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88results about How to "Improve exposure quality" patented technology

Mask plate, fabrication method thereof and exposure system

The invention provides a mask plate, a fabrication method thereof and an exposure system. The mask plate comprises a first region and a second region, wherein a plurality of patterning masks are arranged in both of the first region and the second region, and the distribution density of the plurality of patterning masks in the first region is smaller than the distribution density of the plurality of patterning masks in the second region; and each patterning mask comprises a first pattern, a second pattern and a slit between the two patterns, and the slit width in the first region is greater than the slit width in the second region. By the mask plate, the intensity of the exposure light ray penetrating through the slit in the second region is reduced relative to the intensity of the exposure light ray penetrating through the slit in the first region, thus, the thickness of a photoresist reserved on an active region film layer tends to consistency after transistors in a display region and a non-display region are exposed and developed through a source and a drain, an active region of the transistor in the non-display region after being subjected to an etching process is further ensured not to be broken, and finally, the transistor in the non-display region can be ensured to normally work.
Owner:BOE TECH GRP CO LTD +1

Exposure system, calibration system, optical engines, exposure method, and production method

The invention discloses an exposure system, a calibration system, optical engines, an exposure method, and a production method. The exposure system comprises a first optical engine, a second optical engine; an optical source system, which can be used to provide exposure light beams to the first optical engine and the second optical engine; a first beam splitting device, which is disposed on a first side, and can be used to split the light beams emitted by the first optical engine and the second optical engine; a first visual system, which is disposed on the first side, and can be used to receive the first light beam going through the first optical engine and reflected by the first light splitting device, and can be used to receive the second light beam going through the second light optical engine and reflected by the first light splitting device; and an optical axis, which can be used to calibrate the first optical engine, and the second optical engine. The exposure system, the calibration system, the optical engine, the exposure method, and the production method provided in the utility model can be used to calibrate the optical axis of each of the optical engines, therefore the exposure quality can be improved.
Owner:ZHONGSHAN AISCENT TECH

Sucker and method for eliminating wafer exposure defocus defects

ActiveCN104064508AReduce and eliminate warping locationsEliminate exposure out-of-focus defectsSemiconductor/solid-state device manufacturingSuction forceEngineering
The invention provides a sucker and method for eliminating wafer exposure defocus defects. The sucker is flat in upper surface and is used for supporting a wafer. The sucker comprises a plurality of vacuum suction holes and a plurality of thermoelectric couples, the vacuum suction holes are densely distributed in the upper surface of the sucker, all parts of the wafer are absorbed into the same plane by the vacuum suction holes, the thermoelectric couples are densely distributed at the bottom of the sucker, the thermoelectric couples and the vacuum suction holes are alternatively arranged, and the thermoelectric couples are used for heating the wafer. By means of the sucker and method, the thermoelectric couples densely distributed at the bottom of the sucker and the vacuum suction holes densely distributed in the upper surface of the sucker are arranged, the upper surface of the sucker is flat, stress in the wafer is slowly released in the heating process, vacuum suction force, acting on the wafer, of the vacuum suction holes enables the wafer to be attached to the flat upper surface of the sucker, buckling deformation defects of the wafer are accordingly reduced, the surface of the wafer is flattened, the defocus defects in the exposure process are further eliminated, and the exposure quality and the product yield are improved.
Owner:SHANGHAI HUALI MICROELECTRONICS CORP

Substrate adsorption device, photoetching equipment and adsorption method

The invention discloses a substrate adsorption device, photoetching equipment and an adsorption method, the adsorption device comprises an adsorption mechanism and a shaping mechanism arranged opposite to the adsorption mechanism, and a substrate accommodating space is formed between the adsorption mechanism and the shaping mechanism; the adsorption mechanism comprises a sucker, a plurality of suction holes are distributed in the surface of the sucker, and the sucker is used for adsorbing the substrate in the substrate accommodating space from the first side; the shaping mechanism is used foracting on the substrate in the substrate containing space from the second side opposite to the first side so as to be matched with the suction cup to level the substrate in the substrate containing space. According to the embodiment of the invention, the shaping mechanism opposite to the adsorption mechanism is arranged; the adsorption mechanism flattens the substrate through cooperation of the suction holes in the sucker, the adsorption substrate sheet, the shaping mechanism and the sucker, so that the substrate is completely adsorbed on the sucker, flattening and complete adsorption of the substrate with the large warping amount are achieved, the exposure quality and yield of the substrate are improved, and the production efficiency is improved.
Owner:SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD

