Testing equipment and testing method for off-line testing of chip and self-inspection of testing jig

Abstract

The invention provides a test device and a test method for off-line testing of a chip and self-inspection of a test fixture, and relates to the technical field of chip testing. The function integration device is installed above the testing machine and comprises a gas detection part connected with the gas inlet channel and the gas outlet channel, and the gas detection part is used for conveying protective gas to the testing cavity and detecting the gas inlet amount and the gas outlet amount of the testing jig so as to judge whether the gas leakage amount of the testing jig is qualified or not. According to the technical scheme, the function integration device is additionally arranged on the testing machine of the existing chip off-line testing equipment, which is equivalent to integrating the functions of off-line detection of the electrical performance of the chip and detection of the quality of the testing jig on the same equipment; therefore, the testing equipment for off-line testing of the chip and self-inspection of the testing jig can not only provide protective gas for the testing jig and prevent oxidation fire during testing of the chip, but also detect whether gas leakage of the testing jig is normal or not, so that the functions of the testing equipment are more complete.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and in particular to a testing device and a testing method for chip offline testing and test fixture self-checking. Background Art

[0002] When testing the electrical properties of silicon carbide grains, a small batch of offline tests and verifications are required in the early stage to determine the performance of the test machine and the electrical properties of the silicon carbide grains to be tested. Offline testing refers to manual testing when the test fixture and the test machine are not installed on the sorting machine. Online testing refers to the automatic loading, testing and unloading of the test fixture and the test machine when they are installed on the sorting machine. The existing offline detection device is relatively simple and does not have anti-oxidation functions. In addition, after the silicon carbide grain test fixture is installed, in order to obtain indicators such as heating function integrity and air leakage, it is necessary to measure them through a special detection device. If there is no corresponding special detection device, the quality of the silicon carbide grain test fixture can only be judged according to the actual effect when the silicon carbide grain test fixture is installed on the sorting machine for actual use. When the test fixture is used in the actual use of the sorting machine to detect the quality of the test fixture, the installation is more troublesome, and the sorting machine needs to be used normally and idle to measure. Other simple detection tools cannot be detected according to actual use requirements and indicators. Summary of the invention

[0003] An object of the present invention is to provide a test device for chip offline testing and test fixture self-checking, so as to solve the technical problem that the chip offline testing device in the prior art has imperfect functions.

[0004] A further object of the present invention is to further improve the function of the chip offline testing device.

[0005] Another object of the present invention is to provide a testing method applied to the above-mentioned testing device.

[0006] In particular, the present invention provides a test device for chip offline testing and chip test fixture self-test, comprising:

[0007] A test machine including a mounting plate located on a top portion thereof, the mounting plate having at least one air inlet passage and at least one air exhaust passage;

[0008] At least one test fixture, mounted on the mounting plate, each of the test fixtures having a test cavity connected to the air inlet channel and the exhaust channel, wherein a chip to be tested is placed in the test cavity;

[0009] A functional integration device is installed above the test machine and includes a gas detection component connected to the air inlet channel and the exhaust channel, the gas detection component is used to deliver protective gas to the test chamber and detect the air intake and exhaust volume of the test fixture, so as to judge whether the leakage amount of the test fixture is qualified according to the air intake and exhaust volume.

[0010] Optionally, the functional integration device includes a protective gas inlet, and the gas detection component includes:

[0011] An air intake flow meter, one end of which is connected to the protective gas inlet, and the other end of which is connected to the air intake channel, and the protective gas flows through the protective gas inlet, the air intake channel of the air intake flow meter and the test chamber in sequence;

[0012] An exhaust flow meter is connected to the exhaust channel, and the gas in the test chamber flows through the exhaust channel and the exhaust flow meter in sequence.

[0013] Optionally, the gas detection component further includes:

[0014] An air inlet switch, one end of which is connected to the protective gas inlet, and the other end of which is connected to the air inlet flow meter;

[0015] An exhaust switch has one end connected to the exhaust passage and the other end connected to the exhaust flow meter.

