Adsorption assembly and photoetching device with same

Abstract

The invention discloses an adsorption assembly and a photoetching device with the same, the adsorption assembly comprises a suction cup body, a first adsorption piece, a second adsorption piece and a third adsorption piece, and the suction cup body is provided with a photoetching space; the first adsorption piece is fixedly connected to the suction cup body; the second adsorption piece is fixedly connected to the suction cup body; the third adsorption part is fixedly connected to the suction cup body, the third adsorption part, the first adsorption part and the second adsorption part are arranged on the outer side of the photoetching space at intervals, and the first adsorption part, the second adsorption part and the third adsorption part can all adsorb a mask plate. The first adsorption piece, the second adsorption piece and the third adsorption piece are arranged on the adsorption assembly, so that the first adsorption piece, the second adsorption piece and the third adsorption piece can support and adsorb the mask plate, the mask plate can well act a mask pattern on a circuit board in the using process, the precision and quality of the exposure process are improved, and the exposure efficiency is improved. Therefore, the exposure effect of the circuit board is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of adsorption devices, and in particular to an adsorption assembly and a photolithography device having the same. Background Art

[0002] Photomask, also known as photomask, photomask, photolithography mask, etc., is one of the key components in the photolithography process. As a carrier of information such as graphic design and process technology, the performance of the mask directly determines the quality of the photolithography process in the manufacturing process of downstream industry products. The exposure of the graphics on the IC mask needs to be carried out under the IOS Class 1 clean level to avoid contamination of the upper and lower surfaces of the mask by microparticles, ensure its high light transmittance, reduce the distortion of its layout graphics, and thus ensure the uniformity of the entire line during the exposure process.

[0003] At present, conventional plate-making exposure carriers have structural forms such as whole-plate support adsorption, edge support adsorption, multi-point support adsorption and side clamping. The whole-plate support adsorption suction cup and multi-point support adsorption will contact the bottom of the mask, which is easy to cause particle contamination or scratches on the surface of the mask. The edge support adsorption suction cup can effectively avoid the graphic bearing area on the mask, but its large-area contact with the mask is not conducive to the horizontality and flatness of the exposure surface, and there is also a scratch on the bottom of the mask. Patent CN220050478U discloses a mask carrier suitable for multi-size masks, which mainly includes a base, an embedded groove, a clamping mechanism, etc., which can realize simple loading and unloading and locking of the mask, but its positioning accuracy is low and the structure is not convenient for manipulator handling.

[0004] The invention provides a three-point adsorption stage used in mask manufacturing, aiming to solve the problems of support and adsorption fixation in the process of high-precision mask pattern exposure. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the present invention is to provide an adsorption assembly, wherein the adsorption assembly has a plurality of adsorption members, and since the plurality of adsorption members are arranged outside the photolithography space, the adsorption members can support and adsorb the mask plate while avoiding the influence on the photolithography use of the mask plate, so as to improve the accuracy and quality of the mask plate during use.

[0006] Another object of the present invention is to provide a photolithography device, in which the adsorption assembly as shown above is provided.

[0007] According to an embodiment of the present invention, the adsorption assembly includes: a suction cup body, a first adsorption component, a second adsorption component and a third adsorption component, wherein a photolithography space is provided on the suction cup body; the first adsorption component is fixedly connected to the suction cup body; the second adsorption component is fixedly connected to the suction cup body; the third adsorption component is fixedly connected to the suction cup body, and the third adsorption component and the first adsorption component and the second adsorption component are spaced apart from each other on the outside of the photolithography space, and the first adsorption component, the second adsorption component and the third adsorption component can all adsorb the mask plate.

