Method for observing center accessory mark of wafer

Abstract

The invention discloses a method for observing a mark of a center accessory of a wafer, and relates to the technical field of wafer processing. S1, a mark on the wafer is reflected to a reflective mirror through a light through hole, the reflective mirror reflects light to a left objective lens, and a mark on the right side of a Y-axis area of the wafer can be observed; s2, when an electric push rod in a left objective lens runs, a movable end in the electric push rod moves to drive a convex block to move, the convex block applies extrusion force to drive an extrusion plate to move downwards, the extrusion plate applies extrusion force to drive a reset spring and push a sliding piece on a sliding rheostat to move, and the sliding rheostat controls a warning lamp to run; reminding the angle of the reflector to be adjusted to the position; reflectors or reflecting prisms are arranged in the left objective lens and the right objective lens, so that light rays can be reflected by the reflectors, enter the objective lenses and are observed. Therefore, the left objective lens and the right objective lens can simultaneously observe the mark in the blind area without crossing the Y axis of the wafer.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, in particular to a method for observing a wafer center peripheral mark. Background Art

[0002] Since the left and right alignment systems move as a whole, no matter which side of the wafer Y axis is moved to, the objective lens on that side will be moved further, and the mark on that side in the "blind area" cannot be observed, and can only be observed through the objective lens on the opposite side; if the mark on the other side of the "blind area" needs to be observed, it needs to be moved to the opposite side as a whole, and then observed through the objective lens on this side. This solution cannot observe the marks on the left and right sides of the "blind area" at the same time, and the overall back and forth movement takes a lot of time. Summary of the invention

[0003] Therefore, in order to solve the above-mentioned shortcomings, the present invention provides a method for observing a mark near the center of a wafer.

[0004] The present invention is implemented by constructing a method for observing a wafer center adjacent mark, comprising the following steps:

[0005] S1: The mark on the wafer is reflected onto the reflector through the light hole, and the reflector reflects the light onto the left objective lens, and the mark on the right side of the wafer Y-axis area can be observed;

[0006] S2: When the electric push rod in the left objective lens is running, the moving end in the electric push rod moves and drives the convex block to move. The convex block exerts a squeezing force to drive the squeezing plate to move downward. The squeezing plate exerts a squeezing force to drive the reset spring and push the slider on the sliding rheostat to move, so that the sliding rheostat controls the warning light to operate, reminding the mirror to adjust its angle to the position;

[0007] S3: The elasticity of the multiple sets of electromagnetic springs in the receiving plate can be controlled during operation, that is, the elastic force applied to the receiving plate can be controlled, so that the receiving plate can be fine-tuned in the connecting plate, and the angle of the reflector can be fine-tuned through the receiving plate.

[0008] Preferably, a reflector is provided inside the left objective lens and the right objective lens, and a light hole is provided below the left objective lens and the right objective lens.

[0009] Preferably, the right objective lens has the same structure as the left objective lens.

[0010] Preferably, the reflector is rotatably connected to the left objective lens via a rotating shaft, and the other end of the reflector is rotatably connected to a receiving plate, and a plurality of groups of electromagnetic springs are fixedly connected to the outer peripheral wall of the receiving plate.

[0011] Preferably, the other end of the electromagnetic spring is fixedly connected to a connecting disk, the surface of the connecting disk is rotatably connected to the electric push rod, and the other end of the electric push rod is rotatably connected to the left objective lens.

[0012] Preferably, a protrusion is fixedly connected to the side wall of the movable end of the electric push rod, and an extrusion plate is slidably connected to the inner side wall of the electric push rod, and the extrusion plate is fixedly connected to the return spring through a sliding rod.

[0013] Preferably, the return spring is fixedly connected in the electric push rod, a sliding rheostat is fixedly connected in the electric push rod below the sliding rod, and the sliding piece on the sliding rheostat is fixedly connected to the sliding rod.

[0014] Preferably, a warning light is provided on the left objective lens, and the warning light is connected to the sliding rheostat via a cable.