[0016] Optionally, the mounting plate has at least one first air inlet, at least one second air inlet, at least one first exhaust port and at least one second exhaust port, each of the first air inlet is connected with one of the second air inlet to form an air inlet channel, each of the first exhaust port is connected with one of the second exhaust ports to form an exhaust channel, the test chamber is connected with the second air inlet and the second exhaust port, the first exhaust port is connected with the exhaust switch, and the first air inlet is connected with the air intake flow meter.

[0017] Optionally, the test fixture includes:

[0018] A first fixture, mounted on the mounting plate, the first fixture being in communication with the intake passage and the exhaust passage and having a test probe;

[0019] The second fixture is located above the first fixture, and the chip under test is adsorbed on the bottom. The second fixture is configured to cover the first fixture to form the test cavity, and the test probe is in contact with the chip under test, so as to perform a functional test on the chip under test.

[0020] Optionally, the second fixture has an adsorption channel, and the functional integration device further includes an adsorption component and a compressed gas inlet, and the adsorption component includes:

[0021] a first vacuum switch connected to the compressed gas inlet;

[0022] A vacuum flow meter, one end of which is connected to the first vacuum switch, and the other end of which is connected to the adsorption channel, wherein the compressed gas passes through the compressed gas inlet, the first vacuum switch, the vacuum flow meter and the adsorption channel in sequence, thereby adsorbing the chip under test;

[0023] The vacuum generator has one end connected to the power supply and the other end connected to the vacuum flow meter.

[0024] Optionally, the functional integration device includes:

[0025] A housing, on which the protective gas inlet is mounted, the air intake switch and the exhaust switch protrude to the outside of the housing, and the display area of ​​the air intake flow meter and the display area of ​​the exhaust flow meter are both located at the mounting hole of the housing;

[0026] The first vacuum switch protrudes to the outside of the shell, and the display area of ​​the vacuum flow meter is located at the mounting hole of the shell.

[0027] Optionally, the functional integration device further includes a pressing component, and the pressing component includes:

[0028] a second vacuum switch connected to the compressed gas inlet;

[0029] A cylinder and the second vacuum switch, wherein the cylinder is configured to push the second jig downward when the second vacuum switch is turned on, so that the second jig is covered with the first jig.

[0030] Optionally, a heating component is provided inside the second fixture, and the functional integration device further comprises:

[0031] A temperature controller is connected to the heating component and is used to detect the heating function of the test fixture.

[0032] In particular, the present invention also provides a testing method applied to the above-mentioned testing device, comprising the following steps:

[0033] In response to a trigger instruction for charging, a protective gas is charged into a test cavity of a test fixture, wherein a chip under test is placed in the test cavity;

[0034] Obtaining the air intake and exhaust volume of the test chamber;

[0035] Calculating the air leakage of the test chamber according to the air intake volume and the exhaust volume;

[0036] Whether the leakage amount of the test cavity is qualified is judged according to the leakage amount and the preset leakage amount.

[0037] Optionally, the test fixture includes a first fixture and a second fixture, and the step of filling the test cavity of the test fixture with protective gas in response to the trigger instruction of filling gas also includes the following steps:

[0038] When the chip under test is located below the second fixture, controlling the compressed gas inlet to open, so as to deliver compressed gas to the adsorption channel of the second fixture, thereby adsorbing the chip under test;

[0039] In response to a closing instruction of the test fixture, the cylinder is controlled to drive the second fixture to move downward so as to close with the first fixture to form the test cavity.

[0040] Optionally, the step of judging whether the leakage amount of the test cavity is qualified according to the leakage amount and a preset leakage amount further includes the following steps:

[0041] After determining that the gas leakage of the test cavity is qualified, controlling the heating component inside the second fixture to heat the chip under test, so as to perform a high temperature test on the chip under test;

[0042] The actual temperature of the test fixture is obtained, and the actual temperature is compared with the control temperature of the heating component to determine whether the heating function of the test fixture is normal according to the comparison result.

