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Exposure machine tool, exposure system and exposure method thereof

An exposure machine and machine technology, which is applied in the fields of optomechanical equipment, microlithography exposure equipment, photolithography process exposure devices, etc., can solve problems such as affecting the quality of liquid crystal products, achieve protection from damage, facilitate removal, and ensure adsorption. Effect

Inactive Publication Date: 2017-09-29
BOE TECH GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

With the gradual improvement of the resolution of liquid crystal products, stage mura is continuously detected in actual liquid crystal products, seriously affecting the quality of liquid crystal products

Method used

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  • Exposure machine tool, exposure system and exposure method thereof
  • Exposure machine tool, exposure system and exposure method thereof
  • Exposure machine tool, exposure system and exposure method thereof

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Embodiment Construction

[0031] The specific implementation manners of an exposure machine platform, an exposure system and an exposure method provided by the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the described embodiments are only some of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] Exposure machines can be divided into electron beam exposure machines and ultraviolet exposure machines. The exposure accuracy of electron beam exposure machines can reach the nanometer level, and very fine patterns can be obtained; while the exposure accuracy of ultraviolet exposure machines can reach a minimum of 1 micron, but in actual In the process, it is difficult to obta...

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Abstract

The invention discloses an exposure machine tool, an exposure system and an exposure method thereof. Under the effect of specific light rays emitted by a light source, light sensitive coating shifts between an insulating state and a conductive state, so that fixation and separation of a substrate to be exposed is facilitated; meanwhile, electrostatic charges are released to the light sensitive coating via an electrostatic generator, and the substrate to be exposed is fixed in an electrostatic adsorbing manner without generating a raised partition baffle wall; in addition, the metal tool surface of the exposure machine tool is grounded, so that the electrostatic charges can be exported from the light sensitive coating via the metal tool surface, so that the substrate to be exposed and the light sensitive coating are separated, and movement of the substrate to be exposed is facilitated; in a word, the exposure machine tool ensures generation of static electricity and adsorption to the substrate to be exposed, and also achieves elimination of the existing electrostatic charges, so that the substrate to be exposed is convenient to take out, stage mura caused by negative adsorption of gas is avoided, the substrate to be exposed is protected against damage, and exposure quality of the substrate to be exposed is effectively improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an exposure machine, an exposure system and an exposure method thereof. Background technique [0002] When fabricating the opposite substrate in the liquid crystal display panel, usually the base substrate used for fabricating the opposite substrate is fixed on an exposure machine, and the opposite substrate is fabricated by means of ultraviolet exposure. At present, the method of fixing the substrate on the exposure machine is generally the method of gas negative pressure adsorption, that is, the pressure difference of the gas is used to fix the substrate to prevent the substrate from shifting and affect the accuracy of exposure. . [0003] However, when using gas negative pressure adsorption to fix the substrate, it is usually necessary to perform partition adsorption on the substrate, and partition adsorption will inevitably have a raised partition barrier, so that after the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13G03F7/20
CPCG02F1/1303G03F7/70716
Inventor 孙志义庞华山王立夫武占英
Owner BOE TECH GRP CO LTD
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