit board testing method based on a flying probe tester according to claim 1, characterized in that: The test path includes the test sequence of each test point combination in the test solution data, and the path optimization algorithm includes the shortest path algorithm.

10. A computer storage medium, characterized in that: An executable program code is stored; the executable program code is used to execute the circuit board testing method based on a flying probe tester as described in any one of claims 1 to 9.

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