[0043] The mounting plate of the test machine in the present invention has at least one air inlet channel and at least one exhaust channel. The functional integration device is installed above the test machine and includes a gas detection component connected to the air inlet channel and the exhaust channel. The gas detection component is used to deliver protective gas to the test chamber and detect the air intake and exhaust volume of the test fixture to determine whether the leakage of the test fixture is qualified. The above technical solution adds a functional integration device to the test machine of the existing chip offline test equipment, which is equivalent to integrating the functions of offline detection of chip electrical properties and detection of test fixture quality on the same device, so that the test equipment for chip offline testing and test fixture self-test can not only provide protective gas for the test fixture to prevent oxidation and fire during chip testing, but also detect whether the leakage of the test fixture is normal, making the function of the test equipment more complete.

[0044] Furthermore, in the present invention, a heating component is provided inside the second fixture, and the functional integration device further includes a temperature controller connected to the heating component, which is used to detect the heating function of the test fixture. The above technical solution configures a temperature controller for the test equipment for chip offline testing and test fixture self-test, which can detect whether the heating function of the test fixture is normal, further improving the function of the test equipment for chip offline testing and test fixture self-test.

[0045] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0047] Figure 1 is a schematic structural diagram of a test device for chip offline testing and test fixture self-test according to an embodiment of the present invention;

[0048] Figure 2 yes Figure 1 A schematic structural diagram of a functional integration device of the test equipment shown;

[0049] Figure 3 yes Figure 2 A schematic structural diagram of the interior of the functional integration device shown;

[0050] Figure 4 yes Figure 1 A schematic structural diagram of a mounting plate of a test machine in the test equipment shown;

[0051] Figure 5 yes Figure 1 A schematic structural diagram of a first fixture of the test fixture shown;

[0052] Figure 6 yes Figure 1 A schematic structural diagram of a second fixture of the test fixture shown;

[0053] Figure 7 is a schematic circuit connection diagram of a gas detection component according to an embodiment of the present invention;

[0054] Figure 8 is a schematic circuit connection diagram of an adsorption component according to an embodiment of the present invention;

[0055] Fig. 9 is a schematic circuit connection diagram of a pressing component according to an embodiment of the present invention;

[0056] Fig.10 is a schematic circuit connection diagram of a thermostat according to an embodiment of the present invention;

[0057] Fig.11 is a schematic flow chart of a testing method of a testing device for chip offline testing and test fixture self-test according to an embodiment of the present invention;

[0058] Fig.12 It is a schematic flow chart of a testing method of a testing device for chip offline testing and test fixture self-test according to another embodiment of the present invention.

[0059] Reference numerals:

[0060] 100-test equipment, 200-tested chip, 10-test machine, 20-test fixture, 30-functional integration device, 11-mounting plate, 21-first fixture, 22-second fixture, 31-compressed gas inlet, 32-protective gas inlet, 33-gas detection component, 34-adsorption component, 35-temperature controller, 36-housing, 37-pressing component, 111-second air inlet, 112-second exhaust port, 113-first air inlet Port, 114-first exhaust port, 221-adsorption channel, 222-heat sink, 321-first pressure regulating valve, 331-intake flow meter, 332-intake switch, 333-exhaust switch, 334-exhaust flow meter, 341-first vacuum switch, 342-vacuum flow meter, 343-vacuum generator, 344-second pressure regulating valve, 371-cylinder, 372-second vacuum switch, 381-AC power supply, 382-switching power supply. DETAILED DESCRIPTION

[0061] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0062] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "up", "down", "left", "right", "front", "back", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0063] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or some of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may further include other features.