[0008] According to the adsorption assembly of the embodiment of the present invention, by providing the first adsorption member, the second adsorption member and the third adsorption member on the adsorption assembly, the first adsorption member, the second adsorption member and the third adsorption member can support and adsorb the mask plate, so that the mask plate can better apply the mask pattern to the circuit board during use, improve the accuracy and quality of the exposure process, and thus improve the exposure effect of the circuit board. In addition, since the first adsorption member, the second adsorption member and the third adsorption member are arranged outside the photolithography space, when the first adsorption member, the second adsorption member and the third adsorption member adsorb and support the mask plate, the influence of the mask pattern on the process of applying the mask pattern to the circuit board is relatively low, so that the mask plate can etch the circuit board more accurately and reliably during use, and improve the exposure effect and exposure quality of the circuit board.

[0009] In some embodiments, the first adsorption component, the second adsorption component and the third adsorption component all include: an adsorption part, an adsorption air pipe and an extraction fan, the adsorption part is an adsorption screw, and the suction cup screw is arranged on the suction cup body; the adsorption air pipe is arranged on the side of the suction cup body away from the adsorption part, and the adsorption air pipe is connected to the adsorption air pipe; the extraction fan is connected to one end of the adsorption air pipe, and the extraction fan is used to provide adsorption effect, and the adsorption effect acts on the adsorption part through the adsorption air pipe.

[0010] In some embodiments, the first adsorption component, the second adsorption component and the third adsorption component further include: a supporting boss, a mounting hole is provided on the suction cup body, the supporting boss is arranged in the mounting hole, and a mounting groove is provided on the supporting boss, and the adsorption part is arranged in the supporting boss.

[0011] In some embodiments, the first adsorption member, the second adsorption member and the third adsorption member further include: a sealing portion, wherein the sealing portion is disposed on the adsorption portion and the sealing portion is disposed on the outside of the adsorption air pipe, and the adsorption effect in the adsorption air pipe is transmitted to the mask plate through the sealing portion.

[0012] In some embodiments, it also includes: an interferometer component, the interferometer component includes: a first interferometer reflector group and a second interferometer reflector group, the first interferometer reflector group is arranged at one end of the suction cup body, the second interferometer reflector group is arranged at one side of the suction cup body, and the second interferometer reflector group and the first interferometer reflector group are arranged at intervals.

[0013] In some embodiments, the first interferometer mirror group and the second interferometer mirror group both include an interferometer mirror and a base, the base is connected to the side of the suction cup body, the interferometer mirror is carried on the base, and the output end of the interferometer mirror faces the center of the suction cup body.

[0014] In some embodiments, it also includes: a camera and an energy probe, wherein the energy probe is arranged on the other side of the suction cup body, and the camera is arranged on the other side of the suction cup body and the camera and the energy probe are arranged at an interval.

[0015] In some embodiments, it further includes: a substrate positioning plate, on which a positioning groove is provided, and the mask plate is positioned and restricted by the positioning groove.

[0016] In some embodiments, the device further includes: a detector, wherein the detector is disposed on the other side of the suction cup body and faces the mask plate.

[0017] A lithography apparatus according to an embodiment of the present invention includes: the adsorption assembly as described above.

[0018] According to the lithography device of the embodiment of the present invention, an adsorption component as shown above is provided in the lithography device, and the first adsorption component, the second adsorption component and the third adsorption component are provided on the adsorption assembly so that the first adsorption component, the second adsorption component and the third adsorption component can support and adsorb the mask plate, so that the mask plate can better apply the mask pattern to the circuit board during use, improve the accuracy and quality of the exposure process, and thus improve the exposure effect of the circuit board. In addition, since the first adsorption component, the second adsorption component and the third adsorption component are arranged outside the lithography space, when the first adsorption component, the second adsorption component and the third adsorption component adsorb and support the mask plate, the influence of the mask pattern on the process of applying the mask pattern to the circuit board is relatively low, so that the mask plate can etch the circuit board more accurately and reliably during use, and improve the exposure effect and exposure quality of the circuit board.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 is a schematic structural diagram of an adsorption assembly according to an embodiment of the present invention; Figure 2 is a schematic structural diagram of an adsorption assembly according to an embodiment of the present invention; Figure 3 yes Figure 2 The structural diagram of part A in the figure; Figure 4 is a schematic structural diagram of an adsorption assembly according to an embodiment of the present invention; Reference numerals: Adsorption assembly 10, Suction cup body 100, The first adsorption member 210, the second adsorption member 220, the third adsorption member 230, the adsorption portion 240, the adsorption air pipe 250, the supporting boss 260, the sealing portion 270, Interferometer assembly 300, first interferometer reflector set 310, second interferometer reflector set 320, interferometer reflector 330, base 340, Camera 410 , energy probe 420 , substrate positioning plate 430 , positioning groove 431 , detector 440 . DETAILED DESCRIPTION