[0015] Preferably, the reflector is fixedly connected to the left objective lens, and a reflective prism is fixedly connected below the light hole.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] (1) Both the left and right objective lenses are provided with reflectors or reflective prisms, so that light can be reflected by the reflectors, enter the objective lenses and be observed; so that the left and right objective lenses can simultaneously observe the marks in the "blind area" without crossing the Y axis of the wafer.

[0018] (2) When the electric push rod is running, its moving end will drive the bump and the extrusion plate to move, and then push the slider on the sliding rheostat to move, thereby controlling the operating status of the warning light connected to it; the function of the warning light is to give a prompt when the angle of the reflector is adjusted to the right position to ensure the accuracy of observation.

[0019] (3) By controlling the elasticity of the electromagnetic spring during operation, that is, controlling the elastic force applied to the receiving plate, the angle of the reflector can be finely adjusted to meet the needs of high-precision observation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic diagram of the planar structure of the first embodiment of the present invention;

[0021] Figure 2 It is a schematic diagram of the connection structure between the electric push rod and the reflector of the present invention;

[0022] Figure 3 It is a schematic diagram of the electric push rod structure of the present invention;

[0023] Figure 4 It is a schematic diagram of the internal structure of the electric push rod of the present invention;

[0024] Figure 5 It is a schematic diagram of the plan structure of the second embodiment of the present invention.

[0025] Among them: wafer-1, mark-2, left objective lens-3, rotating shaft-4, reflector-5, light hole-6, right objective lens-7, electric push rod-8, bump-9, extrusion plate-10, sliding rod-11, reset spring-12, sliding rheostat-13, reflecting prism-14, connecting plate-41, electromagnetic spring-42, receiving plate-43. DETAILED DESCRIPTION

[0026] The following will be combined with the attached Figure 1-Figure 5 The present invention is described in detail, and the technical solutions in the embodiments of the present invention are made clear. The complete description is obvious. The described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a component centered. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a component centered. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a component centered. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0029] Embodiment 1;

[0030] See also Figures 1 to 4 A method for observing a wafer center accessory mark of the present invention comprises a reflector 5 provided inside a left objective lens 3 and a right objective lens 7, and a light hole 6 is provided below the left objective lens 3 and the right objective lens 7; the reflector 5 is rotatably connected to the left objective lens 3 through a rotating shaft 4, and the left objective lens 3 can be driven to move by an external moving mechanism, and the other end of the reflector 5 is rotatably connected to a receiving plate 43, and a plurality of groups of electromagnetic springs 42 are fixedly connected to the outer peripheral wall of the receiving plate 43, and the other end of the electromagnetic spring 42 is fixedly connected to a connecting plate 41, and the surface of the connecting plate 41 is rotatably connected to an electric push rod 8, and the other end of the electric push rod 8 is rotatably connected to the left objective lens 3.

[0031] Specifically, a protrusion 9 is fixedly connected to the side wall of the moving end of the electric push rod 8, and a pressing plate 10 is slidably connected to the inner wall of the electric push rod 8. The pressing plate 10 is fixedly connected to a return spring 12 through a sliding rod 11. The return spring 12 is fixedly connected in the electric push rod 8. A sliding rheostat 13 is fixedly connected below the sliding rod 11 in the electric push rod 8. The sliding sheet on the sliding rheostat 13 is fixedly connected to the sliding rod 11.

[0032] Specifically, a warning light is provided on the left objective lens 3, and the warning light is connected to the sliding rheostat 13 via a cable;

[0033] Specifically, the right objective lens 7 has the same structure as the left objective lens 3 .

[0034] Specifically, the mark on the wafer is reflected onto the reflector 5 through the light hole 6, and the reflector 5 reflects the light onto the left objective lens 3, and the mark on the right side of the Y-axis area of ​​the wafer can be observed.

[0035] Specifically, when the electric push rod 8 is controlled to operate, the moving end inside the electric push rod 8 moves, driving the protrusion 9 to move. The protrusion 9 applies an extrusion force to drive the extrusion plate 10 to move downward. The extrusion plate 10 applies an extrusion force to drive the return spring 12 and push the slider on the sliding rheostat 13 to move, so that the sliding rheostat 13 controls the operation of the warning light to remind the reflector 5 to adjust the angle to the position.