[0064] Unless otherwise clearly defined and limited, the terms "connection", "installation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. A person skilled in the art should be able to understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0065] Unless otherwise defined, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0066] Figure 1 is a schematic structural diagram of a test device 100 for chip offline testing and self-testing of a test fixture 20 according to an embodiment of the present invention, Figure 2 yes Figure 1 The schematic structural diagram of the functional integration device 30 of the test equipment 100 is shown. Figure 3 yes Figure 2 The schematic structural diagram of the function integration device 30 is shown in FIG. Figure 4 yes Figure 1 The schematic structural diagram of the mounting plate 11 of the test machine 10 in the test equipment 100 is shown. Figure 5 yes Figure 1 The schematic structural diagram of the first fixture 21 of the test fixture 20 is shown. Figure 6 yes Figure 1 FIG. 2 is a schematic structural diagram of the second fixture 22 of the test fixture 20. Figures 1 to 6As shown, in a specific embodiment, the test equipment 100 for chip offline testing and chip test fixture 20 self-test includes a test machine 10, at least one test fixture 20 and a functional integration device 30. Among them, the test machine 10 includes a mounting plate 11 located on the top thereof, and the mounting plate 11 has at least one air inlet channel and at least one exhaust channel. The test fixture 20 is mounted on the mounting plate 11, and each test fixture 20 has a test cavity connected to the air inlet channel and the exhaust channel, and the chip 200 under test is placed in the test cavity. The functional integration device 30 is installed above the test machine 10, and includes a gas detection component 33 connected to the air inlet channel and the exhaust channel. The gas detection component 33 is used to deliver protective gas to the test cavity, and detect the air intake and exhaust volume of the test fixture 20, so as to judge whether the leakage of the test fixture 20 is qualified according to the air intake and exhaust volume. Here, the actual leakage of the test fixture 20 is first calculated based on the air intake and exhaust volume of the test fixture 20, and then the actual leakage is compared with the preset leakage. If the actual leakage is less than or equal to the preset leakage, it means that the leakage of the test fixture 20 is qualified and there is no quality problem with the test fixture 20. If the actual leakage is greater than the preset leakage, it means that the leakage of the test fixture 20 is unqualified and there is a quality problem with the test fixture 20. In this embodiment, the preset leakage is 0.04L / min. In other embodiments, the preset leakage can be determined according to specific design requirements.

[0067] This embodiment adds a function integration device 30 to the test machine 10 of the existing chip offline test equipment 100, which is equivalent to integrating the functions of offline detection of chip electrical performance and detection of the quality of the test fixture 20 on the same device, so that the test equipment 100 for chip offline testing and self-test of the test fixture 20 can not only provide protective gas for the test fixture 20 to prevent oxidation and fire during chip testing, but also detect whether the leakage of the test fixture 20 is normal, so that the function of the test equipment 100 is more complete.

[0068] In some embodiments, the protective gas is nitrogen. In other embodiments, the protective gas may also be other gases with protective functions.

[0069] Figure 7 FIG. 1 is a schematic circuit connection diagram of a gas detection component 33 according to an embodiment of the present invention, wherein the solid arrow indicates the inlet flow direction of the protective gas, and the dotted arrow indicates the exhaust flow direction of the test chamber. Figure 7 As shown, and see Figures 1 to 6In some embodiments, the functional integration device 30 includes a protective gas inlet 32, and the gas detection component 33 includes an intake flow meter 331 and an exhaust flow meter 334. One end of the intake flow meter 331 is connected to the protective gas inlet 32, and the other end is connected to the intake channel, and the protective gas flows through the protective gas inlet 32, the intake channel of the intake flow meter 331, and the test chamber in sequence. The exhaust flow meter 334 is connected to the exhaust channel, and the gas in the test chamber flows through the exhaust channel and the exhaust flow meter 334 in sequence. This embodiment first calculates the difference between the intake flow meter 331 and the exhaust flow meter 334, and then determines whether the leakage of the test fixture 20 is qualified based on the difference.

[0070] In some embodiments, the gas detection component 33 further includes an air intake switch 332 and an exhaust switch 333. One end of the air intake switch 332 is connected to the protective gas inlet 32, and the other end is connected to the air intake flow meter 331. One end of the exhaust switch 333 is connected to the exhaust channel, and the other end is connected to the exhaust flow meter 334. In this embodiment, the air intake switch 332 and the exhaust switch 333 can be opened to deliver protective gas to the test chamber of the test fixture 20 and discharge the gas in the test chamber.

[0071] In some embodiments, the function integration device 30 further includes a first pressure regulating valve 321 , one end of the first pressure regulating valve 321 is connected to the protective gas inlet 32 ​​, and the other end of the first pressure regulating valve 321 is connected to the gas inlet switch 332 .