[0021] Embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. Embodiments of the present invention are described in detail below.

[0022] Reference below Figure 1-Figure 4 The adsorption assembly 10 according to the embodiment of the present invention includes a suction cup body 100 , a first adsorption component 210 , a second adsorption component 220 and a third adsorption component 230 .

[0023] Specifically, a photolithography space is provided on the suction cup body 100; the first suction component 210 is fixedly connected to the suction cup body 100; the second suction component 220 is fixedly connected to the suction cup body 100; the third suction component 230 is fixedly connected to the suction cup body 100, and the third suction component 230 and the first suction component 210 and the second suction component 220 are spaced apart from each other on the outside of the photolithography space, and the first suction component 210, the second suction component 220 and the third suction component 210 can all adsorb the mask plate.

[0024] It is understandable that, during the use of the suction assembly 10, the mask plate is suitable for being placed on the suction cup body 100, so that the photolithography device can expose the mask plate, and then the mask pattern on the mask plate is exposed to the circuit board to achieve exposure processing. Specifically, a photolithography space is formed on the suction cup body 100, and the mask plate is suitable for shielding one side of the photolithography space, the mask pattern on the mask plate is suitable for acting in the photolithography space, and the circuit board is suitable for being carried in the photolithography space so that the mask pattern is suitable for acting on the circuit board to achieve exposure processing of the circuit board.

[0025] The suction cup body 100 is also suitable for constructing a first adsorbent 210, a second adsorbent 220 and a third adsorbent 230. Since the first adsorbent 210, the second adsorbent 220 and the third adsorbent 230 are arranged at intervals outside the photolithography space, the influence of the first adsorbent 210, the second adsorbent 220 and the third adsorbent 230 on the photolithography space is reduced, so that the performance of the mask plate during use can better act on the circuit board to improve the exposure effect of the circuit board. At the same time, the influence of the adsorbent on the mask plate during use can be avoided, so that the mask plate has more accurate and reliable performance during use.

[0026] In addition, the first adsorbent 210, the second adsorbent 220 and the third adsorbent 230 can also provide an adsorption function to adsorb and support the mask plate, so that the position of the mask plate on the adsorption assembly 10 is more reliable, thereby improving the exposure effect accuracy and quality of the mask plate. At the same time, the first adsorbent 210, the second adsorbent 220 and the third adsorbent 230 are also suitable for adsorption restriction, so that the position of the mask plate on the adsorption assembly 10 is limited, so that the reliability of the adsorption assembly 10 is improved.

[0027] In addition, the first adsorption member 210, the second adsorption member 220 and the third adsorption member 230 are used to restrict the adsorption of the mask plate, so that the adsorption assembly 10 has higher usability and can restrict the adsorption of mask plates of various sizes, so that the adsorption assembly has higher applicability in subsequent use.

[0028] According to the adsorption assembly of the embodiment of the present invention, by providing the first adsorption member 210, the second adsorption member 220 and the third adsorption member 230 on the adsorption assembly 10, the first adsorption member 210, the second adsorption member 220 and the third adsorption member 230 can support and adsorb the mask plate, so that the mask plate can better apply the mask pattern to the circuit board during use, improve the accuracy and quality of the exposure process, and thus improve the exposure effect of the circuit board. In addition, since the first adsorption member 210, the second adsorption member 220 and the third adsorption member 230 are arranged outside the photolithography space, the first adsorption member 210, the second adsorption member 220 and the third adsorption member 230 have a relatively low impact on the process of the mask pattern acting on the circuit board when adsorbing and supporting the mask plate, so that the mask plate can etch the circuit board more accurately and reliably during use, and improve the exposure effect and exposure quality of the circuit board.