Array substrate, method for manufacturing same and display device

The invention provides an array substrate, a method for manufacturing the same and a display device. The method for manufacturing the array substrate includes forming alignment mark covering layers in certain regions of a corresponding substrate by the aid of picture composition processes; forming a black matrix film in regions outside alignment marks on the substrate; removing the alignment mark covering layers by means of exposure so as to expose the alignment marks; carrying out picture composition processes on the black matrix film to form patterns of black matrixes. The alignment marks are formed in the certain regions of the corresponding substrate. Exposure wavelengths of the alignment mark covering layers are different from exposure wavelengths of the black matrix film. The array substrate, the method and the display device have the advantages that interference of black matrix films with high optical density (the optical density is usually higher than or equal to 4.0) on alignment mark recognizing, grasping and positioning in exposure procedures can be prevented by the aid of the method, the alignment marks can be accurately aligned by the black matrix film during exposure, accordingly, the exposure precision of the black matrixes can be improved, and the exposure quality and the performance of the array substrate can be enhanced.
Owner:BOE TECH GRP CO LTD +1

Method for workpiece platform micro moving part mechanical parameter estimation

The invention mainly relates to a method for workpiece platform micro moving part mechanical parameter estimation, and aims to solve the problem that the installation angle and the centroid position of three horizontal voice coil motors of a photoetching machine workpiece platform micro moving part are hard to accurately measure through a traditional precision instrument. The method comprises the following steps: 1. establishing a transformational relation; 2. establishing a positional relation; 3. carrying out a quadratic derivation on the position relation; 4.obtaining a relational expression of the relative driving force and the torque with the exposure area center acceleration; 5. obtaining a relational expression of the exposure center position and the voice coil motor driving force; 6. setting the actual centroid position and installation angle; 7. obtaining an actual value of L1 to L10 through a plane geometry relation; 8. calculating the actual Q by utilizing the method in step 3; 9. calculating the actual L by utilizing the method in step 1; 10. establishing an error model; 11.listing a displacement difference equation; 12. measuring to obtain [ x't, y't, r'zt, z't, r'xt,r'yt] <T> through an experiment; 13. emulating to obtain [ xt, yt, rzt, zt, rxt,ryt] <T>; 14. solving the equation set to obtain delta x0, delta y0, delta z0, delta theta 1, delta theta 2 and delta theta 3. The invention belongs to the field of super-precision manufacturing.
Owner:HARBIN INST OF TECH

Tool and method for detecting tiny bubbles in immersion flow field of immersion lithography machine

The invention discloses a tool and a method for detecting tiny bubbles in an immersion flow field of an immersion lithography machine, and the tool comprises an immersion flow field maintenance system, a photographing system, and a camera pose adjustment system, and the photographing system comprises a photographing camera, a camera lens, and a photographing light source. The camera pose adjustment system is used for adjusting motion adjustment of the shooting camera in the X-axis, Y-axis or Z-axis direction, and the Z-axis is used for realizing focusing and layered scanning motion of the shooting camera. The photographing light source is arranged above the simulation objective lens and used for providing a backlight source for bubble detection in the immersion flow field, the photographing camera and the camera lens are arranged below the simulation silicon wafer and located below the immersion flow field, and the photographing camera is arranged on the camera pose adjustment system.Image data processing is carried out on the shot images, and the bubble size and position on each image are detected. The global image of the whole flow field at the same moment is more effectively obtained, the phenomenon of bubble loss during detection is reduced or avoided, and the final photoetching exposure quality is improved.
Owner:ZHEJIANG CHEER TECH CO LTD