[0036] Specifically, the elasticity of the multiple groups of electromagnetic springs 42 in the receiving plate 43 during operation can be controlled, that is, the elastic force applied to the receiving plate 43 can be controlled, so that the receiving plate 43 can be fine-tuned in the connecting plate 41, and the receiving plate 43 can be used to drive the reflector 5 to be fine-tuned in angle.

[0037] Embodiment 2:

[0038] See also Figure 5 Compared with the first embodiment, the present invention is a method for observing the center accessory mark of a wafer. The present embodiment further includes: a reflector 5 is provided inside the left objective lens 3 and the right objective lens 7, and a light hole 6 is provided below the left objective lens 3 and the right objective lens 7; the reflector 5 is fixedly connected to the left objective lens 3, and a reflective prism 14 is fixedly connected below the light hole 6, and the light on the surface of the wafer is reflected by the reflective prism 14, and the mark 2 near the Y axis of the wafer can be checked.

[0039] The above shows and describes the basic principle, main features and advantages of the present invention, and the standard parts used in the present invention can be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt mature conventional means such as bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0040] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for observing a wafer center adjacent mark, characterized in that: The steps include: S1: The mark on the wafer is reflected onto the reflector through the light hole, and the reflector reflects the light onto the left objective lens, and the mark on the right side of the wafer Y-axis area can be observed; S2: When the electric push rod in the left objective lens is running, the moving end in the electric push rod moves and drives the convex block to move. The convex block exerts a squeezing force to drive the squeezing plate to move downward. The squeezing plate exerts a squeezing force to drive the reset spring and push the slider on the sliding rheostat to move, so that the sliding rheostat controls the warning light to operate, reminding the mirror to adjust its angle to the position; S3: The elasticity of the multiple sets of electromagnetic springs in the receiving plate can be controlled during operation, that is, the elastic force applied to the receiving plate can be controlled, so that the receiving plate can be fine-tuned in the connecting plate, and the angle of the reflector can be fine-tuned through the receiving plate.

2. A structure for observing a wafer center adjacent mark, used to implement a method for observing a wafer center adjacent mark as claimed in claim 1, characterized in that: A reflecting mirror is arranged inside the left objective lens and the right objective lens, and a light hole is arranged below the left objective lens and the right objective lens.

3. The structure for observing wafer center adjacent marks according to claim 2, characterized in that: The structure of the right objective lens is the same as that of the left objective lens.

4. The structure for observing wafer center adjacent marks according to claim 2, characterized in that: The reflecting mirror is rotatably connected with the left objective lens through a rotating shaft, and the other end of the reflecting mirror is rotatably connected with a receiving plate, and a plurality of groups of electromagnetic springs are fixedly connected to the outer peripheral wall of the receiving plate.

5. The structure for observing wafer center adjacent marks according to claim 4, characterized in that: The other end of the electromagnetic spring is fixedly connected with a connecting disk, the surface of the connecting disk is rotationally connected to the electric push rod, and the other end of the electric push rod is rotationally connected to the left objective lens.

6. The structure for observing wafer center adjacent marks according to claim 5, characterized in that: A convex block is fixedly connected to the side wall of the moving end of the electric push rod, and a pressing plate is slidably connected to the inner side wall of the electric push rod. The pressing plate is fixedly connected to the return spring through a sliding rod.

7. The structure for observing wafer center adjacent marks according to claim 6, characterized in that: The return spring is fixedly connected in the electric push rod, a sliding rheostat is fixedly connected below the sliding rod in the electric push rod, and a sliding piece on the sliding rheostat is fixedly connected to the sliding rod.

8. The structure for observing wafer center adjacent marks according to claim 7, characterized in that: A warning light is arranged on the left objective lens, and the warning light is connected to the sliding rheostat through a cable.

9. The structure for observing wafer center proximity marks according to claim 2, characterized in that: The reflector is fixedly connected to the left objective lens, and a reflective prism is fixedly connected below the light hole.

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