[0029] In some embodiments, the first adsorption component 210, the second adsorption component 220 and the third adsorption component 230 all include: an adsorption portion 240, an adsorption air pipe 250 and an extraction fan, the adsorption portion 240 is an adsorption screw, and the suction cup screw is arranged on the suction cup body 100; the adsorption air pipe 250 is arranged on the side of the suction cup body 100 away from the adsorption portion 240, and the adsorption air pipe 250 and the adsorption air pipe 250 are connected; the extraction fan is connected to one end of the adsorption air pipe 250, and the extraction fan is used to provide adsorption, and the adsorption effect acts on the adsorption portion 240 through the adsorption air pipe 250.

[0030] In this way, during the setting process of the first adsorption member 210, the second adsorption member 220 and the third adsorption member 230, it is suitable to include the adsorption part 240, the adsorption air pipe 250 and the extraction fan, and the extraction fan is suitable for providing an extraction effect, so as to be transmitted through the adsorption air pipe 250, and to be led out through the adsorption air pipe 250 provided on the adsorption part 240, so that the adsorption effect can act on the mask plate to achieve adsorption and limiting, so that the mask plate can be adsorbed on the adsorption assembly 10 according to the design. In addition, since the adsorption part 240 provided with the adsorption air pipe 250 is used as the actuator of the first adsorption member 210, the second adsorption member 220 and the third adsorption member 230 during use, the adsorption part 24 can be set as an adsorption screw to reduce the contact area between the adsorption part and the mask plate, so that the influence of the adsorption part 240 on the mask plate during the adsorption process is reduced, and scratches on the mask plate are avoided to affect the use of the mask plate, so that the working performance of the mask plate is improved.

[0031] In some embodiments, the first adsorption member 210, the second adsorption member 220 and the third adsorption member 230 further include: a support boss 260, a mounting hole is provided on the suction cup body 100, the support boss 260 is provided in the mounting hole, and a mounting groove is provided on the support boss 260, and the adsorption portion 240 is provided in the support boss. In other words, the mounting hole is suitable for being constructed on the suction cup body 100 to provide a position for the arrangement of the support boss 260, so that the support boss 260 can be arranged in the mounting hole to achieve assembly connection on the suction cup body 100, so that the adsorption portion 240 can be arranged on the support boss 260.

[0032] In some embodiments, the first adsorption member 210, the second adsorption member 220 and the third adsorption member 230 further include: a sealing portion 270, the sealing portion 270 is provided on the adsorption portion 240, and the sealing portion 270 is provided on the outside of the adsorption air pipe 250, and the adsorption effect in the adsorption air pipe 250 is transmitted to the mask plate through the sealing portion 270. In this way, by providing the sealing portion 270 on the adsorption portion 240, the adsorption effect of the adsorption portion 240 can be better acted on the mask plate, so that the adsorption setting of the mask plate on the adsorption assembly 10 can be more reliable. At the same time, the sealing ring 270 can also prevent gas leakage, and the adsorption effect of the adsorption portion 240 can act on the mask plate according to the design to restrict the adsorption of the mask plate. In addition, since the sealing ring 270 is made of rubber material, the sealing ring 270 has a shock-absorbing and buffering effect to avoid rigid contact when adsorbing the mask plate, thereby reducing the influence of the adsorption assembly 10 on the mask plate.