High-precision full-automatic double-side exposure machine

The invention relates to a high-precision full-automatic double-side exposure machine. The exposure machine comprises a support, an upper frame system, an alignment system, a charging and dischargingsystem, a manipulator system, a visual system, an exposure module, a constant temperature and humidity module and a control system; the support is used to support different modules and systems installed in the exposure machine; the upper frame system is positioned in the frame, and comprises an upper masking plate providing patterns for exposure of an upper surface of a product; the alignment system is provided with a lower masking plate providing patterns for exposure of a lower surface of the product, used to align the upper and lower masking plates accurately, and positioned under the upperframe system; and the charging and discharging system comprises a charging system and a discharging system, and is used to charge and discharge the product automatically. The upper and lower maskingplates are aligned via the alignment system and the visual system, pattern offset during exposure can be prevented, the exposure quality is improved, the alignment can realize adjustment in multiple directions and angles, and the alignment precision is high.
Owner:AMSKY TECHNOLOGY CO LTD

Six-freedom-degree decoupling modeling method of workpiece platform micro-motion part

The invention discloses a six-freedom-degree decoupling modeling method of a workpiece platform micro-motion part, and mainly relates to a six-freedom-degree decoupling modeling method of a photo-etching machine workpiece platform micro-motion part. The six-freedom-degree decoupling modeling method aims to solve the coupling problem of a vertical direction three-freedom-degree motion model of the photo-etching machine workpiece platform micro-motion part and a horizontal direction three-freedom-degree motion model of the photo-etching machine workpiece platform micro-motion part. The six-freedom-degree decoupling modeling method comprises the steps of 1 establishing the conversion relationships between centroid driving force of the workpiece platform micro-motion part and torque of the workpiece platform micro-motion part and driving force of a voice coil motor; 2 establishing the position relationship between an exposure center and the workpiece platform micro-motion part centroid; 3 conducting secondary derivation on the position relationship obtained in the step 2 and ignoring primary derivative items; 4 obtaining the relation between the driving force exerted on the workpiece platform micro-motion part centroid and the torque exerted on the workpiece platform micro-motion part centroid and the acceleration of the exposure area center according to the Newton second law; 5 listing equations about the centroid driving force and torque through the results obtained in the step 1and the step 4, and obtaining the relation between the exposure center position and the driving force of the voice coil motor. The invention belongs to the field of super precision manufacturing.
Owner:严格集团股份有限公司

Film type liquid heater and uniform heating method thereof

The present invention discloses a film type liquid heater and a uniform heating method thereof. End fixation plates are arranged at two ends of a barrel. A heating pipe is arranged in the barrel. Pipe ports run through the two end fixation plates, respectively. Connecting pipes are arranged in the pipe ports. Sealing connection components are arranged at inner ends of the two connecting pipes. A heating film layer is coated outside the heating pipe. Electrode layers are connected left and right sides of the heating film layer, and the electrode layers are connected to an external power supply. An insulating layer is coated outside the heating film layer. A flow splitting column is fixedly connected in the heating pipe. A heating chamber is formed between an inner side of the heating pipe and the flow splitting column. Flow splitting grooves are formed at left and right ends and on the inner side of the flow splitting column. Two outer ends of the flow splitting grooves are communicated with the connecting pipes, and the flow splitting grooves are communicated with the heating chamber. The heating film layer is electrified to generate heat. The heat is conducted inward to the heating pipe and the flow splitting column, and conducted outward to the barrel. Liquid flows into the heating chamber through the connecting pipes and the flow splitting grooves, so that the heating uniformity of the liquid flow flowing through the heating chamber is improved.
Owner:ZHEJIANG CHEER TECH CO LTD