[0072] See also Figure 4 and Figure 7 , the mounting plate 11 has at least one first air inlet 113, at least one second air inlet 111, at least one first exhaust port 114 and at least one second exhaust port 112, each first air inlet 113 is connected with a second air inlet 111 to form an air inlet channel, each first exhaust port 114 is connected with a second exhaust port 112 to form an exhaust channel, the test chamber is connected with the second air inlet 111 and the second exhaust port 112, the first exhaust port 114 is connected with the exhaust switch 333, and the first air inlet 113 is connected with the air inlet flow meter 331. In this embodiment, the mounting plate 11 has a first air inlet 113, a second air inlet 111, a first exhaust port 114 and a second exhaust port 112. That is, the mounting plate 11 has an air inlet channel and an exhaust channel, and a test fixture 20 is installed on the mounting plate 11. In other embodiments, the mounting plate 11 may be configured to have a plurality of first air inlets 113, a plurality of second air inlets 111, a plurality of first exhaust ports 114, and a plurality of second exhaust ports 112. In other words, a plurality of air inlet channels and a plurality of exhaust channels may be provided on the mounting plate 11, so that a plurality of test fixtures 20 may be installed on the mounting plate 11, and the test cavity of each test fixture 20 may be connected to an air inlet channel and an exhaust channel.

[0073] See also Figure 4 and Figure 7 In some embodiments, the first air inlet 113 and the first exhaust port 114 of the mounting plate 11 are respectively provided with gas connectors, and two gas connectors are also installed on the left side of the mounting plate 11, and the two gas connectors are respectively connected to the gas connectors at the first air inlet 113 and the gas connectors at the first exhaust port 114. One of the gas connectors is connected to the air inlet flow meter 331, and the other gas connector is connected to the exhaust switch 333. Here, the air inlet flow meter 331 and the exhaust flow meter 334 detect whether there is a gas leakage problem between the test cavity of the test fixture 20 and the gas connector.

[0074] In some embodiments, the test fixture 20 includes a first fixture 21 and a second fixture 22. The first fixture 21 is mounted on the mounting plate 11. The first fixture 21 is connected to the air inlet channel and the exhaust channel and has a test probe. The second fixture 22 is located above the first fixture 21, and the chip under test 200 is adsorbed on the bottom. The second fixture 22 is configured to cover the first fixture 21 to form a test cavity, and the test probe is in contact with the chip under test 200, so as to perform a functional test on the chip under test 200. In other words, the chip under test 200 is placed from the top of the first fixture 21 to the position of the test probe of the first fixture 21 by adsorption of the second fixture 22.

[0075] See also Figure 6 In some embodiments, a heating component is disposed inside the second fixture 22, and a heat sink 222 is disposed at the bottom of the second fixture 22. The heating component transfers heat to the chip under test 200 through the heat sink 222. In other words, the test fixture 20 has a heating function.

[0076] Figure 8 FIG. 1 is a schematic circuit connection diagram of the adsorption component 34 according to an embodiment of the present invention. Figure 8 As shown, and see Figures 1 to 3 In some embodiments, the second fixture 22 has an adsorption channel 221, and the functional integration device 30 further includes an adsorption component 34 and a compressed gas inlet 31. The adsorption component 34 includes a first vacuum switch 341, a vacuum flow meter 342, and a vacuum generator 343. The first vacuum switch 341 is connected to the compressed gas inlet 31. One end of the vacuum flow meter 342 is connected to the first vacuum switch 341, and the other end is connected to the adsorption channel 221. The compressed gas passes through the compressed gas inlet 31, the first vacuum switch 341, the vacuum flow meter 342, and the adsorption channel 221 in sequence, thereby adsorbing the chip under test 200. One end of the vacuum generator 343 is connected to the power supply, and the other end is connected to the vacuum flow meter 342.

[0077] In some embodiments, the function integration device 30 further includes a second pressure regulating valve 344 , one end of the second pressure regulating valve 344 is connected to the compressed gas inlet 31 , and the other end of the second pressure regulating valve 344 is connected to the first vacuum switch 341 . Figure 8 The right side of the medium vacuum flow meter 342 is connected to the air pipe connector.