[0033] In some embodiments, the adsorption assembly 10 further includes: an interferometer assembly 300, the interferometer assembly 300 includes: a first interferometer reflector group 310 and a second interferometer reflector group 320, the first interferometer reflector group 310 is arranged at one end of the suction cup body 100, the second interferometer reflector group 320 is arranged at one side of the suction cup body 100, and the second interferometer reflector group 320 and the first interferometer reflector group 310 are arranged at intervals. That is to say, during the construction process of the adsorption assembly 10, it is also suitable to construct the interferometer assembly 300, so that the interferometer assembly 300 can measure the exposure effect on the mask plate, so that the etching effect of the adsorption assembly 10 during use can be more reliably fed back and detected, thereby improving the use performance of the adsorption assembly 10. Specifically, the interferometer assembly 300 includes a first interferometer reflector group 310 and a second interferometer reflector group 320, so that the first interferometer reflector group 310 and the second interferometer reflector group 320 are set in different extension directions of the suction cup body 100, so that the first interferometer reflector group 310 and the second interferometer reflector group 320 can measure from multiple angles, and the detection effect is more accurate. At the same time, it should be emphasized that the interferometer assembly 300 is suitable for integration on the adsorption body 100, so that the interferometer assembly 300 can provide real-time feedback on the movement of the suction cup body 100, and can also eliminate measurement errors in the vertical direction. In this way, during the use of the mask plate, the mask pattern can be applied to the circuit board according to the design, and the quality and accuracy of the exposure effect are improved.

[0034] In some embodiments, the first interferometer reflector group 310 and the second interferometer reflector group 320 both include an interferometer reflector 330 and a base 340, the base 340 is connected to the side of the suction cup body 100, the interferometer reflector 330 is carried on the base 340, and the output end of the interferometer reflector 330 faces the center of the suction cup body 100. It can be understood that the base 340 is suitable for providing a bearing function to carry the interferometer reflector 330, so that the output end of the interferometer reflector 330 faces the suction cup body 100 for detection, so that the use of the interferometer reflector 330 is more accurate and reliable. In addition, since the base 240 is used to carry the interferometer reflector 330, the interferometer reflector 330 and the suction cup body 100 are set independently of each other, avoiding the influence of the assembly error on the measurement when the suction cup body 100 is assembled and used, thereby improving the compatibility of the interferometer reflector 330 when used.

[0035] In some embodiments, the adsorption assembly 10 further includes: a camera 410 and an energy probe 420, the energy probe 420 is disposed on the other side of the suction cup body 100, and the camera 410 is disposed on the other side of the suction cup body 100, and the camera 410 and the energy probe 420 are disposed at intervals. In other words, the energy probe 420 is suitable for detecting the exposure energy of the mask during the exposure process, and the camera 410 is suitable for additionally measuring the exposure effect of the mask after the exposure process is completed. In this way, during the subsequent exposure processing of the adsorption assembly 10, the camera 410 and the energy probe 420 can be used to perform real-time detection and feedback on the exposure effect, so that the user can adjust the exposure performance according to the detection results, so as to improve the performance of the exposure device.

[0036] In some embodiments, the adsorption assembly 10 further includes: a substrate positioning plate 430, on which a positioning groove 431 is provided; and a detector 440, which is provided on the other side of the suction cup body 100, and the detector 440 faces the mask plate. It is understandable that the positioning groove 431 on the substrate positioning plate 430 is suitable for limiting the setting of the mask plate, so that the mask plate can be arranged on the adsorption assembly 10 according to the design for subsequent use, so that the use efficiency of the adsorption assembly 10 is improved. At the same time, a detector 440 is also provided to detect the mask plate, so that the subsequent exposure device can determine whether to carry the mask plate for exposure according to the detection result of the detector, so as to avoid the influence of direct exposure on the lens, and play a role in protecting the lens.