Fluid extracting-discharging apparatus and immersion type photoetching machine

The invention discloses a fluid extracting-discharging apparatus used for extracting and discharging a gas-liquid mixture from the edge of an immersion liquid flow field in an immersion head to gas-liquid recycling equipment; the fluid extracting-discharging apparatus comprises a first extracting-discharging pipe, an atomizing cavity and a second extracting-discharging pipe connected in sequence;the gas-liquid mixture enters the atomizing cavity to be atomized through the first extracting-discharging pipe; then the atomized mixture enters the gas-liquid recycling equipment through the secondextracting-discharging pipe; by virtue of the fluid extracting-discharging apparatus, the anisotropic gas-liquid two-phase flow which flows to the fluid extracting-discharging apparatus can be converted into isotropous ''atomized-shaped'' single-phase flow, so that pressure balance in each position of the fluid extracting-discharging apparatus can be maintained; the invention also discloses an immersion type photoetching machine provided with the fluid extracting-discharging apparatus; and the immersion type photoetching machine is stable in the immersion liquid flow field, good in flow fieldsealing effect, and capable of effectively preventing a gas-liquid two-phase ''water plugging'' phenomenon generated in the pipeline by the gas-liquid mixture in the extracting and discharging position of the immersion liquid flow field, and improving exposure quality.
Owner:SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD

Immersion liquid supply and recovery device with novel pumping and discharging assembly and immersion liquid pumping and discharging method

The invention discloses an immersion liquid supply and recovery device with a novel pumping and discharging assembly and an immersion liquid pumping and discharging method. The device comprises a substrate, an immersion liquid supply channel, an immersion liquid recovery channel, a liquid-phase pumping and discharging channel, a gas-phase pumping and discharging channel, a pumping and dischargingcavity, a pumping and discharging opening and a selective pumping and discharging pipe. A plurality of pumping and discharging openings are formed in one side, opposite to the substrate, of the immersion liquid supply and recovery device. A pumping and discharging cavity is formed in the immersion liquid supply and recovery device, a plurality of selective pumping and discharging pipes are arranged in the pumping and discharging cavity, the pumping and discharging openings are communicated with the pumping and discharging cavity, one end of each selective pumping and discharging pipe is communicated with one pumping and discharging opening, the other end of each selective pumping and discharging pipe is communicated with the liquid-phase pumping and discharging channel, and the gas-phase pumping and discharging channel is connected with the pumping and discharging cavity. The negative pressure pulsation inhibition on the gas-liquid two-phase flow is improved, the vibration characteristic of the immersion liquid supply recovery device is improved, the pumping and discharging capability of a recovery port on immersion liquid is improved, and the exposure quality is improved.
Owner:ZHEJIANG CHEER TECH CO LTD

Exposure machine tool, exposure system and exposure method thereof

The invention discloses an exposure machine tool, an exposure system and an exposure method thereof. Under the effect of specific light rays emitted by a light source, light sensitive coating shifts between an insulating state and a conductive state, so that fixation and separation of a substrate to be exposed is facilitated; meanwhile, electrostatic charges are released to the light sensitive coating via an electrostatic generator, and the substrate to be exposed is fixed in an electrostatic adsorbing manner without generating a raised partition baffle wall; in addition, the metal tool surface of the exposure machine tool is grounded, so that the electrostatic charges can be exported from the light sensitive coating via the metal tool surface, so that the substrate to be exposed and the light sensitive coating are separated, and movement of the substrate to be exposed is facilitated; in a word, the exposure machine tool ensures generation of static electricity and adsorption to the substrate to be exposed, and also achieves elimination of the existing electrostatic charges, so that the substrate to be exposed is convenient to take out, stage mura caused by negative adsorption of gas is avoided, the substrate to be exposed is protected against damage, and exposure quality of the substrate to be exposed is effectively improved.
Owner:BOE TECH GRP CO LTD +1

Double-table-board exposure machine and method for controlling opening and closing of door of double-table-board exposure machine

The invention provides a double-table-board exposure machine and a method for controlling the opening and closing of the double-table-board exposure machine, the double-table-board exposure machine comprises a machine body which comprises a first table board and a second table board, a first door body and a second door body, an electric executing device which is arranged on the machine body, is mechanically connected with the first door body and the second door body and is used for controlling the first door body to move in the direction parallel to the table board according to a first door body driving signal, and a control device which is electrically connected with the electric executing device and used for outputting the first door body driving signal or a second door body driving signal according to an operation instruction, wherein the first door body is located on the first table board, a gap is formed between the first door body and the first table board, the second door body is located on the second table board, a gap is formed between the second door body and the second table board, and the first door body and the second door body are staggered in the direction perpendicular to the table boards. According to the double-table-board exposure machine, external dust can be prevented from entering the table boards, and poor exposure is avoided.
Owner:HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
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