[0078] This embodiment can adsorb the chip under test 200 and detect the vacuum leakage when the test fixture 20 adsorbs the chip under test 200 by providing the adsorption component 34, so as to judge whether the quality of the test fixture 20 is qualified. Here, if the vacuum leakage is less than or equal to 0.04L / min, it means that the quality of the test fixture 20 is qualified, and if the vacuum leakage is greater than 0.04L / min, it means that the quality of the test fixture 20 is unqualified.

[0079] See also Figure 2 In some embodiments, the functional integration device 30 includes a housing 36, on which a protective gas inlet 32 ​​is installed, an air intake switch 332 and an air exhaust switch 333 protrude from the outside of the housing 36, and a display area of ​​an air intake flow meter 331 and a display area of ​​an air exhaust flow meter 334 are both located in the mounting hole of the housing 36. The first vacuum switch 341 protrudes from the outside of the housing 36, and a display area of ​​the vacuum flow meter 342 is located in the mounting hole of the housing 36. Specifically, a plurality of mounting holes are provided on the front side of the housing 36, and the air intake switch 332, the air exhaust switch 333, the air intake flow meter 331, the air exhaust flow meter 334, the first vacuum switch 341 and the vacuum flow meter 342 are respectively located at the mounting holes of the housing 36 for installation. The air intake switch 332, the exhaust switch 333 and the first vacuum switch 341 can be directly operated on the front side of the shell 36, and the display areas of the air intake flow meter 331, the exhaust flow meter 334 and the vacuum flow meter 342 can be seen, and the gas flow data can be directly read. The operation is relatively convenient, and the gas flow data can be directly obtained.

[0080] Fig. 9 FIG. 1 is a schematic circuit connection diagram of the pressing component 37 according to an embodiment of the present invention. Fig. 9As shown, in some embodiments, the functional integration device 30 further includes a pressing component 37, and the pressing component 37 includes a second vacuum switch 372 and a cylinder 371, and the second vacuum switch 372 is connected to the compressed gas inlet 31. The cylinder 371 and the second vacuum switch 372, the cylinder 371 is configured to push the second fixture 22 downward when the second vacuum switch 372 is turned on, so that the second fixture 22 is covered with the first fixture 21. Here, the second vacuum switch 372 is connected to the second pressure regulating valve 344. The cylinder 371 has a push rod, and the push rod has at least one first positioning column, and the second fixture 22 is positioned by the first positioning column. In addition, the first fixture 21 has at least one second positioning column, and the second fixture 22 has at least one positioning hole, and the first fixture 21 and the second fixture 22 are covered by the cooperation of the second positioning column and the positioning hole. Fig. 9 On the right side of the middle cylinder 371 is a button, which is connected to the second vacuum switch 372.

[0081] In this embodiment, the first fixture 21 and the second fixture 22 can be compressed by the cylinder 371 and protective gas can be input into the test cavity. When the chip is subjected to functional testing, the test fixture 20 forms a nitrogen sealed cavity to prevent arcing.

[0082] Fig.10 FIG. 3 is a schematic circuit connection diagram of a thermostat 35 according to an embodiment of the present invention. Fig.10 As shown, and see Figures 1 to 3 In some embodiments, a heating component is provided inside the second fixture 22, and the function integration device 30 further includes a temperature controller 35, which is connected to the heating component and is used to detect the heating function of the test fixture 20. Here, the solid-state relay is on the right side of the temperature controller 35.

[0083] In this embodiment, the test equipment 100 for chip offline testing and chip test fixture self-test is equipped with a temperature controller 35, which can detect whether the function of the heating component of the test fixture 20 is normal and perform a function test on the heating component.

[0084] In some embodiments, the functional integration module further includes a switching power supply 382 and an AC power supply 381 , wherein one end of the switching power supply 382 is connected to the AC power supply 381 , and the other end is connected to the temperature controller 35 .