[0037] According to an embodiment of the present invention, the lithography device includes: the adsorption assembly 10 as described above. In this way, the adsorption assembly 10 as described above is provided in the lithography device, and the first adsorption member 210, the second adsorption member 220 and the third adsorption member 230 are provided on the adsorption assembly 10, so that the first adsorption member 210, the second adsorption member 220 and the third adsorption member 230 can support and adsorb the mask plate, so that the mask plate can better apply the mask pattern to the circuit board during use, improve the accuracy and quality of the exposure process, and thus improve the exposure effect of the circuit board. In addition, since the first adsorption member 210, the second adsorption member 220 and the third adsorption member 230 are provided outside the lithography space, the first adsorption member 210, the second adsorption member 220 and the third adsorption member 230 have a relatively low influence on the process of the mask pattern acting on the circuit board when adsorbing and supporting the mask plate, so that the mask plate can etch the circuit board more accurately and reliably during use, and improve the exposure effect and exposure quality of the circuit board.

[0038] Other structures and operations of the lithography apparatus according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0039] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0040] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An adsorption assembly, characterized in that: include: A suction cup body, wherein a photolithography space is provided on the suction cup body; A first adsorption member, wherein the first adsorption member is fixedly connected to the suction cup body; a second adsorption member, the second adsorption member being fixedly connected to the suction cup body; The third adsorbing member is fixedly connected to the suction cup body, and the third adsorbing member and the first adsorbing member and the second adsorbing member are arranged at intervals outside the photolithography space. The first adsorbing member, the second adsorbing member and the third adsorbing member can all adsorb the mask plate.

2. The adsorption assembly according to claim 1, characterized in that: The first adsorption member, the second adsorption member and the third adsorption member each include: An adsorption part, wherein the adsorption part is an adsorption screw, and the suction cup screw is arranged on the suction cup body; An adsorption air pipe, wherein the adsorption air pipe is arranged on a side of the suction cup body away from the adsorption portion, and the adsorption air pipe is connected to the adsorption air pipe; An extraction fan is connected to one end of the adsorption air pipe, and is used to provide an adsorption effect, and the adsorption effect acts on the adsorption part through the adsorption air pipe.

3. The adsorption assembly according to claim 2, characterized in that: The first adsorption member, the second adsorption member and the third adsorption member further include: A supporting boss, a mounting hole is provided on the suction cup body, the supporting boss is arranged in the mounting hole, and a mounting groove is provided on the supporting boss, and the adsorption part is arranged in the supporting boss.

4. The adsorption assembly according to claim 2, characterized in that: The first adsorption member, the second adsorption member and the third adsorption member further include: A sealing part is arranged on the adsorption part, and the sealing part is arranged on the outside of the adsorption air pipe, and the adsorption effect in the adsorption air pipe is transmitted to the mask plate through the sealing part.

5. The adsorption assembly according to claim 1, characterized in that: Also includes: An interferometer component, the interferometer component comprising: a first interferometer reflector group and a second interferometer reflector group, the first interferometer reflector group is arranged at one end of the suction cup body, the second interferometer reflector group is arranged at one side of the suction cup body, and the second interferometer reflector group and the first interferometer reflector group are arranged at intervals.

6. The adsorption assembly according to claim 5, characterized in that: The first interferometer reflector group and the second interferometer reflector group both include: an interferometer reflector and a base, the base is connected to the side of the suction cup body, the interferometer reflector is carried on the base, and the output end of the interferometer reflector faces the center of the suction cup body.

7. The adsorption assembly according to claim 1, characterized in that: Also includes: A camera and an energy probe, wherein the energy probe is arranged on the other side of the suction cup body, and the camera is arranged on the other side of the suction cup body and the camera and the energy probe are arranged at an interval.

8. The adsorption assembly according to claim 1, characterized in that: Also includes: A substrate positioning plate is provided with a positioning groove, and the mask plate is positioned and restricted by the positioning groove.

9. The adsorption assembly according to claim 1, characterized in that: Also includes: A detector is disposed on the other side of the suction cup body and faces the mask plate.

10. A photolithography apparatus, characterized in that: include: An adsorption assembly as claimed in any one of claims 1 to 9.

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