[0085] Fig.11 FIG. 1 is a schematic flow chart of a test method of a test device 100 for chip offline testing and self-testing of a test fixture 20 according to an embodiment of the present invention. Fig.11 As shown, the testing method of the testing device 100 applied to any one of the above embodiments comprises the following steps:

[0086] Step S100, in response to a trigger command for charging, a protective gas is charged into a test cavity of a test fixture 20, wherein a chip under test 200 is placed in the test cavity;

[0087] Step S200, obtaining the air intake and exhaust volume of the test chamber;

[0088] Step S300, calculating the air leakage of the test chamber according to the air intake and exhaust volumes;

[0089] Step S400, judging whether the leakage amount of the test cavity is qualified according to the leakage amount and the preset leakage amount.

[0090] After the protective gas is filled into the test chamber, this embodiment can first calculate the leakage of the test chamber according to the air intake and exhaust volumes of the test chamber, and then compare the leakage with the preset leakage volume to determine whether the leakage of the test chamber is qualified. The performance of the test fixture 20 can be detected, making the function of the test equipment 100 more complete.

[0091] Fig.12 FIG. 1 is a schematic flow chart of a test method of a test device 100 for chip offline testing and self-testing of a test fixture 20 according to another embodiment of the present invention. Fig.12 As shown, in some embodiments, the test fixture 20 includes a first fixture 21 and a second fixture 22, and the following steps are also included before step S100:

[0092] Step S10, when the chip under test 200 is located below the second fixture 22, the compressed gas inlet 31 is controlled to be opened to deliver compressed gas to the adsorption channel 221 of the second fixture 22, so as to adsorb the chip under test 200, and the test fixture 20 includes the second fixture 22;

[0093] Step S20 , in response to the closing instruction of the test fixture 20 , the cylinder 371 is controlled to drive the second fixture 22 to move downward so as to close with the first fixture 21 to form a test cavity.

[0094] In some embodiments, step S400 further includes the following steps:

[0095] Step S500, after determining that the gas leakage of the test chamber is qualified, controlling the heating component inside the second fixture 22 to heat the chip under test 200, so as to perform a high temperature test on the chip under test 200;

[0096] Step S600, obtaining the actual temperature of the test fixture 20, and comparing the actual temperature with the control temperature of the heating component, so as to determine whether the heating function of the test fixture 20 is normal according to the comparison result. Here, if the actual temperature of the test fixture 20 is higher or lower than the preset range of the control temperature, it means that there is an abnormality in the heating function of the test fixture 20. If the actual temperature of the test fixture 20 is within the preset range of the control temperature, it means that the heating function of the test fixture 20 is normal.

[0097] This embodiment adopts the above-mentioned testing method to test the leakage amount and heating components of the test fixture 20, and can detect the quality of the test fixture 20. When the quality of the test fixture 20 is unqualified, it can be replaced in time to avoid affecting the chip test.

[0098] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived based on the content disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all these other variations or modifications.

Claims

1. A test device for chip offline testing and test fixture self-test, characterized in that: include: A test machine including a mounting plate located on a top portion thereof, the mounting plate having at least one air inlet passage and at least one air exhaust passage; At least one test fixture, mounted on the mounting plate, each of the test fixtures having a test cavity connected to the air inlet channel and the exhaust channel, wherein a chip to be tested is placed in the test cavity; A functional integration device is installed above the test machine and includes a gas detection component connected to the air inlet channel and the exhaust channel, the gas detection component is used to deliver protective gas to the test chamber and detect the air intake and exhaust volume of the test fixture, so as to judge whether the leakage amount of the test fixture is qualified according to the air intake and exhaust volume.

2. The test device according to claim 1, characterized in that The functional integration device comprises a protective gas inlet, and the gas detection component comprises: An air intake flow meter, one end of which is connected to the protective gas inlet, and the other end of which is connected to the air intake channel, and the protective gas flows through the protective gas inlet, the air intake channel of the air intake flow meter and the test chamber in sequence; An exhaust flow meter is connected to the exhaust channel, and the gas in the test chamber flows through the exhaust channel and the exhaust flow meter in sequence.

3. The testing device according to claim 2, characterized in that The gas detection component also includes: An air inlet switch, one end of which is connected to the protective gas inlet, and the other end of which is connected to the air inlet flow meter; An exhaust switch has one end connected to the exhaust passage and the other end connected to the exhaust flow meter.

4. The testing device according to claim 3, characterized in that The mounting plate has at least one first air inlet, at least one second air inlet, at least one first exhaust port and at least one second exhaust port, each of the first air inlet is connected with one of the second air inlet to form an air inlet channel, each of the first exhaust port is connected with one of the second exhaust ports to form an exhaust channel, the test chamber is connected with the second air inlet and the second exhaust port, the first exhaust port is connected with the exhaust switch, and the first air inlet is connected with the air inlet flow meter.

5. The testing device according to any one of claims 1 to 4, characterized in that: The test fixture includes: A first fixture, mounted on the mounting plate, the first fixture being in communication with the intake passage and the exhaust passage and having a test probe; The second fixture is located above the first fixture, and the chip under test is adsorbed on the bottom. The second fixture is configured to cover the first fixture to form the test cavity, and the test probe is in contact with the chip under test, so as to perform a functional test on the chip under test.

6. The testing device according to claim 5, characterized in that The second fixture has an adsorption channel, and the functional integration device also includes an adsorption component and a compressed gas inlet, and the adsorption component includes: a first vacuum switch connected to the compressed gas inlet; A vacuum flow meter, one end of which is connected to the first vacuum switch, and the other end of which is connected to the adsorption channel, wherein the compressed gas passes through the compressed gas inlet, the first vacuum switch, the vacuum flow meter and the adsorption channel in sequence, thereby adsorbing the chip under test; The vacuum generator has one end connected to the power supply and the other end connected to the vacuum flow meter.

7. The testing device according to claim 6, characterized in that The functional integration device comprises: A housing, on which the protective gas inlet is mounted, the air intake switch and the exhaust switch protrude to the outside of the housing, and the display area of ​​the air intake flow meter and the display area of ​​the exhaust flow meter are both located at the mounting hole of the housing; The first vacuum switch protrudes to the outside of the shell, and the display area of ​​the vacuum flow meter is located at the mounting hole of the shell.

8. The testing device according to claim 6, characterized in that The functional integration device further includes a pressing component, and the pressing component includes: a second vacuum switch connected to the compressed gas inlet; A cylinder and the second vacuum switch, wherein the cylinder is configured to push the second jig downward when the second vacuum switch is turned on, so that the second jig is covered with the first jig.

9. The testing device according to claim 5, characterized in that A heating component is provided inside the second fixture, and the functional integration device further comprises: A temperature controller is connected to the heating component and is used to detect the heating function of the test fixture.

10. A testing method applied to the testing device according to any one of claims 1 to 9, characterized in that: The steps include: In response to a trigger instruction for charging, a protective gas is charged into a test cavity of a test fixture, wherein a chip under test is placed in the test cavity; Obtaining the air intake and exhaust volume of the test chamber; Calculating the air leakage of the test chamber according to the air intake volume and the exhaust volume; Whether the leakage amount of the test cavity is qualified is judged according to the leakage amount and the preset leakage amount.

11. The testing method according to claim 10, characterized in that: The test fixture comprises a first fixture and a second fixture, and in response to a trigger instruction of filling gas, a step of filling a test cavity of the test fixture with protective gas, and before that, the step further comprises the following steps: When the chip under test is located below the second fixture, controlling the compressed gas inlet to open, so as to deliver compressed gas to the adsorption channel of the second fixture, thereby adsorbing the chip under test; In response to a closing instruction of the test fixture, the cylinder is controlled to drive the second fixture to move downward so as to close with the first fixture to form the test cavity.

12. The testing method according to claim 11, characterized in that: The step of judging whether the leakage volume of the test chamber is qualified according to the leakage volume and the preset leakage volume, and then further comprising the following steps: After determining that the gas leakage of the test cavity is qualified, controlling the heating component inside the second fixture to heat the chip under test, so as to perform a high temperature test on the chip under test; The actual temperature of the test fixture is obtained, and the actual temperature is compared with the control temperature of the heating component to determine whether the heating function of the test fixture is normal according to the comparison result.

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